JP7486264B2 - Pick-up method and pickup device - Google Patents

Description

The present invention relates to a method for picking up chips attached to tape.

Conventionally, as disclosed in Patent Document 1, for example, a method is known in which a rectangular chip attached to tape is pushed up from below by a push-up member to peel it off, and the upper side of the chip is suction-held by a chip holding member to pick up the chip.

When pushing up the chip from below, if stress acts locally on the chip, the chip may be damaged. In particular, if the chip is thin (100 μm or less), the risk of damage is extremely high.

From this perspective, it is ideal to configure the area of the pressing surface of the push-up member to correspond to the size of the chip, and to position the push-up member at the center of the chip and push it up, so that the chip is picked up with as little localized stress as possible.

In Patent Document 1, the push-up member is composed of multiple pressing parts, first to third, and after all the push-up members are raised to a predetermined position, the pressing part closer to the center of the chip is raised in stages, so that the multiple pressing parts push up the chip in a pyramid shape.

JP 2013-033850 A

With conventional methods, the area of the pressing surface of the push-up member needs to be set according to the size of the chip, and when picking up chips of different sizes, a push-up member corresponding to the chip size needs to be prepared each time.

As a result, in the past it was necessary to produce multiple different sized push-up parts and change the push-up parts according to the size of the chip each time.

Replacing push-up members as described above requires a lot of labor and time for the work, and furthermore, it entails the cost of producing and managing multiple types of push-up members, so improvements were needed.

In view of the above, the present invention proposes a pickup method that can accommodate multiple chip sizes without the need to change push-up members depending on the chip size.

According to one aspect of the present invention,
A method for picking up a rectangular chip attached to a surface side of a tape from the tape, comprising the steps of:
a lifting member having an upper portion with a pressing surface for lifting the tape from the back surface side of the tape, the pressing surface being smaller than the area of the back surface of the chip to be picked up;
and an outer layer portion having a suction surface that suction-holds the back surface of the tape around the push-up member,
a first positioning step of positioning the push-up mechanism so that the push-up member is positioned at a first corner of the chip through the tape;
a first pushing-up step in which, after the first positioning step is performed, the tape is sucked and held by the suction surface and the pushing-up member is used to push up the first corner portion through the tape and peel off the first corner portion from the tape;
a second positioning step of positioning the push-up mechanism so that the push-up member is positioned at a second corner portion of the chip via the tape after the first push-up step is performed;
a second pushing-up step of, after performing the second positioning step, sucking and holding the tape on the suction surface and pushing up the second corner portion through the tape with the pushing-up member to peel off the second corner portion from the tape;
a third positioning step of positioning the push-up mechanism so that the push-up member is positioned at a third corner portion of the chip via the tape after the second push-up step is performed;
a third pushing-up step of, after performing the third positioning step, sucking and holding the tape on the suction surface and pushing up the third corner portion through the tape with the pushing-up member to peel off the third corner portion from the tape;
a fourth positioning step of positioning the push-up mechanism so that the push-up member is positioned at a fourth corner portion of the chip via the tape after the third push-up step is performed;
a fourth push-up step of, after performing the fourth positioning step, sucking and holding the tape on the suction surface and using the push-up member to push up the fourth corner portion through the tape and peel off the fourth corner portion from the tape;
After carrying out the fourth push-up step, a pick-up step is carried out in which the chip is picked up from the tape by holding the chip with a chip holding member facing the push-up mechanism across the chip.

According to another aspect of the present invention,
A pickup device for picking up a rectangular chip attached to a tape from the tape, comprising:
a frame holding mechanism that holds an annular frame to which an outer circumferential side of the tape is fixed;
a push-up mechanism including a push-up member that can be raised and lowered and has a pressing surface at an upper portion thereof for pushing up the tape from the back side of the tape, the pressing surface being smaller than the area of the back side of the chip to be picked up, and an outer layer portion having a suction surface around the push-up member for suction-holding the back side of the tape;
a pick-up mechanism that is disposed opposite the push-up mechanism with the chip attached to the tape therebetween and that sucks and holds the chip;
a positioning mechanism for moving the frame holding mechanism relative to the push-up mechanism;
A controller that controls at least the push-up mechanism and the positioning mechanism,
the controller controls the frame holding mechanism to be positioned so that the push-up member is positioned at a corner of the chip to be picked up, and then controls the tape to be sucked and held by the suction surface, and the push-up member to push up the corner through the tape and peel off the corner from the tape, for all corners.
A pickup device.

