JP4795899B2 - Substrate mounting mechanism and substrate delivery method - Google Patents

Description

  In the present invention, a substrate to be processed having flexibility such as a glass substrate for a flat panel display (FPD) is supported by lift pins protruding and retracting with respect to a mounting surface of the mounting table. The present invention relates to a substrate placement mechanism and a substrate delivery method for raising and lowering between a delivery position for delivery and a placement position placed on a placement table.

  In the FPD manufacturing process, various processes such as dry etching, sputtering, and CVD (chemical vapor deposition) are performed on an FPD glass substrate that is a substrate to be processed. Such processing is normally performed in a state where a glass substrate is mounted on a mounting table provided in the chamber, and generally loading and unloading of the substrate with respect to the mounting table is performed on the mounting surface of the mounting table. This is performed by a plurality of lifting pins provided so as to be able to project and retract. When loading a substrate, the lifting pins are raised to protrude from the mounting surface of the mounting table, and after the substrate transferred by the transfer member such as a transfer arm is transferred onto the lifting pins, the lifting pins are lowered. Then immerse it on the mounting surface of the mounting table. Further, when unloading the substrate, the lifting pins are raised to protrude from the mounting surface of the mounting table, and after separating the substrate from the mounting table, the substrate on the lifting pins is transferred to the transport member.

  Elevating pins are preferably provided at the peripheral edge position of the glass substrate in consideration of the effect on processing quality. Recently, however, an increase in the size of the FPD has been aimed at, and a huge glass substrate having a side exceeding 2 m also appears. Therefore, it has become difficult to support such a large glass substrate only with the lifting pins at the peripheral edge positions.

For this reason, when the glass substrate is large, raising and lowering pins are also provided at the center position so that the glass substrate can be reliably supported (see, for example, Patent Document 1). Considering the influence on the quality, the number of lifting pins provided at the center position of the glass substrate must be limited to a small number. As a result, as shown in FIG. 9A, when the glass substrate A is supported by the lift pins B and C at the peripheral edge position and the center position, the glass substrate A has a concave portion between the lift pins B and C. When the glass substrate A is placed on the mounting table D as shown in FIG. 9B, the central portion of the deformed glass substrate A is placed. There is a risk of floating from the mounting table D. In many cases, the mounting table has a temperature control function of adjusting the temperature of the glass substrate during processing.For example, in a plasma etching apparatus, the mounting table plays a role of cooling the glass substrate during plasma etching processing. If a part of the glass substrate is lifted from the mounting table, the temperature of the glass substrate becomes non-uniform in the surface, causing processing unevenness, for example, etching unevenness.
JP 2002-246450 A

  The present invention has been made in view of such circumstances, and even when the substrate to be processed is large, the substrate to be processed is reliably restrained by the lifting pins and the deformation of the substrate to be processed is effectively suppressed. Substrate placement mechanism and substrate delivery method that can be performed, substrate processing apparatus equipped with such a substrate placement mechanism, and computer-readable storage storing a control program for executing such a substrate delivery method The purpose is to provide a medium.

In order to solve the above-mentioned problem, in the first aspect of the present invention, a mounting table on which a substrate to be processed having flexibility is mounted and a mounting surface of the mounting table are provided so as to freely protrude and retract, A plurality of lift pins that lift and lower between a transfer position that supports the substrate to be processed and transfers the substrate above the mounting table, and a mounting position on the mounting table, and a drive mechanism that drives the lift pins The plurality of lifting pins include a first lifting pin that supports the peripheral portion of the substrate to be processed and a second lifting pin that supports the center portion of the substrate to be processed, When the substrate to be processed is moved up and down, the drive mechanism protrudes the first lift pin higher than the second lift pin and is stable in a state where the substrate to be processed is bent downward. so as to be supported, wherein the first and second lift pins, respectively, Load detecting unit for detecting a load of the processing substrate is provided, wherein on the basis of the detection result of the load detection unit, the difference in protrusion height between the first lift pin and the second lift pin are adjusted A substrate mounting mechanism is provided.

  In the first aspect of the present invention, it is preferable that the driving mechanism drives the first elevating pin and the second elevating pin independently.

Further, in the first aspect of the present invention described above, a control unit that controls driving of the first and second lifting pins by the driving mechanism is provided, and the control unit is a substrate to be processed at the placement position described above. Of the first and second lifting pins when the substrate to be processed is bent downward in a convex manner while maintaining contact with the mounting table. It is preferable to temporarily stop driving in the protruding direction. Alternatively, it includes a control unit that controls driving of the first and second lifting pins by the driving mechanism, and the control unit raises the substrate to be processed at the placement position toward the delivery position. On the way, when the substrate to be processed is bent downward while maintaining contact with the mounting table, the drive in the protruding direction of the first and second lifting pins is temporarily stopped. After the driving is resumed and the substrate to be processed is separated from the mounting table, the first and second lifting pins are driven in the immersion direction, and the processing substrate is bent downward in a convex shape. It is preferable to stop the driving when in contact with the first and second driving pins, and then drive the first and second lifting pins in the protruding direction again.

