KR102098762B1 - Apparatus for manufacturing semiconductor and method of manufacturing semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a semiconductor manufacturing apparatus capable of easily changing a pushing unit according to a variety. The semiconductor manufacturing apparatus includes a pushing unit for pushing the die from below the dicing tape, and a collet for adsorbing the die. The pushing unit includes a first unit having a plurality of blocks having a quadrangular shape in contact with a dicing tape, and a second unit having a plurality of blocks having a concentric shape that independently transmits vertical movement to each of the plurality of blocks. do. The first unit is mounted on top of the second unit.

Description

A semiconductor manufacturing apparatus and a manufacturing method of a semiconductor device {APPARATUS FOR MANUFACTURING SEMICONDUCTOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE}

The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder having a pushing unit.

Generally, in a die bonder in which a semiconductor chip called a die is mounted on the surface of a wiring board or a lead frame (hereinafter, collectively referred to as a 'substrate'), for example, an adsorption nozzle such as collet is generally used. Then, the operation (work) of performing bonding by heating the bonding material while heating the bonding material is performed while conveying the die onto the substrate and applying a pressing force.

Among the die bonding process by a semiconductor manufacturing apparatus such as a die bonder, there is a peeling step of peeling a divided die from a semiconductor wafer (hereinafter referred to as a “wafer”). In the peeling step, the die is pushed up by the pushing unit from the back side of the dicing tape, and peeled one by one from the dicing tape held in the die supply section, and conveyed onto the substrate using an adsorption nozzle such as collet.

For example, according to Japanese Patent Laid-Open No. 2012-4393 (Patent Document 1), a plurality of dies adhered to a dicing tape are pushed up and peeled off from the dicing tape, and thus, among the peripheral portions of the die. The dicing tape in the predetermined portion is pushed up to form a peeling origin, and then the dicing tape in a portion other than the predetermined portion is pushed up to peel the die from the dicing tape.

Japanese Patent Publication No. 2012-4393

When picking up a die from a wafer, it is necessary to set a jig according to the variety (for example, die size). However, adjustments when changing varieties are complicated and require time. Since the pickup operation is made of a structure conforming to the operation specifications in advance in the multi-stage pushing such as Patent Document 1, the pushing unit cannot be changed from the back.

An object of the present disclosure is to provide a semiconductor manufacturing apparatus capable of easily changing a pushing unit according to a variety.

Other problems and novel features will become apparent from the description of the present specification and the accompanying drawings.

The outline of a representative one of the present disclosure is briefly described below.

That is, the semiconductor manufacturing apparatus includes a pushing unit for pushing the die from below the dicing tape, and a collet for adsorbing the die. The pushing unit includes a first unit having a plurality of blocks having a quadrangular shape contacting the dicing tape, and a second having a plurality of blocks having a concentric circle shape that independently transmits vertical movement to each of the plurality of blocks. It is equipped with a unit. The first unit is mounted on top of the second unit.

According to the above-mentioned semiconductor manufacturing apparatus, it is possible to easily change the pushing unit according to the variety.

1 is a conceptual view from above of a die bonder according to an embodiment.
FIG. 2 is a view for explaining the operation of the pickup head and the bonding head when viewed in the direction of arrow A in FIG. 1;
3 is a view showing an external perspective view of a die supply unit of FIG. 1.
4 is a schematic cross-sectional view showing a main part of the die supply part of FIG. 1.
5 is an external perspective view of a pushing unit according to an embodiment.
6A is a top view of a portion of the first unit in FIG. 5;
6B is a top view of a portion of the second unit in FIG. 5.
6C is a top view of a part of the third unit in FIG. 5.
Fig. 7 is a longitudinal sectional view of the pushing unit of Fig. 5;
8 is a longitudinal sectional view of the pushing unit of FIG. 5.
9 is a view showing the configuration of the collapsing part of the lifting unit and the pickup head according to the embodiment.
10 is a flowchart for explaining the pickup operation of the die bonder according to the embodiment.
11 is a flowchart for explaining a method of manufacturing a semiconductor device according to an embodiment.
12A is an external perspective view of a pushing unit according to a modification.
12B is an external perspective view of a pushing unit according to a modification.
Fig. 13 is a longitudinal sectional view of the first unit in Fig. 12A.
14A is a longitudinal sectional view of a part of the pushing unit of FIG. 12A.
14B is a longitudinal sectional view of the first unit removed from a part of the pushing unit of FIG. 14A.
15 is an external perspective view of a pushing unit according to Modification 2;
Fig. 16 is a longitudinal sectional view of the third unit in Fig. 15;
17 is a top view of a part of the third unit of FIG. 16.
18 is a top view of a part of a modification of the third unit in FIG. 15.

 Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components may be given the same reference numerals and repeated descriptions may be omitted. In addition, in order to make the description more clear, in some cases, the width, thickness, shape, etc. of each part are schematically expressed in comparison with the actual form, but the interpretation of the present invention is not limited by way of example only. .

[Example]

1 is a top view showing an outline of a die bonder according to an embodiment. FIG. 2 is a view for explaining the operation of the pickup head and the bonding head when viewed in the direction of arrow A in FIG. 1.

The die bonder 10 is largely divided into a die supply unit 1, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, and a substrate supply unit 6 And a control unit 8 that monitors and controls the operation of each unit and the substrate carrying unit 7.

First, the die supply unit 1 supplies the die D mounted on the substrate P. The die supply unit 1 has a wafer holder 12 for holding the wafer 11 and a pushing unit 13 indicated by a dotted line for pushing the die D from the wafer 11. The die supply unit 1 moves in the XY direction by a driving means (not shown), and moves the picked up die D to the position of the pushing unit 13.

The pick-up section 2 lifts, rotates and rotates the pickup head 21 for picking up the die D, the Y drive section 23 of the pick-up head for moving the pick-up head 21 in the Y direction, and the collet 22. It has each driving unit (not shown) that moves in the direction. The pick-up head 21 has a collet 22 (see FIG. 2) for adsorbing and holding the pushed-up die D at the end, picking up the die D from the die supply section 1, and feeding it to the intermediate stage 31. Load. The pickup head 21 has respective driving parts (not shown) for moving the collet 22 up and down, rotating, and moving in the X direction.

The intermediate stage part 3 has an intermediate stage 31 for temporarily loading the die D, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding part 4 picks up the die D from the intermediate stage 31 and bonds it on the substrate P to be conveyed, or bonds it on top of the die already bonded on the substrate P. The bonding portion 4, like the pickup head 21, has a bonding head 41 having a collet 42 (see Fig. 2) for adsorbing and holding the die D at the tip, and the bonding head 41 in the Y direction. It has a Y driving unit 43 to move to and a substrate recognition camera 44 that recognizes a bonding position by imaging a position recognition mark (not shown) of the substrate P.

With such a configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and board recognition camera 44 ), Die D is bonded to the substrate P based on the imaging data.

The transport section 5 includes a board transport pallet 51 on which one or several boards P (four in FIG. 1) are loaded, and a pallet rail 52 on which the board transport pallet 51 moves, It has the 1st, 2nd conveyance parts of the same structure installed in parallel. The substrate conveying pallet 51 is moved by driving a nut (not shown) provided on the substrate conveying pallet 51 with a ball screw (not shown) provided along the pallet rail 52.

With such a configuration, the substrate conveying pallet 51 loads the substrate P from the substrate supply part 6, moves along the pallet rail 52 to the bonding position, and after bonding, moves to the substrate carrying part 7 Then, the substrate P is passed to the substrate carrying portion 7. The first and second transport units are driven independently of each other, and while bonding the die D to the substrate P loaded on one of the substrate transport pallets 51, the other substrate transport pallet 51 carries out the substrate P , Returning to the substrate supply section 6, and preparing such as loading a new substrate P.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each part of the die bonder 10, and a central processing unit (CPU) for executing a program stored in the memory.

Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. It is a figure which shows the external perspective view of a die supply part. 4 is a schematic cross-sectional view showing a main part of a die supply part.

The die supply unit 1 includes a wafer holder 12 moving in the horizontal direction (XY direction) and a pushing unit 13 moving in the vertical direction. The wafer holder 12 horizontally positions the dividing tape 16 holding the wafer ring 14 and the dicing tape 16 held by the wafer ring 14 and adhered to a plurality of dies D. It has a support ring (17). The pushing unit 13 is disposed inside the support ring 17.

