TWI779702B - Die ejector and die bonding apparatus including the same - Google Patents

Abstract

The invention discloses a wafer ejector and a wafer bonding device comprising the wafer ejector. The wafer ejector includes a hood disposed below the dicing tape, an ejector unit configured to be raised through the hood to separate wafers attached to the dicing tape from the dicing tape, a top of the ejector unit configured to lift. an ejector driving part, and a stopper member disposed below the ejector unit and configured to restrict downward movement of the ejector unit. The ejector unit includes a plurality of ejector members extending in the lifting direction and having a telescopic structure, the ejector members are simultaneously lifted by the ejector driving part, and then from outside to inside by the ejector driving part and the stopper member Decrease in sequence.

Description

Wafer ejector and wafer bonding apparatus including wafer ejector

The present invention relates to a wafer ejector and a wafer bonding device including the wafer ejector. More particularly, the present invention relates to a wafer ejector for separating a wafer from a dicing tape in a wafer bonding process and a wafer bonding apparatus including the wafer ejector.

Generally, semiconductor devices can be formed on silicon wafers used as semiconductor substrates by repeatedly performing a series of manufacturing processes. The semiconductor device formed as above can be individualized by a dicing process and can be bonded to a substrate by a wafer bonding process.

The die bonding apparatus includes a die pickup module for picking up a die from a wafer divided into a plurality of dies by a dicing process, and a die bonding module for bonding the die to a substrate such as a printed circuit board or a lead frame. The wafer pickup module may include a stage unit for supporting a dicing tape to which a wafer is attached, a wafer ejector for separating the wafer from the dicing tape, and a vacuum picker for picking up the wafer from the dicing tape.

The wafer ejector may include a cover having a vacuum hole for vacuum absorbing a lower surface of the dicing tape, and an ejector unit provided in the cover and configured to be movable in a vertical direction through an upper portion of the cover. Specifically, the ejector unit may lift the wafer to separate the wafer on the dicing tape from the dicing tape. For example, Korean Patent No. 10-2009922 discloses a wafer ejector including a plurality of ejector members arranged in a telescopic shape.

Specifically, support members having a plate shape (for example, a disc shape) may be provided at lower end portions of the ejector members, respectively, and elastic members may be provided between the support members. When the ejector member is lifted by the ejector driving part, the ejector member can be sequentially raised from the outside to the inside by the elastic member. However, when the ejector member is sequentially lifted from the outside to the inside, the wafer may be lifted excessively, which may cause damage to the wafer.

Embodiments of the present invention provide a wafer ejector capable of preventing damage to a wafer while separating a wafer from a dicing tape, and a wafer bonding apparatus including the wafer ejector.

According to aspects of the present invention, the wafer ejector may include a hood disposed below the dicing tape; an ejector unit configured to rise through the hood to separate wafers attached to the dicing tape from the dicing tape; an ejector driving portion configured to raise the ejector unit; and a stopper member disposed below the ejector unit and configured to restrict downward movement of the ejector unit. Specifically, the ejector unit may include a plurality of ejector members extending in the raising direction and configured to have a telescopic structure, and the ejector members may be configured to be simultaneously lifted by the ejector driving part , and then lowered sequentially from the outside to the inside by the ejector driving part and the stop member.

According to some embodiments of the present invention, the ejector unit further includes a plurality of flanges, which are respectively arranged on the lower end portion of the ejector member, and arranged along the rising direction of the ejector member; at least one elastic member, which is arranged Between the remaining flanges except the uppermost flange of the flanges; a lifting head disposed below a lowermost flange of the flanges; and a connecting member connecting the uppermost flange and the lifting head. In this case, the ejector drive can be connected to the lifting head.

According to some embodiments of the present invention, the ejector unit may further include at least one second stop member, which restricts at least one remaining flange except the uppermost flange and the lowermost flange from being The elevated height of at least one elastic member.

According to some embodiments of the present invention, the wafer ejector may further include a stop driving part that lifts the stop member to adjust a height of the stop member after the ejector drive part lifts the ejector member.

According to another aspect of the present invention, a wafer ejector may include a hood disposed in contact with the lower surface of the dicing tape; a plurality of ejector members configured to rise through the hood so as to be attached to the dicing tape The wafer on the upper surface of the upper surface is separated from the dicing belt, and has a telescopic structure extending along the rising direction; a plurality of flanges, which are respectively arranged on the lower end portion of the ejector member and arranged along the raising direction of the ejector member; an elastic member disposed between the remaining flanges except the uppermost flange among the flanges; a lifting head disposed under the lowermost flange among the flanges; a plurality of connecting pins passing through the flanges The remaining flanges except the uppermost flange, and connect the uppermost flange and the lifting head; the ejector driving part, which is connected with the lifting head, and is configured to raise the ejector member; the stop member, which is arranged on the bottom of the lowermost flange, and configured to limit the downward movement of the lowermost flange; and a stop drive, after the ejector drive lifts the ejector member, the stop drive raises the stop member to adjust The height of the stop member.

According to some embodiments of the present invention, the cover may have an opening into which the ejector member is inserted, and the ejector member is inserted into the opening such that an upper surface of the ejector member is flush with an upper surface of the cover.

According to some embodiments of the invention, the ejector member may be simultaneously lifted by the ejector drive.

According to some embodiments of the present invention, the elastic member may have an elastic force gradually increasing downward, so that the remaining ejector members except the innermost ejector member among the ejector members are sequentially lowered from outside to inside.

According to some embodiments of the present invention, the ejector driving part may include a first driving shaft connected to the lift head and extending downward; and a first driving unit configured to lift the first driving shaft.

According to some embodiments of the present invention, the stop driving part may include a second drive shaft connected to the stop member and extending downward; and a second drive unit configured to raise the second drive shaft.

