CN113921453A

CN113921453A - Bare chip ejector and bare chip bonding device comprising same

Info

Publication number: CN113921453A
Application number: CN202110771020.9A
Authority: CN
Inventors: 李喜澈; 郑炳浩; 郑然赫
Original assignee: Semes Co Ltd
Current assignee: Semes Co Ltd
Priority date: 2020-07-09
Filing date: 2021-07-07
Publication date: 2022-01-11
Also published as: KR102617784B1; TW202207342A; KR20220006828A; TWI779702B

Abstract

The invention discloses a bare chip ejector and a bare chip bonding device comprising the bare chip ejector. The die ejector includes a hood disposed below a dicing tape, an ejector unit configured to be raised through the hood to separate a die attached to the dicing tape from the dicing tape, an ejector drive configured to lift the ejector unit, and a stopper member disposed below the ejector unit and configured to restrict downward movement of the ejector unit. The ejector unit includes a plurality of ejector members extending in a lifting direction and having a telescopic structure, the ejector members being simultaneously lifted by the ejector driving part and then sequentially lowered from outside to inside by the ejector driving part and the stopper member.

Description

Bare chip ejector and bare chip bonding device comprising same

Technical Field

The invention relates to a bare chip ejector and a bare chip bonding device comprising the same. More particularly, the present invention relates to a die ejector for separating a die from a dicing tape in a die bonding process and a die bonding apparatus including the die ejector.

Background

In general, a semiconductor device can be formed on a silicon wafer serving as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor device formed as described above may be individualized by a dicing process and may be bonded to a substrate by a die bonding process.

The die attach apparatus includes a die pick module for picking up a die from a wafer divided into a plurality of dies by a dicing process, and a die attach module for attaching the die to a substrate such as a printed circuit board or a lead frame. The die pick module may include a stage unit for supporting a dicing tape to which the wafer is attached, a die ejector for separating the die from the dicing tape, and a vacuum picker for picking up the die from the dicing tape.

The die ejector may include a hood having a vacuum hole for vacuum-sucking a lower surface of the dicing tape, and an ejector unit disposed in the hood and configured to be movable in a vertical direction through an upper portion of the hood. Specifically, the ejector unit can lift the bare chip to separate the bare chip on the dicing tape from the dicing tape. For example, korean patent No.10-2009922 discloses a die ejector including a plurality of ejector members arranged in a telescopic manner.

Specifically, support members having a plate shape (e.g., a disk shape) may be respectively provided at lower end portions of the ejector members, and an elastic member may be provided between the support members. When the ejector member is lifted by the ejector driving part, the ejector member may be sequentially lifted from the outside to the inside by the elastic member. However, when the ejector member is sequentially lifted from the outside to the inside, the bare chip may be excessively lifted, which may cause damage to the bare chip.

Disclosure of Invention

The embodiment of the invention provides a bare chip ejector capable of separating a bare chip from a cutting belt and preventing the bare chip from being damaged and a bare chip bonding device comprising the bare chip ejector.

According to aspects of the invention, a die ejector may include a hood disposed below a dicing tape; an ejector unit configured to be raised through the hood to separate the bare die attached on the dicing tape from the dicing tape; an ejector driving part configured to lift the ejector unit; and a stopper member disposed below the ejector unit and configured to limit downward movement of the ejector unit. Specifically, the ejector unit may include a plurality of ejector members extending in the elevation direction and configured to have a telescopic structure, and the ejector members may be configured to be simultaneously lifted by the ejector driving part and then sequentially lowered from the outside to the inside by the ejector driving part and the stopper member.

According to some embodiments of the present invention, the ejector unit further includes a plurality of flanges which are respectively provided at lower end portions of the ejector members and arranged in a rising direction of the ejector members; at least one elastic member disposed between remaining ones of the flanges except for an uppermost flange; a lifting head disposed below a lowermost one of the flanges; and a connecting member connecting the uppermost flange and the lift head. In this case, the ejector driving part may be connected to the lifting head.

According to some embodiments of the present invention, the ejector unit may further include at least one second stopper member that limits a height at which at least one remaining one of the flanges other than the uppermost flange and the lowermost flange is lifted by the at least one elastic member.

According to some embodiments of the invention, the die ejector may further include a stopper driving part that raises the stopper member to adjust a height of the stopper member after the ejector driving part raises the ejector member.

According to another aspect of the invention, a die ejector may include a cap disposed in contact with a lower surface of a dicing tape; a plurality of ejector members configured to be raised through the hood so as to separate the bare chip attached to the upper surface of the dicing tape from the dicing tape, and having a telescopic structure extending in a raising direction; a plurality of flanges provided at lower end portions of the ejector members, respectively, and arranged in a rising direction of the ejector members; a plurality of elastic members disposed between remaining ones of the flanges except for an uppermost flange; a lifting head disposed below a lowermost one of the flanges; a plurality of connection pins passing through the remaining flanges except the uppermost flange among the flanges and connecting the uppermost flange and the lift head; an ejector driving part connected to the lift head and configured to lift the ejector member; a stop member disposed below the lowermost flange and configured to limit downward movement of the lowermost flange; and a stopper driving part which raises the stopper member to adjust a height of the stopper member after the ejector driving part raises the ejector member.

