TW202121561A - Apparatus for bonding multiple clips in semiconductro package and semiconductor package produdec using the same - Google Patents

Apparatus for bonding multiple clips in semiconductro package and semiconductor package produdec using the same Download PDF

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TW202121561A
TW202121561A TW109132979A TW109132979A TW202121561A TW 202121561 A TW202121561 A TW 202121561A TW 109132979 A TW109132979 A TW 109132979A TW 109132979 A TW109132979 A TW 109132979A TW 202121561 A TW202121561 A TW 202121561A
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clip
lead frame
bonding
semiconductor
bonding device
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TW109132979A
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Chinese (zh)
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TWI753584B (en
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崔倫華
朴廷敏
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南韓商Ｊｍｊ韓國有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The present invention discloses a multiple clip bonding apparatus for a semiconductor package, capable of minimizing a defect rate of the semiconductor package. The multiple clip bonding apparatus for the semiconductor package includes: a lead frame loading unit for supplying a lead frame in which semiconductor chips are arranged at a first pitch interval; a clip loading unit for supplying a clip array in which clips are arranged at a second pitch interval; a clip cutting unit for cutting the clip array into individual clips; a clip loading unit for loading the clips; a lead frame alignment unit for aligning the lead frame at a clip attachment position; a first inspection unit for inspecting an alignment state or an alignment error of the lead frame with respect to the clip attachment position; a clip attachment unit for picking up the clips to rearrange the clips at the first pitch interval, and attaching the clips to an upper portion of the lead frame; a lead frame unloading unit for discharging the lead frame to which the clips have been attached; and a control unit (not shown) for controlling the supply, alignment, inspection, and discharge of the lead frame and the supply, cutting, and attachment of the clips.

Description

半導體封裝多重夾片黏合裝置及同裝置製造的半導體封裝Semiconductor package multiple clip bonding device and semiconductor package manufactured by the same device

本發明涉及一種半導體封裝的多重夾片黏合裝置及通過同裝置製造的半導體封裝，其將引線框架的排列誤差最小化，以提高引線框架和夾片的貼合準確率，並且依次檢查夾片貼合工藝，以使半導體封裝的不合格率最小化。The present invention relates to a multi-clip bonding device for semiconductor packaging and a semiconductor package manufactured by the same device, which minimizes the arrangement error of the lead frame to improve the accuracy of the bonding of the lead frame and the clip, and sequentially inspects the clip attachment Integrate the process to minimize the failure rate of semiconductor packaging.

通常，實現電力用半導體元件的高電壓大電流半導體封裝在使用導電性夾片而代替焊接引線時，為了將夾片與半導體晶片貼合，而在將夾片排列至半導體晶片之後貼合。Generally, when a high-voltage and high-current semiconductor package that realizes power semiconductor elements uses conductive clips instead of bonding wires, in order to bond the clips to the semiconductor wafer, the clips are arranged on the semiconductor wafer and then bonded.

為了將多個夾片分別排列至多個半導體晶片並同時貼合，夾片的齒距和半導體晶片的齒距需保持一致。In order to arrange multiple clips to multiple semiconductor wafers and attach them at the same time, the tooth pitch of the clip and the semiconductor wafer must be kept consistent.

例如，在效率方面，與在引線框架貼合的半導體晶片的齒距相比，在夾片方陣排列中的夾片的齒距小。在剪裁夾片之後，再次調整夾片的齒距並排列在引線框架上，再貼合夾片。For example, in terms of efficiency, the tooth pitch of the clips in a square array of clips is smaller than that of a semiconductor wafer bonded to a lead frame. After cutting the clips, adjust the tooth pitch of the clips again and arrange them on the lead frame, and then attach the clips.

為了進行如上所述的夾片貼合工藝，需將貼合有半導體晶片的引線框架穩定固定定位在夾片貼合固定位置，以在誤差允許範圍內排列，進而使產品不合格率降到最小化。In order to perform the clip bonding process as described above, the lead frame with the semiconductor chip attached to it needs to be stably fixed and positioned at the clip bonding fixed position so as to be arranged within the allowable error range, thereby minimizing the product failure rate化.

並且，有需要提供一種多重夾片黏合裝置技術，其不僅檢查引線框架的排列，還檢查引線框架的差錯或不合格，以消除在選擇夾片前後的差錯發生的可能性；並且檢查引線框架和夾片的貼合狀態而糾正差錯或誤差，從而提高產品產出率，並解決由夾片的毛刺而引起的電問題。In addition, there is a need to provide a multiple clip bonding device technology that not only checks the arrangement of the lead frame, but also checks the lead frame for errors or failures, so as to eliminate the possibility of errors before and after the clip is selected; and check the lead frame and the lead frame. The fit state of the clip can correct errors or errors, thereby increasing the product yield and solving the electrical problem caused by the burr of the clip.

本發明的思想要解決的技術問題為提供一種半導體封裝的多重夾片黏合裝置及通過同裝置製造的半導體封裝，其將引線框架的排列誤差最小化，以提高引線框架和夾片的貼合準確率，並且依次檢查夾片貼合工藝，以使半導體封裝的不合格率最小化。The technical problem to be solved by the idea of the present invention is to provide a multi-clip bonding device for semiconductor packages and a semiconductor package manufactured by the same device, which minimizes the alignment error of the lead frame and improves the bonding accuracy of the lead frame and the clip. And check the clip bonding process in order to minimize the failure rate of semiconductor packages.

為了實現如上所述的目的，本發明提供一種半導體封裝的多重夾片黏合裝置，其包括：引線框架承載部，用以供應供半導體晶片按第一齒距間距排列的引線框架；夾片承載部，用以供應供電連接所述半導體晶片和所述引線框架的簧片的夾片按第二齒距間距排列的夾片方陣；夾片剪裁部，用以將所述夾片方陣逐個按夾片剪裁；夾片裝載部，用以裝載所剪裁的按第二齒距間距排列的所述夾片；引線框架排列部，用以將所述引線框架排列至夾片貼合位置；第一檢查部，用以檢查所述引線框架的夾片貼合位置的排列狀態或排列誤差；夾片貼合部，其中由所述夾片裝載部選擇所述夾片而再次按第一齒距間距排列，並移送至所述引線框架排列部的夾片貼合位置且按第一齒距間距排列所述半導體晶片的所述引線框架上部，並與相應引線框架上部貼合；引線框架卸載部，用以排出完成夾片貼合的引線框架；及控制部，用以控制所述引線框架的供應、排列、檢查和排出，及所述夾片的供應、剪裁及貼合。In order to achieve the above-mentioned object, the present invention provides a multi-clip bonding device for semiconductor packages, which includes: a lead frame carrying part for supplying lead frames for semiconductor chips arranged at a first pitch pitch; and a clip carrying part , For supplying power to connect the semiconductor chip and the lead frame's reeds, the clips are arranged at a second pitch pitch, a clip square array; clip cutting parts are used to press the clip squares one by one Clipping; clip loading part for loading the clipped clips arranged at the second pitch pitch; lead frame arranging part for arranging the lead frame to the clip bonding position; first inspection part , Used to check the arrangement state or alignment error of the clip bonding position of the lead frame; clip bonding part, wherein the clip is selected by the clip loading part and arranged again according to the first pitch pitch, The upper part of the lead frame of the semiconductor chip is arranged at the first pitch and is attached to the upper part of the corresponding lead frame; the lead frame unloading part is used for Discharge the lead frame to which the clip has been attached; and a control unit for controlling the supply, arrangement, inspection, and discharge of the lead frame, and the supply, cutting, and attachment of the clip.

在一方面，所述控制部確認通過所述第一檢查部所檢查出的排列誤差，以糾正通過所述夾片貼合部而形成的夾片的貼合位置。In one aspect, the control unit confirms the alignment error detected by the first inspection unit to correct the bonding position of the clip formed by the clip bonding portion.