According to some embodiments of the invention, the second drive shaft may have a tubular shape surrounding the first drive shaft.

According to some embodiments of the present invention, the ejector driving part may further include a first guide member disposed between the first driving shaft and the second driving shaft and configured to guide the first driving shaft in a lifting direction.

According to some embodiments of the present invention, the wafer ejector may further include an ejector body connected to a lower portion of the cover and having a tubular shape surrounding the second driving shaft.

According to some embodiments of the present invention, the stop driving part may further include a second guide member disposed between the second drive shaft and the ejector main body and configured to guide the second drive shaft in a rising direction.

According to some embodiments of the present invention, the first drive unit may include a first cam member for raising the first drive shaft; a first motor for rotating the first cam member; a first bracket; and a first cam follower mounted on the first bracket and disposed on the first cam member.

According to some embodiments of the present invention, the ejector driving part may further include a third guide member configured to guide the first bracket in a rising direction.

According to some embodiments of the present invention, the second drive unit may include a second cam member for raising the second drive shaft; a second motor for rotating the second cam member; a second bracket; and a second cam follower mounted on the second bracket and disposed on the second cam member.

According to some embodiments of the present invention, the first bracket may include a connection block coupled to a lower portion of the first drive shaft; a pair of extension parts extending downward from the connection block; and a mounting part that connects lower ends of the extension parts to each other. , with the first cam follower mounted thereon. In this case, the second cam member and the second cam follower may be disposed between the extension parts.

According to some embodiments of the present invention, the cover may include a cover main body, which has a circular tube shape and is coupled with the ejector main body; a cover, which is coupled with the upper part of the cover main body and has a lower surface for vacuum suction cutting tape a vacuum hole; and a third stopper member protruding from the inner surface of the cover main body to prevent the flange from being separated from the cover main body.

According to another aspect of the present invention, the wafer bonding apparatus may include a wafer ejector for separating the wafer attached to the dicing tape from the dicing tape; and a wafer bonding module for separating the wafer attached by the wafer ejector. The wafer is bonded to the substrate. In this case, the wafer ejector may include a cover, which is disposed under the dicing tape; an ejector unit configured to rise through the cover to separate the wafer from the dicing tape; an ejector drive section, which configures for raising the ejector unit; and a stop member disposed below the ejector unit and configured to limit downward movement of the ejector unit. Specifically, the ejector unit may include a plurality of ejector members extending in the lifting direction and configured to have a telescopic structure, and the ejector members may be configured to be simultaneously lifted by the ejector driving part and then lifted by the ejector The ejector driving part and the stop member are lowered sequentially from outside to inside.

The above summary of the present invention is not intended to describe each illustrated embodiment or every implementation of the present invention. The Detailed Description and Claims that follow more particularly exemplify these embodiments.

Hereinafter, embodiments of the present invention are described in more detail with reference to the drawings. However, the present invention is not limited to the embodiments described below and may be implemented in various other forms. The following embodiments are not intended to complete the present invention, but to fully convey the scope of the present invention to those skilled in the art.

In the specification, when an element is referred to as being on or connected to another element or layer, it can be directly on or directly connected to another element or layer, or intervening elements may also be present or layers. In contrast, when an element is referred to as being directly on or connected to another element or layer, it is understood that there are no intervening elements present. Also, although terms like first, second, and third are used to describe various regions and layers in various embodiments of the present invention, the regions and layers are not limited to these terms.

The terms used below are only used to describe specific embodiments, and are not used to limit the present invention. Additionally, unless otherwise defined herein, all terms including technical or scientific terms may have the same meaning as commonly understood by those skilled in the art.

Embodiments of the invention are described with reference to schematic illustrations of idealized embodiments. Accordingly, variations and/or tolerances in manufacturing methods can be expected from the form of the drawings. Accordingly, the embodiments of the present invention have not been described as limited to the specific forms or regions in the drawings and include deviations in form. The regions may be purely schematic and their form may not describe or depict the exact form or structure in any given region and are not intended to limit the scope of the invention.

FIG. 1 is a schematic top view of a wafer bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic front view of the wafer pickup module shown in FIG. 1 .

Referring to FIGS. 1 and 2 , according to an embodiment of the present invention, a wafer 22 individualized through a dicing process may be bonded to a substrate 30 such as a printed circuit board or a lead frame using a wafer bonding apparatus 10 .

The wafer bonding apparatus 10 may include a wafer pickup module 300 for picking up the wafer 22 from the wafer 20 divided into wafers 22, and a wafer bonding module 400 for bonding the wafer 22 picked up by the wafer pickup module 300 on the wafer 22. on the substrate 30. For example, the wafer pick module 300 can transfer the picked wafer 22 to the wafer stage 310 , and the die bonding module 400 can pick the wafer 22 on the wafer stage 310 and bond the wafer 22 to the substrate 30 .

Wafer 20 may include a dicing tape 24 to which wafer 22 is attached and a mounting frame 26 having a substantially circular shape, to which dicing tape 24 is mounted. For example, dicing tape 24 may be attached to a lower surface of mounting frame 26 and wafer 22 may be attached to an upper surface of dicing tape 24 .

The wafer pick module 300 may include a wafer stage 320 for supporting the wafer 20 . A support ring 322 for supporting the dicing tape 24 , a jig 324 for holding the mounting frame 26 , and a jig driving unit 326 for moving the jig 324 in a vertical direction may be disposed on the wafer stage 320 . Specifically, as shown in FIG. 2, the support ring 322 can support the dicing tape 24 between the wafer 22 and the mounting frame 26, and the clamp driver 326 can expand the dicing tape 24 by lowering the clamp 324, and the mounting frame 26 is held by the clamp 324. clamping.

