KR101046381B1 - Die pickup device and semiconductor chip separation method using same - Google Patents

Abstract

A die pick-up apparatus according to an embodiment of the present invention is a die pick-up apparatus for separating a semiconductor chip attached and attached to a mount tape for a die attach from the mount tape. A plurality of vacuum holes are provided on an upper surface of the die pick-up apparatus. A dome having an extension portion open at an upper surface thereof; A support disposed in the extension of the dome; A plate spring disposed integrally between the support and the dome inner surface and on the support, the plate spring extending outwardly of the support such that an edge portion of the portion disposed on the support is disposed on the vacuum hole; A holder disposed up and down inside the dome; And an eject plate attached to the holder to be disposed below the extended portion of the plate spring, the eject plate serving to push up the extended edge portion of the plate spring by lifting the holder.

Description

Die pick-up apparatus and semiconductor chip separation method using the same {Equipment for die pick up and method for detatching of semiconductor chip using the same}

The present invention relates to a die pick-up apparatus and a semiconductor chip separation method using the same, and more particularly, a die pick-up apparatus and a semiconductor chip using the same, which can separate a semiconductor chip cut by a sawing process from a mounting tape without damage such as cracks. To a separation method.

In the semiconductor manufacturing process, a process of cutting several semiconductor chips integrally attached to a wafer at a chip level is called a sawing process. A mounting tape for fixing the semiconductor chips to be cut is attached to the lower surface of the wafer for the sawing process. do.

Each semiconductor chip separated at the chip level through the sawing process is introduced into a die attah process, and in the die attach process, a needle type device or a needle using an ejection means such as an eject pin. Each semiconductor chip is separated from the mounting tape using a needleless device. Then, the separated semiconductor chips are transferred to an electrical connection means such as a substrate and a lead frame by using a pickup means using a vacuum suction method.

1A to 1B are cross-sectional views illustrating a conventional die pickup apparatus and a method of separating a semiconductor chip using the same.

As shown in the drawing, the conventional needle type die pick-up apparatus 100 includes a dome 120, a holder 130, and an eject pin 132.

The dome 120 is a portion forming the outline of the die pick-up apparatus 100, and a vacuum hole through which the mount tape 112 under the semiconductor chips 110 disposed above is sucked with a vacuum and the eject pin 132 passes. (122).

The holder 130 serves to separate the semiconductor chip 110 from the mount tape 122 by raising the eject pin 132 as a part supporting the eject pin 132.

In the method of separating the semiconductor chip 110 using the die pick-up apparatus 100, first, the sawing process is completed, and the semiconductor chip 110 to be detached attached to the mounting tape 112 for die attach is described. It is disposed above the vacuum hole 122 of the dome 120. Then, a vacuum is formed inside the dome 120 to adsorb and process the lower mount tape 110 of the target semiconductor chip 110, and the holder 130 disposed inside the dome 120 is lifted. The semiconductor chip 110 is separated from the mounting tape by pushing the target semiconductor chip 110 onto the eject pin 132 passing through the vacuum hole 122.

However, most of the mounting tapes attached on the wafer to fix the semiconductor chips have a strong adhesive force due to their characteristics, and the edges of the semiconductor chips are strongly adhered to the mounting tape by heat during cutting into the individual semiconductor chips. . For this reason, even if the needle type ejection means is effectively used, there is a problem in that damage such as semiconductor chip crack cannot be completely excluded because it does not fall well when the semiconductor chip is separated.

In addition, when the mounting tape having a weak adhesive force is used for easy separation of the semiconductor chip, many problems occur in a sawing process or the like.

Accordingly, by irradiating the wafer with the mounting tape with ultraviolet rays, the adhesive force of the mounting tape attached to the wafer is weakened, so that the semiconductor chip can be easily detached from the mounting tape during separation of the semiconductor chip, thereby cracking the semiconductor chip. UV (ultraviolet) irradiation device has been used to prevent the back damage occurs.

However, in recent years, the need for a thin die has emerged, and as a result, the wafer has progressed to be thinned to a thickness of 100 μm or less. Even if the adhesion between the mounting tape is weak, the semiconductor chip having a thin thickness is not easy to separate.

In other words, when a semiconductor chip having a thin thickness is pushed up to an eject pin, a hole or a crack is generated in the semiconductor chip before the semiconductor chip and the mounting tape are separated because the semiconductor chip does not overcome the stress concentration caused by the eject pin. Damage such as cracking of the semiconductor chip occurs.

The present invention provides a die pick-up apparatus capable of separating a semiconductor chip cut by a sawing process from a mount tape without damage such as cracks, and a semiconductor chip separation method using the same.

A die pick-up apparatus according to an embodiment of the present invention is a die pick-up apparatus for separating a semiconductor chip attached and attached to a mount tape for a die attach from the mount tape. A plurality of vacuum holes are provided on an upper surface of the die pick-up apparatus. A dome having an extension portion open at an upper surface thereof; A support disposed in the extension of the dome; A plate spring disposed integrally between the support and the dome inner surface and on the support, the plate spring extending outwardly of the support such that an edge portion of the portion disposed on the support is disposed on the vacuum hole; A holder disposed up and down inside the dome; And an eject plate attached to the holder to be disposed below the extended portion of the plate spring, the eject plate serving to push up the extended edge portion of the plate spring by lifting the holder.

An extended plate spring portion on the support has a width corresponding to the semiconductor chip.

The support has a cuboid shape.

And a heating device attached to the dome and applying heat to the dome.

It further comprises a pressure gauge disposed in the holder.

In addition, the semiconductor chip separation method using the die pick-up apparatus according to an embodiment of the present invention, the semiconductor chip is disposed on the support, and the mounting tape under the semiconductor chip to a vacuum through the vacuum hole of the dome Fixing; Lifting the holder to push up a plate spring edge on the support with an eject plate attached to the holder; And separating the semiconductor chip from the mount tape by moving the semiconductor chip in the vacuum hole direction and simultaneously fixing the mount tape with the vacuum.

In addition, the die pick-up apparatus according to the embodiment of the present invention is a die pick-up apparatus for separating a semiconductor chip attached and attached to a mount tape for die attach from the mount tape, the dome having a plurality of vacuum holes on the upper surface thereof. ; One side portion of the dome and integrally disposed on the dome, the portion disposed on the dome has a comb shape including a plurality of comb portions and connecting portions connecting the comb portions, the edge portion of each comb portion A plate spring disposed on the vacuum hole; A holder disposed up and down inside the dome; And detachably attached to the holder portion at a position corresponding to each comb edge portion of the plate spring, and serve to individually push up each comb edge portion of the plate spring by lifting and lowering the holder. It includes an eject pin.

The plate spring is attached to one side portion of the dome as a fixing device.

The comb portion is composed of 15 to 20 pieces.

The comb portions are spaced apart at intervals of 0.1 to 0.2 mm, and each comb portion has a width of 0.8 to 0.9 mm.

The comb portions are spaced apart at intervals of 0.1 to 0.2 mm, one comb portion disposed at the center portion has a width of 0.13 to 0.14 mm, and the remaining comb portions have a width of 0.8 to 0.9 mm.

The holder has a multilayer structure of an upper holder and a lower holder, to which magnetic force is applied and disposed above.

The eject pin is magnetically attached to the holder.

And a heating device attached to the dome and applying heat to the dome.

It further comprises a pressure gauge disposed in the holder.

In the semiconductor chip separation method using the die pick-up apparatus according to the embodiment of the present invention, the semiconductor chip is disposed on the dome, and the mounting tape under the semiconductor chip is vacuumed through the vacuum hole of the dome. Fixing; Lifting the holder to push edges of the combs on the corresponding dome with respective eject pins attached to the holder; And separating the semiconductor chip from the mount tape by moving the semiconductor chip in the vacuum hole direction and simultaneously fixing the mount tape with the vacuum.

