KR101684785B1 - Apparatus for picking up semiconductor packages - Google Patents

Apparatus for picking up semiconductor packages Download PDF

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Publication number
KR101684785B1
KR101684785B1 KR1020150068763A KR20150068763A KR101684785B1 KR 101684785 B1 KR101684785 B1 KR 101684785B1 KR 1020150068763 A KR1020150068763 A KR 1020150068763A KR 20150068763 A KR20150068763 A KR 20150068763A KR 101684785 B1 KR101684785 B1 KR 101684785B1
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South Korea
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vacuum
holes
inner space
panel
semiconductor packages
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KR1020150068763A
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Korean (ko)
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KR20160135457A (en
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신금수
이기욱
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A semiconductor package pickup device is disclosed. The apparatus includes a vacuum panel having vacuum holes for vacuum-chucking individual semiconductor packages through a cutting process, and a vacuum chamber disposed on the vacuum panel and having an internal space connected with the vacuum holes. Particularly, a nozzle connected to the vacuum holes and protruding from the bottom surface of the inner space is provided on the bottom surface of the inner space.

Description

[0001] Apparatus for picking up semiconductor packages [0002]

Embodiments of the present invention relate to an apparatus for picking up semiconductor packages. More particularly, the present invention relates to an apparatus for picking up semiconductor packages for transporting cut semiconductor packages in a cutting and sorting process for semiconductor packages.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be manufactured by a dicing process, a die bonding process, and a molding process, Packages. ≪ / RTI >

The semiconductor strip fabricated as described above may be individually classified into a plurality of semiconductor packages through a sawing and sorting process, and classified according to good or defective product judgment. For example, the semiconductor strip may be loaded onto a chuck table and then individualized into a plurality of semiconductor packages using cutting blades, which may be cleaned and dried and then inspected by a vision module . Also, it can be classified as good and defective according to the inspection result by the vision module.

The semiconductor packages may be transported to both good and defective trays via a buffer table for performing drying and inspection processes and a pallet table for sorting. For example, the semiconductor packages may be transferred to the good and defective trays via the respective tables by a semiconductor package pickup device and a transfer device for moving the same.

The semiconductor package pick-up apparatus may include a vacuum panel having a plurality of vacuum holes for sucking the semiconductor packages, and a vacuum chamber disposed on the vacuum panel and communicating with the vacuum holes, Can be connected to the vacuum pump through the vacuum piping.

The semiconductor packages may be picked up by the pick-up device and then transported by the transport device and placed on a buffer table or pallet table for inspection or sorting.

On the other hand, when picking up the individual semiconductor packages by the cutting process using the pickup device, water used in the cutting process can be sucked into the vacuum chamber and the vacuum pipe. In addition, while the semiconductor packages are picked up, water may be sucked into the vacuum chamber and the vacuum pipe while cleaning the semiconductor packages. The sucked water can transfer the semiconductor packages to the buffer table, thereby increasing the time required to dry the semiconductor packages. In addition, corrosion may be generated inside the vacuum chamber by the sucked water.

Korean Registered Patent No. 10-0604098 (2006.07.18)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor package pickup apparatus capable of preventing a liquid material such as water sucked into a vacuum chamber from being transferred onto a buffer table.

According to an aspect of the present invention, there is provided a semiconductor package pick-up apparatus comprising: a vacuum panel having vacuum holes for vacuum-chucking individual semiconductor packages through a cutting process; And a vacuum chamber having an inner space connected to the holes. In particular, a nozzle connected to the vacuum holes and protruding from a bottom surface of the inner space may be provided on a bottom surface of the inner space.

According to the embodiments of the present invention, the vacuum holes are formed on a lower surface of the vacuum panel, a second vacuum hole is formed on an upper surface of the vacuum panel, the second vacuum hole is connected to the nozzle, And a vacuum path connecting the first vacuum holes and the second vacuum hole may be formed.

According to embodiments of the present invention, the vacuum chamber may include an upper panel and a lower panel coupled to each other, and the lower panel may be provided with a recess for forming the inner space.

