JP6326541B1 - Substrate dividing apparatus and substrate dividing method - Google Patents

Abstract

A substrate dividing apparatus capable of efficiently and concurrently supplying and cutting a substrate and carrying out a cut piece is provided. A substrate dividing apparatus according to the present invention includes a turntable having a first stage and a second stage, a supply mechanism for supplying an uncut substrate to the turntable, a cutting mechanism for cutting the uncut substrate, and a cut An unloading mechanism for unloading the substrate. The turntable rotates so that the first stage stops at the supply position and the carry-out position, respectively. The second stage is positioned at the unloading position when the first stage is stopped at the supply position, and is positioned at the supply position when the first stage is stopped at the unloading position. The supply mechanism and the cutting mechanism are provided in alignment with the supply position, and the carry-out mechanism is provided in alignment with the carry-out position. Each of the first stage and the second stage receives the uncut substrate from the supply mechanism at the supply position, and moves the cut substrate from the supply position to the unloading position. [Selection] Figure 2

Description

  The present invention relates to a substrate dividing apparatus and a substrate dividing method, and more specifically to a turntable type substrate dividing apparatus and a substrate dividing method using the same.

  2. Description of the Related Art Conventionally, it has been performed that a multi-sided board on which electronic components are mounted is cut into individual board pieces to obtain a required unit piece mounted product.

  As such a multi-sided substrate cutting device, a turntable that rotates and stops by 180 degrees, a supply conveyor and a transfer conveyor that are provided at one stop position of the turntable, and a stop position that is provided at the other stop position of the turntable. Two cutting processing mechanisms are provided on the turntable at an interval of 180 degrees, and the turntable rotates 180 degrees at a time, thereby transporting the substrate between the supply conveyor and the transfer conveyor and the cutting processing mechanism. A turntable type substrate cutting apparatus including a station is known (Patent Documents 1 and 2).

  The substrate cutting devices of Patent Documents 1 and 2 rotate the turntable by 180 degrees to convey the multi-sided substrate supplied from the supply conveyor to one station to the cutting mechanism, and in parallel with this, The cut individual substrate pieces placed on the other station are transported from the cutting mechanism to the transport conveyor, and a new multi-chamfered substrate is supplied from the supply conveyor to the other empty station. It is configured to

Japanese Patent Laid-Open No. 5-198915 JP-A-7-9397

  However, in the substrate cutting apparatuses of Patent Documents 1 and 2, the turntable is supplied after the multi-chamfered substrate is supplied by the supply conveyor until the individual pieces of the substrate cut by the transfer conveyor are carried out. There is a problem that it is necessary to make a total of one rotation (360 degree rotation) per substrate, which is inefficient and takes a long processing time.

  The present invention has been made in view of the above problems, and provides a substrate dividing apparatus and a substrate dividing method capable of efficiently supplying and cutting a substrate and carrying out the cut pieces in parallel. The purpose is to do.

  The substrate dividing apparatus according to the present invention includes a turntable having a first stage and a second stage that are spaced apart in the rotation direction, a supply mechanism that supplies an uncut substrate to the turntable, and a supply to the turntable A cutting mechanism for cutting the uncut substrate that has been cut into pieces and frame pieces, and a carry-out mechanism for carrying out the pieces of the cut substrate cut by the cutting mechanism from the turntable, The turntable is configured to be rotatable so that the first stage stops at a supply position and an unloading position different from the supply position, and the second stage is in a state where the first stage is stopped at the supply position. The first stage is located at the unloading position and is positioned at the supply position in a state where the first stage is stopped at the unloading position. The supply mechanism and the cutting mechanism are provided in alignment with the supply position, the unloading mechanism is provided in alignment with the unloading position, and the first stage and the second stage are respectively supplied with the supply The uncut substrate can be received from the supply mechanism at a position, and the cut substrate cut by the cutting mechanism can be moved from the supply position to the unloading position. .

  The substrate dividing method according to the present invention includes a turntable configured to be rotatable at least between a supply position and an unloading position, a supply mechanism and a cutting mechanism provided in alignment with the supply position, and an alignment with the unloading position. A substrate dividing method for dividing a substrate using a substrate dividing device provided with a carry-out mechanism provided as a substrate, the substrate supplying step supplying an uncut substrate from the supply mechanism to the turntable, and the substrate supplying step A substrate cutting step of cutting the uncut substrate supplied to the turntable by the cutting mechanism; and after the substrate cutting step, the turntable is rotated, and the cut substrate cut by the cutting mechanism is Substrate position changing step for moving to the unloading position, and substrate unloading step for unloading the cut substrate by the unloading mechanism after the substrate position changing step. Hints, in parallel with the substrate unloading step, characterized in that it start a new said substrate supplying step.