A wafer ejector 100 for selectively separating the wafer 22 from the dicing tape 24 may be disposed below the dicing tape 24 supported by the support ring 322 . Wafer ejector 100 can vacuum the lower surface of dicing tape 24, and can include ejector unit 110, and this ejector unit 110 is used to lift wafer 22 to be picked up in wafer 22, thereby makes wafer 22 and dicing tape 24 separation.

The wafer picking module 300 may include a vacuum picker 330 disposed above the wafer stage 320 to pick up the wafer 22 separated from the dicing tape 24 by the wafer ejector 100, and to move the vacuum picker 330 vertically and horizontally. The pickup driver 332 of the device 330. For example, although not shown in the drawing, the vacuum picker 330 may include a chuck having a vacuum hole for vacuum absorbing the wafer 22 . The wafer stage 310 may be arranged to be horizontally spaced apart from the wafer stage 320 , and the wafer 22 picked up by the vacuum picker 330 may be transferred onto the wafer stage 310 by the picker driving part 332 . In addition, a camera unit 340 for detecting a wafer 22 to be picked up among the wafers 22 may be disposed above the wafer stage 320 .

Although not shown in the drawings, the wafer bonding apparatus 10 may include a stage driving part (not shown) for horizontally moving the wafer stage 320 . The stage driving part can adjust the position of the wafer stage 320 so that the wafer 22 to be picked up among the wafers 22 is located on the wafer ejector 100 .

Further, as shown in FIG. 1 , the wafer bonding apparatus 10 may include a cassette load port (cassette load port) 42 on which a cassette 40 containing a plurality of wafers 20 is placed; a wafer transfer unit 44 , which is used to transfer the wafer 20 from the cassette 40 to the wafer stage 320 ; and the wafer guide rail 46 , which is used to guide the transfer of the wafer 20 . Specifically, the stage driver can move the wafer stage 320 to be adjacent to the end of the wafer rail 46, and then the wafer transfer unit 44 can transfer the wafer 20 from the cassette 40 to the wafer stage 320. superior. Although not shown in detail, the wafer transfer unit 44 may include a clamper for clamping the mounting frame 26 and a clamping driving part for horizontally moving the clamper.

The wafer bonding module 400 can pick up the wafer 22 transferred to the wafer stage 310 and bond the wafer 22 to the substrate 30 . For example, the wafer bonding module 400 may include a bonding head 410 for picking up and bonding the wafer 22 , a head driving part 412 for moving the bonding head 410 in vertical and horizontal directions, and a substrate stage 420 for supporting the substrate 30 . Although not shown in the drawing, the bonding head 410 may include a bonding tool (not shown) having a vacuum hole for vacuum suctioning the wafer 22 and pressing the wafer 22 onto the substrate 30 . The substrate stage 420 may include a heater (not shown) for heating the substrate 30 to a predetermined bonding temperature.

The substrate 30 may be supplied from a first magazine 50 and may be accommodated in a second magazine 60 after performing a wafer bonding process. For example, the wafer bonding apparatus 10 may include a first cassette handling unit 52 for processing the first cassette 50 and a second cassette handling unit 62 for processing the second cassette 60 . In addition, the wafer bonding apparatus 10 may include a first cassette loading port 54 on which the first cassette 50 is placed, a second cassette loading port 64 on which the second cassette 60 is placed, The first case transfer unit 56 for transferring the first case 50 between the case loading port 54 and the first case handling unit 52, and the second case loading port 64 and the second case handling unit 62 A second cassette transfer unit 66 that transfers the second cassette 60 .

In addition, the wafer bonding apparatus 10 may include a substrate transfer unit 70 . The substrate transfer unit 70 may transfer the substrate 30 from the first cassette 50 to the substrate stage 420 and transfer the substrate 30 from the substrate stage 420 to the second cassette 60 after performing a wafer bonding procedure. The substrate transfer unit 70 may include a substrate guide rail 72 for guiding the transfer of the substrate 30, a gripper 74 for gripping the substrate 30, a gripper driving part 76 for moving the gripper 74, and a gripper driving part 76 for moving the substrate 30. A first push rod 78 to the substrate rail 72 and a second push rod 80 for moving the substrate 30 into the second cassette 60 .

Fig. 3 is a schematic sectional view of the wafer ejector as shown in Fig. 2, Fig. 4 is a schematic sectional view of the ejector driving part and the stop driving part of the wafer ejector as shown in Fig. 2, and Fig. 5 is A schematic side view of the ejector driving part and the stop driving part as shown in FIG. 4 .

Referring to FIGS. 3 to 5 , the wafer ejector 100 may be disposed below the dicing tape 24 supported by the wafer stage 320 . According to an embodiment of the present invention, the wafer ejector 100 may include a cover 110 disposed in contact with the lower surface of the dicing belt 24, and configured to be lifted through the cover 110 so that the wafer 22 attached to the dicing belt 24 is in contact with the lower surface of the dicing belt 24. The ejector unit 120 cuts the strip 24 apart.

The ejector unit 120 may include a plurality of ejector members 122 extending in a rising direction and configured to have a telescopic structure. For example, the ejector members 122 may each have a rectangular tube shape extending in a vertical direction, and may be arranged in a telescopic structure. The ejector unit 120 may include a first ejector member 122A, a second ejector member 122B, a third ejector member 122C, and a fourth ejector member 122D from outside to inside. The cover 110 may have an opening 112A into which the ejector member 122 is inserted, and a plurality of vacuum holes 112B for vacuum suctioning the lower surface of the cutting tape 24 .

