KR100639553B1 - Die pickup device - Google Patents

Abstract

Even if the die pushing-up member is used, the die can be reliably picked up without damaging the die.

In the suction stage 10, a die pushing member 22 for die peeling, which pushes the die from the die pushing member 21 for pickup up to the die transfer side, is provided to be movable up and down, and the die pushing member 22 is provided. ), The die end on the conveying direction side of the die 1A to be picked up is positioned above the die pushing-up member 22, and then the die pushing-up member 22 is raised to raise the die 1A. The die end on the conveying direction side is peeled off from the wafer sheet 2, and the die pushing-up member 22 then moves the die 1A to the pickup center 5 while the die pushing-up member 22 is raised, thereby collet 4 and the die pushing-up member. It picks up by 21.

Die Pickup Device, Suction Stage, Die Pusher, Wafer Sheet, Pickup Center, Collet

Description

Die Pickup Device {DIE PICKUP DEVICE}

1 is a front sectional view showing a first embodiment of the die pick-up apparatus of the present invention.

FIG. 2 is a plan view of the adsorption stage of FIG. 1.

3 is a front sectional view showing a second embodiment of the die pick-up apparatus of the present invention.

4 is a front sectional view showing a third embodiment of the die pick-up apparatus of the present invention.

5 is a front sectional view showing a fourth embodiment of the die pick-up apparatus of the present invention.

6 is a front sectional view showing a fifth embodiment of the die pick-up apparatus of the present invention.

7 is a front sectional view showing the sixth embodiment of the die pick-up apparatus of the present invention.

8 is a front sectional view showing a seventh embodiment of the die pick-up apparatus of the present invention.

9 is a front sectional view showing an eighth embodiment of the die pick-up apparatus of the present invention.

[Description of the code]

1A, 1B, 1C... Die 2 wafer sheet

3 suction hole 4 collet

5 Pickup Centers 10 Suction Stages

11, 12, 13, 14, 15, 16 suction hole

21, 22, 23, 24, 25, 26 Die Push Up Member

30 holder

The present invention relates to a die pick-up apparatus for peeling off and picking up a die attached to a wafer sheet from a wafer sheet by collet.

As the pick-up apparatus of the die attached to the wafer sheet, the pushing member system shown in Patent Document 1 is generally performed. However, this apparatus has a problem that the die breaks when the thickness of the die is thin, about 100 mu m or less.

As this improvement, patent document 2 is mentioned as a method of picking up a die from a wafer sheet, without using a pushing member. The apparatus moves the adsorption stage on a horizontal plane while sucking the wafer sheet (adhesive sheet) to which the die is attached to the adsorption stage while holding the die with the collet, and then the collet picks up the die from the wafer sheet. do.

[Patent Document 1] Japanese Unexamined Patent Publication No. 3-229441

[Patent Document 2] Japanese Patent Application Laid-Open No. 2001-118862 (Patent No. 3209736)

Patent document 1 has the problem of damaging the die, but has an advantage that hardly a pickup miss of the die occurs. Patent Document 2 does not cause damage to the die. However, since the adhered wafer sheet and the die are held by vacuum adsorption of the adsorption stage and the collet, respectively, and both are removed by horizontally moving the adsorption stage, it is necessary to increase the suction force, which has a problem of adversely affecting the die.

An object of the present invention is to provide a die pick-up apparatus which can reliably pick up a die without damaging the die even using a die pushing member.

Claim 1 of this invention for solving the said subject, The adsorption stage which adsorb | sucks and hold | maintains the wafer sheet with die | dye, The die pushing-up member for pick-up which is arrange | positioned in this adsorption stage, and pushes up a die, and this pickup In the die pick-up apparatus provided with the collet which adsorbs, hold | maintains, and conveys the die | dye pushed up by the die pushing-up member,

In the said adsorption stage, the die pushing-up member for die peeling which pushes a die | die to the die conveying side from the said die pushing-up member for pick-up is provided so that up-and-down movement is possible, and the die pushing-up member for die peeling is lowered. After placing the die end on the conveying direction side of the die picked up above the die pushing up member for die peeling, the die pushing up member for die peeling is raised to bring the die end on the feeding direction side of the die Is removed from the wafer sheet, and then the die pushing-up member for peeling the die is transferred while the die is raised, and the die is partially or entirely peeled off and then picked up.