According to embodiments of the present invention, the vacuum chamber includes a vacuum source for providing a vacuum in the inner space for vacuum adsorption of the semiconductor packages, and a vacuum source for supplying air to the inner space to place the semiconductor packages on the table To the air source.

According to embodiments of the present invention, a check valve connected to the inner space may be mounted on a side surface of the vacuum chamber, and the liquid material sucked into the inner space through the vacuum holes and the nozzle may be connected to the check valve To the outside.

According to embodiments of the present invention, a channel connected to the check valve may be formed on the bottom surface of the inner space to discharge the liquid material.

According to embodiments of the present invention, the vacuum panel may include a base panel formed with the vacuum holes, and an adsorption pad attached to a lower portion of the base panel. At this time, third vacuum holes connected to the vacuum holes and for vacuum-adsorbing the semiconductor packages may be formed through the adsorption pad.

According to another aspect of the present invention, there is provided a semiconductor package pick-up apparatus including first vacuum holes for vacuum-absorbing a part of individual semiconductor packages through a cutting process, A vacuum chamber having two vacuum holes, a vacuum chamber disposed on the vacuum panel and having a first inner space connected to the first vacuum holes and a second inner space connected to the second vacuum holes . Particularly, on the bottom surface of the first inner space, a first nozzle connected to the first vacuum holes and protruding from the bottom surface of the first inner space is provided, and on the bottom surface of the second inner space, And a second nozzle connected to the vacuum holes and protruding from the bottom surface of the second inner space.

According to embodiments of the present invention, the first vacuum holes and the second vacuum holes are formed on the lower surface of the vacuum panel, and the upper surface of the vacuum panel is connected to the first nozzle and the second nozzle respectively A third vacuum hole and a fourth vacuum hole are formed in the first vacuum hole and the second vacuum hole and the first vacuum hole connects the first vacuum holes and the third vacuum hole, And a second vacuum flow path connecting the vacuum holes may be formed.

According to the embodiments of the present invention, the first check valve and the second check valve, which are respectively connected to the first inner space and the second inner space, may be mounted on the side surfaces of the vacuum chamber, The liquid material sucked into the first and second inner spaces through the second vacuum holes and the first and second nozzles may be discharged to the outside through the first and second check valves.

According to embodiments of the present invention, first and second channels connected to the first and second check valves are formed on the bottom surfaces of the first and second inner spaces to discharge the liquid material, respectively .

According to embodiments of the present invention, the vacuum panel may include a base panel formed with the first and second vacuum holes, and an adsorption pad attached to a lower portion of the base panel. At this time, the fifth vacuum holes and the sixth vacuum holes, which are connected to the first vacuum holes and the second vacuum holes, respectively, for vacuum adsorption of the semiconductor packages, may be formed through the adsorption pad.

According to the embodiments of the present invention as described above, the semiconductor package pick-up apparatus comprises a vacuum panel having vacuum holes for vacuum-adsorbing the individual semiconductor packages through the cutting process, And a vacuum chamber having an inner space connected to the vacuum chamber. In particular, a nozzle connected to the vacuum holes and protruding from a bottom surface of the inner space may be provided on a bottom surface of the inner space.

Thus, the water sucked through the vacuum holes and the nozzle while picking up the individualized semiconductor packages and cleaning the semiconductor packages can be received in the internal space. Particularly, since the nozzle protrudes from the bottom surface of the inner space, the suctioned water is not transferred onto the buffer table while the semiconductor packages are placed on the buffer table. As a result, the time required to dry the semiconductor packages on the buffer table can be greatly shortened.

In addition, a check valve connected to the inner space may be mounted on a side surface of the vacuum chamber, and the sucked water may be discharged to the outside through the check valve. Therefore, the corrosion by the inhaled water can be greatly reduced.

