CN106486411B - Substrate board treatment, the position detection of lifter pin, adjusting and method for detecting abnormality - Google Patents
Substrate board treatment, the position detection of lifter pin, adjusting and method for detecting abnormality Download PDFInfo
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- CN106486411B CN106486411B CN201610768372.8A CN201610768372A CN106486411B CN 106486411 B CN106486411 B CN 106486411B CN 201610768372 A CN201610768372 A CN 201610768372A CN 106486411 B CN106486411 B CN 106486411B
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- lifter pin
- height
- substrate
- servomotor
- pin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The present invention provides the substrate board treatment that can be properly positioned the height and position of lifter pin in a short time.From the drive control part (51) of control unit (50) to the driving instruction of the driving portion sending motor of lifting pin assembly.Receive the driving instruction, motor makes lifter pin rise driving with rotation speed corresponding with command pulse and torque rotation driving.It abuts test section (53) and monitors that in servo amplifier be output valve.For example, determining that the front end of lifter pin is abutted with the lower surface of mounting object when the absolute value of the delay pulse of the aggregate-value of the command pulse as the offset counter in servo amplifier is more than threshold value.
Description
Technical field
The present invention relates to have for making such as the substrate elevating of flat-panel monitor (FPD) substrate elevating with glass substrate
Device implements the substrate board treatment of processing, the height position detection method and height and position adjusting method of lifter pin to substrate
And the method for detecting abnormality of lifter pin.
Background technique
In the substrate board treatment for the processing such as substrate for example being etched, being formed a film, set in the mounting table of mounting substrate
Being equipped with can be relative to the multiple lift pins that substrate-placing face is prominent and submerges.And rising or falling these lifter pins into
The handover of row substrate.During handling substrate, lifter pin is accommodated in the hole for being formed in mounting table.
About the control of lifter pin, a kind of semiconductor substrate processing apparatus of motion in patent document 1 is included pair
The monitoring unit that the variation for the load that the motor of driving lifter pin is born is monitored when normal；With in the load obtained by monitoring
Variable quantity overrate when, determine the judging part that the movement of lifter pin is abnormal.
In addition, following technologies of motion in patent document 2: when by electrostatic chuck Electrostatic Absorption semiconductor substrate,
The front end of lifter pin is set only to rise specified amount from the adsorption plane of electrostatic chuck, based on the motor drive from driving lifter pin
The motor torque signal of device detects semiconductor substrate to the adsorbed state of electrostatic chuck.
In turn, the control about the motor in semiconductor manufacturing apparatus, patent document 3 motion are non-drive in motor
The technology of pulse caused by monitoring encoder when also normal when dynamic state.In addition, the following technologies of patent document 4 motion: in quilt
Before kinetoplast reaches target position, electric current obtained by proportional integration is carried out to deviation to the circulation of AC servomotor, is arrived by kinetoplast
When up to target position, in the electric current of the proportional value of the circulation of AC servomotor and deviation.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2010-278271 bulletin (Fig. 4 etc.)
Patent document 2: Japanese Unexamined Patent Publication 2008-277706 bulletin (the scope of the claims etc.)
Patent document 3: Japanese Unexamined Patent Publication 2000-152676 bulletin (the scope of the claims etc.)
Patent document 4: Japanese Unexamined Patent Publication 9-201083 bulletin (Fig. 2 etc.)
Summary of the invention
Invention technical problem to be solved
The glass substrate of FPD has the tendency that enlargement continues to develop and its thickness is thinning in recent years.In order to steadily
Bearing large size and thin glass substrate, it is necessary to increase the quantity of lifter pin.Therefore, the face of glass substrate is avoided in the prior art
Interior commercialization field (region of setting member, wiring etc.) and configure lifter pin, and there is also in glass substrate from now on
The demand of the lower section configuration lifter pin in the commercialization region in face.But in the feelings of the lower section in commercialization region configuration lifter pin
It under condition, during handling substrate, can be in contact with substrate when the position of lifter pin is excessively high, and become point reason not
Equal reason.On the other hand, during handling substrate, when the position of lifter pin is too low, since electric field falls into base
Gap between plate and the front end of lifter pin becomes the reason for generating that processing is uneven such as etching spot.It correctly grasps as a result,
The position of lifter pin is critically important for the reliability for ensuring product.
But there is no the schemes for establishing the automatically position of grasp lifter pin all the time, but operator for example makes
The position of each lifter pin is measured with Measuring Devices such as dial ga(u)ges, therefore the time spent by positioning is long, there are devices
Downtime long life the problem of.
The object of the present invention is to provide can the short time correctly grasp lifter pin height and position substrate board treatment.
For solving the technical solution of technical task
Substrate board treatment of the invention includes: the mounting table for loading substrate；Substrate lifting device comprising be arranged to
Enough substrate supporting faces relative to above-mentioned mounting table it is prominent and submerge and the lifter pin of the handover that carries out aforesaid substrate and as making
The servomotor for the driving portion that the lifter pin rises or falls；With the control unit of control aforesaid substrate lifting device.Moreover,
In substrate board treatment of the invention, above-mentioned control unit includes abutting test section, monitors the electricity from above-mentioned servomotor
The output valve of motivation driver detects the front end and the lower surface for the mounting object for being placed in aforesaid substrate bearing surface of above-mentioned lifter pin
The height and position of abutting.
In addition, can be in substrate board treatment of the invention, by as the command pulse of above-mentioned servomotor with
The delay pulse of the difference of feedback pulse monitored as above-mentioned output valve, or using the torque value of above-mentioned servomotor as
Above-mentioned output valve is monitored.
In addition, can be in substrate board treatment of the invention, above-mentioned control unit further includes height and position adjustment portion,
After the front end of above-mentioned lifter pin is abutted with the lower surface of above-mentioned mounting object, make above-mentioned lifter pin decline specified amount.
In addition, can be in substrate board treatment of the invention, above-mentioned control unit further includes abnormity detection portion, based on extremely
The front end of above-mentioned lifter pin abutted with the lower surface of above-mentioned mounting object until amount of movement or to abut after stop until movement
Amount, detects the exception of above-mentioned lifter pin.
In addition, can be in substrate board treatment of the invention, above-mentioned control unit further includes setting above-mentioned lifter pin
The driving speed configuration part of driving speed.It can be at this time, above-mentioned driving speed configuration part sets following speed: on carrying out
It states the handover of substrate and drives the first driving speed of above-mentioned lifter pin；In order to detect the front end of above-mentioned lifter pin and be placed in
State the above-mentioned mounting object in substrate supporting face lower surface abut height and position and drive above-mentioned lifter pin, than it is above-mentioned first drive
The second small driving speed of dynamic speed.
The height position detection method of lifter pin of the invention is to include the mounting table of mounting substrate, be arranged to phase
Lifter pin that is prominent for the substrate supporting face of above-mentioned mounting table and shifting with submerging and as make above-mentioned lifter pin rise or under
The method of the height and position of above-mentioned lifter pin is detected in the substrate board treatment of the servomotor of the driving portion of drop.The lifter pin
Height position detection method include: the up step for increase from the first height and position above-mentioned lifter pin；And detecting step, root
According to the output valve of the motor driver from above-mentioned servomotor, detects the front end of above-mentioned lifter pin and be placed in above-mentioned base
The abutting of the lower surface of the mounting object of plate bearing surface.
