KR102617784B1 - Die ejector and die bonding apparatus including the same - Google Patents

Abstract

A die ejector and a die bonding device including the same are disclosed. The die ejector includes a hood disposed below the dicing tape, an ejector unit configured to be raised and lowered through the hood to separate a die attached to the dicing tape from the dicing tape, and below the ejector unit. It is disposed and includes an ejector driving unit for elevating the ejector unit, and a stopper member disposed below the ejector unit to limit downward movement of the ejector unit. The ejector unit includes a plurality of ejector members that extend in a lifting direction and are configured in a telescope shape, and the ejector members are simultaneously raised by the ejector drive unit and then moved from the outside to the inside by the ejector drive unit and the stopper member. It is configured to descend sequentially.

Description

Die ejector and die bonding device including same {DIE EJECTOR AND DIE BONDING APPARATUS INCLUDING THE SAME}

Embodiments of the present invention relate to a die ejector and a die bonding device including the same. More specifically, it relates to a die ejector for separating dies from a dicing tape in order to bond the dies on a substrate such as a printed circuit board or lead frame in a semiconductor manufacturing process, and a die bonding device including the same.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and the dies may be bonded to the substrate through a bonding process.

The die bonding device for performing the die bonding process may include a die pickup module for picking up and separating the dies from the wafer divided into the dies and a die bonding module for attaching the picked up dies to the substrate. . The die pickup module may include a stage unit supporting the wafer, a die ejector for separating a die to be picked up from the wafer supported on the stage unit, and a vacuum picker for picking up the die from the wafer.

The die ejector includes a hood in which vacuum holes are formed to adsorb the lower surface of the dicing tape to which the dies are attached, and the dicing tape is disposed within the hood and movable in a vertical direction through the upper part of the hood. It may include an ejector unit that elevates the upper die to separate it from the dicing tape. As an example, Republic of Korea Patent Publication No. 10-2009922 discloses a die ejector including a plurality of ejector members arranged in a telescopic manner.

In particular, support members having a plate shape, for example, a circular disk shape, may be provided below each of the ejector members, and elastic members may be disposed between the support members. The elastic members may be used to cause the ejector members to rise in order from the outside to the inside when the ejector members are raised. That is, when the ejector members are raised, the outermost ejector member among the ejector members raises the die first, and then rises inward in order to sequentially raise the die. However, when the rise proceeds from the outer ejector member to the inner ejector member as described above, the die may be lifted excessively and there is a risk that the die may be damaged during the rise process.

Republic of Korea Patent Publication No. 10-2009922 (registration date: August 6, 2019)

The purpose of embodiments of the present invention is to provide a die ejector that can prevent the die from being damaged in the process of separating the die from the dicing tape and a die bonding device including the same.

A die ejector according to an aspect of the present invention for achieving the above object includes a hood disposed below the dicing tape, and a die attached to the dicing tape that is lifted and lowered through the hood to separate the die from the dicing tape. It may include an ejector unit configured to enable, an ejector drive unit disposed below the ejector unit for elevating the ejector unit, and a stopper member disposed below the ejector unit to limit downward movement of the ejector unit. there is. In particular, the ejector unit includes a plurality of ejector members that extend in the lifting direction and are configured in a telescope shape, and the ejector members are simultaneously raised by the ejector drive unit and then moved from the outside to the inside by the ejector drive unit and the stopper member. It may be configured to sequentially descend in one direction.

According to some embodiments of the present invention, the ejector unit is provided between a plurality of flanges, respectively, provided at lower portions of the ejector members and disposed in the lifting direction, and the flanges other than the uppermost flange among the flanges. It includes at least one elastic member disposed, a lifting head disposed below the lowest flange among the flanges, and a connection member connecting the uppermost flange and the lifting head, and the ejector drive unit is coupled to the lifting head. You can.

According to some embodiments of the present invention, the ejector unit has at least one remaining flange excluding the uppermost flange and the lowermost flange among the flanges at least to limit the height raised by the at least one elastic member. It may further include one second stopper member.

According to some embodiments of the present invention, the die ejector may further include a stopper driving unit that elevates the stopper member to adjust the height of the stopper member after the ejector members are raised by the ejector driving unit. .

A die ejector according to another aspect of the present invention for achieving the above object includes a hood in close contact with the lower surface of the dicing tape, and the hood for separating the die attached to the dicing tape from the dicing tape. A plurality of ejector members configured in a telescope shape that can be raised and lowered through and extending in the lifting direction, a plurality of flanges provided at lower portions of the ejector members and disposed in the lifting direction of the ejector members, and A plurality of elastic members disposed between the flanges except the uppermost flange among the flanges, a lifting head disposed below the lowermost flange among the flanges, and a plurality of elastic members disposed between the flanges except the uppermost flange, and a A plurality of connection pins connecting the flange and the lifting head, an ejector drive unit coupled to the lifting head and lifting the ejector members, and a stopper member disposed below the lowermost flange to limit downward movement of the lowermost flange. And, the ejector members may include a stopper driver that elevates the stopper member to adjust the height of the stopper member after the ejector members are raised by the ejector driver.

According to some embodiments of the present invention, the hood has an opening into which the ejector members are inserted, and the ejector members can be inserted into the opening so that the upper surfaces of the ejector members have the same height as the upper surface of the hood. there is.

According to some embodiments of the present invention, the ejector members may be simultaneously raised by the ejector driving unit.

