JP5634021B2 - Semiconductor device manufacturing apparatus and semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method for mounting a semiconductor chip on a lead frame or the like.

  2. Description of the Related Art Conventionally, a die bonding apparatus (die bonder) that mounts a semiconductor chip on a lead frame or the like is known as a semiconductor device manufacturing apparatus (for example, see Patent Document 1).

In a conventional die bonding apparatus, one semiconductor chip is picked up and picked up by one collet provided on the mount head, and then the mount head is moved to the mount position on the lead frame where the solder paste is applied by a dispenser. The semiconductor chip was mounted.
JP 2005-209751 A

  As described above, in the conventional die bonding apparatus, one semiconductor chip is mounted in one cycle operation, and this one cycle operation is the production capacity of the apparatus. In addition, since the reciprocating operation is performed between the pick-up position for picking up the semiconductor chip and the mounting position in one mounting operation, this reciprocation time is directly lost as a tact time for mounting once. For this reason, the production capacity of the die bonding apparatus has been limited.

  The present invention has been made in view of the above, and an object thereof is to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of improving the productivity of the semiconductor device.

In order to achieve the above object, a semiconductor device manufacturing apparatus according to the present invention is a semiconductor device manufacturing apparatus for mounting a semiconductor chip on a lead frame, and has a plurality of nozzles for discharging a solder paste. A dispensing head for applying a solder paste to a plurality of positions on the lead frame; a wafer stage for holding a semiconductor wafer diced into a plurality of semiconductor chips; and a plurality of collets for holding the semiconductor chips by suction. A mounting head for picking up a plurality of the semiconductor chips from the wafer stage by the collet and mounting the picked-up semiconductor chips at a plurality of positions on the lead frame where the solder paste is applied; It is, Oite at the time of pick-up, and the current With a force which is formed by the field Prefecture, lowers the portion of the collet of the plurality of the collet in the direction of the unidirectional current, when said semiconductor chip is adsorbed and held, and the one direction and another collet in the direction of the reverse current, placed at a position higher than the portion of the collet, during mounting, when lowering the mounting head at a predetermined speed, the force formed by the current and the magnetic field, The collet holding the semiconductor chip is loaded with a thrust applied in a direction descending in the direction of the current in one direction, and the semiconductor chip is mounted on a lead frame . It is characterized by.

  According to another aspect of the present invention, there is provided a semiconductor device manufacturing apparatus including: an imaging unit that images a plurality of solder pastes coated on the lead frame; and a plurality of coatings applied on the lead frame from images captured by the imaging unit. The paste recognition means for calculating the solder paste application position and the application area respectively, and the application position calculated by the paste recognition means and a preset reference position are calculated to calculate the amount of positional deviation. Pass / fail is determined for each of the plurality of solder pastes applied on the lead frame based on the shift amount and the application area, and the semiconductor chip is mounted at a position where the solder paste determined to be passed is applied. And a control means for controlling the mount head.

The semiconductor device manufacturing method of the present invention is a method for manufacturing a semiconductor device in which a semiconductor chip is mounted on a lead frame, and is disposed at a plurality of positions on the lead frame by a dispensing head having a plurality of nozzles for discharging a solder paste. Applying a solder paste; imaging a plurality of solder pastes applied on the lead frame; calculating an application position and an application area of the plurality of solder pastes from the obtained images; and A positional deviation amount is calculated by comparing the application position with a preset reference position, and pass / fail is determined for each of the plurality of solder pastes applied on the lead frame based on the positional deviation amount and the application area. And mounting to a plurality of semiconductor chips by a mounting head having a plurality of collets for sucking and holding the semiconductor chips. Picking up a plurality of semiconductor chips to be mounted at a plurality of positions coated with a solder paste determined to pass in a step of determining pass / fail for each of the plurality of solder pastes from a sliced semiconductor wafer; and the mount head Mounting a plurality of the semiconductor chips picked up at a plurality of positions where the solder paste determined to be passed is applied, and in the picking up step, a force formed by a current and a magnetic field, When a part of the plurality of collets is lowered in the direction of current in one direction and the semiconductor chip is held by suction , the other collet is in the direction of current in the direction opposite to the one direction. It arranged to rise from a portion of the collet position, in the step of the mounting, lowering of the mounting head at a predetermined speed When a load is applied in a state in which a thrust is applied to the collet in a state where the semiconductor chip is held by a force formed by an electric current and a magnetic field in a direction descending in the direction of the one-way current, A semiconductor chip is mounted on a lead frame .

