JP2017002353A - Substrate treatment apparatus, and production method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology capable of reducing a wafer loss caused by valve interlock generation in the middle of recipe execution, which is caused by erroneous setting of a process recipe of an operator.SOLUTION: A substrate treatment apparatus includes an operation part having a storage part for storing a parameter showing a content of valve interlock check (valve check pattern) determined beforehand, and a parameter showing a set content of each valve set upon creation of a recipe for treating the substrate, and having a display part capable of displaying the content of each parameter on an operation screen. The operation part is constituted so that a button for collating the content of each parameter can be displayed on the operation screen.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate processing apparatus for manufacturing a semiconductor device and a method for manufacturing the semiconductor device.

  In a substrate processing step, which is one step of a semiconductor device manufacturing method, a silicon wafer, a glass substrate, or the like is placed in a processing furnace, the processing furnace is sealed, and a processing gas is introduced while heating the substrate. Then, substrate processing such as thin film formation, impurity diffusion, annealing, and etching is performed. When the substrate processing is completed, the inside of the processing furnace is purged with an inert gas or the like. Thereafter, the processing furnace was opened and the processed substrate was taken out.

  When the processing gas is supplied together with the carrier gas and the processing furnace is purged, the processing gas supply is stopped, the exhaust in the processing furnace is exhausted, and then the purge gas is supplied into the processing furnace. Supply / discharge, supply / discharge of carrier gas, and supply / discharge of purge gas are performed by opening and closing valves provided in the respective pipe lines. The opening / closing timing of the valve and the opening / closing timing are determined in accordance with a recipe in which the substrate processing content is set.

In film forming process equipment of semiconductor manufacturing equipment, an operator creates a process recipe that describes temperature, pressure, gas flow rate, gas valve, etc. in time series, and executes the recipe. However, the recipe execution time may be several hours. is there. At that time, the recipe execution program checks the valve combination every time a recipe valve operation instruction is requested so that an accident such as an explosion does not occur due to the combination of flammable gas and flammable gas, and determines that it is dangerous. If this happens, the valve opening instruction is rejected and valve interlock is generated.
However, for example, when an experiment is performed while changing the recipe many times, such as confirmation of process processing conditions, a valve interlock may occur due to a description mistake or the like. The processing wafer may be wasted. In addition, when valve interlock occurs after several hours have passed in a long-time recipe, the work efficiency is reduced.

In general, a recipe in which the processing contents of a substrate (control parameters such as processing temperature, gas type, gas flow rate, processing pressure, etc.) are set and inputted in advance to the control device of the substrate processing apparatus, and the opening and closing of the valve is in accordance with the normal recipe The control device controls the opening and closing of the valve.

  Depending on the substrate processing contents, there are valves that should not be operated (operation prohibited valves). For safety reasons, the valve opening / closing state is restricted by hardware, or detailed conditions are set for each process. The controller software incorporates the open / close operation prohibition process.

JP 2007-243119 A

  In view of such circumstances, an object of the present invention is to provide a technique capable of preventing a wafer loss or a reduction in work efficiency due to a valve interlock occurring during the execution of a recipe due to an operator's process recipe setting error. is there.

According to one aspect of the invention,
A storage unit for storing a parameter indicating a predetermined valve interlock check content (valve check pattern) and a parameter indicating a setting content of each valve set when a recipe for processing a substrate is created; A display unit capable of displaying the contents of the parameter on the operation screen,
The operation unit is provided with a substrate processing apparatus configured to be able to display a button for collating the contents of the parameters on the operation screen.

  According to the present invention, it is possible to prevent a wafer loss or a reduction in work efficiency due to the occurrence of a valve interlock during the execution of a recipe due to an operator process recipe setting error.