The height and position adjusting method of lifter pin of the invention is to include the mounting table of mounting substrate, be arranged to phase
Lifter pin that is prominent for the substrate supporting face of above-mentioned mounting table and shifting with submerging and as make above-mentioned lifter pin rise or under
The method of the height and position of above-mentioned lifter pin is adjusted in the substrate board treatment of the servomotor of the driving portion of drop.The height position
Setting adjusting method includes: the up step for increase from the first height and position above-mentioned lifter pin；Detecting step, according to above-mentioned servo
The output valve of the motor driver of motor detects the front end of above-mentioned lifter pin and is placed in the mounting of aforesaid substrate bearing surface
The abutting of the lower surface of object；When with detecting to have abutted in above-mentioned detecting step, make above-mentioned lifter pin in the second height and position
The stopping step of stopping.
In addition, the height and position adjusting method of lifter pin of the invention can further include with the front end of above-mentioned lifter pin with it is upper
On the basis of the height and position or above-mentioned second height and position of lower surface abutting for stating mounting object, above-mentioned lifter pin is made to drop to third
The decline step of height and position.
The method for detecting abnormality of lifter pin of the invention be include mounting substrate mounting table, be arranged to relative to
The substrate supporting face of above-mentioned mounting table is prominent and the lifter pin that submerges and as the driving portion for rising or falling above-mentioned lifter pin
Servomotor substrate board treatment in detect the abnormal method of above-mentioned lifter pin.The method for detecting abnormality of the lifter pin
It include: the up step for increase from the first height and position above-mentioned lifter pin；Detecting step, according to from above-mentioned servomotor
Motor driver output valve, detect above-mentioned lifter pin front end and be placed under the mounting object of aforesaid substrate bearing surface
The abutting on surface；And anomalies detecting step, based on from above-mentioned first height and position to the front end of above-mentioned lifter pin and above-mentioned load
Amount of movement until the height and position that the lower surface of glove abuts or the second height position for stopping above-mentioned lifter pin to after abutting
It is set to amount of movement only, detects the exception of above-mentioned lifter pin.
The height position detection method of the lifter pin of aforementioned present invention, the height and position adjusting method of lifter pin and lifter pin
Method for detecting abnormality in can be, by the delay pulse as the difference of the command pulse and feedback pulse of above-mentioned servomotor
It is monitored as above-mentioned output valve, or is monitored the torque value of above-mentioned servomotor as above-mentioned output valve.
In addition, the height and position adjusting method of the height position detection method of the lifter pin of aforementioned present invention, lifter pin and
It can be in the method for detecting abnormality of lifter pin, above-mentioned servomotor is arranged to switch following speed: on carrying out
It states the handover of substrate and drives the first driving speed of above-mentioned lifter pin；With in order to detect above-mentioned lifter pin front end and above-mentioned load
The abutting of the lower surface of glove and drive the second driving speed above-mentioned lifter pin, smaller than above-mentioned first driving speed, it is above
It states the second driving speed and carries out above-mentioned up step.
Invention effect
According to the present invention, since from the output valve of the motor driver of driving portion as index, can with example
It such as utilizes the manual positioning of dial ga(u)ge same or higher precision, the front end for quickly and automatically detecting lifter pin reaches
The case where loading the lower surface of object.Thereby, it is possible to the times needed for substantially shortening the positioning of lifter pin, therefore can reduce device
Downtime, improve the efficiency of processing substrate.
Detailed description of the invention
Fig. 1 is the summary sectional view for indicating an example of plasma-etching apparatus of one embodiment of the present invention.
Fig. 2 is the block figure for indicating the structure of driving portion of lifting pin assembly.
Fig. 3 is the block figure for indicating the hardware configuration of control unit.
Fig. 4 is the Function Block Diagram for indicating the function of control unit relevant to the lifting control of pin assembly.
Fig. 5 is the partial section view for indicating the top of the mounting table of height and position of lifter pin.
Fig. 6 is the partial section view for indicating the top of the mounting table of another height and position of lifter pin.
Fig. 7 be shown schematically in servo amplifier offset counter it is accumulative obtained by be detained the time change of pulse
Figure.
Fig. 8 is the height and position detection/adjusting method sequence for indicating the lifter pin of first embodiment of the invention
The flow chart of an example.
Fig. 9 is the explanatory diagram for indicating the example of the mounting object other than substrate.
Figure 10 is an example for indicating the sequence of height and position adjusting method of the lifter pin of second embodiment of the present invention
Flow chart.
Figure 11 is the partial section view for indicating the top of the mounting table of another height and position of lifter pin.
Figure 12 is the stream for indicating an example of the sequence of the method for detecting abnormality of lifter pin of third embodiment of the present invention
Cheng Tu.
Figure 13 is the figure for showing schematically the time change of torque value of servomotor.
Description of symbols
50 ... control units, 51 ... drive control parts, 51a ... driving speed configuration part, 51b ... height and position tune
Section portion, 53 ... abutting test sections, 53a ... threshold value storage unit, 53b ... determination unit, 55 ... abnormity detection portions,
55a ... threshold value storage unit, 55b ... determination unit.
Specific embodiment
The embodiment that the present invention will be described in detail referring to the drawings.Firstly, illustrating an embodiment party of the invention referring to Fig.1
The plasma-etching apparatus of formula.What plasma-etching apparatus 100 was configured to be etched the substrate S of the rectangle of FPD
The parallel flat plasma-etching apparatus of capacitively coupled.In addition, liquid crystal display (LCD), electricity can be illustrated as FPD
Photoluminescence (Electro Luminescence:EL) display, plasm display panel (PDP) etc..
<process container>
What the plasma-etching apparatus 100 had that surface implements anodized (alumite processing) includes aluminium
Be formed as the process container 1 of angle barrel shape.Process container 1 is made of bottom wall 1a and 4 side wall 1b.In addition, in process container 1
Upper bond has lid 1c.Lid 1c is configured to be opened and closed using switching mechanism (not shown).In the state for closing lid 1c
The not shown seal member in the bonding part of lower cover 1c and each side wall 1b seals, and the air-tightness in process container 1 is protected
It holds.
<mounting table>
The mounting table 3 of mounting substrate S is provided in process container 1.It also include: example as the mounting table of lower electrode 3
Such as substrate 3a comprising aluminium, stainless steel (SUS) conductive material；Cover the insulating element (illustration omitted) of substrate 3a.Separately
Outside, high frequency electric source, illustration omitted are connected with via supply lines, matching box in substrate 3a.
In addition, mounting table 3 has electrode for electrostatic attraction 5 on substrate 3a.Electrode for electrostatic attraction 5 have rise from below according to
The secondary construction for being laminated with the first insulating layer 5a, electrode 5b and second insulating layer 5c.From DC power supply 5d via supply lines 5e to
Electrode 5b between one insulating layer 5a and second insulating layer 5c applies DC voltage, and thus, it is possible to for example by Coulomb force to substrate S
Carry out Electrostatic Absorption.