  According to the present invention, the productivity of a semiconductor device can be improved.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  1 is a schematic configuration diagram of a semiconductor device manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing a paste application mechanism portion of the semiconductor device manufacturing apparatus shown in FIG. 1, and FIG. 4 is a perspective view showing a mount mechanism section of the semiconductor device manufacturing apparatus shown in FIG. 1, FIG. 4 is a cross-sectional view showing the configuration of the mount head of the mount mechanism section shown in FIG. 3, and FIG. It is sectional drawing which shows the expansion mechanism of the wafer stage of an apparatus.

  As shown in FIG. 1, a semiconductor device manufacturing apparatus 1 according to the present embodiment includes a frame loader 2, a frame feeder 3, a frame unloader 4, a paste application mechanism unit 5, a paste recognition camera 6, and a mount. A mechanism unit 7, a frame recognition camera 8, a wafer supply mechanism unit 9, a wafer recognition camera 10, an image recognition processing unit 11, and a control unit 12 are provided.

  The frame loader 2 is disposed on one end side of the frame feeder 3 and supplies a lead frame 13 to the frame feeder 3.

  The frame feeder 3 conveys the lead frame 13 supplied from the frame loader 2 by a feed claw structure (not shown). The frame feeder 3 has a mechanism (not shown) for positioning and holding the lead frame 13 at a predetermined processing point.

  The frame unloader 4 is arranged on the other end side of the frame feeder 3 and takes out the lead frame 13 on which the semiconductor chip is mounted from the frame feeder 3 as described later.

  The paste application mechanism unit 5 is provided above the frame feeder 3, and as shown in FIGS. 1 and 2, the X table 51, the Y guide 52 mounted on the X table 51, and the Y guide 52. Y table 53, Z table 54 mounted on Y table 53, dispense head 55 mounted on Z table 54, syringe 56 for storing solder paste and supplying it to dispense head 55, solder paste A dispenser 57 that performs ejection control and a pre-paste application recognition camera 58 connected to a Y table 53 are provided.

  The dispense head 55 includes an X table 51, a Y table 53, and a Z table 54, an X direction that is a conveyance direction of the frame feeder 3, a Y direction that is parallel to the lead frame 13 and orthogonal to the X direction, and an X direction and a Y direction. It has four nozzles 551 to 554 arranged along the Y direction at the tip thereof, and solder paste is directed toward the lead frame 13 by the nozzles 551 to 554. Discharge.

  The pre-paste application recognition camera 58 is movable in the X and Y directions by the X table 51 and the Y table 53, and images the lead frame 13 conveyed to the processing point below the paste application mechanism unit 5 by the frame feeder 3. .

  The paste recognition camera 6 is provided on the downstream side in the transport direction of the frame feeder 3 with respect to the paste application mechanism unit 5. The paste recognition camera 6 is supported by the Y table 61 so as to be movable in the Y direction, and sequentially images a plurality of solder pastes applied on the lead frame 13.

  The mount mechanism unit 7 is provided on the downstream side in the transport direction of the frame feeder 3 with respect to the paste recognition camera 6, and as shown in FIGS. 1 and 3, the X tables are provided in parallel with each other with the frame feeder 3 interposed therebetween. 71, an X guide 72, a YZ table 73 mounted on the X table 71 and the X guide 72 across the frame feeder 3, and a mount head 74 mounted on the YZ table 73.

  The mount head 74 includes movable parts 745 to 748 having collets 741 to 744 at their tips, ball bushings 749 to 752 for guiding the movable parts 745 to 748 in a predetermined direction, and a part of the movable parts 745 to 748. Voice coils 753 to 756 arranged so as to surround, and brackets 757 for holding ball bushes 749 to 752 and voice coils 753 to 756 together.

  The collets 741 to 744 are arranged along the Y direction. The mount head 74 is connected to a YZ table 73 at a bracket 757, and is configured to be movable in the X, Y, and Z directions by the X table 71 and the YZ table 73.

  As shown in FIG. 4, the ball bush 749 is a linear guide having an opening 749a in which the movable portion 745 is inserted, and the ball bush 749 is an endless track ball bearing provided therein. Is held movable.