1 is a schematic cross-sectional view illustrating a semiconductor package pickup device according to an embodiment of the present invention.
2 is a schematic plan view for explaining the lower panel shown in FIG.
3 is a schematic cross-sectional view for explaining another example of the vacuum panel shown in Fig.
4 is a schematic cross-sectional view illustrating a semiconductor package pickup device according to another embodiment of the present invention.
5 is a schematic plan view for explaining the semiconductor package pickup device shown in FIG.
6 is a schematic cross-sectional view for explaining another example of the vacuum panel shown in Fig.
7 is a schematic plan view for explaining semiconductor packages placed on a buffer table;
8 is a schematic plan view for explaining some of the semiconductor packages placed on the first inversion table or the first pallet table.
9 is a schematic plan view for explaining the remaining semiconductor packages placed on the second inversion table or the second pallet table.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic cross-sectional view illustrating a semiconductor package pickup device according to one embodiment of the present invention, and FIG. 2 is a schematic plan view for explaining a lower panel shown in FIG.

1 and 2, a semiconductor package pick-up apparatus 100 according to an embodiment of the present invention can be used to pick up individual semiconductor packages 10 (see FIG. 7) by a cutting process.

The semiconductor package pick-up apparatus 100 includes a vacuum panel 110 having a plurality of first vacuum holes 112 for vacuum-adsorbing the semiconductor packages 10, And a vacuum chamber 120 in communication with the first vacuum holes 112. As an example, the vacuum panel 110 may have a rectangular plate shape, and the vacuum chamber 120 may have a rectangular box shape.

The first vacuum holes 112 may be formed on a lower surface of the vacuum panel 110 and a second vacuum hole 114 connected to the vacuum chamber 120 may be formed on the upper surface of the vacuum panel 110. [ May be formed. In particular, a vacuum passage 116 may be formed in the vacuum panel 110 to connect the first vacuum holes 112 with the second vacuum holes 114.

The vacuum chamber 120 may have an inner space 122 connected to the second vacuum hole 114. For example, the vacuum chamber 120 may include an upper panel 124 and a lower panel 126 coupled to each other, and the lower panel 126 may include a recess for forming the inner space 122, May be provided. The upper panel 124 may be provided with a recess for forming the inner space 122 and the inner space 122 may be provided between the upper panel 124 and the lower panel 126 May be provided.

The vacuum chamber 120 may be connected to a vacuum source (not shown) for providing a vacuum to the interior space 122 through the top panel 124. The vacuum source may include a vacuum pump, a valve, and the like. The vacuum chamber 120 may include an air source (not shown) for supplying air to lower the semiconductor packages 10 vacuum-adsorbed on the vacuum panel 110 onto the buffer table 20 (see FIG. 7) Lt; / RTI > The air source may include a fan, a valve, and the like. The upper panel 124 may be provided with a connection member 128 for connecting the vacuum chamber 120 with the vacuum source and the air source.

On the other hand, while picking up the individual semiconductor packages 10 by the cutting process and during cleaning the picked-up semiconductor packages 10, the liquid material used in the cutting and cleaning processes, for example, Water can be sucked into the inner space 122 of the vacuum chamber 120 through the vacuum panel 110. [

According to an embodiment of the present invention, a nozzle 130 connected to the second vacuum hole 114 may be provided on the lower panel 126. The nozzle 130 may protrude higher than the bottom surface of the inner space 122 so that the water sucked into the inner space 122 of the vacuum chamber 120 can be accommodated in the inner space 122 have. That is, the sucked water can be accommodated in the recess of the lower panel 126. Here, although two second vacuum holes 114 and two nozzles 130 are used, the number of the second vacuum holes 114 and the number of the nozzles 130 may vary And thus the scope of the present invention is not limited thereby.

As a result, the water sucked into the inner space 122 can be prevented from leaking through the first vacuum holes 112. Particularly, while the semiconductor packages 10 are placed on the buffer table 20, the suctioned water is not transferred onto the buffer table 20, The time required for the drying process for the packages 10 can be greatly shortened.