  Furthermore, in the first aspect of the present invention described above, the first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position. The control unit has a convex shape downward while the substrate to be processed is kept in contact with the transport member while the first and second elevating pins are driven in the protruding direction toward the delivery position. It is preferable that the driving of the first and second elevating pins in the projecting direction is temporarily stopped when the first and second elevating pins are bent. Alternatively, the first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position, and the control unit is configured to receive the first and second control pins. While the two lifting pins are driven in the projecting direction toward the delivery position, the first substrate is in a state where the substrate to be processed is bent in a convex shape while maintaining contact with the transport member. Then, the driving of the second lifting pins in the protruding direction is temporarily stopped, the driving is resumed to separate the substrate to be processed from the transport member, and then the first and second lifting pins are driven in the immersion direction. And stopping the driving when the substrate to be processed is in a state of being bent downward and contacting the transport member, and then driving the first and second lifting pins in the protruding direction again. Is preferred.

  Moreover, in the 2nd viewpoint of this invention, the substrate mounting mechanism which has the mounting base which mounts the to-be-processed substrate provided in the said processing container, the processing container which accommodates a to-be-processed substrate, The above-mentioned mounting base. A substrate processing apparatus, wherein the substrate mounting mechanism has the configuration of the first aspect. To do.

  In the second aspect of the present invention, the processing mechanism includes a gas supply mechanism for supplying a processing gas into the processing container, an exhaust mechanism for exhausting the processing container, and a plasma of the processing gas in the processing container. It is preferable to perform plasma processing on the substrate to be processed.

According to a third aspect of the present invention, the mounting table is configured such that the substrate to be processed is supported by a plurality of lifting pins projecting and retracting with respect to the mounting surface of the mounting table on which the flexible substrate to be processed is mounted. A substrate delivery method for raising and lowering between a delivery position for delivering a substrate above and a placement position on the mounting table, wherein the plurality of raising and lowering pins support a peripheral portion of a substrate to be processed. When the substrate to be processed is moved up and down, the first lifting pin protrudes higher than the second lifting pin. The substrate to be processed is stably supported in a state where the substrate is bent downward, and each of the first and second lifting pins is provided with a load detection unit that detects the load of the substrate to be processed. , Based on the detection result of each load detection unit, Providing a substrate transfer method characterized by adjusting the difference in projected height between the serial second lift pins.

In a third aspect of the present invention on the following, the way that a substrate to be processed in the placement position is raised toward the transfer position, the lower left target substrate is kept in contact with the mounting table It is preferable that the driving of the first and second lifting pins in the projecting direction is temporarily stopped when in a convexly bent state. Alternatively, when the substrate to be processed at the mounting position is being raised toward the delivery position, the substrate to be processed is bent downward while maintaining contact with the mounting table. The driving of the first and second lifting pins in the protruding direction is temporarily stopped, the driving is restarted to separate the substrate to be processed from the mounting table, and then the first and second lifting pins are immersed. The driving is stopped when the substrate to be processed is in a state of contacting the mounting table while the substrate to be processed is bent downward, and then the first and second lifting pins are moved again in the protruding direction. It is preferable to drive.

  Furthermore, in the above third aspect of the present invention, the first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position, While the first and second lifting pins are driven in the protruding direction toward the delivery position, the substrate to be processed is bent downward in a convex shape while maintaining contact with the transport member. Further, it is preferable that the driving of the first and second lifting pins in the protruding direction is temporarily stopped. Alternatively, the first and second lifting pins are configured to receive a substrate to be processed that is supported from below by a transport member and transported to the delivery position, and the first and second lifting pins are configured to receive the delivery. While the substrate is being driven in the protruding direction toward the position, the first and second lifting pins are in a state where the substrate to be processed is bent in a convex shape while maintaining contact with the transport member. The driving in the protruding direction is temporarily stopped, the driving is resumed to separate the substrate to be processed from the transport member, and then the first and second lifting pins are driven in the immersion direction so that the substrate to be processed is lowered. It is preferable to stop the driving when the conveying member is in a state of being bent in a convex shape and then drive the first and second lifting pins in the protruding direction again.

