KR102654600B1 - Die ejector and die bonding apparatus having the same - Google Patents

Abstract

A die ejector and die bonding device are disclosed. The die bonding device includes a wafer stage for supporting a wafer that is attached to a dicing tape and includes a plurality of dies, and is disposed below the dicing tape supported on the wafer stage to separate the dice from the dicing tape. It includes a die ejector for selectively separating the die, and a bonding unit for bonding the die separated by the die ejector onto the substrate. The die ejector includes a hood in which vacuum holes are formed to adsorb the lower surface of the dicing tape, is disposed within the hood, and is configured to move in a vertical direction through an upper part of the hood, and is configured to move the die on the dicing tape to the die. It includes an eject member for separating from the thinning tape, and an illumination film made of a phosphorescent material disposed on the upper surface of the hood to provide illumination light upward.

Description

Die ejector and die bonding device comprising the same {DIE EJECTOR AND DIE BONDING APPARATUS HAVING THE SAME}

Embodiments of the present invention relate to a die ejector and a die bonding device including the same. More specifically, it relates to a die ejector that separates dies from a dicing tape in order to bond them to a substrate such as a printed circuit board or lead frame in a semiconductor manufacturing process, and a die bonding device including the same.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and the dies may be bonded to the substrate through a bonding process.

The wafer may be transferred to a die bonding process while attached to a dicing tape, and a device for performing the die bonding process includes a wafer stage for supporting the wafer, and a device for separating the dies from the dicing tape. It may include a die ejector for bonding the dies to a printed circuit board or a lead frame.

The die ejector includes a hood in which vacuum holes are formed to adsorb the lower surface of the dicing tape, is disposed within the hood, and is configured to move in a vertical direction through an upper part of the hood, and is configured to move the die on the dicing tape. It may include an eject member for separating from the dicing tape. In particular, the upper part of the hood may be made of a transparent material, and a lighting unit for providing illumination light upward through the upper part of the transparent hood may be disposed within the hood. The illumination unit may be used to detect a die to be picked up among the dies using a camera unit. As an example, Republic of Korea Patent Publication No. 10-2017-0137332 applied for and published by the present applicant discloses a die ejecting device having a ring-shaped lighting unit.

Meanwhile, when placing the lighting unit within the hood, wiring or a battery may be required to supply power to the lighting unit, and when replacing the hood from the ejector body, connectors for connecting the wiring may be required. there is. As a result, the structure of the die ejector becomes very complicated, manufacturing costs increase, and a problem may occur in which the lighting unit does not operate normally due to defective contact points of the connectors. Additionally, when using a resin-based material such as acrylic or silicone to make the hood transparent, its hardness is relatively low, so it is exposed to surrounding elements during the process of replacing the hood or replacing the eject pins used as the eject member. There is a problem that it is easily damaged by contact.

The purpose of embodiments of the present invention is to provide a die ejector that can provide backlight illumination for die detection without requiring a separate power supply and a die bonding device including the same.

A die ejector according to an aspect of the present invention for achieving the above object includes a hood in which vacuum holes are formed to adsorb the lower surface of the dicing tape, and is disposed within the hood and capable of moving in a vertical direction through the upper part of the hood. It may include an eject member for separating the die on the dicing tape from the dicing tape, and an illumination film made of a phosphorescent material disposed on the upper surface of the hood to provide illumination light upward.

According to some embodiments of the present invention, the hood may include a disk-shaped upper panel on which the vacuum holes are formed, and a hood housing that is coupled to the upper panel and has a cylindrical shape.

According to some embodiments of the present invention, the eject member may include at least one eject pin configured to move in the vertical direction through at least one of the vacuum holes.

A die bonding device according to another aspect of the present invention for achieving the above object includes a wafer stage for supporting a wafer that is attached to a dicing tape and includes a plurality of dies, and the dicing device supported on the wafer stage. It is disposed below the tape and may include a die ejector for selectively separating the dies from the dicing tape, and a bonding unit for bonding the dies separated by the die ejector onto the substrate. At this time, the die ejector includes a hood in which vacuum holes are formed to adsorb the lower surface of the dicing tape, is disposed within the hood, and is configured to move in the vertical direction through the upper part of the hood and removes the die on the dicing tape. It may include an eject member for separating from the dicing tape, and an illumination film made of a phosphorescent material disposed on the upper surface of the hood to provide illumination light upward.

