CN106486411A - Substrate board treatment, the position detection of lifter pin, regulation and method for detecting abnormality - Google Patents
Substrate board treatment, the position detection of lifter pin, regulation and method for detecting abnormality Download PDFInfo
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- CN106486411A CN106486411A CN201610768372.8A CN201610768372A CN106486411A CN 106486411 A CN106486411 A CN 106486411A CN 201610768372 A CN201610768372 A CN 201610768372A CN 106486411 A CN106486411 A CN 106486411A
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- Prior art keywords
- lifter pin
- height
- substrate
- lifter
- servomotor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The present invention provides the substrate board treatment of the height and position that can be properly positioned lifter pin at short notice.The driving instruction of motor is sent to the drive division of lifting pin assembly from the drive control part (51) of control unit (50).Receive the driving instruction, motor rises lifter pin and driven with rotary speed corresponding with command pulse and torque rotation driving.Abut test section (53) and monitor that be output valve in servo amplifier.For example, when the absolute value in the delay pulse of the aggregate-value of the command pulse as the offset counter in servo amplifier exceedes threshold value, judge that the front end of lifter pin is abutted with the lower surface of mounting thing.
Description
Technical field
The present invention relates to the substrate elevating having for making such as flat-panel monitor (FPD) substrate elevatings such as glass substrate
Device, substrate board treatment, the height position detection method of lifter pin and height and position control method that substrate enforcement is processed
And the method for detecting abnormality of lifter pin.
Background technology
In the such as substrate board treatment of the process such as etching, film forming is carried out to substrate, set in the mounting table of mounting substrate
It is equipped with the multiple lifter pins that can be projected with respect to substrate-placing face and submerge.Entered by rising or falling these lifter pins
The handing-over of row substrate.During processing to substrate, lifter pin is accommodated in and is formed in the hole of mounting table.
With regard to the control of lifter pin, a kind of semiconductor substrate processing apparatus of motion in patent document 1, which has：Right
The monitoring unit monitored when normal by the change of the load for driving the motor of lifter pin to be born；With in the load obtained by supervision
Variable quantity overrate when, judge that the action of lifter pin occurs abnormal judging part.
Additionally, in patent document 2 the following technology of motion：When semiconductor substrate by electrostatic chuck Electrostatic Absorption,
The front end of lifter pin is made only to rise ormal weight from the adsorption plane of electrostatic chuck, based on the motor-driven for carrying out self-driven lifter pin
The motor torque signal of device is detecting adsorbed state of the semiconductor substrate to electrostatic chuck.
Further, with regard to the control of the motor in semiconductor- fabricating device, 3 motion of patent document is non-drive in motor
The technology of the pulse produced by encoder is monitored when also normal during dynamic state.Additionally, the following technology of patent document 4 motion：In quilt
Before kinetoplast reaches target location, electric current obtained by proportional integral is carried out to deviation to the circulation of AC servomotor, is arrived by kinetoplast
When reaching target location, in the electric current of the AC servomotor circulation value proportional to deviation.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2010-278271 publication (Fig. 4 etc.)
Patent document 2：Japanese Unexamined Patent Publication 2008-277706 publication (scope of claim etc.)
Patent document 3：Japanese Unexamined Patent Publication 2000-152676 publication (scope of claim etc.)
Patent document 4：Japanese Unexamined Patent Publication 9-201083 publication (Fig. 2 etc.)
Content of the invention
The technical problem for solving is wanted in invention
The glass substrate of FPD has the tendency of maximize constantly development and its lower thickness in recent years.In order to stably
The large-scale and thin glass substrate of supporting, it is necessary to increase the quantity of lifter pin.Therefore, the face of glass substrate is avoided in the prior art
Interior commercialization field (region of element, distribution etc. is set) and configure lifter pin, and there is also in glass substrate from now on
The demand of the lower section configuration lifter pin in the commercialization region in face.But, in the feelings of the lower section configuration lifter pin in commercialization region
Under condition, during processing to substrate, can contact with substrate when the position of lifter pin is too high, and become point and manage not
All the reason for.On the other hand, during processing to substrate, when the position of lifter pin is too low, as electric field falls into base
Space between plate and the front end of lifter pin, becomes and produces for example the reason for etching the process inequality such as spot.Thus, correctly grasp
The position of lifter pin is critically important for the reliability for guaranteeing product.
But, do not establish the scheme for automatically grasping the position of lifter pin all the time, but operator for example make
The position of each lifter pin is determined with Measuring Devices such as dial ga(u)ges, and it is long therefore to position the spent time, there is device
Downtime long life problem.
It is an object of the invention to provide can be in the substrate board treatment of the short time correct height and position for grasping lifter pin.
For solving the technical scheme of technical task
The substrate board treatment of the present invention includes：The mounting table of mounting substrate；Substrate lifting device, it include to be arranged to
Enough substrate supporting faces with respect to above-mentioned mounting table project and submerge and carry out the lifter pin of the handing-over of aforesaid substrate and as making
The servomotor of the drive division that the lifter pin rises or falls；Control unit with control aforesaid substrate lowering or hoisting gear.And,
In the substrate board treatment of the present invention, above-mentioned control unit includes to abut test section, and which monitors the electricity from above-mentioned servomotor
The output valve of motivation driver, the front end for detecting above-mentioned lifter pin and the lower surface for loading thing for being placed in aforesaid substrate bearing-surface
The height and position of abutting.
Additionally, in the substrate board treatment of the present invention can be, using as above-mentioned servomotor command pulse with
The delay pulse of the difference of feedback pulse monitored as above-mentioned output valve, or using the torque value of above-mentioned servomotor as
Above-mentioned output valve is monitored.
Additionally, in the substrate board treatment of the present invention can be, above-mentioned control unit also includes height and position adjustment portion, its
After the front end of above-mentioned lifter pin is abutted with the lower surface of above-mentioned mounting thing, above-mentioned lifter pin is made to decline ormal weight.
Additionally, in the substrate board treatment of the present invention can be, above-mentioned control unit also includes abnormity detection portion, its be based on to
The front end of above-mentioned lifter pin abut with the lower surface of above-mentioned mounting thing till amount of movement or to abut after stop movement
Amount, detects the exception of above-mentioned lifter pin.
Additionally, in the substrate board treatment of the present invention can be, above-mentioned control unit also includes to set above-mentioned lifter pin
The actuating speed configuration part of actuating speed.Can be now that above-mentioned actuating speed configuration part sets following speed：In order to carry out on
State the handing-over of substrate and drive the first actuating speed of above-mentioned lifter pin；In order on detecting the front end of above-mentioned lifter pin and being placed in
State substrate supporting face above-mentioned mounting thing lower surface abut height and position and drive above-mentioned lifter pin, than above-mentioned first drive
The second little actuating speed of dynamic speed.