In addition, mounting table 3 has multiple lift pins device 7.Lifting pin assembly 7 as substrate lifting device is according to substrate
The area of S is for example configured with several to dozens of.Each lifting pin assembly 7 is driven by independent driving source respectively.Each lifter pin dress
Setting 7 includes: to be inserted in the hole 3b of substrate 3a setting of mounting table 3 from below, is configured to the base relative to mounting table 3
The lifter pin 7a that plate bearing surface protrusion and the mode submerged are displaced；Drive the driving portion 7b of lifter pin 7a.In addition, as shown in Figure 1,
When mounting table 3 has electrode for electrostatic attraction 5, " the substrate supporting face of mounting table " means the upper surface of electrode for electrostatic attraction 5.
Lifter pin 7a supporting substrates S, and using driving portion 7b mounting table 3 substrate supporting face with leave the position in the substrate supporting face
Between setting, make substrate S lifting displacement.The detailed construction of lifting pin assembly 7 is described below.
<gas supply mechanism>
The spray head 9 to work as upper electrode is provided in the top of mounting table 3.Spray head 9, which is supported on processing, to be held
The lid 1c on the top of device 1.Spray head 9 is formed as hollow form, is provided with gas diffusion space 9a inside it.In addition, spraying
The lower surface (opposite face with mounting table 3) for drenching head 9 is formed with multiple gases row of the discharge as the etching gas of processing gas
Portal 9b.The spray head 9 ground connection constitutes a pair of of parallel plate electrode with mounting table 3 together.
Gas introduction port 11 is provided near the center upper portion of spray head 9.It is connected with and is used in the gas introduction port 11
Supply the gas supply pipe 13 of processing gas.The another side of the gas supply pipe 13 is connected with such as supply as processing gas
Etching gas etc. gas supply source 15.
<exhaust gear>
The position close to 4 angles in above-mentioned process container 1 is formed in multiple positions of bottom wall 1a and opens as perforation
The exhaust of oral area opening 1d (only illustrates 2).Exhaust pipe 17 is connected with opening 1d in each exhaust.Exhaust pipe 17 with have example
The exhaust apparatus 19 of such as turbomolecular pump vacuum pump connects.Rule can will be evacuated in process container 1 by exhaust apparatus 19
Fixed reduced atmosphere.
<substrate carrying-in/carrying-out mouth>
The side wall 1b of process container 1 is provided with substrate conveying opening 1e.Substrate conveying is with opening 1e by gate valve 21
Opening and closing can transport substrate S between adjacent carrying room (diagram is omitted) at it.
<lifting pin assembly>
Then, lifting pin assembly 7 is described in detail.One lifting pin assembly 7 include: as described above carry out lifting displacement and into
The lifter pin 7a of the handover of row substrate S；With the driving portion 7b of driving lifter pin 7a.Fig. 2 is the block for indicating the structure of driving portion 7b
Figure.Driving portion 7b be have pulse generating unit 31, servo amplifier 33, motor 35, encoder 37 servomotor.?
Servo amplifier 33 is provided with offset counter 33a.
Pulse generating unit 31 is, for example, programmable logic controller (PLC) (PLC), passes through the control of supervisory control unit 50 (aftermentioned)
It makes and generates the command pulse for being used for drive motor 35, input servo amplifier 33.
Servo amplifier 33 exports the command signal for being used for drive motor 35 to motor 35, also, receives by electricity
Motivation 35 is driven and the feedback signal that generates, come the output torque, rotation speed, position etc. for controlling motor 35.In addition,
The various parameters of signal based on above-metioned instruction, above-mentioned feedback signal are output to control unit 50 (aftermentioned) by servo amplifier 33.It watches
Amplifier 33 is taken with offset counter 33a and D/A transformation component (not shown).To raw from pulse in offset counter 33a
Cumulative calculation is carried out at the command pulse in portion 31.
Motor 35 and lifter pin 7a link, when command pulse is entered servo amplifier 33, with the command pulse
Corresponding rotation speed and torque rotation driving, drive upside down lifter pin 7a.
Encoder 37 generates the feedback pulse proportional to the revolving speed of motor 35 when motor 35 rotates, and feeds back
To servo amplifier 33.
In the lifting pin assembly 7 with the above structure, based on the instruction from control unit 50, pulse generating unit 31 is generated
For the command pulse of drive motor 35, servo amplifier 33 is inputted.Drift gage of the command pulse in servo amplifier 33
The aggregate-value (being detained pulse) of cumulative calculation in number device 33a, the command pulse is transformed to DC simulation voltage, revolves motor 35
Turn, lifter pin 7a is driven upside down.When motor 35 rotates, generated by encoder 37 proportional to the revolving speed of motor 35
Feedback pulse.The feedback pulse feeds back to servo amplifier 33, subtracts the delay pulse of offset counter 33a.
<control unit>
Each constituting portion of plasma-etching apparatus 100 is connect with control unit 50, is uniformly controlled by control unit 50.Control unit
50 be the module controller (Module Controller) for controlling each constituting portion of plasma-etching apparatus 100.Control unit 50
It is connect with I/O module (not shown).The I/O module has multiple portions I/O, connects with each terminal of plasma-etching apparatus 100
It connects.The portion I/O is provided with the port I/O of the input and output for controlling digital signal, analog signal and serial signal.For each
The control signal of terminal is exported from the portion I/O respectively.In addition, the output signal from each terminal inputs the portion I/O respectively.In plasma
In body Etaching device 100, as the terminal being connect with the portion I/O, such as lifting pin assembly 7, exhaust apparatus 19 can be enumerated etc..
Illustrate an example of the hardware configuration of control unit 50 referring to Fig. 3.Control unit 50 includes main control unit 101, keyboard, mouse
The output devices 103 such as equal input units 102, printer, display device 104, storage device 105, external interface 106 and by they
The bus 107 being connected to each other.Main control unit 101 has CPU (central processing unit) 111, RAM (random access memory) 112
With ROM (read-only memory) 113.Storage device 105 does not limit its form, e.g. hard disk device as long as it can store information
Or optical disc apparatus.In addition, storage device 105 records information to the storage medium 115 that computer can be read, from storage medium
115 read information.Storage medium 115 does not limit its form, e.g. hard disk, CD, flash memory etc. as long as being able to record information.
Storage medium 115 can be the storage medium of the scheme of the substrate processing method using same of storage present embodiment.
In control unit 50, CPU111 is executed by the way that RAM112 is used as working region in ROM113 or storage device 105
The program of middle storage can execute the plasma etching to substrate S in the plasma-etching apparatus 100 of present embodiment
Processing.
Fig. 4 is the Function Block Diagram for indicating the function relevant to the lifting control of pin assembly 7 in control unit 50.Such as Fig. 4 institute
Show, control unit 50 has drive control part 51, abuts test section 53, abnormity detection portion 55.