According to the configuration of the present invention, the corners of the chip are pushed up in sequence by a push-up member having a pressing surface smaller than the chip to be picked up, and the chip is peeled off from the tape, which makes it possible to accommodate a number of different chip sizes. This saves the labor and time required for replacing the push-up member, and also eliminates the manufacturing costs and management burdens of multiple types of push-up members.

FIG. 2 is a perspective view of a pickup device with some components omitted. FIG. 2 is a perspective view of a pickup device with some components omitted. 1A to 1C are diagrams illustrating the configuration of a wafer unit that holds a wafer after cutting. 1A and 1B are diagrams illustrating imaging of a wafer by a wafer imaging camera. 1A is a cross-sectional view showing a wafer unit disposed above a push-up mechanism, FIG. 1B is a cross-sectional view showing an enlarged portion of the push-up mechanism, and FIG. 1C is a cross-sectional view showing an enlarged portion of the push-up mechanism of another embodiment. 5A is a diagram for explaining the relationship between the area of the pressing surface of the push-up portion and the area of the chip in the configuration of FIG. 5B. FIG. 5B is a diagram for explaining the relationship between the area of the pressing surface of the push-up portion and the area of the chip in the configuration of FIG. 5C. FIG. 2 is a perspective view showing a pickup mechanism. 13A is a diagram illustrating a first positioning step, and FIG. 13B is a diagram illustrating a first thrusting step. FIG. 2 is a diagram illustrating a first region to a fourth region. 13A to 13C are diagrams illustrating an example in which the first to fourth positioning steps and the first to fourth pushing-up steps are performed in order. 1A is a diagram for explaining a pick-up step, and FIG. 1B is a diagram for explaining an example of pushing up the central region of a chip.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 and 2 are diagrams showing the configuration of the pickup device 2. FIG.
The pickup device 2 includes a base 4 that supports each of the structural elements that make up the pickup device 2. A cassette mounting table 5 is provided at one corner of the base 4, and a cassette 5a is mounted on the cassette mounting table 5. As shown in Fig. 3, this cassette 5a contains a plurality of wafer units 11, each of which has a wafer 13 that has been cut into individual chips 23 by cutting or the like and is held by an annular frame 21 via a tape 19.

A temporary placement mechanism 10 capable of temporarily placing wafer units in two tiers is provided adjacent to the cassette placement table 5 shown in FIG. 1. The temporary placement mechanism 10 has a pair of guide rails 12 arranged parallel to each other. Each of the pair of guide rails 12 is configured to form a two-tier shelf, and has a first support surface 12a and a second support surface 12b that are generally parallel to the X-axis direction (first horizontal direction, left-right direction) and the Y-axis direction (second horizontal direction, front-back direction).

As shown in FIG. 1, each of the first support surfaces 12a is positioned above the second support surface 12b so as to overlap the second support surface 12b. The pair of first support surfaces 12a and the pair of second support surfaces 12b each support the lower side of the end of the wafer unit (annular frame 21 (FIG. 3)). For example, the pair of first support surfaces 12a supports a wafer unit transferred from the cassette mounting table 5, and the pair of second support surfaces 12b supports a wafer unit transferred from the frame holding mechanism 14 described below.

As shown in FIG. 1, a frame holding mechanism 14 is provided at a position adjacent to the temporary placement mechanism 10. The frame holding mechanism 14 includes a frame support portion 16 that supports the lower side of the annular frame (FIG. 3), and a frame pressing portion 18 that is disposed above the frame support portion 16 and contacts the upper side of the annular frame (FIG. 3). The frame support portion 16 and the frame pressing portion 18 are each formed in an annular shape corresponding to the shape of the annular frame (FIG. 3), and are disposed so as to overlap each other.

The frame support 16 shown in FIG. 1 is configured to be movable along the Z-axis direction (vertical direction, up-down direction). When the frame support 16 is moved upward with the wafer unit positioned so that the annular frame 21 (FIG. 3) is supported by the frame support 16, the annular frame 21 (FIG. 3) is clamped and fixed between the frame support 16 and the frame pressing part 18.