It is a schematic block diagram which shows the structural example of the control system and group management apparatus of the substrate processing apparatus of the substrate processing apparatus of this invention. 1 is a schematic perspective view of a substrate processing apparatus in which the present invention is implemented. It is a schematic side view of this substrate processing apparatus. It is a figure explaining the structure and control of a process recipe in this invention. It is a figure which shows the example of a process recipe valve setting edit screen in this invention. It is a figure which shows an example of the use prohibition valve | bulb setting table used for this control apparatus. It is a figure explaining control of the substrate processing apparatus by the operation control controller in this invention. It is a figure explaining the example of a valve check flow in the present invention. It is a figure explaining the example of a valve check program flow in the present invention. It is a figure which shows an example of (a) process recipe valve setting table, (b) valve state preservation | save area | region table, and (c) valve interlock parameter used by a valve check program.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  First, a substrate processing apparatus according to the present invention will be described.

  The substrate processing apparatus performs a substrate processing process which is one of the manufacturing processes of a semiconductor device (IC). In the following description, a vertical substrate processing apparatus that includes a vertical furnace as an example of a substrate processing apparatus and performs oxidation processing, CVD film formation processing, diffusion processing, annealing processing, etc. on the substrate will be described.

(First embodiment)
Hereinafter, a configuration of a substrate processing system according to a first embodiment of the present invention and a configuration of a substrate processing apparatus and a group management apparatus will be described with reference to the drawings. FIG. 1 shows a configuration example of a control system and a group management apparatus of a substrate processing apparatus, FIG. 2 shows a schematic perspective view of the substrate processing apparatus according to the first embodiment, and FIG. 3 shows an outline of the substrate processing apparatus. It is a side view.
As shown in FIG. 1, the substrate processing system according to the first embodiment includes a substrate processing apparatus 100, a group management apparatus 30, a network such as a factory LAN that connects the substrate processing apparatus 100 and the group management apparatus 30. 60. A plurality, for example, several tens of substrate processing apparatuses 100 are connected to one group management apparatus 30.

Various apparatus data such as a processing temperature and a processing chamber pressure generated and generated in the substrate processing apparatus 100 are stored in the substrate processing apparatus 100, and at a predetermined cycle via the network 60, a group management apparatus that is a host apparatus. 30. The group management apparatus 30 stores apparatus data received from a plurality of substrate processing apparatuses 100 in a storage unit 32 that is also its own database so as to be useful for, for example, failure analysis when a failure occurs. Thus, the group management device 30 can also be said to be a storage device.

  First, a group management apparatus as an upper management apparatus will be described with reference to FIG. As shown in FIG. 1, the group management device 30 includes a control unit 31, a storage unit 32, an operation display unit 33, and a communication unit 34. The operation display unit 33 includes an operation unit that receives an instruction from the operator, and a display unit that displays an operation screen, various data, and the like. The control unit 31 is electrically connected to the respective components such as the operation display unit 33 constituting the group management apparatus 30, and these components are controlled by the control unit 31. The main control unit 31 includes a CPU (Central Processing Unit) and a memory for storing an operation program of the control unit 31 as a hardware configuration, and the CPU operates according to the operation program. The communication unit 34 transmits / receives various data to / from the plurality of substrate processing apparatuses 100 via the network 60.

  The storage unit 32 stores and stores various device data of each substrate processing apparatus 100 received from the plurality of substrate processing apparatuses 100 via the network 60, and is configured from a hard disk or a semiconductor memory that is a nonvolatile storage device. The In addition, the storage unit 32 stores a reporting cycle for each data type used in the substrate processing apparatus 100, an initial parameter storage table, a failure type corresponding data type definition table, and the like. The group management apparatus 30 transmits a report cycle for each data type to the substrate processing apparatus 100 when the substrate processing apparatus 100 starts up from the initial state, such as when the power of the substrate processing apparatus 100 is turned on.

  Device data such as the temperature, gas flow rate, and pressure data of the processing furnace 202 accumulated and stored in the storage unit 32 is transferred to an analysis application device (not shown) having an advanced application function as necessary, for example, and statistical analysis is performed. And data processing for monitoring the substrate processing apparatus 100 such as multivariate analysis. The analysis application device can be configured by a personal computer or the like connected to the network 60.