Drive control part 51 carries out the drive control of lifting pin assembly 7, is specifically controlled, thus driving and stopping
Up and down displacement of the lifter pin 7a relative to driving portion 7b.In addition, drive control part 51 has driving speed configuration part 51a and height
Position-regulation portion 51b.Driving speed configuration part 51a sets the speed moved up and down for making lifter pin 7a.In the present embodiment,
Following speed are switchably set: driving the first driving speed of lifter pin 7a in order to carry out the handover of substrate S；With in order to examine
It surveys the front end of lifter pin 7a and height and position that the lower surface for the mounting object being positioned in mounting table 3 abuts and drives lifter pin 7a
The second driving speed.Second driving speed be set to it is smaller than the first driving speed, such as with 1mm/ point~10mm/ points or so into
The raising and lowering of row lifter pin 7a.Hereinafter, by lifter pin 7a is known as when driving upside down in order to carry out the handover of substrate S
" handover mode ", the height that the front end in order to detect lifter pin 7a is abutted with the lower surface for the mounting object being positioned in mounting table 3
It is known as " detection pattern " when spending position and driving upside down lifter pin 7a.In addition, in the detection pattern of present embodiment, to drive
Dynamic speed second driving speed smaller than handover mode carries out the driving of lifter pin 7a, but also can replace driving speed, and incite somebody to action
Other parameters such as speed gain, position gain etc. are respectively set as different values in each mode.In addition, height and position is adjusted
Portion 51b can be saved abutted from the front end of lifter pin 7a with the lower surface of mounting object after the height and position that stops further drive liter
Drop pin 7a and the amount of movement (that is, path increment of the lifter pin 7a of displacement) when carrying out the adjustment of height and position.In addition, mounting object meaning
Taste substrate S or aftermentioned load-carrying 60 (referring to Fig. 9).
It abuts test section 53 and detects the height and position that the front end of lifter pin 7a is abutted with the lower surface of mounting object.Specifically
Say, abut test section 53 and monitor output valve in the servo amplifier 33 as motor driver, by the output valve with
Preset threshold value is compared, and determines whether the front end of lifter pin 7a abuts with the lower surface of mounting object.Test section 53 is abutted to wrap
It includes the threshold value storage unit 53a for saving above-mentioned threshold value and carries out the determination unit 53b of above-mentioned judgement based on the threshold value.In addition, threshold value is deposited
Storage portion 53a can be set in storage device 105.Here, being lifter pin 7a as " output valve from servo amplifier 33 "
Front end parameter for changing when being abutted with the lower surface of mounting object, can be the ginseng based on the command signal to motor 35
Any one of parameter several or based on the feedback signal from motor 35.In addition, output valve for example can be from motor
The direct parameter of 35 sides output, alternatively, the parameter of the binary obtained to the direct parameter via calculation process.As output
The concrete example of value, can enumerate aggregate-value as the command pulse in servo amplifier 33 is detained pulse, motor 35
Torque value, the speed of motor 35, motor 35 ongoing change (velocity wave form) etc. parameter.In above-mentioned output valve,
Be detained pulsion phase for motor 35 load sensitive react, therefore, as lifter pin 7a abutting detection index it is optimal
Choosing.
Abnormity detection portion 55 detects the exception of lifter pin with 53 co-operating of test section is abutted.Herein, lifter pin 7a
Exception is primarily referred to as reduction, bending of front end of lifter pin 7a etc..Abnormity detection portion 55 is based on detecting in abutting test section 53
The front end of lifter pin 7a out and the height and position that abuts of lower surface of mounting object and the arrival height obtained by encoder 37
The amount of movement (path increment) from down position of lifter pin 7a before spending position, detects the exception of lifter pin.Specifically,
The front end of lifter pin 7a with mounting object lower surface abuts before amount of movement be more than threshold value when, determine lifter pin 7a exception.It is abnormal
Test section 55 includes the threshold value storage unit 55a for saving above-mentioned threshold value and the determination unit 55b that above-mentioned judgement is carried out based on the threshold value.Separately
Outside, threshold value storage unit 55a can be set in storage device 105.
The above processing of control unit 50 can use RAM112 as working region by CPU111, execute in ROM113 or
The software (program) that is stored in storage device 105 and realize.In addition, control unit 50 also has other functions, but omits and say herein
It is bright.
[height position detection method/lifter pin height and position adjusting method of lifter pin]
Then the height position detection method and height and position for illustrating the lifter pin 7a of plasma-etching apparatus 100 are adjusted
Method.
<first embodiment>
Fig. 5 and Fig. 6 be include lifter pin 7a mounting table 3 top partial section view.In Fig. 5 and Fig. 6 typically
Indicate 2 lifter pin 7a.
Firstly, Fig. 5 indicates the position (fall maximum position) that lifter pin 7a declines the most.In fall dominant bit
It sets, the front end of lifter pin 7a is fully embedded in the 3b of hole.The fall maximum position is equivalent to the first height and position.Though in addition,
So the illustration is omitted, in the position (ascensional range maximum position) risen the most, becomes the front end of lifter pin 7a from mounting table 3
Substrate supporting face state outstanding.In the ascensional range maximum position or its neighbouring position, the handover of substrate S is carried out.
Fig. 6 is indicated from the state of Fig. 5, increase lifter pin 7a, become the front end of lifter pin 7a with
It is electrostatically adsorbed in the state of the lower surface of the substrate S of electrode for electrostatic attraction 5 abutting.Position shown in fig. 6 is known as " to abut position
It sets ".The height position detection method of the lifter pin of present embodiment be make in detection pattern lifter pin 7a from fall most
Big position rises, and the variation for being detained pulse when abutted position is reached according to lifter pin 7a, detects the height and position of lifter pin 7a
(i.e. arrival abutted position).
Fig. 7 is shown schematically in the offset counter 33a of the servo amplifier 33 in the driving portion 7b of lifting pin assembly 7
In add up delay pulse time change.Fig. 7 is indicated to reach abutted position in the front end of moment t lifter pin 7a, be stopped later
The state of driving.The delay pulse of difference as command pulse and feedback pulse when the spinning movement of motor 35 starts substantially
It changes, but during increase with certain speed lifter pin 7a, as shown in fig. 7, keeping the change within the scope of certain
It is dynamic.But when moment t lifter pin 7a reaches abutted position, the absolute value for being detained pulse is substantially more than threshold value Th (herein, threshold
Value Th refers to absolute value.It is same as below) and change.As a result, by detecting the variation of the delay pulse, it is able to detect lifter pin 7a
Height and position.
Fig. 8 is the flow chart for indicating an example of the process of height and position adjusting method of the lifter pin of first embodiment.
The height and position adjusting method of the lifter pin of present embodiment can include the process of step S1 shown in Fig. 8 to step S5.This
Place, step S1 to step S4 constitute the height position detection method of the lifter pin of first embodiment.In the following, in the first embodiment party
It in the case where not distinguishing the height position detection method of lifter pin and the height and position adjusting method of lifter pin in formula, is denoted as and " rises
Height and position detection/adjusting method of pin drops ".
Firstly, in step sl, in the driving speed configuration part 51a of the drive control part 51 of control unit 50, will go up and down
The driving speed of pin is set as detection pattern.As described above, in detection pattern, with compared with joining mode driving speed it is smaller
The second driving speed carry out lifter pin 7a driving.By driving lifter pin 7a with the second driving speed, can prevent from going up and down
It sells the accidents such as the breakage of 7a and reliably and accurately implements the detection of height and position.
