JP4369298B2 - DIE PICKUP DEVICE AND DIE PICKUP METHOD - Google Patents

Description

The present invention relates to a die pick-up apparatus and a die pick-up method for picking up a die attached to a wafer sheet by peeling it from the wafer sheet with a collet.

  As a pick-up device for a die attached to a wafer sheet, a push-up member method shown in Patent Document 1 is generally performed. However, this apparatus has a problem that the die is damaged when the thickness of the die is as small as about 100 μm or less.

  As an improvement measure, for example, Patent Document 2 is cited as a method of picking up a die from a wafer sheet without using a push-up member. In this apparatus, with the die held by the collet, the suction stage is moved on a horizontal plane while sucking the wafer sheet (adhesive sheet) to which the die is attached by the suction stage, and then the collet is moved from the wafer sheet to the Pick up the die.

JP-A-3-229441 JP 2001-118862 A (Patent No. 3209736)

  Japanese Patent Application Laid-Open No. H10-228561 has an advantage that there is almost no die pick-up mistake, although there is a problem of damaging the die. In Patent Document 2, die breakage does not occur. However, the attached wafer sheet and die are held by vacuum suction of the suction stage and collet, respectively, and both are peeled off by moving the suction stage horizontally, so it is necessary to increase the suction force, which adversely affects the die. There was a problem of giving.

An object of the present invention is to provide a die pick- up apparatus and a die pick-up method that can reliably pick up a die without damaging the die even if a die push-up member is used.

According to a first aspect of the present invention for solving the above-described problems, a suction stage for sucking and holding a wafer sheet to which a die is attached is attached, and a die push-up member for picking up the die that is disposed in the suction stage and pushes up the die. In the die pick-up device provided with a collet that sucks and holds the die pushed up by the die pushing-up member for pickup,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down . in a state where the vacuum of the stage is turned on, after the die end of the feeding direction side of the die to be picked up is positioned above the die push-up member for the die peeling, said through suction holes of the upper surface of the front Symbol adsorption stage After the die push-up member for die peeling is raised and the die end on the die feeding direction side is peeled off from the wafer sheet, after that, the die push-up member for die peeling is sent in the feed direction while being raised , The die push-up member for peeling the die was lowered through the suction hole to be separated from the wafer sheet, and the collet was lowered to a position where the die was sucked. , It pushes up the die die push-up member for the pickup rises and collet after totally is peeled one die by vacuum suction die, characterized in that to pick up.

A second aspect of the present invention for solving the above-described problems includes a suction stage for sucking and holding a wafer sheet to which a die is attached, and a die push-up member for pickup that is disposed in the suction stage and pushes up the die. In the die pick-up device provided with a collet that sucks and holds the die pushed up by the die pushing-up member for pickup,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down . With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for die peeling, and then the die push-up member for die peeling is raised Then, the die end on the die feeding direction side is peeled off from the wafer sheet, and then the die push-up member for lowering the die is lowered and then the die is sent in the feeding direction to lower the collet to a position where the die is adsorbed. and then, push up the die die push-up member for the pickup rises, the collet part one die by vacuum suction die After totally is peeled, characterized in that to pick up.

According to a third aspect of the present invention for solving the above problems, a suction stage for sucking and holding a wafer sheet to which a die is attached, a die push- up member that is disposed in a pickup center in the suction stage and pushes up the die , In a die pick-up device comprising a collet that sucks and holds the die pushed up by this die pushing-up member ,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member , the die push-up member descends, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the die end portion is positioned above the die push-up member , the die push-up member is raised through the suction hole to peel the die end portion on the die feeding direction side from the wafer sheet, and the die push-up member is raised. After moving one die over the die push-up member , the one die is sent to the pickup center, and then the die push-up member is lowered through the suction hole to be separated from the wafer sheet. After the die is lowered to the position where the die is sucked, the die push-up member rises and pushes up the die, and the collet sucks the die. Characterized in that to pick up the die by.

According to a fourth aspect of the present invention for solving the above problems, a suction stage that sucks and holds a wafer sheet to which a die is attached, a die push- up member that is disposed in a pickup center in the suction stage and pushes up the die , In a die pick-up device comprising a collet that sucks and holds the die pushed up by this die pushing-up member ,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member , the die push-up member descends, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the die end portion is positioned above the die push-up member , the die push-up member is raised to peel off the die end portion on the die feed direction side from the wafer sheet, and the die push-up member is lowered, After the die end on the feed direction side is positioned above the suction hole, the die is sent to the pickup center and the collet is lowered to a position where the die is adsorbed. The collet is pushed up and picked up by vacuum-sucking the die .