The height position detection method of the lifter pin of the present invention is in the mounting table for including mounting substrate, is arranged to phase
Substrate supporting face for above-mentioned mounting table project and the lifter pin that shifts with submerging and as so that above-mentioned lifter pin is increased or under
The method for detecting the height and position of above-mentioned lifter pin in the substrate board treatment of the servomotor of the drive division of drop.The lifter pin
Height position detection method include：The up step for making above-mentioned lifter pin increase from the first height and position；And detecting step, root
According to the output valve of the motor driver from above-mentioned servomotor, detect the front end of above-mentioned lifter pin and be placed in above-mentioned base
The abutting of the lower surface of the mounting thing of plate bearing-surface.
The height and position control method of the lifter pin of the present invention is in the mounting table for including mounting substrate, is arranged to phase
Substrate supporting face for above-mentioned mounting table project and the lifter pin that shifts with submerging and as so that above-mentioned lifter pin is increased or under
The method for adjusting the height and position of above-mentioned lifter pin in the substrate board treatment of the servomotor of the drive division of drop.The height position
Putting control method includes：The up step for making above-mentioned lifter pin increase from the first height and position；Detecting step, according to above-mentioned servo
The output valve of the motor driver of motor, detects the front end of above-mentioned lifter pin and the mounting for being placed in aforesaid substrate bearing-surface
The abutting of the lower surface of thing；With detect in above-mentioned detecting step abut when, make above-mentioned lifter pin in the second height and position
The stopping step of stopping.
Additionally, the height and position control method of the lifter pin of the present invention can also include with the front end of above-mentioned lifter pin with upper
On the basis of stating height and position or above-mentioned second height and position of the lower surface abutting of mounting thing, above-mentioned lifter pin is made to drop to the 3rd
The decline step of height and position.
The method for detecting abnormality of the lifter pin of the present invention be include mounting substrate mounting table, be arranged to respect to
The substrate supporting face of above-mentioned mounting table projects and the lifter pin that submerges and as the drive division for rising or falling above-mentioned lifter pin
Servomotor substrate board treatment in detect above-mentioned lifter pin exception method.The method for detecting abnormality of the lifter pin
Including：The up step for making above-mentioned lifter pin increase from the first height and position；Detecting step, according to from above-mentioned servomotor
Motor driver output valve, under the front end for detecting above-mentioned lifter pin and the mounting thing for being placed in aforesaid substrate bearing-surface
The abutting on surface；And anomalies detecting step, based on front end and above-mentioned load from above-mentioned first height and position to above-mentioned lifter pin
The the second height position for stopping above-mentioned lifter pin after amount of movement till the height and position that the lower surface of glove is abutted or extremely abutting
Amount of movement only is set to, detects the exception of above-mentioned lifter pin.
The height position detection method of the lifter pin of the invention described above, the height and position control method of lifter pin and lifter pin
Method for detecting abnormality in can be, using the delay pulse of the difference of command pulse and feedback pulse as above-mentioned servomotor
Monitored as above-mentioned output valve, or the torque value of above-mentioned servomotor is monitored as above-mentioned output valve.
Additionally, the height and position control method of the height position detection method of the lifter pin of the invention described above, lifter pin and
Can be that above-mentioned servomotor is arranged to switch following speed in the method for detecting abnormality of lifter pin：In order to carry out on
State the handing-over of substrate and drive the first actuating speed of above-mentioned lifter pin；With in order to detect the front end of above-mentioned lifter pin with above-mentioned load
The abutting of the lower surface of glove and drive above-mentioned lifter pin, less than above-mentioned first actuating speed the second actuating speed, above
Stating the second actuating speed carries out above-mentioned up step.
Invention effect
According to the present invention, by since the output valve of motor driver in self-driven portion be used as index, can with example
Such as using the precision that the manual positioning of dial ga(u)ge is equal or higher, quickly and automatically the front end of detection lifter pin reaches
The situation of the lower surface of mounting thing.Thereby, it is possible to the positioning for significantly the shortening lifter pin required time, therefore, it is possible to reduce device
Downtime, improve processing substrate efficiency.
Description of the drawings
Fig. 1 is the summary sectional view of of the plasma-etching apparatus for representing one embodiment of the present invention.
Fig. 2 is the block figure of the structure of the drive division for representing lifting pin assembly.
Fig. 3 is the block figure of the hardware configuration for representing control unit.
Fig. 4 is the FBD of the function of the control unit for representing related to the control of lifting pin assembly.
Fig. 5 is the partial section view on the top of the mounting table of the height and position for representing lifter pin.
Fig. 6 is the partial section view on the top of the mounting table of another height and position for representing lifter pin.
Fig. 7 be shown schematically in servo amplifier offset counter accumulative obtained by be detained the time change of pulse
Figure.
Fig. 8 is the order of the height and position detection/control method of the lifter pin of the first embodiment for representing the present invention
The flow chart of one.
Fig. 9 is the explanatory diagram of the example for representing the mounting thing beyond substrate.
Figure 10 is of the order of the height and position control method of the lifter pin for representing second embodiment of the present invention
Flow chart.
Figure 11 is the partial section view on the top of the mounting table of the another height and position for representing lifter pin.
Figure 12 is the stream of of the order of the method for detecting abnormality of the lifter pin for representing third embodiment of the present invention
Cheng Tu.
Figure 13 is the figure of the time change of the torque value for showing schematically servomotor.
Description of reference numerals
50 ... control units, 51 ... drive control parts, 51a ... actuating speed configuration part, 51b ... height and position are adjusted
Section portion, 53 ... abutting test sections, 53a ... threshold value storage part, 53b ... detection unit, 55 ... abnormity detection portion,
55a ... threshold value storage part, 55b ... detection unit.
Specific embodiment
Embodiments of the present invention are described in detail referring to the drawings.First, an embodiment party of the present invention is described with reference to Fig. 1
The plasma-etching apparatus of formula.Plasma-etching apparatus 100 are configured to what the substrate S of the rectangle to FPD was etched
The parallel flat plasma-etching apparatus of capacitively coupled.In addition, as FPD, liquid crystal display (LCD), electricity can be illustrated
Photoluminescence (Electro Luminescence：EL) display, plasm display panel (PDP) etc..
<Process container>
The plasma-etching apparatus 100 with surface implement anodized (alumite process) comprising aluminium
Be formed as the process container 1 of angle barrel shape.Process container 1 is made up of diapire 1a and 4 side wall 1b.Additionally, in process container 1
Upper bond has lid 1c.Lid 1c is configured to be opened and closed using switching mechanism (not shown).In the state for closing lid 1c
Lower cover 1c is sealed by seal member (not shown) with the bonding part of each side wall 1b, and the air-tightness in process container 1 is protected
Hold.
<Mounting table>
The mounting table 3 of mounting substrate S is provided with process container 1.The mounting table 3 for also serving as lower electrode includes：Example
The such as base material 3a comprising the conductive material such as aluminium, stainless steel (SUS)；Cover the insulating element (omitting diagram) of base material 3a.Separately
Outward, high frequency electric source is connected with base material 3a via supply lines, matching box, omit diagram.
Additionally, mounting table 3 is with electrode for electrostatic attraction 5 on base material 3a.Electrode for electrostatic attraction 5 have rise from below according to
The secondary construction for being laminated with the first insulating barrier 5a, electrode 5b and the second insulating barrier 5c.From dc source 5d via supply lines 5e to
Electrode 5b between one insulating barrier 5a and the second insulating barrier 5c applies DC voltage, thus, it is possible to for example by Coulomb force to substrate S
Carry out Electrostatic Absorption.
Additionally, mounting table 3 is with multiple lifting pin assemblies 7.Lifting pin assembly 7 as substrate lifting device is according to substrate
The area of S is for example configured with several to dozens of.Each lifting pin assembly 7 is driven by independent driving source respectively.Each lifter pin dress
Putting 7 includes：It is inserted in the hole 3b of base material 3a setting of mounting table 3 from below, is configured to the base with respect to mounting table 3
Plate bearing-surface protrusion and the lifter pin 7a of the mode displacement that submerges；Drive the drive division 7b of lifter pin 7a.In addition, as shown in figure 1,
When mounting table 3 is with electrode for electrostatic attraction 5, " the substrate supporting face of mounting table " means the upper surface of electrode for electrostatic attraction 5.
Lifter pin 7a supporting substrates S, and using drive division 7b in the substrate supporting face of mounting table 3 and the position for leaving the substrate supporting face
Between putting, substrate S is made to lift displacement.The detailed construction of lifting pin assembly 7 is described below.
<Gas supply mechanism>
The spray head 9 worked as upper electrode is provided with the top of mounting table 3.Spray head 9 is supported on process to be held
The lid 1c on the top of device 1.Spray head 9 is formed as hollow form, is internally provided with gas diffusion space 9a at which.Additionally, in spray
The lower surface (opposite face with mounting table 3) of pouring 9, is formed with the multiple gases row for discharging the etching gas as processing gas
Portal 9b.The spray head 9 is grounded, and constitutes a pair of parallel plate electrode together with mounting table 3.
Gas introduction port 11 is provided near the center upper portion of spray head 9.The gas introduction port 11 be connected with for
The gas supply pipe 13 of supply processing gas.The another side of the gas supply pipe 13 is connected with for example and supplies as processing gas
Etching gas etc. gas supply source 15.
<Exhaust gear>
The position for being close to 4 angles in above-mentioned process container 1, is formed with multiple positions of diapire 1a and opens as insertion
The exhaust of oral area is with opening 1d (only illustrate 2).Blast pipe 17 is connected with each exhaust opening 1d.Blast pipe 17 with example
The exhaust apparatus 19 of the such as vavuum pump such as turbomolecular pump connects.Rule can will be evacuated in process container 1 by exhaust apparatus 19
Fixed reduced atmosphere.
<Substrate carrying-in/carrying-out mouth>
The side wall 1b of process container 1 is provided with substrate conveyance opening 1e.Opening 1e is by gate valve 21 for the substrate conveyance
Opening and closing, can transport substrate S at which between adjacent carrying room (diagram is omitted).
<Lifting pin assembly>
Then, lifting pin assembly 7 is described in detail.One lifting pin assembly 7 is included as described above：Carry out lifting displacement and entering
The lifter pin 7a of the handing-over of row substrate S；With the drive division 7b for driving lifter pin 7a.Fig. 2 is the block of the structure for representing drive division 7b
Figure.Drive division 7b be with pulse generating unit 31, servo amplifier 33, motor 35, encoder 37 servomotor.?
Servo amplifier 33 is provided with offset counter 33a.
Pulse generating unit 31 is, for example, programmable logic controller (PLC) (PLC), by the control of the control unit 50 (aftermentioned) of higher level
Make and the command pulse for drive motor 35 is generated, be input into servo amplifier 33.
Command signal for drive motor 35 is exported by servo amplifier 33 to motor 35, also, is received by electricity
The feedback signal that motivation 35 is driven and produces, controls the output torque of motor 35, rotary speed, position etc..In addition,
Servo amplifier 33 exports the various parameters based on above-mentioned command signal, above-mentioned feedback signal to control unit 50 (aftermentioned).Watch
Amplifier 33 is taken with offset counter 33a and D/A transformation component (not shown).To giving birth to from pulse in offset counter 33a
The command pulse in portion 31 is become to carry out cumulative calculation.
Motor 35 is linked with lifter pin 7a, when command pulse is transfused to servo amplifier 33, with the command pulse
Corresponding rotary speed and torque rotation driving, make lifter pin 7a drive up and down.
Encoder 37 generates the feedback pulse proportional to the rotating speed of motor 35 when motor 35 rotates, and feeds back
To servo amplifier 33.
In the lifting pin assembly 7 with above structure, based on the instruction from control unit 50, pulse generating unit 31 is produced
For the command pulse of drive motor 35, servo amplifier 33 is input into.Drift gage of the command pulse in servo amplifier 33
Cumulative calculation in number device 33a, the aggregate-value (delay pulse) of the command pulse are transformed to DC simulation voltage, revolve motor 35
Turn, lifter pin 7a is driven up and down.When motor 35 rotates, produced by encoder 37 proportional to the rotating speed of motor 35
Feedback pulse.The feedback pulse feeds back to servo amplifier 33, deducts the delay pulse of offset counter 33a.
<Control unit>
Each constituting portion of plasma-etching apparatus 100 is connected with control unit 50, is uniformly controlled by control unit 50.Control unit
50 is the module controller (Module Controller) of each constituting portion for controlling plasma-etching apparatus 100.Control unit 50
It is connected with I/O module (not shown).The I/O module has multiple I/O portions, connects with each terminal of plasma-etching apparatus 100
Connect.I/O portion is provided with the I/O port for the input and output for controlling data signal, analog signal and serial signal.For each
The control signal of terminal is exported from I/O portion respectively.Additionally, the output signal from each terminal is input into I/O portion respectively.In plasma
In body Etaching device 100, as the terminal being connected with I/O portion, for example, can enumerate lifting pin assembly 7, exhaust apparatus 19 etc..
One with reference to the hardware configuration of Fig. 3 explanation control unit 50.Control unit 50 includes master control part 101, keyboard, mouse
Deng the output devices such as input unit 102, printer 103, display device 104, storage device 105, external interface 106 and by they
The bus 107 being connected to each other.Master control part 101 is with CPU (central processing unit) 111, RAM (random access memory) 112
With ROM (read-only storage) 113.As long as storage device 105 can storage information then do not limit its form, e.g. hard disk unit
Or optical disc apparatus.Additionally, 115 record information of storage medium that storage device 105 can be read to computer, from storage medium
115 read information.As long as storage medium 115 is able to record that information does not then limit its form, e.g. hard disk, CD, flash memory etc..
Storage medium 115 can be the storage medium of the scheme of the substrate processing method using same for storing present embodiment.