  Next, the overall configuration of the substrate processing apparatus 100 will be described with reference to FIGS. In the present embodiment, as an example, the substrate processing apparatus is configured as a semiconductor manufacturing apparatus that performs a processing step in a manufacturing method of a semiconductor device (IC: Integrated Circuit). In the following description, a case where a batch type vertical semiconductor manufacturing apparatus (hereinafter also simply referred to as a processing apparatus) that performs oxidation, diffusion processing, CVD (Chemical Vapor Deposition) processing, or the like is applied to the substrate as the substrate processing apparatus will be described. .

  As shown in FIG. 3, the processing apparatus 100 of this embodiment uses a pod 110 as a wafer carrier for storing a wafer (substrate) 200 made of silicon or the like, and includes a casing 111. A pod loading / unloading port 112 is opened on the front wall 111a of the casing 111 so as to communicate with the inside and outside of the casing 111. The pod loading / unloading port 112 is opened and closed by a front shutter 113. A load port 114 is installed on the front front side of the pod loading / unloading port 112, and the pod 110 is placed on the load port 114. The pod 110 is loaded onto the load port 114 by an in-process conveyance device (not shown), and also unloaded from the load port 114.

A rotating shelf 105 is installed at an upper portion of the casing 111 in a substantially central portion in the front-rear direction. The rotating shelf 105 rotates around a support column 116 and stores a plurality of pods 110 on a shelf plate 117. .
As shown in FIG. 3, a pod transfer device 118 is installed between the load port 114 and the rotating shelf 105 in the housing 111. The pod transfer device 118 includes a pod elevator 118 a that can move up and down while holding the pod 110, and a pod transfer mechanism 118 b as a horizontal transfer mechanism. Between the load port 114, the rotating shelf 105, and the pod opener 121 Then, the pod 110 is conveyed.

  As shown in FIG. 3, a sub-housing 119 is constructed over the rear end at a lower portion of the housing 111 at a substantially central portion in the front-rear direction. On the front wall 119a of the sub housing 119, a pair of wafer loading / unloading ports 120 for loading / unloading the wafer 200 into / from the sub housing 119 are arranged in two vertical rows in the vertical direction. A pair of pod openers 121 and 121 are installed at the wafer loading / unloading ports 120 and 120 at the upper and lower stages, respectively. The pod opener 121 includes mounting bases 122 and 122 for mounting the pod 110 and cap attaching / detaching mechanisms 123 and 123 for attaching and detaching caps (lid bodies) of the pod 110. The pod opener 121 opens and closes the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 mounted on the mounting table 122 by the cap attaching / detaching mechanism 123. The mounting table 122 is a transfer shelf on which a substrate container is mounted when a substrate is transferred.

  As shown in FIG. 3, the sub-housing 119 constitutes a transfer chamber 124 that is isolated from the atmosphere of the installation space of the pod transfer device 118 and the rotating shelf 105. A wafer transfer mechanism 125 is installed in the front region of the transfer chamber 124. The wafer transfer mechanism 125 includes a wafer transfer device 125a that can place the wafer 200 on the tweezer 125c and can rotate or move in the horizontal direction, and a wafer transfer device elevator 125b for moving the wafer transfer device 125a up and down. It consists of The wafers 200 are loaded and unloaded from the boat 217 by the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a.

As shown in FIG. 2, a clean unit 134 composed of a supply fan and a dustproof filter is installed in the transfer chamber 124 so as to supply a clean atmosphere or clean air 133 that is an inert gas. Has been.
As shown in FIG. 3, a processing furnace 202 is provided above the boat 217. The processing furnace 202 includes a substrate processing chamber (not shown) inside, and a heater (not shown) that heats the substrate processing chamber around the substrate processing chamber. The lower end portion of the processing furnace 202 is opened and closed by a furnace port gate valve 147.

  As shown in FIG. 2, a boat elevator 115 for raising and lowering the boat 217 is installed. A seal cap 219 is horizontally installed on the arm 128 connected to the boat elevator 115, and the seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202. ing. The boat 217 includes a plurality of holding members, and horizontally holds a plurality of (for example, about 50 to 125) wafers 200 with their centers aligned and vertically aligned. It is configured as follows.