  As described above, according to the present invention, the supply and cutting of the substrate and the unloading of the cut pieces can be performed in parallel in the same time period, and therefore can be efficiently performed in parallel. A substrate dividing apparatus and a substrate dividing method can be provided.

It is a schematic diagram which shows an example of a board | substrate. 1 is a plan view showing an embodiment of a substrate dividing apparatus according to the present invention. It is a front view of the board | substrate division | segmentation apparatus which concerns on this embodiment. It is an enlarged plan view which shows the structure in the supply position of the substrate dividing apparatus which concerns on this embodiment. It is an enlarged front view which shows the structure in the supply position of the board | substrate division | segmentation apparatus which concerns on this embodiment. FIG. 6 is a B-B ′ sectional view of FIG. 5. FIG. 5 is a cross-sectional view taken along line A-A ′ of FIG. 4. It is a schematic diagram regarding FIG. 7 which shows the cutting | disconnection operation | movement of the substrate dividing apparatus which concerns on this embodiment. It is a flowchart which shows operation | movement of the board | substrate division | segmentation apparatus which concerns on this embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments for carrying out the invention will be described with reference to the drawings. The following embodiments do not limit the invention according to each claim, and all combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. .

  FIG. 1 is a schematic diagram illustrating an example of a substrate S cut by the substrate dividing apparatus 1 according to the present embodiment. As shown in FIG. 1, the substrate S includes a plurality of pieces P, a frame piece F, and a joint J that connects the frame piece F and each piece P.

  With reference to FIG.2 and FIG.3, schematic structure of the board | substrate division | segmentation apparatus 1 which concerns on this embodiment is demonstrated. The substrate dividing apparatus 1 according to the present embodiment is an apparatus that divides the substrate S into individual pieces P and frame pieces F by cutting the joint J of the substrate S supplied from the upstream device 2.

  As shown in FIGS. 2 and 3, the substrate dividing apparatus 1 includes a turntable 10, a housing 12, a transfer auxiliary conveyor 15 (supply mechanism), a circulation conveyor 17 (circulation mechanism), a cutting robot 20 (cutting mechanism), An unloading robot 40 (unloading mechanism), a control device 60, and a sensor 70 are provided.

  The upstream apparatus 2 is an apparatus that supplies the substrate S to the substrate dividing apparatus 1 and includes an upstream conveyor 16 and a support base 161 on which the upstream conveyor 16 is placed. The upstream conveyor 16 is configured to supply the substrate S to the transfer auxiliary conveyor 15 of the substrate dividing apparatus 1.

  In this specification, the upstream device 2 side in the X-axis direction (left side of the housing 12 in FIGS. 2 and 3) is “upstream” with the housing 12 in the plan view of the substrate dividing apparatus 1 as the axis of symmetry. The circulating conveyor 17 side (the right side of the casing 12 in FIGS. 2 and 3) may be referred to as “downstream side”. The supply position refers to a position where an uncut substrate S is supplied on the turntable 10 and the substrate S is cut by the cutting robot 20, that is, a movable range of the cutting robot 20 on the turntable 10. Further, the carry-out position refers to a position where the piece P is transferred from the turntable 10 by the carry-out robot 40, that is, a movable range of the carry-out robot 40 on the turntable 10. In the substrate dividing apparatus 1 according to the present embodiment, the supply position and the carry-out position are arranged so as to face each other via the rotation shaft 11 of the turntable 10.

  As shown in FIGS. 2 and 3, the turntable 10 has a disk shape, and has a rotation shaft 11 at the center of the lower surface of the turntable 10. The turntable 10 rotates by rotating the rotating shaft 11 by a motor (not shown). As shown in FIG. 3, the rotating shaft 11 is rotatably connected to the housing 12. The turntable 10 is not limited to a disk shape, and various types can be adopted as long as the mechanism can rotate around the rotation shaft 11.

  On the upper surface of the turntable 10, support tables 131 a and 131 b arranged so as to face each other via the rotation shaft 11 of the turntable 10 (with a point-symmetrical positional relationship around the rotation shaft 11) are arranged and supported. Conveyors 13a and 13b (first stage and second stage) are placed on the platforms 131a and 131b, respectively. In other words, the pair of conveyors 13 a and 13 b oppose each other via the rotation shaft 11 of the turntable 10. Thereby, the position of the pair of conveyors 13a and 13b is interchangeable when the turntable 10 rotates 180 °. Further, the conveyors 13a and 13b are arranged on the turntable 10 so as to be driven in both the X-axis forward and reverse directions.