According to some embodiments of the present invention, the elastic members may have elastic forces that gradually increase downward so that the ejector members other than the innermost ejector member among the ejector members are sequentially lowered from the outside to the inside.

According to some embodiments of the present invention, the ejector driving unit may include a first driving shaft coupled to the lifting head and extending downward, and a first driving unit for lifting the first driving shaft.

According to some embodiments of the present invention, the stopper driving unit may include a second driving shaft coupled to the stopper member and extending downward, and a second driving unit for lifting and lowering the second driving shaft.

According to some embodiments of the present invention, the second drive shaft may have a tube shape surrounding the first drive shaft.

According to some embodiments of the present invention, the die ejector is disposed between the first drive shaft and the second drive shaft and may further include a first guide member for guiding the first drive shaft in the lifting direction. .

According to some embodiments of the present invention, the die ejector may further include an ejector body having a tube shape that is coupled to the lower part of the hood and surrounds the second drive shaft.

According to some embodiments of the present invention, the die ejector may further include a second guide member disposed between the second drive shaft and the ejector body and for guiding the second drive shaft in the lifting direction.

According to some embodiments of the present invention, the first drive unit includes a first cam member for lifting and lowering the first drive shaft, a first motor for rotating the first cam member, and It may include a first bracket mounted on the lower part, and a first cam follower mounted on the first bracket and disposed on the first cam member.

According to some embodiments of the present invention, the die ejector may further include a third guide member for guiding the first bracket in the lifting direction.

According to some embodiments of the present invention, the second drive unit includes a second cam member for lifting and lowering the second drive shaft, a second motor for rotating the second cam member, and the second drive shaft. It may include a second bracket mounted on the lower part, and a second cam follower mounted on the second bracket and disposed on the second cam member.

According to some embodiments of the present invention, the first bracket includes a connection block coupled to the lower end of the first drive shaft, a pair of extension parts extending downward from the connection block, and lower ends of the extension parts. and a mounting portion that connects the first cam follower to each other, and the second cam follower may be disposed between the extension portions.

According to some embodiments of the present invention, the hood has a circular tube and a hood main body coupled to the ejector main body, and a vacuum hole for vacuum suction of the lower surface of the dicing tape and coupled to the upper part of the hood main body. It may include a cover having a cover, and a third stopper member that protrudes from the inner surface of the hood body and restricts downward movement of the ejector unit.

A die bonding device according to another aspect of the present invention for achieving the above object includes a die ejector for separating a die attached to a dicing tape from the dicing tape, and a die separated by the die ejector. It may include a die bonding module for bonding on the substrate. At this time, the die ejector includes a hood disposed below the dicing tape, an ejector unit configured to be raised and lowered through the hood to separate the die from the dicing tape, and disposed below the ejector unit. It includes an ejector driving unit for elevating the ejector unit, and a stopper member disposed below the ejector unit to limit downward movement of the ejector unit, wherein the ejector unit extends in the ejector unit and has a plurality of telescopic shapes. The ejector members may be configured to be simultaneously raised by the ejector drive unit and then sequentially lowered from the outside to the inside by the ejector drive unit and the stopper member.

According to the embodiments of the present invention as described above, after the ejector members are raised, the ejector members may be sequentially lowered in an inward direction from the outermost ejector member. Therefore, the rising height of the die can be reduced compared to a conventional die ejector in which the ejector members rise from the outside to the inside, and accordingly, the die is damaged by the ejector members during the pick-up process of the die. This can be sufficiently resolved. In particular, after the ejector members and the flanges rise, the stopper member can limit the descending height of the ejector members, and accordingly, the rising height of the ejector members can be set variously according to the size of the die, which By using this, die pickup for various types of dies can be performed more efficiently.

1 is a schematic plan view for explaining a die bonding device according to an embodiment of the present invention.
FIG. 2 is a schematic front view for explaining the die pickup module shown in FIG. 1.
FIG. 3 is a schematic cross-sectional view for explaining the die ejector shown in FIG. 2.
FIG. 4 is a schematic cross-sectional view for explaining the ejector driving unit and the stopper driving unit shown in FIG. 3.
FIG. 5 is a schematic side view for explaining the ejector driving unit and the stopper driving unit shown in FIG. 4.
FIG. 6 is a schematic front view for explaining the first driving unit shown in FIG. 4.
FIG. 7 is a schematic side view for explaining the first driving unit shown in FIG. 4.
FIG. 8 is a schematic front view for explaining the second driving unit shown in FIG. 4.
FIG. 9 is a schematic side view for explaining the second driving unit shown in FIG. 4.
FIG. 10 is a schematic rear view illustrating the third guide member shown in FIG. 5.
FIGS. 11 to 17 are schematic cross-sectional views for explaining the operation of the die ejector shown in FIGS. 3 and 4.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather are provided to fully convey the scope of the present invention to those skilled in the art.

In embodiments of the present invention, when one element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed between them. It could be. Alternatively, if one element is described as being placed directly on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. won't

Technical terms used in the embodiments of the present invention are merely used for the purpose of describing specific embodiments and are not intended to limit the present invention. Additionally, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning that can be understood by a person skilled in the art. The above terms, as defined in common dictionaries, will be construed to have meanings consistent with their meanings in the context of the relevant art and description of the invention, and unless explicitly defined, ideally or excessively by superficial intuition. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, for example changes in manufacturing methods and/or tolerances, are fully to be expected. Accordingly, the embodiments of the present invention are not intended to be described as limited to the specific shapes of the regions illustrated but are intended to include deviations in the shapes, and the elements depicted in the drawings are entirely schematic and represent their shapes. is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the present invention.

