KR20170048041A - Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same - Google Patents

Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same Download PDF

Info

Publication number
KR20170048041A
KR20170048041A KR1020150148908A KR20150148908A KR20170048041A KR 20170048041 A KR20170048041 A KR 20170048041A KR 1020150148908 A KR1020150148908 A KR 1020150148908A KR 20150148908 A KR20150148908 A KR 20150148908A KR 20170048041 A KR20170048041 A KR 20170048041A
Authority
KR
South Korea
Prior art keywords
vacuum
holes
semiconductor packages
grooves
panel
Prior art date
Application number
KR1020150148908A
Other languages
Korean (ko)
Inventor
이호성
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020150148908A priority Critical patent/KR20170048041A/en
Publication of KR20170048041A publication Critical patent/KR20170048041A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A vacuum table for vacuum adsorption of semiconductor packages is disclosed. The vacuum table includes a vacuum panel, a vacuum pad, and a plurality of ball valves. The vacuum panel has a plurality of vacuum holes and a plurality of first vacuum holes communicating with the vacuum holes. A vacuum pad is disposed on the vacuum panel and a plurality of second vacuum holes are formed for vacuum adsorption of the semiconductor packages. The second vacuum holes may communicate with the vacuum holes and may be disposed to face the first vacuum holes with the vacuum holes therebetween. The ball valves are accommodated in the vacuum grooves and open and close the outlet portion of the vacuum groove into which the air flows into the first vacuum hole by the vacuum pressure according to the presence or absence of the semiconductor package corresponding to the second vacuum hole. Accordingly, the vacuum table can prevent air leakage through the second vacuum hole disposed between the semiconductor packages, so that the semiconductor packages can be stably vacuum-adsorbed and easily correspond to various semiconductor packages.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum table for vacuum-adsorbing semiconductor packages, and a semiconductor package transfer module including the vacuum table.

Embodiments of the invention relate to a vacuum table for vacuum adsorption of semiconductor packages. And more particularly, to a vacuum table for vacuum-attracting semiconductor packages in a cutting and sorting process of semiconductor packages and a semiconductor package transfer module having the same.

Generally, semiconductor devices can be formed by repeatedly performing a series of manufacturing processes on a silicon wafer used as a semiconductor substrate, and the semiconductor devices formed through such processes can be formed by a dicing process, a die bonding process, And may be manufactured as a semiconductor strip composed of semiconductor packages.

The semiconductor strips are individualized into a plurality of semiconductor packages through a sawing & sorting process and sorted according to good or defective determination. For example, semiconductor strips are loaded onto a chuck table and then individualized into multiple semiconductor packages using cutting blades. Such individualized semiconductor packages can be cleaned and dried and then inspected by the vision module. The individualized semiconductor packages may be classified as good and defective according to the inspection result by the vision module.

For example, the semiconductor packages can be transferred to the good and defective trays via the buffer table for performing the drying process and the inspection process, the reversal table for inverting the semiconductor packages, and the pallet table for sorting and the like, respectively.

The tables may include vacuum panels formed with vacuum holes for vacuum adsorption of semiconductor packages. On the vacuum panel, a vacuum pad made of a material having flexibility such as synthetic rubber, silicone resin or the like may be disposed in order to stably vacuum adsorb semiconductor packages. The vacuum panel may be detachably coupled to a body providing a vacuum chamber in communication with the vacuum holes, and the body may be connected to a vacuum pump.

Like the above tables, pickers for transferring semiconductor packages according to a process order also transfer semiconductor packages by vacuum suction, and are configured in a similar configuration to the tables.

Particularly, the semiconductor package can be formed in various types, and its size can be variously formed. The tables and pickers must have various types of vacuum panels to stably attract semiconductor packages, and corresponding vacuum panels may be coupled to the body depending on the type of semiconductor packages.

It is an object of the present invention to provide an improved vacuum table capable of preventing air leakage so that semiconductor packages can be stably vacuum adsorbed and applied regardless of the types of semiconductor packages.

It is also an object of the present invention to provide a semiconductor package transfer module capable of loading and transferring semiconductor packages regardless of the types of semiconductor packages by including the above vacuum table.