Claim 2 of this invention for solving the said subject is an adsorption stage which adsorbs and hold | maintains the wafer sheet with die | dye, the die pushing-up member for pick-up which is arrange | positioned in this adsorption stage, and pushes up a die, and this pick-up In the die pick-up apparatus provided with the collet which adsorbs, hold | maintains, and conveys the die | dye pushed up by the die pushing-up member,

In the said adsorption stage, the die pushing-up member for die peeling which pushes a die | die to the die conveying side from the said die pushing-up member for pick-up is provided so that up-and-down movement is possible, and the die pushing-up member for die peeling is lowered. After placing the die end on the conveying direction side of the die to be picked up above the die pushing member for die peeling, the die pushing member for die peeling is raised to raise the die end on the feeding direction side of the die. It peels off from the said wafer sheet, and after that, the die | dye pushing-up member for die peeling is lowered, a die is conveyed, the die is peeled off partially or fully, and it picks up, It is characterized by the above-mentioned.

Claim 3 of the present invention for solving the above problems is a suction stage for suction holding and holding a wafer sheet with a die, and a die pushing member for pick-up, which is disposed at a pickup center in the suction stage and pushes the die up; In the die pick-up apparatus provided with the collet which adsorbs, hold | maintains, and conveys the die | dye pushed up by the die pushing-up member for pick-ups,

A suction hole is formed in the upper surface of the suction stage from the die pushing up member for pick-up to the die transfer side, and the die end on the transfer direction side of the die picked up while the die pushing up member for pick-up is lowered. After positioning the die pushing-up member for pick-up, the die pushing-up member for pick-up is lifted, the die end on the conveying direction side of the die is peeled off the wafer sheet, and the die pushing-up member for pick-up is raised. After moving a die over this pick-up die pushing-up member, the die is transferred to a pick-up center for pickup.

Claim 4 of the present invention for solving the above problems, the suction stage for suction holding and holding the wafer sheet with a die, the die pushing member for pickup which is disposed in the pickup center in the suction stage and pushes the die, In the die pick-up apparatus provided with the collet which suction-holds and conveys the die | dye pushed up by the die pushing-up member for pick-up,

A suction hole is formed in the upper surface of the suction stage from the die pushing up member for pick-up to the die transfer side, and the die end on the transfer direction side of the die picked up while the die pushing up member for pick-up is lowered. After positioning above the die pushing-up member for pick-up, the die pushing-up member for pick-up is raised, the die end on the conveying direction side of the die is peeled off the wafer sheet, and the die pushing-up member for pick-up is lowered. At the same time, the die end on the conveying direction side of the die is positioned above the suction hole, and the die is transferred to a pickup center for pickup.

Claim 5 of this invention for solving the said subject is the adsorption stage which adsorb | sucks and hold | maintains the wafer sheet with die | dye, the die pushing-up member for pick-up which is arrange | positioned at the pick-up center in this adsorption stage, and pushes up a die, In the die pick-up apparatus provided with the collet which suction-holds and conveys the die | dye pushed up by the die pushing-up member for pick-up,

A suction hole is formed in the upper surface of the suction stage from the die pushing-up member for pickup to the die transfer side, and the die end on the transfer direction side of the die to be picked up is located above the suction hole, and then the suction stage is vacuumed. The die end is removed from the wafer sheet by suction, and then the die is transferred to a pickup center for pickup.

(The best mode for carrying out the invention)

A first embodiment of the die pick-up apparatus of the present invention will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, the outer circumference of the wafer sheet 2 with the dies 1A, 1B, 1C... Is fixed to a paper ring (not shown). The wafer ring is fixed to a wafer support frame (not shown) which is driven in the XY axis direction in the planar direction. The dies 1A, 1B, 1C ... are vacuum-adsorbed and picked up by the collet 4 in which the suction holes 3 are formed. Below the pick-up center 5, the adsorption stage 10 which vacuum-adsorbs the wafer sheet 2 is arrange | positioned. The above is a well-known technique.