FIG. 1 is a schematic plan view illustrating a die bonding device according to an embodiment of the present invention, and FIG. 2 is a schematic front view illustrating the die pickup module shown in FIG. 1 .

Referring to FIGS. 1 and 2, the die bonding device 10 according to an embodiment of the present invention is used to bond individual dies 22 through a dicing process in a semiconductor device manufacturing process to a lead frame, a printed circuit board, It can be used for bonding on the substrate 30, etc.

The die bonding device 10 includes a die pick-up module 300 for picking up a die 22 from a wafer 20 including the dies 22, and the die picked up by the die pick-up module 300. It may include a die bonding module 400 for bonding the die 22 to the substrate 30 . As an example, the die pickup module 300 may pick up the die 22 and transfer it onto the die stage 310, and the die bonding module 400 may pick up the die 22 on the die stage 310. ) can be picked up and bonded on the substrate 30.

The wafer 20 may include a dicing tape 24 to which the dies 22 are attached, and a mount frame 26 having a substantially circular ring shape on which the dicing tape 24 is mounted. As an example, the dicing tape 24 may be attached to the lower surface of the mount frame 26, and the dies 22 may be attached to the upper surface of the dicing tape 24. there is.

The die pickup module 300 may include a wafer stage 320 for supporting the wafer 20. On the wafer stage 320, there is a support ring 322 for supporting the dicing tape 24, a clamp 324 for holding the mount frame 26, and the clamp 324 is held in a vertical direction. A clamp driving unit 326 for movement may be disposed. Specifically, as shown, the support ring 322 can support the dicing tape 24 between the dies 22 and the mount frame 26, and the clamp driver 326 The dicing tape 24 can be expanded by lowering the clamp held by the mount frame 26.

A die ejector 100 may be disposed below the dicing tape 24 supported by the support ring 322 to selectively separate the dies 22 from the dicing tape 24. . The die ejector 100 can vacuum adsorb the lower surface of the dicing tape 24 and lift the die 22 to be picked up among the dies 22, thereby removing the die 22 from the dicing tape 24. It may include an ejector unit 110 that separates from (24).

The die pickup module 300 is disposed on the upper part of the wafer stage 320 and includes a vacuum picker 330 for picking up the die 22 separated from the dicing tape 24 by the die ejector 100. ) and a picker driver 332 for moving the vacuum picker 330 in vertical and horizontal directions. As an example, although not shown, the vacuum picker 330 may include a collet (not shown) in which a vacuum hole is formed for vacuum suction of the die 22. The die stage 310 may be arranged to be spaced apart from the wafer stage 320 in the horizontal direction, and the die 22 picked up by the vacuum picker 330 is picked up by the picker driver 332. It may be transferred onto the stage 310. Additionally, a camera unit 340 may be disposed on the upper part of the wafer stage 330 to detect a die 22 to be picked up among the dies 22 .

Although not shown, the die bonding device 10 may include a stage driver (not shown) for moving the wafer stage 320 in the horizontal direction. The stage driver may adjust the position of the wafer stage 320 so that the die 22 to be picked up among the dies 22 is located on the die ejector 100.

In addition, as shown in FIG. 1, the die bonding device 10 includes a cassette load port 42 where a cassette 40 for storing the wafer 20 is placed, and a cassette load port 42 for storing the wafer 20. It may include a wafer transfer unit 44 for transferring the wafer 20 from the cassette 40 onto the wafer stage 320, and wafer guide rails 46 for guiding the transfer of the wafer 20. Specifically, the stage driver may move the wafer stage 320 to be adjacent to the ends of the wafer guide rails 46, and then the wafer transfer unit 44 may move the wafer 20 to the cassette ( 40) can be moved onto the wafer stage 320. Although not shown in detail, the wafer transfer unit 44 may include a gripper for gripping the mount frame 26 and a gripper driving unit for moving the gripper in the horizontal direction.

The die bonding module 400 may pick up the die 22 transferred onto the die stage 310 and bond it to the substrate 30 . As an example, the die bonding module 400 includes a bonding head 410 for picking up the die 22, a head driver 412 for moving the bonding head 410 in vertical and horizontal directions, and , may include a substrate stage 420 to support the substrate 30. Although not shown, the bonding head 410 has a vacuum hole for vacuum suction of the die 22 and includes a bonding tool (not shown) to press the die 22 on the substrate 30. The substrate stage 420 may include a heater (not shown) for heating the substrate 30 to a preset bonding temperature.

The substrate 30 may be supplied from the first magazine 50 and may be stored in the second magazine 60 after the die bonding process is completed. As an example, the die bonding device 10 includes a first magazine handling unit 52 for handling the first magazine 50 and a second magazine handling unit for handling the second magazine 60. (62) may be included. In addition, the die bonding device 10 includes a first magazine load port 54 on which the first magazine 50 is placed, a second magazine load port 64 on which the second magazine 60 is placed, A first magazine transfer unit 56 that transfers the first magazine 50 between the first magazine load port 54 and the first magazine handling unit 52, and the second magazine load port 64 It may include a second magazine transfer unit 66 that transfers the second magazine 60 between the second magazine handling unit 62 and the second magazine handling unit 62.