  Furthermore, according to a fourth aspect of the present invention, there is provided a computer-readable storage medium storing a control program that operates on a computer, and the control program is performed so that the substrate delivery method is performed at the time of execution. A computer-readable storage medium characterized by causing a computer to control a processing device is provided.

  According to the present invention, the plurality of lifting pins are constituted by the first lifting pins that support the peripheral portion of the substrate to be processed and the second lifting pins that support the center portion of the substrate to be processed, and the substrate to be processed is lifted or lowered. When the first raising / lowering pin protrudes higher than the second raising / lowering pin, the substrate to be processed is stably supported in a state of being bent downward, so that the processing target is processed. Even if the substrate is large, the substrate to be processed can be reliably supported by the first and second lifting pins, and the bending between the first and second lifting pins due to its own weight and the second lifting pins The deformation of the substrate to be processed due to the support reaction force can be effectively suppressed. Accordingly, it is possible to suppress the occurrence of processing unevenness by suppressing the floating of the substrate to be processed with respect to the mounting table.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a schematic sectional view of a plasma etching apparatus as an embodiment of a substrate processing apparatus provided with a substrate mounting mechanism according to the present invention, and FIG. 2 is a schematic sectional view of a planar direction thereof.

  The plasma etching apparatus 1 is configured as a capacitively coupled parallel plate plasma etching apparatus that performs etching on an FPD glass substrate (hereinafter simply referred to as “substrate”) G. Examples of the FPD include a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), and the like. The plasma etching apparatus 1 includes a chamber 2 as a processing container that accommodates the substrate G. The chamber 2 is made of, for example, aluminum whose surface is anodized (anodized), and is formed in a square tube shape corresponding to the shape of the substrate G.

  A susceptor 4 as a mounting table on which the substrate G is mounted is provided on the bottom wall in the chamber 2. The susceptor 4 is formed in a square plate shape or a column shape corresponding to the shape of the substrate G, and a base material 4a made of a conductive material such as metal and an insulating member 4b made of an insulating material covering the periphery of the base material 4a. And an insulating member 4c made of an insulating material provided so as to cover the bottoms of the base member 4a and the insulating member 4b and supporting them. A power supply line 23 for supplying high-frequency power is connected to the base material 4a, and a matching unit 24 and a high-frequency power source 25 are connected to the power supply line 23. For example, high frequency power of 13.56 MHz is applied to the susceptor 4 from the high frequency power supply 25, and thereby, the susceptor 4 is configured to function as a lower electrode. The susceptor 4 has a built-in electrostatic adsorption mechanism (not shown) for adsorbing the placed substrate G.

  A shower head 11 that supplies a processing gas into the chamber 2 and functions as an upper electrode is provided on the upper or upper wall of the chamber 2 so as to face the susceptor 4. In the shower head 11, a gas diffusion space 12 for diffusing the processing gas is formed therein, and a plurality of discharge holes 13 for discharging the processing gas are formed on the lower surface or the surface facing the susceptor 4. The shower head 11 is grounded and forms a pair of parallel plate electrodes together with the susceptor 4.

A gas inlet 14 is provided on the upper surface of the shower head 11, and a processing gas supply pipe 15 is connected to the gas inlet 14. A valve 16 and a mass flow controller 17 are connected to the processing gas supply pipe 15. A processing gas supply source 18 is connected to the via. A processing gas for etching is supplied from the processing gas supply source 18. As the processing gas, a gas usually used in this field, such as a halogen-based gas, an O ₂ gas, or an Ar gas, can be used.

  An exhaust pipe 19 is connected to the bottom wall of the chamber 2, and an exhaust device 20 is connected to the exhaust pipe 19. The exhaust device 20 includes a vacuum pump such as a turbo molecular pump, and is configured so that the inside of the chamber 2 can be evacuated to a predetermined reduced pressure atmosphere. A loading / unloading port 21 for loading / unloading the substrate G is formed on the side wall of the chamber 2, and a gate valve 22 for opening / closing the loading / unloading port 21 is provided. However, it is comprised so that it may convey between the load lock chambers which are not shown in figure in the state supported from the downward direction by the conveyance arm 40 (refer virtual line of FIG. 2, 4) as a conveyance member.

  On the substrate mounting surface of the susceptor 4 is formed a cooling space (not shown) filled with a temperature control gas such as He gas that cools the substrate G placed on the susceptor 4 and adsorbed during the plasma etching process. A temperature control gas supply line 41 for supplying temperature control gas to the cooling space is provided so as to pass through the bottom wall of the chamber 2 through the susceptor 4. A temperature control gas supply source 42 is connected to the temperature control gas supply line 41, and a pressure control valve 43 for adjusting the supply pressure of the temperature control gas is provided.