According to an aspect of the present invention, there is provided a vacuum table including a vacuum panel having a plurality of vacuum grooves and a plurality of first vacuum holes communicating with the vacuum grooves, And a plurality of second vacuum holes formed in the vacuum holes for adsorbing the first vacuum holes to the first vacuum holes, and a plurality of second vacuum holes formed in the vacuum holes, And a plurality of ball valves for opening and closing the outlet portion of the vacuum groove by the vacuum pressure according to the presence or absence of the semiconductor package corresponding to the second vacuum hole. Here, the second vacuum holes communicate with the vacuum holes, and may be disposed to face the first vacuum holes with the vacuum holes therebetween.

According to embodiments of the present invention, the vacuum table may include a lead plate disposed between the vacuum pad and the vacuum panel and having a plurality of third vacuum holes communicated with the vacuum holes and the second vacuum holes, . The third vacuum hole may have a diameter smaller than a diameter of the ball valve to prevent the ball valve from being separated from the vacuum groove.

According to embodiments of the present invention, the vacuum table may further include elastic members that engage with the ball valves to separate the ball valves from the outlet portion of the vacuum groove. The vacuum panel may have coupling grooves formed between the vacuum grooves and the first vacuum holes to communicate with the vacuum grooves and the first vacuum holes, As shown in FIG.

According to embodiments of the present invention, a plurality of third vacuum holes may correspond to the ball valve.

According to embodiments of the present invention, a plurality of second vacuum holes may correspond to the semiconductor package.

According to embodiments of the present invention, the vacuum table further includes a main body coupled to the vacuum panel and providing a vacuum chamber for communicating with the first vacuum holes to provide vacuum pressure to the first vacuum holes .

According to an aspect of the present invention, there is provided a semiconductor package transfer module including a chuck unit and a package picker. The chuck unit has a first vacuum table for vacuum-adhering semiconductor packages, and can load the semiconductor packages. The package picker has a second vacuum table for vacuum-adsorbing the semiconductor packages, a surface for vacuum-adsorbing the semiconductor packages can be disposed facing the ground, and the semiconductor packages are picked up and transported for loading on the chuck unit . In particular, the first and second vacuum tables each include a vacuum panel having a plurality of vacuum grooves and a plurality of first vacuum holes communicating with the vacuum grooves, and a vacuum panel disposed on the vacuum panel, And an outlet of the vacuum groove, which is housed in the vacuum grooves and has a ball shape and in which air in the vacuum groove flows into the first vacuum hole, And a plurality of ball valves for opening / closing the portion by the vacuum pressure according to the presence or absence of the semiconductor package corresponding to the second vacuum hole. The second vacuum holes may communicate with the vacuum holes and may be disposed to face the first vacuum holes with the vacuum holes therebetween.

According to the embodiments of the present invention, the first and second vacuum tables are respectively provided with a plurality of third vacuum holes arranged between the vacuum pad and the vacuum panel and communicating with the vacuum holes and the second vacuum holes And a lead plate having holes formed therein. Here, the third vacuum hole may have a diameter smaller than the diameter of the ball valve to prevent the ball valve from being separated from the vacuum groove.

According to embodiments of the present invention, the first vacuum table may further include elastic members that engage with the ball valves to separate the ball valves from the outlet portion of the vacuum groove. Here, the vacuum panel may have coupling grooves formed between the vacuum grooves and the first vacuum holes to communicate with the vacuum grooves and the first vacuum holes, As shown in FIG.

According to embodiments of the present invention, a plurality of third vacuum holes may correspond to the ball valve in the second vacuum table.

According to the embodiments of the present invention as described above, the vacuum table for vacuum-adhering semiconductor packages includes a vacuum panel having a plurality of vacuum grooves and a plurality of first vacuum holes communicated with the vacuum grooves, A vacuum pad disposed on the panel and having a plurality of second vacuum holes for adsorbing the semiconductor packages using vacuum pressure, and an outlet portion of the vacuum groove, depending on the presence or absence of the semiconductor package corresponding to the second vacuum hole And a plurality of ball valves which are opened and closed by the vacuum pressure.

In particular, when the second vacuum hole is disposed between the semiconductor packages, the ball valve can block the outlet portion of the vacuum groove to prevent air leakage, so that the semiconductor packages can be stably vacuum-adsorbed. Accordingly, since the vacuum table can be used without replacing the vacuum pad and the vacuum panel regardless of the size of the semiconductor package, it is possible to easily cope with various semiconductor packages and reduce the processing time and manufacturing cost.