Whether the annular frame 21 (Figure 3) is properly fixed by the frame holding mechanism 14 can be confirmed, for example, by detecting whether the frame support part 16 and the frame pressing part 18 are electrically connected via the annular frame (Figure 3).

Also, as shown in FIG. 1, a transport mechanism (transport means) 20 that transports the wafer unit 11 (FIG. 3) between the cassette 5a and the frame holding mechanism 14 is provided above the temporary placement mechanism 10 and the frame support portion 16. The transport mechanism 20 is configured to be movable along the Y-axis direction and the Z-axis direction, and includes a first gripping portion 22a and a second gripping portion 22b that grip the annular frame 21 (FIG. 3) of the wafer unit 11 from above and below. The first gripping portion 22a is provided on the cassette placement table 5 side of the transport mechanism 20, and the second gripping portion 22b is provided on the frame holding mechanism 14 side of the transport mechanism 20.

As shown in FIG. 1, when transporting the wafer unit 11 (FIG. 3) out of the cassette 5a, the transport mechanism 20 is moved along the Y-axis direction toward the temporary placement mechanism 10 while the end of the wafer unit 11 (FIG. 3) contained in the cassette 5a is gripped by the first gripping portion 22a. This causes the wafer unit 11 (FIG. 3) to be pulled out of the cassette 5a and placed on a pair of first support surfaces 12a (upper stage) provided on the temporary placement mechanism 10. Then, the grip by the first gripping portion 22a is released.

Next, with the end of the wafer unit 11 (FIG. 3) on the cassette 5a side being gripped by the second gripping portion 22b of the transport mechanism 20, the transport mechanism 20 is moved along the Y-axis direction toward the frame holding mechanism 14. As a result, the wafer unit 11 (FIG. 3) is transported between the frame support portion 16 and the frame pressing portion 18, and the annular frame 21 (FIG. 3) is supported by the frame support portion 16.

As shown in Figs. 1 and 2, the frame holding part 18 has a cutout 18a formed by cutting the frame holding part 18 on the temporary placement mechanism 10 side. This cutout 18a is configured to be large enough for the transport mechanism 20 to pass through. This makes it possible to prevent the transport mechanism 20 from coming into contact with the frame holding part 18 when the wafer unit 11 (Fig. 3) is transported to the frame holding mechanism 14.

Then, as shown in FIG. 1, the grip by the second gripping portion 22b is released, and the frame support portion 16 is moved upward. As a result, the annular frame 21 (FIG. 3) is sandwiched and fixed between the frame support portion 16 and the frame pressing portion 18.

As shown in Figures 1 and 2, the frame holding mechanism 14 is supported by a positioning mechanism 30 that controls the position of the frame holding mechanism 14. The positioning mechanism 30 includes an X-axis movement mechanism 32 that moves the frame holding mechanism 14 along the X-axis direction, and a Y-axis movement mechanism 42 that moves the frame holding mechanism 14 along the Y-axis direction. The X-axis movement mechanism 32 and the Y-axis movement mechanism 42 control the horizontal position of the frame holding mechanism 14.

The X-axis movement mechanism 32 includes a pair of guide rails 34 arranged on the base 4 along the X-axis direction. Between the pair of guide rails 34, a ball screw 36 is provided that is arranged generally parallel to the pair of guide rails 34. In addition, a pulse motor 38 that rotates the ball screw 36 is connected to one end of the ball screw 36.

A moving block 40 is slidably disposed on the pair of guide rails 34. A nut portion (not shown) is provided on the underside (backside) of the moving block 40, and this nut portion is screwed into the ball screw 36. When the ball screw 36 is rotated by the pulse motor 38, the moving block 40 moves in the X-axis direction along the pair of guide rails 34.

The Y-axis movement mechanism 42 includes a pair of guide rails 44 arranged on the moving block 40 along the Y-axis direction. Between the pair of guide rails 44, a ball screw 46 is provided that is arranged generally parallel to the pair of guide rails 44. In addition, a pulse motor 48 that rotates the ball screw 46 is connected to one end of the ball screw 46.