  The central axis of the opening 753a of the voice coil 753 is arranged so as to be parallel to the central axis of the opening 749a of the ball bush 749. The upper end portion 745a of the movable portion 745 is inserted into the opening 753a of the voice coil 753. When a negative current is supplied from an amplifier (not shown), the voice coil 753 generates an upward thrust according to the current value to raise the movable part 745, and when a positive current is supplied, the voice coil 753 has a current value. A corresponding downward thrust is generated to move the movable portion 745 downward.

  The relative position between the voice coil 753 and the ball bush 749 is held by the bracket 757. Ball bushings 750 to 752, movable portions 746 to 748, and voice coils 754 to 756 are also arranged in the same manner as described above.

  With the configuration described above, the mount head 74 vacuum picks up the semiconductor chips 99 from the semiconductor wafer 98 placed on the wafer stage 95 described later by the collets 741 to 744 and then moves them onto the frame feeder 3. The semiconductor chip 99 is mounted on the lead frame 13.

  The frame recognition camera 8 is provided adjacent to the mount mechanism unit 7 and fixed above the frame feeder 3, and images the lead frame 13 conveyed to the processing point below the mount mechanism unit 7 by the frame feeder 3.

  The wafer supply mechanism unit 9 is provided on the side of the frame feeder 3 and includes a wafer magazine 91, a transfer arm 92, an X table 93, a wafer guide rail 94, a wafer stage 95, an X table 96, and a Y table. 97.

  The wafer magazine 91 stores the semiconductor wafer 98. The semiconductor wafer 98 is bonded on an adhesive sheet attached to the wafer ring, and is diced into rectangular semiconductor chips 99. The wafer magazine 91 is configured to be movable in the Z direction by a Z table (not shown). The wafer magazine 91 has a pusher (not shown) that pushes the wafer ring outward.

  The transfer arm 92 is configured to be movable in the X direction by the X table 93, and transfers the semiconductor wafer 98 while holding the wafer ring pushed out from the wafer magazine 91 by the pusher by the wafer chuck 921 provided at the tip.

  The wafer guide rail 94 is used to adjust the direction of the wafer ring by pressing the chamfered portion of the wafer ring while the semiconductor wafer 98 is being transferred by the transfer arm 92.

  The wafer stage 95 is configured to be movable in the X and Y directions by the X table 96 and the Y table 97, and by stretching the adhesive sheet to which the semiconductor wafer 98 is attached so that the semiconductor chip 99 can be easily picked up, The interval between the semiconductor chips 99 is widened to hold the semiconductor wafer 98.

  As shown in FIG. 5, the wafer stage 95 is provided with a through-hole in the central portion, a cylindrical inner ring 102 is provided on the peripheral wafer stage 95, and a circular arc 2 in plan view around the periphery. One push-down plate 103 is provided. The push-down plate 103 is configured to be movable in the Z direction by a drive mechanism (not shown).

  As described above, the semiconductor wafer 98 is bonded to the semiconductor chip 99 in a dicing state on the adhesive sheet 101 attached to the wafer ring 100. When the semiconductor wafer 98 is transferred to a predetermined position on the wafer stage 95, the push-down plate 103 is lowered to push down the wafer ring 100, and the adhesive sheet 101 is pressed against the inner ring 102. The semiconductor wafer 98 is held in a state where the interval between the semiconductor chips 99 is widened (expanded state).

  Below the semiconductor wafer 98 held on the wafer stage 95, a push-up unit 104 containing a push-up pin (not shown) that pushes up the target semiconductor chip 99 when the semiconductor chip 99 is picked up by the mount head 74 is disposed. Yes. The push-up unit 104 is configured to be movable in the Z direction by a drive mechanism (not shown).

  Wafer recognition camera 10 is fixedly provided above wafer stage 95 and images semiconductor wafer 98 held on wafer stage 95.

  The image recognition processing unit 11 receives images captured by the pre-paste recognition camera 58, the paste recognition camera 6, the frame recognition camera 8, and the wafer recognition camera 10, processes the images, and outputs the results to the control unit 12. To do.

  The control unit 12 controls each unit provided in the semiconductor device manufacturing apparatus 1.

  Next, the operation of the semiconductor device manufacturing apparatus 1 will be described.