FIG. 1 is a schematic diagram illustrating a semiconductor package transfer module according to an embodiment of the present invention. Referring to FIG.
Fig. 2 is a schematic perspective view for explaining the first and second vacuum tables shown in Fig. 1. Fig.
3 is an enlarged cross-sectional view for explaining the first and second vacuum tables shown in FIG.
4 is an enlarged cross-sectional view for explaining a state in which the first and second vacuum tables shown in FIG. 1 vacuum-adsorb semiconductor packages.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic diagram illustrating a semiconductor package transfer module according to an embodiment of the present invention. Referring to FIG.

Referring to FIG. 1, a semiconductor package transport module 300 according to an embodiment of the present invention may be used to load and transport semiconductor packages 10 in a cutting and sorting process. In particular, the semiconductor package transfer module 300 includes vacuum tables 101 and 201 for vacuum-sucking the semiconductor packages 10 to transfer and support the semiconductor packages 10.

The semiconductor package transfer module 300 may include a chuck unit 100 for loading the semiconductor packages 10 and a package picker 200 for picking up and transferring the semiconductor packages 10.

The semiconductor packages 10 may be loaded on the chuck unit 100 by the package picker 200 and vacuum adsorbed to the chuck unit 100 by vacuum pressure. The chuck unit 100 according to an embodiment of the present invention can be used as a drying and inspection table, an inversion table, a pallet table, and the like in the cutting and sorting process.

The package picker 200 is movable in the horizontal direction with respect to the ground, for example, in the X-axis direction, and is also movable in the Z-direction perpendicular to the ground. The package picker 200 can pick up the semiconductor packages 10 by vacuum suction and then move them to load the semiconductor packages 10 on the chuck unit 100. Also, although not shown in the drawing, the package picker 200 can be used to pick up the semiconductor packages 10 and transfer them to the above-described various kinds of tables in addition to the chuck unit 100. The package picker 200 is disposed so that the surface for vacuum-adsorbing the semiconductor packages 10 faces the ground.

According to an embodiment of the present invention, the chuck unit 100 includes a first vacuum table 101 for vacuum-adsorbing the semiconductor packages 10, and a second vacuum table 101 for providing vacuum pressure to the first vacuum table 101 The first vacuum pump 102 may be provided.

The package picker 200 includes a second vacuum table 201 for vacuum-adsorbing the semiconductor packages 10, a driving unit (not shown) for moving the second vacuum table 210, And a second vacuum pump 202 for providing vacuum pressure. In an example of the present invention, the driving unit may include the linear motion guide, the ball screw, the motor, and the like to move the second vacuum table 210 in the X-axis direction and the Z-axis direction.

Hereinafter, the configuration of the first and second vacuum tables 110 and 210 will be described in detail with reference to the drawings.

FIG. 2 is a schematic perspective view for explaining the first and second vacuum tables shown in FIG. 1, and FIG. 3 is an enlarged sectional view for explaining the first and second vacuum tables shown in FIG.

Referring to FIGS. 2 and 3, the first vacuum table 110 may include a vacuum panel 110, a vacuum pad 120, and a plurality of ball valves 130.

The vacuum panel 110 has a plurality of vacuum grooves 112 and a plurality of first vacuum holes 114 communicating with the vacuum grooves 112.

The vacuum pad 120 is disposed on the vacuum panel 110. The semiconductor packages 10 may be loaded on the vacuum pad 120 and the vacuum pad 120 may include a plurality of second vacuum holes 122 for vacuum adsorption of the semiconductor packages 10 . The second vacuum holes 122 are communicated with the vacuum grooves 112 so that the vacuum holes 112 and the first vacuum holes 114 and the second vacuum holes 122 Are communicated with each other. As shown in FIG. 3, the second vacuum holes 122 are disposed to face the first vacuum holes 114 with the vacuum grooves 112 interposed therebetween. Here, the vacuum pad 120 may be made of a flexible material such as synthetic rubber or silicone resin to stably vacuum adsorb the semiconductor packages 10.

Meanwhile, the ball valves 130 are accommodated in the vacuum grooves 112 of the vacuum panel 110. The outlet portion 112A of the vacuum groove 112 in which the air in the vacuum groove 112 introduced from the second vacuum hole 122 flows into the first vacuum hole 114 is divided into the second vacuum Open or closed depending on the presence or absence of the semiconductor package corresponding to the hole 122. Here, the vacuum groove 112 is formed to be larger than the size of the ball valve 130 so that the ball valve 130 can flow in the vacuum groove 112. The outlet 112A of the vacuum groove 112 may be formed to have a diameter smaller than that of the ball valve 130 so as to be opened and closed by the ball valve 130. The operation of the ball valve 130 to open and close the outlet portion 112A of the vacuum groove 112 will be described in detail with reference to FIG.