As shown in FIG. 1, the frame holding mechanism 14 is slidably disposed on a pair of guide rails 44. A nut portion (not shown) is provided on the support portion 14f of the frame holding mechanism 14, and this nut portion is screwed onto a ball screw 46. When the ball screw 46 is rotated by the pulse motor 48, the frame holding mechanism 14 moves in the Y-axis direction along the pair of guide rails 44.

As shown in Figures 1 and 2, the moving block 40 is formed in a plate shape, and an opening 41 that penetrates in the vertical direction is formed below the frame holding mechanism 14. This opening 41 allows the pushing mechanism 50, which will be described later, to push it up from below.

A rectangular opening 4b is provided in the area of the base 4 between the pair of guide rails 36. Inside this opening 4b, a cylindrical push-up mechanism (push-up means) 50 is provided that pushes up the chips 23 (FIG. 3) included in the wafer 13 of the wafer unit 11 from the bottom side. The push-up mechanism 50 is connected to a lifting mechanism (not shown) comprised of a motor or the like, and moves up and down along the Z-axis direction.

When the annular frame 21 of the wafer unit 11 (Figure 3) is fixed by the frame holding mechanism 14, the frame holding mechanism 14 is moved along the X-axis direction by the positioning mechanism 30, so that the wafer unit 11 is positioned above the opening.

As shown in Figures 1, 2, and 4, a wafer imaging camera 60 is provided on the path that moves the frame holding mechanism 14 to above the push-up mechanism 50 as an imaging means for imaging the top surface of the wafer 13 (Figure 4) affixed to the annular frame 21 fixed by the frame holding mechanism 14.

Images taken by the wafer imaging camera 60 may be taken while the wafer is fixed to the frame holding mechanism 14, or may be taken when the wafer is transported by the transport mechanism 20 before being fixed to the frame holding mechanism 14, or when the wafer is placed on the temporary placement mechanism 10, etc. The placement of the wafer imaging camera 60 may also be designed according to an appropriate position corresponding to each timing.

As shown in Figures 1 and 2, the frame holding mechanism 14 positioned above the opening 4b is adjusted in position by the positioning mechanism 30 (Figures 1 and 2) to align the position of the chip 23 to be picked up directly above the push-up mechanism 50, as shown in Figure 5 (A).

Figure 5 (A) is a cross-sectional view showing a wafer unit 11 arranged above a push-up mechanism 50, which, as shown in Figure 5 (B), has an outer layer portion 52 formed in a hollow cylindrical shape and a square pillar-shaped push-up portion 54 arranged inside the outer layer portion 52.

As shown in FIG. 5(B), a plurality of suction grooves 52b are formed concentrically along the circumferential direction of the outer layer 52 at the upper end of the outer layer 52, so that the upper end surface of the outer layer 52 is configured as a suction surface 52a. Each of the suction grooves 52b is connected to a suction source 58 such as an ejector via a suction passage (not shown) and a valve 56 formed inside the push-up mechanism 50. The outer layer 52 is connected to a lifting mechanism 52c such as a motor, and moves up and down along the Z-axis direction.

The push-up section 54 includes a first push-up pin 54a formed in a rectangular prism shape, and a second push-up pin 54b formed in a hollow rectangular prism shape surrounding the first push-up pin 54a. The first push-up pin 54a and the second push-up pin 54b are connected to lifting mechanisms 55a and 55b, respectively, which are constituted by a motor or the like, and move up and down along the Z-axis direction.

The upper surfaces 57a, 57b of the first push-up pin 54a and the second push-up pin 54b are flat and together form a single pressing surface 57, which comes into contact with the underside of the tape and pushes up the chip from below, as described in more detail below.

In addition, as shown in FIG. 5(C), the push-up portion 54A may be configured with one push-up pin 54c, and the pressing surface 57A may be configured by the upper surface 57c of the push-up pin 54c.

As shown in FIG. 6(A), the area 57M of the pressing surface 57 of the push-up portion 54, i.e., the combined area of the two top surfaces 57a, 57b, is set to be smaller than the area 23M (area of the back surface) of the chip 23 to be picked up. In the example of FIG. 6(A), the area 57M of the pressing surface 57 is set to be approximately one-fourth the area 23M of the chip 23.