Claim 5 of the present invention for solving the foregoing problem resides in that in any of claims 1 to 4, the die push-up member for the pickup is characterized by consisting of a plurality of lines.

According to a sixth aspect of the present invention for solving the above-mentioned problems, in any one of the first to fourth aspects, the pickup die push-up member comprises three or more, and the center die push-up member is a die push-up on both sides. It is characterized by being formed higher than the member.

A seventh aspect of the present invention for solving the above-described problems includes a suction stage for sucking and holding a wafer sheet to which a die is attached, and a die push-up member for pickup that is disposed in the suction stage and pushes up the die. In the die pick-up method using the die pick-up device provided with the collet that sucks and holds the die pushed up by the die pushing-up member for pick-up,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down. With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for peeling the die, and then the die is peeled through the suction hole on the upper surface of the suction stage. The die push-up member for the die is lifted to peel the die end on the die feed direction side from the wafer sheet, and then the die push-up member for die peeling is lifted to feed the die in the feed direction, and then the suction The die push-up member for peeling the die was lowered through the hole to move away from the wafer sheet, and the collet was lowered to the position where the die was adsorbed. , Push up the die push-up member is raised die for the pickup, after the collet fully is peeled one die by vacuum suction of the die, is picked up, the suction stage in this state The vacuum is turned on .

An eighth aspect of the present invention for solving the above-described problems includes a suction stage that sucks and holds a wafer sheet to which a die is attached, and a die push-up member for pickup that is disposed in the suction stage and pushes up the die. In the die pick-up method using the die pick-up device provided with the collet that sucks and holds the die pushed up by the die pushing-up member for pick-up,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down. With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for die peeling, and then the die push-up member for die peeling is raised. The die end on the die feeding direction side was peeled off from the wafer sheet, and then the die push-up member for peeling the die was lowered, then the die was sent in the feeding direction, and the collet was lowered to the position where the die was adsorbed Thereafter, the pick-up die push-up member rises and pushes up the die, and the collet partially or partially holds the die by vacuum suction. After totally is peeled, it is picked up, characterized in that the vacuum of the suction stage in this state is in a state of ON.

Claim 9 of the present invention for solving the above-mentioned problems is a suction stage for sucking and holding a wafer sheet to which a die is attached, and a die push-up member that is disposed in a pickup center in the suction stage and pushes up the die. In a die pick-up method using a die pick-up device provided with a collet that sucks and holds the die pushed up by this die pushing-up member,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member, the die push-up member is lowered, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the end portion is positioned above the die push-up member, the die push-up member is raised through the suction hole to peel the die end portion on the die feed direction side from the wafer sheet, and the die push-up member remains raised. After moving one die over the die push-up member, the one die is sent to the pickup center, and then the die push-up member is lowered through the suction hole to be separated from the wafer sheet. After the die is lowered to the position where it is sucked, the die push-up member rises and pushes up the die, and the collet sucks the die. Is picked up die by, characterized in that the vacuum of the suction stage in this state is in a state of ON.

A tenth aspect of the present invention for solving the above-described problems includes a suction stage that sucks and holds a wafer sheet to which a die is attached, and a die push-up member that is disposed in a pickup center in the suction stage and pushes up the die. In a die pick-up method using a die pick-up device provided with a collet that sucks and holds the die pushed up by this die pushing-up member,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member, the die push-up member is lowered, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the end is positioned above the die push-up member, the die push-up member is lifted to peel the die end on the die feed direction side from the wafer sheet, and the die push-up member is lowered and the die feed After the direction end of the die is positioned above the suction hole, the die is sent to the pickup center, the collet is lowered to a position where the die is adsorbed, and then the die push-up member is raised to push up the die. Te, the collet is picked up by vacuum suction the die, state der vacuum of the suction stage is turned on in this state It is characterized in.

The eleventh aspect of the present invention for solving the above-mentioned problems is characterized in that, in any of the seventh to tenth aspects, the pickup die push-up member comprises a plurality .

A twelfth aspect of the present invention for solving the above-mentioned problems is that in any one of the seventh to tenth aspects, the pickup die push-up member comprises three or more, and the center die push-up member is a die push-up on both sides. It is characterized by being formed higher than the member.

  Since the adhesive force between the die sent to the pickup center and the wafer sheet is reduced, the die will not be damaged even if a thin die is pushed up by the die pushing-up member.