In control unit 50, CPU111 passes through for RAM112 to be used as working region, executes in ROM113 or storage device 105
The program of middle storage, can execute the plasma etching to substrate S in the plasma-etching apparatus 100 of present embodiment
Process.
Fig. 4 is the FBD for representing the function related to the control of lifting pin assembly 7 in control unit 50.As Fig. 4 institute
Show, control unit 50 is with drive control part 51, abutting test section 53, abnormity detection portion 55.
Drive control part 51 carries out lifting the drive control of pin assembly 7, is specifically controlled, so as to driving and stopping
Up and down displacement of the lifter pin 7a with respect to drive division 7b.Additionally, drive control part 51 is with actuating speed configuration part 51a and height
Position-regulation portion 51b.Actuating speed configuration part 51a sets the speed for moving up and down for making lifter pin 7a.In the present embodiment,
Following speed are switchably set：First actuating speed of lifter pin 7a is driven in order to carry out the handing-over of substrate S；With in order to examine
Survey the front end of lifter pin 7a and the height and position that abuts of lower surface of the mounting thing being positioned in mounting table 3 and drive lifter pin 7a
The second actuating speed.Second actuating speed is set to less than the first actuating speed, for example divided with 1mm/～10mm/ divides or so
The raising and lowering of row lifter pin 7a.Hereinafter, lifter pin 7a will be made to be referred to as when driving up and down to carry out the handing-over of substrate S
" handing-over pattern ", the height that will be abutted with the lower surface of the mounting thing for being positioned in mounting table on 3 to detect the front end of lifter pin 7a
It is referred to as " detection pattern " when spending position and so that lifter pin 7a is driven up and down.In addition, in the detection pattern of present embodiment, to drive
Dynamic speed second actuating speed less than handing-over pattern carries out the driving of lifter pin 7a, but it is also possible to replaces actuating speed, and incites somebody to action
Other parameters such as speed gain, position gain etc. are respectively set as different values in each pattern.Additionally, height and position is adjusted
Portion 51b can preserve the height and position stopped after abutting with the lower surface of mounting thing from the front end of lifter pin 7a and drive liter further
Drop pin 7a and the amount of movement (that is, the path increment of the lifter pin 7a of displacement) when carrying out the adjustment of height and position.In addition, mounting thing meaning
Taste substrate S or described later load-carrying 60 (with reference to Fig. 9).
Abut the height and position that test section 53 detects that the front end of lifter pin 7a is abutted with the lower surface of mounting thing.Specifically
Say, abut test section 53 monitor the output valve in the servo amplifier 33 as motor driver, by the output valve with
Threshold value set in advance is compared, and judges whether the front end of lifter pin 7a is abutted with the lower surface of mounting thing.Abut test section 53 to wrap
Include the threshold value storage part 53a for the preserving above-mentioned threshold value and detection unit 53b that above-mentioned judgement is carried out based on the threshold value.In addition, threshold value is deposited
Storage portion 53a can be arranged in storage device 105.Here, as " from the output valve of servo amplifier 33 ", being lifter pin 7a
Front end parameter for changing when abutting with the lower surface of mounting thing, can be the ginseng based on the command signal to motor 35
Number or based on from motor 35 feedback signal parameter any one.In addition, output valve can be for example from motor
The direct parameter of 35 sides output, or, the parameter to binary that the direct parameter is obtained via calculation process.As output
The concrete example of value, can enumerate aggregate-value as the command pulse in servo amplifier 33 are detained pulse, motor 35
The parameter of torque value, the speed of motor 35, the rheological parameters' change with time (velocity wave form) of motor 35 etc..In above-mentioned output valve,
Be detained pulsion phase for motor 35 load sensitive react, the index accordingly, as the abutting detection of lifter pin 7a is optimum
Choosing.
Abnormity detection portion 55 detects the exception of lifter pin with 53 co-operating of test section is abutted.Herein, lifter pin 7a
Reduction, bending of the front end of lifter pin 7a etc. are primarily referred to as extremely.Abnormity detection portion 55 is based on and detects in test section 53 is abutted
Height and position and the arrival height obtained by encoder 37 that the front end of the lifter pin 7a for going out is abutted with the lower surface of mounting thing
The amount of movement (path increment) from down position of the lifter pin 7a before degree position, detects the exception of lifter pin.Specifically, exist
The front end of lifter pin 7a with mounting thing lower surface abuts before amount of movement exceed threshold value when, judgement lifter pin 7a exception.Abnormal
Test section 55 is included the threshold value storage part 55a for preserving above-mentioned threshold value and is carried out the detection unit 55b of above-mentioned judgement based on the threshold value.Separately
Outward, threshold value storage part 55a can be arranged in storage device 105.
The above process of control unit 50 can use RAM112 to be used as working region by CPU111, execute in ROM113 or
In storage device 105 store software (program) and realize.In addition, control unit 50 also has other functions, but omit herein and say
Bright.
[the height and position control method of the height position detection method/lifter pin of lifter pin]
Then the height position detection method of the lifter pin 7a of explanation plasma-etching apparatus 100 and height and position are adjusted
Method.
<First embodiment>
Fig. 5 and Fig. 6 are the partial section view on the top of the mounting table 3 for including lifter pin 7a.In Fig. 5 and Fig. 6 typically
Represent 2 lifter pin 7a.
First, Fig. 5 represents the position (fall maximum position) that lifter pin 7a declines the most.In fall dominant bit
Put, the front end of lifter pin 7a is fully embedded in the 3b of hole.The fall maximum position is equivalent to the first height and position.Though in addition,
Diagram is so eliminated, in the position (ascensional range maximum position) for rising the most, becomes the front end of lifter pin 7a from mounting table 3
The state that substrate supporting face projects.In the ascensional range maximum position or its neighbouring position, the handing-over of substrate S is carried out.
Fig. 6 represents from the state of Fig. 5, so that lifter pin 7a is increased in detection pattern, become the front end of lifter pin 7a with
The state that the lower surface of the substrate S in electrode for electrostatic attraction 5 by electrostatic adsorption is abutted.Position shown in Fig. 6 is referred to as " abutting position
Put ".The height position detection method of the lifter pin of present embodiment be make in detection pattern lifter pin 7a from fall most
Big position rises, and reaches the change for being detained pulse during abutted position according to lifter pin 7a, detects the height and position of lifter pin 7a
(reaching abutted position).
Fig. 7 is shown schematically in the offset counter 33a of the servo amplifier 33 in the drive division 7b of lifting pin assembly 7
In add up delay pulse time change.Fig. 7 represents the front end arrival abutted position in moment t lifter pin 7a, stops afterwards
The state of driving.As command pulse and feedback pulse difference be detained pulse when the spinning movement of motor 35 starts significantly
Change, but during making lifter pin 7a after the time t theta with certain speed rising, as shown in fig. 7, keeping the change in the range of certain
Dynamic.But, when moment t lifter pin 7a reaches abutted position, the absolute value for being detained pulse significantly exceedes threshold value Th (herein, threshold
Value Th refers to absolute value.Same as below) and change.Thus, by detecting the variation of the delay pulse, lifter pin 7a can be detected
Height and position.
Fig. 8 is the flow chart of of the process of the height and position control method of the lifter pin for representing first embodiment.
The height and position control method of the lifter pin of present embodiment can include step S1 shown in Fig. 8 to the process of step S5.This
Place, step S1 to step S4 constitute the height position detection method of the lifter pin of first embodiment.Below, in the first embodiment party
In the case of not distinguishing the height position detection method of lifter pin and the height and position control method of lifter pin in formula, it is designated as " rising
Height and position detection/the control method of drop pin ".
First, in step sl, in the actuating speed configuration part 51a of the drive control part 51 of control unit 50, will lifting
The actuating speed of pin is set as detection pattern.As described above, in detection pattern, with compared with handing-over pattern actuating speed less
The second actuating speed carry out the driving of lifter pin 7a.By lifter pin 7a being driven with the second actuating speed, be prevented from lifting
The accidents such as the breakage of pin 7a and detection that is reliable and accurately implementing height and position.
Then, in step s 2, electricity is sent from the drive control part 51 of control unit 50 to the drive division 7b of lifting pin assembly 7
The driving instruction of motivation 35.Receive the driving instruction, pulse generating unit 31 generates the command pulse for drive motor 35, defeated
Enter servo amplifier 33.When in 33 input instruction pulse of servo amplifier, motor 35 is with rotation corresponding with command pulse
Speed and torque carry out rotation driving, so that lifter pin 7a is increased with second speed from the fall maximum position shown in Fig. 5
Drive.Step S2 is suitable with up step.
In step s3, during lifter pin 7a rising, monitor that deviation is counted by the abutting test section 53 of control unit 50
The delay pulse of device 33a.Specifically, the delay pulse of the detection unit 53b acquirement offset counter 33a of test section 53 is abutted
Value.Then, in step s 4, the absolute value of the delay pulse to obtaining in step s3 is compared with threshold value Th set in advance
Relatively, judge whether the absolute value for being detained pulse exceedes threshold value Th.These steps S3 and step S4 suitable with detecting step.Detection step
Suddenly executed with the up step of step S2 simultaneously in parallel.Herein, through certain time from the rotation of motor 35 starts
Period, the variation for being detained pulse are larger (with reference to 0～t0 of the transverse axis of Fig. 7), therefore preferably by which from the comparison other of step S4
Remove.At this point it is possible to understand the elapsed time from the driving instruction of step S2 to above-mentioned t0 in advance, by the time from comparison other
Remove, or can also be converged in certain limit with its variation and make after monitoring the maximum deviation for detecting delay pulse
For triggering, the comparison of step S4 is carried out.
Threshold value Th used in the judgement of step S4, for example can be using the threshold value storage for being stored in abutting test section 53
The value of portion 53a.Threshold value Th based on the data for for example testing gained, actuating speed according to the lifter pin 7a in detection pattern,
Driving torque and set.In addition, threshold value Th can also be set by being input into from input unit 102.
In the case of judging in step S4 that the absolute value for being detained pulse exceedes threshold value Th (YES), before detecting lifter pin 7a
End reaches the abutted position abutted with the lower surface of substrate S.Now, in next step S5, from the drive control of control unit 50
Portion 51 sends the halt instruction of motor 35 to the drive division 7b of lifting pin assembly 7, stops the driving of lifter pin 7a.The step
S5 is suitable with step is stopped.Height and position when stopping lifter pin 7a like this is used as " detection stop position ".The detection
Stop position is equivalent to " the second height and position ".Due to lift pin assembly 7 control on time lag, detection stop position be with sternly
The abutted position of lattice compare the position that minutely rises very much but it is also possible to be with abutted position identical height and position.
On the other hand, in the case of judging that the absolute value for being detained pulse is not above threshold value Th (no) in step s 4,
Abut in test section 53, repeatedly the judgement of threshold value Th of the supervision and step S4 of the delay pulse of execution step S3.Now, step
S3 and step S4 are persistently carried out, until basis is not included in the halt instruction of this process for example based on the liter obtained from encoder 37
The halt instruction of the higher limit of the height and position of drop pin 7a and pre-determined height and position, the rising of lifter pin 7a stop.
Above from step S1 to step S4 and the process of step S5, each lifting pin assembly 7 can be carried out.Now, energy
Enough for multiple lifting pin assemblies 7 while proceeding as described above.In addition, in present embodiment, by the absolute of pulse will be detained
Value is compared with threshold value Th and detects that the front end of lifter pin 7a and the lower surface of mounting thing are abutted, but is had appreciated that in advance
Obstruction is not resulted in for detection in the case of, it is also possible to will be detained pulse do not use its absolute value and use original just or
Negative threshold value (on the occasion of or negative value) be compared.
Height and position detection, control method according to the lifter pin of present embodiment, by by the deviation in drive division 7b
The delay pulse of counter 33a, can be with equal or higher with for example using the manual positioning of dial ga(u)ge used as index
Precision, quickly and automatically detection lifter pin 7a front end reach abutted position situation.Thus, in the commercialization area of substrate S
During the lower section configuration lifter pin 7a in domain, it is also possible to avoid occurring such as etching spot etc. to process the reliability for guaranteeing product irregularly.
Furthermore it is possible to the height and position of the manually automatic detection lifter pin 7a of operator need not be carried out and be adjusted, by
This can significantly shorten the time needed for the positioning of lifter pin 7a, reduce the downtime of device, it is possible to increase processing substrate
Efficiency.
When substrate S is used as mounting thing, can be right when replacing the substrate S of process object to mounting table 3 every time
Each piece of substrate S carries out detection or the regulation of height and position, it is also possible to which after multiple substrate S are replaced, often regulation number carries out height
The detection of position or regulation.Like this, during actual processing substrate, the regular following table to lifter pin 7a and substrate S
The height and position that face abuts is detected or is adjusted that the generation for processing inequality thus, it is possible to extremely reduce such as etching spot etc. may
Property, it can be ensured that the reliability of product.In height and position detection, control method in the lifter pin of present embodiment, stagnant
Stay pulse generation drastically to change, more can more closely detect the abutting of lifter pin 7a and substrate S.It is therefore preferable that being possible to fill
The stress of the load of the lifter pin 7a for dividing opposing to rise puts on substrate S.Thus, by being inhaled by such as electrode for electrostatic attraction 5
In the state of attaching substrates S, above-mentioned steps S1 are carried out to the process of step S5, it is easier to which the variation of pulse is detained in detection, more
It is preferred that.
