JP4957622B2 - Substrate support device - Google Patents

Description

  The present invention relates to a substrate support apparatus that places and lifts a substrate in order to use the substrate for various processes.

  The substrate support device places a substrate such as a semiconductor substrate or a glass substrate, and uses the substrate for various processes such as a thin film forming process and a processing process. When the processing is completed, a plurality of lifting pins (lift pins) are moved upward from the mounting table (susceptor) to separate the substrate from the mounting table, and the substrate is carried out.

  For example, Patent Document 1 and Patent Documents 2 and 3 have been devised as substrate support forms in the substrate support apparatus. In the former form, the structure which fixes the lower end part of a lift pin to a supporting member is taken (type 1). The latter form employs a configuration in which the lower end portion of the lift pin is not fixed, and the upper end portion is engaged and held with the susceptor so as to be movable up and down (type 2). The main configuration of type 1 is shown in FIG. 10, and the main configuration of type 2 is shown in FIG.

Both types 1 and 2 include a susceptor 111, a plurality of lift pins 112, and a lift pin support member 113.
The susceptor 111 is a substrate stage on which the substrate 10 is placed. The lift pin 112 is inserted into an insertion port 111 a formed in the susceptor 111 so as to be movable up and down, supports the substrate 10 placed on the susceptor 111 at the upper end, and lifts the substrate 10 relative to the susceptor 111. It is a member. The lift pin support member 113 has a hoop shape provided below the lift pin 112.

  In Type 1, as shown in FIG. 10A, the lower end portion of the lift pin 112 is fixed to a lift pin support member 113, and the lift pin support member 113 is in a processing chamber (not shown) that houses the substrate support device. It is driven up and down together with the lift pins 112. When lifting the substrate 10, as shown in FIG. 10B, the lift pin support member 113 is driven upward, the lift pin 112 is inserted into the insertion port 111 a from below the susceptor 111, and the upper end of the lift pin 112 is placed on the substrate. The substrate 10 is separated from the susceptor 111 in contact with the lower portion of the susceptor 111.

  In Type 2, as shown in FIG. 11A, the lift pin 112 is engaged and held so as to be movable up and down in the insertion port 111a of the susceptor 111, and the susceptor 111 is driven up and down together with the lift pin 112 with respect to the processing chamber. To do. When lifting the substrate 10, as shown in FIG. 11B, the susceptor 111 is driven downward, the lower end portion of the lift pin 112 is brought into contact with the lift pin support member 113, and the substrate 10 is separated from the susceptor 111. Let

JP 2006-83406 A JP 2000-294620 A JP 2007-189222 A

  Since the susceptor is fixed in the substrate support apparatus adopting the type 1 described above, the installation position of the substrate in the processing chamber during processing is fixed. In this embodiment, it is impossible to cope with various processes requiring various installation positions in the processing chamber, and it is difficult to adopt as a future substrate support apparatus.

  On the other hand, in the substrate support apparatus adopting the type 2 form, the susceptor is driven up and down, so that the position of the substrate in the processing chamber during processing is variable. In this embodiment, it is possible to appropriately cope with various processes that require various installation positions in the processing chamber.

However, it has been found that the following problems occur when the substrate is carried out of the susceptor in the conventional substrate support apparatus adopting the type 2 configuration.
In order to unload the substrate from the mounting table, the arm 101 of the transfer robot is inserted between the lift pin and the substrate 10 as shown in FIG. The substrate 10 is placed and unloaded so that the substrate 10 is inserted into the placement position 101 a defined on the substrate 101.

  However, in this case, as shown in FIG. 12B, when the substrate 10 is picked up from the lift pin by the arm 101, the substrate 10 does not fit in the predetermined position 101a but is displaced from the predetermined position 101a. Transport becomes difficult. It is considered that the positional deviation of the substrate during unloading by the transfer robot is caused not by the transfer robot side but by the substrate support device.

  The present invention has been made in view of the above-described problems, and allows a substrate to be lifted and lowered in a desired state, and to be used for reliable substrate transport without causing any positional displacement of the substrate particularly when the substrate is unloaded. An object is to provide a support device.