When the die D is pushed up, the die supply unit 1 lowers the expand ring 15 holding the wafer ring 14. As a result, the dicing tape 16 held on the wafer ring 14 is elongated, and the gap between the dies D is enlarged, and the pushing unit 13 pushes the die D from below the die D to pick up the die D. Improving sex. Moreover, the adhesive which bonds a die to a board | substrate with thinning becomes a film form from a liquid state, and is a film called a die attach film (DAF) 18 between the wafer 11 and the dicing tape 16. The adhesive material of the shape is attached. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. In addition, in the following, the existence of the die attach film 18 is ignored, and the peeling process will be described.

Next, the pushing unit 13 will be described with reference to FIGS. 5, 6A to 6D, 7, and 8. 5 is an external perspective view of a pushing unit according to an embodiment. FIG. 6A is a top view of a portion of the first unit of FIG. 5. It is a top view of a part of the 2nd unit of FIG. 5 of FIG. 6B. 6C is a top view of a portion of the third unit of FIG. 5. 7 is a longitudinal sectional view of the pushing unit of FIG. 5. 8 is a longitudinal sectional view of the pushing unit of FIG. 5.

The pushing unit 13 includes a first unit 13a, a second unit 13b to which the first unit 13a is mounted, and a third unit 13c to which the second unit 13b is mounted. do. The second unit 13b and the third unit 13c are common parts regardless of varieties, and the first unit 13a is a replaceable part for each variety.

The first unit 13a has a block portion 13a1 having blocks A1 to A6, a dome head 13a2 having a plurality of suction holes, a suction hole 13a3, and a suction hole 13a4 for dome suction , Convert the vertical motion of the concentric circular blocks B1 to B6 of the second unit 13b to the vertical motion of the six blocks A1 to A6 of concentric square shape. The six blocks A1 to A6 can independently move up and down. The planar shape of the concentric square-shaped blocks A1 to A6 is configured to fit the shape of the die D. When the die size is small, the number of concentric square-shaped blocks is less than six. In this case, for example, the output unit of the third unit and the concentric block of the second unit are not used. This is made possible by a plurality of output units of the third unit and concentric circular blocks of the second unit moving up and down (not moving up and down) independently of each other.

The second unit 13b has six blocks of concentric circular motions with the cylindrical blocks B1 to B6, the outer peripheral portions 13b2, and the vertical movement of the output units C1 to C6 disposed on the circumference of the first unit 13a. It converts to the vertical motion of B1 to B6. The six blocks B1 to B6 can independently move up and down.

The third unit 13c has a central portion 13c0 and six peripheral portions 13c1 to 13c6. The central portion 13c0 is arranged at equal intervals on the circumference of the upper surface and has six output portions C1 to C6 independently rising and falling. The peripheral parts 13c1 to 13c6 can respectively drive the output parts C1 to C6 independently of each other. The peripheral parts 13c1 to 13c6 are provided with motors M1 to M6, respectively, and the central part 13c0 is provided with plunger mechanisms P1 to P6 for converting the rotation of the motor to vertical movement by a cam or link. The plunger mechanisms P1 to P6 provide vertical movement to the output sections C1 to C6. Incidentally, motors M2, M5 and plunger mechanisms P2 and P5 are not shown.

Next, the relationship between the pushing unit and the collet will be described with reference to FIG. 9. 9 is a view showing the configuration of the collapsing part of the lifting unit and the pickup head according to the embodiment.

As shown in Fig. 9, the collet portion 20 includes a collet 22, a collet holder 24 holding the collet 22, and suction holes 22v, 23v provided on each to adsorb the die D ).

The first unit 13a has a dome head 13a2 at its upper periphery. The dome head 13a2 has a plurality of adsorption holes HL and a cavity CV, and the die Dd around the die D picked up by the suction hole 13a3 is picked up by the collet 22 via the dicing tape 16. And aspirate. Although the adsorption hole HL is shown as an example only around the block portion 13a1 in FIG. 9, a plurality of rows are provided to stably maintain the die Dd, which is not a pickup object. The gaps A1v, A2v, A3v, A4v, A5v between the respective blocks of the concentric square-shaped blocks A1 to A6 are interspersed with a cavity in the dome of the first unit 13a and sucked from the suction hole 13a4 of the dome adsorption, collet The die D picked up by (22) is sucked through the dicing tape (16). The suction from the suction hole 13a3 and the suction from the suction hole 13a4 can be performed independently.