The wafer ejector 100 may include an ejector driving part 140 disposed under the ejector unit 120 and configured to raise the ejector unit 120 in a vertical direction, and an ejector driving part 140 disposed under the ejector unit 120 and configured to limit the ejector unit. The stop member 165 for the downward movement of the ejector unit 120. Specifically, according to the embodiment of the present invention, the ejector member 122 can be lifted by the ejector driving part 140 at the same time, and then lowered sequentially from outside to inside by the ejector driving part 140 and the stopper member 165 .

The ejector unit 120 may include a plurality of flanges 124 respectively arranged on the lower end portion of the ejector member 122 and arranged along the rising direction (ie, the vertical direction) of the ejector member 122 ; The elastic member 126 between the remaining flanges 124B, 124C and 124D other than the flange 124A, the lifting head 128 disposed below the lowermost flange 124D among the flanges 124, and the connection connecting the uppermost flange 124A and the lifting head 128 Member 130. For example, a coil spring may be used as the elastic member 126 and a connecting pin may be used as the connecting member 130 .

The flange 124 may have a disc shape. For example, the ejector unit 120 may include a first flange 124A surrounding the lower portion of the first ejector member 122A, a second flange 124B surrounding the lower portion of the second ejector member 122B, surrounding a third ejector member The lower third flange 124C of 122C surrounds the lower fourth flange 124D of the fourth ejector member 122D. As shown in FIG. 3, four ejector members 122 and four flanges 124 are used, but the number of ejector members 122 and flanges 124 may vary to varying degrees and, therefore, the scope of the present invention will not be limited by the number of ejector members 122 and four flanges 124. The number of ejector members 122 and flanges 124 is limited.

Connecting pins 130 may be used to connect uppermost flange 124A and lift head 128 . The lower portion of the connecting pin 130 can pass through the remaining flanges 124B, 124C, and 124D except the uppermost flange 124A, and can be coupled to the lifting head 128 in a bolt fastening method, and the upper portion of the connecting pin 130 can be tightened by A solid member 132 such as a bolt is mounted to the uppermost flange 124A.

The ejector unit 120 may include a second stop member 134 for limiting the remaining flanges, i.e., except for the uppermost flange 124A and the lowermost flange 124D (ie, the first flange 124A and the fourth flange 124A of the flanges 124). The height of the second flange 124B and the third flange 124C outside the edge 124D) is lifted by the elastic member 126 . For example, bolts can be used as the second stop member 134, and the second stop member 134 can pass through the remaining flanges 124B and 124C except the uppermost flange 124A and the lowermost flange 124D, and can be fastened to the Flanges 124C and 124D below remaining flanges 124B and 124C. That is, the second stopper member 134 may pass through the second flange 124B and the third flange 124C, and may be fastened to the third flange 124C and the fourth flange 124D, as shown in FIG. 3 . Specifically, the second flange 124B and the third flange 124C may have a flat-bottomed counterbore into which the head of the second stopper member 134 is inserted, and the counterbore may be formed to be larger than the head portion of the second stopper member 134. The height is deeper so that the head of the second stopper member 134 does not protrude upward even when the flanges 124 are in close contact with each other.

The ejector driving part 140 may be disposed under the ejector unit 120 and may be connected with a lower portion of the lifting head 128 . For example, the lifting head 128 may have a disk shape, and the lowermost flange 124D may be provided on the lifting head 128 . The ejector drive 140 may lift the lift head 128 and the lowermost flange 124D may be lifted by the ejector drive 140 accordingly. In addition, the uppermost flange 124A can be lifted simultaneously with the lowermost flange 124D by the connecting pin 130 , and the second flange 124B and the third flange 124C can be lifted together with the uppermost flange 124A and the lowermost flange 124D by the elastic member 126 . Simultaneously improve. Accordingly, the ejector member 122 connected to the flange 124 may be lifted by the ejector driving part 140 at the same time.

The height of the uppermost flange 124A can be determined by the length of the connecting pin 130 . In addition, the distance between the remaining flanges 124B, 124C, and 124D except the uppermost flange 124A may be continuously maintained by the elastic member 126 and the second stopper member 134 . At this time, the distance between the uppermost flange 124A and the second flange 124B may be the same as the distances between the remaining flanges 124B, 124C, and 124D.

The ejector driving part 140 may include a first driving shaft 144 connected to the lifting head 128 and extending downward, and a first driving unit 150 configured to raise the first driving shaft 144 . For example, a driving head 142 having a disk shape may be coupled to an upper end portion of the first driving shaft 144 , and a lifting head 128 may be coupled to an upper surface of the driving head 142 .

Specifically, an electromagnet 146 configured to surround an upper portion of the first driving shaft 144 may be disposed below the driving head 142 and may provide an electromagnetic force to couple the lifting head 128 to the upper surface of the driving head 142 . As another example, permanent magnets (not shown) may be used to couple lift head 128 to drive head 142 . In this case, permanent magnets may be provided in the drive head 142 .

According to an embodiment of the present invention, the wafer ejector 100 may include a stop drive 170 for raising the stop member 165 to adjust the height of the stop member 165 after the ejector drive 140 lifts the ejector member 122. high.

After the ejector member 122 is simultaneously lifted by the ejector driving part 140, the stopper driving part 170 may lift the stopper member 165 to a predetermined height. Thereafter, the ejector driving part 140 may lower the ejector unit 120 . After the lowermost flange 124D (ie, the fourth flange 124D) is placed on the stop member 165, the uppermost flange 124A (ie, the first flange 124A) can be lowered by the connecting pin 130 and the ejector driving part 140, The second flange 124B and the third flange 124C may then be lowered. In this case, the elastic member 126 may have an elastic force gradually increasing downward.