According to an embodiment of the present invention, one ball valve 130 may be accommodated in one vacuum groove 112, and the ball valve 130 may have a ball shape.

The first vacuum table 101 may further include a lead plate 140 disposed between the vacuum panel 110 and the vacuum pad 120. The lead plate 140 may have a plurality of third vacuum holes 142 communicating with the vacuum holes 112 and the second vacuum holes 122. The third vacuum hole 142 may have a smaller diameter than the ball valve 130 to prevent the ball valve 130 from being separated from the vacuum groove 112.

The first vacuum table 101 may further include a plurality of elastic members 150 for separating the ball valves 130 from the outlet portion 112A of the vacuum groove 112. In one example of the present invention, a coil spring may be used as the elastic member 150.

According to an embodiment of the present invention, the vacuum panel 110 may have a plurality of coupling grooves 116 formed between the vacuum grooves 112 and the first vacuum holes 114, The coupling grooves 116 may communicate with the vacuum grooves 112 and the first vacuum holes 114.

One end of the elastic member 150 may be engaged with the ball valve 130 and the other end may be inserted and fixed into the coupling groove 116. 3, the elastic member 150 may be disposed in the vacuum groove 112 so that the ball valve 130 does not block the outlet portion 112A of the vacuum groove 112 by gravity, Away from the outlet portion 112A.

The first vacuum table 101 may further include a main body 160 coupled to the vacuum panel 110. The main body 160 provides a vacuum chamber 162 communicating with the first vacuum holes 112 and may have a box shape with an open top. The open top of the body 160 may be covered by the vacuum panel 110 and the internal space of the body 160 may serve as the vacuum chamber 152. The body 160 may be connected to the first vacuum pump 102 (see FIG. 1) for providing a vacuum within the vacuum chamber 162.

The second vacuum table 201 picks up the semiconductor packages 10 by vacuum suction and moves to the upper portion of the first vacuum table 101 to pick up the semiconductor packages 10 from the first And can be mounted on the vacuum table 101.

According to an embodiment of the present invention, since the second vacuum table 201 has a configuration similar to that of the first vacuum table 101, the same components as those of the first vacuum table 101 The description is omitted.

The second vacuum table 201 may include a vacuum panel 210, a vacuum pad 220, and a plurality of ball valves 230.

The vacuum panel 210 of the second vacuum table 201 includes a plurality of vacuum grooves 212 in which the ball valves 230 are housed in the same manner as the vacuum panel 110 of the first vacuum table 101, And a plurality of first vacuum holes 214 communicating with the vacuum grooves 212.

The vacuum pad 210 is disposed on a surface of the vacuum table 210 that can be disposed opposite to the first vacuum table 101. The vacuum pad 220 has a plurality of second vacuum holes 222 communicating with the vacuum grooves 212 in the same manner as the vacuum pad 120 of the first vacuum table 101. The semiconductor packages 10 can be attracted to the vacuum pad 220 by the vacuum pressure formed in the second vacuum holes 222. As a result, (10) can be picked up and transported.

Like the ball valves 130 of the first vacuum table 101, the ball valves 230 of the second vacuum table 201 allow air in the vacuum holes 212 to flow through the first vacuum holes 214, And the outlet portion 212A of the vacuum groove 212 is opened or closed according to the presence or absence of the semiconductor package corresponding to the second vacuum hole 222. [

According to an embodiment of the present invention, one ball valve 230 may be housed in one vacuum groove 212 of the second vacuum table 201, and the ball valve 230 may have a ball shape .

The second vacuum table 201 may further include a lead plate 240 disposed between the vacuum panel 210 and the vacuum pad 220. The lead plate 240 may have a plurality of third vacuum holes 242 communicating with the vacuum holes 212 and the second vacuum holes 222. The third vacuum hole 242 may have a diameter smaller than that of the ball valve 230 to prevent the ball valve 230 from being separated from the vacuum groove 112.

