KR100993441B1 - Substrate loading mechanism, substrate transfer method, substrate processing apparatus and computer readable storage medium - Google Patents

Abstract

This invention relates to the board | substrate mounting mechanism which can suppress the deformation of a to-be-processed substrate effectively, reliably supporting a to-be-processed substrate by a lifting pin, even if a to-be-processed substrate is large. The substrate mounting mechanism is provided so that the susceptor 4 serving as the mounting table on which the flexible substrate G is mounted and the mounting surface of the susceptor 4 can be driven around, and the peripheral and central portions of the substrate G are provided. The lifter pins 8a and 8b and the lifter pins 8a and 8b, which lift and move between the exchange positions where the upper and lower positions of the susceptor 4 are executed and the mounting positions on the susceptor 4, respectively. The drive parts 9a and 9b as a drive mechanism to drive are provided, The drive parts 9a and 9b protrude the lifter pin 8a higher than the lifter pin 8b, when raising and lowering the board | substrate G, and the board | substrate ( It is to be stably supported by the lifter pins 8a and 8b in the state where G) is convex downward.

Description

SUBSTRATE LOADING MECHANISM, SUBSTRATE TRANSFER METHOD, SUBSTRATE PROCESSING APPARATUS AND COMPUTER READABLE STORAGE MEDIUM}

This invention supports the to-be-processed board | substrate which has flexibility, such as a glass substrate for flat-panel displays (FPD), with the lifting pin which protrudes with respect to the mounting surface of a mounting board, A substrate mounting mechanism and a substrate exchange method for raising and lowering between a exchange position for performing exchange of a substrate and a mount position mounted on a mounting table.

In the manufacturing process of FPD, various processes, such as dry etching, sputtering, CVD (chemical vapor deposition), are performed with respect to the glass substrate for FPD which is a to-be-processed substrate. Such a process is usually performed in a state where a glass substrate is mounted on a mounting table provided in the chamber, and loading and unloading of the substrate with respect to the mounting table are generally provided such that they can be driven around the mounting surface of the mounting table. It is performed by several lifting pins. When loading a board | substrate, the lifting pins are raised and protruded from the mounting surface of a mounting table, the board | substrate conveyed by the conveying member, such as a conveying arm, is moved on the lifting pins, and then the lifting pins are lowered and immersed in the mounting surface of a mounting table (沒 入). Moreover, when unloading a board | substrate, a lifting pin is raised and protrudes from the mounting surface of a mounting board, and a board | substrate is separated from a mounting board, and the board | substrate of a lifting pin is moved to a conveyance member.

It is preferable to provide the lifting pin at the periphery position of the glass substrate in consideration of the effect on the processing quality, but in recent years, the increase in size of the FPD has been oriented, and the enormous glass substrates such as one side exceeding 2m have also emerged. It is becoming difficult to support such a large glass substrate only by the lifting pin of.

For this reason, when a glass substrate is large, providing a lifting pin also in the center part position so that a glass substrate can be reliably supported (for example, refer patent document 1), As mentioned above, In consideration of the influence, the lifting pins provided at the central position of the glass substrate must be limited to a few. As a result, as shown in FIG.9 (a), when glass substrate A is supported by the lift pins B and C of a peripheral part position and a center part position, glass substrate A will raise and lower pins B and C. When the glass substrate A is mounted on the mounting table D, as shown in Fig. 9B, the deformed glass substrate ( There exists a possibility that the center part of A) may float out from the mounting table D. The mounting table often has a temperature control function for adjusting the temperature of the glass substrate at the time of treatment. For example, in the plasma etching apparatus, the mounting table plays a role of cooling the glass substrate at the time of plasma etching treatment. If a part of the surface rises from the mounting table, the temperature of the glass substrate becomes nonuniform in the plane, thereby causing a processing unevenness, for example, an etching unevenness.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2002-246450

The present invention has been made in view of the above circumstances, and even if the substrate to be processed is large, a substrate mounting mechanism and a substrate exchange mechanism capable of effectively suppressing deformation of the substrate to be processed while reliably supporting the substrate by the lifting pins, An object of the present invention is to provide a substrate processing apparatus having such a substrate mounting mechanism and a computer-readable storage medium storing a control program for executing such a substrate transfer method.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, from a 1st viewpoint of this invention, it is provided so that the mounting table which mounts the to-be-processed substrate which has flexibility, and the mounting surface of the said mounting base can be driven, and supports the to-be-processed substrate, and is mounted A substrate mounting mechanism comprising: a plurality of lifting pins for lifting up and down between a transfer position for performing transfer of a large upper substrate and a mounting position for mounting the target; and a drive mechanism for driving the lifting pins. The lifting pin has a first lifting pin that supports the periphery of the substrate and a second lifting pin that supports the central portion of the substrate, and the drive mechanism is configured to lift the first substrate when the substrate is elevated. Wherein the pin is projected higher than the second lifting pin so that the substrate to be processed can be stably supported in the convex shape. It provides a mounting mechanism.