For example, the first elastic member 126A disposed between the second flange 124B and the third flange 124C may have a smaller diameter than the second elastic member 126B disposed between the third flange 124C and the fourth flange 124D. elastic. Therefore, after the first flange 124A starts to descend, the second flange 124B and the third flange 124C may descend sequentially. Thus, except for the innermost ejector member 122D, the remaining ejector members 122A, 122B, and 122C may descend sequentially from outside to inside. That is, the first ejector member 122A connected to the first flange 124A, the second ejector member 122B connected to the second flange 124B, and the third ejector member 122C connected to the third flange 124C may Lower in order.

The stop member 165 may have a circular tube shape surrounding the lift head 128 and the drive head 142, and the stop drive part 170 may include a second drive shaft 174 connected to the stop member 165 and extending downward, and used to raise the second drive shaft 174. The second driving unit 180 of the second driving shaft 174 . For example, a disc-shaped stopper head 172 may be coupled to an upper end portion of the second drive shaft 174, and the stopper member 165 may be mounted on the stopper head 172 by a plurality of fastening members 176 (eg, a plurality of bolts). surface.

According to an embodiment of the present invention, the second drive shaft 174 may have a circular tube shape surrounding the first drive shaft 144, and the first guide member 148 for guiding the first drive shaft 144 in the lifting direction (ie, the vertical direction) may be provided Between the first drive shaft 144 and the second drive shaft 174 . For example, a first linear ball bushing may be disposed between the first drive shaft 144 and the second drive shaft 174 .

The cover 110 may include a disc-shaped cover 112 in which an opening 112A and a vacuum hole 112B are formed, and a cover main body 114 having a circular tube shape. In this case, the cover 112 may be coupled to an upper portion of the cover main body 114 . Further, the wafer ejector 100 may include an ejector body 200 connected to a lower portion of the cover 110 , ie, a lower portion of the cover body 114 , and having a tubular shape surrounding the second driving shaft 174 . For example, the ejector body 200 may include an intermediate tube 202 and a down tube 204 , and the first drive shaft 144 and the second drive shaft 174 may extend downwardly through the ejector body 200 . In this case, a permanent magnet 206 for coupling between the cover 110 and the ejector body 200 may be installed on the intermediate pipe 202 .

According to an embodiment of the present invention, the second guide member 178 configured to guide the second drive shaft 174 in the lifting direction may be provided between the second drive shaft 174 and the ejector main body 200, for example, at the second drive shaft 174 and down tube 204. For example, a second linear ball bushing may be disposed between the second drive shaft 174 and the ejector body 200 .

The first driving unit 150 may include a first cam member 152 for raising the first driving shaft 144 , a first motor 154 for rotating the first cam member 152 , a first bracket installed at a lower portion of the first driving shaft 144 156 , and a first cam follower 158 mounted to the first bracket 156 and disposed on the first cam member 152 . The second driving unit 180 may include a second cam member 182 for raising the second driving shaft 174 , a second motor 184 for rotating the second cam member 182 , a second bracket installed at a lower portion of the second driving shaft 174 186 , and a second cam follower 188 mounted to the second bracket 186 and disposed on the second cam member 182 . In this case, the first cam follower 158 and the second cam follower 188 may have a roller shape.

The wafer ejector 100 may include a base support 230 on which the ejector main body 200 and the first driving unit 150 and the second driving unit 180 are installed. For example, the base frame 230 may include a horizontal frame 232 on which the ejector body 200 is mounted and a vertical frame 234 on which the first motor 154 and the second motor 184 are mounted.

FIG. 6 is a schematic front view of the first driving unit shown in FIG. 4 , and FIG. 7 is a schematic side view of the first driving unit shown in FIG. 4 . FIG. 8 is a schematic front view of the second driving unit shown in FIG. 4 , and FIG. 9 is a schematic side view of the second driving unit shown in FIG. 4 . FIG. 10 is a schematic rear view of the third guide member shown in FIG. 5 .

6 to 10, the first bracket 156 may include a connection block 156A coupled to the lower portion of the first drive shaft 144, a pair of extensions 156B extending downward from the connection block 156A, and connecting lower ends of the extensions 156B to each other. The mounting portion 156C is connected and to which the first cam follower 158 is mounted. The second bracket 186 may include a connection member 186A having a circular pipe shape and coupled to the lower portion of the second drive shaft 174, a pair of connection rods 186B extending downward from the connection member 186A, and a lower end portion coupled to the connection rod 186B. And the roller block 186C to which the second cam follower 188 is mounted.

The second cam member 182 and the second cam follower 188 may be disposed between the extension portions 156B of the first bracket 156 . Specifically, the second cam follower 188 may be guided by the inner surface of the extension portion 156B of the first bracket 156 in a rising direction (ie, a vertical direction), thereby preventing the second drive shaft 174 from rotating. That is, the extension portion 156B of the first bracket 156 may serve as a guide member for guiding the second drive shaft 174 in the vertical direction, so that the stopper member 165 can be prevented from rotating.

According to an embodiment of the present invention, the wafer ejector 100 may include a third guide member 208 for guiding the first bracket 156 in a rising direction (ie, a vertical direction). For example, as shown in FIGS. 5 and 10 , the third guide member 208 may include a pair of guide rollers 210 mounted on the lower portion of the ejector body 200 (i.e., the lower portion of the lower tube 204 ) so as to be compatible with the first bracket 156 . The side parts are in close contact. Specifically, the guide roller 210 may be in close contact with a side surface of the extension portion 156B of the first bracket 156 , thereby preventing the first bracket 156 from rotating. Therefore, the ejector unit 120 and the first driving shaft 144 can be prevented from rotating.

3 to 5 again, the second elastic member 160 may be disposed between the first guide member 148 and the first bracket 156, so that the first cam follower 158 is in close contact with the first cam member 152, and the third elastic A member 190 may be disposed between the second guide member 178 and the second bracket 186 such that the second cam follower 188 is in close contact with the second cam member 182 . For example, coil springs may be used as the second elastic member 160 and the third elastic member 190 .