The pushing unit 13 of this embodiment can be applied to various dies by changing the block shape and number of blocks of the first unit. For example, in the case of 6 blocks, the die size is 20 mm or less. It is applicable. By increasing the number of output units of the third unit, the number of concentric circular blocks of the second unit, and the number of concentric square blocks of the first unit, it is also applicable to dies having a die size larger than 20 mm □.

Next, the pick-up operation by the pushing unit 13 having the above-described configuration will be described with reference to FIG. 10. 10 is a flowchart showing the processing flow of the pickup operation.

Step S1: The control unit 8 moves the wafer holder 12 so that the die D to be picked up is located directly above the pushing unit 13, and the upper surface of the third unit contacts the back surface of the dicing tape 16 So that the pushing unit 13 is moved. At this time, as shown in FIG. 9, the control unit 8 causes each of the blocks A1 to A6 of the block portion 13a1 to form the same plane as the surface of the dome head 13a2, and adsorbs the dome head 13a2 The dicing tape 16 is adsorbed by the holes HL and the gaps A1v, A2v, A3v, A4v, and A5v between the blocks.

Step 2: The control unit 8 lowers the collet portion 20, positions it on the die D to be picked up, and adsorbs the die D by suction holes 22v and 24v.

Step 3: The control unit 8 sequentially lifts the block of the block portion 13a1 from the outside to perform a peeling operation. That is, the control unit 8 drives the plunger mechanism P6 with the motor M6, and raises and stops only the outermost block A6 from tens of μm to several hundreds of μm. As a result, a raised portion of the dicing tape 16 protruding around the block A6 is formed, and a small space between the dicing tape 16 and the die attach film 18, that is, the peeling origin. Occurs. The anchor effect, that is, the stress applied to the die D is greatly reduced by this space, and subsequent peeling operation can be reliably performed. Next, the control unit 8 drives the plunger mechanism P5 with the motor M5, and secondly, only the outer block A5 rises higher than the block A6 to stop. Next, the control unit 8 drives the plunger mechanism P4 with the motor M4, and thirdly, raises and stops only the outer block A4 higher than the block A5. Next, the control unit 8 drives the plunger mechanism P3 with the motor M3, and fourthly, raises and stops only the outer block A3 higher than the block A4. Next, the control unit 8 drives the plunger mechanism P2 with the motor M2, and fifthly increases only the outer block A2 higher than the block A3 to stop. Finally, the control unit 8 drives the plunger mechanism P1 with the motor M1, and raises and stops only the innermost block A1 higher than the block A2.

Step S4: The control unit 8 raises the collet. In the last state of step S3, the contact area between the dicing tape 16 and the die D is an area that can be peeled off by the rise of the collet, and the die D can be peeled off by the rise of the collet 22.

Step S5: The control unit 8 causes each of the blocks A1 to A6 of the block portion 13a1 to form the same plane as the surface of the dome head 13a2, the adsorption hole HL of the dome head 13a2, and the gap A1v between the blocks , The adsorption of the dicing tape 16 by A2v, A3v, A4v, A5v is stopped. The control unit 8 moves the pushing unit 13 so that the upper surface of the first unit is spaced from the back surface of the dicing tape 16.

The control section 8 repeats steps S1 to S5 to pick up a good quality die of the wafer 11.

Next, a method for manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to FIG. 11. 11 is a flowchart showing a method of manufacturing a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is adhered is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control unit 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14. Further, the substrate P is prepared and carried into the die bonder 10. The control part 8 loads the board | substrate P from the board | substrate supply part 6 to the board | substrate conveyance pallet 51.

Step S12: The control unit 8 picks up the die divided by the steps S1 to S5 from the wafer.

Step S13: The control unit 8 stacks the picked-up die on the substrate P or stacks it on the die already bonded. The control unit 8 loads the die D picked up from the wafer 11 onto the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and bonds it to the conveyed substrate P do.

Step S14: The control unit 8 extracts the substrate P to which the die D is bonded from the substrate transport pallet 51 in the substrate carrying unit 7. The substrate P is taken out from the die bonder 10.