According to some embodiments of the present invention, the die bonding device further includes a camera unit disposed on an upper portion of the wafer stage and detecting a die located on an upper portion of the die ejector among the dies using the illumination light. It can be included.

According to some embodiments of the present invention, the die bonding device may further include a lamp unit for providing light to the lighting film for photoluminescence before the wafer is loaded on the wafer stage.

According to the embodiments of the present invention as described above, the die ejector may be made of a phosphorescent material on the upper surface of the hood and may be provided with an illumination film for providing illumination light upward. Since the lighting film does not require a separate power supply, problems related to power supply in the prior art can be completely solved, and the manufacturing cost of the die ejector can be greatly reduced.

In addition, since there is no need to make the hood out of a transparent material as in the prior art, the hood can be made out of a metal material. Accordingly, compared to the prior art, damage to the hood can be sufficiently prevented, and the lighting film can be periodically filmed. By replacing the hood, the lifespan of the hood can be greatly extended.

1 is a schematic plan view for explaining a die bonding device according to an embodiment of the present invention.
FIG. 2 is a schematic side view illustrating the wafer stage and die ejector shown in FIG. 1.
FIG. 3 is a schematic cross-sectional view for explaining the die ejector shown in FIG. 2.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather are provided to fully convey the scope of the present invention to those skilled in the art.

In embodiments of the present invention, when one element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed between them. It could be. Alternatively, if one element is described as being placed directly on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. won't

Technical terms used in the embodiments of the present invention are merely used for the purpose of describing specific embodiments and are not intended to limit the present invention. Additionally, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning that can be understood by a person skilled in the art. The above terms, as defined in common dictionaries, will be construed to have meanings consistent with their meanings in the context of the relevant art and description of the invention, and unless explicitly defined, ideally or excessively by superficial intuition. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, for example changes in manufacturing methods and/or tolerances, are fully to be expected. Accordingly, the embodiments of the present invention are not intended to be described as limited to the specific shapes of the regions illustrated but are intended to include deviations in the shapes, and the elements depicted in the drawings are entirely schematic and represent their shapes. is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the present invention.

FIG. 1 is a schematic plan view illustrating a die bonding device according to an embodiment of the present invention, and FIG. 2 is a schematic side view illustrating the wafer stage and die ejector shown in FIG. 1.

Referring to FIGS. 1 and 2, the die bonding device 100 according to an embodiment of the present invention is a die ( 20) can be used for bonding. The die bonding device 10 may pick up the dies 20 from the wafer 10 including the individualized dies 20 through a dicing process and bond them to the substrate 30 . The wafer 10 may be provided attached to a dicing tape 12, and the dicing tape 12 may be mounted on a mount frame 14 that has a substantially circular ring shape.

The die bonding device 100 may include a wafer stage 102 for supporting the wafer 10. Specifically, a support ring 104 in the shape of a circular ring may be disposed on the wafer stage 102, and the support ring 104 may support an edge portion of the dicing tape 12. In addition, on the wafer stage 102, the dicing tape 12 can be expanded by lowering the mount frame 14 while the dicing tape 12 is supported by the support ring 104. An expansion ring 106 may be placed.

A die ejector 110 may be disposed below the wafer 10 supported on the wafer stage 102 to selectively separate the dies 20, and the die ejector 110 may separate the dies 20 from each other. Die 20 may be bonded to the substrate 30 by a bonding unit 156 . For example, the die 20 separated from the dicing tape 12 by the die ejector 110 may be picked up by the pickup unit 150 and then transferred onto the die stage 154. there is. Die 20 on the die stage 154 may be picked up by the bonding unit 156 and then bonded onto the substrate 30 by the bonding unit 156 . At this time, the pickup unit 150 may be configured to be movable in horizontal and vertical directions by the first driving unit 152, and the bonding unit 156 can be moved in the horizontal and vertical directions by the second driving unit 158. It can be configured to be movable.