The die pushing-up member 21 for pick-up is provided in the pick-up center 5 part in the suction stage 10 so that up-and-down movement is possible, and the die pushing-up for die peeling is attached to both sides of this die pushing-up member 21. The members 22 and 23 are provided so that up-and-down movement is possible, and these die pushing members 21, 22, and 23 are formed in flat form, and are respectively driven up and down by the vertical drive means not shown independently. . As shown in FIG. 2, the die pushing-up members 21, 22, and 23 are so that the length of the direction orthogonal to the wafer sheet conveyance direction A may become inner rather than the edge part of die 1A, 1B, 1C. That is, it is formed slightly shorter than the length of the edge | side of die 1A, 1B, 1C. In the suction stage 10, suction holes 11, 12, 13 which serve as through holes of the die pushing members 21, 22, 23 and suction holes of the wafer sheet 2 are formed.

Next, the die pickup method will be described. As shown in Fig. 1 (a), the vacuum of the suction stage 10 is turned on so that the die end on the conveying direction side of the die 1A to pick up is located above the die pushing member 22, The wafer ring (not shown) to which the wafer sheet 2 is fixed is moved. Next, as shown to FIG. 1 (b), the die pushing-up member 22 is raised and the die edge part of the conveying direction side of die 1A is pushed up through the wafer sheet 2. As a result, the die end on the conveying direction side of the die 1A is peeled off from the wafer sheet 2.

Next, as shown in FIG. 1C, the die pushing member 22 is moved to move the wafer sheet 2 so that the die 1A is positioned at the pickup center 5. When the die 1A passes above the die pushing member 22, the die 1A is transferred over the ridge pushed up by the die pushing member 22, so that the adhesive force between the wafer sheet 2 and the die 1A is transferred. This degrades. Next, as shown in Fig. 1 (d), the die pushing member 22 is lowered and separated from the wafer sheet 2, and the collet 4 is lowered to the position where the die 1A is adsorbed. Subsequently, as shown in FIG. 1E, the die pushing member 21 rises to push up the die 1A, and the collet 4 sucks the die 1A in vacuum. In this case, since the adhesive force of the wafer sheet 2 and the die 1A is falling, the die 1A is not damaged and is easily peeled off from the wafer sheet 2 by the rise of the die pushing-up member 21.

The collet 4 picked up by vacuum suction of the die 1A is moved up and XY-axis direction by the conveying means which is not shown in figure, and performs the following process, for example, die bonding, die filling, etc. When the die 1A is picked up, as shown in Fig. 1 (f), the die pushing-up member 21 is lowered, and the die end on the conveying direction side of the die 1B to be picked up is as described above. The wafer sheet 2 is moved to be located above the die pushing member 22 as well.

Thus, since the adhesive force of the die 1A and the wafer sheet 2 conveyed to the pick-up center 5 is reduced, even if the thin die 1A is pushed up by the die pushing member 21, this die 1A Is not broken.

In addition, in the said embodiment, the die pushing member 23 does not work at all. This is because the case where the die was transferred from the left side to the pickup center 5 was described. When the die is transferred from the right side to the pickup center 5, the die pushing member 23 acts in the same manner as the die pushing member 22 described above, and the die pushing member 22 does not work at all. .

The second embodiment of the die pick-up apparatus of the present invention will be described with reference to FIG. This embodiment is a modification of the first embodiment, and replaces the process of Fig. 1 (c) (d) with Fig. 3 (a) (b). Since others are the same as the process of FIG. 1, another process is demonstrated.