In the first aspect of the present invention, it is preferable that the drive mechanism independently drives the first lift pin and the second lift pin.

Moreover, in the above 1st viewpoint of this invention, the control part which controls the drive of the said 1st and 2nd lifting pins by the said drive part is provided, The said control part is a position to which the to-be-processed board | substrate of the said mounting position was received. It is preferable to temporarily stop the driving of the first and second lifting pins in the protruding direction when the substrate to be processed is squeezed down while maintaining the contact with the mounting table while being raised toward. Do. Or a control part which controls the drive of the said 1st and 2nd lifting pins by the said drive part is provided, The said control part is in the middle of raising the to-be-processed board | substrate of the said mounting position toward the said receiving position. When the first and second lifting pins are stopped in the protruding direction while being in a convex shape while maintaining contact with the mounting table, the driving in the protruding direction of the first and second lifting pins is once stopped, and the driving is resumed to mount the substrate to be processed. After being separated from the table, the first and second lifting pins are driven in the immersion direction, and the driving is stopped when the substrate to be processed is brought into contact with the mounting table while being convex downward. It is preferable to drive the first and second lifting pins in the protruding direction again.

Further, in the first aspect of the present invention described above, the first and second lifting pins are configured to receive the to-be-processed substrate supported from below by the transfer member and conveyed to the transfer position, and the control unit is And the first and second lifting pins while being driven in the protruding direction toward the exchange position, when the substrate to be processed is in a convex shape while maintaining contact with the conveying member. And stopping the driving of the second lifting pin in the protruding direction once. Alternatively, the first and second lifting pins are configured to receive a to-be-processed substrate supported from below by a transfer member and conveyed to the transfer position, and the control unit is configured to receive the first and second lifting pins. While driving in the protruding direction toward the receiving position, the substrate to be processed is in the protruding direction of the first and second lifting pins when the substrate to be processed is kept convex downward while maintaining contact with the conveying member. The driving is once stopped, the driving is resumed, and the substrate to be processed is separated from the conveying member, and then the first and second lifting pins are driven in the immersion direction, and the substrate is held in a convex downward manner. It is preferable to stop this drive when it is in contact with a conveyance member, and to drive the said 1st and 2nd lifting pin again in a protrusion direction after that.

Moreover, from the 2nd viewpoint of this invention, the board | substrate mounting mechanism which has a processing container which accommodates a to-be-processed board | substrate, the mounting table provided in the said processing container, and mounts a to-be-processed board | substrate, and is mounted on the said mounting table A processing mechanism for performing a predetermined processing on a substrate is provided, and the substrate mounting mechanism has a configuration of the first aspect.

In the second aspect of the present invention, the processing mechanism includes a gas supply mechanism for supplying a processing gas into the processing container, an exhaust mechanism for exhausting the inside of the processing container, and a plasma of the processing gas in the processing container. It is preferable to have a plasma generating mechanism, and to perform a plasma treatment on a substrate to be processed.

Moreover, in the 3rd viewpoint of this invention, a board | substrate to be processed is supported by the some lifting pin which protrudes with respect to the mounting surface on which the to-be-processed board | substrate which mounts is flexible, and the board | substrate of the upper side of the said board | substrate is exchanged. In a substrate exchange method of elevating between an exchange position to be executed and a mounting position of the object to be mounted, the plurality of elevating pins include: a first elevating pin for supporting the periphery of the substrate and a central portion of the substrate; It consists of a 2nd lifting pin which supports, and when raising a to-be-processed board | substrate, the said 1st lifting pin protrudes higher than the said 2nd lifting pin, so that a to-be-processed board | substrate may be stably supported in the state which spread down. It provides a substrate transfer method characterized in that.

According to a third aspect of the present invention, a load detection unit for detecting a load of a substrate to be processed is provided in each of the first and second lifting pins, and the first lifting pin and the first lifting pin are based on a detection result of each of the load detection units. The difference in the protruding height of the second lifting pin can be adjusted.

In addition, according to the third aspect of the present invention, the substrate to be processed is raised downward while maintaining the contact with the mounting table while the substrate to be processed at the mounting position is raised toward the receiving position. It is preferable to stop driving of the said 1st and 2nd lifting pins in the protrusion direction once in a 휜 state. Alternatively, when the substrate to be processed at the mounting position is raised toward the exchange position, when the substrate to be processed is held downward in a convex shape while maintaining contact with the mounting table, the first and second portions are arranged. The driving in the protruding direction of the lifting pins is once stopped, the driving is resumed to separate the substrate from the mounting table, and then the first and second lifting pins are driven in the immersion direction, and the substrate to be It is preferable to stop this driving when it is in contact with the mounting table while keeping the convex shape, and then drive the first and second lifting pins again in the protruding direction.