Furthermore, it is possible to as mounting thing, replace substrate S, and arranged in the way of covering hole 3b being configured with as shown in Figure 9
The load-carrying 60 such as the block with predetermined weight in the state of carry out.Particularly, when Electrostatic Absorption is not utilized, mounting table 3 do not have
When having electrode for electrostatic attraction 5, by replacing substrate S, and using the load with the lifter pin 7a that can fully resist rising
The load-carrying 60 of quality, can accurately detect or adjust the height and position that lifter pin 7a is abutted with load-carrying 60.
<Second embodiment>
Figure 10 is the flow process of another of the process of the height and position control method of the lifter pin for representing second embodiment
Figure.Figure 11 is the partial section view on the top of the mounting table 3 comprising lifter pin 7a.2 liftings are typically illustrated in Figure 11
Pin 7a.The height and position control method of the lifter pin of present embodiment includes the process of step S11～step S17.Step therein
Rapid S11～step S15 equally, is therefore omitted the description with S1～step S5 the step of Fig. 8.
The height and position control method of the lifter pin of present embodiment, in the front end of lifter pin 7a and the lower surface of substrate S
After abutting, including from the state (detection stop position) for stopping, in order to carry out the positioning of lifter pin 7a, further to lifter pin
7a carries out the operation of additional drives.
The step of Figure 10 in S15, the rising of lifter pin 7a is made to drive stopping in the halt instruction according to motor 35
Under state, the front end of lifter pin 7a reaches detection stop position.That is, the front end of lifter pin 7a is abutted with the lower surface of substrate S.In
It is that in next step S16, such as shown in Figure 11, the front end of lifter pin 7a declines slightly from detection stop position, moves
It is located at during process, make lifter pin 7a standby height and position i.e. position of readiness.The position of readiness is equivalent to third height position
Put.Lifter pin 7a is made to decline the amount of movement (path increment) when driving from detection stop position to position of readiness, according to drive control
The altitude information of the position of readiness preserved in height and position adjustment portion 51b in portion 51 is determining.The amount of movement can be using coding
Device 37 is grasping and control.Position of readiness can according to for example corresponding to substrate S process content the data obtained by experiment,
Be set in the height that the process of substrate S will not be had undesirable effect, preferably on the basis of detecting stop position 0.05～
The height and position for declining lifter pin 7a in the range of 1mm degree.In addition, the amount of movement can pass through defeated from input unit 102
Enter and set.
Like this, by the height and position of the front end of lifter pin 7a being adjusted to from the substrate S as detection stop position
Lower surface the position of readiness that declines slightly of height, in the lower section configuration lifter pin 7a in the commercialization region of substrate S, also can
Enough it is reliably prevented and produces the process inequality for for example etching spot etc..In addition, position of readiness is set as than fall maximum position
Height, and lower than detection stop position and abutted position.
Then, in step S17, send from the drive division 7b of 51 pairs of lifting pin assemblies 7 of drive control part of control unit 50
The halt instruction of motor 35, stops the driving of lifter pin 7a.
By said process, in the present embodiment, shift the front end of lifter pin 7a on the basis of detecting stop position
To position of readiness.Thus, for example in the case that the length for being caused lifter pin 7a due to reduction, bending etc. is shortened to a certain degree,
Also the height and position of its front end can be controlled in position of readiness.Thus, even if lifter pin 7a occurs reduction or bending etc., also can
Enough prevent the position of the front end of multiple lifter pin 7a during the process of substrate S in position of readiness uneven, can
Avoid processing uneven generation and guaranteeing the reliability of product for such as etching spot etc..
Experimental result to confirming the effect of the present invention is illustrated.According to step S11～step S17 shown in Figure 10
Process, is placed with the state of mounting thing, makes lifting pin assembly 7 from fall dominant bit with the substrate supporting face in mounting table 3
Put and rise to abutted position and after detection stop position stops, making which drop to position of readiness further.Additionally, in step
In S16, detection stop position is set as 0.05mm to the amount of movement of position of readiness.In this process, mounting thing is being removed
Under state, mounting table 3 is determined using dial ga(u)ge (model 1160T of Mitutoyo Corp's manufacture, 1 scale are 0.01mm)
Substrate supporting face, detection stop position and position of readiness lifter pin 7a front end height.The results are shown in table 1.
[table 1]
It is able to confirm that according to table 1, according to the process of step S11～step S17 shown in Figure 10, after abutting with mounting thing
Stop, and then decline driving amount of movement set in advance from the position for stopping.
The other structures and effect of present embodiment are same with first embodiment.
[method for detecting abnormality of lifter pin]
Then, illustrate using above-mentioned first method lifter pin height and position detection, the lifter pin of control method different
Normal detection method.
<3rd embodiment>
Figure 12 is the stream of of the process of the method for detecting abnormality of the lifter pin for representing third embodiment of the present invention
Cheng Tu.The method for detecting abnormality of the lifter pin of present embodiment includes the process of step S21～step S29.Wherein the step of S21
The step of～step S25 and first embodiment (Fig. 8), S1～step S5 was same, therefore omitted the description.
The step of Figure 12 in S25, the rising of lifter pin 7a is made to drive stopping in the halt instruction according to motor 35
Under state, the front end of lifter pin 7a reaches detection stop position.That is, the front end of lifter pin 7a is abutted with the lower surface of substrate S.Connect
, in step S26, the detection unit 55b of abnormity detection portion 55 is obtained from the encoder 37 of drive division 7b and made lifter pin 7a from decline
Amplitude maximum position is displaced to the amount of movement (path increment) of detection stop position.Then, in step s 27, detection unit 55b is to step
The amount of movement that rapid S26 is obtained and threshold value set in advance are compared, and judge whether amount of movement has exceeded threshold value.Herein, sentencing
Threshold value used in fixed can use the value preserved for example in the threshold value storage part 55a of abnormity detection portion 55.Threshold value is by threshold value
According to the data that obtain for example are tested, the amount of movement based on lifter pin 7a when normal sets storage part 55a.In addition, threshold value also may be used
To be set by being input into from input unit 102.
If lifter pin 7a is in normal condition, make lifter pin 7a detection is displaced to from fall maximum position and stop
Amount of movement during position is substantially certain.But, movement when lifter pin 7a there occurs that reduction, bending that abrasion cause etc. is abnormal
Amount, with normal when amount of movement compared with big amplitude variation big.Then, in step s 27, judge that the amount of movement of lifter pin 7a exceedes threshold value
During (YES), lifter pin 7a is detected as in abnormal in next step S28.Now, for example show in the display device 104 of control unit 50
Show maintenance information that error information or display alarm lifter pin 7a are changed etc..
On the other hand, when judging that the amount of movement of lifter pin 7a is not above threshold value (no) in step s 27, in next step
S29 is detected as lifter pin 7a and abnormal (normal) does not occur.