Then, in step s 2, electricity is issued from the drive control part 51 of control unit 50 to the driving portion 7b of lifting pin assembly 7
The driving instruction of motivation 35.Receive the driving instruction, pulse generating unit 31 generates the command pulse for being used for drive motor 35, defeated
Enter servo amplifier 33.When servo amplifier 33 inputs command pulse, motor 35 is with rotation corresponding with command pulse
Speed and torque carry out rotation driving, increase from fall maximum position shown in fig. 5 with second speed lifter pin 7a
Driving.Step S2 is suitable with up step.
In step s3, during lifter pin 7a rises, monitor that deviation counts by the abutting test section 53 of control unit 50
The delay pulse of device 33a.Specifically, the determination unit 53b for abutting test section 53 obtains the delay pulse of offset counter 33a
Value.Then, in step s 4, the absolute value of the delay pulse obtained in step s3 is compared with preset threshold value Th
Compared with, judge be detained pulse absolute value whether be more than threshold value Th.These steps S3 and step S4 are suitable with detecting step.Detection step
Suddenly it is executed simultaneously in parallel with the up step of step S2.Herein, by certain time from the rotation of motor 35
Period, the variation for being detained pulse is larger (referring to 0~t0 of the horizontal axis of Fig. 7), therefore preferably by it from the comparison other of step S4
It removes.Pass through the time at this point it is possible to be understood in advance from the driving instruction of step S2 to above-mentioned t0, by the time from comparison other
It removes, or can also converge in a certain range and make with its variation by after monitoring and detecting and be detained the maximum deviation of pulse
For triggering, the comparison of step S4 is carried out.
The threshold value Th used in the judgement of step S4, such as be able to use and be stored in the threshold value storage for abutting test section 53
The value of portion 53a.Threshold value Th be based on for example test resulting data, according to the driving speed of the lifter pin 7a in detection pattern,
Driving torque and set.In addition, threshold value Th can also be set and inputting from input unit 102.
In the case that the absolute value that pulse is detained in judgement in step S4 is more than threshold value Th (YES), before detecting lifter pin 7a
End reaches the abutted position abutted with the lower surface of substrate S.At this point, in next step S5, from the drive control of control unit 50
Portion 51 issues the halt instruction of motor 35 to the driving portion 7b of lifting pin assembly 7, stops the driving of lifter pin 7a.The step
S5 is suitable with step is stopped.Using height and position when like this stopping lifter pin 7a as " detection stop position ".The detection
Stop position is equivalent to " the second height and position ".Due to lifting pin assembly 7 control on time lag, detection stop position be with sternly
The abutted position of lattice compares the position minutely risen very much but it is also possible to be height and position identical with abutted position.
On the other hand, in the case that the absolute value that pulse is detained in judgement in step s 4 is not above threshold value Th (no),
It abuts in test section 53, executes the judgement of the monitoring of the delay pulse of step S3 and the threshold value Th of step S4 repeatedly.At this point, step
S3 and step S4 are persistently carried out, until basis is not included in the halt instruction of this process for example based on the liter obtained from encoder 37
The halt instruction of the upper limit value of the height and position and pre-determined height and position of drop pin 7a, the rising of lifter pin 7a stop.
Each lifting pin assembly 7 can be carried out from step S1 to the process of step S4 and step S5 above.At this point, energy
It is enough that multiple lift pins device 7 is proceeded as described above simultaneously.In addition, in present embodiment, by the way that the absolute of pulse will be detained
Value is compared with threshold value Th and detects that the front end of lifter pin 7a is abutted with the lower surface of mounting object, but has appreciated that in advance
Detection will not be counteracted in the case where, can also will be detained pulse without using its absolute value and use it is original just or
Negative threshold value (positive value or negative value) is compared.
The height and position detection of lifter pin according to the present embodiment, adjusting method, by by the deviation in driving portion 7b
The delay pulse of counter 33a as index, can with for example using the manual positioning of dial ga(u)ge it is same or higher
Precision, quickly and automatically detect lifter pin 7a front end reach abutted position situation.As a result, in the commercialization area of substrate S
When the lower section in domain configures lifter pin 7a, it also can be avoided and occur to handle the reliability for ensuring product irregularly such as etching spot.
Furthermore it is possible to do not need to carry out manually detecting the height and position of lifter pin 7a automatically and being adjusted for operator, by
Time needed for this can substantially shorten the positioning of lifter pin 7a, the downtime of device is reduced, can be improved processing substrate
Efficiency.
It, can be right when every time replacing the substrate S of process object to mounting table 3 when using substrate S as mounting object
Each piece of substrate S carries out the detection or adjusting of height and position, every regulation number can also carry out height after replacing multiple substrate S
The detection or adjusting of position.Like this, during actual processing substrate, periodically to the following table of lifter pin 7a and substrate S
The height and position that face abuts is detected or is adjusted, possible thus, it is possible to extremely reduce the generation that processing is uneven such as etching spot
Property, it can be ensured that the reliability of product.It is stagnant in the height and position detection of the lifter pin of present embodiment, adjusting method
It stays pulse generation sharply to change, more can more closely detect the abutting of lifter pin 7a Yu substrate S.It is therefore preferable that will fill
The stress for the load for resisting the lifter pin 7a risen is divided to be applied to substrate S.As a result, by being inhaled by such as electrode for electrostatic attraction 5
In the state of attaching substrates S, the process of above-mentioned steps S1 to step S5 is carried out, it is easier to which the variation of pulse is detained in detection, more
It is preferred that.
Furthermore, it is possible to as mounting object, instead of substrate S, and as shown in Figure 9 configured with being arranged in a manner of covering hole 3b
The load-carryings 60 such as the block with predetermined weight in the state of carry out.In particular, when not utilizing Electrostatic Absorption, mounting table 3 do not have
When having electrode for electrostatic attraction 5, by replacing substrate S, and the load with the lifter pin 7a that can sufficiently resist rising is used
The load-carrying 60 of quality accurately can detect or adjust the height and position that lifter pin 7a is abutted with load-carrying 60.
<second embodiment>
Figure 10 is another process for indicating the process of the height and position adjusting method of the lifter pin of second embodiment
Figure.Figure 11 is the partial section view on the top of the mounting table 3 comprising lifter pin 7a.2 liftings are typically illustrated in Figure 11
Sell 7a.The height and position adjusting method of the lifter pin of present embodiment includes step S11~step S17 process.Step therein
Rapid S11~step S15 is same as the step of Fig. 8 S1~step S5, and and the description is omitted.
The height and position adjusting method of the lifter pin of present embodiment, in the front end of lifter pin 7a and the lower surface of substrate S
After abutting, including from the state of stopping (detection stop position), in order to carry out the positioning of lifter pin 7a, further to lifter pin
The process of 7a progress additional drives.