Furthermore, in the above 3rd viewpoint of this invention, the said 1st and 2nd lifting pins are comprised so that the to-be-processed board | substrate supported by the conveyance member and conveyed to the said sending and receiving position may be comprised, and the said 1st and The first and second lifting pins while the second lifting pin is driven downward in the protruding direction toward the transfer position, when the substrate to be processed is kept in convex shape while maintaining contact with the conveying member. It is preferable to stop the driving in the protruding direction. Alternatively, the first and second lifting pins are configured to receive a to-be-processed substrate supported from below by the transfer member and conveyed to the transfer position, and the first and second lift pins are configured to receive the transfer position. While driving in the protruding direction, the driving of the first and second lifting pins in the protruding direction is stopped once when the substrate to be processed is squeezed down while maintaining contact with the conveying member. After the driving is resumed and the substrate to be processed is spaced apart from the conveying member, the first and second lifting pins are driven in the immersion direction, and the substrate is brought into contact with the conveying member with the substrate being convex downward. It is preferable to stop this drive in the state, and to drive the said 1st and 2nd lifting pin again in a protrusion direction after that.

Further, in a fourth aspect of the present invention, in a computer-readable storage medium in which a control program operating on a computer is stored, the control program controls that the computer controls the processing device so that the substrate transfer method is executed at the time of execution. A computer readable storage medium is provided.

According to the present invention, the plurality of lifting pins includes a first lifting pin for supporting the periphery of the substrate, and a second lifting pin for supporting the center portion of the substrate. Since the first lifting pin is projected higher than the second lifting pin so that the substrate to be processed is stably supported in a state of being convex downward, the first and second lifting pins are used even if the substrate is large. The substrate to be processed can be reliably supported, and the deformation of the substrate to be processed due to the bending caused by the weight of the portion between the first and second lifting pins and the supporting reaction force of the second lifting pin can be effectively suppressed. Therefore, it becomes possible to suppress the rise of the to-be-processed substrate with respect to a mounting table, and to suppress a generation of a process nonuniformity.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross sectional view in a lateral direction of a plasma etching apparatus as an embodiment of a substrate processing apparatus with a substrate mounting mechanism according to the present invention, and Fig. 2 is a schematic cross sectional view in a planar direction thereof.

This plasma etching apparatus 1 is configured as a capacitively coupled parallel plate plasma etching apparatus for performing etching on a glass substrate (hereinafter, simply referred to as a "substrate") G for FPD. Examples of the FPD include a liquid crystal monitor (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), and the like. The plasma etching apparatus 1 is equipped with the chamber 2 as a processing container which accommodates the board | substrate G. As shown in FIG. The chamber 2 is made of aluminum, for example, whose surface is anodized (anodic oxidation), and is formed in a rectangular cylinder shape corresponding to the shape of the substrate G. As shown in FIG.

The susceptor 4 as a mounting table on which the substrate G is mounted is provided on the bottom wall in the chamber 2. The susceptor 4 is formed in a rectangular plate shape or a column shape corresponding to the shape of the substrate G, and an insulating material covering the base material 4a made of a conductive material such as metal and the periphery of the base material 4a. The insulating member 4b which consists of an insulating material 4b which consists of an insulating material which is provided so that the bottom part of the base material 4a and the insulating member 4b may be covered and supports them is provided. A feed line 23 for supplying high frequency power is connected to the base material 4a, and a matcher 24 and a high frequency power supply 25 are connected to the feed line 23. The high frequency power of 13.56 MHz is applied from the high frequency power supply 25 to the susceptor 4, and the susceptor 4 is comprised so that it functions as a lower electrode. Moreover, the susceptor 4 has the electrostatic adsorption mechanism which is not shown in figure for adsorb | sucking the mounted board | substrate G.

The upper or upper wall of the chamber 2 is provided so that the showerhead 11 which functions as an upper electrode while supplying process gas into the chamber 2 and opposes the susceptor 4. The shower head 11 has a gas diffusion space 12 for diffusing a processing gas therein, and a plurality of discharge holes 13 for discharging the processing gas on a lower surface or a surface facing the susceptor 4. Formed. The shower head 11 is grounded, and together with the susceptor 4 constitutes a pair of parallel flat electrodes.

A gas inlet 14 is provided on the upper surface of the shower head 11, and a process gas supply pipe 15 is connected to the gas inlet 14, and a valve 16 is connected to the process gas supply pipe 15. ) And the mass flow controller 17 are connected to the processing gas supply source 18. The process gas for etching is supplied from the process gas supply source 18. As the processing gas, a gas usually used in this field, such as a halogen gas, O ₂ gas, or Ar gas, can be used.