  In the bottom wall of the chamber 2 and the susceptor 4, insertion holes 7 a and 7 b penetrating therethrough are formed at the peripheral edge position and the central position (inner side or central position relative to the peripheral edge position) of the susceptor 4, respectively. . The insertion holes 7a are formed, for example, at a total of eight positions, each having a predetermined interval on each side, and the insertion holes 7b are arranged in parallel with, for example, a pair of opposing sides of the susceptor 4. Two places are formed at predetermined intervals. Lifter pins 8a and 8b (first and second raising and lowering pins) for raising and lowering the substrate G from below are inserted into the insertion holes 7a and 7b so as to protrude and retract with respect to the substrate mounting surface of the susceptor 4. Has been. The lifter pins 8a and 8b are provided so as to come into contact with the peripheral edge portion and the central portion of the substrate G when protruding, and are positioned in the radial direction or the width direction by a positioning bush (not shown) to be inserted into the insertion holes 7a and 7b. Has been inserted.

FIG. 3 is a schematic view of the substrate mounting mechanism.
As shown in FIG. 3, each of the lifter pins 8a and 8b has a lower portion protruding outside the chamber 2, and a lower end portion connected to the drive portions 9a and 9b, and is lifted and lowered by driving the drive portions 9a and 9b. Thus, the susceptor 4 is configured to protrude and immerse with respect to the substrate mounting surface. Each of the drive units 9a and 9b is configured using, for example, a stepping motor.

  Flange 26 is formed in each lower part of lifter pins 8a and 8b, and one end part (lower end part) of bellows 27 which can be expanded and contracted provided in each flange 26 so that lifter pins 8a and 8b may be surrounded. The other end (upper end) of the bellows 27 is connected to the bottom wall of the chamber 2. As a result, the bellows 27 expands and contracts following the lifting and lowering of the lifter pins 8a and 8b, and seals the gap between the insertion holes 7a and 7b and the lifter pins 8a and 8b.

  The drive of the drive units 9a and 9b is configured to be controlled separately by a controller 31 having a microprocessor (computer), whereby the lifter pin 8a and the lifter pin 8b can be lifted and lowered independently. Has been. The controller 31 includes a keyboard on which a process manager manages the drive of the drive units 9a and 9b and a display for visualizing and displaying the drive status of the drive units 9a and 9b. The interface 32 is connected to a storage unit 33 in which a control program for realizing driving of the drive units 9a and 9b by control of the controller 31 and a recipe in which drive condition data is recorded is stored. If necessary, an arbitrary recipe is called from the storage unit 33 by an instruction from the user interface 32 and is executed by the controller 31 so that the drive units 9a and 9b are driven and stopped under the control of the controller 31. Done. For example, the recipe is stored in a computer-readable storage medium such as a CD-ROM, a hard disk, or a flash memory, or is transmitted from another device at any time via, for example, a dedicated line. It is also possible to use it.

  The controller 31, the user interface 32, and the storage unit 33 constitute a control unit that controls the lifting and lowering of the lifter pins 8a and 8b by the drive units 9a and 9b, and the susceptor 4, the lifter pins 8a and 8b, the drive units 9a and 9b, and the control. The unit constitutes a substrate mounting mechanism.

  In the plasma etching apparatus 1 configured as described above, first, the substrate G is moved from the loading / unloading port 21 by the transfer arm 40 (see the phantom line in FIGS. 2 and 4) in a state where the loading / unloading port 21 is opened by the gate valve 22. After being carried in and transported to above the susceptor 4, the lifter pins 8 a and 8 b are raised and protruded higher than the transport arm 40. The lifter pins 8a and 8b and the transport arm 40 are provided so as not to contact each other. As a result, the substrate G is transferred from the transfer arm 40 onto the lifter pins 8a and 8b. At this time, as described above, the lifter pin 8a is positioned higher than the lifter pin 8b by a predetermined amount so that the load of the substrate G is distributed to the lifter pins 8a and 8b, and the substrate G is bent downwardly. In this state, the lifter pins 8a and 8b are supported. When the transfer arm 40 moves out of the chamber 2 from the loading / unloading port 21, the loading / unloading port 21 is closed by the gate valve 22, and the lifting pins 8a and 8b are lowered while keeping the lifting pin 8a at a position higher than the lifting pin 8b by a predetermined amount. Let Then, the lifter pin 8 b and the lifter pin 8 a are immersed in the placement surface of the susceptor 4 in this order, and the substrate G is placed on the susceptor 4. Since the load of the substrate G was distributed in a balanced manner to the lifter pins 8a and 8b, the substrate G was prevented from being deformed by the support reaction force of the lifter pins 8a and 8b, particularly the deformation of the central portion by the lifter pins 8b. The mounting surface of the susceptor 4 can be contacted over almost the entire surface.