After the process of FIG. 1 (a), as shown to FIG. 1 (b), the die edge part of the conveying direction side of die 1A is pushed up with the die pushing-up member 22, and the conveying direction of die 1A is shown. After peeling the die end of the side from the wafer sheet 2, as shown to Fig.3 (a), the die pushing-up member 22 descends. Thereafter, as shown in FIG. 3B, the wafer sheet 2 is moved so that the die 1A is located at the pickup center 5. As described above, since the die end on the conveying direction side of the die 1A is peeled off from the wafer sheet 2, when the die 1A is moved as shown in Fig. 3 (a) and Fig. 3 (b), the suction hole is moved. The die 1A is peeled off the wafer sheet 2 by the vacuum suction force of (12), and the adhesive force between the wafer sheet 2 and the die 1A is lowered. Then, the process of FIG.1 (e) (f) is performed.

As in the present embodiment, similarly to the above embodiment, since the adhesive force between the die 1A and the wafer sheet 2 transferred to the pickup center 5 is reduced, the die-up member 21 is used to transfer the thin die 1A. Even if it pushes up, this die 1A will not be damaged.

A third embodiment of the die pick-up apparatus of the present invention will be described with reference to FIG. Hereinafter, the same code | symbol is attached | subjected to the member equivalent or equivalent to FIGS. 1-3, and the detailed description is abbreviate | omitted. In this embodiment, the pick-up center 5 has the die pushing member 21, and there are only the suction holes 12 and 13 on both sides of the suction hole 11 of this die pushing member 21, and suction The die pushing members 22 and 23 are not disposed in the holes 12 and 13.

Next, the die pickup method will be described. As shown in Fig. 4A, the vacuum of the suction stage 10 is turned on so that the die end on the conveying direction side of the die 1A to be picked up is located above the die pushing member 21, The wafer sheet 2 is moved. Next, as shown in FIG.4 (b), the die pushing-up member 21 is raised and the die edge part of the conveying direction side of the die 1A is pushed up through the wafer sheet 2. As a result, the die end on the conveying direction side of the die 1A is peeled off from the wafer sheet 2.

Next, as shown in FIG.4 (c), while the die pushing-up member 21 is raised, the wafer sheet 2 is moved so that the die 1A may ride over the die pushing-up member 21. FIG. When the die 1A passes above the die pushing member 21, the die 1A is transferred over the ridge pushed up by the die pushing member 21, so that the adhesive force between the wafer sheet 2 and the die 1A is transferred. Is lowered. Thereafter, as shown in FIG. 4D, after the die pushing member 21 is lowered, the wafer sheet 2 is moved so that the die 1A is positioned at the pickup center 5. Subsequently, as shown in FIG. 4E, the die pushing member 21 is raised to push up the die 1A, and the collet 4 sucks the die 1A in vacuum. In this case, since the adhesive force of the wafer sheet 2 and the die 1A is falling, the die 1A is not damaged and is easily peeled off from the wafer sheet 2 by the rise of the die pushing-up member 21.

The collet 4 picked up by vacuum suction of the die 1A is moved up and XY-axis direction by the conveying means which is not shown in figure, and performs the following process, for example, die bonding, die filling, etc. When the die 1A is picked up, as shown in Fig. 4 (f), the die pushing-up member 21 is lowered, and the die end on the conveying direction side of the die 1B to be picked up is as described above. The wafer sheet 2 is moved to be located above the die pushing member 21 (see FIG. 4 (a)).

Thus, since the adhesive force of the die 1A and the wafer sheet 2 conveyed to the pick-up center 5 is falling, even if the thin die 1A is pushed up by the die pushing member 21, this die 1A Is not broken.

The 4th Embodiment of the die pick-up apparatus of this invention is described with reference to FIG. This embodiment is a modification of the third embodiment and changes the process of Fig. 4 (c) (d) to Fig. 5 (a) (b). Since others are the same as the process of FIG. 4, another process is demonstrated.