在一方面，所述第一檢查部與在所述引線框架排列部上部分隔形成的XYR軸平臺結合形成，且通過在夾片貼合位置上部往復並拍攝所述引線框架的左右邊緣來檢查所述引線框架的排列狀態。In one aspect, the first inspection part is formed in combination with an XYR-axis stage partitioned on the upper part of the lead frame arrangement part, and the inspection is performed by reciprocating and photographing the left and right edges of the lead frame at the upper part of the clip bonding position. The arrangement state of the lead frame.

在一方面，所述第一檢查部為飛行視覺攝像機或步進視覺攝像機。In one aspect, the first inspection part is a flight vision camera or a stepping vision camera.

在一方面，所述引線框架排列部包括：平臺，設有所述夾片貼合位置；前段滑軌，用以從所述引線框架承載部向所述平臺移送所述引線框架；後段滑軌，用以從所述平臺向所述引線框架卸載部移送所述引線框架；前端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述前段滑軌的一側的軌道移送所述引線框架；後端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述後段滑軌的一側的軌道移送所述引線框架；限位感測器，用以檢測來自所述引線框架的所述引線框架承載部的供應；及限位感測器，用以檢測來自所述引線框架的所述引線框架卸載部的排出。In one aspect, the lead frame arrangement part includes: a platform provided with the clip attachment position; a front slide rail for transferring the lead frame from the lead frame carrying portion to the platform; a rear slide rail , Used to transfer the lead frame from the platform to the lead frame unloading part; a front end grabbing rail unit used to press one side of the lead frame to follow the slide rail formed in the front section A rail on one side transfers the lead frame; a rear end grabbing rail unit is used to press one side of the lead frame to transfer the lead frame along a rail formed on one side of the rear section of the slide rail A limit sensor to detect the supply from the lead frame carrying portion of the lead frame; and a limit sensor to detect the discharge from the lead frame unloading portion of the lead frame.

在一方面，所述平臺是指真空吸附所述引線框架而形成夾片貼合位置的真空吸附平臺，並包括：真空吸附板，由供安裝所述引線框架的多孔陶瓷構成；負壓供應單元，形成於所述真空吸附板下端而向所述真空吸附板供應負壓。In one aspect, the platform refers to a vacuum suction platform that vacuum-adsorbs the lead frame to form a clip bonding position, and includes: a vacuum suction plate, which is composed of porous ceramics for mounting the lead frame; and a negative pressure supply unit , Formed at the lower end of the vacuum suction plate to supply negative pressure to the vacuum suction plate.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：第二檢查部，分隔形成於所述前段滑軌的前側部上端，用以檢查向所述平臺移送的所述引線框架有無半導體晶片、有無導電膠、導電膠體積及二維碼中的任一個以上。 而且，還包括：第三檢查部，分隔形成於所述後段滑軌的前側部上端，檢查由所述平臺移送的所述夾片的貼合狀態或貼合誤差。In one aspect, the multi-clip bonding device of the semiconductor package further includes: a second inspection part formed separately on the upper end of the front side part of the front slide rail for inspecting the presence or absence of the lead frame transferred to the platform At least one of the semiconductor chip, the presence or absence of conductive glue, the volume of conductive glue, and the two-dimensional code. Furthermore, it further includes: a third inspection part, which is partitioned and formed at the upper end of the front side part of the rear section of the slide rail, and inspects the bonding state or the bonding error of the clip transferred by the platform.

在一方面，所述第二檢查部為飛行視覺攝像機或步進視覺攝像機。In one aspect, the second inspection part is a flight vision camera or a stepping vision camera.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：第四檢查部，分隔形成於所述夾片貼合部的下端，用以檢查通過所述夾片貼合部而產生的所述引線框架排列部的所述夾片的貼合狀態，或檢查所述引線框架與所述夾片的貼合之後所述夾片貼合部的所述夾片的去除狀態。In one aspect, the multi-clip bonding device for semiconductor packages further includes: a fourth inspection part, which is formed separately at the lower end of the clip bonding part, and is used to check the production generated by the clip bonding part. The bonding state of the clip of the lead frame arrangement portion, or the removal state of the clip of the clip bonding portion after the bonding of the lead frame and the clip is checked.

在一方面，所述控制部用以確認通過所述第四檢查部所檢查出的所述夾片的貼合狀態或去除狀態的差錯，並且在確認差錯時將所述夾片移送至廢料盒並去除。In one aspect, the control unit is used to confirm an error in the bonding state or removal state of the clip detected by the fourth inspection unit, and to transfer the clip to the waste box when the error is confirmed And remove.

在一方面，所述第四檢查部為飛行視覺攝像機或步進視覺攝像機。In one aspect, the fourth inspection part is a flight vision camera or a stepping vision camera.

在一方面，所述夾片剪裁部為將所述夾片方陣逐個按夾片而向下剪裁。In one aspect, the clip cutting part is to cut the clip squares one by one by pressing the clip downwards.

在一方面，通過所述夾片剪裁部而剪裁的所述逐個夾片的切削毛刺(burr)向下形成。In one aspect, the cutting burrs of the clip pieces cut by the clip piece cutting portion are formed downward.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：黏合劑塗覆裝置，在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前塗覆導電膠。In one aspect, the multi-clip bonding device of the semiconductor package further includes: an adhesive coating device on the upper part of the lead frame for arranging the semiconductor chip to coat the conductive film before bonding the clips. glue.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：黏合劑塗覆裝置，設置在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前，在所述半導體晶片和所述引線框架的簧片上塗覆導電膠。In one aspect, the multiple clip bonding device of the semiconductor package further includes: an adhesive coating device, which is arranged on the upper part of the lead frame for arranging the semiconductor chip, and is used for bonding the clips before bonding the clips. Conductive glue is coated on the semiconductor wafer and the reeds of the lead frame.

本發明還提供一種通過上述半導體封裝的多重夾片黏合裝置而製造的半導體封裝。The present invention also provides a semiconductor package manufactured by the above-mentioned multiple clip bonding device of the semiconductor package.

下面，參照附圖而對本發明的實施例進行具體說明，以使本發明所屬技術領域的普通技術人員容易實施。本發明通過各種相異的形式實現，並非限定於在此說明的實施例。Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those of ordinary skill in the art to which the present invention belongs can be easily implemented. The present invention is implemented in various different forms and is not limited to the embodiments described here.

參照圖1至圖11，對本發明的實施例的半導體封裝的多重夾片黏合裝置作下列具體的說明。1 to FIG. 11, the following specific descriptions are made on the multiple clip bonding device of the semiconductor package according to the embodiment of the present invention.

本發明的實施例的半導體封裝的多重夾片黏合裝置具體地包括：引線框架承載部110，用以供應供半導體晶片11按第一齒距P1間距排列的引線框架10；夾片承載部120，用以供應供夾片21按第二齒距P2間距排列的夾片方陣20；夾片剪裁部130，用以將夾片方陣20逐個按夾片21剪裁；夾片裝載部140，用以裝載夾片21；引線框架排列部150，用以將引線框架10排列至夾片貼合位置A；第一檢查部160，用以檢查引線框架10的夾片貼合位置A的排列狀態或排列誤差；夾片貼合部170，用以選擇夾片21而再次按第一齒距P1間距排列，貼合至引線框架10上部；引線框架卸載部180，用以排出完成夾片貼合的引線框架10；控制部(未圖示)，用以控制引線框架10的供應、排列、檢查及排出，及夾片21的供應、剪裁及貼合，並且以檢查引線框架10的排列狀態或排列誤差為主要目的。The multi-clip bonding device of the semiconductor package of the embodiment of the present invention specifically includes: a lead frame carrying portion 110 for supplying the lead frame 10 for semiconductor chips 11 arranged at the first pitch P1 pitch; and the clip supporting portion 120, It is used for supplying the square matrix 20 of clamping pieces 21 arranged at the second pitch P2; the clamping piece cutting part 130 is used to cut the square matrix 20 one by one according to the clamping pieces 21; the clamping piece loading part 140 is used for loading Clip 21; lead frame arrangement part 150 for arranging the lead frame 10 to the clip bonding position A; first inspection part 160 for checking the arrangement state or arrangement error of the clip bonding position A of the lead frame 10 The clip attachment portion 170 is used to select the clip 21 and arranged again according to the first pitch P1 pitch to be attached to the upper part of the lead frame 10; the lead frame unloading portion 180 is used to discharge the lead frame after the clip attachment is completed 10; The control unit (not shown) is used to control the supply, arrangement, inspection and discharge of the lead frame 10, and the supply, cutting and bonding of the clip 21, and to check the arrangement state or arrangement error of the lead frame 10 main purpose.