According to some embodiments of the invention, the cap may have an opening into which the ejector member is inserted, and the ejector member is inserted into the opening such that an upper surface of the ejector member is flush with an upper surface of the cap.

According to some embodiments of the invention, the ejector members may be simultaneously lifted by the ejector drive.

According to some embodiments of the present invention, the elastic member may have an elastic force gradually increasing downward such that the remaining ejector members except for the innermost ejector member among the ejector members are sequentially lowered from the outside to the inside.

According to some embodiments of the present invention, the ejector driving part may include a first driving shaft connected to the lift head and extending downward; and a first driving unit configured to lift the first driving shaft.

According to some embodiments of the present invention, the stopper driving part may include a second driving shaft connected to the stopper member and extending downward; and a second driving unit configured to lift the second driving shaft.

According to some embodiments of the invention, the second drive shaft may have a tubular shape surrounding the first drive shaft.

According to some embodiments of the present invention, the ejector driving part may further include a first guide member disposed between the first driving shaft and the second driving shaft and configured to guide the first driving shaft in the elevation direction.

According to some embodiments of the present invention, the die ejector may further comprise an ejector body connected with a lower portion of the hood and having a tubular shape surrounding the second drive shaft.

According to some embodiments of the present invention, the stopper driving part may further include a second guide member disposed between the second driving shaft and the ejector body and configured to guide the second driving shaft in the elevation direction.

According to some embodiments of the invention, the first drive unit may comprise a first cam member for raising the first drive shaft; a first motor for rotating the first cam member; a first bracket installed on a lower portion of the first driving shaft; and a first cam follower mounted on the first bracket and disposed on the first cam member.

According to some embodiments of the present invention, the ejector driving part may further include a third guide member configured to guide the first bracket in the lifting direction.

According to some embodiments of the invention, the second drive unit may comprise a second cam member for raising the second drive shaft; a second motor for rotating the second cam member; a second bracket mounted on a lower portion of the second driving shaft; and a second cam follower mounted on the second bracket and provided on the second cam member.

According to some embodiments of the present invention, the first bracket may include a connection block coupled to a lower portion of the first driving shaft; a pair of extension portions extending downward from the connection block; and a mounting portion which connects lower ends of the extension portions to each other and on which the first cam follower is mounted. In this case, the second cam member and the second cam follower may be disposed between the extension portions.

According to some embodiments of the present invention, the cap may include a cap body having a circular tube shape and coupled with the ejector body; a cover coupled with an upper portion of the cover main body and having a vacuum hole for vacuum-adsorbing a lower surface of the dicing tape; and a third stopper member protruding from an inner surface of the cover main body to prevent the flange from being separated from the cover main body.

According to another aspect of the invention, a die bonder may include a die ejector for separating a die attached to a dicing tape from the dicing tape; and a die attach module for attaching the die separated by the die ejector to the substrate. In this case, the die ejector may include a hood disposed below the dicing tape; an ejector unit configured to be raised through the hood to separate the die from the dicing tape; an ejector driving part configured to lift the ejector unit; and a stopper member provided below the ejector unit and configured to limit downward movement of the ejector unit. Specifically, the ejector unit may include a plurality of ejector members extending in the elevation direction and configured to have a telescopic structure, and the ejector members may be configured to be simultaneously lifted by the ejector driving part and then sequentially lowered from the outside to the inside by the ejector driving part and the stopper members.

The above summary of the present invention is not intended to describe each illustrated embodiment or every implementation of the present invention. The detailed description and claims that follow more particularly exemplify these embodiments.

Drawings

Embodiments of the invention may be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which:

fig. 1 is a schematic plan view of a die attach apparatus according to an embodiment of the present invention;

fig. 2 is a schematic front view of the die pick-up module shown in fig. 1;

fig. 3 is a schematic cross-sectional view of the die ejector shown in fig. 2;

fig. 4 is a schematic cross-sectional view of an ejector drive and a stop drive of the die ejector shown in fig. 2;

fig. 5 is a schematic side view of the ejector drive and stop drive as shown in fig. 4;

fig. 6 is a schematic front view of the first drive unit shown in fig. 4;

FIG. 7 is a schematic side view of the first drive unit shown in FIG. 4;

fig. 8 is a schematic front view of the second drive unit shown in fig. 4;

FIG. 9 is a schematic side view of the second drive unit shown in FIG. 4;

FIG. 10 is a schematic rear view of the third guide member shown in FIG. 5; and

fig. 11-17 are schematic cross-sectional views illustrating operation of the die ejector shown in fig. 3 and 4.

While various embodiments are amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the claimed invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the claims.

Detailed Description

Hereinafter, embodiments of the present invention are described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, and the present invention may be embodied in various other forms. The following examples are not provided to fully complete the present invention but to fully convey the scope of the invention to those skilled in the art.

In the specification, when a component is referred to as being on or connected to another component or layer, it may be directly on or connected to the other component or layer or intervening components or layers may also be present. In contrast, it will be understood that when an element is referred to as being directly on or directly connected to another element or layer, it can mean that there are no intervening elements present. Also, although terms such as first, second, and third are used to describe various regions and layers in various embodiments of the present invention, the regions and layers are not limited by these terms.