In particular, unlike the first vacuum table 101, the second vacuum table 201 is disposed such that the surfaces to which the semiconductor packages 10 are vacuum-adsorbed face the ground, The third vacuum holes 242 can be completely closed.

3, the third vacuum hole 242 of the second vacuum table 201 has a smaller diameter than the third vacuum hole 142 of the first vacuum table 101 . The first vacuum table 101 corresponds to one ball valve 130 and one third vacuum hole 142 corresponds to the first vacuum table 101. The second vacuum table 201 corresponds to one ball valve 230 A plurality of third vacuum holes 242 can correspond.

Unlike the first vacuum table 101, the ball valve 230 of the second vacuum table 201 does not block the outlet portion 212A of the vacuum groove 212 by gravity, The table 201 may not have the same configuration as the elastic members 150 and the coupling grooves 116 of the first vacuum table 101. [ 3, since the vacuum panel 210 of the second vacuum table 201 does not have the coupling grooves 116, the first vacuum hole 214 of the second vacuum table 201, May be longer than the first vacuum hole (114) of the first vacuum table (101).

The second vacuum table 201 may further include a main body 250 coupled to the vacuum panel 210. The main body 250 provides a vacuum chamber 252 communicating with the first vacuum holes 212 and may have a box shape with an open top. The opened upper portion of the main body 250 may be covered by the vacuum panel 210 and the inner space of the main body 250 may function as the vacuum chamber 252. The main body 250 may be connected to the second vacuum pump 202 (see FIG. 1) for providing vacuum pressure inside the vacuum chamber 252.

Referring again to FIG. 1, the package picker 200 may further include coupling members 204 detachably coupling the vacuum panel 210 to the main body 250. The coupling members 204 may be mounted on the side surfaces of the vacuum panel 210 and the main body 250 as shown in FIG. 2, and cimi-rings may be used as the coupling members 204 .

Although not shown in detail in the drawing, the chuck unit 100 also has the same configuration as the coupling members 204 of the package picker 200 for detachably coupling the vacuum panel 110 to the main body 160 .

FIG. 4 is an enlarged cross-sectional view for explaining a state in which the first and second vacuum tables shown in FIG. 1 vacuum-adsorb semiconductor packages.

4, the second vacuum table 201 vacuum-adsorbs the semiconductor packages 10 on one side of the vacuum pad 220 to pick them up. At this time, a part of the second vacuum holes 222 of the second vacuum table 201 may be disposed between the semiconductor packages 10, and the ball valves 230 of the second vacuum table 201, A ball valve corresponding to a second vacuum hole disposed between the semiconductor packages 10 is connected to the vacuum chamber 212 by a vacuum pressure provided from the vacuum chamber 252 to the first vacuum hole 214, Seal the outlet portion 212A. As a result, the second vacuum table 201 can block the air flowing into the first vacuum hole 212 from the second vacuum hole disposed between the semiconductor packages 10, thereby preventing air leakage. Herein, the vacuum valves provided in the first vacuum holes 214, except for the ball valves corresponding to the second vacuum holes disposed between the semiconductor packages 10 among the ball valves 230, 2 vacuum hole 222 by gravity from the outlet portion 212A of the vacuum groove 212. The vacuum hole 212 is formed in the vacuum hole 212,

The second vacuum table 201 is mounted on the first vacuum table 101 and the vacuum pads 120 of the first vacuum table 101 are mounted on the stacked semiconductor packages (10) are adsorbed using vacuum pressure. At this time, a part of the second vacuum holes 122 of the first vacuum table 101 may be disposed between the semiconductor packages 10, and the elastic members 150 of the first vacuum table 101 The elastic member corresponding to the second vacuum hole disposed between the semiconductor packages 10 is contracted by the vacuum pressure provided from the vacuum chamber 162 to the first vacuum hole 214. [ As a result, the ball valve coupled to the retracted elastic member blocks the outlet portion 112A of the vacuum groove 112 from the second vacuum hole disposed between the semiconductor packages 10 to the first vacuum hole 212 Can be blocked. Here, other than the ball valve corresponding to the second vacuum hole disposed between the semiconductor packages 10 among the ball valves 130, the vacuum pressure provided from the first vacuum holes 114 is changed to the And is spaced from the outlet portion 112A of the vacuum groove 112 by the elastic members 150 to provide the vacuum holes 122. [

