KR101684803B1 - Vacuum table for vacuum-adsorbing semiconductor packages - Google Patents

Vacuum table for vacuum-adsorbing semiconductor packages Download PDF

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Publication number
KR101684803B1
KR101684803B1 KR1020150142591A KR20150142591A KR101684803B1 KR 101684803 B1 KR101684803 B1 KR 101684803B1 KR 1020150142591 A KR1020150142591 A KR 1020150142591A KR 20150142591 A KR20150142591 A KR 20150142591A KR 101684803 B1 KR101684803 B1 KR 101684803B1
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South Korea
Prior art keywords
vacuum
holes
semiconductor packages
plate
eject
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KR1020150142591A
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Korean (ko)
Inventor
신금수
이용현
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세메스 주식회사
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Priority to KR1020150142591A priority Critical patent/KR101684803B1/en
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Publication of KR101684803B1 publication Critical patent/KR101684803B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The vacuum table includes a vacuum adsorption unit for vacuum adsorption of semiconductor packages. Wherein the vacuum adsorption unit comprises: a vacuum pad formed with first vacuum holes; a vacuum pad disposed on the vacuum panel and having second vacuum holes communicating with the first vacuum holes for vacuum adsorption of the semiconductor packages; Eject pins inserted into the first vacuum holes and the second vacuum holes, and an eject plate on which the eject pins are mounted. The vacuum table further includes a driving unit for moving the eject plate such that the eject pins protrude from the vacuum pad to separate the semiconductor packages on the vacuum pad from the vacuum pad.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum table for vacuum-adsorbing semiconductor packages,

Embodiments of the invention relate to a vacuum table for vacuum adsorption of semiconductor packages. More particularly, the present invention relates to a vacuum table for vacuum adsorption of semiconductor packages in a cutting and sorting process of semiconductor packages.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be manufactured by a dicing process, a die bonding process, and a molding process, Packages. ≪ / RTI >

The semiconductor strip fabricated as described above may be individually classified into a plurality of semiconductor packages through a sawing and sorting process, and classified according to good or defective product judgment. For example, the semiconductor strip may be loaded onto a chuck table and then individualized into a plurality of semiconductor packages using cutting blades, which may be cleaned and dried and then inspected by a vision module . Also, it can be classified as good and defective according to the inspection result by the vision module.

For example, the semiconductor packages can be transferred to good and defective trays, respectively, via a buffer table for performing drying and inspection processes, an inversion table for reversing the semiconductor packages, and a pallet table for sorting .

The tables may include a vacuum panel having vacuum holes for vacuum-adsorbing the semiconductor packages. A vacuum pad made of a flexible material such as synthetic rubber, silicone resin or the like may be disposed on the vacuum panel in order to stably vacuum adsorb the semiconductor packages. The vacuum panel may be coupled to a body providing a vacuum chamber in communication with the vacuum holes, and the body may be connected to a vacuum pump.

It is an object of the present invention to provide an improved vacuum table which can easily cope with various kinds of semiconductor packages and can save time and cost for maintenance.

According to an aspect of the present invention, a vacuum table may include a vacuum adsorption unit for vacuum-adsorbing semiconductor packages. Wherein the vacuum adsorption unit comprises: a vacuum pad formed with first vacuum holes; a vacuum pad disposed on the vacuum panel and having second vacuum holes communicating with the first vacuum holes for vacuum adsorption of the semiconductor packages; Eject pins inserted into the first vacuum holes and the second vacuum holes, and an eject plate on which the eject pins are mounted. The vacuum table may include a driving unit for moving the eject plate so that the eject pins protrude from the vacuum pad to separate the semiconductor packages on the vacuum pad from the vacuum pad.

According to embodiments of the present invention, the vacuum adsorption unit may further include elastic members disposed between the vacuum panel and the eject plate.

According to embodiments of the present invention, the vacuum adsorption unit may further include guide pins extending through edge portions of the eject plate.

According to the embodiments of the present invention, the vacuum table may further include a second vacuum adsorption unit disposed on one side of the vacuum adsorption unit and having the same configuration as the vacuum adsorption unit, And the second eject plate of the second ejection plate can be moved by the driving unit.