The substrate support device of the present invention is described above in a state in which the substrate is placed thereon, and is inserted into the insertion port formed in the mounting table so as to be movable up and down, and inserted into the insertion port of the mounting table. A plurality of lift pins that are engaged and held by the mounting table, support the substrate mounted on the mounting table at the upper end, and lift the substrate with respect to the mounting table, and below the mounting table A lifting pin fixing portion that is an annular body that is integrally fixed on the surface with the lower end portion of each lifting pin fixed to be freely raised and lowered together with each lifting pin ; and provided below the lifting pin fixing portion. A lift pin support portion that supports the lift pin fixing portion as a contact with the lift pin fixing portion when the lift pins are lifted, a first drive portion that drives the table to move up and down, and the lift pins Drive the support part up and down and select grounding or non-grounding. And a second driving unit which is to set.

  The substrate support method of the present case is inserted through a mounting table on which the substrate is mounted and an insertion port formed in the mounting table so as to be movable up and down, and the substrate mounted on the mounting table is supported at an upper end portion. And a substrate support apparatus including a plurality of lifting pins for lifting and lowering the substrate relative to the mounting table. This method includes a first step of removing the charged substrate through each of the lifting pins in a state where the substrate is placed on the mounting table, and each of the lifting pins relative to the mounting table. A second step of moving the substrate upward and separating the substrate from the mounting table.

  According to the present case, the substrate can be lifted and lowered in a desired state, and can be used for reliable substrate transport without causing any positional displacement of the substrate particularly when the substrate is unloaded.

―Basic outline of this case―
In the present case, in the substrate support device adopting a configuration in which the lower end portion of the lift pin is not fixed and the upper end portion is engaged and held movably up and down with respect to the susceptor, the positional displacement of the substrate at the time of unloading by the transfer robot described above. The cause of occurrence was studied earnestly. As a result, I came up with the following two main factors.

(1) When the substrate is carried out by the transfer robot, when the substrate is lifted from the susceptor by the lift pin, the lift pin is not in contact with the substrate in the intended state, and therefore the substrate is displaced from the lift pin. Occurs. When the arm of the transfer robot is inserted between the lift pin and the substrate in this state, the substrate is displaced with respect to the lift pin, so that the substrate is also displaced with respect to the arm.

  As a specific example of the factor (1), as shown in FIG. 1, when the lift pin 112 abuts on the lift pin support member 113, the lift pin 112 is pushed up, and the lower end portion of the lift pin 112 is not fixed. Thus, the lift pin 112 is inclined in the insertion port 111a. As a result, the lift pin 112 comes into contact with the insertion opening 111a and the contact resistance increases, so that the lift pin 112 cannot be raised to the intended state, and a displacement occurs between the substrate and the lift pin 112.

(2) The substrate is charged by plasma treatment or the like on the substrate, and the upper end portion of the lift pin that comes into contact with the substrate is also charged. When the substrate is lifted from the susceptor by the lift pins, the substrate and the upper end portion of the lift pins are electrically attached by charging. If the arm of the transfer robot is inserted between the lift pin and the substrate in this state, the substrate is displaced relative to the arm when the substrate is pulled away from the lift pin.

  Further, when the substrate is pulled away from the lift pins, the lift pins are also displaced, and the lift pins 112 are inclined in the insertion opening 111a as shown in FIG. Thus, it is considered that the factor (1) may be caused by the factor (2).

  In the present case, a substrate support apparatus that focuses on the removal of the factor (1), a substrate support method that focuses on the removal of the factor (2), and (1) and (2). A substrate support method for removing both is presented.

1. Substrate Support Device Focusing on Removing Factor (1) As shown in FIG. 2A, this substrate support device supports a susceptor 11, a plurality of lift pins 12, a lift pin fixing member 13, and a lift pin support. And a member 14.
The susceptor 11 is a substrate stage on which the substrate 10 is placed. The lift pin 12 is inserted into an insertion port 11 a formed in the susceptor 11 so as to be movable up and down, supports the substrate 10 placed on the susceptor 11 at the upper end, and lifts the substrate 10 relative to the susceptor 11. It is a member. The lift pin fixing member 13 is an annular body that is provided below the susceptor 11 and has a lower end portion of each lift pin 12 fixed integrally on the surface so that the lift pin 12 can be raised and lowered together. The lift pin support member 14 has a hoop shape provided below the lift pin 12.

  In this case, the lift pin 12 is engaged and held so as to be movable up and down in the insertion port 11a of the susceptor 11, and the susceptor 11 is driven up and down together with the lift pin 12 with respect to the processing chamber. When lifting the substrate 10, as shown in FIG. 2B, the susceptor 11 is driven downward to bring the lift pin fixing member 13 into contact with the lift pin support member 14 and raise the lift pin 12 together with the lift pin fixing member 13. . As a result, the substrate 10 is separated from the susceptor 11.