  The turntable 10 rotates so that the conveyors 13a and 13b stop at the supply position and the carry-out position, respectively. As a result, the conveyors 13a and 13b are configured such that the other conveyor 13b (second stage) is positioned at the carry-out position while the other conveyor 13a (first stage) is stopped at the supply position, and the one conveyor 13a. Is arranged so that the other conveyor 13b is located at the supply position in a state where the belt is stopped at the carry-out position.

  As shown in FIG. 2, the conveyors 13 a and 13 b have two rows of conveyor surfaces, the frame piece F of the substrate S is placed on each belt, and the pieces P and joints J are positioned between the belts. It has become. Thereby, damage to the belt when cutting the joint J can be prevented.

  The support bases 131a and 131b have a positioning mechanism (not shown) for stopping the substrate S supplied from the upstream device 2 at the supply position. This positioning mechanism is, for example, a stopper (not shown) that projects in the Z-axis direction at the end portion adjacent to the housing 12 (the front end side in the supply direction of the substrate S) and positions the substrate S in the X-axis direction. ) And a pressing means (clamping means) that is provided so as to be able to advance and retreat along a direction orthogonal to the supply direction of the substrate S and that positions the substrate S in the Y-axis direction by pressing the side portion of the substrate S. You may have. By providing the positioning mechanism, the substrate S can be positioned so as to be a position suitable for cutting.

  The transfer auxiliary conveyor 15 is provided at a position between the upstream conveyor 16 of the upstream apparatus 2 and the conveyor 13a or 13b at the supply position, and supplies the substrate S supplied from the upstream apparatus 2 to the conveyor 13a or 13b at the supply position. It is a conveyor to do. As shown in FIGS. 2 and 3, the transfer auxiliary conveyor 15 is placed on a support base 151.

  The substrate dividing apparatus 1 may be configured to supply the substrate S directly from the upstream conveyor 16 of the upstream apparatus 2 to the conveyor 13a or 13b at the supply position without providing the transfer assist conveyor 15.

  The circulation conveyor 17 is a conveyor for conveying the piece P carried out from the conveyor 13b or 13a at the carry-out position. As shown in FIG. 2, the circulation conveyor 17 is arrange | positioned so that four linear conveyors may comprise each side of a rectangle. In FIG. 2, only one side of the circulation conveyor 17 is not shown. On the circulation conveyor 17, a tray 18 for conveying the individual pieces P carried from the carry-out position conveyor 13 one by one circulates. In the example of FIG. 2, the tray 18 circulates counterclockwise. The number of trays 18 includes the time during which the circulation conveyor 17 makes one turn (periodic time), and the irregular generation allowable value in the downstream device after unloading (collects the tray 18 on which the defective pieces P are placed. The number is determined as appropriate according to the number that can be performed. Here, although the required number of the trays 18 of this embodiment that are transported in units of individual pieces P is increased as compared with the tray that is transported in units of substrates S, it is possible to significantly reduce the manufacturing unit price. As a result, the equipment cost can be reduced. Note that the tray 18 is not limited to a configuration in which the individual pieces P are conveyed one by one, and a configuration in which a plurality of individual pieces P are accommodated per tray and can be carried out is also possible.

  Pushers (not shown) for moving the tray 18 to the conveyors forming adjacent sides are respectively provided at the connection points of the sides of the circulation conveyor 17. Moreover, it can also comprise so that the tray 18 may circulate by providing a curved conveyor in the connection location of each edge | side of the circulation conveyor 17 instead of providing a pusher. Moreover, the circulation conveyor 17 should just circulate the tray 18, and is not limited to the rectangular arrangement | positioning shown in FIG. 2, You may be comprised by one conveyor which can form a curve.

  Further, the circulation conveyor 17 includes a positioning mechanism (not shown) for temporarily stopping the movement of the tray 18 at a suitable position when the pieces P are carried out onto the tray 18 flowing through the circulation conveyor 17. Yes. The positioning mechanism of the circulation conveyor 17 is provided so as to be able to advance and retreat along a direction orthogonal to the traveling direction of the tray 18, and a pressing means that stops the movement of the tray 18 by pressing the side portion of the tray 18 ( (Clamping means) or the like can be employed, but is not limited thereto, and various configurations can be employed.

  Although not shown, a downstream device for receiving the pieces P from the tray 18 is provided on the downstream side in the X-axis direction of the circulation conveyor 17.

  The cutting robot 20 is a mechanism that is provided in alignment with the supply position and cuts the joint J of the substrate S supplied to the conveyor 13a or 13b stopped at the supply position to obtain the piece P and the frame piece F. is there. The cutting robot 20 is provided on the upstream side of the substrate dividing apparatus 1 and is configured to be movable in three axial directions at the supply position. The cutting robot 20 includes a cutter 31 for cutting the joint J of the substrate S.