  The lead frame 13 conveyed by the frame feeder 3 is positioned at a processing point set below the paste application mechanism unit 5, and the image recognition processing unit 11 determines the lead frame 13 based on the image of the recognition camera 58 before paste application. Upon recognition, the control unit 12 sequentially moves the dispensing head 55 to preset discharge target positions, and causes the dispenser 57 to simultaneously discharge a predetermined amount of solder paste from the four nozzles 551 to 554 at each discharge target position. In this way, the solder paste is applied to a plurality of positions on the lead frame 13.

  On the other hand, the wafer supply mechanism unit 9 transfers the semiconductor wafer 98 stored in the wafer magazine 91 by the transfer arm 92 and holds it on the wafer stage 95 in an expanded state.

  When the application of the solder paste is completed, the control unit 12 causes the frame feeder 3 to carry the lead frame 13 and positions it at a processing point set below the paste recognition camera 6.

  Next, the control unit 12 causes the paste recognition camera 6 to sequentially perform imaging so as to individually image the solder paste applied to a plurality of positions on the lead frame 13. The imaging position where the movement of the paste recognition camera 6 is stopped and the imaging is performed is a position set in advance as the imaging position of the designed solder paste application position on the lead frame 13.

  The image recognition processing unit 11 processes an image captured at each imaging position by the paste recognition camera 6, and applies each of a plurality of solder pastes applied on the lead frame 13 to the application position and application on the lead frame 13. The area is calculated and the result is output to the control unit 12.

  The control unit 12 compares each solder paste application position calculated by the image recognition processing unit 11 with a preset design application position (reference position) corresponding to each solder paste application position. The amount of misregistration is calculated for each application position. Then, the control unit 12 applies the calculated amount of misalignment and application area of each solder paste to the lead frame 13 by comparing the threshold value of the amount of misalignment and the allowable range of the application area, respectively. Pass / fail is determined for each solder paste.

  Next, the control unit 12 causes the frame feeder 3 to convey the lead frame 13 and position it at a processing point set below the mount mechanism unit 7. When the image recognition processing unit 11 recognizes the lead frame 13 based on the image of the frame recognition camera 8, the control unit 12 moves the mount head 74 above the semiconductor wafer 98 held on the wafer stage 95, and collet. The semiconductor chip 99 is picked up by 741-744.

  The operation of the pickup will be described with reference to FIG.

  The control unit 12 moves the mount head 74 so that one collet 741 is positioned above the push-up position of the push-up unit 104. At this time, the control unit 12 causes all voice coils 753 to 756 to supply a negative current from an amplifier (not shown) to generate a thrust in the attracting direction (upward), and collets 741 to 744 at the tips of the movable units 745 to 748. Is evacuated.

  Further, the image recognition processing unit 11 recognizes the position where the semiconductor chip 99 exists on the semiconductor wafer 98 based on the image captured by the wafer recognition camera 10, and outputs the chip position recognition result to the control unit 12. Based on the chip position recognition result from the image recognition processing unit 11, the control unit 12 moves the wafer stage 95 so that the semiconductor chip 99 is positioned above the push-up position of the push-up unit 104.

  Then, the control unit 12 raises the push-up unit 104 and pushes up the target semiconductor chip 99 with a built-in push-up pin.

  On the other hand, the control unit 12 generates a thrust in the pressing direction (downward direction) by supplying a positive current from an amplifier (not shown) only to the voice coil 753 corresponding to the collet 741 that is to attract the semiconductor chip 99. Thereby, the collet 741 is arranged at a position as close as possible to the semiconductor wafer 98, and the other collets 742 to 744 are arranged as far as possible from the semiconductor wafer 98.

  In this state, the control unit 12 lowers the entire mount head 74 by the YZ table 73. As shown in FIG. 6, when the collet 741 is lowered to a position where it contacts the target semiconductor chip 99, the control unit 12 vacuums the inside of the suction hole provided in the collet 741 to generate an adsorption force. 99 is adsorbed and held on the collet 741.

  Then, the control unit 12 raises the bracket 757 by the YZ table 73 in a state where the collet 741 sucks and holds the semiconductor chip 99 to detach the semiconductor chip 99 from the adhesive sheet 101 and retracts the push-up pin, 104 is lowered.