According to embodiments of the present invention, the second vacuum panel and the second vacuum pad of the second vacuum adsorption unit may be respectively attached to one side of the vacuum panel and the vacuum pad.

According to embodiments of the present invention, the vacuum table may further include a base plate having an opening covered by the vacuum adsorption unit.

According to embodiments of the present invention, the base plate has a recess into which the vacuum panel is inserted, the opening is formed through a bottom surface of the recess, and the eject pins and the eject plate are moved through the opening .

According to embodiments of the present invention, the vacuum table may further include a main body that is coupled to the base plate and provides a vacuum chamber communicating with the first vacuum holes.

According to embodiments of the present invention, the vacuum table may further include at least one vacuum unit disposed in the vacuum chamber and for providing vacuum pressure inside the vacuum chamber.

According to embodiments of the present invention, the vacuum unit is connected to a compressed air source and has a hollow pipe shape to provide a flow path of air provided from the compressed air source in the vacuum chamber, And at least one opening connecting between the vacuum chamber and the flow path of the air to provide the vacuum pressure within the vacuum chamber.

According to embodiments of the present invention, the body may be connected to a vacuum pump for providing vacuum pressure inside the vacuum chamber.

According to embodiments of the present invention, at least one vacuum pipe connected to the vacuum pump is disposed in the vacuum chamber, and the vacuum pipe includes a plurality of third vacuum Holes.

According to embodiments of the present invention, the driving unit may include a push plate for moving the eject plate, a pneumatic cylinder connected to the push plate, and a mount plate on which the pneumatic cylinder is mounted.

According to embodiments of the present invention, the eject plate may be provided with a plurality of through holes.

According to embodiments of the present invention, a plurality of second vacuum holes may correspond to each of the semiconductor packages.

According to another aspect of the present invention, there is provided a vacuum table comprising: a plurality of vacuum adsorption units continuously arranged to vacuum-adsorb semiconductor packages individualized by a cutting process; And a base plate having an opening that is substantially perpendicular to the base plate. At this time, each of the vacuum adsorption units includes a vacuum panel formed with first vacuum holes, and second vacuum holes arranged on the vacuum panel and communicating with the first vacuum holes for vacuum adsorption of the semiconductor packages A vacuum pad, eject pins inserted into the first vacuum holes and the second vacuum holes, an eject plate on which the eject pins are mounted, and elastic members disposed between the vacuum panel and the eject plate. have.

According to embodiments of the present invention, each of the vacuum adsorption units may further include guide pins extending through edge portions of the eject plate.

According to embodiments of the present invention, in order to separate the semiconductor packages on the vacuum pads of the vacuum adsorption units from the vacuum pads, the ejection plates of the vacuum adsorption units are moved so that the eject pins protrude from the vacuum pads And a driving unit for driving the driving unit.

According to embodiments of the present invention as described above, the vacuum table for vacuum-adsorbing semiconductor packages may include a vacuum adsorption unit. Wherein the vacuum adsorption unit comprises: a vacuum pad having a first vacuum hole formed therein; a vacuum pad disposed on the vacuum panel and having second vacuum holes communicating with the first vacuum holes for vacuum adsorption of the semiconductor packages; 1 eject holes inserted in the first vacuum holes and the second vacuum holes, and an eject plate on which the eject pins are mounted.

In particular, a plurality of vacuum adsorption units arranged in series can be used for vacuum adsorption of the semiconductor packages, and the vacuum adsorption units can be mounted on the base plate by a plurality of fastening members. Therefore, when damage is generated to the vacuum pad or the eject pins, only the vacuum suction unit can be selectively replaced, thereby greatly reducing the time and cost required for maintenance and repair of the vacuum table.

Further, by using a plurality of second vacuum holes for vacuum-absorbing one semiconductor package, there is no need to replace the vacuum panel and the vacuum pad even when the sizes of the semiconductor packages are changed, It is possible to respond easily.