An exhaust pipe 19 is connected to the bottom wall of the chamber 2, and an exhaust device 20 is connected to the exhaust pipe 19. The exhaust device 20 includes a vacuum pump such as a turbomolecular pump, and is thus configured to be capable of vacuum suction in the chamber 2 to a predetermined reduced pressure atmosphere. On the sidewall of the chamber 2, a carry-in and outlet 21 for carrying in and out of the substrate G is formed, and a gate valve 22 for opening and closing the carry-in and outlet 21 is provided, and the carry-in and outlet 21 is provided. At the time of opening of the substrate G between the loadlock chambers (not shown) adjacent to each other in a state where the substrate G is supported from below by the conveying arm 40 (see the imaginary line in FIGS. 2 and 4) as the conveying member. It is configured to be conveyed.

The substrate mounting surface of the susceptor 4 is provided with a cooling space (not shown) filled with a temperature control gas such as He gas that is mounted on the susceptor 4 and cools the adsorbed substrate G during the plasma etching process. The temperature control gas supply line 41 for supplying a temperature control gas to this cooling space is provided so as to pass through the susceptor 4 and penetrate the bottom wall of the chamber 2. The temperature control gas supply line 42 is connected to the temperature control gas supply line 41, and the pressure control valve 43 for adjusting the supply pressure of the temperature control gas is provided.

In the bottom wall of the chamber 2 and the susceptor 4, the through insertion holes 7a and 7b penetrating them are respectively located at the periphery position and the center position (inside or near the center position of the periphery position) of the susceptor 4, respectively. Formed. For example, the through insertion holes 7a are formed in eight positions at two sides at predetermined intervals, and the through insertion holes 7b are parallel to, for example, a pair of opposite sides of the susceptor 4. It is formed in two places at predetermined intervals so as to be arranged. Lifter pins 8a and 8b (first and second lift pins) which support and lift the substrate G from below are respectively driven into the through insertion holes 7a and 7b with respect to the substrate mounting surface of the susceptor 4. It is inserted as possible. The lifter pins 8a and 8b are provided so as to contact the periphery and the center of the substrate G at the time of protruding, respectively, and are positioned in the radial direction or the width direction by a positioning bush (not shown), so that the through insertion hole is provided. It is inserted in (7a, 7b).

3 is a schematic diagram of a substrate mounting mechanism.

As shown in FIG. 3, the lifter pins 8a and 8b respectively protrude to the outside of the chamber 2, and the lower ends thereof are connected to the driving units 9a and 9b, and the driving units 9a and 9b are driven. It is comprised so that it may protrude and immerse with respect to the board | substrate mounting surface of the susceptor 4 by lifting up and down by. The drive parts 9a and 9b are each configured using a stepping motor, for example.

Flange 26 is formed in the lower part of the lifter pin 8a, 8b, respectively, One end (lower end) of the elastic bellows 27 provided so that the flange 26 may surround the lifter pin 8a, 8b is provided. Is connected, and the other end (upper end) of this bellows 27 is connected to the bottom wall of the chamber 2. As a result, the bellows 27 expands and contracts with the lifting and lowering of the lifter pins 8a and 8b, and seals the gap between the through insertion holes 7a and 7b and the lifter pins 8a and 8b.

The driving units 9a and 9b are configured to be controlled separately by the controller 31 having a microprocessor (computer), so that the lifter pins 8a and the lifter pins 8b can be independently lifted. Consists of. The controller 31 includes a keyboard for performing a command input operation or the like for the process manager to manage the driving of the driving units 9a and 9b, a display for visually displaying the driving state of the driving units 9a and 9b, and the like. A storage unit in which a recipe in which a control program, driving condition data, and the like are recorded, for realizing driving of the user interface 32 and the driving units 9a and 9b by the control of the controller 31 ( 33) is connected. Then, if necessary, an arbitrary recipe is called from the storage unit 33 by the instruction from the user interface 32 and executed in the controller 31, thereby driving the driving units 9a and 9b under the control of the controller 31. And stop is executed. The recipe may be used in a state stored in a computer-readable storage medium such as a CD-ROM, a hard disk, or a flash memory, or may be frequently transmitted from another device via, for example, a dedicated line. .

The controller 31, the user interface 32, and the storage unit 33 constitute a control unit for controlling the lifting and lowering of the lifter pins 8a and 8b by the driving units 9a and 9b, and the susceptor 4 and the lifter pins. 8a, 8b, the drive parts 9a, 9b, and a control part comprise a board | substrate mounting mechanism.