After the process of FIG. 4A, as shown to FIG. 4B, the die edge part of the conveying direction side of die 1A is pushed up with the die pushing-up member 21, and the conveying direction of die 1A is shown. After peeling the die end of the side from the wafer sheet 2, as shown in Fig. 5A, the die pushing-up member 21 is lowered, and the die 1A is transferred in the conveying direction and the die ( The whole or part of 1A) is peeled off from the wafer sheet 2 by the negative pressure of the suction hole 11. Thereafter, as shown in FIG. 5B, the wafer sheet 2 is moved so that the die 1A is located at the pickup center 5 in the direction opposite to the conveying direction A. FIG. As described above, since the die end on the conveying direction side of the die 1A is peeled off from the wafer sheet 2, when the die 1A is moved as shown in Fig. 5 (a) to Fig. 5 (b), the suction hole is moved. The die 1A is peeled off the wafer sheet 2 by the vacuum suction force of (12), and the adhesive force between the wafer sheet 2 and the die 1A is lowered. Thereafter, the process of Fig. 4E (f) is performed.

In the present embodiment, as in the respective embodiments described above, since the adhesive force between the die 1A and the wafer sheet 2 transferred to the pick-up center 5 is reduced, the die-up member 21 is a thin die 1A. This die 1A is not damaged even if the die is pushed up.

The fifth embodiment of the die pick-up apparatus of the present invention will be described with reference to FIG. In the present embodiment, as in the third and fourth embodiments, the pick-up center 5 has a die pushing member 21, and on both sides of the suction holes 11 of the die pushing member 21, There are only suction holes 12 and 13, and the die pushing members 22 and 23 are not disposed in the suction holes 12 and 13. However, the action of the die pushing member 21 is different from the third and fourth embodiments.

Next, the die pickup method will be described. As shown in FIG. 6A, the wafer sheet 2 is moved so that the die end on the conveying direction side of the die 1A to be picked up is located above the suction hole 12, and the suction stage 10 is moved. Turn on the vacuum. As a result, as shown in FIG. 6B, the wafer sheet 2 at the end of the die on the conveying direction side of the die 1A is pulled downward by vacuum suction of the suction stage 10, and the die 1A is pulled down. Die end on the conveying direction side of the sheet) is peeled off from the wafer sheet 2.

Next, as shown in FIG. 6C, the wafer sheet 2 is moved so that the die 1A is located at the pickup center 5. As described above, since the die end on the conveying direction side of the die 1A is peeled off the wafer sheet 2, when the die 1A is moved as shown in Fig. 6 (b) and Fig. 6 (c), the suction hole is moved. The die 1A is peeled off the wafer sheet 2 by the vacuum suction force of (12), and the adhesive force between the wafer sheet 2 and the die 1A is lowered. Thereafter, the process of Fig. 6D (e) is performed. Since this process is the same as the process of FIG.4 (e) (f), the description is abbreviate | omitted.

In the present embodiment, as in the respective embodiments described above, since the adhesive force between the die 1A and the wafer sheet 2 transferred to the pick-up center 5 is reduced, the die-up member 21 is a thin die 1A. This die 1A is not damaged even if the die is pushed up.

In each said embodiment, the die pushing-up member 21 for pickup was one. 7, 8, and 9 show a case where the three die pushing members 24, 25, and 26 for pickup are used. 7 shows an example applied to the first embodiment of FIG. 1, FIG. 8 shows an example applied to the third embodiment of FIG. 4, and FIG. 9 shows an example applied to the fifth embodiment of FIG. 6. The die pushing members 24, 25 and 26 are fixed to the holder 30 which is driven up and down by a vertical drive means not shown, and the center die pushing member 24 is the die pushing member 25 of both sides. (H) (about 100-150 micrometers) is formed higher than (26). At the suction stage 10, suction holes 14, 15, 16 are formed corresponding to the die pushing members 24, 25, 26. Since the other structure is the same as that of the said applied figure, the same code | symbol is attached | subjected to the same or equivalent member, and the detailed description is abbreviate | omitted.

The sixth embodiment of the die pick-up apparatus of the present invention will be described with reference to FIG. This embodiment is applied to the first embodiment of FIG. 1, and since the operation is almost the same as that in FIG. 1, detailed description of the same operation is omitted. That is, FIG.7 (a) (b) (c) (d) respond | corresponds to FIG.1 (a) (b) (c) (d), and only the die pushing-up member 22 moves up and down, and die ( 1A is conveyed as demonstrated in FIG. 1, and the adhesive force of the wafer sheet 2 and the die 1A is falling in the state of FIG. 7 (d).