According to an embodiment of the present invention, a check valve 132 connected to the inner space 122 may be mounted on a side surface of the vacuum chamber 120. The check valve 132 may be used to discharge the sucked water from the vacuum chamber 120 to the outside. Particularly, when air is supplied into the vacuum chamber 120 to lower the semiconductor packages 10 on the buffer table 20, the internal pressure of the vacuum chamber 120 can be increased. So that the sucked water can be discharged to the outside through the check valve 132.

2, a channel 134 may be formed on the bottom surface of the inner space 122 to more easily discharge the sucked water through the check valve 132. As shown in FIG. The channel 134 may be connected to the check valve 132.

As another example, although not shown, the check valve 132 may be connected to a vacuum source (not shown) to discharge the inhaled water.

3 is a schematic cross-sectional view for explaining another example of the vacuum panel shown in Fig.

Referring to FIG. 3, the vacuum panel 140 may include a base panel 142 and a suction pad 150 attached to a lower portion of the base panel 142. First vacuum holes 144 for adsorbing the semiconductor packages 10 may be formed on a lower surface of the base panel 142. The upper surface of the base panel 142 may be connected to the vacuum chamber 120 A second vacuum hole 146 may be formed. In addition, a vacuum passage 148 may be formed in the base panel 142 to connect the first vacuum holes 144 and the second vacuum holes 146.

The adsorption pad 150 may be formed with third vacuum holes 152 connected to the first vacuum holes 144 so as to pass through the adsorption pad 150, May be vacuum-adsorbed on the lower surface of the adsorption pad 150. At this time, the adsorption pad 150 is preferably made of a flexible material such as rubber, silicone resin or the like in order to easily vacuum adsorb the semiconductor packages 10.

FIG. 4 is a schematic cross-sectional view illustrating a semiconductor package pickup device according to another embodiment of the present invention, and FIG. 5 is a schematic plan view illustrating the semiconductor package pickup device shown in FIG.

4 and 5, according to another embodiment of the present invention, a semiconductor package pick-up apparatus 200 includes a plurality of semiconductor packages 10A (see FIG. 8) 10A A vacuum panel 210 having first vacuum holes 212 for vacuum-adsorbing the semiconductor packages 10B and second vacuum holes 214 for vacuum-adsorbing the remaining semiconductor packages 10B (see FIG. 9) And a vacuum chamber 230 having a first inner space 232 and a second inner space 234 connected to the first vacuum holes 212 and the second vacuum holes 214, respectively. For example, the vacuum panel 210 may have a rectangular plate shape, and the vacuum chamber 230 may have a rectangular box shape.

The first vacuum holes 212 and the second vacuum holes 214 may be formed on a lower surface of the vacuum panel 210. On the upper surface of the vacuum panel 210, A third vacuum hole 216 connected to the second vacuum hole 212 and a fourth vacuum hole 218 connected to the second vacuum holes 214 may be formed. A first vacuum path 220 connecting the first vacuum holes 212 and the third vacuum holes 216 and a second vacuum path 220 connecting the first vacuum holes 212 and the second vacuum holes 214 are formed in the vacuum panel 210, And a second vacuum passage 222 connecting the fourth vacuum hole 218 may be formed.

The first inner space 232 of the vacuum chamber 230 may be connected to the third vacuum hole 216 and the second inner space 234 may be connected to the fourth vacuum hole 218. For example, as shown, the vacuum chamber 230 may include an upper panel 236 and a lower panel 238, and the lower panel 238 may include the first and second inner spaces 232 , 234) may be provided. Alternatively, the upper panel 238 may be provided with first and second recesses for forming the first and second inner spaces 232 and 234, and the upper panel 236 and lower Sidewalls and a partition wall may be provided between the panels 238 to form the first and second inner spaces 232 and 234.