<Modification 1>

Next, Modification Example 1 of the pushing unit will be described with reference to FIGS. 12A, 12B, 13, 14A, and 14B. 12A is an external perspective view of a pushing unit according to Modification Example 1; 12B is an external perspective view of a pushing unit according to Modification Example 1; 13 is a longitudinal sectional view of the first unit of FIG. 12A. 14A is a longitudinal sectional view of a part of the first unit and the second unit of the pushing unit of FIG. 12A. 14B is a longitudinal sectional view of the first unit of FIG. 12A removed.

The pushing unit 13A includes a first unit 13Aa and a second unit 13Ab to which the first unit 13Aa is mounted. The second unit 13Ab is a common part regardless of the variety, and the first unit 13Aa is a replaceable part for each variety.

The first unit 13Aa has a different number of blocks from the first unit 13a in the embodiment, but is the same as the first unit 13a otherwise. The first unit 13Aa includes a block portion 13Aa1 having blocks AA1 to AA4, a dome head 13Aa2 having a plurality of suction holes, a suction hole 13a3, and a suction hole 13a4 for dome suction , And members aA1 to aA4 for transmitting the vertical motion of the concentric circular blocks BA1 to BA4 of the second unit 13Ab to the four concentric rectangular blocks A1 to A4.

The second unit 13Ab is a member 13Ab2 for mounting the first unit 13Aa by covering the outer peripheral portion 13Ab1 and the outer peripheral portion 13Ab1, and the member 13Ab2 is locked (fixed) to the outer peripheral portion 13Ab1. The member 13Ab3 to be provided, the coaxial cylindrical (pipe-shaped) blocks BA1 to BA4, and the driving units CA1 to CA4 for driving the blocks BA1 to BA4, respectively. By unlocking the member 13Ab3, the member 13Ab2 can be moved upward, and the first unit 13Aa can be detached from the second unit 13Ab. The driving units CA1 to CA4 are arranged in the order of the driving units CA1, CA2, CA3, and CA4 from the top in the vertical direction. The four driving units CA1 to CA4 can independently drive the four blocks BA1 to BA4 up and down, and as a result, the four blocks AA1 to AA4 can independently move up and down. Since the driving units CA1 to CA4 are arranged in the vertical direction, the size in the horizontal direction can be made smaller than in the examples.

The pickup operation by the pushing unit 13A is the same as the operation by the pushing unit 13 in the embodiment shown in FIG. The manufacturing method of the semiconductor device using the die bonder provided with the pushing unit 13A is the same as the manufacturing method of the semiconductor device of the embodiment shown in FIG.

<Modification 2>

Next, Modification Example 2 of the pushing unit will be described with reference to FIGS. 15 to 17. 15 is an external perspective view of a pushing unit according to Modification 2; 16 is a longitudinal sectional view of the third unit of FIG. 15. 17 is a top view of a portion of the third unit of FIG. 16.

The pushing unit 13B includes a first unit 13Ba, a second unit 13Bb to which the first unit 13Ba is mounted, and a third unit 13Bc to which the second unit 13Bb is mounted. do. The second unit 13Bb and the third unit 13Bc are common parts regardless of varieties, and the first unit 13Ba is a replaceable part for each variety.

The first unit 13Ba has the same number of blocks as the first unit 13a, but has the same structure and includes up to 12 blocks. The second unit 13Bb has the same number of blocks as the second unit 13b, but has the same structure and includes up to 12 blocks.

The third unit 13Bc has a central portion 13Bc0 and 12 peripheral portions 13c1 to 13c6 and 13d1 to 13d6. The central portion 13Bc0 has six outputs C1 to C6 which are arranged at equal intervals on the outer circumference of the upper surface and rise and fall independently, and six outputs D1 to D6 that are arranged at equal intervals on the inner circumference to rise and fall independently. . The peripheral portions 13c1 to 13c6 are disposed on the peripheral portions 13d1 to 13d6. The peripheral parts 13c1 to 13c6 and 13d1 to 13d6 can respectively drive the output parts C1 to C6 and D1 to D6 independently of each other. The peripheral parts 13c1 to 13c6, 13d1 to 13d6 are provided with motors M1 to M6 and Md1 to Md6, respectively, and in the central part 13Bc0, plunger mechanisms P1 to P6, Pd1 for converting rotation of the motor to vertical movement by a cam or link To Pd6. The plunger mechanisms P1 to P6, Pd1 to Pd6 provide vertical movement to the output sections C1 to C6, D1 to D6. Also, motors M1, M2, M4, M5, Md1, Md2, Md4, Md5 and plunger mechanisms P1, P2, P4, P5, Pd1, Pd2, Pd4, and Pd5 are omitted from the illustration.