In the plasma etching apparatus 1 comprised in this way, the board | substrate G is the conveyance arm 40 (imaginary line of FIG. 2, FIG. 4) in the state which the loading / exit opening 21 is opened by the gate valve 22 first. When it is carried in from the carry-in / out port 21 and conveyed to the upper direction of the susceptor 4, each lifter pin 8a, 8b is raised and protrudes higher than the conveyance arm 40. Moreover, each lifter pin 8a, 8b and conveyance arm 40 are provided so that it may not mutually contact. As a result, the substrate G is transferred from the transfer arm 40 onto the lifter pins 8a and 8b. At this time, as described above, the lifter pin 8a is placed a predetermined amount higher than the lifter pin 8b so that the load of the substrate G is distributed to the lifter pins 8a and 8b, and the substrate G is lowered. The lifter pins 8a and 8b are supported by the lifter pins in the convex shape. When the transfer arm 40 exits the chamber 2 from the inlet and outlet 21, the inlet and outlet 21 is blocked by the gate valve 22, and the lifter pin 8a is lifted from the lifter pin 8b. The lifter pins 8a and 8b are lowered while keeping at a predetermined high position. The substrate G is mounted on the susceptor 4 by immersing the mounting surface of the susceptor 4 in the order of the lifter pin 8b and the lifter pin 8a. Since the load of the board | substrate G is distributed to each lifter pin 8a, 8b in balance, the board | substrate G deforms by the support reaction force of the lifter pin 8a, 8b, especially the lifter pin 8b. The deformation of the center portion is suppressed, and the contact surface of the susceptor 4 can be contacted over the entire surface or almost the entire surface.

When the inlet / outlet 21 is closed by the gate valve 22 and the substrate G is mounted on the susceptor 4, the exhaust device 20 vacuums the inside of the chamber 2 to a predetermined degree of vacuum. . Next, the chamber 2 is passed through the process gas supply pipe 15, the gas inlet 14, and the shower head 11 while adjusting the flow rate of the process gas from the process gas supply source 18 by the mass flow controller 17. ) And a DC voltage is applied to the electrostatic adsorption mechanism in this state to adsorb the substrate G to the susceptor 4.

Then, high frequency power is applied from the high frequency power supply 25 to the susceptor 4 via the matching unit 24 to generate a high frequency electric field between the susceptor 4 as the lower electrode and the showerhead 11 as the upper electrode. In order to make the process gas in the chamber 2 into plasma, and to avoid the temperature change of the substrate G, for example, the temperature rise, the temperature control gas from the temperature control gas supply 42 is controlled by the pressure control valve 43. ) Is introduced into the cooling space on the back surface side of the substrate G adsorbed to the susceptor 4 via the temperature control gas supply line 41. In this state, the etching process is performed on the substrate G by the plasma of the processing gas.

When the etching treatment is performed on the substrate G, the application of the high frequency power from the high frequency power supply 25 is stopped, the introduction of the processing gas and the temperature control gas is stopped, and the substrate G is stopped by the electrostatic adsorption mechanism. Release the adsorption. Next, the inlet / outlet 21 is opened by the gate valve 22, and the lifter pins 8a and 8b are raised in the same manner as when the substrate G is received from the transfer arm 40. G) is bent downwardly convex to be spaced apart from the susceptor 4 upwards. After that, when the transfer arm 40 enters the chamber 2 from the carrying in and out ports 21, the lifter pins 8a and 8b are lowered. Thereby, the board | substrate G is moved to the conveyance arm 40 from the lifter pin 8a, 8b. And the board | substrate G is carried out from the carrying in / out port 21 to the chamber 2 exterior by the conveyance arm 40. As shown in FIG.

In the present embodiment, the lifter pins 8a are placed higher than the lifter pins 8b by a predetermined amount and supported in a state in which the substrate G is bent downward in a convex shape, thereby bending the portions between the lifter pins 8a and 8b. And the deformation of the substrate G due to the supporting reaction force of the lifter pin 8b, which can suppress the rise of the substrate G with respect to the susceptor 4 functioning as the lower electrode. By the temperature control gas supplied from the susceptor 4, the substrate G can be cooled almost evenly over the entire surface, thereby making it possible to effectively suppress the occurrence of etching unevenness. Similarly after the etching process, the support reaction force of the lifter pin 8b is supported by arranging the lifter pin 8a in a predetermined amount higher than the lifter pin 8b and supporting the substrate G in a convex shape downward. Since deformation | transformation of the board | substrate G by this can be suppressed, it becomes possible to improve the quality of the post-processing of an etching.

Next, an example of receipt of the substrate G from the transfer arm 40 and the susceptor 4 by the lifter pins 8a and 8b will be described.