  In this substrate support apparatus, as shown in FIG. 3B, each lift pin 12 is integrated as compared with the case where the lower end of the lift pin 111 is not fixed as in the conventional configuration of FIG. It is fixed to the lift pin fixing member 13 at the lower end. Therefore, when the lift pins 12 are moved up and down, the lift pin support members 14 do not directly contact the lift pins 12 but contact the lift pin fixing members 13 to which the lift pins 12 are integrally fixed. At this time, the lift pins 12 are driven up and down stably simultaneously with the lift pin fixing member 13 without the lift pins 12 being flipped up alone.

  As shown in FIG. 4, each lift pin 12 is fixed to the lift pin fixing member 13 and stabilized as a whole, and therefore, the lift pin 12 is not inclined as shown in FIG. The lift pin 12 moves up and down without coming into contact with the insertion opening 11a. As a result, the occurrence of misalignment between the substrate and the lift pins 12 is suppressed, and the occurrence of substrate misalignment is also suppressed with respect to the arm of the transfer robot when the substrate is unloaded.

  This substrate support apparatus can cope with the factor (2), that is, even when electrical adhesion occurs between the substrate and the upper end of the lift pin due to charging. That is, since each lift pin 12 is fixed to the lift pin fixing member 13 and stabilized as a whole, the influence of the lift pin 12 when the substrate is pulled away from the lift pin 12 is extremely small, and the occurrence of the displacement of the substrate with respect to the arm is suppressed. The

2. Substrate Support Method Focusing on Removing Factor (2) This substrate support method can also be applied to a conventional substrate support apparatus as shown in FIG. In this substrate support method, the lift pin support member 113 is grounded in advance as shown in FIG. When the substrate 10 is moved up and down, when the substrate 10 is placed on the susceptor 111 and the lift pins 112 contact the lift pin support member 113, the lifting operation of the substrate 10 is stopped for a predetermined time in this state. . When the surfaces of the susceptor 111 and the lift pins 112 are attached together with the substrate 10 due to electrification, the substrate 10, the susceptor 111 and the lift pins 112 are neutralized from the lift pin support member 113 via the lift pins 112 due to the holding in the stationary state.

  Here, the predetermined time is preferably about 2 to 5 seconds, for example. In order to perform sufficient static elimination without prolonging the time required for the lifting operation, the required time within the range is necessary and sufficient, but in consideration of performing sufficient static elimination, the predetermined time is set to 5 seconds. Most preferably. As a result, sufficient neutralization of the substrate, the susceptor, and the lift pin is realized while maintaining the quickness of the lifting operation.

  By performing this static elimination step, the susceptor and lift pins are removed from the charge, and the electrical adhesion between the substrate and the lift pins is eliminated. Accordingly, when the arm of the transfer robot is inserted between the lift pin and the substrate in this state, the substrate is smoothly separated from the lift pin, and the substrate is not displaced relative to the arm.

  In this case, since the substrate is smoothly separated from the lift pins, the lift pins are not displaced. Therefore, even in the device configuration in which the lift pin 112 is not fixed to the lift pin support member 113, the tilt of the lift pin 112 in the insertion port 111a as shown in FIG. 1 is suppressed as much as possible, and the factor (1) is also It will be removed sufficiently.

3. Substrate Support Method for Removing Both Factors (1) and (2) In this substrate support method, the above-described static elimination process is performed using the substrate support apparatus of FIG.
In this substrate support method, the lift pin support member 14 is grounded in advance as shown in FIG. When the substrate 10 is moved up and down, the substrate 10 is placed on the susceptor 11 and the lift pin fixing member 13 with the lower ends of the lift pins 12 fixed integrally is in contact with the lift pin support member 14. In this state, the raising / lowering operation of the substrate 10 is stopped for a predetermined time (same as the above-mentioned predetermined time). When the surfaces of the susceptor 11 and the lift pins 112 are attached together with the substrate 10 due to electrification, the substrate 10, the susceptor 11 and the lift pins 12 are held in the stationary state, and the lift pin support member 14 is interposed via the lift pins 12 and the lift pin fixing members 13. Is neutralized.

  In this substrate support apparatus, as described above, each lift pin 12 is fixed to the lift pin fixing member 13 and stabilized as a whole. Therefore, the lift pin 12 moves up and down without contacting the insertion hole 11a. As a result, the occurrence of misalignment between the substrate and the lift pins 12 is suppressed, and the occurrence of substrate misalignment is also suppressed with respect to the arm of the transfer robot when the substrate is unloaded.