By stacking the third units vertically to increase the output, more blocks can be operated. In addition to the output unit, the third unit disposed at the top requires a space through which the axis of the plunger for the bottom unit passes. In Variation 2, the cam or link position of the plunger mechanism for converting the rotation of the motors of the upper and lower third units to vertical movement is arranged with the inner and outer circumferential portions above the concentric circles, as shown in FIG. 18. , By placing the angles of the upper and lower third units (180 ° / number of installation points, for example, 30 ° in the third unit of 6 outputs), the space through which the axis of the plunger output part penetrates may be secured. As a result, in the two-layer stacking layer, it is possible to cope with an output unit of about 12 points. In addition, space may be secured by reducing the output unit of the upper unit by one to three places.

In the embodiment, the rotational point of the motor in the third unit is six points on the circumference of the vertical movement by the cam or link. In the second unit, it develops from an operating point on the circumference of six points to an operating circle on six concentric circles. In the first unit, each component of the die-sized rectangular block is connected from the operating circle on the concentric circle. In the modified example 1, the four-point motion points arranged in the vertical direction in the second unit are developed to the motion circle on the four-ply concentric circles. In the first unit, each component of the die-sized rectangular block is connected from the operating circle on the concentric circle. In Modification 2, a maximum of 12 operating points of the third unit are arranged. By disassembling and pushing up to a maximum of 12 steps, 6 steps, or 4 steps, it is possible to share parts and processes for dies of a plurality of sizes.

Further, in the embodiment and the modified example, it is possible to provide a push mechanism that can be freely set in both the push direction and the pull direction by implementing a push stroke in which each end is not affected by each other (no interference occurs). . That is, design is easy because each stage is independent and is made of a combination that does not interfere with each other. In addition, you can freely select the height of pushing up / down and the timing.

Since the concentric structure of the upper surface of the pushing jig can be common, the exchange of varieties by die size is completed by replacing the varieties switching parts (first unit). The design of varieties conversion parts becomes easy. It is possible to quickly design a variety conversion part, so it is possible to suppress delivery / price. Common use of parts is also in progress. In addition, it is possible to shorten the time required for conversion of varieties.

In the above, although the invention made by the present inventors has been specifically described based on Examples and Modifications, the present invention is not limited to the above Examples and Modifications, and of course various changes are possible.

For example, in the embodiment, the vertical movement of the plunger mechanism is performed using a motor, but the forward and backward movements of an axis such as an air cylinder may be converted to vertical movement using a flat cam without using a motor.

In addition, when a large output or stroke is required, the size of the cam or link becomes large, so that even if it is not accommodated in a predetermined space, it is possible to reduce the output per unit of the third unit and respond by stacking the same.

In addition, the plunger mechanism for raising the block of the second unit from the output of the third unit may have a structure in which a wire-shaped core moves forward and backward within the flexible guide, such as the release of a camera shutter. In this case, the arrangement of the driving parts of the plunger cam, such as a motor or an air cylinder, can be installed at a spaced apart position, so that the degree of freedom of placement is improved.

In addition, although 12, 6, or 4 examples of the number of the plurality of blocks of the first unit have been described, three or more blocks may be used. Although the number of the plurality of blocks in the second unit has been described for 12, 6, or 4 examples, the number of blocks in the first unit may be the same. Although 12 or 6 examples of the number of the plurality of drive outputs of the third unit have been described, it is sufficient that the number of the plurality of blocks of the second unit is the same.

In addition, although the plurality of blocks of the first unit has been described as having concentric square shapes, the square blocks may be arranged in parallel.

Further, in the embodiment, the pickup target die and the peripheral die are adsorbed / released at the same timing, but the pickup target die and the peripheral die may be adsorbed / released at each timing. Thereby, more reliable peeling can be performed.

Further, in the embodiment, the blocks of each stage are sequentially pushed up, but since each stage can independently perform separate operations, the operations in both directions of push / pull may be mixed.

Further, in the embodiment, an example in which the die is pushed up by using a block in the first unit is described, but a pin (needle) may be used instead of the block.