The substrate 30 may be supplied from the first magazine 40 and moved to the bonding area 158 by the first substrate transfer unit 160. Although not shown, a substrate stage (not shown) may be placed in the bonding area 158 to support the substrate 30 and heat it to a preset bonding temperature. The substrate 30 on which the die bonding process has been completed may be stored in the second magazine 42 by the second substrate transfer unit 162.

The die bonding device 100 includes a load port 164 that supports a cassette 50 containing a plurality of wafers 10, and a wafer stage ( 102), and may include a wafer transfer unit 166 for loading on the cassette 50 and guide rails 168 for guiding the wafer 10 between the wafer stage 102.

Although not shown, the wafer stage 102 may be configured to be movable in the horizontal direction by a stage driver (not shown), and the stage driver operates the guide rails for loading and unloading the wafer 10. The wafer stage 102 can be moved to the wafer load/unload area 170 adjacent to the end of 168. Additionally, the stage driver may move the wafer stage 102 to selectively pick up the dies 20. That is, the stage driver may adjust the position of the wafer stage 102 so that the die 20 to be picked up among the dies 20 is located on the upper part of the die ejector 110.

FIG. 3 is a schematic cross-sectional view for explaining the die ejector shown in FIG. 2.

Referring to FIG. 3, the die ejector 110 may be located below the wafer 10 supported on the wafer stage 102, and the die ejector 110 is placed on the wafer stage 102. It can have an opening that For example, the expansion ring 106 may lower the mount frame 14 so that the dicing tape 12 is supported on the support ring 104 and then expanded in the radial direction. At this time, the upper part of the die ejector 110 may be in close contact with the lower surface of the dicing tape 12 supported by the support ring 104.

The die ejector 110 includes a hood 112 having vacuum holes 116 for vacuum suction of the lower surface of the dicing tape 12, and is disposed within the hood 112 and includes the hood 112. It is configured to be movable in the vertical direction through the upper part of and may include an eject member 120 for separating the die 20 on the dicing tape 12 from the dicing tape 12. For example, the hood 112 may have an overall circular cap shape, and may include an upper panel 114 on which the vacuum holes 116 are formed, and a cylindrical hood housing on which the upper panel 114 is mounted ( 118) may be included.

Meanwhile, referring to FIG. 2, the die bonding device 100 includes a camera to detect the die 20 to be picked up among the dies 20, that is, the die 20 located on the upper part of the die ejector 110. It may include unit 180. The camera unit 180 may be placed on the upper part of the wafer stage 102 and may acquire an image of the die 20 to be picked up. At this time, the die ejector 110 may provide backlight illumination necessary for acquiring the image.

According to one embodiment of the present invention, as shown in FIG. 3, an illumination film 122 made of a phosphorescent material may be disposed on the upper surface of the hood 112 to provide illumination light upward. As an example, a photoluminescent polyurethane film containing a photoluminescent pigment may be used as the lighting film 122, and various types of photoluminescent films may be used as the lighting film 122. The lighting film 122 may have relatively low brightness compared to the light emitting diodes used as backlight lighting units in the prior art, but can be closely adhered to the lower surface of the dicing tape 12, thereby forming the die 20. It can sufficiently function as a backlight for detection.

The eject member 120 may include eject pins movable in the vertical direction through some of the vacuum holes 116, and a support member for supporting the eject pins inside the hood 112. (124) can be placed. In particular, the support member 124 may be equipped with a permanent magnet 126 for fixing the eject pins, and in addition, the upper and lower portions of the support member 124 may be configured to raise and lower the support member 124. Stoppers 128 and 130 for restriction may be disposed, respectively. Meanwhile, the number of eject pins can be varied depending on the size of the die 20 to be separated, so the scope of the present invention will not be limited thereby.

The die ejector 110 has a cylindrical body 132 coupled to the lower part of the hood 112, and is coupled to the support member 124 through the body 132 and supports the support member 124. It may include a vertical driving unit 134 for moving in the vertical direction. As an example, the lower part of the hood 112 and the upper part of the main body 132 may be provided with step portions for fitting together, and as shown, the upper part of the main body 132 is the hood ( 112) can be inserted into the lower part.