FIG. 5: is a figure for demonstrating the receiving aspect of the board | substrate G from the conveyance arm 40 by the lifter pin 8a, 8b.

The board | substrate G conveyed by the conveyance arm 40 may be adsorb | sucked by this conveyance arm 40. FIG. In this case, when the lifter pins 8a and 8b are raised at once to receive the substrate G from the transfer arm 40, when the substrate G is peeled off from the conveying arm 40 that has been adsorbed, it receives an impact. It may vibrate greatly and cause a misalignment or breakage. Here, when receiving the board | substrate G from the conveyance arm 40 by the lifter pin 8a, 8b, as shown to FIG. 5 (a), the lifter pin 8a will be compared with the lifter pin 8b. Lifter pins 8a and 8b are raised so as to be arranged a predetermined amount higher, and as shown in FIG. 5 (b), the substrate G contacts the lifter pins 8a while maintaining the contact with the transfer arm 40. As a result, the lifter pins 8a and 8b are temporarily stopped when the substrate G is in a convex shape, and more preferably, when the substrate G is in a state just before falling off the carrying arm 40. Thereby, even when the board | substrate G is adsorb | sucked to the conveyance arm 40, in order to peel off the board | substrate G gradually from the conveyance arm 40, the vibration of the board | substrate G can be suppressed. Then, as shown in FIG. 5C, the lifter pins 8a and 8b are lifted again to separate the substrate G from the transfer arm 40. Thereby, it becomes possible to safely move the board | substrate G from the conveyance arm 40 onto the lifter pins 8a and 8b.

In addition, as shown in FIG. 5 (c), when the lifter pins 8a and 8b are lifted up again and the substrate G is separated from the transfer arm 40, for example, the center portion is attached to the transfer arm 40. When vibration is generated in the substrate G by being adsorbed, the lifter pins 8a and 8b are lowered as shown in Fig. 5D. And as shown in FIG.5 (e), the board | substrate G contact | connected again with the conveyance arm 40 with the board | substrate G bent convexly downward, More preferably, the board | substrate G is the conveyance arm 40 more preferably. In the state just after contacting with, the lowering of the lifter pins 8a and 8b is stopped. In this state, since the contact part of the board | substrate G and the conveyance arm 40 is small, and there is no possibility that the board | substrate G will adsorb | suck to the conveyance arm 40 again, the vibration of the board | substrate G more reliably. It can be suppressed. Subsequently, as shown in FIG. 5F, the lifter pins 8a and 8b are raised again, and the substrate G is separated from the transfer arm 40, thereby moving the substrate G to the transfer arm 40. It is possible to move more safely from above onto the lifter pins 8a and 8b.

FIG. 6 is a view for explaining a receiving mode of the substrate G from the susceptor 4 by the lifter pins 8a and 8b.

Since the board | substrate G after the etching process may be adsorb | sucked to the susceptor 4 which functions as a lower electrode, even if the adsorption | suction by the electrostatic adsorption mechanism is cancelled, the susceptor by the lifter pins 8a and 8b ( It is preferable to perform receipt of the board | substrate G from 4) similarly to receipt from the conveyance arm 40. FIG. First, as shown in Fig. 6A, the lifter pins 8a and 8b are raised so that the lifter pins 8a are arranged higher than the lifter pins 8b (even if only the lifter pins 8a are raised). Good), as shown in Fig. 6 (b), the substrate G is brought into contact with the lifter pin 8a and is convex downward while maintaining contact with the transfer arm 40, more preferably. Stops the lift of the lifter pins 8a and 8b once when the substrate G is in the state just before it is detached from the susceptor 4. As shown in FIG. 6C, the lifter pins 8a and 8b are lifted again to separate the substrate G from the transfer arm 40. Thereby, the vibration of the board | substrate G is suppressed and it becomes possible to safely move the board | substrate G from the susceptor 4 onto the lifter pins 8a and 8b.

In addition, as shown in Fig. 6C, when the lifter pins 8a and 8b are lifted again and the substrate G is separated from the susceptor 4, for example, the center portion is placed on the susceptor 4, for example. When vibration is generated in the substrate G by being adsorbed, the lifter pins 8a and 8b are lowered as shown in Fig. 6 (d), and the substrate G is shown in Fig. 6 (e). ) Is in contact with the susceptor 4 again while being convex downward, more preferably in the state immediately after the substrate G is in contact with the susceptor 4. Stop the descent of Thereafter, as shown in FIG. 6 (f), the lifter pins 8a and 8b are raised again to separate the substrate G from the transfer arm 40. Thereby, the vibration of the board | substrate G can be suppressed more reliably, and it becomes possible to move the board | substrate G more safely from the susceptor 4 onto the lifter pins 8a and 8b.