The terminology used below is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In addition, unless otherwise defined herein, all terms including technical or scientific terms may have the same meaning as commonly understood by one of ordinary skill in the art.

Embodiments of the present invention have been described with reference to schematic illustrations of idealized embodiments. Accordingly, variations in manufacturing methods and/or tolerances may be expected from the form of the drawings. Thus, embodiments of the invention are not described as limited to the particular forms or regions in the drawings, but are to include deviations in forms. These regions may be purely schematic and their form may not depict or depict the exact form or structure in any given region and is not intended to limit the scope of the invention.

Fig. 1 is a schematic plan view of a die attach apparatus according to an embodiment of the present invention, and fig. 2 is a schematic front view of a die pick-up module as shown in fig. 1.

Referring to fig. 1 and 2, according to an embodiment of the present invention, a die 22 individualized by a dicing process may be bonded to a substrate 30, such as a printed circuit board or a lead frame, using a die bonding apparatus 10.

The die attach apparatus 10 may include a die pick-up module 300 for picking up die 22 from the wafer 20 divided into die 22, and a die attach module 400 for attaching the die 22 picked up by the die pick-up module 300 to the substrate 30. For example, die pick module 300 may transfer the picked die 22 onto die stage 310, and die attach module 400 may pick up the die 22 on die stage 310 and attach the die 22 to substrate 30.

Wafer 20 may include dicing tape 24 to which die 22 are attached, and mounting frame 26 having a substantially toroidal shape to which dicing tape 24 is mounted. For example, dicing tape 24 may be attached to a lower surface of mounting frame 26, and die 22 may be attached to an upper surface of dicing tape 24.

Die pick module 300 may include a wafer stage 320 for supporting wafer 20. A support ring 322 for supporting the dicing tape 24, a jig 324 for holding the mounting frame 26, and a jig driving unit 326 for moving the jig 324 in the vertical direction may be provided on the wafer stage 320. Specifically, as shown in fig. 2, the support ring 322 may support the dicing tape 24 between the bare die 22 and the mounting frame 26, and the jig driving part 326 may expand the dicing tape 24 by lowering the jig 324, and the mounting frame 26 is clamped by the jig 324.

A die ejector 100 for selectively separating the die 22 from the dicing tape 24 may be disposed below the dicing tape 24 supported by the support ring 322. The die ejector 100 may vacuum-adsorb the lower surface of the dicing tape 24, and the die ejector 100 may include an ejector unit 110 for lifting the die 22 to be picked up among the die 22, thereby separating the die 22 from the dicing tape 24.

The die pick module 300 may include a vacuum picker 330 disposed above the wafer stage 320 to pick up the die 22 separated from the dicing tape 24 by the die ejector 100, and a picker drive 332 for moving the vacuum picker 330 in vertical and horizontal directions. For example, although not shown in the figures, the vacuum pickup 330 may include a collet having a vacuum hole for vacuum sucking the die 22. The die stage 310 may be arranged horizontally spaced from the wafer stage 320, and the die 22 picked up by the vacuum pickup 330 may be transferred onto the die stage 310 by the pickup drive 332. Further, an image pickup unit 340 for detecting a die 22 to be picked up among the dies 22 may be disposed above the wafer stage 320.

Although not shown in the drawings, the die bonder apparatus 10 may include a stage driving part (not shown) for horizontally moving the wafer stage 320. The stage drive may adjust the position of the wafer stage 320 so that the die 22 to be picked up among the die 22 is positioned on the die ejector 100.

Further, as shown in fig. 1, the die bonder apparatus 10 may include a cassette load port 42 on which a cassette 40 containing a plurality of wafers 20 is placed; a wafer transfer unit 44 for transferring the wafer 20 from the cassette 40 onto the wafer stage 320; and a wafer guide 46 for guiding the transfer of the wafer 20. Specifically, the stage driving part may move the wafer stage 320 to be adjacent to the end of the wafer guide 46, and then the wafer transfer unit 44 may transfer the wafer 20 from the cassette 40 onto the wafer stage 320. Although not shown in detail, the wafer transfer unit 44 may include a gripper for gripping the mounting frame 26 and a gripping drive for horizontally moving the gripper.

The die attach module 400 may pick up the die 22 transferred to the die stage 310 and attach the die 22 to the substrate 30. For example, the die bonder module 400 may include a bonding head 410 for picking up and bonding the die 22, a head driver 412 for moving the bonding head 410 in vertical and horizontal directions, and a substrate stage 420 for supporting the substrate 30. Although not shown in the figures, the bonding head 410 may include a vacuum hole for vacuum-sucking the die 22 and a bonding tool (not shown) for pressing the die 22 onto the substrate 30. The substrate stage 420 may include a heater (not shown) for heating the substrate 30 to a predetermined bonding temperature.