In addition, although the example using the die attach film was demonstrated in the Example, it is not necessary to use the die attach film by providing a preform part for applying an adhesive to the substrate.

In addition, although the die bonder which picks up a die from a die supply part with a pick-up head and loads it on an intermediate stage and bonds the die loaded on the intermediate stage to a board | substrate with a bonding head was demonstrated in embodiment, it is not limited to this. It is applicable to a semiconductor manufacturing apparatus for picking up a die from a die supply section.

For example, it is applicable to a die bonder that bonds the die of the die supply to the substrate with a bonding head, without an intermediate stage and a pickup head.

Further, without an intermediate stage, it is applicable to a flip chip bonder that picks up a die from the die supplying part, rotates the die pickup head upwards, transfers the die to the bonding head, and bonds the substrate with the bonding head.

In addition, it is applicable to a die sorter that loads a die picked up from a die supply section to a pickup head without a middle stage and a bonding head, or the like on a tray.

1: die supply
11: Wafer
13: pushing unit
13a: first unit
13a1: block
13a2: adsorption section
13a3: suction part
13a4: suction part
A1 to A6: concentric square-shaped block
13b: second unit
B1 to B6: concentric block
13c: 3rd unit
13c0: center
13c1 to 13c6: periphery
C1 to C6: output unit
16: dicing tape
2: pickup section
21: pickup head
3: Middle stage section
31: intermediate stage
4: bonding
41: bonding head
7: Control
10: die bonder
D: die
P: Substrate

Claims (14)

A semiconductor manufacturing apparatus,
A pushing unit for pushing the die from the bottom of the dicing tape,
Collet adsorbing the die
Equipped with,
The pushing unit,
A first unit having a plurality of blocks of a rectangular shape in contact with the dicing tape,
A second unit having a plurality of blocks for transmitting the vertical movement independently to each of the plurality of blocks,
A third unit having a plurality of drive outputs that independently give up and down movement to each of the plurality of blocks of the second unit
Equipped with,
The first unit is mounted on top of the second unit,
The second unit and the third unit are common parts regardless of varieties, and the first unit is replaceable for each varieties, a semiconductor manufacturing apparatus. According to claim 1,
The first unit converts the vertical movement of the plurality of blocks into the vertical movement of the plurality of blocks of the square shape, the semiconductor manufacturing apparatus. According to claim 1,
The first unit,
A first adsorption unit for adsorbing the outer peripheral die of the die to the outside of the plurality of blocks,
A second adsorption unit composed of a gap between the plurality of blocks adsorbing the die
Further comprising, a semiconductor manufacturing apparatus. According to claim 3,
The first adsorption unit and the second adsorption unit are capable of independently setting the adsorption timing, a semiconductor manufacturing apparatus. According to claim 4,
The number of the plurality of blocks of the first unit is three or more, a semiconductor manufacturing apparatus. According to claim 1,
A semiconductor manufacturing apparatus, wherein the plurality of square-shaped blocks are configured in a concentric shape. According to claim 1,
The first unit is provided with a plurality of needles arranged in a square shape instead of the plurality of blocks of the square shape, the semiconductor manufacturing apparatus. According to claim 1,
The die further comprises a die attach film between the die and the dicing tape. According to claim 1,
And a pickup head on which the collet is mounted. The method of claim 9,
An intermediate stage for loading the die picked up by the pickup head,
A bonding head that bonds the die loaded on the intermediate stage onto a substrate or an already bonded die.
Further comprising, a semiconductor manufacturing apparatus. A method for manufacturing a semiconductor device,
(a) a process for preparing the semiconductor manufacturing apparatus according to any one of items 1 to 10,
(b) preparing a wafer ring holding a dicing tape with a die,
(c) a process for preparing a substrate,
(d) process of picking up the die by the collet by pushing up the die by the pushing unit
A method of manufacturing a semiconductor device comprising: The method of claim 11,
(e) A method of manufacturing a semiconductor device, further comprising a step of bonding the die onto a substrate or a die that is already bonded. The method of claim 12,
The step (d) further includes a step of loading the picked-up die on an intermediate stage,
The step (e) further includes a step of picking up the die from the intermediate stage, a method for manufacturing a semiconductor device. The method of claim 11,
The step (d) further includes a step of mixing and pushing / unloading operations in both directions to produce a semiconductor device.

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