  The carry-out robot 40 is an apparatus that is provided in alignment with the carry-out position and picks up or holds the cut pieces S of the substrate S from the conveyor 13b or 13a stopped at the carry-out position. The carry-out robot 40 is provided on the downstream side of the substrate dividing apparatus 1 and is configured to be movable in the three-axis directions on the conveyor 13b or 13a at the carry-out position and the upper part of the circulation conveyor 17. The unloading robot 40 includes a transfer head 41 capable of sucking or gripping the pieces P of the cut substrate S, and is configured to unload the pieces P from the conveyor 13b or 13a at the unloading position to the circulation conveyor 17. .

  Detailed configurations of the cutting robot 20 and the unloading robot 40 will be described later.

  Although not shown, the substrate dividing apparatus 1 includes a driver for rotating the turntable 10, a driver for driving the cutting robot 20 and the unloading robot 40 in three axes, a pair of conveyors 13a and 13b, A driver for driving the joint auxiliary conveyor 15 and the circulation conveyor 17, wiring and circuits for connecting the components, and the like are provided. Further, the upstream device 2 includes a driver for driving the upstream conveyor 16, various wirings, and a circuit.

  The control device 60 is connected to a driver that drives the turntable 10, the pair of conveyors 13a and 13b, the transfer auxiliary conveyor 15, the circulation conveyor 17, the cutting robot 20, and the unloading robot 40 of the substrate dividing apparatus 1, and issues a drive command. These operations are controlled by transmission.

  The control device 60 is connected to the substrate dividing device 1 and the upstream device 2 and is configured to be able to communicate substrate supply information between the substrate dividing device 1 and the upstream device 2. The substrate supply information is information indicating whether or not there is an uncut substrate S that can be supplied to the substrate dividing apparatus 1. Note that “connection” between the board dividing apparatus 1, the upstream apparatus 2, and the control apparatus 60 does not necessarily mean that each component is physically connected by wiring or the like, but data between the components. This means that it can send and receive signals, and it does not matter whether it is wired or wireless.

  The control device 60 transmits a request signal for substrate supply information to the upstream device 2. The upstream device 2 receives the substrate supply information request signal and transmits the substrate supply information to the control device 60. The control device 60 receives the substrate supply information from the upstream device 2 and, when there is a substrate S that can be supplied, transmits a drive command to the driver that drives the transfer assist conveyor 15. In the present embodiment, the control device 60 transmits a request signal to the upstream device 2 and then transmits a drive command to the driver based on the substrate supply information received from the upstream device 2 (so-called both). However, the present invention is not limited to this, and the control device 60 unilaterally transmits a substrate receivable signal to the upstream device 2 in a state where the substrate S can be received. The upstream device 2 may receive the substrate S to the transit auxiliary conveyor 15 (so-called one-way communication configuration).

  The sensor 70 is connected to the control device 60 and is provided at a position where the board S passing through the transit auxiliary conveyor 15 can be detected. When the sensor 70 detects the substrate S that is supplied from the upstream conveyor 16 of the upstream device 2 and passes through the transit auxiliary conveyor 15, the sensor 70 transmits a detection signal to the control device 60. When receiving the detection signal from the sensor 70, the control device 60 transmits a drive command to a driver that drives the conveyor 13a or 13b at the supply position.

  In addition, the control device 60 performs the setup change operation by using the board information indicating information about the board S such as the shape of the board S, the number of pieces P, the position of the joint J, or the like stored in advance. A cutting operation by the cutter 31 of the cutting robot 20 and an unloading operation of the piece P by the transfer head 41 are determined based on the substrate information in advance or each time received from the upstream device 2, and a driving command is transmitted to each driver. It is preferable that the control device 60 store and maintain a plurality of board types at the same time, and select from the plurality of board types at the time of setup change.

  Next, the configuration of the cutting robot 20 of the substrate dividing apparatus 1 will be described in detail with reference to FIGS.

  The cutting robot 20 includes two rows of frames 21 extending in the X-axis direction so as to bridge the casing 12 and the support column 121, guide rails 22 provided on the upper surface of each frame 21, and the X-axis direction along each guide rail 22. Sliders 23 that can be moved to each other, a frame 24 that is provided on each slider 23 so as to bridge the sliders 23, extends in the Y-axis direction, and is provided on a side surface in the X-axis direction of the frame 24 and extends in the Y-axis direction. The slider 26 is movable along the guide rail 25 in the Y-axis direction. The frame 27 extends in the Z-axis direction. The guide rail is provided on the side surface in the X-axis direction of the frame 27 and extends in the Z-axis direction. 28, a slider 29 movable in the Z-axis direction along the guide rail 28, a rotary actuator 30 provided on the slider 29, a rotor Rotating member 32 provided on the output shaft of the actuator 30 comprises a cutter 31 attached to the rotating member 32.