The first and second vacuum tables 101 and 201 for vacuum-adsorbing the semiconductor packages 10 are connected to the first vacuum holes 114 and 214 through the second vacuum holes And ball valves 130 and 230 for turning on / off the vacuum pressure provided to the first and second valves 122 and 222, respectively. Each of the ball valves 130 and 230 may include an outlet portion of a corresponding vacuum groove when the corresponding second vacuum hole is disposed between the semiconductor packages 10, It is possible to seal air by the air pressure, so that air leakage can be prevented. Accordingly, the vacuum tables 101 and 201 can stably vacuum-adsorb the semiconductor packages 10 and the vacuum panels 110 and 210 and the vacuum pads 120 and 220, depending on the size of the semiconductor package, It is possible to easily cope with various semiconductor packages, shorten the manufacturing process time, and improve the mass production efficiency.

In addition, since the semiconductor package transfer module 300 does not need to have various vacuum panels and vacuum pads according to the types of the semiconductor packages 10, it is possible to reduce equipment manufacturing cost.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

100: Chuck unit 200: Package picker
101, 201: vacuum table 110, 210: vacuum panel
112, 212: vacuum grooves 114, 214: first vacuum hole
116: coupling groove 120, 220: vacuum pad
122, 222: second vacuum hole 130, 230: ball valve
140, 240: lead plate 142, 242: third vacuum hole
150: elastic member 160, 250:
162, 252: vacuum chamber 102, 202: vacuum pump
204:

Claims (10)

A vacuum panel having a plurality of vacuum grooves and a plurality of first vacuum holes communicating with the vacuum grooves;
A vacuum pad disposed on the vacuum panel and having a plurality of second vacuum holes for adsorbing the semiconductor packages using vacuum pressure; And
And an outlet portion of the vacuum groove, which is housed in the vacuum grooves and has a ball shape and into which the air in the vacuum groove flows into the first vacuum hole, And a plurality of ball valves which are opened and closed by the vacuum pressure in accordance with the vacuum pressure,
Wherein the second vacuum holes are arranged to communicate with the vacuum grooves and face the first vacuum holes with the vacuum grooves therebetween. The method according to claim 1,
Further comprising a lead plate disposed between the vacuum pad and the vacuum panel and having a plurality of third vacuum holes communicated with the vacuum holes and the second vacuum holes,
Wherein the third vacuum hole has a diameter smaller than a diameter of the ball valve to prevent the ball valve from being separated from the vacuum groove. 3. The method of claim 2,
Further comprising elastic members engaged with the ball valves to separate the ball valves from the outlet portion of the vacuum groove,
Wherein the vacuum panel has coupling grooves formed between the vacuum grooves and the first vacuum holes to communicate with the vacuum grooves and the first vacuum holes,
And the elastic members are inserted and fixed in the coupling grooves. 3. The method of claim 2,
Wherein a plurality of third vacuum holes are associated with the ball valve. The method according to claim 1,
Characterized in that a plurality of second vacuum holes are associated with the semiconductor package. The method according to claim 1,
Further comprising a body coupled to the vacuum panel and providing a vacuum chamber in communication with the first vacuum holes to provide vacuum pressure to the first vacuum holes. Vacuum table. A chuck unit having a first vacuum table for vacuum-chucking semiconductor packages, the chuck unit loading the semiconductor packages; And
And a package picker for picking up and transporting the semiconductor packages to be mounted on the chuck unit, the package picker having a second vacuum table for vacuum-adsorbing the semiconductor packages, ,
The first and second vacuum tables each have a first,
A vacuum panel having a plurality of vacuum grooves and a plurality of first vacuum holes communicating with the vacuum grooves;
A vacuum pad disposed on the vacuum panel and having a plurality of second vacuum holes for adsorbing the semiconductor packages using vacuum pressure; And
And an outlet portion of the vacuum groove, which is housed in the vacuum grooves and has a ball shape and into which the air in the vacuum groove flows into the first vacuum hole, And a plurality of ball valves which are opened and closed by the vacuum pressure in accordance with the vacuum pressure,
Wherein the second vacuum holes are arranged to communicate with the vacuum grooves and to face the first vacuum holes with the vacuum grooves therebetween. 8. The method of claim 7,
The first and second vacuum tables each have a first,
Further comprising a lead plate disposed between the vacuum pad and the vacuum panel and having a plurality of third vacuum holes communicated with the vacuum holes and the second vacuum holes,
Wherein the third vacuum hole has a diameter smaller than a diameter of the ball valve to prevent the ball valve from being separated from the vacuum groove. 9. The method of claim 8,
Wherein the first vacuum table further comprises elastic members for engaging with the ball valves to disengage the ball valves from the outlet portion of the vacuum groove,
Wherein the vacuum panel has coupling grooves formed between the vacuum grooves and the first vacuum holes to communicate with the vacuum grooves and the first vacuum holes,
And the elastic members are inserted and fixed in the coupling grooves. 9. The method of claim 8,
Wherein the second vacuum table corresponds to a plurality of third vacuum holes with respect to the ball valve.
KR1020150148908A 2015-10-26 2015-10-26 Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same KR20170048041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150148908A KR20170048041A (en) 2015-10-26 2015-10-26 Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150148908A KR20170048041A (en) 2015-10-26 2015-10-26 Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same