Next, as shown in Fig. 7E, the holder 30 is raised to push the die 1A up to the die pushing members 24, 25, and 26, and the collet 4 lifts the die 1A. Adsorption in vacuum. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is lowered, the die 1A is not damaged by the rise of the die pushing members 24, 25, and 26 as in the case of FIG. It is easily peeled off from the wafer sheet 2. Moreover, in this embodiment, since the die 1A is pushed up by the three die pushing members 24, 25, and 26, an unreasonable force is not applied to the die 1A, and the center die pushing member 24 is carried out. Even if the die 1A pushed up by) is inclined, it is supported by one die pushing member 25 or 26 and adsorbed to the collet 4 by vacuum suction by the suction hole 3 of the collet 4. maintain.

Subsequently, as shown in FIG. 7 (f), the die pushing members 24, 25, and 26 are lowered by the lowering of the holder 30, and the collet 4 which sucks and holds the die 1A is As in the case of Fig. 1, the wafer sheet 2 is disposed so that the die end on the conveying direction side of the die 1B to be picked up next is positioned above the die pushing member 22 as described above. ) Is moved.

A seventh embodiment of the die pick-up apparatus of the present invention will be described with reference to FIG. This embodiment is applied to the third embodiment of FIG. 4. As shown in Fig. 8 (a), the end of the die on the conveying direction side of the die 1A to be picked up with the vacuum of the suction stage 10 turned on is located above the center die pushing member 24. The wafer sheet 2 is moved so as to. Next, as shown in FIG. 8 (b), when the holder 30 is raised, the die pushing member 24 pushes up the die end on the conveying direction side of the die 1A through the wafer sheet 2. . As a result, the die end on the conveying direction side of the die 1A is peeled off from the wafer sheet 2.

Next, as shown in Fig. 8C, the holder 30, i.e., the die pushing member 24, is raised and the wafer sheet 2 is moved so that the die 1A rides over the die pushing member 24. Move it. When the die 1A passes above the die pushing member 24, the die 1A is transferred over the ridge pushed up by the die pushing member 24, so that the adhesive force between the wafer sheet 2 and the die 1A is transferred. Is lowered. Thereafter, as shown in FIG. 8D, after the holder 30 is lowered, the wafer sheet 2 is moved so that the die 1A is positioned at the pickup center 5. Subsequently, as shown in FIG. 8E, the holder 30 is raised to push the die 1A up to the die pushing members 24, 25, and 26, and the collet 4 lifts the die 1A. Adsorption in vacuum. In this case, since the adhesive force of the wafer sheet 2 and the die 1A falls, as in the case of FIG. 4, the die 1A is not damaged due to the rise of the die pushing members 24, 25, and 26. It is easily peeled off from the wafer sheet 2. Moreover, in this embodiment, since the die 1A is pushed up by the three die pushing members 24, 25, and 26, an unreasonable force is not applied to the die 1A, and the center die pushing member 24 is carried out. Even if the die 1A pushed up by) is tilted, it is supported by one die pushing member 25 or 26 and adsorbed to the collet 4 by vacuum suction by the suction hole 3 of the collet 4. maintain.

Subsequently, as shown in FIG. 8 (f), the die pushing members 24, 25, and 26 are lowered by the lowering of the holder 30, and the collet 4 which sucks and holds the die 1A is As in the case of Fig. 1, the wafer sheet 2 is disposed so that the die end on the conveying direction side of the die 1B to be picked up next is positioned above the die pushing member 22 as described above. ) Is moved.