FIG. 1 is a schematic view illustrating a vacuum table for vacuum-adhering semiconductor packages according to an embodiment of the present invention. Referring to FIG.
Fig. 2 is a schematic perspective view for explaining the vacuum table shown in Fig. 1. Fig.
3 is a schematic perspective view for explaining the vacuum adsorption unit shown in Fig.
4 is a schematic enlarged cross-sectional view for explaining the vacuum adsorption unit shown in Fig.
FIG. 5 is a schematic enlarged cross-sectional view for explaining a state in which semiconductor packages of different sizes are supported on the vacuum pad shown in FIG. 2. FIG.
6 is a schematic diagram illustrating a vacuum table for vacuum-adhering semiconductor packages according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic view illustrating a vacuum table for vacuum-adhering semiconductor packages according to an embodiment of the present invention. Referring to FIG.

Referring to FIG. 1, a vacuum table 100 according to an embodiment of the present invention may be used to support individual semiconductor packages 10 through a cutting and sorting process. Particularly, after the semiconductor packages 10 are loaded on the vacuum table 100, the semiconductor packages 10 can be vacuum-adsorbed on the vacuum table 100 by vacuum pressure. The vacuum table 100 according to an embodiment of the present invention can be used as a drying and inspection table, an inversion table, a pallet table, and the like in the cutting and sorting process. Alternatively, the vacuum table 100 may be used as a picker for picking up the semiconductor packages 10.

According to an embodiment of the present invention, the vacuum table 100 may include a vacuum adsorption unit 102 for vacuum-adsorbing the semiconductor packages 10. In particular, a plurality of vacuum adsorption units 102 may be used to vacuum adsorb the semiconductor packages 10. [

Fig. 2 is a schematic perspective view for explaining the vacuum table shown in Fig. 1, Fig. 3 is a schematic perspective view for explaining the vacuum absorption unit shown in Fig. 2, and Fig. 4 is a cross- And Fig.

1 to 4, the vacuum adsorption units 102 include a vacuum panel 110 having first vacuum holes 112 formed thereon and a plurality of semiconductor packages 10 A vacuum pad 120 having second vacuum holes 122 communicating with the first vacuum holes 112 for vacuum suction of the first vacuum holes 112 and the second vacuum holes 112, Ejection pins 130 inserted into the ejection opening 122 and an ejection plate 132 on which the ejection pins 130 are mounted.

The vacuum panel 110 may include a recess 114 extending from one side to the other and the vacuum pad 120 may be inserted into the recess 114. The first vacuum holes 112 may be formed through the bottom surface of the recess 114 and the second vacuum holes 122 may be connected to the first vacuum holes 112. The vacuum pad 120 may be made of a flexible material such as synthetic rubber or silicone resin to stably vacuum adsorb the semiconductor packages 10.

The vacuum table 100 may include a base plate 140 on which the vacuum adsorption units 102 are mounted. The base plate 140 may have an opening 144 that is covered by the vacuum adsorption units 102 and the vacuum adsorption units 102 may include a plurality of fastening members 146, And may be coupled to the base plate 140 by a plurality of bolts.

According to an embodiment of the present invention, the base plate 140 may have a recess 142 into which the vacuum panel 110 is inserted, and the opening 144 is formed in the bottom surface of the recess 142 As shown in FIG. In particular, the vacuum adsorption units 102 may be disposed continuously within the recess 142. Specifically, as illustrated, the vacuum panels 110 of the vacuum adsorption units 102 and the side surfaces of the vacuum pads 120 may be in close contact with each other.

The eject pins 130 may be formed on the vacuum table 100 when the semiconductor packages 10 are picked up or when the semiconductor packages 10 vacuum-adsorbed on the vacuum table 100 are placed on another table May be used to separate the semiconductor packages (10) from the vacuum pads (120).