  A first embodiment of a die pickup apparatus of the present invention will be described with reference to FIGS. As shown in FIG. 1, the outer periphery of the wafer sheet 2 to which the dies 1A, 1B, 1C... Are attached is fixed to a wafer ring (not shown). The wafer ring is fixed to a wafer support frame (not shown) driven in the XY axis direction in the planar direction. The dies 1A, 1B, 1C... Are picked up by being vacuum-sucked by the collet 4 in which the suction holes 3 are formed. Below the pickup center 5, a suction stage 10 that vacuum-sucks the wafer sheet 2 is disposed. The above is a well-known technique.

A pick-up die push-up member 21 is provided at the pickup center 5 in the suction stage 10 so as to be movable up and down. On both sides of the die push-up member 21, die push-up die push members 22 and 23 are moved up and down. These die push-up members 21, 22, and 23 are formed in a flat plate shape, and can be driven up and down independently by vertical drive means (not shown). As shown in FIG. 2, the die push-up members 21, 22, and 23 are set so that the length in the direction perpendicular to the wafer sheet feeding direction A is inside the corners of the dies 1 </ b> A, 1 </ b> B, and 1 </ b> C. It is formed slightly shorter than the length of the sides 1B and 1C. The suction stage 10 is formed with suction holes 11, 12, and 13 that also serve as the through holes of the die push-up members 21, 22, and 23 and the suction holes of the wafer sheet 2.

  Next, a die pickup method will be described. As shown in FIG. 1A, the vacuum of the suction stage 10 is turned on, and the wafer sheet 2 is fixed so that the die end on the feeding direction side of the die 1A to be picked up is positioned above the die push-up member 22. The wafer ring (not shown) is moved. Next, as shown in FIG. 1B, the die push-up member 22 is raised, and the die end portion on the feed direction side of the die 1 </ b> A is pushed up through the wafer sheet 2. As a result, the die end portion on the feed direction side of the die 1 </ b> A is peeled off from the wafer sheet 2.

  Next, as shown in FIG. 1C, the wafer sheet 2 is moved so that the die 1 </ b> A is positioned at the pickup center 5 while the die push-up member 22 is raised. When the die 1A passes above the die push-up member 22, the die 1A is fed over the peak pushed up by the die push-up member 22, so that the adhesive force between the wafer sheet 2 and the die 1A is reduced. Next, as shown in FIG. 1D, the die push-up member 22 is lowered and separated from the wafer sheet 2, and the collet 4 is lowered to a position where the die 1A is adsorbed. Subsequently, as shown in FIG. 1 (e), the die push-up member 21 rises to push up the die 1A, and the collet 4 vacuum-sucks the die 1A. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is reduced, the die 1A is easily peeled off from the wafer sheet 2 without being damaged by the rising of the die push-up member 21.

  The collet 4 picked up by vacuum-sucking the die 1A is moved up and moved in the XY-axis direction by a transfer means (not shown), and the following processes such as die bonding and die packing are performed. When the die 1A is picked up, as shown in FIG. 1 (f), the die push-up member 21 is lowered, and the die end on the feed direction side of the die 1B to be picked up next is the die push-up member as described above. The wafer sheet 2 is moved so as to be located above 22.

  Thus, since the adhesive force between the die 1A sent to the pickup center 5 and the wafer sheet 2 is reduced, even if the thin die 1A is pushed up by the die pushing member 21, the die 1A is not damaged. .

  In the above embodiment, the die push-up member 23 is not acting at all. This is because the case where the die is sent from the left side to the pickup center 5 has been described. When the die is sent to the pickup center 5 from the right side, the die push-up member 23 acts in the same manner as the above-described die push-up member 22, and the die push-up member 22 does not act at all.

  A second embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. The present embodiment is a modification of the first embodiment, in which the steps of FIGS. 1C and 1D are changed to FIGS. 3A and 3B. The other steps are the same as those in FIG. 1, and different steps will be described.

  After the process of FIG. 1A, as shown in FIG. 1B, the die push-up member 22 pushes up the die end on the feed direction side of the die 1A, and the die end on the feed direction side of the die 1A is moved to the wafer sheet. After peeling from 2, the die push-up member 22 descends as shown in FIG. Thereafter, as shown in FIG. 3B, the wafer sheet 2 is moved so that the die 1 </ b> A is positioned at the pickup center 5. As described above, since the die end portion on the feed direction side of the die 1A is peeled off from the wafer sheet 2, when the die 1A is moved as shown in FIGS. The die 1A is peeled off from the wafer sheet 2 by the vacuum suction force of 12, and the adhesive force between the wafer sheet 2 and the die 1A is reduced. Thereafter, the steps of FIGS. 1E and 1F are performed.