The cover 110 may include a third stopper member 116 protruding from an inner surface of the cover body 114 to prevent the flange 124 from being separated from the cover body 114 . For example, a snap ring may be used as the third stop member 116 . A snap ring 116 may be installed on an inner surface of the cover body 114 , and the ejector unit 120 may be disposed above the snap ring 116 . When the cover 110 and the ejector unit 120 are replaced, the third stopper member 116 may be used to simultaneously separate the cover 110 and the ejector unit 120 from the ejector main body 200 and the ejector driving part 140 . At this time, the power supply to the electromagnet 146 may be cut off, and thus, the cover 110 and the ejector unit 120 may be easily separated from the ejector main body 200 and the ejector driving part 140 .

Vacuum pressure for vacuum absorbing the lower surface of the cutting tape 24 may be provided inside the cover 110 and the ejector main body 200 . For example, down tube 204 may be connected to a vacuum source 220 , such as a vacuum pump or vacuum ejector, and may have a second vacuum port 204A for providing vacuum pressure inside shroud 110 and mid tube 202 . In addition, as shown in FIG. 3 , sealing members for preventing vacuum leakage may be provided between the cover 110 and the middle pipe 202, between the middle pipe 202 and the lower pipe 204, between the lower pipe 204 and the second drive shaft 174, And between the stop head 172 and the first drive shaft 144 .

Further, a vacuum pressure for vacuum absorbing the lower surface of the cutting tape 24 may be set inside the innermost ejector member 122D (ie, the fourth ejector member 122D) among the ejector members 122 . For example, the ejector unit 120 may include an extension portion 124E having a round tube and extending downward from the lowermost flange 124D, and the inside of the extension portion 124E may be connected with the inside of the innermost ejector member 122D. The lift head 128 may have a first through hole 128A into which the extension portion 124E is inserted. The first driving shaft 144 may have a circular tube shape, and may be connected to a vacuum source 222 for providing vacuum pressure, such as a vacuum pump or a vacuum ejector, through the connection block 156A of the first bracket 156 , as shown in FIG. 5 . The connecting block 156A of the first bracket 156 may have a third vacuum hole 156D for connecting the vacuum source 222 and the first driving shaft 144 . The driving head 142 may have a second through hole 142A for connecting the first through hole 128A of the lifting head 128 with the first driving shaft 144 . Vacuum pressure can be provided to the innermost ejector member 122D through the connection block 156A of the first bracket 156 , the first drive shaft 144 , the drive head 142 and the lift head 128 .

Specifically, as shown in FIG. 3 , the ejector member 122 may be inserted into the opening 112A such that the upper surface of the ejector member 122 is flush with the upper surface of the cover 110 (ie, the upper surface of the cover 112 ). Thus, the dicing tape 24 can be vacuum-adsorbed to the cover 110 and the ejector member 122 by the vacuum pressure provided by the vacuum holes 112B and the innermost ejector member 122D.

According to an embodiment of the present invention, compressed air for inflating the cutting belt 22 may be supplied into the innermost ejector member 122D. For example, a compressed air source 224 for supplying compressed air, eg, an air tank for storing compressed air, may be connected to the first drive shaft 144 through the connection block 156A of the first bracket 156 , as shown in FIG. 5 . In addition, as shown in FIG. 3 , in order to prevent leakage of compressed air, sealing members may be provided between the lifting head 128 and the driving head 142 , and between the inner surface of the first through hole 128A and the extension portion 124E.

11 to 17 are schematic sectional views illustrating the operation of the wafer ejector shown in FIGS. 3 and 4 .

Referring to FIG. 11 , the ejector member 122 and the flange 144 may be simultaneously lifted by the ejector driving part 140 , and the ejector member 122 may protrude upward from the upper surface of the cover 110 . Although not shown in the drawings, the wafer 22 may be lifted by the ejector member 122 , and thus, the edge portion of the wafer 22 may be separated from the dicing tape 24 . Specifically, the lift height of the ejector member 122 can be fine-tuned to prevent damage to the wafer 22 . For example, the lift height of the ejector member 122 can be adjusted between approximately tens of microns and hundreds of microns, and can be properly adjusted according to the size of the wafer 22 to prevent damage to the wafer 22 .

Referring to FIG. 12 , the stopper member 165 may be lifted by the stopper driving part 170 . For example, the stopper driving part 170 may lift the stopper member 165 such that the stopper member 165 comes into contact with the lower surface of the lowermost flange 124D. However, the height of the stop member 165 may be variously changed, and thus the scope of the present invention will not be limited by the lifting height of the stop member 165 . In addition, the stopper member 165 may be lifted simultaneously with the ejector unit 120 .

Referring to FIG. 13 , the ejector driving part 140 may lower the ejector unit 120 after the stopper member 165 is lifted. Specifically, in a state where the innermost ejector member 122D and the lowermost flange 124D are supported by the stopper member 165, the lift head 128 can be lowered by the ejector driving part 140, and thus, the uppermost flange connected to the lift head 128 124A and outermost ejector member 122A may be lowered by connecting pin 130 . Then, as shown in FIGS. 14 and 15 , the second ejector member 122B connected to the second flange 124B and the third ejector member 122C connected to the third flange 124C may be sequentially lowered. Therefore, the dicing tape 24 can be separated from the wafer 22 in a direction from the edge portion toward the center portion of the wafer 22 .

Referring to FIG. 16 , after the remaining ejector members 122A, 122B, and 122C except the innermost ejector member 122D are lowered, the wafer 22 may be supported by the innermost ejector member 122D. Dicing tape 24 may be separated from wafer 22 by vacuum pressure provided within enclosure 110 and innermost ejector member 122D. Then, as shown in FIG. 17, compressed air may be supplied from the compressed air source 224 to the interior of the innermost ejector member 122D, whereby the cutting belt 24 may be inflated upward by the compressed air. As a result, the wafer 22 can be sufficiently separated from the dicing tape 24 . Wafer 22 may then be picked up by vacuum picker 330 and transferred to wafer stage 310 .