So, the method for detecting abnormality of the lifter pin of present embodiment makes lifter pin 7a rise from fall maximum position
Drive, abuts with the lower surface of substrate S according to its front end and reach detect stop position amount of movement, detection such as lifter pin 7a
The reduction of leading section, bending etc. abnormal.Lifter pin 7a due to cut down, bending and become in short-term, the handing-over of substrate S can be caused not
Good impact, and will also become the reason for etching spot etc..The method for detecting abnormality of the lifter pin of present embodiment is by using upper
Height and position detection, the control method of the lifter pin of first embodiment is stated, can simply and rapidly detect lifter pin 7a's
Abnormal.
The other structures and effect of present embodiment are same with first embodiment.In addition, in present embodiment, replacing making
Lifter pin 7a is displaced to amount of movement when detecting stop position from fall maximum position, it would however also be possible to employ will be from fall
The structure that amount of movement when maximum position is displaced to abutted position is compared with threshold value.Now, the step of Figure 12 being omitted
The process of S25.That is, when step S24 judges that the absolute value for being detained pulse exceedes threshold value (YES), then execution step S26, abnormal
The detection unit 55b of test section 55 is obtained from the encoder 37 of drive division 7b makes lifter pin 7a be displaced to from fall maximum position
The amount of movement of abutted position.
<Variation>
As the variation of above-mentioned 1st～the 3rd embodiment, illustrate to substitute and be detained pulse and the torque value to electrode 35 enters
The situation that row is monitored.Figure 13 is the time of the torque value of the motor 35 in the drive division 7b for show schematically lifting pin assembly 7
The figure of change.The longitudinal axis of Figure 13 is ratio [%] of the torque value to the driving of lifter pin 7a, more removes torque value to the top of in figure
More become big.Represent in fig. 13, abutted position is reached in the front end of moment t, lifter pin 7a, then, make the state of driving stopping.
The torque value of electrode 35 change when spinning movement starts larger, but, in moment t0Lifter pin 7a is made later with certain speed
During rising, as shown in figure 13, advanced with the variation in the range of certain.But, when moment t lifter pin 7a reaches abutted position,
The absolute value of torque value significantly exceedes threshold value Th and changes.So, by the variation of the torque value is detected, lifting can be detected
The height and position of pin 7a.
As described above, in plasma-etching apparatus 100, by the variation of the torque value of monitoring motor 35, with prison
Situation depending on being detained pulse is same, can implement the height position detection method (first embodiment) of lifter pin, lifter pin
The method for detecting abnormality (the 3rd embodiment) of height and position control method (second embodiment) and lifter pin.In these deformation
In example, " the delay pulse being accumulated in offset counter 33a " in above-mentioned 1st～the 3rd embodiment replaces with " torque value ".
Additionally, judge threshold value Ta of used torque value in variation, such as according to the experimental data for obtaining, according to detection
The actuating speed of the lifter pin 7a in pattern and driving torque set.In addition, torque value for example can be used as torque current, torque
Voltage etc. is detected.
More than, be described in detail embodiments of the present invention in order to illustrate, but the present invention be not limited to above-mentioned
Embodiment, can have various modifications.For example, the present invention is not limited to using FPD substrate as at the substrate of process object
Reason device, it is also possible to be applied to for example using semiconductor wafer as the substrate board treatment of process object.
Additionally, plasma-etching apparatus are not limited to the parallel plate-type shown in Fig. 1, it is also possible to micro- using for example applying
The plasma-etching apparatus of ripple plasma, plasma-etching apparatus of application inductively coupled plasma etc..Additionally, this
Invention is not limited to plasma-etching apparatus, it is also possible to is applied to such as plasma ashing apparatus, plasma CVD and becomes
The plasma processing apparatus for the purpose of other process such as film device, plasma diffusion film formation device, and then can also answer
For the substrate board treatment for the purpose of the process beyond corona treatment.
Additionally, the method for detecting abnormality of the such as lifter pin of the 3rd embodiment can be with the height position of second embodiment
Put control method combination.For example, it is possible to the step of second embodiment (Figure 10) is implemented after the process of S11～step S17, hold
The step of the 3rd embodiment (Figure 12) of row S26～step S29.Additionally, for example can be in the step of the 3rd embodiment (Figure 12)
Rapid S29 confirm as lifter pin 7a not abnormal (normal) when, S16～step S17 the step of execute second embodiment (Figure 10).
In addition, in test section 53 is abutted, the multiple output valves from offset counter 33a can be simultaneously monitored.For example,
Abut test section 53 and the both sides for being detained pulse and torque value can be monitored, the front end of the result judgement lifter pin 7a of comprehensive both sides is
The no lower surface with mounting thing is abutted.Also, in the above-described embodiment, list servomotor is utilized as drive division 7b
Example, but, only monitor torque value in the case of, not limited to this, it is also possible to using from motor driver output torque
The motor (such as stepping motor etc.) of the form outside value.
Claims (20)
1. a kind of substrate board treatment, it is characterised in that include：
The mounting table of mounting substrate；
Substrate lifting device, it include to be arranged to project with respect to the substrate supporting face of the mounting table and submerge and carry out
The lifter pin of the handing-over of the substrate and the servomotor as the drive division for rising or falling the lifter pin；With
Control the control unit of the substrate lifting device,
The control unit includes to abut test section, and which monitors the output valve of the motor driver from the servomotor,
The height and position that the front end for detecting the lifter pin is abutted with the lower surface of the mounting thing for being placed in the substrate supporting face.
2. substrate board treatment as claimed in claim 1, it is characterised in that：
To carry out as the command pulse of the servomotor and the delay pulse of the difference of feedback pulse as the output valve
Monitor.
3. substrate board treatment as claimed in claim 1, it is characterised in that：
The torque value of the servomotor is monitored as the output valve.
4. substrate board treatment as claimed in claim 1, it is characterised in that：
The control unit also includes height and position adjustment portion, and which is supported with the lower surface of the mounting thing in the front end of the lifter pin
After connecing, the lifter pin is made to decline ormal weight.
5. substrate board treatment as claimed in claim 1, it is characterised in that：
The control unit also includes abnormity detection portion, and which is supported based on the lower surface to the front end of the lifter pin with the mounting thing
Amount of movement being connected in amount of movement only or stopping to after abut, detects the exception of the lifter pin.
6. the substrate board treatment as any one of Claims 1 to 5, it is characterised in that：
The control unit also includes the actuating speed configuration part of the actuating speed for setting the lifter pin.
7. substrate board treatment as claimed in claim 6, it is characterised in that：
The actuating speed configuration part sets following speed：
The first actuating speed of the lifter pin is driven in order to carry out the handing-over of the substrate；With
Abut with the lower surface of the mounting thing for being placed in the substrate supporting face to detect the front end of the lifter pin
Height and position and drive the lifter pin, less than first actuating speed the second actuating speed.
8. a kind of height position detection method of lifter pin, its include the mounting table of mounting substrate, be arranged to respect to
The substrate supporting face of the mounting table projects and the lifter pin that shifts with submerging and as rising or falling the lifter pin
The height and position of the lifter pin, the height position of the lifter pin is detected in the substrate board treatment of the servomotor of drive division
Put detection method to be characterised by, including：
The up step for making the lifter pin increase from the first height and position；With
Detecting step, according to the output valve of the motor driver from the servomotor, before detecting the lifter pin
Hold the abutting with the lower surface of the mounting thing for being placed in the substrate supporting face.