As shown in FIG. 6(A), the pressing surface 57 formed by the upper surface of the push-up portion 54 is rectangular, and the corners of the outermost periphery (corners of the second push-up pin 54b) form first to fourth corners 59a to 59d. The first to fourth corners 59a to 59d are sequentially positioned so as to align with the first to fourth corners 23a to 23d, which are the corners of the rectangular chip 23, as described below.

Figure 6 (B) shows the configuration of the push-up portion 54A in Figure 5 (C), where the area 57AM of the pressing surface 57A formed by the upper surface 57c is set to be smaller than the area 23M (area of the back surface) of the chip 23 to be picked up. In the example of Figure 6 (B), the area 57AM of the pressing surface 57A is set to be approximately one-quarter of the area 23M of the chip 23.

The pressing surface 57A is configured so that its surface is rectangular, and the corners of the outermost periphery form first to fourth corners 59a to 59d . The first to fourth corners 59a to 59d are sequentially positioned so as to match the first to fourth corners 23a to 23d, which are the corners of the rectangular chip 23.

Next, the pickup mechanism 70 shown in FIG. 2 will be described.
The chip pushed up by the push-up mechanism 50 is picked up by a pick-up mechanism 70. The pick-up mechanism 70 includes a collet 76 that picks up the chip pushed up by the push-up mechanism 50, and is connected to a collet moving mechanism (collet moving means) 80 that controls the position of the collet 76.

Figure 7 is a perspective view showing the pickup mechanism 70. The pickup mechanism 70 comprises a moving base 72 connected to the collet moving mechanism 80, and a columnar arm 74 arranged along the X-axis direction from the moving base 72 toward the opposite side to the collet moving mechanism 80, connecting the collet 76 to the collet moving mechanism 80. The arm 74 comprises a columnar first support portion 74a connected to the collet moving mechanism 80 via the moving base 72, and a second support portion 74b protruding downward from the tip of the first support portion 74a.

The first support portion 74a and the second support portion 74b are configured to be connectable and detachable to each other. For example, the first support portion 74a and the second support portion 74b are configured to be detachable from each other by a tool changer or the like. The first support portion 74a is configured to move in the X-axis direction by the X-axis direction movement mechanism 74d, and this allows the second support portion 74b to move in the X-axis direction. This makes it possible to select the storage position in the X-axis direction when storing in the chip storage device 501 shown in FIG. 1.

As shown in FIG. 7, a collet 76 that holds the tip is fixed to the lower end side of the second support portion 74b. The lower surface of the collet 76 forms a suction surface 76a that suction-holds the tip. The suction surface 76a is connected to a suction source (not shown) via a suction path (not shown) formed inside the collet 76. With the tip in contact with the suction surface 76a of the collet 76, the negative pressure of the suction source is applied to the suction surface 76a, whereby the tip is suction-held by the collet 76.

As shown in FIG. 2, the pickup mechanism 70 is connected to a collet moving mechanism 80. The collet moving mechanism 80 includes a Y-axis moving mechanism 82 that moves the pickup mechanism 70 along the Y-axis direction, and a Z-axis moving mechanism 92 that moves the pickup mechanism 70 along the Z-axis direction. The Y-axis moving mechanism 82 and the Z-axis moving mechanism 92 control the position of the collet 76 in the Y-axis direction and the Z-axis direction.

The Y-axis movement mechanism 82 includes a pair of guide rails 84 arranged along the Y-axis direction. Between the pair of guide rails 84, a ball screw 86 is provided that is arranged generally parallel to the pair of guide rails 84. In addition, a pulse motor 88 that rotates the ball screw 86 is connected to one end of the ball screw 86.

A moving block 90 is slidably mounted on the pair of guide rails 84. The moving block 90 is also provided with a nut portion (not shown), which is screwed onto the ball screw 86. When the ball screw 86 is rotated by the pulse motor 88, the moving block 90 moves in the Y-axis direction along the pair of guide rails 84.

As shown in Figures 2 and 7, the Z-axis movement mechanism 92 includes a pair of guide rails 94 arranged along the Z-axis direction on the side of the movement block 90. Between the pair of guide rails 94, a ball screw 96 is provided that is arranged generally parallel to the pair of guide rails 94. In addition, a pulse motor 98 that rotates the ball screw 96 is connected to one end of the ball screw 96.