The substrate 30 may be supplied from a first tray 50 and may be received in a second tray 60 after performing the die attach process. For example, the die bonder apparatus 10 may include a first tray handling unit 52 for handling a first tray 50 and a second tray handling unit 62 for handling a second tray 60. Further, the die bonder apparatus 10 may include a first tray load port 54 on which the first tray 50 is placed, a second tray load port 64 on which the second tray 60 is placed, a first tray transfer unit 56 for transferring the first tray 50 between the first tray load port 54 and the first tray handling unit 52, and a second tray transfer unit 66 for transferring the second tray 60 between the second tray load port 64 and the second tray handling unit 62.

Further, the die attach apparatus 10 may include a substrate transfer unit 70. The substrate transfer unit 70 may transfer the substrate 30 from the first tray 50 onto the substrate stage 420 and transfer the substrate 30 from the substrate stage 420 to the second tray 60 after performing the die attach procedure. The substrate transfer unit 70 may include a substrate guide 72 for guiding the transfer of the substrate 30, a gripper 74 for gripping the substrate 30, a gripper driving part 76 for moving the gripper 74, a first push rod 78 for moving the substrate 30 onto the substrate guide 72, and a second push rod 80 for moving the substrate 30 into the second tray 60.

Fig. 3 is a schematic cross-sectional view of the die ejector shown in fig. 2, fig. 4 is a schematic cross-sectional view of the ejector driver and the stopper driver of the die ejector shown in fig. 2, and fig. 5 is a schematic side view of the ejector driver and the stopper driver shown in fig. 4.

Referring to fig. 3-5, the die ejector 100 may be disposed below the dicing tape 24 supported by the wafer stage 320. According to an embodiment of the present invention, die ejector 100 may include a hood 110 disposed in contact with a lower surface of dicing tape 24, and an ejector unit 120 configured to be raised through hood 110 to separate die 22 attached on dicing tape 24 from dicing tape 24.

The ejector unit 120 may include a plurality of ejector members 122, the ejector members 122 extending in the elevation direction and configured to have a telescopic structure. For example, the ejector members 122 may each have a rectangular tube shape extending in a vertical direction, and may be arranged in a telescopic structure. The ejector unit 120 may include, from the outside to the inside, a first ejector member 122A, a second ejector member 122B, a third ejector member 122C, and a fourth ejector member 122D. The cover 110 may have an opening 112A into which the ejector member 122 is inserted, and a plurality of vacuum holes 112B for vacuum-sucking the lower surface of the dicing tape 24.

The die ejector 100 may include an ejector driving part 140 disposed below the ejector unit 120 and configured to lift the ejector unit 120 in a vertical direction, and a stopper member 165 disposed below the ejector unit 120 and configured to restrict downward movement of the ejector unit 120. Specifically, according to an embodiment of the present invention, the ejector member 122 may be simultaneously lifted by the ejector driving part 140 and then sequentially lowered from the outside to the inside by the ejector driving part 140 and the stopper member 165.

The ejector unit 120 may include a plurality of flanges 124 respectively provided at lower end portions of the ejector member 122 and arranged in a lifting direction (i.e., a vertical direction) of the ejector member 122, elastic members 126 provided between the remaining

flanges

124B, 124C, and 124D except for the uppermost flange 124A of the flanges 124, a lift head 128 provided below the lowermost flange 124D of the flanges 124, and a connecting member 130 connecting the uppermost flange 124A and the lift head 128. For example, a coil spring may be used as the elastic member 126, and a connection pin may be used as the connection member 130.

The flange 124 may have a disk shape. For example, the ejector unit 120 may include a first flange 124A surrounding a lower portion of the first ejector member 122A, a second flange 124B surrounding a lower portion of the second ejector member 122B, a third flange 124C surrounding a lower portion of the third ejector member 122C, and a fourth flange 124D surrounding a lower portion of the fourth ejector member 122D. As shown in fig. 3, four ejector members 122 and four flanges 124 are used, but the number of ejector members 122 and flanges 124 may vary to varying degrees, and thus, the scope of the present invention will not be limited by the number of ejector members 122 and flanges 124.

A connecting pin 130 may be used to connect the uppermost flange 124A and the lift head 128. The lower portion of the connection pin 130 may pass through the remaining

flanges

124B, 124C, and 124D except for the uppermost flange 124A, and may be coupled to the lift head 128 in a bolt fastening method, and the upper portion of the connection pin 130 may be mounted to the uppermost flange 124A by a fastening member 132 (e.g., a bolt).

The ejector unit 120 may include a second stopper member 134 for limiting the height of the remaining flanges, i.e., the second and

third flanges

124B and 124C except for the uppermost and

lowermost flanges

124A and 124D (i.e., the first and

fourth flanges

124A and 124D of the flanges 124), which are lifted by the elastic member 126. For example, bolts may be used as the second stopper members 134, and the second stopper members 134 may pass through the remaining

flanges

124B and 124C except for the uppermost flange 124A and the lowermost flange 124D and may be fastened to the

flanges

124C and 124D disposed below the remaining

flanges

124B and 124C. That is, the second stop member 134 may pass through the second and

third flanges

124B, 124C and may be fastened to the third and

fourth flanges

124C, 124D, as shown in fig. 3. Specifically, the second flange 124B and the third flange 124C may have flat-bottomed counter bores into which the heads of the second stopper members 134 are inserted, and the counter bores may be formed deeper than the height of the heads of the second stopper members 134 so that the heads of the second stopper members 134 do not protrude upward even when the flanges 124 are brought into close contact with each other.