  Next, the operation of the processing apparatus of this embodiment will be described. As shown in FIGS. 2 and 3, when the pod 110 is supplied to the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113 and loaded from the pod loading / unloading port 112. The loaded pod 110 is automatically conveyed and delivered to the designated shelf plate 117 of the rotary shelf 105 by the pod conveying device 118.

  After the pod 110 is temporarily stored on the rotating shelf 105, the pod 110 is transferred from the shelf 117 to one pod opener 121 and transferred to the mounting table 122, or directly from the load port 114 to the pod opener 121. It is transported and transferred to the mounting table 122. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and clean air 133 is circulated and filled in the transfer chamber 124.

  As shown in FIG. 3, the cap of the pod 110 mounted on the mounting table 122 is removed by the cap attaching / detaching mechanism 123, and the wafer loading / unloading port of the pod 110 is opened. The wafer 200 is picked up from the pod 110 by the wafer transfer device 125a, transferred to the boat 217, and loaded. The wafer transfer device 125 a that has transferred the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 110 into the boat 217.

  During the loading operation of the wafer 200 to the boat 217 by the wafer transfer device 125a in the one (upper or lower) pod opener 121, the other (lower or upper) pod opener 121 has the rotating shelf 105 or the load port 114. The other pod 110 is transported by the pod transport device 118, and the opening operation of the pod 110 by the pod opener 121 proceeds simultaneously.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 is opened by the furnace port gate valve 147. Subsequently, the seal cap 219 is raised by the boat elevator 115, and the boat 217 supported by the seal cap 219 is carried into the substrate processing chamber in the processing furnace 202.

  After loading, arbitrary processing is performed on the wafer 200 in the substrate processing chamber. After the processing, the boat 217 is pulled out by the boat elevator 115, and thereafter, the wafer 200 and the pod 110 are discharged to the outside of the casing 111 in the reverse procedure described above.

  Next, the configuration of the control system of the substrate processing apparatus 100 will be described with reference to FIG. As shown in FIG. 1, the main control unit 11 of the substrate processing apparatus 100 includes a main storage unit 12, a transfer control unit 13, a temperature control unit 14, a gas control unit 15, a PLC (Programmable Logic Controller) unit 16, a communication. The unit 17, an operation unit (not shown) that receives an instruction from the operator, a display unit (not shown) that displays an operation screen, various data, and the like are electrically connected. The communication unit 17 transmits and receives various data to and from the group management device 30 via the network 60.

    The transfer control unit 13 controls the positions of the pod transfer device 118, the wafer transfer mechanism 125, the boat elevator 115, and the like. The transfer control unit 13 is electrically connected to the photo sensor 21 and the pod sensor 22, From these sensors, for example, data such as the presence / absence and position of the pod 110 containing the wafer 200 is received and transmitted to the main control unit 11. Further, the transport control unit 13 receives, for example, a transport instruction for the pod 110 from the main control unit 11 and transports the pod 110 to the instructed location or position.

  The temperature control unit 14 controls the temperature of the heater that heats the processing furnace 202, receives temperature data from the temperature sensor 23 that measures the temperature in the processing furnace 202, and transmits the temperature data to the main control unit 11. Further, the temperature control unit 14 receives, for example, a heater heating temperature instruction for increasing the temperature in the processing furnace 202 from the main control unit 11, and heats the heater to the instructed temperature.

  For example, the gas control unit 15 transmits the data received from the valve I / O 24 and the interlock I / O 25 to the main control unit 11 via the PLC unit 16, and the data received from the main control unit 11 is the valve I / O24 and interlock I / O25. Specifically, for example, gas flow rate data is received from an MFC (mass flow controller: flow rate control device) provided in a processing gas supply pipe for supplying a processing gas into the processing furnace 202 and transmitted to the main control unit 11. . Further, from the main control unit 11, for example, a valve opening / closing instruction to an opening / closing valve provided in the processing gas supply pipe or a pressure adjusting valve provided in a processing gas exhaust pipe for exhausting gas from the processing furnace 202, a pump, etc. A gas control instruction such as a pump drive instruction is received, and gas control is performed according to the instruction. The PLC unit 16 transmits the data received from the valve I / O 24 and the interlock I / O 25 to the main control unit 11, and the data received from the main control unit 11 to the valve I / O 24 and the interlock I / O 25. May be sent.