Publications (1)

Publication Number Publication Date
KR20170048041A true KR20170048041A (en) 2017-05-08

Family

ID=60164033

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150148908A KR20170048041A (en) 2015-10-26 2015-10-26 Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same

Country Status (1)

Country Link
KR (1) KR20170048041A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190102919A (en) * 2018-02-27 2019-09-04 제너셈(주) Transfer apparatus of semiconductor package
KR102083351B1 (en) * 2019-01-29 2020-03-02 제너셈(주) Vision table module and vision table apparatus
KR102137996B1 (en) * 2019-09-09 2020-07-27 제너셈(주) Vacuum adsorption module
KR102167500B1 (en) * 2019-09-09 2020-10-19 제너셈(주) Vacuum adsorption module
KR20230023962A (en) * 2021-08-11 2023-02-20 서우테크놀로지 주식회사 Semiconductor strip grinding apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190102919A (en) * 2018-02-27 2019-09-04 제너셈(주) Transfer apparatus of semiconductor package
KR102083351B1 (en) * 2019-01-29 2020-03-02 제너셈(주) Vision table module and vision table apparatus
KR102137996B1 (en) * 2019-09-09 2020-07-27 제너셈(주) Vacuum adsorption module
KR102167500B1 (en) * 2019-09-09 2020-10-19 제너셈(주) Vacuum adsorption module
KR20230023962A (en) * 2021-08-11 2023-02-20 서우테크놀로지 주식회사 Semiconductor strip grinding apparatus

Similar Documents

Publication Publication Date Title
KR20170048041A (en) Vacuum table for vacuum-adsorbing semiconductor packages and module of carrying semiconductor packages having the same
US10083846B2 (en) Apparatuses for bonding semiconductor chips
KR101896800B1 (en) Apparatus for picking up semiconductor packages
KR102446947B1 (en) Apparatus for sawing and sorting semiconductor packages
CN101000883A (en) Workbench for semiconductor manufacturing engineering
JP2008538453A (en) Semiconductor package pickup device
KR20160028953A (en) Cutting apparatus, adsorption mechanism and apparatus equpped with adsorption mechanism
KR101684803B1 (en) Vacuum table for vacuum-adsorbing semiconductor packages
KR101684802B1 (en) Vacuum table for vacuum-adsorbing semiconductor packages
KR101630039B1 (en) Pallet table for supporting semiconductor packages
KR101647877B1 (en) Table assembly for supporting semiconductor packages
TWI384571B (en) Unit for eliminating particles and apparatus for transferring a substrate having the same
KR102267946B1 (en) Apparatus for transferring semiconductor packages and semiconductor strip
KR102106562B1 (en) Vacuum table for vacuum-adsorbing semiconductor packages
KR102401363B1 (en) Vacuum table for vacuum-adsorbing semiconductor packages
KR20150086671A (en) Apparatus for transferring semiconductor packages
KR101684785B1 (en) Apparatus for picking up semiconductor packages
KR102284152B1 (en) Apparatus for picking up a semiconductor device
KR101287325B1 (en) Apparatus for picking up a light-emitting device
KR102312853B1 (en) Apparatus for transferring semiconductor packages
KR102158819B1 (en) Apparatus for picking up semiconductor packages
KR102158825B1 (en) Apparatus for picking up semiconductor packages
KR200468034Y1 (en) Pallet table for loading semiconductor devices
KR101496041B1 (en) Table assembly for supporting semiconductor packages
KR102344112B1 (en) Vacuum table for vacuum-adsorbing semiconductor packages