In addition, the die pick-up apparatus according to an embodiment of the present invention is a die pick-up apparatus for separating a semiconductor chip attached and attached to a mounting tape for die attach from the mount tape, the dome having a plurality of vacuum holes on the upper surface thereof. ; A holder disposed up and down inside the dome; An eject pin attached to the holder; And a pressure gauge connected to the eject pin, the pressure gauge measuring the pressure applied by the eject pin to the mount tape.

The present invention performs the semiconductor chip separation from the mounting tape in a line contact manner using a plate such as a plate spring, rather than a point contact method such as eject pins, thereby dispersing the stress concentration applied to the semiconductor chip when the semiconductor chip is separated. The stress on the chip can be minimized so that a thin semiconductor chip can be separated from the mount tape without cracking and damage.

In addition, the edge portion of the plate spring in contact with the mounting tape disposed on the lower surface of the semiconductor chip in the form of a plurality of combs and can be used by selectively raising only the comb portion required according to the size of the semiconductor chip for separation It can be used without limitation on the size of the chip.

In addition, by using a heating device and a pressure gauge together in the die pick-up device, the semiconductor chip can be easily separated from the mounting tape, and damage including cracks occurring in the semiconductor chip can be prevented.

In addition, it is possible to utilize the equipment used for the detachment of the conventional semiconductor chip for the thin semiconductor chip can reduce the manufacturing cost.

Hereinafter, a semiconductor chip detaching method using a die pick-up apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to the following embodiments, and is generally used in the art. Those skilled in the art can implement the semiconductor chip separation method using the die pickup apparatus according to the present invention in various other forms without departing from the technical spirit of the present invention.

The present invention is to separate the semiconductor chip from the mounting tape using a plate-shaped plate spring in order to prevent problems such as cracks of the semiconductor chip generated in the process of separating the semiconductor chip having a thin thickness from the mounting tape. .

In detail, the present invention provides a plate spring or a comb-shaped plate spring on the top surface of the dome and an eject plate or an eject pin to lift and push up the edge portion of the plate spring to separate the semiconductor chip from the mounting tape. Configure the die pickup device.

Then, the semiconductor chip attached to the mounting tape is disposed on the upper part of the dome, and when the semiconductor chip to pass through the upper portion of the plate spring while the edge of the plate spring is pushed up, By virtue of the edge height and the dome vacuum adsorbing the mounting tape, the lower portion of the semiconductor chip is sequentially in linear contact with the plate spring, thereby separating the semiconductor chip from the mounting tape.

Therefore, when the semiconductor chip is separated, it is performed by the line contact method such as the plate spring, rather than the point contact method such as the eject pin, to minimize the stress applied to the semiconductor chip by dispersing the stress concentration applied to the semiconductor chip when the semiconductor chip is separated. The semiconductor chip having a thin thickness can be separated from the mount tape without cracking and damage.

In addition, the edge portion of the plate spring in contact with the mounting tape disposed on the lower surface of the semiconductor chip in the form of a plurality of combs and can be used by selectively raising only the comb portion required according to the size of the semiconductor chip for separation It can be used without limitation on the size of the chip.

In addition, it is possible to utilize the equipment used for the detachment of the conventional semiconductor chip for the thin semiconductor chip can reduce the manufacturing cost.

Hereinafter, a die pick-up apparatus and a method of separating a semiconductor chip using the same according to an embodiment of the present invention will be described in detail.

2 is a cross-sectional view showing a die pick-up apparatus according to the first embodiment of the present invention.

As shown, the die pick-up apparatus 200 according to the first embodiment of the present invention is the dome 220, the support 252, the plate spring 250, the eject plate 240, the eject plate 240 It comprises a holder 230 for supporting.

The dome 220 forms an outer shape of the die pick-up apparatus 200, and has a vacuum hole 222 formed to suck a mount tape under the semiconductor chips disposed thereon with a vacuum, and has an upper surface open at an upper end of a side surface thereof. Have wealth

The support 252 is disposed in the extension portion, has a rectangular parallelepiped shape, and serves to fix the plate spring 250.