In addition, the die bonding device 10 transfers the substrate 30 from the first magazine 50 onto the substrate stage 420 and adjusts the position of the substrate 30 on the substrate stage 420. And may include a substrate transfer unit 70 for transferring the substrate 30 to the second magazine 60 after the die bonding process is completed. The substrate transfer unit 70 includes substrate guide rails 72 for guiding the transfer of the substrate 30, grippers 74 for gripping the substrate 30, and the grippers 74 ), gripper driving units 76 for moving the substrate 30 on the substrate guide rails 72, and a first pusher 78 for moving the substrate 30 onto the substrate guide rails 72. It may include a second pusher 80 for moving the inside of the second magazine 60 on the fields 72.

FIG. 3 is a schematic cross-sectional view for explaining the die ejector shown in FIG. 2, FIG. 4 is a schematic cross-sectional view for explaining the ejector driving unit and the stopper driving unit shown in FIG. 3, and FIG. 5 is a schematic cross-sectional view for explaining the die ejector shown in FIG. 4. This is a schematic side view to explain the driving part and the stopper driving part.

3 to 5, the die ejector 100 may be disposed below the dicing tape 24 supported on the wafer stage 320. According to one embodiment of the present invention, the die ejector 100 includes a hood 110 in close contact with the lower surface of the dicing tape 24, and is disposed within the hood 110 and attaches the dicing tape 24 ) may include an ejector unit 120 configured to be raised and lowered through the hood 110 in order to separate the die 22 attached therefrom from the dicing tape 24.

The ejector unit 120 may include a plurality of ejector members 122 that extend in the lifting direction and are configured in a telescopic shape. For example, the ejector members 122 may have a square tube shape extending in the vertical direction and arranged in a telescopic shape. For example, the ejector unit 120 includes a first ejector member 122A, a second ejector member 122B, a third ejector member 122C, and a fourth ejector member 122D from the outside to the inside. It can be included. The hood 110 may have an opening 112A into which the ejector members 122 are inserted and a plurality of vacuum holes 112B for vacuum suction of the lower surface of the dicing tape 24.

The die ejector 100 is disposed below the ejector unit 120 and includes an ejector drive unit 140 for vertically elevating the ejector unit 120, and is disposed below the ejector unit 120. It may include a stopper member 165 to limit downward movement of the ejector unit 120. In particular, according to one embodiment of the present invention, the ejector members 122 can be simultaneously raised by the ejector drive unit 140, and then moved to the outside by the ejector drive unit 140 and the stopper member 165. It can be sequentially lowered in the medial direction.

The ejector unit 120 includes a plurality of flanges 124 provided at lower portions of the ejector members 122 and disposed in the vertical direction, that is, the elevating direction, and an uppermost flange among the flanges 124. Elastic members 126 disposed between the remaining flanges (124B, 124C, and 124D) except for (124A), and an elevating head 128 disposed below the lowest flange (124D) among the flanges (124), It may include connecting members 130 connecting the uppermost flange 124A and the lifting head 128. As an example, coil springs may be used as the elastic members 126, and connection pins may be used as the connecting members 130.

The flanges 124 may have a disk shape, and as an example, the ejector unit 120 includes a first flange 124A connected to the lower part of the first ejector member 122A, as shown. , a second flange 124B connected to the lower part of the second ejector member 122B, a third flange 124C connected to a lower part of the third ejector member 122C, and the fourth ejector member 122D. It may include a fourth flange (124D) connected to the lower part of. As shown, four ejector members 122 and four flanges 124 are used, but the number of ejector members 122 and the flanges 124 can be varied, and accordingly, the The scope of the present invention will not be limited by the number of ejector members 122 and the flanges 124.

The connecting pins 130 may be used to connect between the uppermost flange 124A and the lifting head 128. As shown, the lower portions of the connecting pins 130 may pass through the remaining flanges 124B, 124C, and 124D except for the uppermost flange 124A and be coupled to the lifting head 128 by bolting, The upper portions of the connecting pins 130 may be mounted on the uppermost flange 124A by fastening members 132, for example, bolts.

The ejector unit 120 includes the uppermost flange 124A and the lowermost flange 124D among the flanges 124, for example, the remaining flanges except the first flange 124A and the fourth flange 124D ( 124B, 124C), for example, the second flange 124B and the third flange 124C include second stopper members 134 to limit the height raised by the elastic members 126. can do. As an example, a plurality of bolts may be used as the second stopper members 134, and the second stopper members 134 include the remaining flanges except the uppermost flange 124A and the lowermost flange 124D ( It may pass through 124B and 124C and be fastened to the flanges 124C and 124D disposed below the remaining flanges 124B and 124C. That is, as shown, the second stopper members 134 pass through the second flange 124B and the third flange 124C and are fastened to the third flange 124C and the fourth flange 124D. You can. In particular, the second flange 124B and the third flange 124C may be provided with grooves into which the heads of the bolts are inserted. It may be formed deeper than the head height of the bolts so that it does not protrude upward.

The ejector driving unit 140 may be disposed below the ejector unit 120 and may be coupled to the lower part of the lifting head 128. As an example, the lifting head 128 may have a disk shape, and the lowermost flange 124D may be disposed on the lifting head 128. The ejector driving unit 140 may raise the lifting head 128, and accordingly, the lowermost flange 124D may be raised by the ejector driving unit 140. In addition, the uppermost flange (124A) can be raised simultaneously with the lowermost flange (124D) by the connecting pins 130, and the uppermost flange (124A) and the lowermost flange (124D) by the elastic members 126. ), the remaining flanges (124B, 124C) may be raised simultaneously with the uppermost flange (124A) and the lowermost flange (124D). For example, the second flange 124B and the third flange 124C may be raised simultaneously with the first flange 124A and the fourth flange 124D. As a result, the ejector members 122 connected to the flanges 124 can be simultaneously raised by the ejector driving unit 140.

The height of the uppermost flange 124A may be determined by the length of the connecting pins 130. In addition, the spacing between the remaining flanges 124B, 124C, and 124D except for the uppermost flange 124A can be kept constant by the elastic members 126 and the second stopper members 134. At this time, it is preferable that the spacing between the flanges 124 is the same.

The ejector drive unit 140 may include a first drive shaft 144 that is coupled to the lifting head 128 and extends downward, and a first drive unit 150 for lifting the first drive shaft 144. You can. For example, a disk-shaped driving head 142 may be coupled to the upper end of the first driving shaft 144, and the lifting head 128 may be coupled to the upper surface of the driving head 142. In particular, an electromagnet 146 may be disposed below the driving head 142 to surround the upper part of the first driving shaft 144, and the electromagnet 146 moves the lifting head 128 to the driving head ( 142) can provide electromagnetic force for coupling to the upper surface of the device. As another example, permanent magnets (not shown) may be used to couple the lifting head 128 to the driving head 142. In this case, the permanent magnets may be disposed within the driving head 142.

According to one embodiment of the present invention, the die ejector 100 uses the stopper to adjust the height of the stopper member 165 after the ejector members 122 are raised by the ejector driving unit 140. It may include a stopper driving unit 170 that elevates the member 165. After the ejector members 122 are simultaneously raised by the ejector driver 140, the stopper driver 170 may raise the stopper member 165 to a preset height. Subsequently, the ejector driver 140 may lower the ejector unit 120. After the lowermost flange (124D), i.e., the fourth flange (124D), is placed on the stopper member 165, the uppermost flange (124A), i.e., the first flange (124A), is lowered by the connecting pins 130. and then the second and third flanges 124B and 124C can be lowered. At this time, the elastic members 126 may have elastic forces that gradually increase downward.

For example, the first elastic members 126A disposed between the second flange 124B and the third flange 124C are disposed between the third flange 124C and the fourth flange 124D. It may have a smaller elastic force than the second elastic members 126B. As a result, after the first flange 124A begins to descend, the second flange 124B and the third flange 124C may sequentially descend. As a result, the remaining ejector members 122A, 122B, and 122C, excluding the innermost ejector member 122D, may be sequentially lowered from the outside to the inside. That is, the first ejector member 122A connected to the first flange 124A, the second ejector member 122B connected to the second flange 124B, and the third flange connected to the third flange 124C. 3 The ejector members 122C may be sequentially lowered.

The stopper member 165 may have a circular tube shape surrounding the lifting head 128 and the driving head 142, and the stopper driving unit 170 is coupled to the stopper member 165 and extends downward. It may include a second drive shaft 174 that lifts and lowers the second drive shaft 174 and a second drive unit 180 that moves the second drive shaft 174 up and down. For example, a disk-shaped stopper head 172 may be coupled to the upper end of the second drive shaft 174, and the stopper member 165 may include a plurality of fastening members on the upper surface of the stopper head 172. (176), for example, may be mounted by a plurality of bolts.

According to one embodiment of the present invention, the second drive shaft 174 may have a circular tube shape surrounding the first drive shaft 144, and is located between the first drive shaft 144 and the second drive shaft 174. A first guide member 148 may be disposed to guide the first drive shaft 144 in the lifting direction, that is, in the vertical direction. For example, a first linear ball bush may be disposed between the first drive shaft 144 and the second drive shaft 174.

Meanwhile, the hood 110 includes a disk-shaped cover 112 in which the opening 112A and the vacuum holes 112B are formed, and a hood body 114 in the form of a circular tube coupled to the cover 112. can do. Additionally, the die ejector 100 may include an ejector body 200 in the form of a circular tube coupled to the lower part of the hood 110, that is, the lower part of the hood main body 114. For example, the ejector body 200 may include a middle tube 202 and a lower tube 204, and the first drive shaft 144 and the second drive shaft 174 may be connected to the ejector body 200. It can be extended downward through . At this time, the intermediate tube 202 may be equipped with permanent magnets 206 for coupling between the hood 110 and the ejector body 200. Meanwhile, in the above example, the ejector body 200 includes a middle tube 202 and a lower tube 204, but differently, the ejector body 200 may be formed as an integrated piece.

According to one embodiment of the present invention, the second drive shaft 174 is between the second drive shaft 174 and the ejector body 200, especially between the second drive shaft 174 and the lower tube 204. A second guide member 178 may be disposed to guide the lifting direction, that is, the vertical direction. For example, a second linear ball bush may be disposed between the second drive shaft 174 and the ejector body 200.

The first drive unit 150 includes a first cam member 152 for lifting and lowering the first drive shaft 144, and a first motor 154 for rotating the first cam member 152, A first bracket 156 mounted on the lower part of the first drive shaft 144, and a first cam follower in the form of a roller mounted on the first bracket 156 and disposed on the first cam member 152 ( 158) may be included. The second drive unit 180 includes a second cam member 182 for lifting and lowering the second drive shaft 174, a second motor 184 for rotating the second cam member 182, and A second bracket 186 mounted on the lower part of the second drive shaft 174, and a second cam follower 188 in the form of a roller mounted on the second bracket 186 and disposed on the second cam member 182. ) may include.

The die ejector 100 may include the ejector body 200 and a base bracket 230 on which the first driving unit 150 and the second driving unit 180 are mounted. The base bracket 230 may include a horizontal bracket 232 on which the ejector body 200 is mounted and a vertical bracket 234 on which the first and second motors 154 and 184 are mounted.

FIG. 6 is a schematic front view for explaining the first driving unit shown in FIG. 4, and FIG. 7 is a schematic side view for explaining the first driving unit shown in FIG. 4. FIG. 8 is a schematic front view for explaining the second driving unit shown in FIG. 4, and FIG. 9 is a schematic side view for explaining the second driving unit shown in FIG. 4. FIG. 10 is a schematic rear view illustrating the third guide member shown in FIG. 5.

6 to 9, as an example, the first bracket 156 includes a connection block 156A coupled to the lower end of the first drive shaft 144, and a connection block 156A connected downward from the connection block 156A. It may include a pair of extending extension parts 156B and a mounting part 156C that connects lower ends of the extension parts 156B and on which the first cam follower 158 is mounted. As an example, the second bracket 186 includes a circular tube-shaped connecting member 186A coupled to the lower end of the second drive shaft 174, and a pair extending downward from the connecting member 186A. It may include connecting rods 186B and a roller block 186C coupled to lower ends of the connecting rods 186B and on which the second cam follower 188 is mounted.

The second cam member 182 and the second cam follower 188 may be disposed between the extension portions 156B of the first bracket 156. In particular, the second cam follower 188 may be guided in the vertical direction by the inner surfaces of the extension portions 156B of the first bracket 156, thereby driving the second drive shaft. Rotation of (174) can be prevented. That is, the extension portions 156B of the first bracket 156 may function as a guide member that guides the stopper member 165 and the second drive shaft 174 in the vertical direction.

According to one embodiment of the present invention, the die ejector 100 may include a third guide member 208 for guiding the first bracket 156 in the vertical direction. For example, as shown in FIGS. 5 and 10, the third guide member 208 is positioned at the lower part of the ejector body 200, that is, the lower tube, so as to be in close contact with the side portions of the first bracket 156. It may include a pair of guide rollers 210 mounted on the lower end of 204. In particular, the guide rollers 210 may be in close contact with each of the side portions of the extension portions 156B of the first bracket 156, thereby preventing rotation of the first bracket 156. there is. As a result, rotation of the ejector unit 120 and the first drive shaft 144 can be prevented by the guide rollers 210.

Referring again to FIGS. 3 to 5, between the first guide member 148 and the first bracket 156, there is a spacer for bringing the first cam follower 158 into close contact with the first cam member 152. A second elastic member 160 may be disposed between the second guide member 178 and the second bracket 186, and the second cam follower 188 may be placed on the second cam member 182. A third elastic member 190 may be disposed for close contact. As an example, coil springs may be used as the second elastic member 160 and the third elastic member 190, respectively.

The hood 110 is configured to protrude from the inner surface of the hood main body 114 and may include a third stopper member 116 to limit downward movement of the ejector unit 120. As an example, a snap ring may be used as the third stopper member 116. The snap ring 116 may be mounted on the inner side of the hood body 114, and the ejector unit 110 may be placed on top of the snap ring 116. The third stopper member 116 connects the hood 110 and the ejector unit 120 to the ejector driver 140 and the ejector body ( 200) can be used to separate simultaneously. At this time, the power supply to the electromagnet 146 may be cut off, and thus the hood 110 and the ejector unit 120 can be easily separated from the ejector driver 140 and the ejector body 200. You can.

Vacuum pressure for vacuum suction of the lower surface of the dicing tape 24 may be provided inside the hood 110 and the ejector body 200. As an example, the lower tube 204 may be connected to a vacuum source 220, such as a vacuum pump or a vacuum ejector, and a second device for providing vacuum pressure inside the hood 110 and the middle tube 202. A vacuum hole (204A) may be provided. In addition, as shown in FIG. 3, between the hood 110 and the middle tube 202, between the middle tube 202 and the lower tube 204, and between the lower tube 204 and the second drive shaft Sealing members to prevent vacuum leakage may be disposed between 174 and between the stopper head 172 and the first drive shaft 144.

In addition, vacuum pressure for vacuum adsorption of the lower surface of the dicing tape 24 may be provided inside the innermost ejector member 122D, that is, the fourth ejector member 122D, among the ejector members 122. there is. For example, the ejector unit 120 may be provided with an extension portion 124E in the form of a circular tube extending downward from the lowermost flange 124, and the inside of the extension portion 124E is the innermost ejector. It may be connected to the inside of the member 122D. The lifting head 128 may have a first through hole 128A into which the extension part 124E is inserted. The first drive shaft 144 may have a circular tube shape, and a connection block between a vacuum source 222 for providing the vacuum pressure, for example, a vacuum pump or a vacuum ejector, and the first bracket 156 ( 156A). For this purpose, the connection block 156A of the first bracket 156 may be provided with a third vacuum hole 156D. The driving head 142 coupled to the lifting head 128 may be provided with a second through hole 142A for connecting the innermost ejector member 122D and the first driving shaft 144, The vacuum pressure is applied to the innermost ejector member ( 122D) may be provided inside.