The vacuum table 100 may be configured to allow the eject pins 130 to protrude from the vacuum pads 120 to separate the semiconductor packages 10 on the vacuum pads 120 from the vacuum pads 120. [ And a driving unit 160 for moving the ejection plates 132. The driving unit 160 may be disposed below the opening 144 of the base plate 140. The ejection pins 130 and the ejection plate 132 may be coupled to the opening 144 by the driving unit 160, Lt; / RTI >

The driving unit 160 includes a push plate 162 disposed on a lower surface of the eject plates 132 on the rear surface of the eject plates 132 and connected to the push plate 162 And a mount plate 166 on which the pneumatic cylinder 164 is mounted. The eject plates 132, the push plate 162, and the mount plate 166 may be disposed in parallel with the base plate 140.

Each of the vacuum adsorption units 102 may include a plurality of elastic members 134 disposed between the vacuum panel 110 and the eject plate 132, for example, a plurality of coil springs. The elastic members 134 may be used to return the eject plates 132 to an initial position. That is, the elastic members 134 are disposed on the first and second vacuum holes 112 and 122, respectively, after the semiconductor packages 10 are separated from the vacuum pads 120, It can be used to move it inward.

Each of the vacuum adsorption units 102 may include guide pins 136 extending through edge portions of the eject plate 132. The guide pins 136 may be used to guide the movement of the ejection plates 132 by the driving unit 160. The guide pins 136 may be mounted on the vacuum panel 110 in a screwing manner and may include a head 138 for preventing the ejection plate 132 from being separated from the guide pins 136, Respectively.

According to an embodiment of the present invention, the vacuum table 100 includes a main body 150 coupled to the base plate 140 and providing a vacuum chamber 152 communicating with the first vacuum holes 112 . In one example, the base plate 140 may have a generally rectangular plate shape, and the body 150 may have a rectangular box shape with an open top. The open top of the main body 150 may be covered by the base plate 140 and the internal space of the main body 150 may function as the vacuum chamber 152.

According to an embodiment of the present invention, at least one vacuum unit 170 may be disposed in the vacuum chamber 152 to provide a vacuum within the vacuum chamber 152. At this time, the driving unit 160 may be disposed between the base plate 140 and the vacuum unit 170.

For example, the vacuum unit 170 may provide a path for the flow of compressed air within the interior space of the body 150, i.e., within the vacuum chamber 152. In particular, as shown, the vacuum unit 170 may have a generally elongated pipe shape and may have openings 172 that communicate with the vacuum chamber 152. The vacuum unit 170 may be connected to a compressed air source 174 that provides compressed air and the compressed air may flow at a high rate along the vacuum unit 170. One side of the vacuum unit 170 may be connected to the compressed air source 174 and the compressed air may be discharged to the outside of the main body 150 through the other side of the vacuum unit 170.

The internal pressure of the vacuum unit 170 may be lower than the internal space pressure of the main body 150 by the flow of the compressed air so that air in the internal space of the main body 150 through the openings 172 Can be sucked into the vacuum unit 170. As a result, the vacuum unit 170 can provide vacuum pressure to the internal space of the body 150, so that the semiconductor packages 10 can be vacuum adsorbed onto the vacuum pads 120 have.

The compressed air source 174 may include an air pump and an air tank for receiving the compressed air. As another example, an air fan may be used as the compressed air source 174.

When the driving unit 160 is disposed between the base plate 140 and the vacuum unit 170 as described above, the push plate 162 and the mount plate 166 are provided with a guide groove Openings for pneumatic delivery may be provided. The ejection plates 132 may be provided with a plurality of through holes 139 to uniformly provide the vacuum pressure to the first and second vacuum holes 112 and 122. That is, the ejection plates 132 may function as baffle plates for uniformly providing vacuum pressure to the first and second vacuum holes 112 and 122.

According to one embodiment of the present invention, as shown in FIG. 4, a plurality of second vacuum holes 122 may be used to vacuum-adsorb one semiconductor package 10. It is possible to vacuum-adsorb one semiconductor package 10 using a plurality of second vacuum holes 122 which are relatively small in size as compared with the conventional technology in which one vacuum hole is used for one semiconductor package 10 The vacuum table 100 can be used without being replaced even when the sizes of the semiconductor packages 10 are changed.

FIG. 5 is a schematic enlarged cross-sectional view for explaining a state in which semiconductor packages of different sizes are supported on the vacuum pad shown in FIG. 2. FIG.