  The cutting robot 20 includes sliders 23, 26, and 29 that move in three axis directions, respectively, so that the cutter 31 can move in the three axis directions. Moreover, the direction of the cutter 31 can be changed by the rotation member 32 rotating. From the viewpoint of changing the orientation of the cutter 31, the rotating member 32 can rotate at least 90 ° in the XY plane, and more preferably can rotate 360 °.

  The cutting robot 20 drives the sliders 23 and 26 by a driver (not shown) based on the substrate information indicating information about the substrate S, and moves the cutter 31 in the XY plane so as to be positioned above the joint J. The rotation member 32 is rotated in accordance with the direction of J to change the direction of the cutter 31, and the slider 29 is driven to lower the cutter 31 in the Z-axis direction, thereby cutting the joint J of the substrate S. When cutting of one joint J is completed, the cutter 31 is raised in the Z-axis direction. The cutting robot 20 cuts the joints J of the substrates S one by one by repeating the above operation.

  In the present embodiment, the cutter 31 is used as the cutting means, and the orientation of the cutter 31 is changed by the rotary actuator 30 and the rotary member 32. However, the present invention is not limited to this. Instead of 31, for example, a router cutter (spin cutter) or the like may be used. When the router cutter is used, when the substrate S is cut, the router C can be cut by bringing the tip of the router cutter into contact with the joint J while rotating the router cutter at a high speed by the rotating member 32. When a router cutter is used, it is necessary to use a rotary actuator having a performance capable of rotating the output shaft at a higher speed than the rotary actuator 30 when the cutter 31 is used.

  As shown in FIGS. 2 and 3, the carry-out robot 40 is provided so as to bridge the housing 12 and the support column 122. The unloading robot 40 has a configuration in which the cutter 31 of the cutting robot 20 is replaced with a transfer head 41. The transfer head 41 can move in three axial directions, and the rotating member 32 rotates. The transfer head 41 rotates so that the direction of the piece P can be changed. In the carry-out robot 40, the illustration and detailed description of the configuration common to the cutting robot 20 are omitted.

  The carry-out robot 40 moves on the XY plane so that the transfer head 41 is positioned on the upper part of one piece P based on the substrate information indicating information about the substrate S, and rotates according to the direction of the piece P as appropriate. The direction of the transfer head 41 is changed by rotating the member 32, the transfer head 41 is lowered in the Z-axis direction and brought into contact with the piece P, and the piece P is sucked or gripped. After attracting or gripping the pieces P, the transfer head 41 is raised in the Z-axis direction, moved on the XY plane so as to be positioned above the tray 18 of the circulation conveyor 17, and rotated according to the direction of the tray 18 as appropriate. The direction of the transfer head 41 is changed by rotating the member 32, the transfer head 41 is lowered in the Z-axis direction, the piece P is placed on the tray 18, and suction or gripping is released. When the carry-out of one piece P is completed, the transfer head 41 is raised in the Z-axis direction. The carry-out robot 40 carries out the pieces P one by one by repeating the above operation.

  As the transfer head 41, for example, various known means such as a mechanical chuck having a gripper and a vacuum chuck having a suction pad can be adopted.

  Next, the lifting table 80 of the substrate dividing apparatus 1 according to the present embodiment will be described with reference to FIGS. 6 to 8, only the upstream side of the substrate dividing apparatus 1 is shown for the sake of simplicity of illustration. As shown in FIGS. 6-8, one conveyor 13a has stopped in the supply position. As shown in FIGS. 6 and 7, the substrate dividing apparatus 1 according to this embodiment includes a lifting table 80 for supporting the substrate S between the belts of the conveyors 13 a and 13 b. The elevating table 80 is provided on each of the support bases 131a and 131b, and is configured to be able to elevate in the Z-axis direction.

  In the lifting table 80, the length in the Y-axis direction on the upper surface is smaller than the distance between the belts of the conveyors 13a and 13b so as not to collide with the belts of the conveyors 13a and 13b. Further, the length of the upper surface in the X-axis direction is smaller than the length of each belt of the conveyors 13a and 13b in the X-axis direction.

