JP2007073778A - Method and device for picking up semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent breakage of semiconductor chips when an adhesive sheet is released. <P>SOLUTION: The method for picking up semiconductor chips 3 includes a moving step wherein the adhesive sheet 2 is moved relatively to a chucking unit 4 by means of a transfer table 5, so that a semiconductor chip 3 to be picked up may be above the top 4a of the chucking unit 4; a fixing step wherein a head surface 6a of a collet 6 is brought into contact with the top of the semiconductor chip 3 to be picked up, and the semiconductor chip 3 is vacuum chucked and fixed by the collet 6; and a releasing step wherein the adhesive sheet 2 is released from the semiconductor chip 3 to be picked up by vacuum chucking the adhesive sheet 2 by the chucking unit 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor chip pick-up method and apparatus for picking up a semiconductor chip that is affixed on a pressure-sensitive adhesive sheet and individually divided from a semiconductor wafer by a dicing process from the pressure-sensitive adhesive sheet and transporting it to the next process. is there.

  As a background art, a semiconductor chip pickup device described in Patent Document 1 is exemplified. This apparatus is a pressure-sensitive adhesive sheet peeling mechanism used in a pickup device that picks up a thin chip 56 attached to a pressure-sensitive adhesive sheet 55. As shown in FIGS. 8 and 9, a plurality of suction grooves 72b are formed on the suction surface 72a. The suction peeling tool 72 provided is brought into contact with the lower surface of the adhesive sheet 55, and the suction groove 72b is vacuum-sucked to bend and deform the adhesive sheet 55 together with the chip 56 (see FIG. 9A). The pressure-sensitive adhesive sheet 55 is peeled off from the lower surface of the chip 56 (see FIGS. 9B and 9C).

JP 2004-55661 A

  However, since the pressure-sensitive adhesive sheet 55 is bent and deformed together with the chip 56 and the pressure-sensitive adhesive sheet 55 is peeled off from the lower surface of the chip 56 due to the bending deformation, the chip 56 is cracked or chipped, or the inside of the chip 56 is damaged. There is a possibility that a malfunction will occur. In particular, when the chip 56 is thin, there is a high possibility that this problem occurs.

In order to solve the above problems, a method for picking up a semiconductor chip of the present invention includes:
A pick-up method for picking up a semiconductor chip that has been affixed on a pressure-sensitive adhesive sheet and individually divided from a semiconductor wafer by a dicing step and picking it up from the pressure-sensitive adhesive sheet to the next step,
An adsorbing unit having a unit upper surface that is in contact with the lower surface of the pressure-sensitive adhesive sheet, and vacuum-adsorbing the pressure-sensitive adhesive sheet into an adsorption hole opened on the unit upper surface;
A transport table for moving the adhesive sheet relative to the suction unit;
Using a collet that has a head surface that comes into contact with the upper surface of the semiconductor chip, and vacuum-adsorbs the semiconductor chip to the head surface and conveys it to the next process,
Moving the adhesive sheet relative to the suction unit by the transport table so that a semiconductor chip to be picked up is on the upper surface of the suction unit; and
A fixing step in which the head surface of the collet is brought into contact with the upper surface of the semiconductor chip to be picked up and the semiconductor chip is fixed in a vacuum-adsorbed state by the collet;
A peeling step of peeling the pressure-sensitive adhesive sheet from the semiconductor chip to be picked up by vacuum-sucking the pressure-sensitive adhesive sheet by the suction unit.

  According to this method, the pressure-sensitive adhesive sheet is peeled off from the semiconductor chip after the semiconductor chip is vacuum-adsorbed and fixed by the collet. Therefore, unlike the conventional example, the semiconductor chip is removed at the time of peeling. The chip can be prevented from being bent and deformed, thereby preventing the semiconductor chip from being damaged.

In the semiconductor chip pickup method,
The suction unit has an opening of the suction hole larger than the size of the semiconductor chip, and includes a lifting stage in the suction hole, the lifting stage having a stage upper surface formed in a size smaller than the suction hole, The upper surface of the stage is in contact with the lower surface of the pressure-sensitive adhesive sheet in the suction hole, and is supported so as to be movable up and down between a lowered position relatively below the raised position,
In the moving stage, in the plan view, all or part of the peripheral portion of the semiconductor chip to be picked up is in the suction hole and protrudes from the upper surface of the stage. And moving the adhesive sheet relative to the lifting stage,
In the peeling step, after the pressure-sensitive adhesive sheet is vacuum-sucked by the suction unit in a state where the lift stage is in the raised position, the lift stage is moved to the lowered position while being vacuum-sucked. The mode which was made is illustrated.

  According to this method, since the pressure-sensitive adhesive sheet is first vacuum-sucked by the suction unit in a state where the elevating stage is in the raised position, the plan view is located in the suction hole and from the top surface of the stage. The pressure-sensitive adhesive sheet is peeled off from the whole or a part of the peripheral edge of the semiconductor chip to be picked up in the protruding state. Since the peripheral portion of the semiconductor chip is the place where the adhesive sheet is most easily peeled off, there is almost no damage to the semiconductor chip when the adhesive sheet is peeled off. Next, the adhesive sheet is completely separated from the semiconductor chip by moving the elevating stage to the lowered position. In this way, since the adhesive sheet is easily peeled off by pre-peeling all or part of the peripheral edge of the semiconductor chip from the adhesive sheet, the adhesive sheet is completely peeled off. The pressure-sensitive adhesive sheet can be peeled off without applying an excessive load to the semiconductor chip. For this reason, damage to the semiconductor chip can be prevented.