The ejector driving part 140 may be disposed below the ejector unit 120, and may be connected to a lower portion of the lift head 128. For example, the lift head 128 may have a disk shape and the lowermost flange 124D may be disposed on the lift head 128. The ejector driving part 140 may lift the lift head 128, and the lowermost flange 124D may be thus lifted by the ejector driving part 140. Further, the uppermost flange 124A may be lifted simultaneously with the lowermost flange 124D by the connection pin 130, and the second and

third flanges

124B and 124C may be lifted simultaneously with the uppermost and

lowermost flanges

124A and 124D by the elastic member 126. Accordingly, the ejector member 122 connected to the flange 124 can be simultaneously lifted by the ejector driving part 140.

The height of the uppermost flange 124A may be determined by the length of the connecting pin 130. Further, the distance between the remaining

flanges

124B, 124C and 124D except for the uppermost flange 124A may be continuously maintained by the elastic member 126 and the second stopper member 134. At this time, the distance between the uppermost flange 124A and the second flange 124B may be the same as the distance between the remaining

flanges

124B, 124C, and 124D.

The ejector driving part 140 may include a first driving shaft 144 connected to the lifting head 128 and extending downward, and a first driving unit 150 configured to raise the first driving shaft 144. For example, a driving head 142 having a disk shape may be coupled to an upper end portion of the first driving shaft 144, and the elevating head 128 may be coupled to an upper surface of the driving head 142.

Specifically, an electromagnet 146 configured to surround an upper portion of the first drive shaft 144 may be disposed below the drive head 142, and may provide an electromagnetic force to couple the lift head 128 to an upper surface of the drive head 142. As another example, a permanent magnet (not shown) may be used to couple the lift head 128 to the drive head 142. In this case, a permanent magnet may be provided in the driving head 142.

According to an embodiment of the invention, the die ejector 100 may include a stopper drive 170 for raising the stopper member 165 to adjust the height of the stopper member 165 after the ejector drive 140 raises the ejector member 122.

After the ejector member 122 is simultaneously lifted by the ejector driving part 140, the stopper driving part 170 may lift the stopper member 165 to a predetermined height. Thereafter, the ejector driving part 140 may lower the ejector unit 120. After the lowermost flange 124D (i.e., the fourth flange 124D) is placed on the stopper member 165, the uppermost flange 124A (i.e., the first flange 124A) may be lowered by the connecting pin 130 and the ejector driving part 140, and then the second flange 124B and the third flange 124C may be lowered. In this case, the elastic member 126 may have an elastic force gradually increasing downward.

For example, the first elastic member 126A disposed between the second and

third flanges

124B and 124C may have a smaller elastic force than the second elastic member 126B disposed between the third and

fourth flanges

124C and 124D. Thus, after the first flange 124A begins to descend, the second flange 124B and the third flange 124C may descend in sequence. Accordingly, the remaining

ejector members

122A, 122B, and 122C except for the innermost ejector member 122D may be sequentially lowered from the outside to the inside. That is, the first ejector member 122A connected to the first flange 124A, the second ejector member 122B connected to the second flange 124B, and the third ejector member 122C connected to the third flange 124C may be lowered in order.

The stopper member 165 may have a circular tube shape surrounding the elevating head 128 and the driving head 142, and the stopper driving part 170 may include a second driving shaft 174 connected with the stopper member 165 and extending downward, and a second driving unit 180 for elevating the second driving shaft 174. For example, a disc-shaped stopper head 172 may be coupled with an upper end portion of the second driving shaft 174, and the stopper member 165 may be mounted to an upper surface of the stopper head 172 by a plurality of fastening members 176 (e.g., a plurality of bolts).

According to an embodiment of the present invention, the second driving shaft 174 may have a circular tube shape surrounding the first driving shaft 144, and the first guide member 148 for guiding the first driving shaft 144 in the ascending and descending direction (i.e., the vertical direction) may be disposed between the first driving shaft 144 and the second driving shaft 174. For example, a first linear ball bushing may be disposed between the first drive shaft 144 and the second drive shaft 174.

The cover 110 may include a disk-shaped cover 112 having an opening 112A and a vacuum hole 112B formed in the cover 112, and a cover body 114 having a circular tube shape. In this case, the cover 112 may be coupled to an upper portion of the cover main body 114. Further, die ejector 100 may include ejector body 200 connected to a lower portion of mask 110, i.e., to a lower portion of mask body 114, and having a tubular shape surrounding second drive shaft 174. For example, the ejector body 200 may include an intermediate tube 202 and a lower tube 204, and the first drive shaft 144 and the second drive shaft 174 may extend downward through the ejector body 200. In this case, a permanent magnet 206 for coupling between the cap 110 and the ejector body 200 may be installed on the intermediate pipe 202.

According to an embodiment of the present invention, a second guide member 178 configured to guide the second driving shaft 174 in the elevation direction may be disposed between the second driving shaft 174 and the ejector main body 200, for example, between the second driving shaft 174 and the lower tube 204. For example, a second linear ball bushing may be disposed between the second drive shaft 174 and the ejector body 200.