  The main storage unit 12 stores a processing recipe that is a substrate processing sequence of the substrate processing apparatus 100, and includes a hard disk or a semiconductor memory that is a nonvolatile storage device. The main storage unit 12 stores an update data storage table, a data update information storage table, a report cycle switching setting table, and the like.

The main control unit 11 includes a CPU (Central Processing Unit) and a memory for storing an operation program of the main control unit 11 as a hardware configuration, and the CPU stores in the main storage unit 12 according to the operation program. The processing recipe is read and executed. In addition, the sub-control units such as the transfer control unit 13, the temperature control unit 14, and the gas control unit 15 are each provided with a CPU and a memory for storing an operation program of each control unit. Operates according to the program.

  The main control unit 11 collects each monitor data such as the temperature indicated by the temperature sensor and the position of the actuator from each sub-control unit such as the transport control unit 13 and each component unit such as the PLC unit 16, and these monitor data are collected. It is a control unit that controls each component so that parameters such as the temperature and pressure of the processing furnace 202 become preset target values. The states of the pod sensor 22 and the temperature sensor 23 are transmitted to the main control unit 11 by an analog signal from each sub control unit or a digital signal such as RS-232C or DeviceNet. When the main control unit 11 collects the monitor data from each component unit, the main control unit 11 stamps the collected data (collected data) with a time stamp that is the detection time of the collected data, and stores and saves it in the main storage unit 12. Moreover, it transmits to the group management apparatus 30 and reports it with a predetermined period.

  Next, the configuration of the process recipe in the substrate processing of the present invention will be described with reference to FIG.

In FIG. 4, 401 is a screen configuration example when creating a Step 1 process recipe, 402 is a screen configuration example when creating a Step 2 process recipe, and 40N is a screen configuration example when creating a Step N process recipe. Yes.
Thus, the process recipe is divided into a plurality of Steps (or Events). A set value is output and instructed to each device at each step control setting time.
In the example of Step 1, the Step time is 30 m0 s, the set pressure is 100 Pa, the gas flow rate is 50 slm for N ₂ , 10 sccm for NH ₃ , and the temperature setting is 300 ° C. The valve setting will be described with reference to FIG.

  In the example shown in FIG. 5, the setting of each valve at Step 1 is shown. In this example, since the valves 1, 3, and 4 are painted black, the setting screen indicates that “Close” and the valves 32, 5, and 6 are set to “Open”. As described above, Open and Close are set for all the valves at each Step.

  In FIG. 6, reference numeral 601 denotes an operation control controller that controls recipe editing, recipe execution instructions, and the like. The operation control controller 601 corresponds to the group management apparatus 30 in FIG. The operation controller 601 and the substrate processing apparatus 100 are connected via the network 60. Reference numeral 602 denotes a process control controller: process recipe execution control and monitor monitoring, and is provided as a part of the main control unit 11 in FIG. A valve control controller 603 receives (1) the valve open / close state from the digital I / O 604 and holds it. Further, (2) receiving data of the process control controller. (3) The contents of (1) and (2) are collated with the interlock pattern incorporated in advance, and if it is OK, the output to Digital I / O 604 is rejected as an output if it is NG. The valve controller 603 corresponds to the gas controller 15 in FIG. 1, and the Digital I / O 604 corresponds to the valve I / O 24.

An operator creates a process recipe from the operation control controller 601.
In the case of the example in FIG. 6, the process recipe created by the operation control controller 601 by the operator is transferred to the process control controller 602 when instructed to execute. In accordance with the description of the process recipe, the process control controller 602 instructs the respective controllers to output (0-5V, 1/0 value, etc.), such as temperature, pressure, gas flow rate, valve opening / closing, etc. for each set time. Among these, for valve opening / closing, valve setting pattern data (Open / Close for each valve) is transmitted to the valve controller 603. At this time, the valve controller 603 collates the current valve opening / closing state being held with the instructed valve pattern to check whether or not the interlock opening / closing pattern is obtained, and if OK, the digital I / O A valve opening / closing signal is output via 604. If it is NG (valve interlock), the digital I / O 604 is not output.
The interlock opening / closing pattern is preliminarily incorporated with a logic as a software program in the valve controller 603. Or it may be incorporated as a hard-wired theory value instead of a software program.
In this example, the valve interlock check is performed by the valve controller 603, but may be performed by a host controller such as PMC.