The vertical driving unit 134 can separate the die 20 from the dicing tape 12 by raising the eject member 120 in the vertical direction. For example, the vertical driving unit 134 includes a head 136 coupled to the support member 124 and extending downward from the head 134 through the lower portion of the main body 132. A drive shaft 138, a roller-shaped cam follower 140 mounted on the lower part of the drive shaft 138, a cam plate 142 disposed below the cam follower 140, and the cam plate 142. ) may include a motor 144 for rotating the machine, etc. The coupling between the head 136 and the support member 124 may be achieved by magnetic force caused by the permanent magnet 126, and the main body 132 is formed through the vacuum holes 116 of the hood 112. It can be connected to a vacuum pump 146 that provides vacuum in order to vacuum adsorb the lower surface of the dicing tape 12.

In the above, a plurality of eject pins are used as the eject member 120, but differently, a column-shaped eject member may be used. In this case, the upper panel 114 may be provided with an opening into which the eject member is inserted. As an example, the eject member may have a chamber with an open top, and within the chamber, vacuum and compressed air are sequentially supplied for vacuum adsorption of the dicing tape 12 and separation of the die 20. can be provided. The column-shaped ejection member as described above is disclosed in detail in Korean Patent Publication No. 10-2017-0137332, applied for and published by the present applicant, so further detailed description thereof will be omitted.

Referring again to FIGS. 1 and 2, the die bonding device 100 provides light to the illumination film 122 for photoluminescence before the wafer 10 is loaded on the wafer stage 102. It may further include a lamp unit 182 for. The lamp unit 182 may be disposed on top of the wafer load/unload area 170, and may be positioned before and/or after the wafer 10 is loaded onto the wafer stage 102. 122) can provide light for photoluminescence. To this end, the die bonding device 100 may further include an ejector driver 172 for moving the die ejector 110 in the horizontal direction. The die ejector 110 may be moved to the wafer load/unload area 170 together with the wafer stage 102 by the ejector driver 172.

According to the embodiments of the present invention as described above, the die ejector 110 is made of a phosphorescent material on the upper surface of the hood 112 and is provided with an illumination film 122 for providing illumination light upward. You can. Since the lighting film 122 does not require a separate power supply, problems caused by power supply in the prior art can be completely solved, and the manufacturing cost of the die ejector 110 can be greatly reduced.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to understand that it exists.

10: wafer 12: dicing tape
14: Mount frame 20: Die
30: Substrate 100: Die bonding device
102: wafer stage 110: die ejector
112: hood 114: upper panel
116: vacuum hole 118: hood housing
120: Eject member 122: Lighting film
132: main body 134: vertical driving unit
150: pickup unit 156: bonding unit
170: wafer load/unload area 180: camera unit
182: lamp unit

Claims (7)

delete delete delete A wafer stage attached to a dicing tape and supporting a wafer including a plurality of dies;
a die ejector disposed below the dicing tape supported on the wafer stage and configured to selectively separate the dies from the dicing tape;
a pickup unit for picking up the die separated from the dicing tape and transferring it onto the die stage;
a stage driver for moving the wafer stage between an area where pickup of the die is performed by the pickup unit and a wafer load/unload area where loading and unloading of the wafer is performed with respect to the wafer stage;
an ejector driver for moving the die ejector between an area where pickup for the die is performed and the wafer load/unload area; and
A bonding unit for picking up the die transferred onto the die stage and bonding it to the substrate,
The die ejector is,
A hood with vacuum holes for adsorbing the lower surface of the dicing tape,
an eject member disposed within the hood and configured to be movable in a vertical direction through an upper portion of the hood and configured to separate the die on the dicing tape from the dicing tape;
an illumination film disposed on the upper surface of the hood and made of a phosphorescent material to provide illumination light upward;
a lamp unit for providing light to the illumination film for photoluminescence before the wafer is loaded on the wafer stage,
A die bonding device, characterized in that the lamp unit is disposed on an upper part of the wafer load/unload area. The die bonding device of claim 4, further comprising a camera unit disposed on an upper portion of the wafer stage and configured to detect a die located on an upper portion of the die ejector among the dies using the illumination light. delete delete

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