The first driving unit 150 may include a first cam member 152 for elevating the first driving shaft 144, a first motor 154 for rotating the first cam member 152, a first bracket 156 mounted at a lower portion of the first driving shaft 144, and a first cam follower 158 mounted to the first bracket 156 and disposed on the first cam member 152. The second driving unit 180 may include a second cam member 182 for elevating the second driving shaft 174, a second motor 184 for rotating the second cam member 182, a second bracket 186 installed at a lower portion of the second driving shaft 174, and a second cam follower 188 installed to the second bracket 186 and disposed on the second cam member 182. In this case, the first and

second cam followers

158 and 188 may have a roller shape.

The die ejector 100 may include a base support 230 on which the ejector body 200 and the first and

second drive units

150 and 180 are mounted. For example, the base bracket 230 may include a horizontal bracket 232 on which the ejector body 200 is mounted, and a vertical bracket 234 on which the first motor 154 and the second motor 184 are mounted.

Fig. 6 is a schematic front view of the first driving unit shown in fig. 4, and fig. 7 is a schematic side view of the first driving unit shown in fig. 4. Fig. 8 is a schematic front view of the second driving unit shown in fig. 4, and fig. 9 is a schematic side view of the second driving unit shown in fig. 4. Fig. 10 is a schematic rear view of the third guide member shown in fig. 5.

Referring to fig. 6 to 10, the first bracket 156 may include a connection block 156A coupled to a lower portion of the first driving shaft 144, a pair of extension portions 156B extending downward from the connection block 156A, and a mounting portion 156C connecting lower ends of the extension portions 156B to each other and to which the first cam follower 158 is mounted. The second bracket 186 may include a connection member 186A having a circular tube shape and coupled with a lower portion of the second driving shaft 174, a pair of connection rods 186B extending downward from the connection member 186A, and a roller block 186C coupled with a lower end portion of the connection rods 186B and to which the second cam follower 188 is mounted.

The second cam member 182 and the second cam follower 188 may be disposed between the extension portions 156B of the first bracket 156. Specifically, the second cam follower 188 may be guided by an inner surface of the extension portion 156B of the first bracket 156 in the elevation direction (i.e., the vertical direction), thereby preventing the second driving shaft 174 from rotating. That is, the extension portion 156B of the first bracket 156 may serve as a guide member for guiding the second driving shaft 174 in the vertical direction, so that the stopper member 165 can be prevented from rotating.

According to an embodiment of the invention, the die ejector 100 may include a third guide member 208 for guiding the first carriage 156 in an elevation direction (i.e., a vertical direction). For example, as shown in fig. 5 and 10, the third guide member 208 may include a pair of guide rollers 210 mounted on a lower portion of the ejector main body 200 (i.e., a lower portion of the lower tube 204) so as to be in close contact with side portions of the first bracket 156. Specifically, the guide roller 210 may be in close contact with a side surface of the extension portion 156B of the first bracket 156, thereby preventing the first bracket 156 from rotating. Therefore, the ejector unit 120 and the first drive shaft 144 can be prevented from rotating.

Referring again to fig. 3 to 5, the second elastic member 160 may be disposed between the first guide member 148 and the first bracket 156 such that the first cam follower 158 is in close contact with the first cam member 152, and the third elastic member 190 may be disposed between the second guide member 178 and the second bracket 186 such that the second cam follower 188 is in close contact with the second cam member 182. For example, a coil spring may be used as the second elastic member 160 and the third elastic member 190.

The shroud 110 may include a third stop member 116 protruding from an inner surface of the shroud body 114 to prevent the flange 124 from separating from the shroud body 114. For example, a snap ring may be used as the third stop member 116. A snap ring 116 may be mounted on an inner surface of the cover main body 114, and an ejector unit 120 may be disposed above the snap ring 116. When the cover 110 and the ejector unit 120 are replaced, the third stopper member 116 may be used to simultaneously separate the cover 110 and the ejector unit 120 from the ejector main body 200 and the ejector driving part 140. At this time, the power supply to the electromagnet 146 may be cut off, and thus, the cover 110 and the ejector unit 120 may be easily separated from the ejector main body 200 and the ejector driving part 140.

Vacuum pressure for vacuum-absorbing the lower surface of the dicing tape 24 may be provided inside the cover 110 and the ejector body 200. For example, the lower tube 204 may be connected to a vacuum source 220, such as a vacuum pump or vacuum ejector, and may have a second vacuum hole 204A for providing vacuum pressure inside the cover 110 and the intermediate tube 202. Further, as shown in fig. 3, sealing members for preventing vacuum leakage may be provided between the cover 110 and the intermediate tube 202, between the intermediate tube 202 and the lower tube 204, between the lower tube 204 and the second driving shaft 174, and between the stopper head 172 and the first driving shaft 144.