  At an appropriate position of the lifting table 80, the cutter 31 enters between the piece P and the piece P of the substrate S and between the piece P and the frame piece F so that the joint J can be cut. An appropriately shaped recess 81 is provided. In other words, the upper surface of the lifting table 80 has the recess 81 so that it does not come into contact with the joint J when the substrate S is placed. Note that the position and shape of the recess 81 differ depending on the substrate type to be cut. For this reason, for example, it is preferable that the upper surface portion of the lifting table 80 has a replaceable layer structure, and the upper layer portion is replaced according to the substrate type to be cut at the time of setup change. Note that the recess 81 may be a groove extending in the X-axis direction and / or the Y-axis direction, or may be a recess provided locally.

  Further, the elevating table 80 is provided with a reference pin (not shown) protruding in the Z-axis direction for positioning the substrate S. For example, the reference pin may be configured to engage with a pin hole provided in the substrate S in advance, or may be configured to engage with a gap between the piece P and the frame piece F. The position and number of reference pins can be arbitrarily set according to the substrate type to be cut.

  The lifting table 80 is configured to be movable in the Z-axis direction by a lifting actuator 82 and moves up and down along a guide post 83 fixed to the support base 131. Further, as shown in FIG. 8, when the substrate S is cut, the elevating table 80 is raised until the upper surface of the substrate S is higher than the upper surface of the conveyor 13 a or 13 b at the supply position.

  The lifting table 80 is configured to be able to vacuum-suck the substrate S when the substrate S is cut at the supply position and when the turntable 10 is rotated after cutting. Thereby, it becomes possible to fix the positioning of the substrate S at the time of cutting the substrate S and at the time of movement after the cutting.

  Further, the lifting table 80 releases the suction of the individual pieces P when the individual pieces P are carried out at the carry-out position. In the carry-out position, after the suction by the lifting table 80 is released, the individual pieces P are positioned by the above-described reference pins.

  As shown in FIG. 8, when the substrate S is cut at the supply position, the cutter 31 descends to a position where the tip does not contact the bottom surface of the recess 81 of the lifting table 80 and cuts the joint J of the substrate S. .

  Next, a substrate dividing method for dividing a substrate using the substrate dividing apparatus 1 according to the present embodiment will be described with reference to FIG. As described above, each component of the substrate dividing apparatus 1 operates when a drive command is transmitted to the driver by the control device 60.

  First, the control device 60 executes a substrate supply process for supplying the uncut substrate S to the turntable 10 from the transfer auxiliary conveyor 15 (supply mechanism). Specifically, in step S1, when there is a substrate S supplied from the upstream device 2, the transfer auxiliary conveyor 15 and one conveyor 13a (first stage) stopped at the supply position are rotated by the turntable 10. Driving in a direction toward the shaft 11, the substrate S is supplied to the conveyor 13a. Next, in step S2, the substrate S is stopped at a position suitable for cutting on the conveyor 13a.

  Next, the control device 60 executes a substrate cutting process in which the uncut substrate S supplied to the turntable 10 is cut by the cutting robot 20 (cutting mechanism). Specifically, in step S3, the lift table 80 at the supply position is raised, and the substrate S is sucked by vacuuming. Next, in step S4, the cutting robot 20 is driven to cut the joint J of the substrate S.

  When the cutting of all the joints J is completed, the control device 60 rotates the turntable 10 and changes the substrate position to move the cut substrates (the pieces P and the frame pieces F) cut by the cutting robot 20 to the carry-out position. Execute the process. Specifically, in step S5, the turntable 10 is rotated 180 ° to move the conveyor 13a to the carry-out position. Thereby, the other conveyor 13b (2nd stage) is moved to a supply position.

  After the turntable 10 rotates, the control device 60 executes a substrate unloading step of unloading the piece P by the unloading robot 40 (unloading mechanism). Specifically, in step S 6, the suction of the individual pieces P by the lifting table 80 moved to the carry-out position is released, the carry-out robot 40 is driven, and the single piece P is placed on the tray 18 flowing through the circulation conveyor 17. Unload one by one. The pieces P placed on the tray 18 are carried out from the circulation conveyor 17 to a downstream device (not shown). When the unloading of all the pieces P is completed, the lifting table 80 is lowered in step S7. Next, in step S8, the conveyor 13a at the carry-out position is driven in a direction away from the rotating shaft 11 of the turntable 10, and the frame piece F is dropped to be removed.