Referring to FIGS. 4 and 5, when semiconductor packages 10A different in size are supported on the vacuum pad 120 as compared with the semiconductor packages 10 shown in FIG. 4, A part of the second vacuum holes 122 may be positioned between the semiconductor packages 10A. However, since the inner diameters of the second vacuum holes 122 are relatively small, It does not greatly affect the vacuum adsorption of the adsorbent 10A.

A plurality of recesses 124 may be formed on one surface of the vacuum pad 120 on which the semiconductor packages 10 are supported. The second vacuum holes 122 may be connected to the recesses 124 so that micro vacuum chambers may be formed between the semiconductor packages 10 and the recesses 124. The recesses 124 may be used to increase the area to which vacuum pressure is applied to the semiconductor packages 10.

6 is a schematic diagram illustrating a vacuum table for vacuum-adhering semiconductor packages according to another embodiment of the present invention.

Referring to FIG. 6, the main body 150 may be connected to a vacuum pump 180 for providing vacuum pressure inside the vacuum chamber 152. In this case, at least one vacuum pipe 182 connected to the vacuum pump 180 may be disposed in the vacuum chamber 150. In the vacuum chamber 152, A plurality of third vacuum holes 184 for providing air pressure may be provided.

According to the embodiments of the present invention as described above, the vacuum table 100 for vacuum-adsorbing the semiconductor packages 10 may include a vacuum adsorption unit 102. The vacuum adsorption unit 102 includes a vacuum panel 110 in which first vacuum holes 112 are formed and a second vacuum hole 110 formed on the vacuum panel 110 for vacuum- A vacuum pad 120 having second vacuum holes 122 communicating with the holes 112 and eject pins 130 inserted into the first vacuum holes 112 and the second vacuum holes 122 And an eject plate 132 on which the eject pins 130 are mounted.

In particular, a plurality of vacuum adsorption units 102 disposed in series can be used for vacuum adsorption of the semiconductor packages 10, and the vacuum adsorption units 102 are connected to the plurality of fastening members 146 To the base plate 140, as shown in Fig. Therefore, when damage is generated to the vacuum pad 120 or the eject pins 130, only the vacuum adsorption unit 102 can be selectively replaced, and accordingly, the time required for the maintenance and repair of the vacuum table 100 and / The cost can be greatly reduced.

Further, by using a plurality of second vacuum holes 122 for vacuum-absorbing one semiconductor package 10, even when the sizes of the semiconductor packages 10 are changed, Since it is not necessary to replace the vacuum pad 120, it is possible to easily cope with various semiconductor packages 10 and 10A.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

10: Semiconductor package 100: Vacuum table
102: Vacuum suction unit 110: Vacuum panel
112: first vacuum hole 114: recess
120: vacuum panel 122: second vacuum hole
124: recess 130: eject pin
132: eject plate 134: elastic member
136: guide pin 138: head
139: through hole 140: base plate
142: recess 144: opening
146: fastening member 150:
152: vacuum chamber 160:
162: push plate 164: pneumatic cylinder
166: Mount plate 170: Vacuum unit
172: opening 174: compressed air source
180: Vacuum pump 182: Vacuum pipe
184: Third vacuum hole

Claims (18)

