KR102656718B1 - Die ejecting apparatus - Google Patents

Abstract

A die ejecting device is disclosed. The device is configured in a telescopic form and includes a plurality of ejector members for separating dies on the dicing tape, vacuum holes for vacuum suction of the dicing tape and in close contact with the lower surface of the dicing tape, and It includes a hood having an opening through which the ejector members pass, and a plurality of vertical driving units respectively connected to the ejector members and moving the ejector members in a vertical direction.

Description

Die ejecting device {DIE EJECTING APPARATUS}

Embodiments of the present invention relate to die ejecting devices. More specifically, it relates to a die ejecting device that separates the dies from the dicing tape of a framed wafer in order to bond the dies on a substrate such as a printed circuit board or lead frame in a semiconductor manufacturing process.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and the dies may be bonded to the substrate through a bonding process.

The device for performing the die bonding process may include a pickup module for picking up and separating the dies from the wafer divided into the dies and a bonding module for attaching the picked up dies to the substrate. The pickup module includes a stage unit supporting the wafer, a die ejecting device installed to be movable in the vertical direction to selectively separate the die from the wafer supported on the stage unit, and the die being picked up from the wafer and placed on the substrate. It may include a pickup unit for attachment.

The die ejector includes a hood in which vacuum holes are formed to adsorb the lower surface of the dicing tape, is disposed within the hood, and is configured to move in a vertical direction through an upper part of the hood, and is configured to move the die on the dicing tape. It may include an ejector unit that elevates the die to separate it from the dicing tape. As an example, Korean Patent Publication Nos. 10-1585316 and 10-1627906 disclose a die ejecting device including a plurality of ejector members arranged in a telescopic manner.

In particular, support members having a plate shape, for example, a circular disk shape, may be connected to lower portions of the ejector members, and elastic members may be disposed between the support members. The elastic members may be used to cause the ejector members to rise in order from the outside to the inside when the ejector members are raised. That is, when the ejector members are raised, the outermost ejector member among the ejector members raises the die first, and then rises inward in order to sequentially raise the die.

In the case of the multi-stage die ejector as described above, the rising height of the ejector members may be different from the preset height due to the elastic members. That is, it is very difficult to maintain a constant distance between the ejector members due to the elastic members, and it is also inconvenient to replace the hood and the ejector members depending on the size of the die to be picked up. Additionally, even when using a plurality of ejector pins differently from the above, there is the inconvenience of having to adjust the number and position of the ejector pins according to the size of the die.

Republic of Korea Patent Publication No. 10-1585316 (registration date: January 7, 2016) Republic of Korea Patent Publication No. 10-1627906 (registration date: May 31, 2016)

The purpose of embodiments of the present invention is to provide a die ejecting device that does not require replacement of the hood and ejector members depending on the size of the die and can adjust the rising height of the ejector members depending on the size of the die.

According to some embodiments of the present invention, the die ejecting device is configured in a telescopic form and includes a plurality of ejector members for separating the die on the dicing tape, and is in close contact with the lower surface of the dicing tape and the die It may include a hood having vacuum holes for vacuum-adsorbing the thinning tape and openings through which the ejector members pass, and a plurality of vertical driving units respectively connected to the ejector members and moving the ejector members in a vertical direction. there is.

According to some embodiments of the present invention, it may further include support members connected to lower portions of each of the ejector members, and the vertical driving units may each include drive shafts coupled to the support members and extending in the vertical direction. You can.

According to some embodiments of the present invention, the die ejecting device may further include an ejector body coupled to the hood and having a tube shape with a closed lower portion, and the drive shaft penetrates the lower part of the ejector body and moves downward. can be extended.

According to some embodiments of the present invention, the ejector body may be connected to a vacuum pump.

According to some embodiments of the present invention, the support members may have a disk shape surrounding a lower portion of each of the ejector members.

According to some embodiments of the present invention, the support members have a cantilever shape connected to one lower side of each of the ejector members and may extend in different directions for coupling with the drive shafts.

According to some embodiments of the present invention, the hood may include an upper panel in which the vacuum holes and the opening are formed, and a tube-shaped hood housing coupled to the upper panel, and the support members may include the hood. It may be placed within a housing.

According to some embodiments of the present invention, permanent magnets for coupling to the drive shafts may be built into each of the support members.

According to some embodiments of the present invention, the ejector members may each have a tube shape with open upper and lower ends.

According to some embodiments of the present invention, the vertical driving units may raise at least one ejector member among the ejector members depending on the size of the die.

According to some embodiments of the present invention, the vertical driving units may gradually raise the ejector members higher from the outermost ejector member toward the innermost ejector member.