  In addition, when there is a supply of a new uncut substrate S from the upstream device 2, the control device 60 newly starts the above-described substrate supply process in parallel with the substrate carry-out process. Specifically, simultaneously with performing Steps S6 to S8, the control device 60 supplies a new uncut substrate S to the conveyor 13b at the supply position in Step S9. Next, in step S10, the conveyor 13b is stopped so that the substrate S stops at a position suitable for cutting on the conveyor 13b. Next, in step S11, the elevating table 80 is raised and the substrate S is sucked by vacuuming. Next, in step S12, the cutting robot 20 is driven to cut the joint J of the substrate S. When the cutting of all the joints J is completed, in step S13, the turntable 10 is rotated by 180 ° and the conveyor 13b is moved to the carry-out position. Thereby, the conveyor 13a is moved to the supply position again. In the case where there is no supply of a new uncut substrate S from the upstream apparatus 2, although not shown in FIG. 9, after performing Steps S6 to S8 without performing Step S9 and subsequent steps, It becomes a driving standby state.

  When the rotation of the turntable 10 in step S13 is completed, the control device 60 determines whether or not there is an uncut substrate S that is supplied from the upstream device 2 by the sensor 70 and passes through the transfer assist conveyor 15 in step S14. judge. The control device 60 unilaterally transmits a substrate receivable signal to the upstream device 2 in a state where the substrate S can be received, and the upstream device 2 supplies the substrate S to the transfer assisting conveyor 15 in response to the signal. In the case of a configuration (a so-called one-way communication configuration), unlike the illustration in FIG. 9, the determination step S <b> 14 is not executed. In this case, steps S6 to S8 and steps S9 to S12 are repeatedly executed regardless of the presence or absence of the substrate S until the worker manually stops the substrate dividing apparatus 1.

  When there is an uncut substrate S (Yes), steps S6 to S8 and steps S9 to S12 are simultaneously performed again. When there is no substrate S (No), in step S15, as in step S6, the adsorption of the pieces P by the lifting table 80 of the conveyor 13b moved to the carry-out position is released, and the carry-out robot 40 is driven to circulate. The individual pieces P are carried out one by one on the tray 18 flowing through the conveyor 17. In Steps S16 and S17, as in Steps S7 and S8, when the carrying out of all the pieces P is completed, the lifting table 80 is lowered, and the conveyor 13b is driven to drop the frame piece F and discard it.

  When step S17 is completed, in step S18, the sensor 70 determines whether there is an uncut substrate S that is supplied from the upstream device 2 and passes through the transfer assist conveyor 15. When there is an uncut substrate S (Yes), the process returns to step S1 and steps S1 to S17 are executed again. When there is no uncut substrate S (No), an operation standby state is set. Similar to the above step S14, when the control device 60 has a one-way communication configuration, unlike the illustration of FIG. 9, the determination step S18 is not executed, and the operator manually performs the substrate dividing apparatus 1. Need to be stopped.

  As described above, the substrate dividing apparatus 1 according to the present embodiment can efficiently supply and cut the substrate and carry out the cut pieces and discard the frame pieces in parallel. Time can be shortened. In particular, by reducing the time efficiency of the pieces (small, irregular, etc.) that are unsuitable for conveying the conveyor after completion of cutting, the interval time for supplying the cut pieces to the post process and the waiting time for the post process are shortened. can do.

  The substrate dividing apparatus according to the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the technical idea of the present invention.

  For example, in the above-described embodiment, the cutting robot 20 and the unloading robot 40 have been described as being configured such that the cutter 31 and the transfer head 41 can be moved in the three-axis directions by a frame type, but are not limited thereto. It can also be a multi-axis robot type. In the case of the multi-axis robot type, it is not necessary to provide a frame extending in the triaxial direction, so that the substrate dividing apparatus can be reduced in size.

  Moreover, in the above-mentioned embodiment, although the case where the conveyors 13a and 13b on the turntable 10 are one pair was demonstrated, it can also be made into two or more pairs. In this case, a conveyor is arranged for each angle calculated by 360 ° / (number of pairs × 2). In this case, on each conveyor, the supply position is arranged at every angle calculated by the number of 360 ° / pair so that the supply position and the carry-out position are alternately positioned in the rotation direction, and the carry-out position is 360 ° / Arranged for each angle calculated by the number of pairs. The cutting robot 20 is provided in alignment with each supply position, and the carry-out robot 40 is provided in alignment with each carry-out position. Even with such a configuration, the turntable 10 is rotated by an angle calculated by 360 ° / (number of pairs × 2), whereby each stage can be alternately stopped at the supply position and the unloading position. Supply and cutting and unloading of the cut substrate pieces can be efficiently performed in parallel. For example, when there are two pairs of conveyors, the conveyor is provided every 90 °.