As shown in FIG. 7, the moving base 72 of the pickup mechanism 70 is slidably mounted on a pair of guide rails 94. The moving base 72 is also provided with a nut portion (not shown), which is screwed into a ball screw 96. When the ball screw 96 is rotated by a pulse motor 98, the moving base 72 moves in the Z-axis direction along the pair of guide rails 94.

The pickup mechanism 70 configured as described above picks up the chip 23 pushed up by the push-up mechanism 50. As shown in FIG. 1, the picked up chip is transported appropriately to the chip observation mechanism 100 or the strength measurement mechanism 200, and is also appropriately stored in the chip storage device 501.

Next, a pickup method using the above configuration will be described. Below, the configuration of the push-up unit 54 shown in FIG. 5(B) and FIG. 6(A) will be described, but the same applies to FIG. 5(C) and FIG. 6(B). In addition, various processes such as control of each operation required to carry out the following method and calculation of position coordinates based on captured images can be executed by a program stored in a controller 1 that controls the pickup device 2, as shown in FIG. 1.

<Wafer imaging step>
4, the wafer 13 is imaged from above by a wafer imaging camera 60 to capture an image for identifying the arrangement of each chip 23. From the captured image, the position coordinates of the first corner portion to the fourth corner portion 23a to 23d (FIG. 6A) of each chip 23 are calculated.

<First positioning step>
As shown in Figure 5 (A), the chip 23 to be picked up is moved above the push-up mechanism 50, and as shown in Figure 8 (A), the chip 23 is positioned so that the first corner 23a of the chip 23 coincides with the first corner 59a of the push-up portion 54 (pressure surface 57).

As shown in FIG. 1, the positioning of the chip 23 is performed by moving the frame holding mechanism 14 using the positioning mechanism 30, and this movement is performed by referring to the position coordinates of the first corner 23a of the chip 23 being picked up.

<First thrust step>
As shown in Fig. 8(B), the suction surface 52a of the outer layer portion 52 is raised until it contacts the tape 19, and suction is started to hold the tape 19 by the suction surface 52a. Next, the first push-up pin 54a and the second push-up pin 54b are pushed up to peel the first corner portion 23a of the chip 23 from the tape 19. In the example of Fig. 8(B), the first push-up pin 54a is pushed up higher than the second push-up pin 54b. The device 24 is formed on the upper surface of the chip 23.

<Second to fourth positioning steps and second to fourth thrusting steps>
As shown in FIGS. 9 and 10, operations similar to the first positioning step and the first push-up step described above are performed for the second corner portion 23b to the fourth corner portion 23d of the chip 23 in order.

That is, as shown in Figures 9 and 10, the second corner 23b of the tip 23 is positioned at the second corner 59b of the push-up portion 54 and pushed up. Next, the third corner 23c of the tip 23 is positioned at the third corner 59c of the push-up portion 54 and pushed up. Next, the fourth corner 23d of the tip 23 is positioned at the fourth corner 59d of the push-up portion 54 and pushed up.

In this manner, a total of four pushing steps are performed, and pushing is performed on each of the first to fourth regions 23A to 23D. Note that there is no particular limitation on the order in which the first to fourth corners 23a to 23d are positioned and pushed up.

<Pickup step>
As shown in FIG. 11A, the collet 76 of the pickup mechanism 70 is positioned above the chip 23 by the collet moving mechanism 80 (FIG. 2), and the chip 23 is sucked and held by the suction surface 76a of the collet 76, thereby moving the chip 23 away from the tape 19 and picking it up.

The pickup step may be performed while the tip 23 is pushed up, as shown in FIG. 11(A), i.e., at the same time as the fourth push-up step described above, or may be performed while the push-up mechanism 50 (pushing section 54) is lowered.

Also, in a configuration in which the pickup mechanism 70 does not move, the frame holding mechanism 14 (Figure 1) may be moved to a position below the pickup mechanism 70 to perform pickup.

Furthermore, as shown in FIG. 11(B), the central region 23E of the chip 23 may be pushed up during the pick-up step. FIG. 11(B) shows an example in which the central region 23E is pushed up in addition to the first to fourth regions 23A to 23D that are pushed up in the first to fourth pushing-up steps.