  When the loading / unloading port 21 is closed by the gate valve 22 and the substrate G is placed on the susceptor 4, the inside of the chamber 2 is evacuated to a predetermined vacuum level by the exhaust device 20. Next, the process gas is supplied from the process gas supply source 18 into the chamber 2 through the process gas supply pipe 15, the gas inlet 14, and the shower head 11 while adjusting the flow rate by the mass flow controller 17. A DC voltage is applied to the electrostatic adsorption mechanism to adsorb the substrate G to the susceptor 4.

  Then, high frequency power is applied to the susceptor 4 from the high frequency power supply 25 through the matching unit 24, and a high frequency electric field is generated between the susceptor 4 as the lower electrode and the shower head 11 as the upper electrode, thereby processing in the chamber 2. While the gas is turned into plasma, the temperature control gas from the temperature control gas supply source 42 is adjusted to a predetermined pressure by the pressure control valve 43 in order to avoid a temperature change of the substrate G, for example, a temperature rise. The gas is introduced into a cooling space on the back side of the substrate G adsorbed by the susceptor 4 through the gas supply line 41. In this state, the substrate G is etched by the plasma of the processing gas.

  When the etching process is performed on the substrate G, the application of the high frequency power from the high frequency power supply 25 is stopped, the introduction of the processing gas and the temperature control gas is stopped, and the adsorption of the substrate G by the electrostatic adsorption mechanism is released. Next, the loading / unloading port 21 is opened by the gate valve 22, and the lifter pins 8 a and 8 b are raised as in the case of receiving the substrate G from the transfer arm 40, and the substrate G is bent downward to form a susceptor. 4 away from the top. Thereafter, when the transfer arm 40 enters the chamber 2 from the loading / unloading port 21, the lifter pins 8a and 8b are lowered. As a result, the substrate G is transferred from the lifter pins 8a and 8b onto the transfer arm 40. Then, the substrate G is carried out of the chamber 2 from the loading / unloading port 21 by the transfer arm 40.

  In the present embodiment, the lifter pin 8a is disposed higher than the lifter pin 8b by a predetermined amount, and is supported in a state where the substrate G is bent in a convex shape, thereby bending the portion between the lifter pins 8a and 8b and the lifter pin. Since the deformation of the substrate G due to the support reaction force of 8b can be suppressed, and the floating of the substrate G with respect to the susceptor 4 functioning as the lower electrode can be suppressed, the substrate is controlled by the temperature control gas supplied from the susceptor 4 during the plasma etching process. G can be cooled almost uniformly over the entire surface, thereby making it possible to effectively suppress the occurrence of etching unevenness. Similarly, after the etching process, the lifter pin 8a is disposed higher than the lifter pin 8b by a predetermined amount, and the substrate G is supported in a state of being bent downwardly, thereby supporting the lifter pin 8b. Since the deformation of the substrate G can be suppressed, the quality of post-processing of etching can be improved.

  Next, an example of receiving the substrate G from the transfer arm 40 and the susceptor 4 by the lifter pins 8a and 8b will be described.

FIG. 5 is a view for explaining how the substrate G is received from the transfer arm 40 by the lifter pins 8a and 8b.
The substrate G transported by the transport arm 40 may be attracted to the transport arm 40 in some cases. In this case, if the lifter pins 8a and 8b are lifted at a stroke to receive the substrate G from the transfer arm 40, the substrate G is vibrated greatly due to an impact when the substrate G is peeled off from the transfer arm 40 and is displaced. May cause damage or damage. Therefore, when the substrate G is received from the transfer arm 40 by the lifter pins 8a and 8b, first, as shown in FIG. 5A, the lifter pin 8a is disposed higher than the lifter pin 8b by a predetermined amount. The lifter pins 8a and 8b are lifted, and as shown in FIG. 5 (b), the substrate G is in contact with the lifter pin 8a while maintaining contact with the transfer arm 40 and bent downward in a convex shape. Preferably, when the substrate G is in a state immediately before leaving the transfer arm 40, the lift of the lifter pins 8a and 8b is temporarily stopped. Accordingly, even when the substrate G is adsorbed to the transfer arm 40, the substrate G is gradually peeled off from the transfer arm 40, so that the vibration of the substrate G can be suppressed. Then, as shown in FIG. 5C, the lift of the lifter pins 8 a and 8 b is resumed, and the substrate G is separated from the transfer arm 40. As a result, the substrate G can be safely transferred from the transfer arm 40 to the lifter pins 8a and 8b.