According to an embodiment of the present invention, the ejector members 122 may be lifted simultaneously and then sequentially lowered from outside to inside. Therefore, the height at which the wafer 22 is lifted can be reduced compared to a conventional wafer ejector, and the wafer 22 can be prevented from being damaged by the ejector member 122 when the wafer 22 is picked up. Specifically, the stopper member 165 may limit the descending height of the ejector member 122 after the ejector member 122 and the flange 124 are lifted. That is, the lifting height and lowering height of the ejector member 122 may be varied to varying degrees according to the size of the wafer 22, and thus, the picking up step of various types of wafers 22 may be performed more efficiently.

Although the exemplary embodiments of the present invention have been described with reference to specific embodiments, it is not limited thereto. Accordingly, it will be readily understood by those skilled in the art that various modifications and changes can be made thereto without departing from the spirit and scope of the present invention defined by the appended claims.

10: Wafer bonding device 20: Wafer 22: Wafer 24: Cutting tape 26: Install the frame 30: Substrate 40: Cassette 42: Cassette loading port 44:Wafer transfer unit 46:Wafer rail 50: First Box 52: First box handling unit 54: First box loading port 56: First Box Transfer Unit 60: The second box 62: Second box handling unit 64:Second box loading port 66:Second box transfer unit 70: substrate transfer unit 72: Substrate rail 74: Gripper 76: Gripper drive unit 78: First Putt 80: second putter 100: wafer ejector 110: cover 112: opening 112A: opening 112B: vacuum hole 114: Cover main body 116: the third stop member 120: ejector unit 122: Ejector component 122A: first ejector member 122B: Second ejector member 122C: The third ejector member 122D: The fourth ejector member 124, 124A, 124B, 124C, 124D: Flange 124E: Extension 126: Elastic member 126A: first elastic member 126B: second elastic member 128: lifting head 128A: the first through hole 130: connection pin 132: fastening member 134: second stop member 140: Ejector drive unit 142: drive head 142A: Second through hole 144: The first drive shaft 146: electromagnet 148: first guide member 150: The first drive unit 152: first cam member 154: The first motor 156: The first bracket 156A: Connection block 156B: Extension 156C: Installation part 156D: The third vacuum hole 158: 1st cam follower 160: second elastic member 165: stop member 170: stop drive unit 172: stop head 174: Second drive shaft 176: fastening member 178: second guide member 180: Second drive unit 182: second cam member 184:Second motor 186: second bracket 186A: Connecting member 186B: connecting rod 186C: Roller block 188: Second cam follower 190: the third elastic member 200: ejector body 202: middle pipe 204: down tube 204A: Second vacuum hole 206 : permanent magnet 208: The third guiding member 210: guide roller 220: vacuum source 222: vacuum source 224: compressed air source 230: Base bracket 232: horizontal bracket 234: vertical support 300: Wafer pickup module 310: wafer stand 320: wafer stand 322: support ring 324: fixture 330: vacuum pickup 332:Pickup drive unit 340: camera unit 400: Wafer Bonding Module 410: joint head 412: Head drive unit 420: substrate stand

According to the following description in conjunction with the drawings, the embodiments of the present invention can be understood in more detail, wherein:

1 is a schematic top view of a wafer bonding apparatus according to an embodiment of the present invention;

Fig. 2 is a schematic front view of the wafer pick-up module shown in Fig. 1;

Fig. 3 is a schematic cross-sectional view of the wafer ejector shown in Fig. 2;

Fig. 4 is a schematic cross-sectional view of an ejector driving part and a stop driving part of the wafer ejector shown in Fig. 2;

Fig. 5 is a schematic side view of the ejector driving part and the stop driving part as shown in Fig. 4;

Fig. 6 is a schematic front view of the first drive unit shown in Fig. 4;

Fig. 7 is a schematic side view of the first drive unit shown in Fig. 4;

Fig. 8 is a schematic front view of the second drive unit shown in Fig. 4;

Fig. 9 is a schematic side view of the second drive unit shown in Fig. 4;

Figure 10 is a schematic rear view of the third guide member as shown in Figure 5; and

11 to 17 are schematic sectional views illustrating the operation of the wafer ejector shown in FIGS. 3 and 4 .

While various embodiments are susceptible to various modifications and alternative forms, specific details thereof have been shown in the drawings, by way of example, and will be described in more detail. It should be understood, however, that the intention is not to limit the invention as claimed to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the claims.

100: wafer ejector

110: cover

112: opening

112A: opening

112B: vacuum hole

114: Cover main body

116: the third stop member

120: ejector unit

122: Ejector component

122A: first ejector member

122B: Second ejector member

122C: The third ejector member

122D: The fourth ejector member

124, 124A, 124B, 124C, 124D: Flange

124E: Extension

126: Elastic member

126A: first elastic member

126B: second elastic member

128: lifting head

128A: the first through hole

130: connection pin

132: fastening member

134: second stop member

140: Ejector drive unit

142: drive head

142A: Second through hole

144: The first drive shaft

146: electromagnet

148: first guide member

160: second elastic member

165: stop member

170: stop drive unit

172: stop head

174: Second drive shaft

176: fastening member

178: second guide member

190: the third elastic member

200: ejector body

202: middle pipe

204: down tube

204A: Second vacuum hole

206: permanent magnet

Claims (20)