Further, a vacuum pressure for vacuum-sucking the lower surface of the dicing tape 24 may be provided inside the innermost ejector member 122D (i.e., the fourth ejector member 122D) among the ejector members 122. For example, the ejector unit 120 may include an extension portion 124E having a circular tube and extending downward from the lowermost flange 124D, and the inside of the extension portion 124E may be connected with the inside of the innermost ejector member 122D. The lift head 128 may have a first through hole 128A into which the extension portion 124E is inserted. The first driving shaft 144 may have a circular tube shape and may be connected to a vacuum source 222 for providing vacuum pressure, for example, a vacuum pump or a vacuum ejector, through a connection block 156A of the first bracket 156, as shown in fig. 5. Connection block 156A of first bracket 156 may have a third vacuum hole 156D for connecting vacuum source 222 and first drive shaft 144. The drive head 142 may have a second through-hole 142A for connecting the first through-hole 128A of the lift head 128 and a first drive shaft 144. Vacuum pressure may be provided to the innermost ejector member 122D through connection block 156A of first carriage 156, first drive shaft 144, drive head 142, and lift head 128.

Specifically, as shown in fig. 3, the ejector member 122 may be inserted into the opening 112A such that an upper surface of the ejector member 122 is flush with an upper surface of the cap 110 (i.e., an upper surface of the cover 112). Accordingly, the cutting belt 24 may be vacuum sucked onto the cover 110 and the ejector member 122 by the vacuum pressure provided by the vacuum holes 112B and the innermost ejector member 122D.

According to an embodiment of the present invention, compressed air for inflating the cutting belt 22 may be supplied into the innermost ejector member 122D. For example, a compressed air source 224 for supplying compressed air, e.g., an air tank storing compressed air, may be connected to the first drive shaft 144 through the connection block 156A of the first bracket 156, as shown in fig. 5. Further, as shown in fig. 3, in order to prevent leakage of compressed air, a sealing member may be provided between the lift head 128 and the driving head 142, and between the inner surface of the first through hole 128A and the extension portion 124E.

Fig. 11-17 are schematic cross-sectional views illustrating operation of the die ejector as shown in fig. 3 and 4.

Referring to fig. 11, the ejector member 122 and the flange 144 may be simultaneously lifted by the ejector driving part 140, and the ejector member 122 may protrude upward from the upper surface of the cover 110. Although not shown in the figures, the die 22 may be lifted by the ejector member 122, and thus, edge portions of the die 22 may be separated from the dicing tape 24. In particular, the height at which the ejector member 122 is raised may be fine-tuned to prevent damage to the die 22. For example, the height at which the ejector member 122 is raised may be adjusted between about several tens of microns and several hundreds of microns, and may be appropriately adjusted according to the size of the die 22 to prevent damage to the die 22.

Referring to fig. 12, the stopper member 165 may be lifted by the stopper driving part 170. For example, the stop driver 170 may lift the stop member 165 such that the stop member 165 contacts the lower surface of the lowermost flange 124D. However, the height of the stopper member 165 may be variously changed, and thus the scope of the present invention will not be limited by the lifting height of the stopper member 165. In addition, the stopper member 165 may be lifted simultaneously with the ejector unit 120.

Referring to fig. 13, the ejector driving part 140 may lower the ejector unit 120 after the stopper member 165 is lifted. Specifically, the lifter head 128 may be lowered by the ejector driving part 140 in a state where the innermost ejector member 122D and the lowermost flange 124D are supported by the stopper member 165, and thus, the uppermost flange 124A and the outermost ejector member 122A connected to the lifter head 128 may be lowered by the connection pin 130. Then, as shown in fig. 14 and 15, the second ejector member 122B connected to the second flange 124B and the third ejector member 122C connected to the third flange 124C may be sequentially lowered. Therefore, the dicing tape 24 can be separated from the bare chip 22 in a direction from the edge portion toward the center portion of the bare chip 22.

Referring to fig. 16, after the remaining

ejector members

122A, 122B, and 122C, except for the innermost ejector member 122D, are lowered, the die 22 may be supported by the innermost ejector member 122D. The dicing tape 24 can be separated from the die 22 by vacuum pressure provided within the enclosure 110 and the innermost ejector member 122D. Then, as shown in fig. 17, compressed air may be supplied from the compressed air source 224 to the interior of the innermost ejector member 122D, and thus, the cutting belt 24 may be inflated upward by the compressed air. As a result, the die 22 can be sufficiently separated from the dicing tape 24. The die 22 may then be picked up by the vacuum pickup 330 and transferred onto the die stage 310.

According to an embodiment of the present invention, the ejector members 122 may be simultaneously lifted and then sequentially lowered from the outside to the inside. Therefore, the height to which the die 22 is lifted can be reduced compared to a conventional die ejector, and the die 22 can be prevented from being damaged by the ejector member 122 when the die 22 is picked up. Specifically, the stop member 165 may limit the lowered height of the ejector member 122 after the ejector member 122 and the flange 124 are lifted. That is, the lift height and the drop height of the ejector member 122 can be varied to different degrees according to the size of the die 22, and thus, the picking up steps of various types of die 22 can be performed more efficiently.

Although the exemplary embodiments of the present invention have been described with reference to specific embodiments, it is not limited thereto. Accordingly, it will be readily understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the appended claims.