An example of the valve check will be described with reference to FIG.
The check contents of the valve interlock are naturally different if the gas piping of the device is different. In the present embodiment, it is assumed that the interlock check value data incorporated in the valve controller 603 cannot be uploaded to the host controller, that is, the valve interlock check cannot be performed by the host controller that can perform recipe editing. Check flow.

Since the valve check pattern is generally created and submitted as a specification for a customer, in this example, this specification is used and converted into a parameter that can be verified with a recipe by the operation controller 601 ( S701).
The parameter created in S701 is installed in the operation control controller 601 of the apparatus (S702). There are various installation methods. However, the installation method may be finally held in a predetermined area of the storage medium (storage unit 32) in the operation control controller 601.
Before the operator executes the process recipe created by the apparatus / operation unit, the operator presses the “Valve Check” button 605 displayed on the operation control display unit 33 in the operation control controller 601 and stores it in the operation control controller 601. The process recipe is checked (verified) with the program thus executed (S703). If the result of the check (S704) is OK (Yes), the process recipe can be executed (S705), and if it is No, the execution is not possible (S706).

The flow of the valve check program will be described with reference to FIGS. 8 and 9A, 9B, and 9C.
The valve check is started by pressing the Valve check button 605 displayed on the operation display unit 33 in the operation controller 601 (S101). Step N is set to N = 0, and the storage area is cleared (S102). N of StepN is set to +1 and is set to Step1 (S103). Valve (valve) No. X of X is set to 0 (S104). The Valve setting of Step 1 is read from the process recipe valve setting table (FIG. 9A) (S105). Valve No. +1 is added to 0 (S106). Valve No. It is checked whether the parameter condition 1 (valve interlock parameter (FIG. 9C) is the same as the state (opening / closing) of the valve state storage region (FIG. 9B) (S107). Is repeated until the Valve No reaches the maximum value (S108), and when the Valve No reaches the maximum value, Steps S103 and after are repeated until the Step No reaches the maximum value (S109). If the value is reached, the valve check is completed as OK processing (S110).
In S107, Valve No. If the parameter condition of X (valve interlock parameter) is different from the state (open / close) of the valve state storage area, the NG process (S111) is performed. Completed.

The check result of the valve check is output to the display unit 33 provided in the operation control controller 601. In the case of NG, the corresponding Step, the corresponding valve number, and the like that are NG are displayed so that the operator can easily correct. After the operator corrects, the valve check will be performed again.
The process recipe is provided with an area for storing the valve interlock check OK / NG, and the process recipe that is not OK can be rejected. The process recipe may be downloaded from the customer (host computer), but this check is also performed at that time, and after OK / NG results are returned to the customer (host computer), the OK / NG information is returned. Is stored in the storage unit 32 in the write operation control controller 601 in the storage area of the recipe. Thereby, even when the customer corrects the valve setting to be OK and does not download it to the apparatus, a recipe with a setting error is not executed.

  When a command to start Step 1 is input from the operation display unit 33, the valve setting is called, and the process recipe valve setting table corresponding to the substrate processing is called from the storage unit 32, and the valve is prohibited from being used. A valve check program for determining A setting request is made based on the setting condition of the valve set in Step 1, and the setting request is compared with the setting state of the process recipe valve setting table by the valve check program.

If the valve setting contents in Step 1 and the setting contents of the process recipe valve setting table are not consistent, an alarm is issued as NG. As a case where the setting contents of the process recipe valve setting table are not consistent with each other, for example, when Step 1 is executed, the valve for Step 2 is set. The alarm is such that a message indicating that the valve setting of Step 1 is incorrect is displayed on the operation display unit 33, a warning light is flashed, a buzzer is sounded, or the like.
Further, when an incorrect valve is opened and closed by manual operation or the like at the time of execution, an alarm is generated because it is not consistent with the setting contents of the process recipe valve setting table.