A vacuum panel disposed continuously for vacuum adsorption of the semiconductor packages individualized by the cutting process, the vacuum panel being provided with first vacuum holes, and a second vacuum hole disposed on the vacuum panel and communicating with the first vacuum holes for vacuum- An ejection plate to which the ejection pins are mounted, and an ejection plate to be disposed between the vacuum panel and the ejection plate, wherein the ejection pins are inserted into the first vacuum holes and the second vacuum holes. A plurality of vacuum adsorption units, each of which includes elastic members;
A base plate having an opening covered by the vacuum adsorption units; And
And a driving unit for moving the ejection plates of the vacuum suction units so that the eject pins of the vacuum suction units protrude from the vacuum pads in order to separate the semiconductor packages on the vacuum pads of the vacuum suction units from the vacuum pads A vacuum table for vacuum adsorption of semiconductor packages. delete The vacuum table according to claim 1, wherein each of the vacuum adsorption units further comprises guide pins extending through edge portions of the eject plate. delete delete delete The vacuum cleaner according to claim 1, wherein the base plate has a recess into which vacuum panels of the vacuum suction units are inserted, the opening is formed through a bottom surface of the recess, Wherein the semiconductor package is moved through the opening. The vacuum table as claimed in claim 1, further comprising a main body coupled to the base plate and providing a vacuum chamber communicating with the first vacuum holes. 9. The vacuum table of claim 8, further comprising at least one vacuum unit disposed within the vacuum chamber and for providing vacuum pressure within the vacuum chamber. 10. The vacuum cleaner according to claim 9, wherein the vacuum unit is connected to a compressed air source and has a hollow pipe shape to provide a flow path of air provided from the compressed air source in the vacuum chamber, And at least one opening connecting the flow path of the air and the vacuum chamber to provide pneumatic pressure. 9. The vacuum table according to claim 8, wherein the body is connected to a vacuum pump for providing vacuum pressure inside the vacuum chamber. The vacuum pump according to claim 11, wherein at least one vacuum pipe connected to the vacuum pump is disposed in the vacuum chamber, and the vacuum pipe has a plurality of third vacuum holes for providing the vacuum pressure inside the vacuum chamber And a vacuum table for vacuum adsorbing the semiconductor packages. The driving apparatus according to claim 1,
A push plate for moving the eject plates of the vacuum adsorption units;
A pneumatic cylinder connected to the push plate; And
And a mount plate on which the pneumatic cylinder is mounted. The vacuum table according to claim 1, wherein a plurality of through holes are formed in the ejection plates of the vacuum absorption units. The vacuum table according to claim 1, wherein a plurality of second vacuum holes are associated with each of the semiconductor packages. delete delete delete
KR1020150142591A 2015-10-13 2015-10-13 Vacuum table for vacuum-adsorbing semiconductor packages KR101684803B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190047895A (en) 2017-10-30 2019-05-09 세메스 주식회사 Vacuum table for vacuum-adsorbing semiconductor packages
KR102056186B1 (en) 2018-06-20 2019-12-16 제너셈(주) Pickup apparatus of semiconductor package
KR102138003B1 (en) * 2019-09-09 2020-07-27 제너셈(주) Conversion kit auto change system
KR20210112731A (en) 2020-03-06 2021-09-15 세메스 주식회사 Vacuum table for vacuum-adsorbing semiconductor packages

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050087746A (en) * 2005-08-08 2005-08-31 인사이드테크윈(주) Grinding table for edge lcd panel
KR20060047924A (en) * 2004-05-17 2006-05-18 가부시키가이샤 신가와 Die pickup device
KR20130081170A (en) * 2012-01-06 2013-07-16 한미반도체 주식회사 Chip holding device and pickup system having the same
KR20150106162A (en) * 2014-03-11 2015-09-21 세메스 주식회사 Table assembly for supporting semiconductor packages

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060047924A (en) * 2004-05-17 2006-05-18 가부시키가이샤 신가와 Die pickup device
KR20050087746A (en) * 2005-08-08 2005-08-31 인사이드테크윈(주) Grinding table for edge lcd panel
KR20130081170A (en) * 2012-01-06 2013-07-16 한미반도체 주식회사 Chip holding device and pickup system having the same
KR20150106162A (en) * 2014-03-11 2015-09-21 세메스 주식회사 Table assembly for supporting semiconductor packages

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190047895A (en) 2017-10-30 2019-05-09 세메스 주식회사 Vacuum table for vacuum-adsorbing semiconductor packages
KR102056186B1 (en) 2018-06-20 2019-12-16 제너셈(주) Pickup apparatus of semiconductor package
KR102138003B1 (en) * 2019-09-09 2020-07-27 제너셈(주) Conversion kit auto change system
KR20210112731A (en) 2020-03-06 2021-09-15 세메스 주식회사 Vacuum table for vacuum-adsorbing semiconductor packages

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