According to the embodiments of the present invention as described above, the die ejecting device includes a plurality of ejector members configured in a telescopic shape, and a plurality of vertical driving units for selectively elevating the ejector members according to the size of the die. may include. Accordingly, there is no need to replace the ejector members and the hood even if the size of the die changes. In addition, since the ejector members are each connected to the vertical driving units, the rising height of the ejector members can be more easily adjusted compared to the prior art, and thus pickup defects of the die can be greatly reduced.

1 is a schematic configuration diagram for explaining a die bonding device including a die ejecting device according to an embodiment of the present invention.
FIG. 2 is a schematic plan view for explaining the die ejecting device shown in FIG. 1.
Figure 3 is a cross-sectional view taken along line III-III' shown in Figure 2.
FIG. 4 is a cross-sectional view for explaining each of the ejector members and support members shown in FIG. 3.
Figure 5 is a plan view for explaining each of the ejector members and support members shown in Figure 3.
Figure 6 is a plan view for explaining another example of the ejector members and support members shown in Figures 4 and 5.
FIG. 7 is a plan view for explaining each of the ejector members and support members shown in FIG. 6.
FIGS. 8 to 11 are schematic diagrams for explaining the operation of the die ejecting device shown in FIG. 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather are provided to fully convey the scope of the present invention to those skilled in the art.

In embodiments of the present invention, when one element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed between them. It could be. Alternatively, if one element is described as being placed directly on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. won't

Technical terms used in the embodiments of the present invention are merely used for the purpose of describing specific embodiments and are not intended to limit the present invention. Additionally, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning that can be understood by a person skilled in the art. The above terms, as defined in common dictionaries, will be construed to have meanings consistent with their meanings in the context of the relevant art and description of the invention, and unless explicitly defined, ideally or excessively by superficial intuition. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, for example changes in manufacturing methods and/or tolerances, are fully to be expected. Accordingly, the embodiments of the present invention are not intended to be described as limited to the specific shapes of the regions illustrated but are intended to include deviations in the shapes, and the elements depicted in the drawings are entirely schematic and represent their shapes. is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the present invention.

FIG. 1 is a schematic configuration diagram for explaining a die bonding device including a die ejecting device according to an embodiment of the present invention, and FIG. 2 is a schematic plan view for explaining the die ejecting device shown in FIG. 1. , and FIG. 3 is a cross-sectional view obtained along the line III-III` shown in FIG. 2.

1 to 3, the die ejecting device 100 according to an embodiment of the present invention may be used to pick up the semiconductor die 12 in a die bonding process for manufacturing a semiconductor device.

As shown in FIG. 1, the device for performing the die bonding process includes a stage unit 20 supporting a wafer 10 made of a plurality of dies 12 individualized by a dicing process, and the wafer ( A die ejecting device 100 for selectively separating dies 12 from 10), a picker 30 for picking up the dies 12 separated by the die ejecting device 100, and It may include a picker driver 40 for moving the picker 30.

The wafer 10 may be attached to a dicing tape 14, and the dicing tape 14 may be mounted on a mount frame 16 that has a substantially circular ring shape. The stage unit 20 includes a wafer stage 22 configured to be movable in the horizontal direction, and a support ring 24 disposed on the wafer stage 22 to support the edge portion of the dicing tape 14. and an expansion ring 26 for expanding the dicing tape 14 by lowering the mount frame 16.

The picker 30 may be placed on top of the wafer 10 supported by the stage unit 20 and may be mounted on the picker driver 40. The picker driving unit 40 can move the picker 30 in horizontal and vertical directions to pick up the die 12 separated from the dicing tape 14 by the die ejecting device 100. .

Additionally, a vision unit 50 may be placed on the wafer 10 supported by the stage unit 20 to confirm the positions of the dies 12. The vision unit 50 may acquire an image of the die 12 to be picked up and obtain the position coordinates of the die 12 from the acquired die image.

The die ejecting device 100 may be disposed below the dicing tape 14 supported by the stage unit 20. For example, the die ejecting device 100 and the vision unit 50 may be arranged to face each other in a vertical direction, and the stage unit 20 may be connected to the die ejecting device 100 and the vision unit. (50) It may be configured to be movable in the horizontal direction by a stage driver (not shown).

Additionally, although not shown, the die 12 picked up by the picker 30 may be transferred onto a die stage (not shown) and then picked up by a bonding unit (not shown) and then placed on a substrate (not shown). ) can be bonded on.

According to one embodiment of the present invention, the die ejecting device 100 is configured in a telescopic form, as shown, and includes a plurality of ejector members for separating the dies 12 on the dicing tape 14. s (102, 104, 106), vacuum holes (122) in close contact with the lower surface of the dicing tape (14) and for vacuum suction of the dicing tape (14), and the ejector members (102, 104) , 106) is connected to a hood 120 having an opening 124 through which the ejector members 102, 104, and 106 move, respectively, in the vertical direction. It may include a plurality of vertical driving units 142, 144, and 146 to do this.