首先，引線框架承載部110如圖1A、圖1B及圖8所示，將半導體晶片11(參照圖11)按第一齒距P1間距排列的引線框架10引入裝料庫111而裝載多個，將裝料庫111通過借助電機112而驅動的輸送帶113而移送至裝料拾取器(114)，而排列至前段滑軌152之後，通過推送器115的前進滑動而將引線框架10供應至引線框架排列部150。First, as shown in FIG. 1A, FIG. 1B and FIG. 8, the lead frame carrying portion 110 introduces the semiconductor wafer 11 (refer to FIG. 11) with the lead frames 10 arranged at the first pitch P1 into the loading bay 111 to load a plurality of them. The loading magazine 111 is transferred to the loading picker (114) by the conveyor 113 driven by the motor 112, and after being arranged on the front slide rail 152, the lead frame 10 is supplied to the lead by the forward sliding of the pusher 115 Frame arrangement part 150.

在此，推送器115包括：T杆115a，用以推動被裝載至裝料庫111的引線框架10的一端；齒條115b，與T杆115a的後端結合形成；小齒輪(未圖示)，與齒條115b嚙合；電機115c，用以旋轉驅動小齒輪，以將T杆115a前後滑動。Here, the pusher 115 includes: a T rod 115a for pushing one end of the lead frame 10 loaded into the loading magazine 111; a rack 115b combined with the rear end of the T rod 115a; and a pinion gear (not shown) , Meshes with the rack 115b; the motor 115c is used to rotate and drive the pinion gear to slide the T rod 115a back and forth.

另外，本發明的實施例公開引線框架承載部110用於將半導體晶片11按第一齒距P1間距排列的引線框架10引入至裝料庫111，以及裝載並供應引線框架10，但並非限定於此，亦可為能夠進行供應供半導體晶片11按第一齒距P1間距排列的引線框架10的各種變形的實施。In addition, the embodiment of the present invention discloses that the lead frame carrying portion 110 is used to introduce the lead frame 10 of the semiconductor chip 11 arranged at the first pitch P1 pitch into the loading library 111, and to load and supply the lead frame 10, but it is not limited to This can also be an implementation that can supply various modifications of the lead frame 10 in which the semiconductor wafers 11 are arranged at the pitch of the first pitch P1.

例如，在用於將半導體晶片11按第一齒距P1間距排列至引線框架10上的先行工作臺與本發明的實施例的半導體封裝的多重夾片黏合裝置連接的情況下，引線框架承載部110起到將由該先行工作臺移送的引線框架10承載至本發明的實施例的半導體封裝多重夾片黏合裝置的作用。For example, in the case where the advance stage for arranging the semiconductor chip 11 on the lead frame 10 at the first pitch P1 is connected to the multiple clip bonding device of the semiconductor package of the embodiment of the present invention, the lead frame carrying portion 110 plays the role of carrying the lead frame 10 transferred from the advance workbench to the semiconductor package multiple clip bonding device of the embodiment of the present invention.

作為參考，適用MOSFET半導體或IGBT半導體作為半導體晶片11，但並非限定於此，由可控矽整流器(SCR)、電力電晶體、電力整流器、電力調整器或其組合的電力半導體構成。For reference, MOSFET semiconductor or IGBT semiconductor is used as the semiconductor chip 11, but it is not limited to this, and is composed of a silicon controlled rectifier (SCR), a power transistor, a power rectifier, a power regulator, or a combination of power semiconductors.

夾片承載部120將供通過導電膠13電連接半導體晶片11和引線框架10的簧片12的夾片21按第二齒距P2間距排列的夾片方陣20捲繞為捲筒形而供應至夾片剪裁部130。The clip carrying portion 120 winds the clip 21 that is used to electrically connect the semiconductor chip 11 and the reed 12 of the lead frame 10 through the conductive glue 13 to the clip square array 20 arranged at the second pitch P2. Clip cutting section 130.

在此，如圖4所示，夾片方陣20包括：夾片21，按能夠剪裁的最小齒距間距排列成矩陣；連接部22，相互連接夾片21；夾片框架23，按長度方向連接連接部22的兩端。Here, as shown in FIG. 4, the clip square 20 includes: clip 21, arranged in a matrix according to the smallest pitch that can be cut; connecting portion 22, interconnecting clip 21; clip frame 23, connected in the length direction Both ends of the connecting portion 22.

具體地，夾片承載部120如圖1A、圖1B、圖2A、圖2B及圖3所示，包括：夾片捲盤121，用以捲繞夾片方陣20；襯底捲盤122，用以從夾片方陣20去除襯底；供應滾軸123，用以將夾片方陣20移送至夾片剪裁部130；電機124，用以旋轉驅動供應滾軸123；調節手柄125，用以調節夾片方陣20的移送寬度。Specifically, as shown in FIGS. 1A, 1B, 2A, 2B and 3, the clip carrying portion 120 includes: a clip reel 121 for winding the clip square 20; and a substrate reel 122 To remove the substrate from the clip square 20; the supply roller 123 to transfer the clip square 20 to the clip cutting part 130; the motor 124 to rotate the supply roller 123; the adjustment handle 125 to adjust the clip The transfer width of the phalanx 20.

另外，本發明的實施例的夾片承載部120公開一種由捲繞夾片方陣20的夾片捲盤121構成的捲盤類型，但並非限定於捲盤類型，也能夠以條狀供應夾片方陣20，亦能夠進行各種變形的實施。In addition, the clip carrier 120 of the embodiment of the present invention discloses a reel type composed of a clip reel 121 wound around the clip square 20, but it is not limited to the reel type, and the clip can also be supplied in strips. The array 20 can also be implemented in various modifications.

另外，在半導體晶片11和引線框架10的簧片12貼合夾片21之前，增加塗覆導電膠13的黏合劑塗覆裝置(未圖示)。導電膠13包含錫或鉛的焊錫系列、包含銀或銅的燒結(sintering)材料，以及包含金的共晶(eutectic)反應材料。In addition, before the semiconductor chip 11 and the reed 12 of the lead frame 10 are attached to the clip 21, an adhesive coating device (not shown) for coating the conductive glue 13 is added. The conductive paste 13 includes a solder series of tin or lead, a sintering material including silver or copper, and an eutectic reaction material including gold.

夾片剪裁部130通過剪裁連接部22而將夾片方陣20逐個按夾片21分離。The clip cutting part 130 separates the clip squares 20 one by one by the clip 21 by cutting the connecting part 22.