  In the present embodiment as well, the adhesive force between the die 1A and the wafer sheet 2 sent to the pickup center 5 is reduced, so that even if the thin die 1A is pushed up by the die push-up member 21, The die 1A is not damaged.

  A third embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. Hereinafter, the same or equivalent members as in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted. In the present embodiment, there is a die push-up member 21 in the pickup center 5, and there are only suction holes 12 and 13 on both sides of the suction hole 11 of the die push-up member 21, and the die push-up member is in the suction holes 12 and 13. 22 and 23 are not provided.

  Next, a die pickup method will be described. As shown in FIG. 4A, the vacuum of the suction stage 10 is turned on, and the wafer sheet 2 is moved so that the die end on the feed direction side of the die 1A to be picked up is positioned above the die push-up member 21. . Next, as shown in FIG. 4B, the die push-up member 21 is raised, and the die end portion on the feed direction side of the die 1 </ b> A is pushed up through the wafer sheet 2. As a result, the die end portion on the feed direction side of the die 1 </ b> A is peeled off from the wafer sheet 2.

  Next, as shown in FIG. 4C, the wafer sheet 2 is moved so that the die 1A gets over the die push-up member 21 while the die push-up member 21 is raised. When the die 1A passes over the die push-up member 21, the die 1A is fed over the peak pushed up by the die push-up member 21, so that the adhesive force between the wafer sheet 2 and the die 1A is reduced. Thereafter, as shown in FIG. 4D, after the die push-up member 21 is lowered, the wafer sheet 2 is moved so that the die 1 </ b> A is positioned at the pickup center 5. Subsequently, as shown in FIG. 4 (e), the die push-up member 21 rises to push up the die 1A, and the collet 4 vacuum-sucks the die 1A. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is reduced, the die 1A is easily peeled off from the wafer sheet 2 without being damaged by the rising of the die push-up member 21.

  The collet 4 picked up by vacuum-sucking the die 1A is moved up and moved in the XY-axis direction by a transfer means (not shown), and the following processes such as die bonding and die packing are performed. When the die 1A is picked up, as shown in FIG. 4 (f), the die push-up member 21 is lowered, and the die end on the feed direction side of the die 1B to be picked up next is the die push-up member as described above. The wafer sheet 2 is moved so as to be positioned above 21 (see FIG. 4A).

  Thus, since the adhesive force between the die 1A sent to the pickup center 5 and the wafer sheet 2 is reduced, even if the thin die 1A is pushed up by the die pushing member 21, the die 1A is not damaged. .

  A fourth embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. The present embodiment is a modification of the third embodiment, in which the steps of FIGS. 4 (c) and 4 (d) are changed to FIGS. 5 (a) and 5 (b). The other steps are the same as those shown in FIG. 4, and different steps will be described.

  After the step of FIG. 4A, as shown in FIG. 4B, the die push-up member 21 pushes up the die end portion on the feed direction side of the die 1A, and the die end portion on the feed direction side of the die 1A is a wafer sheet. 5, after the die push-up member 21 is lowered, the die 1 </ b> A is fed in the feeding direction, and the entire surface or a part of the die 1 </ b> A is exposed to the wafer by the negative pressure of the suction hole 11. The sheet 2 is peeled off. Thereafter, as shown in FIG. 5B, the wafer sheet 2 is moved so that the die 1 </ b> A is positioned at the pickup center 5 in the direction opposite to the feeding direction A. As described above, since the die end on the feed direction side of the die 1A is peeled off from the wafer sheet 2, when the die 1A is moved as shown in FIGS. The die 1A is peeled off from the wafer sheet 2 by the vacuum suction force of 12, and the adhesive force between the wafer sheet 2 and the die 1A is reduced. Thereafter, the steps of FIGS. 4E and 4F are performed.

  In the present embodiment, the adhesive force between the die 1A sent to the pickup center 5 and the wafer sheet 2 is reduced as in the above embodiments, so that even if the thin die 1A is pushed up by the die push-up member 21. The die 1A is not damaged.

A reference embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. In the present embodiment, as in the third and fourth embodiments, the pickup center 5 has a die push-up member 21, and suction holes 12 on both sides of the suction hole 11 of the die push-up member 21. 13, and the die push-up members 22 and 23 are not disposed in the suction holes 12 and 13. However, the action of the die push-up member 21 is different from those of the third and fourth embodiments.