The plate spring 250 is integrally disposed between the support 252 and the inner surface of the dome 220 and on the support 252, ie, bent to surround one side and the upper surface of the support 252. It is formed in the form of a plate, the portion disposed on the support 252 is disposed to be parallel to the upper surface of the dome 220. The portion of the plate spring 250 disposed above the support 252 is not attached to the support 252, and an edge portion of the portion disposed above the support 252 is disposed on the vacuum hole 222. It extends outside the support 252 to be disposed. The edge portion of the extended plate spring 250 has a size corresponding to that of the semiconductor chip disposed for detachment, that is, a width in a direction perpendicular to the moving direction of the semiconductor chip or the die pick-up apparatus 200 corresponds to the semiconductor chip. It has a width.

The holder 230 is disposed to move up and down inside the dome 220.

The eject plate 240 is attached to the side of the holder 230 to be disposed below the extended portion of the plate spring 250, the extension of the plate spring 250 by the lifting of the holder 230 It pushes up the edges.

3A to 3B are cross-sectional views illustrating processes for separating a semiconductor chip using the die pick-up apparatus according to the first embodiment of the present invention.

Referring to FIG. 3A, a mounting tape 212 is attached to a lower portion of the die attach to place the transferred semiconductor chip 210 on the support 250. At this time, the mounting tape 212 below the semiconductor chip 210 to be detached is fixed to a vacuum through the vacuum hole 222 of the dome 220.

Then, the holder 230, which is disposed inside the dome 220 and is attached to the eject plate 240, is lifted to push up the edge portion of the plate spring 250 disposed on the support 252.

Referring to FIG. 3B, the semiconductor chip 210 is moved in the direction of the vacuum hole 222 so that the mounting tape 212 attached to the lower surface of the semiconductor chip 210 is detached. At this time, the mounting tape 212 attached to the lower surface of the semiconductor chip 210 by the movement is sequentially attached to the upper portion of the dome 220 by vacuum through the vacuum hole 222, thereby, the semiconductor As the chip 210 moves, the semiconductor chip 210 is gradually separated from the mounting tape 212.

Thereafter, although not shown, the detached semiconductor chip is transferred using a pickup device, and the holder is lowered.

Meanwhile, the die pick-up apparatus according to the present invention may form a plate spring provided in the die pick-up apparatus in the form of a comb to separate the semiconductor chip from the mounting tape regardless of the size of the semiconductor chip.

4 is a cross-sectional view showing a die pick-up apparatus according to a second embodiment of the present invention, and FIGS. 5A and 5B are plan views showing plate springs used in the second embodiment of the present invention.

As shown, the die pick-up apparatus 300 according to the second embodiment of the present invention includes a dome 320, a plate spring 350a, an eject pin 332, and upper and lower holders 370 and 330. It is done by

The dome 320 forms an outer shape of the die pick-up apparatus 300 and includes a plurality of vacuum holes 322 that suction the mount tape under the semiconductor chips disposed above.

The plate spring 350a is disposed in a shape to be bent so as to surround one side and an upper surface of the dome 320 integrally on one side portion of the dome 320 and the dome 320. One side portion is attached with a fastener 360 such as a screw. A portion of the plate spring 250 disposed above the dome 320 is not attached to the dome 320, and an edge portion thereof is disposed above the vacuum hole 322 of one of the plurality of vacuum holes.

As shown in FIGS. 5A and 5B, the plate spring 350a has a portion disposed on the dome 320 connecting a plurality of comb portions 380 and the comb portions 380. ) Has a comb shape.

The comb portion 380 is composed of 15 to 20, as shown in Figure 5a, is spaced apart at intervals of 0.1 to 0.2mm, each comb portion 380 has a width of 0.8 ~ 0.9mm, For example, when the comb part 380 is formed of 16 pieces, as shown in FIG. 5B, the comb part 380a is spaced apart at intervals of 0.1 to 0.2 mm, and one comb part 380a disposed at the center part is 0.13˜. It has a width of 0.14mm, the remaining comb portion 380b has a width of 0.8 ~ 0.9mm. This is to correspond to a semiconductor chip having a width of 1 mm to 20 mm in units of about 1 mm or 0.5 mm depending on the size of the semiconductor chip to be separated.
On the other hand, the reference numeral 380a refers to the comb teeth disposed at the center of the comb part 380 consisting of sixteen, for example, the eighth comb part 380a. The remaining comb portions 380b other than the portion 380a are referred to. As shown in FIG. 5B, the comb portion 380 is disposed at the center portion, and the remaining comb portion 380b other than the comb portion 380a corresponding to the eighth and the comb portion 380a corresponding to the eighth. It includes.