An eighth embodiment of the die pick-up apparatus of the present invention will be described with reference to FIG. This embodiment is applied to the fifth embodiment of FIG. 6, and since the operation is almost the same as that in FIG. 6, detailed description of the same operation is omitted. That is, Fig. 9 (a) (b) (c) corresponds to Fig. 6 (a) (b) (c), and in the state of Fig. 9 (c), the wafer sheet 2 and the die 1A Adhesive force is falling. Next, as shown in Fig. 9 (d), the holder 30 is raised to push the die 1A up to the die pushing members 24, 25, and 26, and the collet 4 lifts the die 1A. Adsorption in vacuum. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is lowered, as in the case of FIG. 6, the die 1A is not damaged by the rise of the die pushing members 24, 25, and 26. It is easily peeled off from the wafer sheet 2. Moreover, in this embodiment, since the die 1A is pushed up with the three die pushing members 24, 25, and 26, an excessive force is not applied to the die 1A, and the center die pushing member ( Even if the die 1A pushed up by 24 is inclined, it is supported by one die pushing member 25 or 26 and is brought to the collet 4 by vacuum suction by the suction hole 3 of the collet 4. Adsorption is maintained.

Subsequently, as shown in FIG. 9E, the die pushing members 24, 25, and 26 are lowered by the lowering of the holder 30, and the collet 4 which sucks and holds the die 1A is The wafer sheet 2 is moved so that the same operation as in the prior art is carried out and the die end on the conveying direction side of the die 1B to be picked up next is located above the suction hole 12 as in the case of FIG. 6.

In the first and sixth embodiments shown in FIG. 1 and FIG. 7, as shown in FIGS. 1B and 7C, 7B and 7C, the die pushing member 22 is used. When the whole surface of the die 1A is peeled off in the state of raising the), the die 1A may peel off from the wafer sheet 2. In order to prevent this, the die pushing-up member 22 is lowered before the rear end of the die 1A is peeled off from the wafer sheet 2. This also applies to the third embodiment shown in FIG. 4. That is, as shown in Fig. 4 (b), before the die 1A is completely peeled off by moving the wafer sheet 2, i.e., the die 1A, while the die pushing-up member 21 is raised. The die pushing member 21 is lowered.

Moreover, as shown to FIG. 1 (b) and FIG. 7 (b), after pushing up the die edge part of the conveying direction side of the die 1A with the die pushing-up member 22, the movement of the wafer sheet 2 is performed. When it stops 100-200 msec, peeling of the die 1A from the wafer sheet 2 will improve.

1 (b) and 7 (b), when the die end of the die 1A in the feed direction side is pushed up by the die pushing-up member 22, the die pushing-up member 22 The larger the protrusion amount from the upper surface of the suction stage 10 is, the die end on the side of the die 1A in the conveying direction tends to be peeled off. For example, the protrusion amount is 250 μm. However, if the wafer sheet 2, that is, the die 1A is moved at such a large amount of protrusion, there is a risk of damaging the die 1A. In order to avoid this, the die pushing-up member 22 may be slightly lowered after Figs. 1 (b) and 7 (b). For example, the amount of protrusion from the upper surface of the suction stage 10 is 100 μm. This also applies to the case of FIG. That is, as shown in FIG.4 (b), the protrusion amount from the upper surface of the adsorption stage 10 of the die pushing member 21 is made large, and the die pushing member 21 is then slightly lowered.

In addition, the die pushing members 24, 25, and 26 for pick-up in the embodiment of FIG. 7 and FIG. 9 push up the die 1A whose adhesive force is already reduced with respect to the wafer sheet 2, and collet. Since only the function to adsorb | suck to (4), the die pushing members 24, 25, and 26 may all be the same height. However, in the case of the embodiment of FIG. 8, since the center die pushing member 24 acts to lower the adhesive force with respect to the wafer sheet 2, in the case of the present embodiment, the die pushing member 24 is used. ) Needs to be formed at least higher than the die pushing member 25.

In addition, in the embodiment of FIGS. 7-9, although the three die pushing members 24, 25, 26 for pickup were demonstrated, two or four or more die pushing members for pickup may be sufficient. . In addition, although not shown, embodiment of FIG. 7 is applicable also to embodiment of FIG. 3, Needless to say, embodiment of FIG. 8 is also applicable to embodiment of FIG.

Since the adhesive force of the die and the wafer sheet transferred to the pick-up center is lowered, even if the thin die is pushed up by the die pushing-up member, the die is not damaged.

