JPH10340931A - Chip bonding tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to obtain in a chip bonding tool, a wide range of bonding pressures from a low pressure level of several grams or less to a high pressure level of several kilograms so as to provide a general use. SOLUTION: A piston 7 is inserted into a cylinder 4, so that there is formed a gap ranging from several μms to several tens of μms between a head 1 thereof and the cylinder 4, with a rod thereof being supported by a static pressure air bearing 10. In this structure, while compressed air is supplied to the cylinder 4, the air is discharged therefrom to move the piston 7 downward. At that time, a sliding resistance (frictional resistance) at the supporting point of the piston 7 is negligibly small, and therefore the piston 7 can be moved with a supply of low-level compressed air supplied to the cylinder tube 4. Accordingly, it is possible to obtain a low-level bonding pressure, for example, of several grams or less. On the other hand, by supplying high-level compressed air to the cylinder 4, a high-level bonding pressure of several kilograms can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called chip bonding tool used for bonding a semiconductor chip to various circuit boards such as a liquid crystal substrate.

[0002]

2. Description of the Related Art Conventionally, various types of chip bonding tools used for bonding a semiconductor chip to various circuit boards such as a liquid crystal substrate are known.

As one of them, for example, Japanese Patent Application Laid-Open No. 8-70
No. 013, the pressurizer (the heater chip 13 or 35 described in the publication corresponds to the tip of the rod of the piston of the cylinder (the cylinder corresponds to the cylinder 14 or 36 described in the publication)). ) Is mounted.

Incidentally, an air cylinder is generally used for such a cylinder, and the piston of this cylinder has an O-ring or the like mounted on its head 1 and rod 2 as shown in FIG. It is inserted into the cylinder tube 4 so as to be airtight through the air seal means 3.

Therefore, the piston is discharged by discharging air from the upper port 5 while supplying pressurized air from the lower port 6 or discharging air from the lower port 6 while supplying pressurized air from the upper port 5. The pressing element 8 can be moved up and down, so that the pressurizing element 8 can be moved to the upper standby position or to the lower bonding position.

[0006]

However, in this type of chip bonding tool, since the sliding resistance (friction resistance) of the air seal means 3 such as an O-ring is relatively large, the chip bonding tool supplied from both ports 5 and 6 cannot be used. The pressurized air must be in the high pressure zone, which makes it difficult to obtain a low level of bonding pressure, for example a few g or less, and the use of the And the versatility was insufficient.

The present invention has been made in view of the above drawbacks, and as a result of intensive studies to solve the drawback, a piston is attached to a cylinder tube having an upper port and a lower port. It is necessary to use an air cylinder that is fitted and inserted into the cylinder tube so that a gap of several μm to several tens of μm is formed, and the rod is supported by a static pressure air bearing or a sliding bearing. The present invention has been completed.

[0008]

That is, one of the chip bonding tools according to the present invention is a chip bonding tool in which a pressurizer is mounted on the tip of a rod of a piston of an air cylinder having an upper port and a lower port formed in a cylinder tube. In the tool, the piston is fitted with a head having no air seal means attached thereto so as to form a gap of several μm to several tens of μm with respect to the cylinder tube, and the rod is fitted with a static pressure air bearing or It is characterized by being mounted while supported by a sliding bearing.

In another aspect of the chip bonding tool according to the present invention, as described in claim 2, in the chip bonding tool according to claim 1, the pressurizer includes a heat generating pattern printed thereon. It has a heater sealed with an electric insulating material.

According to another aspect of the present invention, there is provided a chip bonding tool according to the first aspect of the present invention, further comprising an air suction hole penetrated through a cylinder tube. It is characterized by having an air suction connection hole communicating with the chip suction hole penetrated by the pressurizer.

[0011]

1, a cylinder tube 4 of an air cylinder is mounted on a movable arm (not shown). A piston 7 made of ceramic is inserted into the cylinder tube 4, and A pressure head 8 made of ceramic is adhered to the tip (lower end) of the rod 2 exposed from the cylinder tube 4.

The cylinder tube 4 includes an upper cap 4a, a body 4b, and a lower cap 4c, and both caps 4a, 4c are screwed to the body 4b. A, B shown
The location is the threaded location.

The upper cap 4a has an upper port 5 penetrated, and the body 4b has a lower port 6 and an air supply hole 9 penetrated. The rod 2 of the piston 7 is supported by the hydrostatic air bearing 10, and the rod 2 has a rectangular cross section.

The static pressure air bearing 10 is generally called an air bearing, and pressurized air supplied from an air supply hole 9 is uniformly dispersed by a porous body 11 so that the piston 7 Is supported in a non-contact state.

[0015] Therefore, the sliding resistance (friction resistance) of the supporting portion is extremely small to a negligible level. Although not shown in the figure, the porous body 11 and the rod 2
A minute gap is formed between them.