  Furthermore, by performing the static elimination process using this substrate support device, the susceptor and the lift pins are removed from the charge, and the electrical adhesion between the substrate and the lift pins is eliminated. Accordingly, when the arm of the transfer robot is inserted between the lift pin and the substrate in this state, the substrate is smoothly separated from the lift pin, and the substrate is not displaced relative to the arm.

  Thus, by executing the static elimination process using the substrate support apparatus of FIG. 2, both the factors (1) and (2) are more reliably removed, and the substrate is lifted and lowered in a desired state. Thus, the substrate can be reliably transported without causing a positional shift of the substrate during the unloading.

-Preferred embodiment to which this case is applied-
Hereinafter, specific embodiments to which the present application is applied will be described in detail with reference to the drawings.
In the present embodiment, a plasma etching apparatus provided with the substrate support apparatus of the present case and a substrate support method in the plasma etching apparatus are illustrated. In addition to the plasma etching apparatus, the substrate support apparatus of the present case can be applied to various processing apparatuses that perform various processes on a substrate in a chamber, such as an etching apparatus, a CVD apparatus, a plasma CVD apparatus, and a sputtering apparatus.

(Plasma etching equipment)
FIG. 7 is a schematic view showing the plasma etching apparatus according to the present embodiment.
The plasma etching apparatus includes a processing chamber 21 in which a plasma etching process is performed and a substrate support apparatus 22 of the present case. FIG. 7 illustrates the case where one substrate support device 22 is provided in the processing chamber 21, but a so-called dual chamber plasma etching apparatus in which two substrate support devices are provided in the processing chamber is also illustrated. This case is applicable. In this case, the substrate support device 22 of the present case may be provided as each substrate support device.

  The processing chamber 21 performs plasma etching by applying a predetermined RF voltage to the supplied etching gas. In the processing chamber 21, a shower head 31 to which an etching gas and an RF voltage are supplied, a vacuum mechanism 32 for bringing the inside of the chamber into a desired vacuum state, and an arm of a transfer robot enter and exit, and a substrate (for example, a silicon wafer) The board | substrate entrance / exit 33 for carrying in / out of this is provided.

Similarly to FIG. 2, the substrate support device 22 includes a susceptor 11, a plurality of lift pins 12, a lift pin fixing member 13, and a lift pin support member 14.
The susceptor 11 has a built-in heater for adjusting the substrate to a predetermined temperature. The lift pin fixing member 13 has a lower end portion of each lift pin 12 fixed integrally on the surface, and can be moved up and down together with the lift pin 12, and is made of ceramic, SiC, aluminum (Al) or an alloy thereof, quartz, or the like. It is an annular body.

The substrate support device 22 further includes a first drive unit 15 and a second drive unit 16.
The first drive unit 15 includes, for example, a motor, a ball screw, and the like, and drives the susceptor 11 up and down in the vertical direction (indicated by an arrow A1).
The second drive unit 16 includes, for example, a cylinder, a bellows, and the like, and drives the lift pin support member 14 up and down in the vertical direction (indicated by an arrow A2). For example, the lower part of the second drive unit 16 is grounded. In this case, instead of a configuration in which the second drive unit 16 is always grounded, a configuration in which grounding / non-grounding can be selectively set may be employed.

The first drive unit 15 and the second drive unit 16 can be independently operated.
An example of both operations is shown in FIG. FIG. 8A illustrates a state before the first drive unit 15 and the second drive unit 16 are operated. 8B, the second drive unit 16 is operated from the state of FIG. 8A, the lift pin support member 14 is brought into contact with the lift pin fixing member 13, and the lift pin 12 and the lift pin 12 are inserted through the opening. The state driven upward in 11a is illustrated. FIG. 8C illustrates a state in which the first drive unit 16 is operated from the state of FIG. 8B and the susceptor 11 is driven upward to separate the lift pin fixing member 13 from the lift pin support member 14. is doing.

  By operating the first drive unit 15 to drive the susceptor 11 up and down, as shown in FIG. 7, the distance between the susceptor 11 on which the substrate is placed and the shower head 31 (processing region) in the processing chamber 21. Can be changed. By making the processing region variable in this way, it is possible to flexibly cope with various required etching conditions and perform the desired etching reliably.

  Further, in addition to the first drive unit 15, the second drive unit 16 is operated independently of the first drive unit 15, and the lift pin support member 14 is driven to move up and down, thereby precisely moving the substrate up and down. Can do. Thus, by providing two types of drive mechanisms independently, a multi-stage substrate lifting operation described later can be performed.