In particular, the ejector members 122 are inserted into the opening 112A so that the upper surfaces of the ejector members 122 have the same height as the upper surface of the hood 110, that is, the upper surface of the cover 112. It can be. Accordingly, the dicing tape 24 creates a vacuum on the hood 110 and the ejector members 122 by the vacuum pressure provided through the vacuum holes 112B and the innermost ejector member 122D. may be adsorbed.

According to one embodiment of the present invention, compressed air for expanding the dicing tape 22 may be supplied to the interior of the innermost ejector member 122D. As an example, a compressed air source 224 for supplying the compressed air, for example, an air tank storing compressed air, is connected to the first drive shaft 144 through the connection block 156A of the first bracket 156. ) can be connected to. In addition, as shown in FIG. 3, in order to prevent leakage of the compressed air, between the lifting head 128 and the driving head 142 and the inner surface of the first through hole 128A and the extension ( 124E), a sealing member may be disposed between each.

FIGS. 11 to 17 are schematic cross-sectional views for explaining the operation of the die ejector shown in FIGS. 3 and 4.

Referring to FIG. 11, the ejector members 122 and the flanges 144 can be raised simultaneously by the ejector driving unit 140, whereby the ejector members 122 of the hood 110 It may protrude upward from the upper surface. Accordingly, although not shown, the die 22 on the ejector members 122 may rise together, and as a result, the edge portion of the die 22 may be separated from the dicing tape 24. . In particular, the rising height of the ejector members 122 can be finely adjusted to prevent damage to the die 22. For example, the rising height of the ejector members 122 may be adjusted between approximately tens of micrometers and hundreds of micrometers, and may be adjusted according to the size of the die 22 to prevent damage to the die 22. It can be.

Subsequently, as shown in FIG. 12, the stopper member 165 may be raised by the stopper driving unit 170. For example, the stopper driving unit 170 may raise the stopper member 165 so that the stopper member 165 comes into close contact with the lower surface of the lowermost flange 124D. However, since the height of the stopper member 165 can be changed in various ways, the scope of the present invention will not be limited by the rising height of the stopper member 165. In addition, in the above, the stopper member 165 is raised after the ejector unit 120 is raised, but the ejector unit 120 and the stopper member 165 may be raised simultaneously.

Referring to FIG. 13, after the stopper member 165 is stopped, the ejector driver 140 may lower the ejector unit 120. That is, the lifting head 128 can be lowered by the ejector driving unit 140 while the innermost ejector member 122D and the lowermost flange 124D are supported by the stopper member 165, As a result, the uppermost flange 124A and the outermost ejector member 122A connected to the lifting head 128 by the connecting pins 130 can be lowered. Subsequently, as shown in FIGS. 14 and 15, the second ejector member 122B connected to the second flange 124B and the third ejector member 122C connected to the third flange 124C are sequentially lowered. It can be. As a result, the dicing tape 24 may be separated from the die 22 in an inward direction from the edge of the die 22.

Referring to FIG. 16, after the remaining ejector members 122A, 122B, and 122C except for the innermost ejector member 122D are lowered as described above, the die 22 is moved by the innermost ejector member 122D. It can be supported, and the dicing tape 24 can be separated from the die 22 by vacuum pressure provided inside the hood 110 and the innermost ejector member 122D. Subsequently, as shown in FIG. 17, compressed air may be supplied to the inside of the innermost ejector member 122D from the compressed air source 224, whereby the dicing tape 24 is supplied with the compressed air. It can be expanded upward. As a result, the die 22 can be sufficiently separated from the dicing tape 24 and then picked up by the vacuum picker 330 and transferred onto the die stage 310.

According to the embodiments of the present invention as described above, after the ejector members 122 are raised, the ejector members 122 may be sequentially lowered in an inward direction from the outermost ejector member 122A. Therefore, compared to a conventional die ejector in which the ejector members rise from the outside to the inside, the rising height of the die 22 can be reduced, and accordingly, during the pickup process of the die 22, the ejector members 122 ), the problem of the die 22 being damaged can be sufficiently solved. In particular, after the ejector members 122 and the flanges 124 rise, the stopper member 165 may limit the descending height of the ejector members 122, and thus the die 22 The rising height of the ejector members 122 can be set in various ways depending on the size, and using this, die pickup for various types of dies 22 can be performed more efficiently.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to understand that it exists.

10: die bonding device 20: wafer
22: Die 24: Dicing Tape
30: substrate 40: cassette
50: 1st magazine 60: 2nd magazine
100: die ejector 110: hood
112: Cover 112A: Opening
112B: Vacuum hole 114: Hood body
120: Ejector unit 122: Ejector member
124: Flange 126: Elastic member
128: lifting head 130: connection pin
140: Ejector driving unit 142: Driving head
144: first drive shaft 146: electromagnet
148: first guide member 150: first driving unit
152: first cam member 154: first motor
156: first bracket 158: first cam follower
160: second elastic member 165: stopper member
170: stopper driving unit 172: stopper head
174: second drive shaft 178: second guide member
180: second driving unit 182: second cam member
184: second motor 186: second bracket
188: second cam follower 190: third elastic member
200: Ejector body 202: Middle tube
204: lower tube 300: die pickup module
310: die stage 320: wafer stage
330: Vacuum picker 400: Die bonding module
410: bonding head 420: substrate stage

Claims (20)