Next, the load of the board | substrate G which acts on each lifter pin 8a, 8b at the time of supporting the board | substrate G is adjusted, adjusting the difference of the protrusion height of the lifter pin 8a and the lifter pin 8b. Measured. The size (vertical × horizontal) of the substrate G is 1800 mm × 1500 mm, and the load measurement of the substrate G acting on each lifter pin 8a, 8b is performed by the lifter pin ( It carried out by the load sensor 50 as a load detection part provided in the front-end | tip part of 8a, 8b). The results are shown in FIG. In addition, in FIG. 8, the vertical axis was made into the [measured value by each load sensor 50], and the horizontal axis was made into the [height of the lifter pin 8b-the height of the lifter pin 8a].

As shown in FIG. 8, when the lifter pin 8a is placed slightly higher than the lifter pin 8b, a large deviation occurs in the measured value by each load sensor 50. As the difference in the height of the lifter pins 8b increases, the deviation of the measured value by each load sensor 50 decreases, and the lifter pins 8a have a predetermined amount than the lifter pins 8b, here about 20 mm. In the case where the lifter pin 8a is placed at the same height as the lifter pin 8b, or when the lifter pin 8a is disposed at a height lower than the lifter pin 8b, each load sensor ( The deviation of the measured value by 50) is getting smaller. That is, it was confirmed that by placing the lifter pins 8a higher than the lifter pins 8b by a predetermined amount as in the present embodiment, the load of the substrate G can be uniformly distributed to the lifter pins 8a and 8b. . Therefore, according to this embodiment, it is thought that the deformation | transformation of the board | substrate G can be suppressed, and the board | substrate G can be stably supported.

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible. In the above embodiment, a plurality of lifter pins for supporting the center of the substrate may be provided, for example, two. One lifter pin may be used. In addition, in the said embodiment, although the independent drive part was employ | adopted so that the lifter pin which supports the periphery of a board | substrate may be arrange | positioned higher than the lifter pin which supports the center part of a board | substrate, it does not restrict to this, The length of each lifter pin is changed beforehand. In addition, it is also possible to drive each lifter pin by the same drive part, it is also possible to change the length of each lifter pin beforehand, and to use an independent drive part. Moreover, in the said embodiment, although the example applied to the RIE type capacitively coupled parallel plate plasma etching apparatus which applies a high frequency electric power to a lower electrode was demonstrated, it is not limited to this, Other plasma processing apparatuses, such as ashing and CVD film-forming, are mentioned. It is applicable to the board | substrate processing apparatuses other than the plasma processing apparatus which mounts and processes a board | substrate on a mounting table, and is applicable. Moreover, in the said embodiment, although the example applied to the glass substrate for FPD was demonstrated, it is applicable to the board | substrate which has flexibility other than the glass substrate for FPD.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a side direction of a plasma etching apparatus as an embodiment of a substrate processing apparatus having a substrate mounting mechanism according to the present invention;

2 is a schematic cross-sectional view of the plasma etching apparatus in a planar direction;

3 is a schematic diagram of a substrate mounting mechanism;

4 is a view for explaining a support aspect of a substrate by a lifter pin that is a component of the substrate mounting mechanism;

5 is a view for explaining an embodiment of receiving a substrate from a transfer arm by a lifter pin;

6 is a view for explaining an embodiment of receiving a substrate from a susceptor by a lifter pin;

7 is a view for explaining a load measuring method of the substrate acting on the lifter pin,

8 is a view showing a measurement result by the measurement method shown in FIG.

9 is a schematic view of a conventional substrate mounting mechanism.

Explanation of symbols for the main parts of the drawings

1: plasma etching apparatus (substrate processing apparatus: plasma processing apparatus)

2: chamber (processing container) 4: susceptor (mounting table)

8a: lifter pin (first lifting pin) 8b: lifter pin (second lifting pin)

9a, 9b: Drive part (drive mechanism) 15: Process gas supply pipe

18 process gas supply source 19 exhaust pipe

20: exhaust device 25: high frequency power

31: controller 32: user interface

33: Memory 4O: Carrying arm (carrying member)

50: load sensor (load detection unit) G: glass substrate (treated substrate)

Claims (15)