  As shown in FIG. 5C, when the lift of the lifter pins 8a and 8b is resumed and the substrate G is separated from the transfer arm 40, for example, the central portion is attracted to the transfer arm 40. When the substrate G vibrates, the lifter pins 8a and 8b are lowered as shown in FIG. Then, as shown in FIG. 5E, when the substrate G is in a state where it is in contact with the transfer arm 40 again while being bent downward, more preferably, immediately after the substrate G is in contact with the transfer arm 40. Then, the lowering of the lifter pins 8a and 8b is stopped. In this state, the contact portion between the substrate G and the transfer arm 40 is small, and there is no possibility that the substrate G will be attracted to the transfer arm 40 again, so that the vibration of the substrate G can be more reliably suppressed. Thereafter, as shown in FIG. 5 (f), the lifter pins 8a and 8b are lifted again, and the substrate G is separated from the transfer arm 40, so that the substrate G is safer on the lifter pins 8a and 8b from the transfer arm 40. It becomes possible to transfer to.

FIG. 6 is a view for explaining how the substrate G is received from the susceptor 4 by the lifter pins 8a and 8b.
Since the substrate G after the etching process may be adsorbed to the susceptor 4 that functions as the lower electrode even if the adsorption by the electrostatic adsorption mechanism is released, the substrate G from the susceptor 4 by the lifter pins 8a and 8b The reception is preferably performed in the same manner as the reception from the transfer arm 40. First, as shown in FIG. 6 (a), the lifter pins 8a and 8b are raised so that the lifter pin 8a is disposed higher than the lifter pin 8b by a predetermined amount (only the lifter pin 8a may be raised). 6B, the substrate G is in contact with the lifter pin 8a while maintaining contact with the transfer arm 40, and is bent downward in a convex shape. More preferably, the substrate G is removed from the susceptor 4. In the state immediately before leaving, the lift of the lifter pins 8a and 8b is temporarily stopped. Then, as shown in FIG. 6C, the lift of the lifter pins 8 a and 8 b is resumed, and the substrate G is separated from the transfer arm 40. Accordingly, it is possible to safely transfer the substrate G from the susceptor 4 to the lifter pins 8a and 8b while suppressing the vibration of the substrate G.

  6C, when the lift of the lifter pins 8a and 8b is resumed and the substrate G is separated from the susceptor 4, for example, the central portion is adsorbed to the susceptor 4, so that the substrate When vibration occurs in G, the lifter pins 8a and 8b are lowered as shown in FIG. 6D, and the substrate G is bent downwardly as shown in FIG. 6E. The lowering of the lifter pins 8a, 8b is stopped when the substrate G is in contact with the susceptor 4 again, more preferably in the state immediately after the substrate G is in contact with the susceptor 4. Thereafter, as shown in FIG. 6F, the lifter pins 8 a and 8 b are raised again, and the substrate G is separated from the transfer arm 40. Thereby, the vibration of the substrate G can be more reliably suppressed, and the substrate G can be safely transferred from the susceptor 4 to the lifter pins 8a and 8b.

  Next, the load of the board | substrate G which acts on each lifter pin 8a, 8b at the time of supporting the board | substrate G was measured, adjusting the difference in the protrusion height of the lifter pin 8a and the lifter pin 8b. The size (length × width) of the substrate G is 1800 mm × 1500 mm, and the load on the substrate G acting on the lifter pins 8a, 8b is measured at the tip of each lifter pin 8a, 8b as shown in FIG. This was performed by a load sensor 50 as a provided load detection unit. The results are shown in FIG. In FIG. 8, the vertical axis is (measured value by each load sensor 50), and the horizontal axis is (height of lifter pin 8b−height of lifter pin 8a).