  In addition, the substrate processing command is canceled at the same time that an alarm is issued. As a result, the operator can know that there is an error in the setting for executing the substrate processing, and the substrate processing is canceled, so that the occurrence of defective processing can be prevented.

  Further, when the valve setting contents in Step 1 and the setting contents of the process recipe valve setting table are consistent, the use prohibition valve is set, and further, the substrate processing such as a sequence program is executed from the storage unit 32. The substrate processing program is developed.

  Note that the use and prohibition of the valve in the substrate processing to be executed is prohibited because the valve check program checks the setting state of the valve of the step that has been input by the process recipe valve setting table. Is certain.

  If a different step other than Steps 1 to N is to be performed, a process recipe valve setting table corresponding to the process may be created and added, and it is necessary to change the substrate processing software or hardware settings. do not do. Therefore, it is rich in versatility, and can handle a plurality of processes and film types with one substrate processing apparatus.

  In the description of the embodiment of the present invention, the group management device 30 includes an operation display unit 33, a keyboard (not shown), and the like, and creates a recipe, inputs a setting, or inputs a previously created recipe. . The operation display unit 33 may be a touch panel, and the keyboard may be omitted.

  The storage unit 32 includes a program storage unit and a data storage unit. The program storage unit includes a process program for executing a process, a recipe program for executing a recipe corresponding to the process, and a valve use prohibition state. A determination processing program, a sequence program for executing a sequence, and the like, a substrate processing program necessary for substrate processing are stored, and the data storage unit includes a recipe, a use prohibition valve setting table in which a use prohibition state is set, Data such as the temperature, pressure, and gas flow rate of the processing furnace 202 during processing is recorded.

The main control unit 11 is connected to an external storage device 35 (for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card). The stored program can be configured by installing it in a computer. The main storage unit 12 and the external storage device 35 are configured as computer-readable recording media. Hereinafter, these are collectively referred to simply as a recording medium. When the term “recording medium” is used in this specification, it may include only the main storage unit 12 alone, may include only the external storage device 35 alone, or may include both. The program may be provided to the computer by using communication means such as the Internet or a dedicated line without using the external storage device 35.

  The present invention can be applied not only to a substrate processing apparatus for a semiconductor device but also to an apparatus for processing a glass substrate such as an LCD device. The film formation process includes, for example, a process for forming CVD, PVD, an oxide film, a nitride film, a process for forming a film containing metal, and the like. Needless to say, the present invention can also be applied to other substrate processing apparatuses (exposure apparatus, lithography apparatus, coating apparatus, etc.).

(Appendix)
The present invention includes the following embodiments.

(Appendix 1)
According to one aspect of the invention,
A storage unit for storing a parameter indicating a predetermined valve interlock check content (valve check pattern) and a parameter indicating a setting content of each valve set when a recipe for processing a substrate is created; A display unit capable of displaying the contents of the parameter on the operation screen,
The operation unit is provided with a substrate processing apparatus configured to be able to display a button for collating the contents of the parameters on the operation screen.

(Appendix 2)
According to another aspect of the invention,
A method for manufacturing a semiconductor device, comprising: a step of creating a recipe for processing a substrate; and a step of executing the recipe,
The step of creating the recipe includes a step of setting a predetermined parameter for each step constituting the recipe, a parameter indicating a predetermined valve interlock check content (valve check pattern), and the predetermined parameter setting. A step of collating the parameters indicating the setting contents of each valve set at the time;
As a result of collating each parameter, the process of clearly showing the inconsistent part on the operation screen,
A method for manufacturing a semiconductor device is provided.

(Appendix 3)
The substrate processing apparatus according to appendix 1, wherein the operation unit provides a substrate processing apparatus in which an erroneous setting portion of the parameter is clearly indicated on an operation screen as a result of collating each parameter.

(Appendix 4)
The substrate processing apparatus according to appendix 1, wherein the operation unit is configured such that the recipe cannot be executed if it is determined as NG as a result of comparing the parameters.