  Next, a die pickup method will be described. As shown in FIG. 6A, the wafer sheet 2 is moved so that the die end on the feeding direction side of the die 1A to be picked up is located above the suction hole 12, and the vacuum of the suction stage 10 is turned on. . 6B, the wafer sheet 2 at the die end on the feed direction side of the die 1A is pulled downward by the vacuum suction of the suction stage 10, and the die end portion on the feed direction side of the die 1A. Is peeled off from the wafer sheet 2.

  Next, as shown in FIG. 6C, the wafer sheet 2 is moved so that the die 1 </ b> A is positioned at the pickup center 5. As described above, since the die end portion on the feed direction side of the die 1A is peeled off from the wafer sheet 2, when the die 1A is moved as shown in FIG. 6B to FIG. The die 1A is peeled off from the wafer sheet 2 by the vacuum suction force of 12, and the adhesive force between the wafer sheet 2 and the die 1A is reduced. Thereafter, the steps of FIGS. 6D and 6E are performed. Since this process is the same as the process of FIGS. 4E and 4F, the description thereof is omitted.

  In the present embodiment, the adhesive force between the die 1A sent to the pickup center 5 and the wafer sheet 2 is reduced as in the above embodiments, so that even if the thin die 1A is pushed up by the die push-up member 21. The die 1A is not damaged.

In each of the above-described embodiments, there is one die push-up member 21 for pickup. The fifth, sixth and seventh embodiments shown in FIG. 7, FIG. 8 and FIG. 9 show the case where three pickup die push-up members 24, 25 and 26 are used. 7 is an example applied to the first embodiment of FIG. 1, FIG. 8 is an example applied to the third embodiment of FIG. 4, and FIG. 9 is an example applied to the reference embodiment of FIG. Each is shown. The die push-up members 24, 25, and 26 are fixed to a holder 30 that is driven up and down by a vertical drive means (not shown), and the center die push-up member 24 has a height h (about 100) than the die push-up members 25 and 26 on both sides. (About 150 μm). Suction holes 14, 15, 16 are formed in the suction stage 10 corresponding to the die push-up members 24, 25, 26. Since other configurations are the same as those in the applied drawings, the same or corresponding members are denoted by the same reference numerals, and detailed description thereof is omitted.

A fifth embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. The present embodiment is applied to the first embodiment of FIG. 1 and the operation is almost the same as that of FIG. 1, and thus detailed description of the same operation is omitted. That is, FIGS. 7A, 7B, 7C, and 7D correspond to FIGS. 1A, 1B, 1C, and 1D, and only the die push-up member 22 moves up and down, and the die 1A moves. In the state shown in FIG. 7D, the adhesive force between the wafer sheet 2 and the die 1A is reduced as described with reference to FIG.

  Next, as shown in FIG. 7 (e), the holder 30 is raised and the die push-up members 24, 25, and 26 push up the die 1A, and the collet 4 vacuum-sucks the die 1A. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is reduced, the die 1A can be easily broken without being damaged by the rising of the die push-up members 24, 25, and 26, as in the case of FIG. 2 is peeled off. In the present embodiment, the die 1A is pushed up by the three die push-up members 24, 25, and 26, so that an excessive force is not applied to the die 1A, and the die 1A is tilted by being pushed up by the center die push-up member 24. However, it is supported by one die push-up member 25 or 26 and is sucked and held by the collet 4 by vacuum suction through the suction hole 3 of the collet 4.

  Thereafter, as shown in FIG. 7 (f), the die push-up members 24, 25, and 26 are lowered by the lowering of the holder 30, and the collet 4 holding the die 1A by suction performs the same operation as in the prior art. Similarly to the case, the wafer sheet 2 is moved so that the die end of the die 1B to be picked up next is positioned above the die push-up member 22 as described above.

A sixth embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. This embodiment is applied to the third embodiment of FIG. As shown in FIG. 8A, the vacuum of the suction stage 10 is turned on, and the wafer sheet 2 is placed so that the die end on the feed direction side of the die 1A to be picked up is positioned above the central die push-up member 24. Move. Next, as shown in FIG. 8B, when the holder 30 is raised, the die push-up member 24 pushes up the die end portion on the feed direction side of the die 1 </ b> A via the wafer sheet 2. As a result, the die end portion on the feed direction side of the die 1 </ b> A is peeled off from the wafer sheet 2.