  As shown in FIG. 8, when the lifter pins 8a are arranged slightly higher than the lifter pins 8b, the measurement values of the load sensors 50 vary greatly, but the heights of the lifter pins 8a and the lifter pins 8b are high. As the difference in height increases, the variation in the measured values by the load sensors 50 decreases, and when the lifter pin 8a is disposed higher than the lifter pin 8b by a predetermined amount, here about 20 mm, the lifter pin 8a. The variation in the measured values by the load sensors 50 is smaller than when the lifter pin 8b is disposed at a height equal to that of the lifter pin 8b or when the lifter pin 8a is disposed at a height lower than the lifter pin 8b. That is, it was confirmed that the load of the substrate G can be distributed to each of the lifter pins 8a and 8b in a balanced manner by disposing the lifter pins 8a higher than the lifter pins 8b by a predetermined amount as in this embodiment. Therefore, according to the present embodiment, it is considered that the deformation of the substrate G can be suppressed and the substrate G can be stably supported.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made. In the above embodiment, a plurality of, for example, two lifter pins for supporting the central portion of the substrate are provided, but one lifter pin may be provided. In the above embodiment, the independent drive unit is used so that the lifter pin that supports the peripheral portion of the substrate is disposed higher than the lifter pin that supports the central portion of the substrate by a predetermined amount. It is possible to change the length of each lifter pin in advance and drive each lifter pin by the same drive unit, or to change the length of each lifter pin in advance and use an independent drive unit Is possible. Furthermore, in the above-described embodiment, an example in which the present invention is applied to an RIE type capacitively coupled parallel plate plasma etching apparatus that applies high-frequency power to the lower electrode has been described. However, the present invention is not limited thereto, and other plasmas such as ashing and CVD film formation are used. The present invention can be applied to a processing apparatus, and can also be applied to any substrate processing apparatus other than a plasma processing apparatus that mounts a substrate on a mounting table for processing. Furthermore, although the said embodiment demonstrated the example applied to the glass substrate for FPD, it is applicable to the board | substrate with flexibility other than the glass substrate for FPD.

It is a schematic sectional drawing of the side surface direction of the plasma etching apparatus which is one Embodiment of the substrate processing apparatus provided with the substrate mounting mechanism based on this invention. It is a schematic sectional drawing of the plane direction of a plasma etching apparatus. It is the schematic of a substrate mounting mechanism. It is a figure for demonstrating the support aspect of the board | substrate by the lifter pin which is a component of a board | substrate mounting mechanism. It is a figure for demonstrating the reception aspect of the board | substrate from the conveyance arm by a lifter pin. It is a figure for demonstrating the reception aspect of the board | substrate from a susceptor by a lifter pin. It is a figure for demonstrating the measuring method of the load of the board | substrate which acts on a lifter pin. It is a figure which shows the measurement result by the measuring method shown in FIG. It is the schematic of the conventional board | substrate mounting mechanism.

Explanation of symbols

1: Plasma etching equipment (substrate processing equipment: plasma processing equipment)
2: Chamber (processing container)
4: Susceptor (mounting table)
8a: Lifter pin (first lifting pin)
8b: Lifter pin (second lifting pin)
9a, 9b: Drive unit (drive mechanism)
15: Process gas supply pipe 18: Process gas supply source 19: Exhaust pipe 20: Exhaust device 25: High frequency power supply 31: Controller 32: User interface 33: Storage unit 40: Transfer arm (transfer member)
50: Load sensor (load detection unit)
G: Glass substrate (substrate to be processed)

Claims (14)