The holder 330 is disposed to move up and down inside the dome 320, and has a multilayer structure of an upper holder 370 and a lower holder 330 that are applied with a magnetic force and are disposed thereon.

The eject pin 332 is arranged to be detachably detached by magnetic force to a portion of the upper holder 370 corresponding to an edge portion of each extended comb portion 380 of the plate spring 350, and the lower portion By lifting the holder 330, the edge portions of the comb portions 380 of the plate spring 350 are individually pushed up.

6A to 6B are cross-sectional views illustrating processes for separating a semiconductor chip using the die pick-up apparatus according to the second embodiment of the present invention.

Referring to FIG. 6A, a mounting tape 312 is attached to a lower portion of the die attach to place the transferred semiconductor chip 310 on the dome 320. In this case, the mounting tape 312 below the semiconductor chip 310 to be detached is fixed to a vacuum through the vacuum hole 322 of the dome 320.

Then, the upper and lower holders 370 and 330 disposed inside the dome 320 and attached with a plurality of eject pins 332 are lifted to each eject pin 332 attached to the holder. The edges of the comb portions (not shown) of the corresponding plate spring 350a are pushed up.

Referring to FIG. 6B, the semiconductor chip 310 is moved in the direction of the vacuum hole 222 so that the mounting tape 312 attached to the lower surface of the semiconductor chip 310 is detached. At this time, the mount tape 312 attached to the lower surface of the semiconductor chip 310 by the movement is attached to the upper portion of the dome 320 by vacuum through the vacuum hole 322 in sequence, As the semiconductor chip 310 moves, the semiconductor chip 310 is gradually separated from the mounting tape 312.

Thereafter, although not shown, the detached semiconductor chip is transferred using a pickup device, and the holder is lowered.

7A and 7B are cross-sectional views for explaining the die pick-up apparatus according to the third embodiment of the present invention.

7A and 7B include substantially the same components as the die pick-up apparatus shown and described above in FIG. 4. Therefore, duplicate descriptions of the same components will be omitted, and the same components and the same reference numerals will be given to the same components.

Referring to FIG. 7A, in the die pick-up apparatus 300 according to the present invention, a heating device 392 is attached to an outer surface of a dome 320 forming an external shape, and the heating device 392 is attached to the dome 320. It is a device which directly heats 50 degreeC-60 degreeC heat to the dome 320.

In detail, referring to FIG. 7B, the column applies heat to the mount tape from the dome 320, and the mount tape 312 becomes ductile due to the heat, so that the semiconductor chip 310 is easily separated from the mount tape 312. do.

That is, when the semiconductor chips 310 attached to the mounting tape 312 pass on the dome 320 heated by the heating device 392, the eject pins are raised by the rise of the upper holder 370 and the lower holder 330. 332 pushes the plate spring 350a to separate the semiconductor chip 310 to be separated from the mounting tape 312.

At this time, the semiconductor chip 320 adjacent to the semiconductor chip 310 by the separation target semiconductor chip 310 pushed up by the plate spring 350a has a portion of an edge close to the separation semiconductor chip 310. As the ductility of the 312 is increased, the upper surface of the dome 320 is closely attached to the upper surface of the dome 320 without being pushed along the separation target semiconductor chip 310.

Therefore, when the ductility of the mounting tape 312 is weak, a portion of the edge of the semiconductor chip disposed adjacent to the separation target semiconductor chip 310 is pushed up along the mounting tape 312 so that cracks generated by the step are not generated. Do not.

8 is a cross-sectional view for explaining a die pick-up apparatus according to a fourth embodiment of the present invention.

FIG. 8 includes substantially the same components as the die pick-up apparatus shown and described above in FIG. 4. Therefore, duplicate descriptions of the same components will be omitted, and the same components and the same reference numerals will be given to the same components.

Referring to FIG. 8, the die pickup apparatus 300 according to the present invention includes a dome 320, a holder 330, an eject pin 332, and a pressure gauge 390.

The eject pin 332 extends and extends into the upper and lower holders 370 and 330, and is attached to the eject pin support 334 disposed in the upper and lower holders 370 and 330.

The pressure gauge 390 is disposed inside the upper and lower holders 370 and 330 and is connected to the eject pin support 334. The pressure gauge 390 may measure pressure in grams, and measure the pressure when the plate spring 350a is pushed up by the eject pin 332 to separate the semiconductor chip from the mount tape.

In detail, when the semiconductor chip is separated from the mount tape by using the eject pin 332, cracking may occur in the semiconductor chip due to a thin thickness of the semiconductor chip, but may occur due to an adhesion problem of the mount tape. Can be.

The mount tape has a property value related to the adhesive force for whether the semiconductor chip is separated from the mount tape when a certain pressure is applied for each product, and the property value related to the adhesive force controls the pressure gauge 390. It is input to an external device (not shown).

Accordingly, when the semiconductor chip is separated by the eject pin 332, the semiconductor chip may be measured by measuring the pressure applied by the eject pin 332 by the pressure gauge 390 and applying a pressure higher than a property value related to a predetermined adhesive force. If it is not separated from the mount tape, the rise of the eject pin 332 is stopped to prevent breakage including cracks in the semiconductor chip.

As described above, the present invention is carried out by a line contact method such as a plate spring, rather than a point contact method such as eject pins when separating the semiconductor chip from the mounting tape to disperse the stress concentration applied to the semiconductor chip when the semiconductor chip is separated The stress on the semiconductor chip can be minimized so that the semiconductor chip having a thin thickness can be separated from the mounting tape without cracking and damage.

In addition, the edge portion of the plate spring in contact with the mounting tape disposed on the lower surface of the semiconductor chip in the form of a plurality of combs and can be used by selectively raising only the comb portion required according to the size of the semiconductor chip for separation It can be used without limitation on the size of the chip.

In addition, by using a heating device and a pressure gauge together in the die pick-up device, the semiconductor chip can be easily separated from the mounting tape, and damage including cracks occurring in the semiconductor chip can be prevented.

As mentioned above, although the present invention has been illustrated and described with reference to specific embodiments, the present invention is not limited thereto, and the following claims are not limited to the scope of the present invention without departing from the spirit and scope of the present invention. It can be easily understood by those skilled in the art that can be modified and modified.

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1A to 1B are cross-sectional views illustrating a conventional die pickup apparatus and a method of separating a semiconductor chip using the same.
Fig. 2 is a sectional view showing the die pick-up apparatus according to the first embodiment of the present invention.

3A to 3B are cross-sectional views illustrating processes for separating a semiconductor chip using the die pick-up apparatus according to the first embodiment of the present invention.

4 is a sectional view showing a die pick-up apparatus according to a second embodiment of the present invention.

5A to 5B are plan views showing plate springs used in the second embodiment of the present invention.

6A to 6B are cross-sectional views illustrating processes for separating a semiconductor chip using the die pick-up apparatus according to the second embodiment of the present invention.

7A and 7B are cross-sectional views for explaining a die pick-up apparatus according to a third embodiment of the present invention.

8 is a cross-sectional view for explaining a die pick-up apparatus according to a fourth embodiment of the present invention.

Claims (16)

A die pick-up apparatus for separating a semiconductor chip transferred from a mount tape attached to a mount tape for a die attach, A dome having a plurality of vacuum holes provided at an upper surface thereof and having an extension portion at which an upper surface thereof is opened at an upper end portion of the side surface; A support disposed in the extension of the dome; A plate spring disposed integrally between the support and the dome inner surface and on the support, the plate spring extending outwardly of the support such that an edge portion of the portion disposed on the support is disposed on the vacuum hole; A holder disposed up and down inside the dome; And An eject plate attached to the holder to be disposed below the extended portion of the plate spring, the eject plate serving to push up the extended edge portion of the plate spring by lifting the holder; Die pickup apparatus comprising a. Claim 2 has been abandoned due to the setting registration fee. The method of claim 1, The extended plate spring portion on the support has a width corresponding to the semiconductor chip. Claim 3 was abandoned when the setup registration fee was paid. And said support has a rectangular parallelepiped shape. Claim 4 was abandoned when the registration fee was paid. The method of claim 1, And a heating device attached to the dome and applying heat to the dome. Claim 5 was abandoned upon payment of a set-up fee. The method of claim 1, And a pressure gauge disposed in said holder. Claim 6 was abandoned when the registration fee was paid. A semiconductor chip separation method using a die pick-up device having the configuration of claim 1, Placing the semiconductor chip on the support and fixing the mounting tape under the semiconductor chip to a vacuum through the vacuum hole of the dome; Lifting the holder to push up a plate spring edge on the support with an eject plate attached to the holder; And Moving the semiconductor chip in the vacuum hole direction and simultaneously fixing the mount tape with the vacuum to separate the semiconductor chip from the mount tape; Claim 7 was abandoned upon payment of a set-up fee. A die pick-up apparatus for separating a semiconductor chip transferred from a mount tape attached to a mount tape for a die attach, A dome having a plurality of vacuum holes on the upper surface thereof; One side portion of the dome and integrally disposed on the dome, the portion disposed on the dome has a comb shape including a plurality of comb portions and connecting portions connecting the comb portions, the edge portion of each comb portion A plate spring disposed on the vacuum hole; A holder disposed up and down inside the dome; And An ejector arranged to be detachably attached to the holder portion at a position corresponding to each comb edge portion of the plate spring, and an ejector serving to individually push up each comb edge portion of the plate spring by lifting and lowering of the holder; Pin; Die pickup apparatus comprising a. Claim 8 was abandoned when the registration fee was paid. The method of claim 7, wherein And the plate spring is attached to one side portion of the dome as a fixing device. Claim 9 was abandoned upon payment of a set-up fee. The method of claim 7, wherein The die pick-up device, characterized in that the comb portion consisting of 15 to 20 pieces. Claim 10 was abandoned upon payment of a setup registration fee. The method of claim 9, The comb portions are spaced apart at intervals of 0.1 to 0.2mm, each comb portion has a width of 0.8 ~ 0.9mm. Claim 11 was abandoned upon payment of a setup registration fee. The method of claim 9, The comb portions are spaced apart at intervals of 0.1 to 0.2 mm, one comb portion disposed at the center portion has a width of 0.13 to 0.14 mm, and the remaining comb portions have a width of 0.8 to 0.9 mm. Device. Claim 12 was abandoned upon payment of a registration fee. The method of claim 7, wherein The holder is a die pick-up device, characterized in that consisting of a multi-layer structure of the upper holder and the lower holder is applied to the magnetic force and disposed above. Claim 13 was abandoned upon payment of a registration fee. 13. The method of claim 12, And said eject pin is magnetically attached to said upper holder. Claim 14 was abandoned when the registration fee was paid. The method of claim 7, wherein And a heating device attached to the dome and applying heat to the dome. Claim 15 was abandoned upon payment of a registration fee. The method of claim 7, wherein And a pressure gauge disposed in said holder. Claim 16 was abandoned upon payment of a setup registration fee. A semiconductor chip separation method using a die pick-up device having the structure of claim 7, Placing the semiconductor chip on the dome and fixing the mounting tape under the semiconductor chip to a vacuum through the vacuum hole of the dome; Lifting the holder to push edges of the combs on the corresponding dome with respective eject pins attached to the holder; And Moving the semiconductor chip in the vacuum hole direction and simultaneously fixing the mount tape with the vacuum to separate the semiconductor chip from the mount tape; A semiconductor chip separation method using a die pick-up device, characterized in that it comprises.

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