  Next, as shown in FIG. 8C, the wafer sheet 2 is moved so that the die 1 </ b> A gets over the die push-up member 24 while the holder 30, that is, the die push-up member 24 is raised. When the die 1A passes over the die push-up member 24, the die 1A is fed over the peak pushed up by the die push-up member 24, so that the adhesive force between the wafer sheet 2 and the die 1A is reduced. Thereafter, as shown in FIG. 8D, after the holder 30 is lowered, the wafer sheet 2 is moved so that the die 1 </ b> A is positioned at the pickup center 5. Subsequently, as shown in FIG. 8 (e), the holder 30 is raised and the die push-up members 24, 25 and 26 push up the die 1A, and the collet 4 vacuum-sucks the die 1A. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is reduced, the die 1A can be easily broken without being damaged by the rising of the die push-up members 24, 25, and 26 as in the case of FIG. 2 is peeled off. In the present embodiment, the die 1A is pushed up by the three die push-up members 24, 25, and 26, so that an excessive force is not applied to the die 1A, and the die 1A is tilted by being pushed up by the center die push-up member 24. However, it is supported by one die push-up member 25 or 26 and is sucked and held by the collet 4 by vacuum suction through the suction hole 3 of the collet 4.

    Thereafter, as shown in FIG. 8 (f), the die push-up members 24, 25, and 26 are lowered by the lowering of the holder 30, and the collet 4 holding the die 1A by suction performs the same operation as in the prior art. Similarly to the case, the wafer sheet 2 is moved so that the die end of the die 1B to be picked up next is positioned above the die push-up member 22 as described above.

A seventh embodiment of the die pickup apparatus of the present invention will be described with reference to FIG. This embodiment is applied to the reference embodiment shown in FIG. 6, and the operation is almost the same as that of FIG. 6, and thus detailed description of the same operation is omitted. That is, FIGS. 9A, 9B, and 9C correspond to FIGS. 6A, 6B, and 6C, and in the state of FIG. 9C, the adhesive force between the wafer sheet 2 and the die 1A is reduced. is doing. Next, as shown in FIG. 9 (d), the holder 30 is raised and the die push-up members 24, 25, and 26 push up the die 1A, and the collet 4 vacuum-sucks the die 1A. In this case, since the adhesive force between the wafer sheet 2 and the die 1A is reduced, the die 1A can be easily broken without being damaged by the rising of the die push-up members 24, 25 and 26, as in the case of FIG. 2 is peeled off. Further, in the present embodiment, the die 1A is pushed up by the three die push-up members 24, 25, and 26, so that excessive force is not applied to the die 1A, and the die 1A is tilted by being pushed up by the center die push-up member 24. However, it is supported by one die push-up member 25 or 26 and is sucked and held by the collet 4 by vacuum suction through the suction hole 3 of the collet 4.

  Thereafter, as shown in FIG. 9E, the die push-up members 24, 25, and 26 are lowered by the lowering of the holder 30, and the collet 4 holding the die 1A by suction performs the same operation as in the prior art. Similarly to the case, the wafer sheet 2 is moved so that the die end of the die 1B to be picked up next is located above the suction hole 12.

In the first and fifth embodiments shown in FIGS. 1 and 7, the die push-up member 22 is raised as shown in FIGS. 1 (b) and (c), FIGS. 7 (b) and (c). If the entire surface of the die 1 </ b> A is peeled in a state where the die 1 </ b> A is peeled, the die 1 </ b> A may be detached from the wafer sheet 2. In order to prevent this, the die push-up member 22 is lowered before the rear end portion of the die 1A is peeled off from the wafer sheet 2. The same applies to the third embodiment shown in FIG. That is, as shown in FIG. 4B, the die push-up member 21 is lowered before the wafer sheet 2, that is, the die 1A is moved while the die push-up member 21 is raised and the die 1A is completely peeled off. Let

  Moreover, as shown in FIG. 1B and FIG. 7B, after the die push-up member 22 pushes up the die end on the feed direction side of the die 1A, the movement of the wafer sheet 2 is stopped for 100 to 200 msec. Separation of the die 1A from the wafer sheet 2 is improved.

  Further, as shown in FIGS. 1B and 7B, when the die push-up member 22 pushes up the die end on the feed direction side of the die 1A, the die push-up member 22 protrudes from the upper surface of the suction stage 10. The die end on the feed direction side of the die 1A is more easily peeled off when the value is increased. For example, the protrusion amount is 250 μm. However, if the wafer sheet 2, that is, the die 1A is moved with such a large protruding amount, the die 1A may be damaged. In order to avoid this, the die push-up member 22 may be slightly lowered after FIGS. 1 (b) and 7 (b). For example, the amount of protrusion from the upper surface of the suction stage 10 is set to 100 μm. The same applies to the case of FIG. That is, as shown in FIG. 4B, the amount of protrusion of the die push-up member 21 from the upper surface of the suction stage 10 is increased, and then the die push-up member 21 is slightly lowered.