A mounting table for electrostatically absorbing and mounting a flexible glass substrate, A plurality of lifting pins provided so as to be capable of being driven against the mounting surface of the mounting table, and lifting and lowering between a sending and receiving position for supporting a glass substrate to exchange the substrate above the mounting table and a mounting position for the mounting object; A substrate mounting mechanism comprising a drive mechanism for driving the lift pins, The plurality of lifting pins have a first lifting pin that supports the periphery of the glass substrate, and a second lifting pin that supports the center of the glass substrate, The drive mechanism protrudes the first lifting pin higher than the second lifting pin when lifting the glass substrate, so that the glass substrate is stably supported in a convex shape downward, A control unit for controlling driving of the first and second lifting pins by the driving mechanism; The said control part is a state in which the glass substrate was convex-shaped downward while maintaining the contact with the said mounting base, while raising the glass substrate of the said mounting position electrostatically adsorbed by the said mounting base toward the said receiving position. Wherein the driving of the first and second lifting pins in the protruding direction is stopped once, and then the lift is resumed to separate the glass substrate from the mounting table. Board Mount Mechanism. The method of claim 1, The drive mechanism is capable of driving the first lift pin and the second lift pin independently. Board Mount Mechanism. delete A mounting table on which a glass substrate having flexibility is mounted, A plurality of lifting pins provided so as to be capable of being driven against the mounting surface of the mounting table, and lifting and lowering between a sending and receiving position for supporting a glass substrate to exchange the substrate above the mounting table and a mounting position for the mounting object; A substrate mounting mechanism comprising a drive mechanism for driving the lift pins, The plurality of lifting pins have a first lifting pin that supports the periphery of the glass substrate, and a second lifting pin that supports the center of the glass substrate, The drive mechanism protrudes the first lifting pin higher than the second lifting pin when lifting the glass substrate, so that the glass substrate is stably supported in a convex shape downward, A control unit for controlling driving of the first and second lifting pins by the driving mechanism; The said control part is the said, 1st and 2nd, when the glass substrate is bent down convexly, maintaining the contact with the said mounting base, while raising the glass substrate of the said mounting position toward the said receiving position. The driving in the protruding direction of the lifting pins is once stopped and the driving is resumed to separate the glass substrate from the mounting table, and then the first and second lifting pins are driven in the immersion direction, and the glass substrate is convex downward. The drive is stopped when it is in contact with the mounting table while being kept in shape, and then the first and second lifting pins are driven again in the protruding direction. Board Mount Mechanism. The method according to claim 1 or 4, The first and second lifting pins are configured to receive a glass substrate supported from below by a conveying member and conveyed to the transfer position. The said control part, when the said 1st and 2nd lifting pins are driven in the protrusion direction toward the said receiving position, when the glass substrate is bent down convexly, maintaining the contact with the said conveyance member, Characterized in that the driving of the first and second lifting pins in the protruding direction is stopped once Board Mount Mechanism. The method according to claim 1 or 4, The first and second lifting pins are configured to receive a glass substrate supported from below by a conveying member and conveyed to the transfer position. The said control part, when the said 1st and 2nd lifting pins are driven in the protrusion direction toward the said receiving position, when the glass substrate is bent down convexly, maintaining the contact with the said conveyance member, The driving in the protruding direction of the first and second lifting pins is once stopped, the driving is resumed to separate the glass substrate from the conveying member, and then the first and second lifting pins are driven in the immersion direction, and the glass The driving is stopped when the substrate is in contact with the conveying member while being convex downward, and the first and second lifting pins are then driven in the protruding direction again. Board Mount Mechanism. delete delete Sending and receiving position for supporting the glass substrate by a plurality of lifting pins that rush against the mounting surface of the mounting table on which the flexible glass substrate is electrostatically absorbed and mounted to perform the exchange of the substrate above the mounting table and the mounting target In the substrate exchange method of elevating between the mounting position of, The said plurality of lifting pins is comprised from the 1st lifting pin which supports the periphery of a glass substrate, and the 2nd lifting pin which supports the center part of a glass substrate, When raising and lowering the glass substrate, the first lifting pin is projected higher than the second lifting pin, so that the glass substrate is stably supported in a convex shape downward, When the glass substrate is lifted down in the convex shape while maintaining the contact with the mounting table while raising the glass substrate at the mounting position electrostatically adsorbed on the mounting table toward the exchange position. The driving of the first and second lifting pins in the protruding direction is once stopped and then the lift is resumed to separate the glass substrate from the mounting table. Board transfer method. The method of claim 9, The load detection part which detects the load of a glass substrate is provided in each of the said 1st and 2nd lifting pins, and the difference of the protrusion height of the said 1st lifting pin and the said 2nd lifting pins based on the detection result of each said load detection part. Characterized in that to adjust the How to send and receive boards. delete The method of claim 9, Protruding of the first and second lifting pins while the glass substrate in the mounting position is raised toward the receiving position while the glass substrate is held in a convex shape while maintaining contact with the mounting table. The driving in the direction is stopped once, and the driving is restarted to separate the glass substrate from the mounting table, and then the first and second lifting pins are driven in the immersion direction, with the glass substrate being convex downward. This drive is stopped when it is in contact with the mounting table, and then the first and second lifting pins are driven again in the protruding direction. How to send and receive boards. delete delete delete

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