The present invention can be realized in the above manner.
That is, as shown in FIGS.
A pickup method for picking up a rectangular chip 23 attached to a surface side of a tape 19 from the tape 19, comprising the steps of:
a push-up member 54 that can be raised and lowered and has a pressing surface 57 at an upper portion thereof for pushing up the tape 19 from the back side of the tape 19, the pressing surface 57 being smaller than the area of the back side of the chip 23 to be picked up;
and an outer layer portion 52 having a suction surface 52a that suction-holds the back surface of the tape 19 around the periphery of the push-up member 54,
a first positioning step of positioning the push-up mechanism 50 so that the push-up member 54 is positioned at a first corner of the chip 23 via the tape 19;
a first pushing-up step in which, after the first positioning step, the tape 19 is sucked and held by the suction surface 52 a and the pushing-up member 54 pushes up the first corner portion through the tape 19 to peel off the first corner portion from the tape 19;
a second positioning step of positioning the push-up mechanism 50 so that the push-up member 54 is positioned at a second corner portion of the chip 23 via the tape 19 after the first push-up step is performed;
a second pushing-up step in which, after the second positioning step is performed, the tape 19 is sucked and held by the suction surface 52 a and the pushing-up member 54 pushes up the second corner portion through the tape 19 to peel off the second corner portion from the tape 19;
a third positioning step of positioning the push-up mechanism 50 so that the push-up member 54 is positioned at a third corner portion of the chip 23 via the tape 19 after the second push-up step is performed;
a third pushing-up step in which, after the third positioning step, the tape 19 is sucked and held by the suction surface 52 a and the pushing-up member 54 pushes up the third corner portion through the tape 19 to peel off the third corner portion from the tape 19;
a fourth positioning step of positioning the push-up mechanism 50 so that the push-up member 54 is positioned at the fourth corner portion of the chip 23 via the tape 19 after the third push-up step is performed;
a fourth push-up step in which, after the fourth positioning step, the tape 19 is sucked and held by the suction surface 52 a and the push-up member 54 pushes up the fourth corner portion through the tape 19 to peel off the fourth corner portion from the tape 19;
After carrying out the fourth push-up step, a pickup step is carried out in which the chip 23 is held by a collet 76 (chip holding member) of the pickup mechanism 70 facing the push-up mechanism 50, sandwiching the chip 23, and the chip 23 is picked up from the tape 19.

As shown in FIGS. 1, 2, and 5(A) and (B),
A pickup device 2 for picking up a rectangular chip 23 attached to a tape 19 from the tape 19,
a frame holding mechanism 14 for holding a frame to which an outer circumferential side of the tape 19 is fixed;
a push-up mechanism 50 including a push-up member 54 that can be raised and lowered and has at its upper portion a pressing surface 57 for pushing up the tape 19 from the back side of the tape 19, the pressing surface 57 being smaller than the area of the back side of the chip 23 to be picked up, and an outer layer portion 52 having a suction surface 52a that suction-holds the back side of the tape 19 around the push-up member 54;
a pick-up mechanism 70 that is disposed opposite the push-up mechanism 50 with the chip 23 attached to the tape 19 sandwiched therebetween and that sucks and holds the chip 23;
a positioning mechanism 30 for moving the frame holding mechanism 14 relative to the push-up mechanism 50;
A controller 1 that controls at least the push-up mechanism 50 and the positioning mechanism 30,
The controller 1 positions the frame holding mechanism 14 so that the push-up member 54 is positioned at the corner of the chip 23 to be picked up, and then controls the suction surface 52a to hold the tape 19 by suction and the push-up member 54 to push up the corner through the tape 19 and peel off the corner from the tape 19, for all corners.
The pickup device 2 is a pickup device.

According to the embodiment described above, as shown in the example of Figure 6 (A), a push-up member 54 having a pressing surface 57 smaller than the chip 23 to be picked up is used to push up the corners of the chip in sequence, thereby peeling the chip off from the tape, which makes it possible to accommodate a number of different chip sizes.

This not only eliminates the labor and time required to replace push-up members, but also eliminates the manufacturing costs and management burdens of multiple types of push-up members.