A hood placed under the dicing tape;
an ejector unit configured to be raised and lowered through the hood to separate a die attached to the dicing tape from the dicing tape;
an ejector drive unit disposed below the ejector unit and configured to elevate and lower the ejector unit;
a stopper member disposed below the ejector unit to limit downward movement of the ejector unit; and
After the ejector unit is raised by the ejector driver, it includes a stopper driver that raises and lowers the stopper member to adjust the height of the stopper member,
The ejector unit includes a plurality of ejector members that extend in a lifting direction and are configured in a telescope shape, and the ejector members are raised by the ejector drive unit and then sequentially moved from the outside to the inside by the ejector drive unit and the stopper member. A die ejector, characterized in that it is configured to descend. The method of claim 1, wherein the ejector unit,
a plurality of flanges provided at lower portions of each of the ejector members and disposed in the elevating direction;
At least one elastic member disposed between the flanges other than the uppermost flange,
A lifting head disposed below the lowest flange of the flanges,
It includes a connecting member connecting the uppermost flange and the lifting head,
A die ejector, wherein the ejector driving unit is coupled to the lifting head. The method of claim 2, wherein the ejector unit,
Among the flanges, at least one remaining flange excluding the uppermost flange and the lowermost flange further includes at least one second stopper member for limiting the height raised by the at least one elastic member. Ejector. delete A hood fitted tightly on the lower surface of the dicing tape;
a plurality of ejector members configured in a telescope shape that can be raised and lowered through the hood and extend in a lifting direction to separate the die attached on the dicing tape from the dicing tape;
a plurality of flanges provided at lower portions of each of the ejector members and disposed in an elevating direction of the ejector members;
a plurality of elastic members disposed between the flanges except the uppermost flange;
A lifting head disposed below the lowest flange of the flanges;
A plurality of connection pins connecting the uppermost flange and the lifting head by penetrating the remaining flanges except the uppermost flange among the flanges;
an ejector driving unit coupled to the lifting head and lifting the ejector members;
a stopper member disposed below the lowermost flange to limit downward movement of the lowermost flange; and
A die ejector comprising a stopper driving unit that lifts the stopper member to adjust the height of the stopper member after the ejector members are raised by the ejector driving unit. The method of claim 5, wherein the hood has an opening into which the ejector members are inserted,
The die ejector, wherein the ejector members are inserted into the opening so that the upper surfaces of the ejector members have the same height as the upper surface of the hood. The die ejector according to claim 5, wherein the ejector members are simultaneously raised by the ejector driving unit. The die ejector according to claim 7, wherein the elastic members have elastic forces that gradually increase downward so that the ejector members other than the innermost ejector member are sequentially lowered from the outside to the inside. The method of claim 5, wherein the ejector driving unit,
a first drive shaft coupled to the lifting head and extending downward;
A die ejector comprising a first drive unit for lifting and lowering the first drive shaft. The method of claim 9, wherein the stopper driving unit,
a second drive shaft coupled to the stopper member and extending downward;
A die ejector comprising a second drive unit for lifting and lowering the second drive shaft. The die ejector of claim 10, wherein the second drive shaft has a tube shape surrounding the first drive shaft. The die ejector of claim 11, further comprising a first guide member disposed between the first drive shaft and the second drive shaft and guiding the first drive shaft in the lifting direction. The die ejector of claim 11, further comprising an ejector body coupled to a lower portion of the hood and having a tube shape surrounding the second drive shaft. The die ejector of claim 13, further comprising a second guide member disposed between the second drive shaft and the ejector body and guiding the second drive shaft in the lifting direction. 14. The method of claim 13, wherein the first driving unit is:
a first cam member for lifting and lowering the first drive shaft;
a first motor for rotating the first cam member;
A first bracket mounted on the lower part of the first drive shaft,
A die ejector comprising a first cam follower mounted on the first bracket and disposed on the first cam member. The die ejector according to claim 15, further comprising a third guide member for guiding the first bracket in the lifting direction. The method of claim 15, wherein the second driving unit,
a second cam member for elevating the second drive shaft;
a second motor for rotating the second cam member;
a second bracket mounted on the lower part of the second drive shaft;
A die ejector comprising a second cam follower mounted on the second bracket and disposed on the second cam member. The method of claim 17, wherein the first bracket is:
A connection block coupled to the lower end of the first drive shaft,
a pair of extension parts extending downward from the connection block,
It connects the lower ends of the extension parts to each other and includes a mounting part on which the first cam follower is mounted,
A die ejector, characterized in that the second cam follower is disposed between the extension parts. The method of claim 13, wherein the hood is:
A hood body having a circular tube and coupled to the ejector body,
A cover coupled to the upper part of the hood main body and having vacuum holes for vacuum suction of the lower surface of the dicing tape;
A die ejector that protrudes from the inner surface of the hood body and includes a third stopper member to limit downward movement of the lowermost flange. a die ejector for separating a die attached to a dicing tape from the dicing tape; and
A die bonding module for bonding the die separated by the die ejector to a substrate,
The die ejector is,
A hood disposed below the dicing tape,
an ejector unit configured to be raised and lowered through the hood to separate the die from the dicing tape;
an ejector drive unit disposed below the ejector unit and configured to elevate and lower the ejector unit;
a stopper member disposed below the ejector unit to limit downward movement of the ejector unit;
After the ejector unit is raised by the ejector driver, it includes a stopper driver that raises and lowers the stopper member to adjust the height of the stopper member,
The ejector unit includes a plurality of ejector members that extend in a lifting direction and are configured in a telescope shape, and the ejector members are raised by the ejector drive unit and then sequentially moved from the outside to the inside by the ejector drive unit and the stopper member. A die bonding device characterized in that it is configured to be lowered.

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