具體地，夾片剪裁部130如圖5及圖6A所示，包括：剪裁帶131，用以引導夾片方陣20，定位夾片21的剪裁孔131a按第二齒距P2間距排列形成；打孔器132，形成於剪裁帶131上端，以將剪裁孔131a向下側方向貫通的方式下降而剪裁夾片方陣20；加壓板133，供結合形成打孔器132；剪裁氣缸134，用以升降驅動加壓板133；導板135，分隔形成於剪裁帶131上端，供形成打孔器132貫通的沖孔135a而引導打孔器132的升降滑動；第一廢料盒136，用以回收經去除的夾片21的夾片方陣20。Specifically, as shown in FIG. 5 and FIG. 6A, the clip cutting portion 130 includes: a cutting belt 131 for guiding the clip square array 20, and the cutting holes 131a of the positioning clip 21 are arranged and formed at the second pitch P2; The hole 132 is formed at the upper end of the cutting belt 131, and the cutting hole 131a penetrates downward to cut the clip square 20; the pressure plate 133 is combined to form the hole punch 132; the cutting cylinder 134 is used for Lifting and driving the pressurizing plate 133; the guide plate 135 is formed separately at the upper end of the cutting belt 131 for forming a punching hole 135a through which the punch 132 penetrates to guide the lifting and sliding of the punch 132; the first waste box 136 is used for recycling The clip square 20 of the clip 21 is removed.

在此，剪裁孔131a與夾片21的形狀相應並貫通形成，並將夾片方陣20通過打孔器132而如箭頭方向(參照圖5)所示，通過剪裁帶131的剪裁孔131a而向下側方向剪裁，在剪裁分離的夾片21的剪裁面邊緣發生的毛刺(burr)向下形成，在半導體晶片11和夾片21貼合時，完全消除因毛刺而產生的與半導體晶片11的非正常的接觸所導致的電問題的發生的可能性。Here, the cutting holes 131a are formed to correspond to the shape of the clip 21, and the clip squares 20 are passed through the punch 132, as shown in the arrow direction (refer to FIG. 5), and directed through the cutting holes 131a of the cutting tape 131. Cutting in the lower side direction, the burr that occurs at the edge of the cutting surface of the clip 21 that is cut and separated is formed downwards. When the semiconductor wafer 11 and the clip 21 are attached, the burr and the semiconductor wafer 11 are completely eliminated. The possibility of electrical problems caused by abnormal contact.

夾片裝載部140包括：夾片安裝器141，用以裝載所剪裁的按第二齒距P2間距排列的夾片21而滑動移送至與引線框架排列部150的選擇位置，如圖6A、圖6B及圖7所示，上升引入至剪裁帶131的剪裁孔131a而安裝所剪裁的夾片21；裝載氣缸142，用以上升驅動夾片安裝器141；導軌143，用以將安裝至夾片安裝器141的夾片21移動至選擇位置的方式引導按箭頭方向前後滑動；驅動單元144，用以沿著導軌143前後驅動。驅動單元144由與導軌143緊貼旋轉的輪子和旋轉驅動輪子的電機構成。The clip loading part 140 includes: a clip mounter 141 for loading the clip 21 arranged at a second pitch P2 pitch and slidingly transferred to a selected position with the lead frame arrangement part 150, as shown in FIG. 6A and FIG. As shown in 6B and FIG. 7, the clip 21 is mounted on the cutting hole 131a of the cutting tape 131 by lifting; the loading cylinder 142 is used to lift the drive clip installer 141; the guide rail 143 is used to mount the clip to the clip 21 The clip 21 of the installer 141 is guided to slide back and forth in the direction of the arrow by moving the clip 21 of the installer 141 to the selected position; the driving unit 144 is used to drive back and forth along the guide rail 143. The driving unit 144 is composed of a wheel that rotates in close contact with the guide rail 143 and a motor that rotates and drives the wheel.

引線框架排列部150真空吸附引線框架10而排列至夾片貼合位置A(參照圖2B)。.The lead frame arrangement part 150 vacuum sucks the lead frame 10 and arranges it to the clip bonding position A (refer to FIG. 2B). .

具體地，引線框架排列部150如圖2A、圖2B、圖6A、圖6B及圖8所示，包括：真空吸附平臺151，設有真空吸附引線框架10的夾片貼合位置A；前段滑軌152，用以從引線框架承載部110向真空吸附平臺151移送引線框架10；後段滑軌153，用以從真空吸附平臺151向引線框架卸載部180移送引線框架10；前端抓取軌道單元155，用以對引線框架10的一側面加壓而沿著形成於前段滑軌152的一側的導軌154移送引線框架10；後端抓取軌道單元156，用以對引線框架10的一側面加壓而沿著形成於後段滑軌153的一側的導軌154移送引線框架10；限位感測器157，用以檢測來自引線框架10的引線框架承載部110的供應；限位感測器158，用以檢測通過引線框架10的引線框架卸載部180的排出。Specifically, the lead frame arrangement portion 150, as shown in FIGS. 2A, 2B, 6A, 6B and FIG. 8, includes: a vacuum suction platform 151 provided with a clip attachment position A of the vacuum suction lead frame 10; The rail 152 is used to transfer the lead frame 10 from the lead frame carrying portion 110 to the vacuum suction platform 151; the rear slide rail 153 is used to transfer the lead frame 10 from the vacuum suction platform 151 to the lead frame unloading portion 180; the front end grabbing rail unit 155 , Used to press a side surface of the lead frame 10 and move the lead frame 10 along the guide rail 154 formed on one side of the front slide rail 152; the rear end grabbing rail unit 156 is used to add a side surface of the lead frame 10 The lead frame 10 is pressed and transferred along the guide rail 154 formed on one side of the rear slide rail 153; the limit sensor 157 is used to detect the supply from the lead frame carrying portion 110 of the lead frame 10; the limit sensor 158 , To detect the discharge through the lead frame unloading portion 180 of the lead frame 10.

在此，真空吸附平臺151由供安裝引線框架10的多孔陶瓷構成的真空吸附板、形成於真空吸附板下端而向真空吸附板供應負壓的負壓供應單元構成，在與夾片21貼合時，穩定地固定引線框架10。Here, the vacuum suction platform 151 is composed of a vacuum suction plate made of porous ceramic on which the lead frame 10 is mounted, and a negative pressure supply unit formed at the lower end of the vacuum suction plate to supply negative pressure to the vacuum suction plate, and is bonded to the clip 21 At this time, the lead frame 10 is stably fixed.

另外，真空吸附板在燒爐中10日左右時間內，在1300℃的高溫下通過燒結方式形成，保持均勻的氣孔分佈和2μm至3μm氣孔大小，均勻吸附各種尺寸或各種形狀的引線框架。即使僅通過一個真空吸附板也能夠吸附各種尺寸或各種形狀的引線框架。真空吸附板具有不存在產生本身粉塵及微粒、防止引線框架10的刮痕，以及具有103·Ω cm2 至109·Ω cm2 的表面電阻率的特性，而可釋放並去除半導體晶片11和引線框架10的靜電，並提供高真空及高強度的吸附力。In addition, the vacuum adsorption plate is formed by sintering at a high temperature of 1300°C in the furnace for about 10 days, maintaining a uniform pore distribution and a pore size of 2 μm to 3 μm, and uniformly adsorbing lead frames of various sizes or shapes. Lead frames of various sizes or shapes can be adsorbed even through only one vacuum suction plate. The vacuum suction plate has the characteristics of not generating dust and particles of its own, preventing scratches of the lead frame 10, and having a surface resistivity of 103·Ω cm 2 to 109·Ω cm 2 and can release and remove the semiconductor wafer 11 and leads The static electricity of the frame 10 provides high vacuum and high-strength adsorption force.

第一檢查部160如圖1A及圖6B所示，由飛行視覺攝像機或步進視覺攝像機構成，用以檢查引線框架10的夾片貼合位置A的排列狀態或排列誤差。As shown in FIGS. 1A and 6B, the first inspection unit 160 is composed of a flight vision camera or a stepping vision camera, and is used to check the arrangement state or arrangement error of the clip bonding position A of the lead frame 10.

例如，第一檢查部160與分隔形成於引線框架排列部150上部的XYR軸平臺161結合形成，通過在夾片貼合位置A上部往復引線框架10的左右邊緣，並連續拍攝(例如，2次往復及16攝拍攝)來檢查引線框架10的排列狀態，使控制部確認通過第一檢查部160所檢查出的引線框架10的排列誤差，並糾正夾片貼合部170的夾片貼合位置A，以提高引線框架10和夾片21的貼合準確率。For example, the first inspection part 160 is formed by combining with the XYR axis stage 161 formed separately on the upper part of the lead frame arrangement part 150, by reciprocating the left and right edges of the lead frame 10 at the upper part of the clip bonding position A, and continuously photographing (for example, twice Reciprocating and 16-shot photography) to check the arrangement state of the lead frame 10, make the control unit confirm the arrangement error of the lead frame 10 inspected by the first inspection unit 160, and correct the clip bonding position of the clip bonding portion 170 A, to improve the bonding accuracy of the lead frame 10 and the clip 21.

之後，夾片貼合部170如圖7及圖9所示，與XYR軸平臺161結合形成，通過夾片裝載部140的夾片安裝器141選擇按第二齒距P2間距排列的夾片21，以及使夾片21再次按第一齒距P1間距排列，並向供按引線框架排列部150的夾片貼合位置A的第一齒距P1間距排列半導體晶片11的引線框架10上部移送，且按一定壓力加壓，以與相應引線框架10上部貼合。Then, as shown in FIGS. 7 and 9, the clip bonding portion 170 is combined with the XYR axis platform 161 to form, and the clip mounter 141 of the clip loading portion 140 selects the clips 21 arranged at the second pitch P2 pitch. , And the clips 21 are arranged again at the first pitch P1 pitch, and are transferred to the top of the lead frame 10 where the semiconductor chips 11 are arranged at the first pitch P1 pitch of the clip bonding position A of the lead frame arrangement portion 150, And press a certain pressure to fit the upper part of the corresponding lead frame 10.

具體地，夾片貼合部170包括：貼合焊嘴171，真空吸附夾片21；多個可變塊172，在下端結合貼合焊嘴171，並以改變齒距的方式相互分離形成並咬合；真空管件173，向貼合焊嘴171提供負壓；直線導軌174，引導可變塊172的齒距的調節；固定板175，供固定形成直線導軌174，形成引導與可變塊172結合的凸輪從動件172a的左右擴展的狹槽175a；可變凸輪板176，引入凸輪從動件172a，且設有預定形狀的凸輪插槽176a，以調節齒距；線形發動機177，用於使可變凸輪板176前後滑動。此時，為了調節齒距而形成的凸輪插槽176a可形成為扇骨形狀，以在兩種齒距間進行調節，也可形成為彎曲(香蕉)形狀，以在三種齒距間進行調節，但其並非限定於此，能夠根據齒距類型的數量而形成為適當的形狀。Specifically, the clip attaching portion 170 includes: a bonding nozzle 171, a vacuum suction clip 21; a plurality of variable blocks 172, which are combined with the bonding nozzle 171 at the lower end, and are formed and separated from each other by changing the tooth pitch. Bite; vacuum tube 173, to provide negative pressure to the welding nozzle 171; linear guide 174, guide the adjustment of the pitch of the variable block 172; fixed plate 175 for fixing to form a linear guide 174, forming a guide and variable block 172 combination The left and right extended slots 175a of the cam follower 172a; the variable cam plate 176, which introduces the cam follower 172a, and is provided with a cam slot 176a of a predetermined shape to adjust the tooth pitch; a linear motor 177 for making The variable cam plate 176 slides back and forth. At this time, the cam slot 176a formed in order to adjust the tooth pitch may be formed in a fan shape to adjust between two tooth pitches, or it may be formed in a curved (banana) shape to adjust between three tooth pitches, but It is not limited to this, and can be formed into an appropriate shape according to the number of pitch types.

因而，參照圖10A及圖10B，通過線形發動機177的前後滑動來前後移動可變凸輪板176，凸輪從動件172a之間的分隔根據凸輪插槽176a而擴展或縮小，以與半導體晶片11的第一齒距P1一致的方式，將貼合焊嘴171的齒距由夾片21的第二齒距P2向第一齒距P1改變，而再次按第一齒距P1間距排列夾片21。Therefore, referring to FIGS. 10A and 10B, the variable cam plate 176 is moved back and forth by sliding the linear motor 177 back and forth, and the separation between the cam followers 172a expands or contracts according to the cam slot 176a to match the semiconductor chip 11 The first tooth pitch P1 is consistent, the tooth pitch of the bonding nozzle 171 is changed from the second tooth pitch P2 of the clip 21 to the first tooth pitch P1, and the clips 21 are arranged again according to the first tooth pitch P1.

另外，如圖6B所示，還包括：監控器（CCTV）162，形成於夾片貼合部170的後側部，以影像方式拍攝夾片貼合部170的齒距調節狀態，由此，管理者也容易識別齒距調節狀態。In addition, as shown in FIG. 6B, it also includes a monitor (CCTV) 162 formed on the rear side of the clip bonding portion 170 to photograph the tooth pitch adjustment state of the clip bonding portion 170 in a video mode, thereby, It is also easy for managers to recognize the state of tooth pitch adjustment.

引線框架卸載部180排出在真空吸附平臺151完成夾片貼合的引線框架10。由此排出的完成夾片貼合的引線框架10被裝載於卸料庫(181)，以用於焊接或黏合劑固化等後續工藝，或通過另外設置的軌道(未圖示)運送或通過另外的選擇臂(未圖示)而移送至後續工序平臺。The lead frame unloading part 180 discharges the lead frame 10 on which the clips are bonded on the vacuum suction platform 151. The lead frame 10, which has been discharged and completed with clip bonding, is loaded in the unloading magazine (181) for subsequent processes such as soldering or adhesive curing, or is transported through an additional rail (not shown) or through another The selection arm (not shown) is transferred to the subsequent process platform.

控制部控制引線框架10的供應、排列、檢查及排出，及夾片21的供應、剪裁及貼合，確認通過第一檢查部160而產生的引線框架10的排列誤差，以糾正通過夾片貼合部170而產生的夾片的貼合位置而提高引線框架10和夾片21的貼合準確率。The control unit controls the supply, arrangement, inspection, and discharge of the lead frame 10, as well as the supply, cutting, and bonding of the clip 21, and confirms the alignment error of the lead frame 10 generated by the first inspection unit 160, so as to correct the pasting by the clip. The bonding position of the clip generated by the bonding portion 170 improves the bonding accuracy of the lead frame 10 and the clip 21.

另外，第二檢查部(191)由飛行視覺攝像機或步進視覺攝像機構成，如圖6B所示，分隔形成於前段滑軌152的前側部上端，用以檢查移送至真空吸附平臺151的引線框架10有無半導體晶片11、有無導電膠13、導電膠13的體積及/或二維碼，在檢測差錯時通過控制部而確定夾片貼合工藝進行與否。In addition, the second inspection unit (191) is composed of a flight vision camera or a stepping vision camera. As shown in FIG. 6B, a partition is formed at the upper end of the front side of the front slide rail 152 to inspect the lead frame transferred to the vacuum suction platform 151 10. The presence or absence of the semiconductor chip 11, the presence or absence of the conductive glue 13, the volume of the conductive glue 13, and/or the two-dimensional code, when the error is detected, the control unit determines whether the clip bonding process is performed or not.

並且，第三檢查部192由飛行視覺攝像機或步進視覺攝像機構成，如圖6B所示，分隔形成於後段滑軌153的前側部上端，用以檢查由真空吸附平臺151移送的夾片21的貼合狀態及/或貼合誤差，並比對基準值識別誤差允許範圍。In addition, the third inspection unit 192 is composed of a flight vision camera or a stepping vision camera. As shown in FIG. 6B, a partition is formed at the upper end of the front side of the rear slide rail 153 to inspect the clamp 21 transferred by the vacuum suction platform 151. Fitting state and/or fitting error, and compare the reference value to identify the allowable range of error.

並且，第四檢查部193由飛行視覺攝像機或步進視覺攝像機構成，如圖7所示，分隔形成於夾片貼合部170的下端，檢查通過夾片貼合部170而構成的引線框架排列部150的夾片21的貼合狀態，及/或在引線框架10和夾片21的貼合之後，檢查夾片貼合部170的夾片21的去除狀態，即，確認夾片貼合部170的貼合焊嘴171是否正常選擇夾片21和在夾片21的貼合之後，貼合焊嘴171空閒與否，控制部確認通過第四檢查部193所檢查出的夾片21的貼合狀態或去除狀態的差錯，在確認差錯時將夾片21移送至第二廢料盒(194)(參照圖8)，以分離回收並去除。In addition, the fourth inspection unit 193 is composed of a flight vision camera or a stepping vision camera. As shown in FIG. 7, it is partitioned and formed at the lower end of the clip bonding portion 170 to inspect the lead frame arrangement formed by the clip bonding portion 170 The bonding state of the clip 21 of the section 150, and/or after the bonding of the lead frame 10 and the clip 21, the removal state of the clip 21 of the clip bonding portion 170 is checked, that is, the clip bonding portion is confirmed Whether the bonding nozzle 171 of 170 is normal, select the clip 21 and after the bonding of the clip 21, whether the bonding nozzle 171 is free or not, the control part confirms the bonding of the clip 21 checked by the fourth inspection part 193 For errors in the closed state or the removed state, when the error is confirmed, the clip 21 is transferred to the second waste box (194) (refer to FIG. 8) to be separated, recovered and removed.

因此，為了在構成上述所述的半導體封裝的多重夾片黏合裝置時，將引線框架的排列誤差最小化而提高引線框架和夾片的貼合準確率；在貼合工藝之前(prebond)，檢查供應引線框架時的引線框架上有無半導體晶片11、有無導電膠13、導電膠13體積及二維碼中的至少一個；在貼合工藝之後(postbond)，檢查夾片的貼合狀態及貼合誤差，並比對基準值以識別誤差允許範圍，確認夾片的貼合狀態或去除狀態的差錯，依次檢查夾片貼合工藝而使半導體封裝的不合格率最小化，從而提高產品產出率。Therefore, in order to minimize the alignment error of the lead frame and improve the accuracy of the bonding of the lead frame and the clip when constructing the above-mentioned multiple clip bonding device of the semiconductor package; check before the bonding process (prebond) When the lead frame is supplied, there is at least one of the semiconductor chip 11, the conductive glue 13, the volume of the conductive glue 13, and the QR code on the lead frame; after the bonding process (postbond), check the bonding state and bonding of the clip Error, and compare the reference value to identify the allowable range of error, confirm the bonding state of the clip or the error of the removal state, and check the bonding process of the clip in turn to minimize the failure rate of the semiconductor package, thereby increasing the product yield rate .

另外，本發明的實施例的半導體封裝的多重夾片黏合裝置可單獨使用，也能夠與先行或後行的各種工作臺連接使用。In addition, the multi-clip bonding device of the semiconductor package of the embodiment of the present invention can be used alone, and can also be used in connection with various workbenches in advance or in advance.

具體地，本發明的一實施例的引線框架承載部110與用於將半導體晶片11按第一齒距P1間距排列在引線框架10上的先行工作臺連接，以將由相應先行工作臺供應的引線框架10通過另外配置的軌道或另外的選擇臂而投入至本發明的半導體封裝的多重夾片黏合裝置。在該過程中，在半導體晶片11和引線框架10的簧片12上按完成塗覆的導電膠13的狀態由先行工作臺向引線框架承載部110供應或在本發明的半導體封裝的多重夾片黏合裝置內設置另外的黏合劑塗覆裝置(未圖示)，而在夾片貼合之前塗覆導電膠13。Specifically, the lead frame carrying portion 110 of an embodiment of the present invention is connected to an advance stage for arranging the semiconductor chips 11 on the lead frame 10 at a first pitch P1 pitch, so as to transfer the leads supplied by the corresponding advance stage The frame 10 is put into the multi-clip bonding device of the semiconductor package of the present invention through a separately arranged rail or another selection arm. In this process, the conductive glue 13 is applied on the semiconductor chip 11 and the reed 12 of the lead frame 10 from the pre-work table to the lead frame carrier 110 or in the multiple clips of the semiconductor package of the present invention. Another adhesive coating device (not shown) is provided in the bonding device, and the conductive glue 13 is coated before the clip is attached.

而且，對於本發明的一實施例的引線框架卸載部180，為了焊接或黏合劑固化等後續工藝，完成夾片貼合的引線框架10被裝載至卸料庫181，或通過另外設置的軌道(未圖示)或另外的選擇臂(未圖示)而移送至後續工作臺。Moreover, for the lead frame unloading portion 180 of an embodiment of the present invention, for subsequent processes such as welding or adhesive curing, the lead frame 10 that has completed the clip bonding is loaded into the unloading library 181, or through a separate rail ( Not shown) or another selection arm (not shown) and transferred to the subsequent workbench.

綜上，對本發明的優選的實施例進行了說明，但本發明並非限定於此，在申請專利範圍和發明的具體說明及附圖的範圍內進行各種變形的實施，並屬於該本發明的範圍內。In summary, the preferred embodiments of the present invention have been described, but the present invention is not limited thereto. Various modifications are implemented within the scope of the patent application, the specific description of the invention and the scope of the drawings, and belong to the scope of the present invention. Inside.

本發明具有以下效果：將引線框架的排列誤差最小化，而提高引線框架和夾片的貼合準確率；以及在貼合工藝之前(prebond)檢查供應引線框架時的引線框架上有無半導體晶片、有無導電膠、導電膠體積及二維碼中的至少一個，在貼合工藝之後(postbond)檢查夾片的貼合狀態及貼合誤差，並比對基準值以識別誤差允許範圍，確認夾片的貼合狀態或去除狀態的差錯，依次檢查夾片貼合工藝，以使半導體封裝的不合格率最小化，從而提高產品產出率。The present invention has the following effects: minimizing the arrangement error of the lead frame, and improving the bonding accuracy of the lead frame and the clip; and checking whether there is a semiconductor chip on the lead frame when the lead frame is supplied before the bonding process (prebond), Whether there is at least one of conductive glue, conductive glue volume, and QR code, check the bonding state and bonding error of the clip after the bonding process (postbond), and compare the reference value to identify the allowable error range, and confirm the clip If the bonding state or removal state is wrong, check the clip bonding process in turn to minimize the failure rate of the semiconductor package, thereby increasing the product yield rate.

再者，本發明還具有以下效果：通過由多孔陶瓷構成的真空吸附板，可均勻地真空吸附各種尺寸或各種形狀的引線框架。可僅通過一個真空吸附板來吸附各種尺寸或各種形狀的引線框架。由多孔陶瓷構成的真空吸附板可減少產生自身粉塵及微粒、防止發生引線框架的刮痕、釋放並去除放靜電，以及提供高真空及高強度的吸附力。Furthermore, the present invention has the following effect: the vacuum suction plate made of porous ceramics can uniformly vacuum suction lead frames of various sizes or shapes. Lead frames of various sizes or shapes can be absorbed by only one vacuum suction plate. The vacuum suction plate made of porous ceramics can reduce the generation of dust and particles, prevent scratches on the lead frame, release and remove static electricity, and provide high vacuum and high-strength adsorption.

10:引線框架 11:半導體晶片 12:簧片 13:導電膠 14:導電膠 20:夾片方陣 21:夾片 22:連接部 23:夾片框架 110:引線框架承載部 111:裝料庫 112:電機 113:輸送帶 114:裝料拾取器 115:推送器 115a:T杆 115b:齒條 115c:電機 120:夾片承載部 121:夾片捲盤 122:襯底捲盤 123:供應滾軸 124:電機 125:調節手柄 130:夾片剪裁部 131:剪裁帶 131a:剪裁孔 132:打孔器 133:加壓板 134:剪裁氣缸 135:導板 135a:沖孔 136:第一廢料盒 140:夾片裝載部 141:夾片安裝器 142:裝載氣缸 143:導軌 144:驅動單元 150:引線框架排列部 151:真空吸附平臺 152:前段滑軌 153:後段滑軌 154:導軌 155:前端抓取軌道單元 156:後端抓取軌道單元 157,158:限位感測器 160:第一檢查部 161:XYR軸平臺 162:監控器 170:夾片貼合部 171:貼合焊嘴 172:可變塊 172a:凸輪從動件 173:真空管件 174:直線導軌 175:固定板 175a:狹槽 176:可變凸輪板 176a:凸輪插槽 177:線形發動機 180:引線框架卸載部 181:卸料庫 191:第二檢查部 192:第三檢查部 193:第四檢查部 194:第二廢料盒 P1:第一齒距 P2:第二齒距10: Lead frame 11: Semiconductor wafer 12: Reed 13: conductive adhesive 14: Conductive glue 20: Clipping phalanx 21: Clip 22: Connection part 23: Clip frame 110: Lead frame bearing part 111: loading warehouse 112: Motor 113: Conveyor belt 114: Loading Picker 115: Pusher 115a: T bar 115b: rack 115c: Motor 120: Clip carrying part 121: Clip Reel 122: Substrate reel 123: supply roller 124: Motor 125: Adjusting handle 130: Clip Cutting Department 131: Cut tape 131a: Cut hole 132: Hole Punch 133: pressure plate 134: Tailoring cylinder 135: guide plate 135a: Punching 136: First Waste Box 140: Clip loading section 141: Clip Installer 142: Load cylinder 143: Rail 144: drive unit 150: Lead frame arrangement part 151: Vacuum adsorption platform 152: front slide 153: rear slide 154: Rail 155: Front end grab track unit 156: Rear-end grab rail unit 157,158: limit sensor 160: First Inspection Department 161: XYR axis platform 162: Monitor 170: Clip fitting part 171: Fit welding tip 172: Variable block 172a: Cam follower 173: Vacuum fittings 174: Linear guide 175: fixed plate 175a: Slot 176: Variable cam plate 176a: Cam slot 177: Linear engine 180: Lead frame unloading part 181: Unloading warehouse 191: Second Inspection Department 192: Third Inspection Department 193: Fourth Inspection Department 194: second waste box P1: first pitch P2: second tooth pitch

[圖1A]及[圖1B]為本發明的實施例的半導體封裝的多重夾片黏合裝置從不同視角觀看的立體圖； [圖2A]為圖1的半導體封裝的多重夾片黏合裝置的平面圖； [圖2B]為圖1的半導體封裝的多重夾片黏合裝置的側面圖； [圖3]為圖1的半導體封裝的多重夾片黏合裝置從另一視角觀看的側面圖；[圖4]為圖1的半導體封裝的多重夾片黏合裝置中的夾片方陣的局部放大示意圖； [圖5]為顯示將圖1的半導體封裝的多重夾片黏合裝置中的夾片剪裁部分離出來的示意圖； [圖6A]為圖1的半導體封裝的多重夾片黏合裝置中的主要結構的示意圖； [圖6B]為圖1的半導體封裝的多重夾片黏合裝置中的部分結構的示意圖； [圖7]為圖6的夾片貼合部及引線框架排列部的示意圖； [圖8]為圖1的半導體封裝的多重夾片黏合裝置中的引線框架承載部的局部放大示意圖； [圖9]為圖1的半導體封裝的多重夾片黏合裝置中的夾片貼合部的分解圖； [圖10A]及[圖10B]為例示圖9的夾片貼合部的齒距調節的示意圖； [圖11]為例示通過圖1的半導體封裝的多重夾片黏合裝置而貼合形成的半導體封裝截面結構的示意圖。[FIG. 1A] and [FIG. 1B] are three-dimensional views of the multi-clip bonding device of the semiconductor package according to the embodiment of the present invention viewed from different viewing angles; [FIG. 2A] is a plan view of the multiple clip bonding device of the semiconductor package of FIG. 1; [FIG. 2B] is a side view of the multiple clip bonding device of the semiconductor package of FIG. 1; [FIG. 3] is a side view of the multiple clip bonding device of the semiconductor package of FIG. 1 viewed from another perspective; [FIG. 4] is a partial enlarged schematic view of the clip square in the multiple clip bonding device of the semiconductor package of FIG. ； [FIG. 5] is a schematic diagram showing the separation of the clip cutting part in the multiple clip bonding device of the semiconductor package of FIG. 1; [FIG. 6A] is a schematic diagram of the main structure in the multiple clip bonding device of the semiconductor package of FIG. 1; [FIG. 6B] is a schematic diagram of a part of the structure in the multi-clip bonding device of the semiconductor package of FIG. 1; [Fig. 7] is a schematic diagram of the clip bonding part and the lead frame arrangement part of Fig. 6; [FIG. 8] is a partial enlarged schematic view of the lead frame carrying portion in the multiple clip bonding device of the semiconductor package of FIG. 1; [FIG. 9] is an exploded view of the clip bonding part in the multiple clip bonding device of the semiconductor package of FIG. 1; [FIG. 10A] and [FIG. 10B] are schematic diagrams illustrating the adjustment of the tooth pitch of the clip fitting part of FIG. 9; [FIG. 11] is a schematic diagram illustrating a cross-sectional structure of a semiconductor package formed by bonding through the multiple clip bonding device of the semiconductor package of FIG. 1.

110:引線框架承載部110: Lead frame bearing part

111:裝料庫111: loading warehouse

112:電機112: Motor

113:輸送帶113: Conveyor belt

115:推送器115: Pusher

120:夾片承載部120: Clip carrying part

121:夾片捲盤121: Clip Reel

122:襯底捲盤122: Substrate reel

125:調節手柄125: Adjusting handle

160:第一檢查部160: First Inspection Department

161:XYR軸平臺161: XYR axis platform

170:夾片貼合部170: Clip fitting part

180:引線框架卸載部180: Lead frame unloading part

181:卸料庫181: Unloading warehouse

Claims (18)

一種半導體封裝的多重夾片黏合裝置，其包括： 引線框架承載部，用以供應供半導體晶片按第一齒距間距排列的引線框架； 夾片承載部，用以供應供電連接所述半導體晶片和所述引線框架的簧片的夾片按第二齒距間距排列的夾片方陣； 夾片剪裁部，用以將所述夾片方陣逐個按夾片剪裁； 夾片裝載部，用以裝載所剪裁的按第二齒距間距排列的所述夾片； 引線框架排列部，用以將所述引線框架排列至夾片貼合位置； 第一檢查部，用以檢查所述引線框架的夾片貼合位置的排列狀態或排列誤差； 夾片貼合部，其中由所述夾片裝載部選擇所述夾片並再次按第一齒距間距排列，並移送至所述引線框架排列部的夾片貼合位置且按第一齒距間距排列至所述半導體晶片的所述引線框架上部，並與相應引線框架上部貼合； 引線框架卸載部，用以排出完成夾片貼合的引線框架；及 控制部，用以控制所述引線框架的供應、排列、檢查和排出，及所述夾片的供應、剪裁及貼合。A multi-clip bonding device for semiconductor packaging, which includes: The lead frame carrying part is used to supply the lead frame for semiconductor chips arranged at the first pitch pitch; A clip carrying portion for supplying power to connect the semiconductor chip and the clip of the lead frame with a square array of clips arranged at a second pitch; The clip cutting part is used to cut the clip squares one by one according to the clip; The clip loading part is used to load the clip that is cut and arranged according to the second pitch pitch; A lead frame arrangement part for arranging the lead frame to a position where the clip is attached; The first inspection part is used to inspect the arrangement state or arrangement error of the bonding position of the clip of the lead frame; Clip bonding part, wherein the clips are selected by the clip loading part and arranged again at a first pitch pitch, and then transferred to the clip bonding position of the lead frame arrangement part according to the first pitch Arranged at intervals to the upper part of the lead frame of the semiconductor chip and attached to the upper part of the corresponding lead frame; The lead frame unloading part is used to discharge the lead frame after the clip is attached; and The control part is used to control the supply, arrangement, inspection and discharge of the lead frame, and the supply, cutting and bonding of the clip. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述控制部確認通過所述第一檢查部所檢查出的排列誤差，以糾正通過所述夾片貼合部而形成的夾片的貼合位置。The multiple clip bonding device for semiconductor packages according to claim 1, wherein the control section confirms the alignment error detected by the first inspection section to correct the clip formed by the clip bonding section Fitting position. 如請求項2之半導體封裝的多重夾片黏合裝置，其中所述第一檢查部與在所述引線框架排列部上部分隔形成的XYR軸平臺結合形成，且通過在夾片貼合位置上部往復並拍攝所述引線框架的左右邊緣來檢查所述引線框架的排列狀態。The multi-clip bonding device for a semiconductor package according to claim 2, wherein the first inspection part is formed in combination with an XYR axis stage formed separately on the upper part of the lead frame arrangement part, and is formed by reciprocating and reciprocating at the upper part of the clip bonding position The left and right edges of the lead frame are photographed to check the arrangement state of the lead frame. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述第一檢查部為飛行視覺攝像機或步進視覺攝像機。The multi-clip bonding device for semiconductor packaging according to claim 1, wherein the first inspection part is a flight vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述引線框架排列部包括： 平臺，設有所述夾片貼合位置； 前段滑軌，用以從所述引線框架承載部向所述平臺移送所述引線框架； 後段滑軌，用以從所述平臺向所述引線框架卸載部移送所述引線框架； 前端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述前段滑軌的一側的軌道移送所述引線框架； 後端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述後段滑軌的一側的軌道移送所述引線框架； 限位感測器，用以檢測來自所述引線框架的所述引線框架承載部的供應；及 限位感測器，用以檢測來自所述引線框架的所述引線框架卸載部的排出。The multi-clip bonding device for a semiconductor package according to claim 1, wherein the lead frame arrangement portion includes: A platform, provided with a position where the clip is attached; The front slide rail is used to transfer the lead frame from the lead frame carrying portion to the platform; A rear slide rail for transferring the lead frame from the platform to the lead frame unloading part; The front end grabbing rail unit is used to press one side of the lead frame to transfer the lead frame along a rail formed on one side of the front section of the slide rail; The rear end grabbing rail unit is used to press a side surface of the lead frame to transfer the lead frame along a rail formed on one side of the rear section of the slide rail; A limit sensor for detecting the supply from the lead frame carrying portion of the lead frame; and The limit sensor is used to detect the discharge from the lead frame unloading part of the lead frame. 如請求項5之半導體封裝的多重夾片黏合裝置，其中所述平臺是指真空吸附所述引線框架而形成夾片貼合位置的真空吸附平臺，並包括： 真空吸附板，由供安裝所述引線框架的多孔陶瓷構成； 負壓供應單元，形成於所述真空吸附板下端而向所述真空吸附板供應負壓。According to claim 5, the multi-clip bonding device for semiconductor packaging, wherein the platform refers to a vacuum suction platform that vacuum suctions the lead frame to form a clip bonding position, and includes: The vacuum adsorption board is made of porous ceramics for mounting the lead frame; The negative pressure supply unit is formed at the lower end of the vacuum suction plate and supplies negative pressure to the vacuum suction plate. 如請求項5之半導體封裝的多重夾片黏合裝置，其還包括： 第二檢查部，分隔形成於所述前段滑軌的前側部上端，用以檢查向所述平臺移送的所述引線框架有無半導體晶片、有無導電膠、導電膠體積及二維碼中的任一個以上。For example, the multi-clip bonding device for semiconductor packaging of claim 5, which further includes: The second inspection part is formed separately on the upper end of the front side of the front slide rail, and is used to inspect the lead frame transferred to the platform for any of semiconductor chips, conductive glue, conductive glue volume, and two-dimensional code the above. 如請求項5之半導體封裝的多重夾片黏合裝置，其還包括： 第三檢查部，分隔形成於所述後段滑軌的前側部上端，用以檢查由所述平臺移送的所述夾片的貼合狀態或貼合誤差。For example, the multi-clip bonding device for semiconductor packaging of claim 5, which further includes: The third inspection part is formed separately at the upper end of the front side of the rear section of the slide rail, and is used to inspect the fitting state or fitting error of the clip transferred by the platform. 如請求項7之半導體封裝的多重夾片黏合裝置，其中所述第二檢查部為飛行視覺攝像機或步進視覺攝像機。According to claim 7, the semiconductor packaged multiple clip bonding device, wherein the second inspection part is a flight vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括： 第四檢查部，分隔形成於所述夾片貼合部的下端，用以檢查通過所述夾片貼合部而產生的所述引線框架排列部的所述夾片的貼合狀態，或檢查在所述引線框架與所述夾片貼合之後所述夾片貼合部的所述夾片的去除狀態。For example, the multi-clip bonding device for semiconductor packaging of claim 1, which further includes: The fourth inspection part is formed separately at the lower end of the clip bonding part, and is used to check the bonding state of the clips of the lead frame arrangement part generated by the clip bonding part, or to check A removed state of the clip of the clip bonding portion after the lead frame is bonded to the clip. 如請求項10之的半導體封裝的多重夾片黏合裝置，其中所述控制部用以確認通過所述第四檢查部所檢查出的所述夾片的貼合狀態或去除狀態的差錯，並且在確認差錯時將所述夾片移送至廢料盒而去除。The multi-clip bonding device for a semiconductor package according to claim 10, wherein the control section is used to confirm the error in the bonding state or the removal state of the clip detected by the fourth inspection section, and When the error is confirmed, the clip is transferred to the waste box and removed. 如請求項10之半導體封裝的多重夾片黏合裝置，其中所述第四檢查部為飛行視覺攝像機或步進視覺攝像機。According to claim 10, the semiconductor packaged multiple clip bonding device, wherein the fourth inspection part is a flight vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述夾片剪裁部為將所述夾片方陣逐個按夾片而向下剪裁。The multi-clip bonding device for a semiconductor package according to claim 1, wherein the clip cutting part is to press the clip squares one by one to cut downwards. 如請求項1之半導體封裝的多重夾片黏合裝置，其中通過所述夾片剪裁部而剪裁的所述各個夾片的切削毛刺向下形成。The multiple clip bonding device for a semiconductor package according to claim 1, wherein the cutting burrs of each clip cut by the clip cutting portion are formed downward. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括： 黏合劑塗覆裝置，設置在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前塗覆導電膠。For example, the multi-clip bonding device for semiconductor packaging of claim 1, which further includes: The adhesive coating device is arranged on the upper part of the lead frame for arranging the semiconductor chips, and is used for coating conductive glue before attaching the clips. 如請求項8之半導體封裝的多重夾片黏合裝置，其中所述第三檢查部為飛行視覺攝像機或步進視覺攝像機。The multi-clip bonding device for semiconductor packaging according to claim 8, wherein the third inspection part is a flight vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括： 黏合劑塗覆裝置，設置在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前，在所述半導體晶片和所述引線框架的簧片上塗覆導電膠。For example, the multi-clip bonding device for semiconductor packaging of claim 1, which further includes: The adhesive coating device is arranged on the upper part of the lead frame for arranging the semiconductor chip, and is used to coat the semiconductor chip and the reed of the lead frame with conductive glue before the clip is attached. 一種半導體封裝，其是通過如請求項1之半導體封裝的多重夾片黏合裝置而製成。A semiconductor package, which is manufactured by a multiple-clip bonding device of the semiconductor package as in claim 1.
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