On the other hand, the head 1 of the piston 7 is several μm from the ring-shaped metal bearing 12 mounted on the body 4b.
It is inserted so that a gap of m to several tens μm is formed. The gap between the porous body 11 and the rod 2 is set to be equal to or larger than that between the head 1 and the ring bearing 12, and between the body 4b and the rod 2 and between the lower cap 4c and the rod 2 Between them, a gap equal to or greater than that between the head 1 and the ring bearing 12 is formed.

Therefore, pressurized air is supplied into the cylinder tube 4 through the pipe 13 and the air supply hole 9 to support the rod 2 of the piston 7 in a non-contact state, and
By discharging the air through the upper port 5 and the conduit 15 while supplying the pressurized air into the cylinder tube 4 through the lower port 4 and the lower port 6, the head 1 of the piston 7 can be positioned at the reference level.

As a result, the pressurizing element 8 is positioned at the upper standby position. Subsequently, while supplying pressurized air into the cylinder tube 4 through the pipe 15 and the upper port 5, the lower port 6 and the pipe By discharging the air through 14, the piston 7 is moved downward to
Can be moved to a level at which a predetermined bonding pressure can be obtained.

At this time, since the sliding resistance (friction resistance) of the supporting portion of the piston 7 is extremely small to a negligible level, a low-pressure pressurized air is supplied into the cylinder tube 4 to move the pitons 7 downward. Therefore, a low pressure level bonding pressure of, for example, several g or less can be obtained.

Further, since the piston 7 can be moved downward by supplying high-pressure air into the cylinder tube 4, a wide range from a low pressure level of several g or less to a high pressure level of several kg can be obtained. A bonding pressure can be obtained, and therefore, the tool can be generalized.

The pressure of the pressurized air supplied from the air supply hole 9 is higher than that of the pressurized air supplied from the lower port 6.
g / cm ² of pressurized air and the lower port 6
And pressurized air of ² kg / cm ² may be supplied.

Next, another embodiment shown in FIG. 2 will be described. In this embodiment, a rod 2 of a ceramic piston 7 has an air suction hole 18 penetrated through a cylinder tube 4 and a pressurizer. An air suction connection hole 20 communicating with a chip suction hole 19 penetrated through the hole 8 is provided, and a heater 21 (see FIG. 3) is mounted on an upper end surface of the pressurizer 8.

The heater 21 seals a heat generating pattern 22 (for example, platinum palladium) screen-printed on the upper end surface of the pressurizer 8 with an electric insulating material 23 (for example, glass) to provide a small and lightweight heater. It is configured.

Further, the upper end surface of the pressing element 8 is bonded to the lower end surface of the rod 2. Therefore, by moving the piston 7 downward, the semiconductor chip sucked and held by the pressurizer 8 can be thermocompression-bonded to a lower substrate (not shown).

At this time, the movement of the piston 7 is controlled in the same manner as in the above-mentioned tip bonk tool shown in FIG. In the embodiment shown in FIGS. 1 and 2, a sliding bearing may be used instead of the hydrostatic air bearing 10.

The movable arm (not shown) on which the cylinder tube 4 is mounted is mounted so that it can move in multiple directions (for example, up and down, left and right horizontal and front and back horizontal) as needed. Alternatively, the piston 7 may be inserted into the cylinder tube 4 without using a metal bearing as shown in FIG. 4, and in this case, the piston 7 may be inserted between the upper cap 4 a and the head 1. A gap equal to or greater than that between the head 1 and the ring bearing 12 in the embodiment shown in FIGS. The pipe 25 shown in FIG.
Is connected to a vacuum pump.

[0027]

As described above, according to the first to third aspects of the present invention, with respect to the chip bonding tool, a wide range of bonding pressure from a low pressure level to a high pressure level can be obtained, and general use can be achieved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a chip bonding tool.

FIG. 2 is a longitudinal sectional view of another chip bonding tool.

FIG. 3 is a perspective view of a pressing element.

FIG. 4 is a longitudinal sectional view of an air cylinder portion of another chip bonding tool.

FIG. 5 is a longitudinal sectional view of a conventional chip bonding tool.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head 2 Rod 4 Cylinder tube 5 Upper port 6 Lower port 7 Piston 8 Pressurizer 10 Static pressure air bearing 18 Air suction hole 19 Chip suction hole 21 Heater 22 Heat generation pattern 23 Electric insulating material

Claims (3)

[Claims] 1. A tip bonding tool in which a pressurizer is attached to a rod end of a piston of an air cylinder in which an upper port and a lower port are bored in a cylinder tube. A chip bonding tool which is fitted and inserted into a cylinder tube so as to form a gap of several μm to several tens μm, and the rod is supported by a hydrostatic air bearing or a sliding bearing. 2. The chip bonding tool according to claim 1, wherein the pressure element has a heater formed by sealing a heating pattern printed on the pressure element with an electrical insulating material. 3. The piston rod has an air suction connection hole communicating with an air suction hole penetrated through the cylinder tube and a chip suction hole penetrated through the pressure head. The chip bonding tool according to claim 1, wherein