(Appendix 5)
The substrate processing apparatus according to appendix 4, wherein, in the case of the NG determination, the operation unit displays a step or valve number corresponding to an erroneous setting of the parameter on the operation screen.

(Appendix 6)
The substrate processing apparatus according to appendix 4, wherein the operation unit is configured not to be able to press a button for collation in the case of the NG determination.

(Appendix 7)
The substrate processing apparatus according to appendix 6, wherein in the case of the NG determination, the operation unit is configured to be able to press the button for collation when a factor of the NG determination is eliminated. Is provided.

(Appendix 8)
According to yet another embodiment of the invention,
A procedure for storing a parameter indicating a predetermined valve interlock check content (valve check pattern) and a parameter indicating a setting content of each valve set when a recipe for processing a substrate is created;
The procedure for displaying the contents of each parameter on the operation screen;
A procedure for displaying a button for collating the contents of each parameter on the operation screen;
And a recording medium that can read the program.

(Appendix 9)
The method for manufacturing a semiconductor device according to attachment 2, wherein the step of creating the recipe further includes a step of correcting an erroneous setting part of the parameter and a step of collating the parameters again.

(Appendix 10)
The method of manufacturing a semiconductor device according to attachment 2, wherein the step of creating the recipe at least repeats a step of correcting an erroneous setting portion of the parameter and a step of collating the parameters again.

(Appendix 11)
According to yet another embodiment of the invention,
An operation screen for a button for comparing a parameter indicating a predetermined valve interlock check content with a parameter indicating a setting content of each valve among predetermined parameters set when a recipe for processing a substrate is created. There is provided a terminal device comprising: an operation unit provided in the control unit; and a control unit that causes an erroneous setting portion between the parameters to be clearly indicated on the operation screen.

(Appendix 12)
The terminal device according to attachment 11, wherein the operation unit displays an erroneous setting portion between the parameters by color on the operation screen, and the control unit stops collation between the parameters.

(Appendix 13)
The terminal device according to attachment 11, wherein the control unit is configured to be able to transfer the recipe according to a result of collating each parameter.

(Appendix 14)
The terminal device according to appendix 11, further comprising a substrate processing apparatus for processing a substrate,
The control unit is configured to transfer the recipe created by correcting the valve opening / closing setting on the operation screen to the substrate processing apparatus.

(Appendix 15)
According to yet another embodiment of the invention,
An operation screen for a button for comparing a parameter indicating a predetermined valve interlock check content with a parameter indicating a setting content of each valve among predetermined parameters set when a recipe for processing a substrate is created. A substrate processing system comprising: a terminal device having an operation unit provided in the control unit; a terminal device having a control unit that clearly indicates an erroneous setting portion between the parameters on the operation screen; and a substrate processing apparatus that processes a substrate,
There is provided a substrate processing system in which the control unit is configured to download the recipe created by correcting the valve opening / closing setting on the operation screen to the substrate processing apparatus.

11 Main Control Unit 30 Group Management Device 32 Storage Unit 33 Operation Display Unit 60 Network 100 Substrate Processing Unit 601 Operation Control Controller 602 Process Control Controller 603 Valve Control Controller 604 Digital I / O
604 Valve Check button

Claims (2)

A storage unit that stores parameters indicating the details of the valve interlock check determined in advance and parameters indicating the settings of each valve set when the recipe for processing the substrate is created, and operates the contents of each parameter An operation unit having a display unit that can be displayed on a screen;
The substrate processing apparatus, wherein the operation unit is configured to display a button for collating the contents of the parameters on the operation screen. A method for manufacturing a semiconductor device, comprising: a step of creating a recipe for processing a substrate; and a step of executing the recipe,
The step of creating the recipe includes a step of setting a predetermined parameter for each step constituting the recipe, a parameter indicating the content of a predetermined valve interlock check, and each of the parameters set when the predetermined parameter is set A step of checking a parameter indicating the setting content of the valve;
As a result of collating each parameter, the process of clearly showing the inconsistent part on the operation screen,
A method of manufacturing a semiconductor device including: