CN112838024B - Semiconductor package multiple clip bonding apparatus and semiconductor package manufactured by the same - Google Patents

Semiconductor package multiple clip bonding apparatus and semiconductor package manufactured by the same Download PDF

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Publication number
CN112838024B
CN112838024B CN202010878222.9A CN202010878222A CN112838024B CN 112838024 B CN112838024 B CN 112838024B CN 202010878222 A CN202010878222 A CN 202010878222A CN 112838024 B CN112838024 B CN 112838024B
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CN
China
Prior art keywords
clip
lead frame
semiconductor package
bonding apparatus
unit
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Active
Application number
CN202010878222.9A
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Chinese (zh)
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CN112838024A (en
Inventor
崔伦华
朴廷敏
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Jmj Korea Co ltd
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Jmj Korea Co ltd
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Publication of CN112838024A publication Critical patent/CN112838024A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Abstract

The invention provides a multiple clamping piece bonding device of a semiconductor package, comprising: a lead frame carrier 110 for supplying lead frames 10 in which the semiconductor chips 11 are arranged at a first pitch; a clip carrying part 120 for supplying a clip matrix 20 in which clips 21 are arranged at a second pitch P; a clip clipping unit 130 clipping the clip square matrix 20 to the clips 21 one by one; a clip loading part 140 for loading the clip 21; a lead frame arrangement unit 150 for arranging the lead frames 10 to the clip attaching position a; a first inspection unit 160 for inspecting the arrangement state or arrangement error of the clip attaching position a of the lead frame 10; a clip attaching part 170 which selects the clips 21 to be arranged again at the first pitch distance and attaches to the upper part of the lead frame 10; a lead frame unloading part 180 for discharging the lead frame 10 with the clip attached; a control unit (not shown) for controlling the supply, arrangement, inspection, and discharge of the lead frames 10, and the supply, cutting, and bonding of the clips 21.

Description

Semiconductor package multiple clip bonding apparatus and semiconductor package manufactured by the same
Technical Field
The invention relates to a multiple clamping piece bonding device of a semiconductor package and the semiconductor package manufactured by the same device, which can minimize the arrangement error of a lead frame, improve the bonding accuracy of the lead frame and clamping pieces, and sequentially check the clamping piece bonding process, thereby minimizing the disqualification rate of the semiconductor package.
Background
In general, when a high-voltage high-current semiconductor package that realizes a power semiconductor element is used in place of a bonding wire by using a conductive clip, the clip is attached to a semiconductor chip after being aligned to the semiconductor chip in order to attach the clip to the semiconductor chip.
In addition, the plurality of clips are arranged to the plurality of semiconductor chips, respectively, and the pitch of the clips and the pitch of the semiconductor chips need to be kept uniform for bonding.
For example, in terms of efficiency, the pitch of the clips arranged in the clip matrix is smaller than the pitch of the semiconductor chips bonded to the lead frame, and after the clips are cut, the pitch of the clips is adjusted again to be arranged on the lead frame, whereby the clips are bonded.
In order to perform the clip attaching process as described above, the lead frame to which the semiconductor chip is attached needs to be stably fixed in a clip attaching fixing position, and aligned within an allowable error range to minimize the product reject ratio.
Also, a multi-clip bonding apparatus technique is provided that not only checks the arrangement of the lead frames, but also checks the errors or disqualification of the lead frames, eliminates the possibility of errors occurring before and after selecting clips, and checks the bonding state of the lead frames and the clips to correct errors or errors, thereby improving the product yield and solving the electrical problems caused by burrs of the clips.
Prior art literature
[ patent literature ]
(patent document 1) korean registered patent publication No. 1949334 (clip bonding apparatus of semiconductor package and clip selection, 2019.02.18)
(patent document 2) korean registered patent publication No. 1544086 (clip attaching method of semiconductor package, multiple clip attaching apparatus therefor, 2015.08.12)
(patent document 3) korean registered patent publication No. 1612730 (clip attaching method of semiconductor package and multiple clip attaching apparatus therefor 2016.04.26)
Summary of the invention
Technical problem to be solved by the invention
The technical problem to be solved by the invention is to provide a multiple clamping piece bonding device of a semiconductor package and the semiconductor package manufactured by the same device, which can minimize the arrangement error of a lead frame, improve the bonding accuracy of the lead frame and clamping pieces, and sequentially check the clamping piece bonding process, thereby minimizing the disqualification rate of the semiconductor package.
Technical scheme for solving problems
In order to achieve the above object, the present invention provides a multiple clip bonding apparatus of a semiconductor package, comprising: a lead frame carrying part for supplying a lead frame for arranging the semiconductor chips according to the first pitch; a clip carrying part for supplying power to a clip matrix in which clips of the reed connecting the semiconductor chip and the lead frame are arranged at a second pitch; the clamping piece cutting part is used for cutting the clamping piece square matrix one by one according to the clamping pieces; a clip loading part loading the clips of the cut second pitch spacing; a lead frame arrangement unit for arranging the lead frames to a clip attaching position; a first inspection unit configured to inspect an arrangement state or an arrangement error of a clip attaching position of the lead frame; a clip attaching part, which selects the clips from the clip loading part to be arranged again according to a first pitch, transfers the clips to the clip attaching position of the lead frame arranging part, arranges the upper parts of the lead frames of the semiconductor chips according to the first pitch, and attaches the upper parts of the corresponding lead frames; a lead frame unloading part for discharging the lead frame bonded by the clamping piece; and a control part for controlling the supply, arrangement, inspection and discharge of the lead frames, and the supply, cutting and attaching of the clamping pieces.
Here, the control unit checks the alignment error checked by the first checking unit, and corrects the bonding position of the clip formed by the clip bonding unit.
At this time, the first inspection part is formed by being combined with an XYR axis platform formed at a distance from the upper part of the lead frame arrangement part, and the arrangement state of the lead frames is inspected by reciprocating the upper part of the clip attaching position and photographing the left and right edges of the lead frames.
The first inspection unit is a flight visual camera or a step visual camera.
Further, the lead frame arrangement portion includes: a platform forming the clamping piece attaching position; a front-stage slide rail for transferring the lead frame from the lead frame carrying part to the platform; a rear slide rail for transferring the lead frame from the platform to the lead frame unloading part; a front-end gripping rail unit for pressurizing one side surface of the lead frame and transferring the lead frame along a rail formed on one side of the front-stage slide rail; a rear-end grasping rail unit that pressurizes one side surface of the lead frame and transfers the lead frame along a rail formed on one side of the rear-end slide rail; a limit sensor detecting a supply of the lead frame carrier from the lead frame; and a limit sensor for detecting discharge of the lead frame unloading part from the lead frame.
Here, the stage is a vacuum suction stage for vacuum sucking the lead frame to form a clip attaching position, and includes: a vacuum adsorption plate composed of porous ceramics for mounting the lead frame; and a negative pressure supply unit formed at a lower end of the vacuum adsorption plate to supply negative pressure to the vacuum adsorption plate.
And, still include: and a second inspection unit which is formed at the upper end of the front side of the front slide rail in a separated manner and inspects whether the semiconductor chip of the lead frame transferred to the platform is present or not, whether the conductive adhesive is present or not, the volume of the conductive adhesive and the two-dimensional code.
Moreover, the method further comprises the steps of: and a third inspection part which is formed at the upper end of the front side part of the rear section sliding rail in a separated manner and inspects the attaching state or attaching error of the clamping piece transferred by the platform.
Here, the second inspection unit is a flight visual camera or a step visual camera.
And, still include: and a fourth inspection unit which is formed at the lower end of the clip attaching unit in a spaced manner and inspects the attaching state of the clips of the lead frame arrangement unit or the removing state of the clips of the clip attaching unit after the attachment of the lead frame to the clips, which is generated by the clip attaching unit.
Here, the control unit checks an error in the attached state or removed state of the clip checked by the fourth checking unit, and when the error is checked, transfers the clip to a scrap box to remove the clip.
The fourth inspection unit is a flight visual camera or a step visual camera.
And the clip clipping part clips the clip square matrix downward one by one according to clips.
And, the clip-by-clip cutting burr (burr) cut by the clip cutting portion is formed upward.
And, still include: and an adhesive coating device for coating conductive adhesive on the upper part of the lead frame for arranging the semiconductor chips before attaching the clamping pieces.
Moreover, the method further comprises the steps of: and an adhesive coating device for coating conductive adhesive on the semiconductor chip and the reed of the lead frame before attaching the clamping piece on the upper part of the lead frame for arranging the semiconductor chip.
The present invention provides a semiconductor package manufactured by the multiple clip bonding apparatus of a semiconductor package described above.
ADVANTAGEOUS EFFECTS OF INVENTION
The invention has the following effects of minimizing the arrangement error of the lead frame, improving the bonding accuracy of the lead frame and the clamping pieces, checking whether the semiconductor chip on the lead frame is provided with the lead frame or not, whether the conductive adhesive is provided with at least one of the volume of the conductive adhesive and the two-dimensional code before the bonding process (prebond), checking the bonding state and the bonding error of the clamping pieces after the bonding process (postbond), comparing the reference value, identifying the allowable range of the error, confirming the bonding state or the error of the removing state of the clamping pieces, and sequentially checking the bonding process of the clamping pieces to minimize the disqualification rate of the semiconductor package, thereby improving the product yield.
Further, even if various sizes or various shapes of lead frames are adsorbed by only one vacuum adsorption plate, there is an effect that the generation of dust and particles of the lead frames is reduced, scratches of the lead frames are prevented, static electricity is discharged and removed, and high vacuum and high strength adsorption force is provided.
Drawings
FIG. 1 is a perspective view of a multiple clip bonding apparatus of a semiconductor package showing an embodiment of the present invention;
FIGS. 2 and 3 are plan and side views, respectively, of the multiple clip bonding apparatus of the semiconductor package of FIG. 1;
FIG. 4 is a drawing showing a clip matrix of the multiple clip bonding apparatus of the semiconductor package of FIG. 1 separated;
FIG. 5 is a drawing showing the clip cut out of the multiple clip bonding apparatus of the semiconductor package of FIG. 1 in isolation;
FIG. 6 is a drawing showing the main structure of a multiple clip bonding apparatus of the semiconductor package of FIG. 1 in a separated manner;
fig. 7 is an enlarged view showing a clip attaching portion and a lead frame arranging portion of fig. 6;
FIG. 8 is a drawing showing the lead frame carrier of the multiple clip bonding device of the semiconductor package of FIG. 1 separated;
FIG. 9 is an exploded view showing the clip applying portion of the multiple clip bonding apparatus of the semiconductor package of FIG. 1;
FIG. 10 is a drawing illustrating pitch adjustment of the clip applying portion of FIG. 9;
fig. 11 is a drawing illustrating a semiconductor package cross-sectional structure formed by bonding multiple clip bonding devices of the semiconductor package of fig. 1.
Description of the reference numerals
110 lead frame carrier 111, loading magazine
112 motor 113 conveyer belt
114 charge pick-up 115 pusher
120 clip carrying part 121 clip reel
122 substrate reel 123 supply roller
124 motor 125 adjusting handle
130 clip clipping portion 131 clip tape
132 punch 133 pressurizing plate
134 cutting cylinder 135 guide plate
136 first scrap box 140 clip loading portion
141 clip installer 142 loading cylinder
143 guide rail 144 drive unit
150 lead frame arrangement portion 151 vacuum suction stage
152 front section slide rail 153 and rear section slide rail
154 guide rail 155 front end gripping rail unit
156 rear end grabbing rail units 157, 158 limit sensors
160 first inspection portion 161 XYR axis platform
162:CCTV 170:clip attaching part
171 bonding tip 172, variable block
173 vacuum pipe 174 linear guide rail
175 fixed plate 176 variable cam plate
177 wire form engine 180 lead frame unloading section
181, discharging warehouse 191, second inspection part
192 third inspection part 193 fourth inspection part
194 second scrap box 10 leadframe
11 semiconductor chip 12 reed
13 conductive adhesive 14 conductive adhesive
20 is a clamping piece square matrix 21 is a clamping piece
22 connecting pile 23 clamping piece frame
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings so as to enable those skilled in the art to which the present invention pertains to easily implement the present invention. The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
A multiple clip bonding apparatus of a semiconductor package according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 11.
The multiple clip bonding apparatus of the semiconductor package of the embodiment of the present invention specifically includes: a lead frame carrier 110 for supplying lead frames 10 in which the semiconductor chips 11 are arranged at a first pitch; a clip carrying part 120 for supplying a clip matrix 20 in which clips 21 are arranged at a second pitch P; a clip clipping unit 130 clipping the clip square matrix 20 to the clips 21 one by one; a clip loading part 140 for loading the clip 21; a lead frame arrangement unit 150 for arranging the lead frames 10 to the clip attaching position a; a first inspection unit 160 for inspecting the arrangement state or arrangement error of the clip attaching position a of the lead frame 10; a clip attaching part 170 which selects the clips 21 to be arranged again at the first pitch distance and attaches to the upper part of the lead frame 10; a lead frame unloading part 180 for discharging the lead frame 10 with the clip attached; a control unit (not shown) controls the supply, arrangement, inspection, and discharge of the lead frames 10, and the supply, cutting, and attachment of the clips 21, and also checks the arrangement state or arrangement error of the lead frames 10.
First, as shown in fig. 1 and 8, the lead frame carrier 110 introduces the lead frames 10 arranged at a first pitch of the semiconductor chips 11 (see fig. 11) into the loading magazine 111, loads the plurality of the lead frames, transfers the loading magazine 111 to the loading pick-up (114) by the conveyor 113 driven by the motor 112, arranges the lead frames to the front stage slide rail 152, and then supplies the lead frames 10 to the lead frame arrangement unit 150 by the forward sliding of the pusher 115.
Here, the pusher 115 includes: a T bar 115a pushing one end of the lead frame 10 loaded to the loading magazine 111; a rack gear 115b formed in combination with the rear end of the T-bar 115 a; a pinion (not shown) engaged with the rack gear 115 b; the motor 115c rotates and drives the pinion, and slides the T-bar 115a back and forth.
The embodiment of the present invention discloses that the lead frame carrier 110 is used to introduce the lead frames 10 in which the semiconductor chips 11 are arranged at the first pitch to the loading library 111 and load and supply the lead frames 10, but the present invention is not limited thereto, and various modifications of supplying the lead frames 10 in which the semiconductor chips 11 are arranged at the first pitch can be made.
For example, in the case where the semiconductor chips 11 are arranged at the first pitch to the preceding stage on the lead frame 10 in the preceding stage associated with the multi-clip bonding apparatus for semiconductor packages of the embodiment of the present invention, the lead frame carrier 110 functions to carry the lead frame 10 transferred by the preceding stage to the multi-clip bonding apparatus for semiconductor packages of the embodiment of the present invention.
For reference, a MOSFET semiconductor or an IGBT semiconductor is applied as the semiconductor chip 11, but not limited thereto, and is composed of a power semiconductor of a Silicon Controlled Rectifier (SCR), a power transistor, a power rectifier, a power regulator, or a combination thereof.
Next, the clip carrying part 120 winds the clip square matrix 20, in which the clips 21 of the reed 12 electrically connecting the semiconductor chip 11 and the lead frame 10 through the conductive adhesive 13 are arranged at the second pitch P, into a roll shape and supplies to the clip cutting part 130.
Here, as shown in fig. 4, the clip matrix 20 includes: the clips 21 arranged in a matrix form with a minimum pitch spacing that can be cut; a connection stack 22 interconnecting the clips 21; the clip frames 23 connect both ends of the connection stack 22 in the length direction.
Specifically, as shown in fig. 1 to 3, the clip carrying portion 120 includes: a clip reel 121 around which the clip matrix 20 is wound; a substrate reel 122 that removes the substrate from the clip matrix 20; a supply roller 123 for transferring the clip square matrix 20 to the clip clipping part 130; a motor 124 that rotationally drives the supply roller 123; the handle 125 is adjusted to adjust the transfer width of the clip matrix 20.
The clip carrying unit 120 according to the embodiment of the present invention is disclosed as a reel type constituted by the clip reels 121 wound around the clip matrix 20, but the present invention is not limited to this, and the clip matrix 20 may be supplied in a strip shape, and various modifications are possible.
Before the semiconductor chip 11 and the spring piece 12 of the lead frame 10 are attached to the clip 21, an adhesive coating device (not shown) for coating the conductive adhesive 13 is added. As the conductive paste 13, a solder series containing tin or lead components, a sintering (sintering) material containing silver or copper components, and a eutectic (eutec) reaction material to which gold components are added are used.
Next, the clip clipping section 130 separates the clip matrix 20 one by the clip 21 by clipping the connection stack 22.
Specifically, as shown in fig. 5 and 6A, the clip clipping portion 130 includes: the cutting belt 131 guides the clip square matrix 20, and the cutting holes 131a of the positioning clip 21 are arranged and formed according to the second pitch P; a punch 132 formed at the upper end of the trimming belt 131 to lower the trimming hole 131a so as to penetrate the trimming hole in the lower direction, thereby trimming the clip matrix 20; a pressing plate 133 for being combined to form the punch 132; a cutting cylinder 134 for driving the pressing plate 133 up and down; a guide plate 135 separately formed at the upper end of the cutting belt 131 for forming a punched hole 135a through which the punch 132 passes to guide the punch 132 to move up and down; the first scrap box 136 recovers the clip matrix 20 from which the clips 21 are removed.
Here, the clipping hole 131a is formed so as to penetrate in accordance with the shape of the clip 21, and the clip matrix 20 is clipped in the downward direction by the clipping hole 131a of the clipping band 131 as shown in the arrow direction (see fig. 5) by the puncher 132, so that burrs (burrs) generated at the edges of the clipping surfaces of the clip 21 that are separated by clipping are formed upward, and the possibility of occurrence of electrical problems caused by abnormal contact with the semiconductor chip 11 due to the burrs is completely eliminated when the semiconductor chip 11 and the clip 21 are attached.
Next, the clip loading part 140 includes: the clip mounting device 141 loads the clip 21 of the cut second pitch P and slides to a selected position with the lead frame arrangement portion 150, and as shown in fig. 6 and 7, lifts the clip 21 introduced into the cutting hole 131a of the cutting tape 131 to mount the cut clip 21; a loading cylinder 142 for lifting and driving the clip installer 141; a guide rail 143 guiding the back and forth sliding in the arrow direction in such a manner that the clip 21 mounted to the clip mounter 141 is moved to a selected position; the driving unit 144 is driven back and forth along the guide rail 143, and the driving unit 144 is composed of a wheel that rotates in close contact with the guide rail 143 and a motor that rotationally drives the wheel.
Next, the lead frame arrangement portion 150 vacuum-suctions the lead frame 10 and arranges the lead frame to the clip attaching position a (see fig. 2 (b)). .
Specifically, as shown in fig. 2, 6 and 8, the lead frame arrangement portion 150 includes: a vacuum suction stage 151 forming a clip attaching position a of the vacuum suction lead frame 10; a front slide rail 152 for transferring the lead frame 10 from the lead frame carrier 110 to the vacuum suction stage 151; a rear slide rail 153 for transferring the lead frame 10 from the vacuum suction stage 151 to the lead frame unloading unit 180; a front end grasping rail unit 155 for pressurizing one side surface of the lead frame 10 and transferring the lead frame 10 along a guide rail 154 formed on one side of the front stage rail 152; a rear end grasping rail unit 156 for pressurizing one side surface of the lead frame 10 and transferring the lead frame 10 along a guide rail 154 formed on one side of the rear-stage slide rail 153; a limit sensor 157 that detects supply from the lead frame bearing 110 of the lead frame 10; the limit sensor 158 detects discharge through the lead frame unloading portion 180 of the lead frame 10.
Here, the vacuum suction stage 151 is composed of a vacuum suction plate made of porous ceramics to which the lead frame 10 is attached, and a negative pressure supply unit formed at the lower end of the vacuum suction plate to supply negative pressure to the vacuum suction plate, and stably fixes the lead frame 10 when the lead frame is attached to the clip 21.
In addition, the vacuum adsorption plate is formed by sintering at 1300 ℃ in about 10 days in a furnace, maintains uniform air hole distribution and air hole size of 2-3 μm, uniformly adsorbs lead frames with various sizes or various shapes, can adsorb lead frames with various sizes or various shapes even through only one vacuum adsorption plate, has no dust and particles, prevents scratches of the lead frame 10, and has 10 3 ·Ωcm 2 To 10 9 ·Ωcm 2 And the electrostatic discharge of the semiconductor chip 11 and the lead frame 10 is removed, and provides a high vacuum and a high-strength adsorption force.
Next, as shown in fig. 1A and 6 (b), the first inspection unit 160 is constituted by a flight-vision camera or a step-vision camera, and inspects the alignment state or alignment error of the clip bonding position a of the lead frame 10.
For example, the first inspection unit 160 is formed by being coupled to the XYR axis table 161 formed separately on the upper portion of the lead frame arrangement unit 150, and the left and right edges of the lead frame 10 are reciprocated by the clip bonding position a, and the arrangement state of the lead frame 10 is inspected by continuous photographing (for example, 2 reciprocations and 16 photographing), and the control unit confirms the arrangement error of the lead frame 10 inspected by the first inspection unit 160, corrects the clip bonding position a of the clip bonding unit 170, and improves the bonding accuracy of the lead frame 10 and the clip 21.
Then, as shown in fig. 7 and 9, the clip attaching part 170 is formed by being combined with the XYR shaft stage 161, and the clip 21 of the second pitch P is selected by the clip mounter 141 of the clip loading part 140 and is again arranged at the first pitch, and is transferred to the upper part of the lead frame 10 in which the semiconductor chip 11 is arranged at the first pitch of the clip attaching position a of the lead frame arranging part 150, and is pressed by a certain pressure, thereby being attached to the upper part of the corresponding lead frame 10.
Specifically, the clip applying part 170 includes: attaching the welding tip 171, vacuum sucking the clip 21; a plurality of variable blocks 172 which are combined with the bonding welding tip 171 at the lower end and are separated from each other to be engaged in a manner of changing the pitch; a vacuum pipe 173 that provides negative pressure to the bonding tip 171; a linear guide 174 guiding the pitch adjustment of the variable block 172; a fixing plate 175 for fixing the linear guide 174 to form a slot 175a for guiding the left and right expansion of the cam follower 172a coupled to the variable block 172; a variable cam plate 176, which is introduced with the cam follower 172a to form a cam slot 176a formed by a predetermined shape for adjusting the pitch; a linear motor 177 for sliding the variable cam plate 176 back and forth. In this case, the cam slot 176a formed to adjust the pitch may be formed in a fan-shaped configuration to change the pitch distance by two, or may be formed in a curved (banana) configuration to change the pitch distance by three, but the present invention is not limited thereto, and may be formed in an appropriate configuration according to the number of pitches.
Thus, referring to fig. 10, by moving the variable cam plate 176 back and forth by the forward and backward sliding of the linear motor 177, the separation between the cam followers 172a expands or contracts according to the cam slots 176a, and the pitch of the bonding tips 171 is changed from the second pitch P of the clips 21 to the first pitch in a manner consistent with the first pitch of the semiconductor chips 11, and the clips 21 are arranged again at the first pitch.
In addition, as shown in fig. 6 (b), the device further includes: a monitor (CCTV) 162 is formed at the rear side of the clip applying part 170 to image the pitch adjustment state of the clip applying part 170, whereby the manager can easily recognize the pitch adjustment state.
Next, the lead frame unloading section 180 ejects the lead frame 10, on which the clip bonding is completed on the vacuum suction stage 151. The lead frame 10 thus discharged, on which the clip attachment is completed, is loaded in a discharge bin (181) for use in a subsequent process such as soldering or adhesive curing, or is carried by a rail (not shown) provided separately or is transferred to a subsequent process stage by a separate selection arm (not shown).
The following control part controls the supply, arrangement, inspection and discharge of the lead frame 10, and the supply, cutting and attaching of the clips 21, confirms the arrangement error of the lead frame 10 generated by the first inspection part 160, corrects the attaching position of the clips generated by the clip attaching part 170, and improves the attaching accuracy of the lead frame 10 and the clips 21.
The second inspection unit 191 is configured by a flying camera or a step camera, and as shown in fig. 6 (b), is configured to check whether the semiconductor chip 11, the conductive paste 13, the volume of the conductive paste 13, and/or the two-dimensional code of the lead frame 10 transferred to the vacuum suction stage 151 is present or not by being separated from the upper end of the front side portion of the front rail 152, and to determine whether the clip bonding process is performed or not by the control unit when an error is detected.
The third inspection unit 192 is configured by a flight visual camera or a step visual camera, and as shown in fig. 6 (b), is formed separately on the upper end of the front side of the rear rail 153, inspects the bonding state and/or bonding error of the clip 21 transferred by the vacuum suction stage 151, and compares the reference value with the allowable range of the recognition error.
As shown in fig. 7, the fourth inspection unit 193 is configured by a flying camera or a step camera, and is formed separately from the lower end of the clip attaching unit 170, and checks the attached state of the clips 21 of the lead frame array unit 150 configured by the clip attaching unit 170, and/or checks the removed state of the clips 21 of the clip attaching unit 170 after the attachment of the lead frame 10 and the clips 21, that is, checks whether or not the attaching nozzle 171 of the clip attaching unit 170 normally selects the clip 21 and whether or not the attaching nozzle 171 is free after the attachment of the clip 21, and the control unit checks an error in the attached state or the removed state of the clip 21 checked by the fourth inspection unit 193, and transfers the clip 21 to the second scrap box (194) (see fig. 8) to separate and remove the clip 21 when the error is checked.
Therefore, in order to construct the above-mentioned multiple clip bonding apparatus of semiconductor package, the alignment error of the lead frame is minimized to improve the bonding accuracy of the lead frame and the clip, before the bonding process (prebond), at least one of the presence or absence of the semiconductor chip 11, the presence or absence of the conductive adhesive 13, the volume of the conductive adhesive 13 and the two-dimensional code on the lead frame when the lead frame is supplied is inspected, after the bonding process (postbond), the bonding state and the bonding error of the clip are inspected, and the error of the bonding state or the removal state of the clip is confirmed by comparing the reference value recognition error allowable range, and the clip bonding process is inspected in turn to minimize the reject ratio of the semiconductor package, thereby improving the product yield.