A mounting table for mounting a substrate to be processed having flexibility;
Between the mounting position on the mounting table and the mounting position that is provided so as to be able to project and retract with respect to the mounting surface of the mounting table and supports the substrate to be processed and transfers the substrate above the mounting table. A plurality of lifting pins to be raised and lowered;
A substrate mounting mechanism comprising a driving mechanism for driving the elevating pins,
The plurality of lifting pins include a first lifting pin that supports a peripheral portion of the substrate to be processed, and a second lifting pin that supports a center portion of the substrate to be processed.
When the substrate to be processed is moved up and down, the drive mechanism protrudes the first lift pin higher than the second lift pin and is stable in a state where the substrate to be processed is bent downward. so as to be supported by,
Each of the first and second lifting pins is provided with a load detection unit that detects the load of the substrate to be processed. Based on the detection result of each load detection unit, the first lifting pin and the second lifting pin are provided. A substrate mounting mechanism characterized in that a difference in protruding height from an elevation pin is adjusted .   2. The substrate mounting mechanism according to claim 1, wherein the driving mechanism is capable of independently driving the first lifting pins and the second lifting pins. A controller that controls driving of the first and second lifting pins by the driving mechanism ;
The control unit is in a state in which the substrate to be processed is bent downward in a convex shape while keeping the contact with the mounting table while raising the substrate to be processed at the mounting position toward the delivery position. 3. The substrate mounting mechanism according to claim 1, wherein driving of the first and second elevating pins in the protruding direction is temporarily stopped at the time. A controller that controls driving of the first and second lifting pins by the driving mechanism ;
The control unit is in a state in which the substrate to be processed is bent downward in a convex shape while keeping the contact with the mounting table while raising the substrate to be processed at the mounting position toward the delivery position. At this time, the driving of the first and second lifting pins in the protruding direction is temporarily stopped, the driving is resumed to separate the substrate to be processed from the mounting table, and then the first and second lifting and lowering pins are performed. The pin is driven in the immersion direction, and this drive is stopped when the substrate to be processed is in a state of being bent downward and in contact with the mounting table, and then the first and second lifting pins are moved again. The substrate mounting mechanism according to claim 1, wherein the substrate mounting mechanism is driven in a protruding direction. The first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position.
While the first and second elevating pins are driven in the projecting direction toward the delivery position, the control unit projects downward while the substrate to be processed remains in contact with the transport member. 5. The substrate mounting mechanism according to claim 3, wherein driving of the first and second elevating pins in a protruding direction is temporarily stopped in a bent state. 6. The first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position.
While the first and second elevating pins are driven in the projecting direction toward the delivery position, the control unit projects downward while the substrate to be processed remains in contact with the transport member. After the first and second elevating pins are driven in the projecting direction in a bent state, the driving in the projecting direction is temporarily stopped and the driving is resumed to separate the substrate to be processed from the transport member. The second raising / lowering pin is driven in the immersion direction, and this drive is stopped when the substrate to be processed is in contact with the transport member while being bent downwardly, and then the first and second pins are driven. 5. The substrate mounting mechanism according to claim 3, wherein the elevating pins are again driven in the protruding direction. A processing container for storing a substrate to be processed;
A substrate mounting mechanism provided in the processing container and having a mounting table for mounting a substrate to be processed;
A processing mechanism for performing a predetermined process on the target substrate placed on the mounting table;
Comprising
7. The substrate processing apparatus, wherein the substrate mounting mechanism has a configuration according to any one of claims 1 to 6.   The processing mechanism includes a gas supply mechanism that supplies a processing gas into the processing container, an exhaust mechanism that exhausts the processing container, and a plasma generation mechanism that generates plasma of the processing gas in the processing container. The substrate processing apparatus according to claim 7, wherein plasma processing is performed on the substrate to be processed. A transfer position for supporting the substrate to be processed by a plurality of lifting pins projecting and retracting with respect to the mounting surface of the mounting table on which the flexible substrate to be processed is mounted, and transferring the substrate above the mounting table; A substrate delivery method for moving up and down between the mounting position on the mounting table,
The plurality of elevating pins are composed of a first elevating pin that supports the peripheral portion of the substrate to be processed and a second elevating pin that supports the center portion of the substrate to be processed,
When raising and lowering the substrate to be processed, the first raising and lowering pins protrude higher than the second raising and lowering pins so that the substrate to be treated is stably supported in a state of being bent downward. to,
Each of the first and second lifting pins is provided with a load detection unit that detects the load of the substrate to be processed, and based on the detection result of each load detection unit, the first lifting pin and the second lifting pin A substrate delivery method comprising adjusting a difference in protrusion height . While the substrate to be processed at the mounting position is being raised toward the delivery position, the substrate is bent in a convex shape while maintaining contact with the mounting table. The substrate delivery method according to claim 9, wherein driving of the first and second lifting pins in the protruding direction is temporarily stopped. While the substrate to be processed at the mounting position is being raised toward the delivery position, the substrate is bent in a convex shape while maintaining contact with the mounting table. The drive in the protruding direction of the first and second lifting pins is temporarily stopped, the driving is resumed to separate the substrate to be processed from the mounting table, and then the first and second lifting pins are moved in the immersion direction. The driving is stopped when the substrate to be processed is in a state of being bent downward and in contact with the mounting table, and then the first and second lifting pins are driven again in the protruding direction. The substrate delivery method according to claim 9 . The first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position,
While the first and second elevating pins are driven in the protruding direction toward the delivery position, the substrate to be processed is bent in a convex shape while maintaining contact with the transport member. substrate transfer method according to claim 9 in any one of claims 11, wherein the once stopping the driving of the to the first and second projecting direction of the lifting pin when. The first and second lifting pins are configured to receive a substrate to be processed which is supported from below by a transport member and transported to the delivery position,
While the first and second elevating pins are driven in the protruding direction toward the delivery position, the substrate to be processed is bent in a convex shape while maintaining contact with the transport member. Sometimes, the drive of the first and second lifting pins in the protruding direction is temporarily stopped, the driving is restarted to separate the substrate to be processed from the transport member, and then the first and second lifting pins Is driven in the immersion direction, and this drive is stopped when the substrate to be processed is in a state of being bent downward and in contact with the transport member, and then the first and second lifting pins protrude again. substrate transfer method according to claims 9 to any one of claims 11, wherein the driving direction. A computer-readable storage medium storing a control program that runs on a computer,
The control program, as the substrate transfer method according to any one of claims 13 to runtime claims 9 is performed, computer-readable storage medium, characterized in that to control the processing unit to the computer.

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