Claims (7)

An adsorption stage for adsorbing and holding a wafer sheet with a die adsorbed, a die pushing member for pick-up disposed in the suction stage and pushing up the die, and a die pushed up by the die pushing-up member for pick-up In the die pick-up device provided with a collet for conveying In the said adsorption stage, the die pushing-up member for die peeling which pushes a die | die to the die conveying side from the said die pushing-up member for pick-up is provided so that up-and-down movement is possible, and the die pushing-up member for die peeling is lowered. After placing the die end on the conveying direction side of the die to be picked up above the die pushing member for die peeling, the die pushing member for die peeling is raised to raise the die end on the feeding direction side of the die. The die pick-up apparatus which peels from the said wafer sheet, and after that, the die pushing-up member for peeling off dies is conveyed, raises a die partially or fully peels off, and then picks up. An adsorption stage for adsorbing and holding a wafer sheet with a die adsorbed, a die pushing member for pick-up disposed in the suction stage and pushing up the die, and a die pushed up by the die pushing-up member for pick-up In the die pick-up device provided with a collet for conveying In the said adsorption stage, the die pushing-up member for die peeling which pushes a die | die to the die conveying side from the said die pushing-up member for pick-up is provided so that up-and-down movement is possible, and the die pushing-up member for die peeling is lowered. After placing the die end on the conveying direction side of the die to be picked up above the die pushing member for die peeling, the die pushing member for die peeling is raised to raise the die end on the feeding direction side of the die. The die pick-up apparatus which peels from the said wafer sheet, and after that, die | dye is conveyed after lowering the die pushing-up member for die peeling, and it picks up after peeling a die partially or fully. An adsorption stage for adsorbing and holding a wafer sheet having a die attached thereto, a die pushing member for pickup picking up the die and pushing up the die, and a die pushed up by the die pushing member for pickup; In the die pick-up apparatus provided with the collet which adsorbs, hold | maintains, and conveys, A suction hole is formed in the upper surface of the suction stage from the die pushing up member for pick-up to the die transfer side, and the die end on the transfer direction side of the die picked up while the die pushing up member for pick-up is lowered. After positioning the die pushing-up member for pick-up, the die pushing-up member for pick-up is lifted, the die end on the conveying direction side of the die is peeled off the wafer sheet, and the die pushing-up member for pick-up is raised. And moving the die over the die pushing-up member for pick-up, and then transferring the die to the pick-up center to pick up the die. An adsorption stage for adsorbing and holding a wafer sheet having a die attached thereto, a die pushing member for pickup picking up the die and pushing up the die, and a die pushed up by the die pushing member for pickup; In the die pick-up apparatus provided with the collet which adsorbs, hold | maintains, and conveys, A suction hole is formed in the upper surface of the suction stage from the die pushing up member for pick-up to the die transfer side, and the die end on the transfer direction side of the die picked up while the die pushing up member for pick-up is lowered. After positioning the die pushing-up member for picking up, the die pushing-up member for picking up is lifted, the die end on the conveying direction side of the die is peeled off the wafer sheet, and the die pushing-up member for picking up is lowered. At the same time, the die pick-up apparatus which transfers the die to a pick-up center, after positioning the die edge part of the die | dye conveyance side above the said suction hole, is picked up. An adsorption stage for adsorbing and holding a wafer sheet having a die attached thereto, a die pushing member for pickup picking up the die and pushing up the die, and a die pushed up by the die pushing member for pickup; In the die pick-up apparatus provided with the collet which adsorbs, hold | maintains, and conveys, A suction hole is formed in the upper surface of the suction stage from the die pushing-up member for pickup to the die transfer side, and the die end on the transfer direction side of the die to be picked up is located above the suction hole, and then the suction stage is vacuumed. A die pick-up apparatus, wherein the die end on the conveying direction side of the die is removed from the wafer sheet by suction, and then the die is transferred to a pickup center for pickup. The die pick-up device according to any one of claims 1 to 5, wherein the pick-up of the die pushing-up member is made of a plurality of pieces. The said die pushing member for pickup is comprised of three or more, The center die pushing member is formed higher than the die pushing member of both sides, The thing of any one of Claims 1-5. The die pick-up apparatus characterized by the above-mentioned.

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