1 Controller 2 Pickup device 13 Wafer 14 Frame holding mechanism 16 Frame support portion 18 Frame pressing portion 19 Tape 21 Annular frame 23 Chip 23a First corner portion 23E Central region 23M Area 30 Positioning mechanism 50 Push-up mechanism 52 Outer layer portion 52a Suction surface 52b Suction groove 52c Lifting mechanism 54 Push-up portion 54a First push-up pin 54b Second push-up pin 57 Pressing surface 57a First corner portion 57M Area 60 Wafer imaging camera 70 Pick-up mechanism 76 Collet (chip holding member)
76a Suction surface 80 Collet moving mechanism

Claims (4)

A method for picking up a rectangular chip attached to a surface side of a tape from the tape, comprising the steps of:
a push-up member that can be raised and lowered and has a rectangular pressing surface at an upper portion thereof for pushing up the tape from the back surface side of the tape, the pressing surface being smaller than the area of the back surface of the chip to be picked up;
and an outer layer portion having a suction surface that suction-holds the back surface of the tape around the push-up member,
The pressing surface is configured in a rectangle having a first corner portion, a second corner portion, a third corner portion, and a fourth corner portion,
a first positioning step of positioning the push-up mechanism so that a first corner portion of the pressing surface of the push-up member is positioned at a first corner portion of the chip via the tape;
a first pushing-up step in which, after the first positioning step is performed, the tape is sucked and held by the suction surface, and the pushing-up member pushes up a first corner portion of the chip through the tape, thereby peeling off the first corner portion of the chip from the tape;
a second positioning step of positioning the push-up mechanism such that a second corner of the pressing surface of the push- up member is positioned at a second corner of the chip via the tape after the first push-up step is performed;
a second push-up step in which, after the second positioning step is performed, the tape is sucked and held by the suction surface, and the push-up member is used to push up a second corner portion of the chip through the tape, thereby peeling off the second corner portion of the chip from the tape;
a third positioning step of positioning the push-up mechanism such that a third corner portion of the pressing surface of the push- up member is positioned at a third corner portion of the chip via the tape after the second push-up step is performed;
a third push-up step in which, after the third positioning step is performed, the tape is sucked and held by the suction surface, and the push-up member is used to push up a third corner portion of the chip through the tape and peel off the third corner portion of the chip from the tape;
a fourth positioning step of positioning the push-up mechanism such that a fourth corner portion of the pressing surface of the push- up member is positioned at a fourth corner portion of the chip via the tape after the third push-up step is performed;
a fourth push-up step of, after carrying out the fourth positioning step, sucking and holding the tape on the suction surface and using the push-up member to push up the fourth corner portion of the chip through the tape and peel off the fourth corner portion of the chip from the tape;
After carrying out the fourth push-up step, a pick-up step is carried out of picking up the chip from the tape by holding the chip with a chip holding member facing the push-up mechanism across the chip. The push-up portion includes a first push-up pin formed in a rectangular prism shape, and a second push-up pin formed in a hollow rectangular prism shape and surrounding the first push-up pin.
2. The pickup method according to claim 1 . The first thrust pin is thrust higher than the second thrust pin.
3. The pickup method according to claim 2. A pickup device for picking up a rectangular chip attached to a tape, the rectangular chip having a first corner, a second corner, a third corner, and a fourth corner, from the tape, comprising:
a frame holding mechanism that holds an annular frame to which an outer circumferential side of the tape is fixed;
a push-up mechanism including a push-up member that can be raised and lowered and has a rectangular pressing surface at an upper portion thereof for pushing up the tape from the back side of the tape, the pressing surface being smaller than the area of the back side of the chip to be picked up, and an outer layer portion having a suction surface around the push-up member for suction-holding the back side of the tape;
a pick-up mechanism that is disposed opposite the push-up mechanism with the chip attached to the tape therebetween and that sucks and holds the chip;
a positioning mechanism for moving the frame holding mechanism relative to the push-up mechanism;
A controller that controls at least the push-up mechanism and the positioning mechanism,
The pressing surface is configured in a rectangle having a first corner portion, a second corner portion, a third corner portion, and a fourth corner portion,
the controller sequentially positions the frame holding mechanism so that the corners of the pressing surface of the push-up member are positioned at the corners of the chip to be picked up, and then controls the frame holding mechanism to suck and hold the tape with the suction surface while pushing up the corners of the chip through the tape with the corners of the pressing surface of the push-up member to peel off the corners of the chip from the tape.
Pick-up device.