In the step S15 of Figure 10, make the rising driving stopping of lifter pin 7a in the halt instruction according to motor 35
Under state, the front end of lifter pin 7a reaches detection stop position.That is, the front end of lifter pin 7a is abutted with the lower surface of substrate S.In
It is that in next step S16, such as shown in Figure 11, the front end of lifter pin 7a declines slightly from detection stop position, moves
Positioned at the height and position for keeping lifter pin 7a standby during processing i.e. position of readiness.The position of readiness is equivalent to third height position
It sets.Make the amount of movement (path increment) when lifter pin 7a decline driving from detection stop position to position of readiness, according to drive control
The altitude information of the position of readiness saved in the height and position adjustment portion 51b in portion 51 determines.The amount of movement can utilize coding
Device 37 is grasped and is controlled.Position of readiness can according to the data obtained by experiment for example corresponding to the process content of substrate S,
Dysgenic height will not be caused to the processing of substrate S by being set in, preferably on the basis of detecting stop position 0.05~
The height and position for declining lifter pin 7a in the range of 1mm degree.In addition, the amount of movement can be by defeated from input unit 102
Enter and sets.
Like this, by being adjusted to the height and position of the front end of lifter pin 7a from the substrate S as detection stop position
The position of readiness that declines slightly of height of lower surface also can when the lower section in the commercialization region of substrate S configures lifter pin 7a
It is enough reliably prevented and generates the unevenness of the processing such as etching spot.In addition, position of readiness is set as than fall maximum position
Height, and it is lower than detection stop position and abutted position.
Then, it in step S17, is issued from the driving portion 7b of 51 pairs of drive control part lifting pin assemblies 7 of control unit 50
The halt instruction of motor 35 stops the driving of lifter pin 7a.
By the above process, in the present embodiment, the front end of lifter pin 7a is shifted
To position of readiness.Thus, for example in the case where causing the length of lifter pin 7a to shorten to a certain degree due to reduction, bending etc.,
Also the height and position of its front end can be controlled in position of readiness.Even if reduction or bending etc. occur for lifter pin 7a as a result, also can
Enough prevent the position of the front end of the multiple lift pins 7a during processing of substrate S in position of readiness irregular, it can
The generation that avoids such as etching spot processing uneven and the reliability for ensuring product.
The experimental result for confirming effect of the invention is illustrated.According to step S11~step S17's shown in Fig. 10
Process is placed with the state of mounting object with the substrate supporting face in mounting table 3, makes to go up and down pin assembly 7 from fall dominant bit
It sets and rises to abutted position after detection stop position stops, further it is made to drop to position of readiness.In addition, in step
In S16, the amount of movement that will test stop position to position of readiness is set as 0.05mm.In this process, in removal mounting object
Under state, dial ga(u)ge (model 1160T, 1 scale of Mitutoyo Corp's manufacture are 0.01mm) measurement mounting table 3 is used
Substrate supporting face, detection stop position and position of readiness lifter pin 7a front end height.It the results are shown in table 1.
[table 1]
It is able to confirm that according to table 1, according to the process of step S11~step S17 shown in Fig. 10, after being abutted with mounting object
Stop, and then decline drives preset amount of movement from the position of stopping.
The other structures and effect of present embodiment are same as first embodiment.
[method for detecting abnormality of lifter pin]
Then, illustrate using above-mentioned first method lifter pin height and position detection, adjusting method lifter pin it is different
Normal detection method.
<third embodiment>
Figure 12 is the stream for indicating an example of the process of the method for detecting abnormality of lifter pin of third embodiment of the present invention
Cheng Tu.The method for detecting abnormality of the lifter pin of present embodiment includes step S21~step S29 process.Step S21 wherein
~step S25 is same as step S1~step S5 of first embodiment (Fig. 8), and and the description is omitted.
In the step S25 of Figure 12, make the rising driving stopping of lifter pin 7a in the halt instruction according to motor 35
Under state, the front end of lifter pin 7a reaches detection stop position.That is, the front end of lifter pin 7a is abutted with the lower surface of substrate S.It connects
, make lifter pin 7a from decline from the acquirement of the encoder 37 of driving portion 7b in the determination unit 55b of step S26, abnormity detection portion 55
Amplitude maximum position is displaced to the amount of movement (path increment) of detection stop position.Then, in step s 27, determination unit 55b is to step
The amount of movement and preset threshold value that rapid S26 is obtained are compared, and judge whether amount of movement has been more than threshold value.Herein, sentencing
Threshold value used in fixed is able to use the value for example saved in the threshold value storage unit 55a of abnormity detection portion 55.Threshold value is by threshold value
Amount of movement setting of the storage unit 55a according to the data for example tested, based on lifter pin 7a when normal.In addition, threshold value can also
To be set and being inputted from input unit 102.
If lifter pin 7a is in normal condition, so that lifter pin 7a is displaced to detection from fall maximum position and stop
Amount of movement when position is substantially certain.But movement when wearing away the exceptions such as caused reduction, bending has occurred in lifter pin 7a
Amount, substantially becomes larger compared with amount of movement when normal.Then, in step s 27, the amount of movement for judging lifter pin 7a is more than threshold value
When (YES), lifter pin 7a is detected as in next step S28 and is in abnormal.At this point, for example aobvious in the display device 104 of control unit 50
Show the maintenance information etc. of error information or display alarm lifter pin 7a replacement.
On the other hand, when judging that the amount of movement of lifter pin 7a is not above threshold value (no) in step s 27, in next step
S29 is detected as lifter pin 7a, and there is no abnormal (normal).
In this way, the method for detecting abnormality of the lifter pin of present embodiment rises lifter pin 7a from fall maximum position
Driving abuts with the lower surface of substrate S and reaches the amount of movement of detection stop position according to its front end, detects such as lifter pin 7a
Reduction, the bending of front end etc. it is abnormal.Lifter pin 7a due to reduction, bending and when shortening, the handover of substrate S can be caused not
Good influence, and will also become the reason for etching spot etc..The method for detecting abnormality of the lifter pin of present embodiment passes through using upper
Height and position detection, the adjusting method for stating the lifter pin of first embodiment, can simply and rapidly detect lifter pin 7a's
It is abnormal.
The other structures and effect of present embodiment are same as first embodiment.In addition, in present embodiment, instead of making
Amount of movement when lifter pin 7a is displaced to detection stop position from fall maximum position, can also use will be from fall
The structure that amount of movement when maximum position is displaced to abutted position is compared with threshold value.At this point, the step of Figure 12 can be omitted
The processing of S25.That is, step S26 is then executed when step S24 judges that the absolute value for being detained pulse is more than threshold value (YES), it is abnormal
The determination unit 55b of test section 55 is displaced to lifter pin 7a from fall maximum position from the acquirement of the encoder 37 of driving portion 7b
The amount of movement of abutted position.
<variation>
As the variation of above-mentioned 1st~the 3rd embodiment, illustrate substitution be detained pulse and to the torque value of electrode 35 into
The case where row monitoring.Figure 13 is the time of the torque value of the motor 35 in the driving portion 7b for show schematically lifting pin assembly 7
The figure of variation.The longitudinal axis of Figure 13 is the ratio [%] of driving of the torque value to lifter pin 7a, and torque value is removed on the top more into figure
More become larger.It is indicated in Figure 13, reaches abutted position in the front end of moment t, lifter pin 7a, then, the state for stopping driving.