  The pick-up die push-up members 24, 25, and 26 in the embodiment shown in FIGS. Therefore, the die push-up members 24, 25, and 26 may all be the same height. However, in the case of the embodiment of FIG. 8, the die push-up member 24 at the center performs the action of reducing the adhesive force with respect to the wafer sheet 2. It is necessary to form at least higher than the die push-up member 25.

  In the embodiment shown in FIGS. 7 to 9, the three pick-up die push-up members 24, 25, and 26 have been described. However, the number of pick-up die push-up members may be two or four or more. Although not shown, it is needless to say that the embodiment of FIG. 7 can be applied to the embodiment of FIG. 3, and the embodiment of FIG. 8 can be applied to the embodiment of FIG.

It is front sectional drawing which shows 1st Embodiment of the die pick-up apparatus of this invention. It is a top view of the adsorption | suction stage of FIG. It is front sectional drawing which shows 2nd Embodiment of the die pick-up apparatus of this invention. It is front sectional drawing which shows 3rd Embodiment of the die pick-up apparatus of this invention. It is front sectional drawing which shows 4th Embodiment of the die pick-up apparatus of this invention. It is front sectional drawing which shows embodiment of reference of the die pick-up apparatus of this invention. It is front sectional drawing which shows 5th Embodiment of the die pick-up apparatus of this invention. It is front sectional drawing which shows 6th Embodiment of the die pick-up apparatus of this invention. It is front sectional drawing which shows 7th Embodiment of the die pick-up apparatus of this invention.

Explanation of symbols

1A, 1B, 1C ... Die 2 Wafer sheet 3 Suction hole 4 Collet 5 Pickup center 10 Suction stage 11, 12, 13, 14, 15, 16 Suction hole 21, 22, 23, 24, 25, 26 Die push-up member 30 Holder

Claims (12)