Claims

1. A die ejector, comprising:

a cover disposed below the cutting belt;

an ejector unit configured to be raised through a hood to separate a bare die attached on the dicing tape from the dicing tape;

an ejector driving part configured to lift the ejector unit; and

a stopper member disposed below the ejector unit and configured to limit downward movement of the ejector unit,

wherein the ejector unit includes a plurality of ejector members extending in a rising direction and configured to have a telescopic structure, and

the ejector member is configured to be simultaneously lifted by the ejector driving part and then sequentially lowered from the outside to the inside by the ejector driving part and the stopper member.

2. The die ejector of claim 1 wherein the ejector unit further comprises:

a plurality of flanges provided at lower end portions of the ejector members, respectively, and arranged in a lifting direction of the ejector members;

at least one elastic member disposed between remaining ones of the flanges except for an uppermost flange;

a lift head disposed below a lowermost one of the flanges; and

a connecting member connecting the uppermost flange and the lift head,

wherein, the ejector driving part is connected with the lifting head.

3. The die ejector of claim 2, wherein the ejector unit further comprises:

at least one second stop member limiting a height of at least one remaining one of the flanges other than the uppermost flange and the lowermost flange to be lifted by the at least one elastic member.

4. The die ejector of claim 1, further comprising:

a stopper driving part that raises the stopper member to adjust a height of the stopper member after the ejector driving part lifts the ejector member.

5. A die ejector, comprising:

a cover disposed to contact a lower surface of the cutting belt;

a plurality of ejector members configured to be raised through a hood so as to separate a bare chip attached to an upper surface of the dicing tape from the dicing tape, and having a telescopic structure extending in a raising direction;

a plurality of elastic members disposed between remaining ones of the flanges except for an uppermost flange;

a lift head disposed below a lowermost one of the flanges;

a plurality of connection pins passing through remaining ones of the flanges except the uppermost flange and connecting the uppermost flange and the lift head;

an ejector driving part connected to the lift head and configured to lift the ejector member;

a stop member disposed below the lowermost flange and configured to limit downward movement of the lowermost flange; and

6. The die ejector of claim 5 wherein the cover has an opening into which the ejector member is inserted and the ejector member is inserted into the opening such that an upper surface of the ejector member is flush with an upper surface of the cover.

7. The die ejector of claim 5 wherein the ejector member is simultaneously lifted by the ejector driver.

8. The die ejector of claim 7 wherein the resilient member has a downwardly increasing spring force such that the remaining ones of the ejector members, except for the innermost ejector member, are lowered in sequence from outside to inside.

9. The die ejector of claim 5 wherein the ejector driver includes:

a first drive shaft connected to the lift head and extending downward; and

a first drive unit configured to raise the first drive shaft.

10. The die ejector of claim 9 wherein the stop drive includes:

a second drive shaft connected to the stop member and extending downward; and

a second drive unit configured to raise the second drive shaft.

11. The die ejector of claim 10 wherein the second drive shaft has a tubular shape surrounding the first drive shaft.

12. The die ejector of claim 11 wherein the ejector driver further comprises:

a first guide member disposed between the first drive shaft and the second drive shaft and configured to guide the first drive shaft in a lifting direction.

13. The die ejector of claim 11, further comprising:

an ejector body connected to a lower portion of the housing and having a tubular shape surrounding the second driving shaft.

14. The die ejector of claim 13 wherein the stop drive further comprises:

a second guide member disposed between the second drive shaft and the ejector body and configured to guide the second drive shaft in a lifting direction.

15. The die ejector of claim 13 wherein the first drive unit comprises:

a first cam member for raising the first drive shaft;

a first motor for rotating the first cam member;

a first bracket mounted on a lower portion of the first driving shaft; and

a first cam follower mounted on the first bracket and disposed on the first cam member.

16. The die ejector of claim 15 wherein the ejector driver further comprises:

a third guide member configured to guide the first bracket in a lifting direction.

17. The die ejector of claim 15 wherein the second drive unit comprises:

a second cam member for raising the second drive shaft;

a second motor for rotating the second cam member;

a second bracket mounted on a lower portion of the second driving shaft; and

a second cam follower mounted on the second bracket and disposed on the second cam member.

18. The die ejector of claim 17 wherein the first support comprises:

a connecting block coupled to a lower portion of the first driving shaft;

a pair of extension portions extending downward from the connection block; and

a mounting portion which connects lower ends of the extension portions to each other and on which the first cam follower is mounted,

wherein the second cam member and the second cam follower are disposed between the extension portions.

19. The die ejector of claim 13 wherein the hood comprises:

a cap body having a circular tube shape and coupled with the ejector body;

a cover coupled with an upper portion of the cover main body and having a vacuum hole for vacuum-sucking a lower surface of the dicing tape; and

a third stop member protruding from an inner surface of the cover main body to prevent the flange from being separated from the cover main body.

20. A die attach apparatus, comprising:

a die ejector for separating a die attached to a dicing tape from the dicing tape; and

a die attach module for attaching the die separated by the die ejector to a substrate,

wherein the die ejector comprises:

a cover disposed below the cutting belt;

an ejector unit configured to be raised through the hood to separate the die from the dicing tape;

an ejector driving part configured to lift the ejector unit; and

a stopper member provided below the ejector unit and configured to limit downward movement of the ejector unit,