In addition, the multiple clip bonding apparatus of the semiconductor package according to the embodiment of the present invention can be used in connection with various tables in advance or in backward direction.
Specifically, the lead frame carrier 110 of an embodiment of the present invention is associated with a preceding stage that arranges the semiconductor chips 11 on the lead frame 10 at a first pitch, and the lead frame 10 supplied from the corresponding preceding stage is put into the multiple clip bonding apparatus of the semiconductor package of the present invention through a separately arranged rail or a separately arranged selection arm. In this process, an additional adhesive coating means (not shown) is provided on the lead frame carrier 110 by a preliminary stage or in the multiple clip bonding apparatus of the semiconductor package of the present invention in a state where the coated conductive paste 13 is completed on the semiconductor chip 11 and the reed 12 of the lead frame 10, and the conductive paste 13 is coated before the clip bonding.
In the lead frame unloading unit 180 according to an embodiment of the present invention, the lead frame 10 on which the clip attachment is completed is loaded into the unloading magazine 181 for subsequent processes such as soldering or adhesive curing, or is transferred to a subsequent stage by a rail (not shown) or a separate selection arm (not shown).
While the preferred embodiments of the present invention have been described, the present invention is not limited thereto, and various modifications and implementations are possible within the scope of the claims, the detailed description of the invention, and the accompanying drawings, and are within the scope of the invention.

Claims (17)

1. A multiple clip bonding apparatus for semiconductor packages, characterized in that,
comprising the following steps: a lead frame carrying part for supplying a lead frame for arranging the semiconductor chips according to the first pitch;
a clip carrying part for supplying power to a clip matrix in which clips of the reed connecting the semiconductor chip and the lead frame are arranged at a second pitch;
the clamping piece cutting part is used for cutting the clamping piece square matrix one by one according to the clamping pieces;
a clip loading part loading the clips of the cut second pitch spacing;
a lead frame arrangement unit for arranging the lead frames to a clip attaching position;
the lead frame arrangement portion includes:
a platform forming the clamping piece attaching position;
a front-stage slide rail for transferring the lead frame from the lead frame carrying part to the platform;
a rear slide rail for transferring the lead frame from the platform to the lead frame unloading part;
a front-end gripping rail unit for pressurizing one side surface of the lead frame and transferring the lead frame along a rail formed on one side of the front-stage slide rail;
a rear-end grasping rail unit that pressurizes one side surface of the lead frame and transfers the lead frame along a rail formed on one side of the rear-end slide rail;
a first limit sensor detecting a supply of the lead frame carrier from the lead frame; a kind of electronic device with high-pressure air-conditioning system
A second limit sensor that detects discharge of the lead frame unloading section from the lead frame;
a first inspection unit configured to inspect an arrangement state or an arrangement error of a clip attaching position of the lead frame;
a clip attaching part, which selects the clips from the clip loading part to be arranged again according to a first pitch, transfers the clips to the clip attaching position of the lead frame arranging part, arranges the upper parts of the lead frames of the semiconductor chips according to the first pitch, and attaches the upper parts of the corresponding lead frames;
a lead frame unloading part for discharging the lead frame bonded by the clamping piece; a kind of electronic device with high-pressure air-conditioning system
And a control part for controlling the supply, arrangement, inspection and discharge of the lead frames, and the supply, cutting and attaching of the clamping pieces.
2. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
the control unit confirms the arrangement error checked by the first checking unit and corrects the bonding position of the clip formed by the clip bonding unit.
3. The semiconductor package multi-clip bonding apparatus of claim 2 wherein,
the first inspection part is formed by combining with an XYR shaft platform which is formed at the upper part of the lead frame arrangement part in a separated way, and the arrangement state of the lead frames is inspected by reciprocating and shooting the left and right edges of the lead frames from the upper part of the clamping piece attaching position.
4. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
the first inspection part is a flight visual camera or a stepping visual camera.
5. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
the platform refers to a vacuum adsorption platform for vacuum adsorbing the lead frame to form a clamping piece attaching position,
and comprises:
a vacuum adsorption plate composed of porous ceramics for mounting the lead frame;
and a negative pressure supply unit formed at a lower end of the vacuum adsorption plate to supply negative pressure to the vacuum adsorption plate.
6. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
further comprises:
and a second inspection unit which is formed at the upper end of the front side of the front slide rail in a separated manner and inspects whether the semiconductor chip of the lead frame transferred to the platform is present or not, whether the conductive adhesive is present or not, the volume of the conductive adhesive and the two-dimensional code.
7. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
further comprises:
and a third inspection part which is formed at the upper end of the front side part of the rear section sliding rail in a separated manner and inspects the attaching state or attaching error of the clamping piece transferred by the platform.
8. The semiconductor package multi-clip bonding apparatus of claim 6, wherein,
the second inspection part is a flight visual camera or a stepping visual camera.
9. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
further comprises:
and a fourth inspection unit which is formed at the lower end of the clip attaching unit in a spaced-apart manner and inspects the attaching state of the clips of the lead frame arrangement unit generated by the clip attaching unit, or the removing state of the clips of the clip attaching unit after the lead frame is attached to the clips.
10. The semiconductor package multi-clip bonding apparatus of claim 9, wherein,
the control unit confirms an error in the attached state or removed state of the clip checked by the fourth checking unit, and transfers the clip to a scrap box to remove the clip when the error is confirmed.
11. The semiconductor package multi-clip bonding apparatus of claim 9, wherein,
the fourth inspection part is a flight visual camera or a stepping visual camera.
12. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
the clamping piece cutting part is used for cutting the clamping piece square matrix downwards according to the clamping pieces one by one.
13. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
the cutting burrs of the respective clips cut by the clip cutting part are formed upward.
14. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
further comprises:
and an adhesive coating device for coating conductive adhesive on the upper part of the lead frame for arranging the semiconductor chips before attaching the clamping pieces.
15. The semiconductor package multi-clip bonding apparatus of claim 7, wherein,
the third inspection part is a flight visual camera or a stepping visual camera.
16. The semiconductor package multi-clip bonding apparatus of claim 1, wherein,
further comprises:
and an adhesive coating device for coating conductive adhesive on the semiconductor chip and the reed of the lead frame before attaching the clamping piece on the upper part of the lead frame for arranging the semiconductor chip.
17. A semiconductor package manufactured by the multiple clip bonding apparatus of the semiconductor package of claim 1.
CN202010878222.9A 2019-11-22 2020-08-27 Semiconductor package multiple clip bonding apparatus and semiconductor package manufactured by the same Active CN112838024B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101263596A (en) * 2005-08-30 2008-09-10 飞兆半导体公司 Reversible-multiple footprint package and method of manufacturing
CN103367168A (en) * 2012-04-02 2013-10-23 大和工程有限公司 Clamping piece supplying device used for clamping piece combining equipment and clamping piece combining equipment
KR101544086B1 (en) * 2014-02-07 2015-08-12 제엠제코(주) Multi clip mounting method for semiconductor packages and multi clip mounting system
KR101612730B1 (en) * 2016-02-24 2016-04-26 제엠제코(주) Method for mounting clip for semiconductor package and the multi clip mounting apparatus for the same
KR101949334B1 (en) * 2018-03-27 2019-02-18 제엠제코(주) Apparatus for bonding clips for semiconductor package and the clip picker for the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354740B2 (en) * 2008-12-01 2013-01-15 Alpha & Omega Semiconductor, Inc. Top-side cooled semiconductor package with stacked interconnection plates and method
US8166638B2 (en) * 2009-06-11 2012-05-01 Asm Assembly Automation Ltd Rotary clip bonder

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101263596A (en) * 2005-08-30 2008-09-10 飞兆半导体公司 Reversible-multiple footprint package and method of manufacturing
CN103367168A (en) * 2012-04-02 2013-10-23 大和工程有限公司 Clamping piece supplying device used for clamping piece combining equipment and clamping piece combining equipment
KR101544086B1 (en) * 2014-02-07 2015-08-12 제엠제코(주) Multi clip mounting method for semiconductor packages and multi clip mounting system
KR101612730B1 (en) * 2016-02-24 2016-04-26 제엠제코(주) Method for mounting clip for semiconductor package and the multi clip mounting apparatus for the same
KR101949334B1 (en) * 2018-03-27 2019-02-18 제엠제코(주) Apparatus for bonding clips for semiconductor package and the clip picker for the same
CN209169115U (en) * 2018-03-27 2019-07-26 Jmj韩国株式会社 The intermediate plate bonding apparatus and intermediate plate pick-up of semiconductor packages

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TW202121561A (en) 2021-06-01

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