A suction stage for sucking and holding a wafer sheet to which a die is attached, a die push-up member for picking up the die that is disposed in the suction stage, and a die pushed up by the die push-up member for pick-up are sucked In a die pick-up device provided with a collet to hold and convey,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down. With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for peeling the die, and then the die is peeled through the suction hole on the upper surface of the suction stage. The die push-up member for the die is lifted to peel the die end on the die feed direction side from the wafer sheet, and then the die push-up member for die peeling is lifted to feed the die in the feed direction, and then the suction The die push-up member for peeling the die was lowered through the hole to move away from the wafer sheet, and the collet was lowered to the position where the die was adsorbed. , Push up the die push-up member is raised die for the pickup, after the collet fully is peeled one die by vacuum suction of the die, is picked up, the suction stage in this state A die pick-up apparatus characterized in that a vacuum is on . A suction stage for sucking and holding a wafer sheet to which a die is attached, a die push-up member for picking up the die that is disposed in the suction stage, and a die pushed up by the die push-up member for pick-up are sucked In a die pick-up device provided with a collet to hold and convey,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down. With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for die peeling, and then the die push-up member for die peeling is raised. The die end on the die feeding direction side was peeled off from the wafer sheet, and then the die push-up member for peeling the die was lowered, then the die was sent in the feeding direction, and the collet was lowered to the position where the die was adsorbed Thereafter, the pick-up die push-up member rises and pushes up the die, and the collet partially or partially holds the die by vacuum suction. After the overall is peeled, it is picked up, die pickup apparatus characterized in that the vacuum of the suction stage in this state is in a state of ON. An adsorption stage that adsorbs and holds the wafer sheet to which the die is attached, a die push-up member that is disposed in a pickup center in the adsorption stage, pushes up the die, and a die pushed up by the die push-up member. In a die pick-up device equipped with a collet to be transported,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member, the die push-up member is lowered, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the end portion is positioned above the die push-up member, the die push-up member is raised through the suction hole to peel the die end portion on the die feed direction side from the wafer sheet, and the die push-up member remains raised. After moving one die over the die push-up member, the one die is sent to the pickup center, and then the die push-up member is lowered through the suction hole to be separated from the wafer sheet. After the die is lowered to the position where it is sucked, the die push-up member rises and pushes up the die, and the collet sucks the die. Is picked up die by die pickup apparatus characterized in that the vacuum of the suction stage in this state is in a state of ON. An adsorption stage that adsorbs and holds the wafer sheet to which the die is attached, a die push-up member that is disposed in a pickup center in the adsorption stage, pushes up the die, and a die pushed up by the die push-up member. In a die pick-up device equipped with a collet to be transported,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member, the die push-up member is lowered, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the end is positioned above the die push-up member, the die push-up member is lifted to peel the die end on the die feed direction side from the wafer sheet, and the die push-up member is lowered and the die feed After the direction end of the die is positioned above the suction hole, the die is sent to the pickup center, the collet is lowered to a position where the die is adsorbed, and then the die push-up member is raised to push up the die. Te, the collet is picked up by vacuum suction the die, state der vacuum of the suction stage is turned on in this state Die pickup apparatus characterized by. Die push-up member for said pickup, die pickup device according to any one of claims 1 to 4, characterized in that consists of a plurality of lines. Die push-up member for the pickup is made of three or more, the center of the die push-up member, on both sides of the die push-up that is formed above the member die pickup device according to any one of claims 1 to 4, characterized in. A suction stage for sucking and holding a wafer sheet to which a die is attached, a die push-up member for picking up the die that is disposed in the suction stage, and a die pushed up by the die push-up member for pick-up are sucked In a die pick-up method using a die pick-up device provided with a collet to hold and convey,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down. With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for peeling the die, and then the die is peeled through the suction hole on the upper surface of the suction stage. The die push-up member for the die is lifted to peel the die end on the die feed direction side from the wafer sheet, and then the die push-up member for die peeling is lifted to feed the die in the feed direction, and then the suction The die push-up member for peeling the die was lowered through the hole to move away from the wafer sheet, and the collet was lowered to the position where the die was adsorbed. , Push up the die push-up member is raised die for the pickup, after the collet fully is peeled one die by vacuum suction of the die, is picked up, the suction stage in this state A die pick-up method, wherein the vacuum is on . A suction stage for sucking and holding a wafer sheet to which a die is attached, a die push-up member for picking up the die that is disposed in the suction stage, and a die pushed up by the die push-up member for pick-up are sucked In a die pick-up method using a die pick-up device provided with a collet to hold and convey,
In the suction stage, a die push-up member for peeling the die that pushes the die closer to the die feed side than the die push-up member for the pickup is provided so as to be movable up and down. With the stage vacuum turned on, the die end on the feed direction side of the die to be picked up is positioned above the die push-up member for die peeling, and then the die push-up member for die peeling is raised. The die end on the die feeding direction side was peeled off from the wafer sheet, and then the die push-up member for peeling the die was lowered, then the die was sent in the feeding direction, and the collet was lowered to the position where the die was adsorbed Thereafter, the pick-up die push-up member rises and pushes up the die, and the collet partially or partially holds the die by vacuum suction. After the overall is peeled, it is picked up, die pickup wherein the vacuum of the suction stage in this state is in a state of ON. An adsorption stage that adsorbs and holds the wafer sheet to which the die is attached, a die push-up member that is disposed in a pickup center in the adsorption stage, pushes up the die, and a die pushed up by the die push-up member. In a die pick-up method using a die pick-up device provided with a collet to be conveyed,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member, the die push-up member is lowered, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the end portion is positioned above the die push-up member, the die push-up member is raised through the suction hole to peel the die end portion on the die feed direction side from the wafer sheet, and the die push-up member remains raised. After moving one die over the die push-up member, the one die is sent to the pickup center, and then the die push-up member is lowered through the suction hole to be separated from the wafer sheet. After the die is lowered to the position where it is sucked, the die push-up member rises and pushes up the die, and the collet sucks the die. It is picked up die by die pickup wherein the vacuum of the suction stage in this state is in a state of ON. An adsorption stage that adsorbs and holds the wafer sheet to which the die is attached, a die push-up member that is disposed in a pickup center in the adsorption stage, pushes up the die, and a die pushed up by the die push-up member. In a die pick-up method using a die pick-up device provided with a collet to be conveyed,
On the upper surface of the suction stage, a suction hole is formed on the die feed side from the die push-up member, the die push-up member is lowered, and the die on the feed direction side of the die picked up with the vacuum of the suction stage turned on After the end is positioned above the die push-up member, the die push-up member is lifted to peel the die end on the die feed direction side from the wafer sheet, and the die push-up member is lowered and the die feed After the direction end of the die is positioned above the suction hole, the die is sent to the pickup center, the collet is lowered to a position where the die is adsorbed, and then the die push-up member is raised to push up the die. Te, the collet is picked up by vacuum suction the die, state der vacuum of the suction stage is turned on in this state Die pickup wherein the. The die pick-up method according to claim 7, wherein the pick-up die push-up member includes a plurality of pick-up members. The die pick-up method according to claim 7, wherein the pick-up die push-up member includes three or more die push-up members, and the center die push-up member is formed higher than the die push-up members on both sides.

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