FIG. 4 is a cross-sectional view for explaining each of the ejector members and support members shown in FIG. 3, and FIG. 5 is a plan view for explaining each of the ejector members and support members shown in FIG. 3.

Referring to FIGS. 4 and 5 , the die ejecting device 100 may include support members 112, 114, and 116 connected to lower portions of each of the ejector members 102, 104, and 106. For example, each of the ejector members 102, 104, and 106 may have a tube shape with open upper and lower ends, and the support members 112, 114, and 116 may be connected to the ejector members 102, 104, and 106. It may have a disk shape configured to surround each lower part.

As shown, the die ejecting device 100 includes a first ejector member 102 disposed on the outermost side, a third ejector member 106 disposed on the innermost side, and the first and third ejectors. It may include a second ejector member 104 disposed between the members 102 and 106. In addition, the die ejecting device 100 includes a first support member 112 provided below the first ejector member 102, and a second support member provided below the second ejector member 104. It may include a member 114 and a third support member 116 provided below the third ejector member 106. In addition, the die ejecting device 100 includes a first vertical driver 142 connected to the first support member 112, and a second vertical driver 144 connected to the second support member 114. and a third vertical driving unit 146 connected to the third support member 116. However, the number of the ejector members 102, 104, 106, the support members 112, 114, 116, and the vertical driving units 142, 144, 146 can be changed in various ways, so the scope of the present invention is not limited thereby. won't

The vertical driving units 142, 144, and 146 may include drive shafts 150 that are respectively coupled to the support members 112, 114, and 116 and extend in the vertical direction. At this time, the drive shaft 150 of the first vertical drive unit 142 may pass through the second and third support members 114 and 116 and be coupled to the first support member 112, and the second The drive shaft 150 of the vertical drive unit 144 may pass through the third support member 116 and be connected to the second support member 114. That is, as shown, the second support member 114 may be provided with one through hole 119A through which the drive shaft of the first vertical drive unit 142 passes, and the third support member 114 may be provided with two through holes 119B and 119C through which the drive shafts 150 of the first and second vertical driving units 142 and 144 pass. At this time, a permanent magnet 118 for coupling to the drive shafts 150 may be built into each of the support members 112, 114, and 116.

FIG. 6 is a plan view for explaining another example of the ejector members and support members shown in FIGS. 4 and 5, and FIG. 7 is a plan view for explaining each of the ejector members and support members shown in FIG. 6.

Referring to FIG. 6, the die ejecting device 100 may include support members 112A, 114A, and 116A connected to one lower side of each of the ejector members 102, 104, and 106. The support members 112A, 114A, and 116A may have a cantilever shape extending in different directions for coupling to the drive shafts 150.

Referring again to FIGS. 2 and 3, the hood 120 has an upper panel 126 on which the vacuum holes 122 and the opening 124 are formed, and a tube shape coupled to the upper panel 126. may include a hood housing 128, and the support members 112, 114, and 116 may be disposed within the hood housing 128. Additionally, the die ejecting device 100 may include an ejector body 130 in the form of a tube coupled to the hood 120.

For example, the hood 120 may have the shape of a circular cap, and the ejector body 130 may have the shape of a circular tube with an open top and a closed bottom. The hood 120 may be coupled to the upper part of the ejector body 130. As an example, as shown, corresponding step portions may be provided at the lower part of the hood 120 and the upper part of the ejector body 130, and the ejector body 130 is located at the lower part of the hood 120. The upper part can be inserted.

The drive shafts 150 may extend downwardly through the lower portion 132 of the ejector body 130. In particular, the ejector body 130 may be connected to a vacuum pump 134, and vacuum may be provided to the internal space of the ejector body 130 and the hood 120 from the vacuum pump 134. As a result, vacuum pressure can be applied to the lower surface of the dicing tape 14 through the vacuum holes 122 of the hood 120 and the ejector members 102, 104, and 106, and thus The dicing tape 14 may be adsorbed to the upper surface of the hood 120. As described above, the ejector members 102, 104, and 106 may be raised while the dicing tape 14 is adsorbed to the upper surface of the hood 120, and accordingly, the die 12 may be It can be separated from the singe tape 14.

Meanwhile, the vertical driving units 142, 144, and 146 include a linear motion guide 152 for guiding the driving shaft 150 extending below the ejector body 130 in the vertical direction, and the driving shaft 150. It may each include a motor 154, a ball screw 156, and a ball nut 158 for vertical movement. However, since the detailed configuration of the vertical driving units 142, 144, and 146 as described above can be changed in various ways, the scope of the present invention will not be limited thereby.