(Substrate support method)
Hereinafter, a substrate support method using the substrate support apparatus in the plasma etching apparatus configured as described above will be described.
9A and 9B are schematic views illustrating the substrate support method according to the present embodiment in the order of steps.

  After the plasma etching process is performed on the surface of the substrate 10 by the plasma etching apparatus, as shown in FIGS. 9-1 (a) and (b), the first driving unit 15 is operated to move the susceptor 11 downward. The lift pin support member 14 is moved closer to the lift pin fixing member 13.

  Here, in the state where the lift pin support member 14 is separated from the lift pin fixing member 13 as shown in FIG. 9-1 (a), the lift pin 12 is engaged and held in the insertion port 11a. Due to the weight, the lift pin 12 is suspended from the lowest position. Accordingly, even if the lift pin 12 is slightly misaligned in the insertion port 11a due to the usage situation before FIG. 9-1 (a), the misalignment of the lift pin 12 is eliminated by the weight of the lift pin fixing member 13. .

Then, as shown to FIG. 9-1 (c), a static elimination process is performed.
Specifically, the first driving unit in a state where the lift pin support member 14 is in contact with the lift pin fixing member 13 (however, the substrate 10 is still placed on the susceptor 11 (not separated from the susceptor 11)). 15 is stopped, and is kept stationary for the above-mentioned predetermined time, here for about 2 seconds. At this time, the substrate 10, the susceptor 11, and the lift pin 12 are neutralized from the grounded second driving unit 16 via the lift pin 12, the lift pin fixing member 13, and the lift pin support member 14 by holding the stationary state.

Subsequently, as shown in FIG. 9B, the substrate 10 is separated from the susceptor 11 by a predetermined distance.
Specifically, the first drive unit 15 is operated to move the susceptor 11 downward, and the substrate 10 is separated from the susceptor 11 by a distance d1, and in this state, the first time is about 2 seconds. The operation of the drive unit 15 is stopped. In this state, the substrate 10 is lifted upward by a distance d1 from the susceptor 11 by the lift pins 12.

Subsequently, as shown in FIG. 9B, the substrate 10 is further separated from the susceptor 11 to a predetermined position.
Specifically, the second drive unit 16 is operated, and the lift pin 12 is moved upward together with the lift pin fixing member 13 via the lift pin support member 14, and the substrate 10 is moved from the susceptor 11 by a distance d2 (d2> d1). The operation of the second drive unit 16 is stopped at a predetermined position that is separated. Thereafter, the substrate 10 is unloaded using the transfer robot at the predetermined position.

In the present embodiment, the above-described static elimination process is performed, and the substrate 10 is stopped once when the substrate 10 is moved to a predetermined position where the substrate is unloaded. By performing this stationary step, the substrate 10 can be moved finely, and displacement of the lift pins 12 relative to the substrate 10 can be suppressed as much as possible.
In the present embodiment, the case where a static process is performed once together with the static elimination process (referred to as a two-step method for convenience) is illustrated, but the present invention is not limited to this two-step method, and the predetermined position is reached. Further, a static process may be inserted. For example, between the static elimination process of FIG. 9-1 (c) and the static process of FIG. 9-2 (a), and until the static process of FIG. 9-2 (a) and the process of FIG. 9-2 (b). It is also preferable to perform a stationary process (four-step method) in between.

  As described above, according to the present embodiment, the substrate 10 can be lifted and lowered in a desired state, and the substrate 10 can be reliably transported without causing any positional displacement of the substrate 10 when the substrate 10 is unloaded. .

  Hereinafter, various aspects of the present case will be collectively described as additional notes.

(Appendix 1) a mounting table on which a substrate is mounted;
A plurality of holes are inserted through the insertion port formed in the mounting table so as to be movable up and down, support the substrate mounted on the mounting table at an upper end, and lift the substrate with respect to the mounting table. Elevating pins,
A lifting pin fixing portion provided below the mounting table, wherein a lower end portion of each lifting pin is fixed integrally and can be raised and lowered together with each lifting pin,
And a lift pin support portion that supports the lift pin fixing portion as a contact with the lift pin fixing portion when the lift pins are lifted and lowered. Support device.

  (Additional remark 2) The board | substrate support apparatus of Additional remark 1 characterized by further including the 1st drive part which raises / lowers the mounting base.