The first and second inner spaces 232 and 234 of the vacuum chamber 230 may be connected to a vacuum source (not shown) through the upper panel 236. The vacuum source may include a vacuum pump and valves connected to the first and second inner spaces 232, 234. The first and second inner spaces 232 and 234 of the vacuum chamber 230 are formed in order to lower the semiconductor packages 10 vacuum-adsorbed on the vacuum panel 210 onto the buffer table 20 And may be connected to an air source (not shown) for supplying air. The air source may include a fan and valves connected to the first and second internal spaces 232 and 234. The upper panel 236 may be provided with connecting members 240 for connecting the vacuum chamber 230 with the vacuum source and the air source.

A first nozzle 242 and a second nozzle 242 are connected to the third vacuum hole 216 and the fourth vacuum hole 218 on the bottom surfaces of the first inner space 232 and the second inner space 234, A nozzle 244 may be provided. The first and second nozzles 242 and 244 may protrude higher than the bottom surfaces of the first and second inner spaces 232 and 234 so that the first and second nozzles 242 and 244 may protrude higher than the bottom surfaces of the first and second inner spaces 232 and 234, The water sucked into the second inner spaces 232 and 234 can be accommodated in the first and second inner spaces 232 and 234. That is, the inhaled water may be received in the first and second recesses of the lower panel 238.

As a result, water sucked into the first and second inner spaces 232 and 234 of the vacuum chamber 230 is prevented from leaking through the first and second vacuum holes 212 and 214 . Particularly, while the semiconductor packages 10 are placed on the buffer table 20, the suctioned water is not transferred onto the buffer table 20, The time required for the drying process for the packages 10 can be greatly shortened.

According to an embodiment of the present invention, first and second check valves 246 and 248 connected to the first and second inner spaces 232 and 234, respectively, are formed on the sides of the vacuum chamber 230, Can be mounted. The first and second check valves 246 and 248 may be used to discharge the inhaled water from the vacuum chamber 230 to the outside. In particular, when air is supplied to the first and second inner spaces 232 and 234 of the vacuum chamber 230 to lower the semiconductor packages 10 on the buffer table 20, The internal pressures of the first and second check valves 230 and 230 can be raised, whereby the sucked water can be discharged to the outside through the first and second check valves 246 and 248.

5, the bottom surfaces of the first and second inner spaces 232 and 234 are connected to the first and second check valves 246 and 248 through the first and second check valves 246 and 248, respectively, The first channel 250 and the second channel 252 may be respectively provided for easy discharge. The first and second channels 250 and 252 may be connected to the first and second check valves 246 and 248, respectively.

As another example, although not shown, the first and second check valves 246 and 248 may be connected to a vacuum source (not shown) to discharge the inhaled water. Further, unlike the above, a plurality of third vacuum holes 216, a plurality of first nozzles 242, a plurality of fourth vacuum holes 218, and a plurality of second nozzles 244 are used It is possible. Therefore, the scope of the present invention is not limited by the number of the third and fourth vacuum holes 216, 218 and the number of the first and second nozzles 242, 244.

6 is a schematic cross-sectional view for explaining another example of the vacuum panel shown in Fig.

Referring to FIG. 6, the vacuum panel 260 may include a base panel 262 and an adsorption pad 276 attached to the bottom of the base panel 262. The first vacuum holes 264 and the second vacuum holes 266 may be formed on the lower surface of the base panel 262 to allow the semiconductor packages 10 to be attracted. A third vacuum hole 268 and a fourth vacuum hole 270 connected to the vacuum chamber 230 may be formed on the upper surface of the vacuum chamber 230. A first vacuum passage 272 for connecting the first vacuum holes 264 and the third vacuum hole 268 and a second vacuum hole 262 for connecting the first vacuum holes 264 and the third vacuum holes 268 are formed in the base panel 262, And a second vacuum passage 274 for connecting the fourth vacuum hole 270 may be formed.

The adsorption pad 276 includes fifth vacuum holes 278 connected to the first vacuum holes 264 and sixth vacuum holes 280 connected to the second vacuum holes 266, And the semiconductor packages 10 may be vacuum-adsorbed on the lower surface of the adsorption pad 276. In this case, At this time, the adsorption pad 276 is preferably made of a flexible material such as rubber or silicone resin to easily vacuum-adsorb the semiconductor packages 10.