The torque value of electrode 35 changed when spinning movement starts it is larger, still, in moment t0Make lifter pin 7a with certain speed later
During rising, as shown in figure 13, promoted with the variation within the scope of certain.But when moment t lifter pin 7a reaches abutted position,
The absolute value of torque value is significantly more than threshold value Th and changes.So being able to detect lifting by the variation for detecting the torque value
Sell the height and position of 7a.
As described above, in plasma-etching apparatus 100, by the variation of the torque value of monitoring motor 35, with prison
The case where depending on being detained pulse is same, can implement the height position detection method (first embodiment) of lifter pin, lifter pin
The method for detecting abnormality (third embodiment) of height and position adjusting method (second embodiment) and lifter pin.In these deformations
In example, " the delay pulse being accumulated in offset counter 33a " in above-mentioned 1st~the 3rd embodiment replaces with " torque value ".
In addition, the threshold value Ta of torque value used in determining in variation, such as according to the data that experimentally obtain, according to detection
The driving speed and driving torque of lifter pin 7a in mode is set.In addition, torque value can for example be used as torque current, torque
Voltage etc. is detected.
More than, embodiments of the present invention are described in detail in order to be illustrated, but the present invention is not limited to above-mentioned
Embodiment can have various modifications.For example, the present invention is not limited to using FPD use substrate as process object substrate at
Device is managed, can also apply to the substrate board treatment for example using semiconductor wafer as process object.
In addition, plasma-etching apparatus is not limited to parallel plate-type shown in FIG. 1, also it is able to use for example using micro-
The plasma-etching apparatus of wave plasma, using plasma-etching apparatus of inductively coupled plasma etc..In addition, this
Invention be not limited to plasma-etching apparatus, can also apply to such as plasma ashing apparatus, plasma CVD at
The plasma processing apparatus for the purpose of other processing such as film device, plasma diffusion film formation device, and then can also answer
For the substrate board treatment for the purpose of the processing other than corona treatment.
In addition, the method for detecting abnormality of the lifter pin of such as third embodiment can be with the height position of second embodiment
Set adjusting method combination.For example, can be held after the step S11~step S17 process for implementing second embodiment (Figure 10)
Step S26~step S29 of row third embodiment (Figure 12).In addition, for example can be in the step of third embodiment (Figure 12)
When rapid S29 is confirmed as lifter pin 7a without abnormal (normal), the step S16~step S17 of second embodiment (Figure 10) is executed.
In addition, can monitor a variety of output valves from offset counter 33a simultaneously in abutting test section 53.For example,
The both sides for being detained pulse and torque value can be monitored by abutting test section 53, and the front end of the result judgement lifter pin 7a of comprehensive both sides is
The no lower surface with mounting object abuts.Also, it in the above-described embodiment, lists and utilizes servomotor as driving portion 7b
Example, still, only monitor torque value in the case where, it is without being limited thereto, be also able to use from motor driver output torque
The motor (such as stepping motor etc.) of form except value.
Claims (20)
1. a kind of substrate board treatment characterized by comprising
Load the mounting table of substrate；
Substrate lifting device comprising be arranged to the substrate supporting face protrusion relative to the mounting table and submerge and carry out
The lifter pin of the handover of the substrate and servomotor as the driving portion for rising or falling the lifter pin；With
The control unit of the substrate lifting device is controlled,
The control unit includes:
Test section is abutted, monitors the output valve of the motor driver from the servomotor, it is super in the output valve
In the case where changing with crossing preset threshold value, detects the front end of the lifter pin and be placed in the substrate supporting face
The lower surface for loading object abuts；With
Drive control part rises the lifter pin from the position for leaving the substrate supporting face, in the abutting test section
In the case where detecting that the front end of the lifter pin is abutted with the lower surface of the mounting object, the sending of Xiang Suoshu servomotor stops
It only instructs, stops the driving of the lifter pin,
In the case where the abutting test section detects that the front end of the lifter pin is abutted with the lower surface for loading object, institute
The position that drive control part stops the driving of the lifter pin is stated, is set as under front end and the mounting object of the lifter pin
The height and position that surface abuts.
2. substrate board treatment as described in claim 1, it is characterised in that:
It is carried out as the delay pulse of the difference of the command pulse and feedback pulse of the servomotor as the output valve
Monitoring.
3. substrate board treatment as described in claim 1, it is characterised in that:
It is monitored the torque value of the servomotor as the output valve.
4. substrate board treatment as described in claim 1, it is characterised in that:
The control unit further includes height and position adjustment portion, is supported in the front end of the lifter pin and the lower surface of the mounting object
After connecing, make the lifter pin decline specified amount.
5. substrate board treatment as described in claim 1, it is characterised in that:
The control unit further includes abnormity detection portion, and the lower surface based on the extremely front end of the lifter pin and the mounting object is supported
Amount of movement until being connected in amount of movement only or stopping after abutting, detects the exception of the lifter pin.
6. such as substrate board treatment according to any one of claims 1 to 5, it is characterised in that:
The control unit further includes the driving speed configuration part for the driving speed for setting the lifter pin.
7. substrate board treatment as claimed in claim 6, it is characterised in that:
The driving speed configuration part sets following speed:
The first driving speed of the lifter pin is driven to carry out the handover of the substrate；With
It is abutted to detect the front end of the lifter pin with the lower surface for the mounting object for being placed in the substrate supporting face
Height and position and drive the second driving speed lifter pin, smaller than first driving speed.
8. a kind of height position detection method of lifter pin, include the mounting table of mounting substrate, be arranged to relative to
The substrate supporting face of the mounting table is prominent and the lifter pin that shifts with submerging and as rising or falling the lifter pin
The height and position of the lifter pin, the height position of the lifter pin are detected in the substrate board treatment of the servomotor of driving portion
Detection method is set to be characterised by comprising:
The up step for increase from the first height and position for leaving the substrate supporting face lifter pin；
Detecting step monitors the output valve of the motor driver from the servomotor, is more than pre- in the output valve
In the case where changing to the threshold value first set, detects the front end of the lifter pin and be placed in the mounting in the substrate supporting face
The abutting of the lower surface of object；With
Stop step, in the case where detecting to have abutted in the detecting step, stop the driving of the lifter pin,
By the position of the lifter pin stopped in the stopping step be set as the lifter pin front end and the mounting object
The height and position that lower surface abuts.
9. the height position detection method of lifter pin as claimed in claim 8, it is characterised in that:
It is carried out as the delay pulse of the difference of the command pulse and feedback pulse of the servomotor as the output valve
Monitoring.
10. the height position detection method of lifter pin as claimed in claim 8, it is characterised in that:
It is monitored the torque value of the servomotor as the output valve.
11. the height position detection method of lifter pin as claimed in claim 8, it is characterised in that:
The servomotor is arranged to switch following speed:
The first driving speed of the lifter pin is driven to carry out the handover of the substrate；With
In order to detect the lifter pin front end and it is described mounting object lower surface abutting and drive the lifter pin, compare institute
The second small driving speed of the first driving speed is stated,
The up step is carried out with second driving speed.