9. the height position detection method of lifter pin as claimed in claim 8, it is characterised in that：
To carry out as the command pulse of the servomotor and the delay pulse of the difference of feedback pulse as the output valve
Monitor.
10. the height position detection method of lifter pin as claimed in claim 8, it is characterised in that：
The torque value of the servomotor is monitored as the output valve.
The height position detection method of 11. lifter pins as claimed in claim 8, it is characterised in that：
The servomotor is arranged to switch following speed：
The first actuating speed of the lifter pin is driven in order to carry out the handing-over of the substrate；With
In order to detect the front end of the lifter pin with described mounting thing lower surface abutting and drive the lifter pin, compare institute
The second little actuating speed of the first actuating speed is stated,
The up step is carried out with second actuating speed.
A kind of height and position control method of 12. lifter pins, its include mounting substrate mounting table, be arranged to respect to
The substrate supporting face of the mounting table projects and the lifter pin that shifts with submerging and as rising or falling the lifter pin
The height and position of the lifter pin, the height position of the lifter pin is adjusted in the substrate board treatment of the servomotor of drive division
Put control method to be characterised by, including：
The up step for making the lifter pin increase from the first height and position；
Detecting step, according to the output valve of the motor driver of the servomotor, detect the front end of the lifter pin with
It is placed in the abutting of the lower surface of the mounting thing in the substrate supporting face；With
Detect in the detecting step when abutting, the stopping step for making the lifter pin stop in the second height and position.
The height and position control method of 13. lifter pins as claimed in claim 12, it is characterised in that：
Delay pulse of the command pulse of the servomotor with the difference of feedback pulse is monitored as the output valve.
The height and position control method of 14. lifter pins as claimed in claim 12, it is characterised in that：
The torque value of the servomotor is monitored as the output valve.
The height and position control method of 15. lifter pins as claimed in claim 12, it is characterised in that：
The servomotor is arranged to switch following speed：
The first actuating speed of the lifter pin is driven in order to carry out the handing-over of the substrate；With
In order to detect the front end of the lifter pin with described mounting thing lower surface abutting and drive the lifter pin, compare institute
The second little actuating speed of the first actuating speed is stated,
The up step is carried out with second actuating speed.
The height and position control method of 16. lifter pins as claimed in claim 12, it is characterised in that also include：
The height and position abutted with the lower surface of the mounting thing with the front end of the lifter pin or second height and position are
Benchmark, makes the lifter pin drop to the decline step of third height position.
A kind of 17. method for detecting abnormality of lifter pin, its are including the mounting table of mounting substrate, are being arranged to respect to described
The substrate supporting face protrusion of mounting table and the lifter pin for submerging and watching as the drive division for rising or falling the lifter pin
The exception of the lifter pin is detected in the substrate board treatment for taking motor, and the feature of the method for detecting abnormality of the lifter pin exists
In, including：
The up step for making the lifter pin increase from the first height and position；
Detecting step, according to the output valve of the motor driver from the servomotor, before detecting the lifter pin
Hold the abutting with the lower surface of the mounting thing for being placed in the substrate supporting face；With
Anomalies detecting step, based on front end and the following table for loading thing from first height and position to the lifter pin
Amount of movement till the height and position that face abuts or the shifting to the second height and position for stopping the lifter pin after abutting
Momentum, detects the exception of the lifter pin.
The method for detecting abnormality of 18. lifter pins as claimed in claim 17, it is characterised in that：
To carry out as the command pulse of the servomotor and the delay pulse of the difference of feedback pulse as the output valve
Monitor.
The method for detecting abnormality of 19. lifter pins as claimed in claim 17, it is characterised in that：
The torque value of the servomotor is monitored as the output valve.
The method for detecting abnormality of 20. lifter pins as claimed in claim 17, it is characterised in that：
The servomotor is arranged to switch following speed：
The first actuating speed of the lifter pin is driven in order to carry out the handing-over of the substrate；With
In order to detect the front end of the lifter pin with described mounting thing lower surface abutting and drive the lifter pin, compare institute
The second little actuating speed of the first actuating speed is stated,
The up step is carried out with second actuating speed.
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| JP2015-172109 | 2015-09-01 | ||
| JP2015172109 | 2015-09-01 | ||
| JP2016158382A JP6817745B2 (en) | 2015-09-01 | 2016-08-12 | Substrate processing device, lift pin height position detection method, lift pin height position adjustment method, and lift pin abnormality detection method |
| JP2016-158382 | 2016-08-12 |
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| CN106486411A true CN106486411A (en) | 2017-03-08 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735654A (en) * | 2017-04-14 | 2018-11-02 | 东京毅力科创株式会社 | Sell control method and substrate board treatment |
| CN108962794A (en) * | 2018-07-20 | 2018-12-07 | 北京北方华创微电子装备有限公司 | A kind of liter of needle method and the thimble lifting device for applying it |
| CN109755156A (en) * | 2017-11-06 | 2019-05-14 | 株式会社斯库林集团 | Substrate delivery/reception system and substrate delivery/reception method |
| CN109841544A (en) * | 2017-11-29 | 2019-06-04 | Tes股份有限公司 | The moving method and substrate board treatment of ejector pin unit |
| CN109849052A (en) * | 2018-12-20 | 2019-06-07 | 江苏集萃智能制造技术研究所有限公司 | A kind of submissive closing method of joint of robot |
| CN110010512A (en) * | 2018-01-04 | 2019-07-12 | 东京毅力科创株式会社 | Substrate processing device and processing method for substrate |
| CN110850690A (en) * | 2019-11-19 | 2020-02-28 | 上海华力微电子有限公司 | Photoresist removing equipment, thimble monitoring method and photoresist removing process |
| CN113808972A (en) * | 2020-06-15 | 2021-12-17 | 细美事有限公司 | Substrate processing apparatus, method for measuring height difference between lift pins, and computer-readable recording medium storing processing program |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198353A (en) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | Plasma pcocessing system |
| JP2007273685A (en) * | 2006-03-31 | 2007-10-18 | Tokyo Electron Ltd | Substrate placing stage and substrate processing apparatus |
| CN101136353A (en) * | 2006-08-31 | 2008-03-05 | 东京毅力科创株式会社 | Substrate carrying mechanism and connecting method |
| JP2010262983A (en) * | 2009-04-30 | 2010-11-18 | Nec Corp | Semiconductor manufacturing device, and low-load contact detecting device and low-load contact detection method thereof |
| JP2010278271A (en) * | 2009-05-29 | 2010-12-09 | Panasonic Corp | Semiconductor substrate processing device |
-
2016
- 2016-08-30 CN CN201610768372.8A patent/CN106486411B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198353A (en) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | Plasma pcocessing system |
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