Meanwhile, the semiconductor packages 10 may be cleaned while being picked up by the semiconductor package pick-up device 200, and water may be supplied to the first and second inner spaces 232 and 234 during the cleaning process. Can be inhaled. The cleaned semiconductor packages 10 may be placed on the buffer table 20 and dried on the buffer table 20.

Subsequently, the dried semiconductor packages 10 can be transferred to the reversing table or the pallet table by the semiconductor package pick-up apparatus 200.

FIG. 7 is a schematic plan view for explaining semiconductor packages placed on the buffer table, FIG. 8 is a schematic plan view for explaining a part of the semiconductor packages placed on the first inversion table or the first pallet table, Is a schematic plan view for describing the remaining semiconductor packages placed on the second inversion table or the second pallet table.

7 to 9, all of the semiconductor packages 10 may be placed on the buffer table 20, and the semiconductor packages 10 may be dried on the buffer table 20. At this time, the semiconductor packages 10 may be arranged in a plurality of rows and columns. Although not shown, the dried semiconductor packages 10 can be inspected by an inspecting device (not shown), and then the inverted tables 30, 32 or the pallet table Lt; / RTI >

For example, as shown in FIG. 8, some of the semiconductor packages 10A may be transferred onto the first reversal table 30 or the first pallet table, 10B can be transferred onto the second inversion table 32 or the second pallet table. Particularly, the semiconductor packages 10A and the remaining semiconductor packages 10B are arranged on the first and second reversing tables 10A and 10B so that the semiconductor packages 10A and 10B are arranged in a zigzag manner in the row direction and the column direction. 30, 32) or first and second pallet tables, respectively.

On the other hand, in order to lower the semiconductor packages 10A and the remaining semiconductor packages 10B into the first and second reversal tables 30 and 32 or the first and second palette tables, 1 and the second inner spaces 232, 234, respectively. At this time, the sucked water can be discharged from the first and second inner spaces 232 and 234 through the first and second check valves 246 and 248, and the first and second inverting First and second containers (not shown) for receiving the water discharged from the first and second internal spaces 232, 234 adjacent to the tables 30, 32 or the first and second pallet tables, Respectively.

According to the embodiments of the present invention as described above, the semiconductor package pick-up apparatus 100 includes a vacuum panel (not shown) having vacuum holes 112 for vacuum-adsorbing the individual semiconductor packages 10 through the cutting process And a vacuum chamber 120 disposed on the vacuum panel 110 and having an internal space 122 connected to the vacuum holes 112. Particularly, a nozzle 130 connected to the vacuum holes 112 and protruding from the bottom surface of the inner space 122 may be provided on the bottom surface of the inner space 120.

Thus, the water sucked through the vacuum holes 112 and the nozzle 130 while picking up the individualized semiconductor packages 10 and while cleaning the semiconductor packages 10 is separated from the internal space 122 ). ≪ / RTI > Particularly, since the nozzle 130 protrudes from the bottom surface of the inner space 122, the buffer table 20 can be opened while the suctioned water drops the semiconductor packages 10 on the buffer table 20, Lt; / RTI > As a result, the time required to dry the semiconductor packages 10 on the buffer table 20 can be greatly shortened.

A check valve 132 connected to the internal space 122 may be mounted on the side surface of the vacuum chamber 120 and the sucked water may be discharged to the outside through the check valve 132 . Therefore, the corrosion by the inhaled water can be greatly reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: semiconductor package 20: buffer table
100: semiconductor package pickup device 110: vacuum panel
112: first vacuum hole 114: second vacuum hole
116: Vacuum channel 120: Vacuum chamber
122: inner space 124: upper panel
126: lower panel 128: connecting member
130: nozzle 132: check valve
134: channel

Claims (12)

A vacuum panel having vacuum holes for vacuum-adsorbing individualized semiconductor packages through a cutting process; And
And a vacuum chamber disposed on the vacuum panel and having an inner space connected to the vacuum holes,
A nozzle connected to the vacuum holes and protruding from a bottom surface of the inner space, the vacuum hole being connected to the inner space, And the liquid material sucked into the inner space through the vacuum holes and the nozzle is discharged to the outside through the check valve. The vacuum cleaner according to claim 1, wherein the vacuum holes are formed on a lower surface of the vacuum panel, a second vacuum hole is formed on an upper surface of the vacuum panel to be connected to the nozzle, And a vacuum passage connecting the first vacuum hole and the second vacuum hole. 2. The semiconductor package pick-up apparatus of claim 1, wherein the vacuum chamber includes an upper panel and a lower panel coupled to each other, and the lower panel includes a recess for forming the inner space. The vacuum cleaner according to claim 1, wherein the vacuum chamber comprises a vacuum source for providing a vacuum in the inner space for vacuum adsorption of the semiconductor packages, and an air source for supplying air to the inner space for lowering the semiconductor packages on the table. Is connected to the semiconductor package. delete The apparatus of claim 1, wherein a channel connected to the check valve is formed on a bottom surface of the inner space to discharge the liquid material. The vacuum cleaner according to claim 1,
A base panel having the vacuum holes formed therein; And
And an adsorption pad attached to a lower portion of the base panel and connected to the vacuum holes and having third vacuum holes for vacuum adsorption of the semiconductor packages. A vacuum panel having first vacuum holes for vacuum-adsorbing some of the individual semiconductor packages through the cutting process and second vacuum holes for adsorbing the remaining semiconductor packages; And
And a vacuum chamber disposed on the vacuum panel and having a first inner space connected to the first vacuum holes and a second inner space connected to the second vacuum holes,
A first nozzle connected to the first vacuum holes and the first inner space and protruding from a bottom surface of the first inner space is provided on a bottom surface of the first inner space, A second nozzle connected to the second vacuum holes and the second inner space and protruding from a bottom surface of the second inner space,
A first check valve and a second check valve connected to the first inner space and the second inner space, respectively, are mounted on the side surfaces of the vacuum chamber, and the first and second vacuum holes and the first and second And the liquid material sucked into the first and second inner spaces through the nozzles is discharged to the outside through the first and second check valves. The vacuum cleaner according to claim 8, wherein the first vacuum holes and the second vacuum holes are formed on a lower surface of the vacuum panel, and the upper surface of the vacuum panel is provided with a third A vacuum hole and a fourth vacuum hole are formed in the vacuum chamber, a first vacuum passage connecting the first vacuum holes and the third vacuum hole, and a second vacuum hole connecting the second vacuum holes and the fourth vacuum hole, And a second vacuum path for connecting the semiconductor package to the semiconductor package. delete The liquid container according to claim 8, wherein a first channel and a second channel are connected to the first and second check valves, respectively, for discharging the liquid material on the bottom surfaces of the first and second inner spaces Up device. The vacuum cleaner according to claim 8,
A base panel having the first and second vacuum holes formed therein; And
And an adsorption pad attached to a lower portion of the base panel and connected to the first vacuum holes and the second vacuum holes and having fifth vacuum holes and sixth vacuum holes for vacuum adsorption of the semiconductor packages, And a semiconductor package.
KR1020150068763A 2015-05-18 2015-05-18 Apparatus for picking up semiconductor packages KR101684785B1 (en)

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KR100604098B1 (en) * 2005-04-20 2006-07-24 한미반도체 주식회사 Semiconductor package pickup apparatus
KR101281495B1 (en) 2013-04-05 2013-07-17 주식회사 한택 Sorting table and singulation apparatus using the sorting table

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Publication number Priority date Publication date Assignee Title
KR100604098B1 (en) * 2005-04-20 2006-07-24 한미반도체 주식회사 Semiconductor package pickup apparatus
KR101281495B1 (en) 2013-04-05 2013-07-17 주식회사 한택 Sorting table and singulation apparatus using the sorting table

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