A wafer ejector, characterized in that it comprises: a shroud disposed below the cutting belt; an ejector unit configured to rise through the hood to separate wafers attached to the dicing tape from the dicing tape; an ejector drive configured to raise the ejector unit; and a stop member disposed below the ejector unit and configured to limit downward movement of the ejector unit, Wherein, the ejector unit includes a plurality of ejector members, the ejector members extend along the raising direction and are configured to have a telescopic structure, and The ejector member is configured to be simultaneously lifted by the ejector driving part, and then sequentially lowered by the ejector driving part and the stopper member from outside to inside. The wafer ejector as described in Claim 1, wherein the ejector unit further comprises: a plurality of flanges, which are respectively provided on the lower end portion of the ejector member and arranged along the rising direction of the ejector member; at least one elastic member disposed between the remaining ones of the flanges except the uppermost flange; a lifting head disposed below a lowermost one of the flanges; and a connecting member connecting the uppermost flange and the lifting head, Wherein, the driving part of the ejector is connected with the lifting head. The wafer ejector as described in Claim 2, wherein the ejector unit further comprises: At least one second stop member that limits the height at which at least one remaining flange of the flanges except the uppermost flange and the lowermost flange is lifted by the at least one elastic member. The wafer ejector as described in Claim 1, further comprising: and a stop driving part that raises the stop member to adjust the height of the stop member after the ejector drive part lifts the ejector member. A wafer ejector, characterized in that it comprises: a shroud configured to contact the lower surface of the cutting tape; a plurality of ejector members configured to be raised through the hood to separate wafers attached to the upper surface of the dicing tape from the dicing tape and having a telescoping structure extending in a direction of elevation; a plurality of flanges, which are respectively provided on the lower end portion of the ejector member and arranged along the rising direction of the ejector member; a plurality of elastic members disposed between the remaining ones of the flanges except for the uppermost flange; a lifting head disposed below a lowermost one of the flanges; a plurality of connecting pins, which pass through the remaining flanges of the flanges except the uppermost flange, and connect the uppermost flange and the lifting head; an ejector drive connected to the lift head and configured to raise the ejector member; a stop member disposed below the lowermost flange and configured to limit downward movement of the lowermost flange; and and a stop driving part that raises the stop member to adjust the height of the stop member after the ejector drive part lifts the ejector member. The wafer ejector as described in claim 5, wherein the cover has an opening into which the ejector member is inserted, and the ejector member is inserted into the opening so that the upper surface of the ejector member is in contact with the upper surface of the cover flush. The wafer ejector according to claim 5, wherein the ejector member is simultaneously lifted by the ejector driving part. The wafer ejector as claimed in claim 7, wherein the elastic member has an elastic force that gradually increases downwards, so that the remaining ejector members in the ejector member except the innermost ejector member are arranged from outside to inside. sequence down. The wafer ejector as described in Claim 5, wherein the ejector drive unit includes: a first drive shaft connected to the lifting head and extending downward; and A first drive unit configured to raise the first drive shaft. The wafer ejector as described in Claim 9, wherein the stop driving part includes: a second drive shaft connected to the stop member and extending downward; and A second drive unit configured to raise the second drive shaft. The wafer ejector as recited in claim 10, wherein the second drive shaft has a tubular shape surrounding the first drive shaft. The wafer ejector as described in claim 11, wherein the ejector driving part further includes: A first guide member is disposed between the first drive shaft and the second drive shaft and is configured to guide the first drive shaft in a raising direction. The wafer ejector as described in Claim 11, further comprising: The ejector body is connected to the lower portion of the cover and has a tubular shape surrounding the second drive shaft. The wafer ejector as described in claim 13, wherein the stop driving part further comprises: A second guide member is disposed between the second drive shaft and the ejector body and is configured to guide the second drive shaft in a lift direction. The wafer ejector as described in claim 13, wherein the first driving unit comprises: a first cam member for raising the first drive shaft; a first motor for rotating the first cam member; a first bracket mounted on the lower portion of the first drive shaft; and A first cam follower mounted on the first bracket and disposed on the first cam member. The wafer ejector as described in claim 15, wherein the ejector driving part further includes: a third guide member configured to guide the first bracket in a rising direction. The wafer ejector according to claim 15, wherein the second drive unit comprises: a second cam member for raising the second drive shaft; a second motor for rotating the second cam member; a second bracket mounted on the lower portion of the second drive shaft; and A second cam follower mounted on the second bracket and disposed on the second cam member. The wafer ejector as described in claim 17, wherein the first bracket comprises: a connection block coupled to a lower portion of the first drive shaft; a pair of extensions extending downwardly from the connection block; and a mounting portion that connects the lower ends of the extension portions to each other and on which the first cam follower is mounted, Wherein the second cam member and the second cam follower are disposed between the extension portions. The wafer ejector according to claim 13, wherein the cover comprises: The cover main body has a circular tube shape and is coupled with the ejector main body; a cover coupled to the upper portion of the cover main body and having a vacuum hole for vacuum absorbing the lower surface of the cutting tape; and A third stopper member protrudes from the inner surface of the cover body to prevent the flange from being separated from the cover body. A wafer ejector, characterized in that it comprises: a wafer ejector for separating a wafer attached to the dicing tape from the dicing tape; and a wafer bonding module for bonding the wafer separated by the wafer ejector onto a substrate, Wherein, the wafer ejector includes: a shroud disposed below the cutting strip; an ejector unit configured to rise through the hood to separate the wafer from the dicing tape; an ejector drive configured to raise the ejector unit; and a stop member disposed below the ejector unit and configured to limit downward movement of the ejector unit, Wherein, the ejector unit comprises a plurality of ejector members extending along the raising direction and configured to have a telescopic structure, and The ejector member is configured to be simultaneously lifted by the ejector driving part, and then sequentially lowered by the ejector driving part and the stopper member from outside to inside.

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