  Thereafter, the collets 742 to 744 are sequentially moved above the push-up position of the push-up unit 104, and the semiconductor chips 99 are sequentially picked up by the collets 742 to 744 by the same operation as described above.

  During this pickup, the image recognition processing unit 11 processes the image picked up by the frame recognition camera 8 and determines the position where the semiconductor chip 99 is mounted on the lead frame 13 and the position where the solder paste is applied. The result is output to the control unit 12.

  When the pickup is completed, the control unit 12 moves the mount head 74 based on the calculation result of the mount position from the image recognition processing unit 11, and positions the collets 741 to 744 above the mount position.

  At this time, the control unit 12 causes the amplifiers to supply positive currents to the voice coils 753 to 756 corresponding to the collets 741 to 744 that hold the semiconductor chip 99, and lowers the collets 741 to 744 so that the voice coils 753 to 756 fall. A thrust in the pressing direction is generated.

  In this state, the control unit 12 lowers the entire mount head 74 by the YZ table 73 and abuts the semiconductor chip 99 held by the collets 741 to 744 against the lead frame 13 to which the solder paste to be mounted is applied. Let At this time, the collets 741 to 744 are retracted by an excessive amount of the descending amount of the mount head 74, but since the pressing force is given by the voice coils 753 to 756, the semiconductor chips 99 held by the collets 741 to 744 are applied. Is in a state where a pressing load is applied. As a result, the semiconductor chip 99 is bonded to the lead frame 13.

  Thereafter, the control unit 12 releases the suction of the collets 741 to 744, raises the entire mount head 74 by the YZ table 73, and supplies a negative current from the amplifier to apply a thrust in the attracting direction to the voice coils 753 to 756. And collets 741-744 are retracted.

  Thereafter, the above-described pickup operation and mounting operation are repeated until the mounting of the semiconductor chip 99 to the position where all the solder pastes to be mounted are applied is completed.

  In the mount head 74 of the present embodiment, since the mount head 74 is lowered during mounting and the semiconductor chip 99 held on the collets 741 to 744 is brought into contact with the lead frame 13, the impact load is alleviated. Therefore, the tact time required for lowering the mount head 74 can be shortened.

  In the pick-up operation and the mount operation, if there is a solder paste that is determined to be rejected as a result of the pass / fail determination based on the solder paste application position and the application area, the control unit 12 responds to the rejected solder paste. The mounting head 74 is controlled so that the semiconductor chip 99 is picked up and mounted only on the solder paste determined to be acceptable, without picking up and mounting the semiconductor chip 99 to be performed.

  When the mounting is completed, the lead frame 13 on which the semiconductor chip 99 is mounted is transported by the frame feeder 3, taken out by the frame unloader 4, and transported to a device that performs a post process.

  As described above, according to the present embodiment, the dispensing head 55 having a plurality of nozzles 551 to 554 applies solder paste to a plurality of positions on the lead frame 13 at the same time, and has a plurality of collets 741 to 744. Since the mounting head 74 picks up and mounts the plurality of semiconductor chips 99 in one cycle operation, the time loss of the tact time can be reduced and the productivity of the semiconductor device can be improved.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiments.

  For example, in the above-described embodiment, the case where there are four nozzles of the dispensing head and four collets of the mounting head has been described, but the number of nozzles of the dispensing head and the collets of the mounting head are not limited thereto.

  In the above embodiment, the example in which the nozzles 551 to 554 of the dispense head 55 and the collets 741 to 744 of the mount head 74 are arranged in the X direction is shown, but the arrangement direction of the nozzles 551 to 554 and the collets 741 to 744 is They may be the same and may be arranged in the Y direction.