  (Additional remark 3) Each said raising / lowering pin is engaged with the said mounting base in the state penetrated by the said insertion port of the said mounting base, The board | substrate support apparatus of Additional remark 1 or 2 characterized by the above-mentioned.

  (Additional remark 4) The board | substrate support apparatus of any one of additional marks 1-3 characterized by further including the 2nd drive part which raises / lowers the said raising / lowering pin support part.

  (Additional remark 5) The said raising / lowering pin fixing | fixed part is a cyclic | annular body which fixed each said raising / lowering pin integrally on the surface, The board | substrate support apparatus of any one of Additional remarks 1-4 characterized by the above-mentioned.

(Appendix 6) A mounting table on which a substrate is mounted;
A plurality of holes are inserted through the insertion port formed in the mounting table so as to be movable up and down, support the substrate mounted on the mounting table at an upper end, and lift the substrate with respect to the mounting table. A substrate support method using a substrate support device including lifting pins,
A first step of neutralizing the charged substrate through the lift pins in a state where the substrate is placed on the mounting table;
And a second step of moving each of the lifting pins relatively upward with respect to the mounting table, and separating the substrate from the mounting table.

(Appendix 7) The substrate support apparatus
Below the mounting table, the lower and upper pins fixed integrally, the lifting pin fixing portion that can be moved up and down,
An elevating pin support portion that is provided below the elevating pin fixing portion and supports the elevating pin fixing portion as a contact with the elevating pin fixing portion when the elevating pins are moved up and down,
In the first step, the substrate is stationary for a predetermined time while the lifting pin support portion is in contact with the lifting pin support portion and the lifting pin support portion is grounded, and the charged substrate is Static elimination from the lifting pin support through each lifting pin and the lifting pin fixing portion,
In the second step, with the lifting pin support portion in contact with the lifting pin fixing portion, the lifting pins are moved together with the lifting pin fixing portion relative to the mounting table. The substrate supporting method according to appendix 7, wherein the substrate is separated from the mounting table.

(Appendix 8) The second step includes
A step of allowing the substrate to stand still for a predetermined time with a predetermined distance away from the mounting table;
The substrate supporting method according to appendix 6 or 7, further comprising a step of moving the substrate further upward to a predetermined position after the stationary.

It is a schematic diagram for demonstrating the problem of the conventional board | substrate support apparatus. It is a schematic diagram which shows schematic structure of the board | substrate support apparatus of this case. It is a schematic diagram shown based on the comparison with a prior art about the advantage of the board | substrate support apparatus of this case. It is a schematic diagram which shows the advantage of the board | substrate support apparatus of this case. It is a schematic diagram which shows the board | substrate support method of this case. It is a schematic diagram which shows the board | substrate support method of this case. It is a schematic diagram which shows the plasma etching apparatus by this embodiment. It is a schematic sectional drawing which shows an example of operation | movement of the board | substrate support apparatus of this case. It is a schematic diagram which shows the board | substrate support method by this embodiment in order of a process. It is a schematic diagram which shows the board | substrate support method by this embodiment in order of a process. It is a schematic diagram which shows the conventional board | substrate support apparatus. It is a schematic diagram which shows the conventional board | substrate support apparatus. It is a schematic diagram for demonstrating the problem of the conventional board | substrate support apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate 11, 111 Susceptor 11a, 111a Insertion port 12, 112 Lift pin 13 Lift pin fixing member 14, 113 Lift pin support member 15 1st drive part 16 2nd drive part 21 Processing chamber 22 Substrate support apparatus 31 Shower head 32 Vacuum mechanism 33 Substrate entrance / exit 101 Arm 101a Placement position

Claims (1)

A mounting table on which a substrate is mounted;
It is inserted through the insertion port formed in the mounting table so as to be movable up and down, and is engaged and held in the mounting table in a state of being inserted into the insertion port of the mounting table, and the mounting table is placed on the mounting table. A plurality of elevating pins for supporting the substrate at the upper end and elevating the substrate with respect to the mounting table;
The lifting pin fixing portion which is provided below the mounting table and is an annular body in which the lower end portion of each lifting pin is integrally fixed on the surface and can be lifted and lowered together with the lifting pins,
An elevating pin support portion that is provided below the elevating pin fixing portion and supports the elevating pin fixing portion as a contact with the elevating pin fixing portion when the elevating pins are moved up and down ;
A first drive unit for moving the table up and down;
A substrate support apparatus comprising: a second drive unit that drives the elevation pin support unit up and down and selectively sets grounding or non-grounding .

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