FIGS. 8 to 11 are schematic diagrams for explaining the operation of the die ejecting device shown in FIG. 3.

8 to 11, the die ejecting device 100 can selectively elevate the ejector members 102, 104, and 106 depending on the size of the die 12. For example, as shown in FIGS. 8 to 10, the vertical driving units 142, 144, and 146 are at least one of the ejector members 102, 104, and 106 depending on the size of the die 12. The ejector member can be raised.

Unlike the above, as shown in FIG. 11, the vertical driving units 142, 144, and 146 move from the outermost first ejector member 102 toward the innermost third ejector member 106. The die ejector members 102, 104, and 106 can be raised higher in stages, and through this, the die 12 with a relatively large area can be effectively separated from the dicing tape 14.

According to the embodiments of the present invention as described above, the die ejecting device 100 includes a plurality of ejector members 102, 104, and 106 configured in a telescope shape, and the ejector members 102 and 104. , 106 may include a plurality of vertical driving units 142, 144, and 146 for selectively raising the die 12 according to the size of the die 12. Therefore, even if the size of the die 12 changes, there is no need to replace the ejector members 102, 104, and 106 and the hood 120. In addition, since the ejector members 102, 104, and 106 are connected to the vertical driving units 142, 144, and 146, respectively, the rising height of the ejector members 102, 104, and 106 can be seen compared to the prior art. It can be easily adjusted, and thus pickup defects of the die 12 can be greatly reduced.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to understand that it exists.

10: wafer 12: die
14: Dicing Tape 16: Mount Frame
20: Stage unit 100: Die ejecting device
102: first ejector member 104: second ejector member
106: Third ejector member 112: First support member
114: second support member 116: third support member
118: permanent magnet 120: hood
122: vacuum hole 124: opening
126: upper panel 128: hood housing
130: Ejector body 134: Vacuum pump
142: first vertical driving unit 144: second vertical driving unit
146: third vertical driving unit 150; driving axle
152: Linear motion guide 154: Motor
156: ball screw 158: ball nut

Claims (12)

A plurality of ejector members configured in a telescopic shape to separate dies on the dicing tape;
a hood that is in close contact with the lower surface of the dicing tape and has vacuum holes for vacuum suction of the dicing tape and an opening through which the ejector members pass;
a plurality of vertical driving units respectively connected to the ejector members and configured to move the ejector members in a vertical direction; and
Includes support members connected to the lower portion of each of the ejector members,
The vertical driving units each include drive shafts that are coupled to the support members and extend in a vertical direction,
A die ejecting device, characterized in that each of the support members has a permanent magnet built into it for coupling to the drive shafts. delete The method of claim 1, further comprising an ejector body coupled to the hood and having a tube shape with a closed lower portion,
A die ejecting device wherein the drive shafts extend downwardly through a lower portion of the ejector body. The die ejecting device according to claim 3, wherein the ejector body is connected to a vacuum pump. The die ejecting device according to claim 1, wherein the support members have a disk shape surrounding a lower portion of each of the ejector members. The die ejecting device of claim 1, wherein the support members have a cantilever shape connected to one lower side of each of the ejector members and extend in different directions for coupling with the drive shafts. The method of claim 1, wherein the hood is:
an upper panel in which the vacuum holes and the opening are formed; and
It includes a tube-shaped hood housing coupled to the upper panel,
A die ejecting device, characterized in that the support members are disposed within the hood housing. delete The die ejecting device according to claim 1, wherein the ejector members each have a tube shape with open upper and lower ends. The die ejecting device of claim 1, wherein the vertical driving units elevate at least one of the ejector members according to the size of the die. The die ejecting device of claim 1, wherein the vertical driving units gradually raise the ejector members higher from the outermost ejector member toward the innermost ejector member. a die ejector for separating a die attached to a dicing tape from the dicing tape; and
It includes a bonding unit for bonding the die separated from the dicing tape onto the substrate,
The die ejector is,
A plurality of ejector members configured in a telescopic shape to separate the die from the dicing tape,
a hood that is in close contact with the lower surface of the dicing tape and has vacuum holes for vacuum suction of the dicing tape and an opening through which the ejector members pass;
a plurality of vertical driving units respectively connected to the ejector members and configured to move the ejector members in a vertical direction;
Includes support members connected to the lower portion of each of the ejector members,
The vertical driving units each include drive shafts that are coupled to the support members and extend in a vertical direction,
A die bonding device, characterized in that each of the support members is equipped with a permanent magnet for coupling to the drive shafts.

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