It is a schematic block diagram of the manufacturing apparatus of the semiconductor device which concerns on embodiment of this invention. It is a perspective view which shows the paste application | coating mechanism part of the manufacturing apparatus of the semiconductor device shown in FIG. It is a perspective view which shows the mount mechanism part of the manufacturing apparatus of the semiconductor device shown in FIG. It is sectional drawing which shows the structure of the mount head of the mount mechanism part shown in FIG. FIG. 2 is a cross-sectional view showing an expanding mechanism in a wafer stage of the semiconductor device manufacturing apparatus shown in FIG. 1. It is a figure for demonstrating the pickup operation | movement in the manufacturing apparatus of the semiconductor device shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor device manufacturing apparatus, 2 ... Frame loader, 3 ... Frame feeder, 4 ... Frame unloader, 5 ... Paste application mechanism part, 6 ... Paste recognition camera, 7 ... Mount mechanism part, 8 ... Frame recognition camera, 9 ... Wafer supply mechanism unit, 10 ... wafer recognition camera, 11 ... image recognition processing unit, 12 ... control unit, 13 ... lead frame, 55 ... dispense head, 56 ... syringe, 57 ... dispenser, 58 ... recognition camera before paste application, 74 DESCRIPTION OF SYMBOLS ... Mount head, 95 ... Wafer stage, 98 ... Semiconductor wafer, 99 ... Semiconductor chip, 104 ... Push-up unit, 551-554 ... Nozzle, 741-744 ... Collet, 745-748 ... Moving part, 749-752 ... Ball bush, 753-756 ... Voice coil, 757 ... Bracket.

Claims (3)

A semiconductor device manufacturing apparatus for mounting a semiconductor chip on a lead frame,
A dispense head that has a plurality of nozzles for discharging a solder paste and applies the solder paste to a plurality of positions on the lead frame by the plurality of nozzles;
A wafer stage for holding a semiconductor wafer diced into a plurality of semiconductor chips;
A plurality of collets for adsorbing and holding the semiconductor chips are picked up, a plurality of the semiconductor chips are picked up from the wafer stage by a plurality of the collets, and a solder paste on the lead frame is applied to the plurality of picked up semiconductor chips With a mount head that mounts at multiple locations,
The mounting head is Oite during pickup, the force formed by the current and the magnetic field, is lowered a portion of the collet of the plurality of the collet in the direction of the unidirectional current, the suction holding the semiconductor chip when brought into, the other collet from said one direction orientation of reverse current, placed at a position higher than the portion of the collet, during mounting, when lowering the mounting head at a predetermined speed The semiconductor chip is loaded in a state in which thrust is applied to the collet in a state where the semiconductor chip is held by a force formed by a current and a magnetic field in a direction descending in the direction of the current in one direction. An apparatus for manufacturing a semiconductor device, wherein the apparatus is configured to be mounted on a lead frame . Imaging means for imaging a plurality of solder pastes applied on the lead frame;
Paste recognition means for calculating the application position and application area of a plurality of solder pastes applied on the lead frame from the image imaged by the imaging means;
A positional deviation amount is calculated by comparing the application position calculated by the paste recognition means with a preset reference position. Based on the positional deviation amount and the application area, a plurality of parts applied on the lead frame are calculated. And a control means for controlling the mount head so as to mount the semiconductor chip at a position where the solder paste determined to be acceptable is applied. The manufacturing apparatus of the semiconductor device as described in 2. above. A method of manufacturing a semiconductor device in which a semiconductor chip is mounted on a lead frame,
Applying the solder paste to a plurality of positions on the lead frame by a dispensing head having a plurality of nozzles for discharging the solder paste;
Imaging a plurality of solder pastes applied on the lead frame, and calculating each of the application positions and application areas of the plurality of solder pastes from the obtained images;
A positional deviation amount is calculated by comparing the application position with a preset reference position, and pass / fail is determined for each of the plurality of solder pastes applied on the lead frame based on the positional deviation amount and the application area. A determining step;
A plurality of solder pastes that are determined to pass in the step of determining pass / fail for each of the plurality of solder pastes from a semiconductor wafer diced into a plurality of semiconductor chips by a mount head having a plurality of collets that hold the semiconductor chips by suction. Picking up a plurality of the semiconductor chips mounted at the position;
Mounting a plurality of the semiconductor chips picked up by the mount head at a plurality of positions where the solder paste determined to be acceptable is applied,
In the picking up step , when the semiconductor chip is attracted and held by lowering some collets of the plurality of collets in one direction of current by a force formed by a current and a magnetic field. The other collet is disposed at a position higher than the part of the collets in the direction of the current in the direction opposite to the one direction, and when the mount head is lowered at a predetermined speed in the mounting step, the current is A force generated by a magnetic field and a magnetic field is applied to the collet holding the semiconductor chip in a state in which a thrust is applied in a direction that descends in the direction of the current in one direction, and the semiconductor chip is attached to the lead frame. A method for manufacturing a semiconductor device , comprising: mounting on a semiconductor device.

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