  When the supply position and the carry-out position are two or more pairs, the supply position and the carry-out position may be provided so as to face each other via the rotation shaft 11 of the turntable 10. In this case, a plurality of supply positions and a plurality of carry-out positions may be adjacent to each other in the rotation direction. Each conveyor is arranged on the turntable 10 for each angle calculated by 360 ° / (number of pairs × 2) so that the conveyor can be stopped at the supply position and the carry-out position, respectively. The cutting robot 20 is provided in alignment with each supply position, and the carry-out robot 40 is provided in alignment with each carry-out position. As described above, even when the supply position and the carry-out position face each other, the stage can be alternately stopped at the supply position and the carry-out position by rotating the turntable 10 by 180 °. Then, the cut substrate pieces can be efficiently carried out in parallel.

  In the above-described embodiment, when the first stage 13a and the second stage 13b are stopped at the supply position, the uncut substrate S is supplied in the direction toward the rotation axis 11 of the turntable 10. Although described as a conveyor, the present invention is not limited to this.

  Further, in the above-described embodiment, the first stage 13a and the second stage 13b remove the frame piece F after carrying out the piece P of the cut substrate S moved from the supply position to the carry-out position by the carry-out mechanism 40. Although described as being possible, it is not limited to this. For example, when the substrate to be cut does not have a frame piece, the operation of removing the frame piece is unnecessary.

  In the above-described embodiment, the substrate dividing apparatus 1 has been described as further including the tray 18 for placing the pieces P carried out by the carry-out mechanism 40 and the circulation mechanism 17 through which the tray circulates. It is not limited to this.

  S ... substrate, P ... piece, F ... frame piece, J ... joint, 1 ... substrate dividing device, 2 ... upstream device, 10 ... turntable, 1. ..Rotating shaft, 12 ... Case, 13a, 13b ... Conveyor, 15 ... Transit auxiliary conveyor, 16 ... Upstream conveyor, 17 ... Circulating conveyor, 18 ... Tray, 20 ... Cutting robot, 40 ... Unloading robot, 60 ... Control device, 70 ... Sensor, 80 ... Lifting table

Claims (4)

A turntable having a first stage and a second stage that are spaced apart in the rotational direction;
A supply mechanism for supplying an uncut substrate having a frame piece and an individual piece connected to the frame piece via a joint to the turntable;
In the supply position where the uncut board is supplied to the turntable, and a cutting mechanism for cutting the joint of the uncut board is divided into the individual pieces and the frame pieces,
A delivery mechanism for unloading the Kikohen before divided by the cutting mechanism from the turntable,
A control device for controlling operations of the turntable, the supply mechanism, the cutting mechanism, and the unloading mechanism ;
The turntable is configured to be rotatable so that the first stage stops at a supply position and an unloading position different from the supply position, respectively.
The second stage is positioned at the unloading position when the first stage is stopped at the supply position, and is positioned at the supply position when the first stage is stopped at the unloading position. Provided to
The supply mechanism and the cutting mechanism are provided in alignment with the supply position,
The unloading mechanism is provided in alignment with the unloading position,
Each of the first stage and the second stage can receive the uncut substrate from the supply mechanism at the supply position, and supplies the individual pieces and the frame pieces divided by the cutting mechanism. is configured to be mounting moved to the unloading position from the position,
The first stage and the second stage respectively rotate in a direction toward the rotation axis of the turntable, rotate in a direction away from the rotation axis of the turntable, and stop the rotation operation. Having a conveyor configured to be switchable,
The controller is
Among the first stage and the second stage, the conveyor of the stage at the supply position is rotationally driven in a direction toward the rotation axis of the turntable, so that the uncut substrate is supplied to the stage. And
Of the first stage and the second stage, the frame piece is removed from the stage by rotating the conveyor of the stage at the unloading position in a direction away from the rotation axis of the turntable. A substrate dividing apparatus characterized by the above . It said supply position and the unloading position, claim 1 Symbol mounting substrate dividing device, characterized in that face each other through the rotation axis of the turntable. A tray for placing the individual pieces carried out by the carrying-out mechanism;
Substrate dividing apparatus according to claim 1, wherein further comprising a circulating mechanism for the tray is circulated. A substrate dividing method for dividing a substrate using the substrate dividing apparatus according to any one of claims 1 to 3 ,
In the supply position, the conveyor is rotated driven in a direction toward the rotation axis of the turntable, the board supply step of supplying the uncut board on the turntable from the feed mechanism,
Substrate cutting step of cutting the joint of the uncut substrate supplied to the turntable by the cutting mechanism after the substrate supply step;
Substrate position changing step of rotating the turntable after the substrate cutting step and moving the cut substrate cut by the cutting mechanism to the unloading position;
Substrate unloading step of unloading the cut substrate by the unloading mechanism after the substrate position changing step ;
Removing the frame piece by rotating the conveyor in a direction away from the rotation axis of the turntable at the unloading position ;
In parallel with the substrate carry-out step, the substrate supply step is newly started.

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