12. a kind of height and position adjusting method of lifter pin, include the mounting table of mounting substrate, be arranged to relative to
The substrate supporting face of the mounting table is prominent and the lifter pin that shifts with submerging and as rising or falling the lifter pin
The height and position of the lifter pin, the height position of the lifter pin are adjusted in the substrate board treatment of the servomotor of driving portion
Adjusting method is set to be characterised by comprising:
The up step for increase from the first height and position for leaving the substrate supporting face lifter pin；
Detecting step monitors the output valve of the motor driver of the servomotor, is more than to set in advance in the output valve
In the case where changing to fixed threshold value, the front end of the lifter pin and the mounting object for being placed in the substrate supporting face are detected
The abutting of lower surface；With
Stop step, in the case where detecting to have abutted in the detecting step, makes the lifter pin in the second height and position
Stop,
The height and position that the front end that second height and position is set as the lifter pin is abutted with the lower surface of the mounting object.
13. the height and position adjusting method of lifter pin as claimed in claim 12, it is characterised in that:
The delay pulse of the difference of the command pulse of the servomotor and feedback pulse is monitored as the output valve.
14. the height and position adjusting method of lifter pin as claimed in claim 12, it is characterised in that:
It is monitored the torque value of the servomotor as the output valve.
15. the height and position adjusting method of lifter pin as claimed in claim 12, it is characterised in that:
The servomotor is arranged to switch following speed:
The first driving speed of the lifter pin is driven to carry out the handover of the substrate；With
In order to detect the lifter pin front end and it is described mounting object lower surface abutting and drive the lifter pin, compare institute
The second small driving speed of the first driving speed is stated,
The up step is carried out with second driving speed.
16. the height and position adjusting method of lifter pin as claimed in claim 12, which is characterized in that further include:
It is with the height and position that abuts of lower surface of the mounting object or second height and position with the front end of the lifter pin
Benchmark makes the lifter pin drop to the decline step of third height position.
17. a kind of method for detecting abnormality of lifter pin is including the mounting table of mounting substrate, is being arranged to relative to described
The substrate supporting face protrusion of mounting table and the lifter pin submerged and watching as the driving portion for rising or falling the lifter pin
The exception that the lifter pin is detected in the substrate board treatment of motor is taken, the feature of the method for detecting abnormality of the lifter pin exists
In, comprising:
The up step for increase from the first height and position for leaving the substrate supporting face lifter pin；
Detecting step monitors the output valve of the motor driver from the servomotor, is more than pre- in the output valve
In the case where changing to the threshold value first set, detects the front end of the lifter pin and be placed in the mounting in the substrate supporting face
The abutting of the lower surface of object；
Stop step, in the case where detecting to have abutted in the detecting step, stops the driving of the lifter pin；With
Anomalies detecting step, by the position of the lifter pin stopped in the stopping step be set as the front end of the lifter pin with
It is described mounting object lower surface abut height and position, based on from first height and position to the front end of the lifter pin with
Amount of movement until the height and position that the lower surface of the mounting object abuts or stop the lifter pin to after abutting second
Amount of movement until height and position detects the exception of the lifter pin.
18. the method for detecting abnormality of lifter pin as claimed in claim 17, it is characterised in that:
It is carried out as the delay pulse of the difference of the command pulse and feedback pulse of the servomotor as the output valve
Monitoring.
19. the method for detecting abnormality of lifter pin as claimed in claim 17, it is characterised in that:
It is monitored the torque value of the servomotor as the output valve.
20. the method for detecting abnormality of lifter pin as claimed in claim 17, it is characterised in that:
The servomotor is arranged to switch following speed:
The first driving speed of the lifter pin is driven to carry out the handover of the substrate；With
In order to detect the lifter pin front end and it is described mounting object lower surface abutting and drive the lifter pin, compare institute
The second small driving speed of the first driving speed is stated,
The up step is carried out with second driving speed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-172109 | 2015-09-01 | ||
| JP2015172109 | 2015-09-01 | ||
| JP2016-158382 | 2016-08-12 | ||
| JP2016158382A JP6817745B2 (en) | 2015-09-01 | 2016-08-12 | Substrate processing device, lift pin height position detection method, lift pin height position adjustment method, and lift pin abnormality detection method |
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| Publication Number | Publication Date |
|---|---|
| CN106486411A CN106486411A (en) | 2017-03-08 |
| CN106486411B true CN106486411B (en) | 2019-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610768372.8A Active CN106486411B (en) | 2015-09-01 | 2016-08-30 | Substrate board treatment, the position detection of lifter pin, adjusting and method for detecting abnormality |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6797063B2 (en) * | 2017-04-14 | 2020-12-09 | 東京エレクトロン株式会社 | Pin control method and substrate processing equipment |
| JP6896588B2 (en) * | 2017-11-06 | 2021-06-30 | 株式会社Ｓｃｒｅｅｎホールディングス | Board delivery system and board delivery method |
| KR102053593B1 (en) * | 2017-11-29 | 2019-12-09 | 주식회사 테스 | Movement method of Lift pin and Substrate process apparatus |
| KR102616612B1 (en) * | 2018-01-04 | 2023-12-26 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus and substrate processing method |
| CN108962794B (en) * | 2018-07-20 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Needle lifting method and thimble lifting device applying same |
| CN109849052B (en) * | 2018-12-20 | 2021-11-02 | 江苏集萃智能制造技术研究所有限公司 | Robot joint flexible shutdown method |
| CN110850690B (en) * | 2019-11-19 | 2023-05-23 | 上海华力微电子有限公司 | Stripping equipment, thimble monitoring method and stripping process |
| KR102582696B1 (en) * | 2020-06-15 | 2023-09-26 | 세메스 주식회사 | Apparatus for treating substrate, method for measuring height difference of lift pins and computer readable recording medium recoring program |
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| JP2002198353A (en) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | Plasma pcocessing system |
| JP2007273685A (en) * | 2006-03-31 | 2007-10-18 | Tokyo Electron Ltd | Substrate placing stage and substrate processing apparatus |
| CN101136353A (en) * | 2006-08-31 | 2008-03-05 | 东京毅力科创株式会社 | Substrate carrying mechanism and connecting method |
| JP2010262983A (en) * | 2009-04-30 | 2010-11-18 | Nec Corp | Semiconductor manufacturing device, and low-load contact detecting device and low-load contact detection method thereof |
| JP2010278271A (en) * | 2009-05-29 | 2010-12-09 | Panasonic Corp | Semiconductor substrate processing device |
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| JP2002198353A (en) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | Plasma pcocessing system |
| JP2007273685A (en) * | 2006-03-31 | 2007-10-18 | Tokyo Electron Ltd | Substrate placing stage and substrate processing apparatus |
| CN101136353A (en) * | 2006-08-31 | 2008-03-05 | 东京毅力科创株式会社 | Substrate carrying mechanism and connecting method |
| JP2010262983A (en) * | 2009-04-30 | 2010-11-18 | Nec Corp | Semiconductor manufacturing device, and low-load contact detecting device and low-load contact detection method thereof |
| JP2010278271A (en) * | 2009-05-29 | 2010-12-09 | Panasonic Corp | Semiconductor substrate processing device |
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