In addition, the semiconductor chip pickup device of the present invention includes:
A pick-up device that picks up a semiconductor chip that has been affixed on a pressure-sensitive adhesive sheet and individually divided from a semiconductor wafer by a dicing process and transports it to the next process from the pressure-sensitive adhesive sheet,
A suction unit that has a unit upper surface that comes into contact with the lower surface of the pressure-sensitive adhesive sheet, and vacuum-sucks the pressure-sensitive adhesive sheet into a suction hole that opens on the upper surface of the unit;
A transport table for moving the adhesive sheet relative to the suction unit;
A collet that has a head surface in contact with the upper surface of the semiconductor chip, and vacuum-adsorbs the semiconductor chip to the head surface and conveys it to the next process;
A control unit,
The control unit moves the adhesive sheet relative to the suction unit by the transport table so that the semiconductor chip to be picked up is on the upper surface of the suction unit. When,
A fixing step in which the head surface of the collet is brought into contact with the upper surface of the semiconductor chip to be picked up, and the semiconductor chip is fixed in a vacuum-adsorbed state by the collet;
A control process including a peeling step of peeling the pressure-sensitive adhesive sheet from the semiconductor chip to be picked up by vacuum-sucking the pressure-sensitive adhesive sheet by the suction unit is performed.

In the semiconductor chip pickup device,
The suction unit has an opening of the suction hole larger than the size of the semiconductor chip, and includes a lifting stage in the suction hole, the lifting stage having a stage upper surface formed in a size smaller than the suction hole, The upper surface of the stage is in contact with the lower surface of the pressure-sensitive adhesive sheet in the suction hole, and is supported so as to be movable up and down between a lowered position relatively below the raised position,
In the moving stage, in the plan view, all or part of the peripheral portion of the semiconductor chip to be picked up is in the suction hole and protrudes from the upper surface of the stage. And moving the adhesive sheet relative to the lifting stage,
In the peeling step, after the pressure-sensitive adhesive sheet is vacuum-sucked by the suction unit in a state where the lift stage is in the raised position, the lift stage is moved to the lowered position while being vacuum-sucked. The mode which was made is illustrated.

  Also with these pickup devices, the same effect as the pickup method can be obtained.

  The method and apparatus for picking up a semiconductor chip according to the present invention has an excellent effect of preventing damage to the semiconductor chip when the adhesive sheet is peeled off.

  1 to 8 show an embodiment embodying the present invention. Hereinafter, an embodiment in which the present invention is embodied in a semiconductor chip pickup apparatus 1 will be described with reference to the drawings, together with a method of using the apparatus 1.

  As shown in FIG. 1, the pickup device 1 of the present invention picks up the semiconductor chips 3 that are attached to the adhesive sheet 2 and individually divided from the semiconductor wafer by the dicing process from the adhesive sheet 2 and then It is conveyed to the process, and includes a suction unit 4, a conveyance table 5, a collet 6, and a control unit 7.

  The suction unit 4 has a unit upper surface 4 a that is in contact with the lower surface of the adhesive sheet 2, and includes an elevating stage 12 in the suction hole 11 that opens to the unit upper surface 4 a, and the adhesive sheet 2 is placed in the suction hole 11. Vacuum adsorption. The opening of the suction hole 11 in the unit upper surface 4a is larger than the size of the lower surface of the semiconductor chip 3 and does not cover the adjacent semiconductor chip 3 in plan view as shown in FIGS. It is formed in the opening size. The lift stage 12 is formed such that the stage upper surface 12 a is smaller than the suction hole 11 (in this example, smaller than the size of the lower surface of the semiconductor chip 3), and the stage upper surface 12 a is formed on the lower surface of the adhesive sheet 2 in the suction hole 11. Is supported so as to be able to move up and down between a raised position P1 (see FIG. 5) at which the valve contacts and a lowered position P2 (see FIG. 5) relatively below the raised position P1. It is driven up and down. The adsorption unit 4 may be provided with a heater (not shown) so that the unit upper surface 4a can be heated. The adhesive force between the semiconductor chip 3 and the pressure-sensitive adhesive sheet 2 is reduced by this heat, and the pressure-sensitive adhesive sheet 2 is easily stretched, so that the semiconductor chip 3 and the pressure-sensitive adhesive sheet 2 can be easily separated.

  The conveyance table 5 is configured to hold the pressure-sensitive adhesive sheet 2 so as not to be loosened by applying a predetermined tension, and is configured to move the pressure-sensitive adhesive sheet 2 relative to the suction unit 4. ing.

  As shown in FIG. 4, the collet 6 has a head surface 6a that comes into contact with the upper surface of the semiconductor chip 3, picks up the semiconductor chip 3 by vacuum suction to the head surface 6a, and transports it to the next process. Is. The head surface 6 a is formed to have a size substantially equal to the size of the upper surface of the semiconductor chip 3. The head surface 6a is provided with a large number of through holes 6b for vacuum-sucking the semiconductor chip 3. Alternatively, a porous material can be used for the head surface 6a.

  The control unit 7 controls the suction unit 4, the transport table 5, and the collet 6, and specifically, the following control processing is repeatedly executed sequentially (see FIG. 5). This control process implements the semiconductor chip pickup method of the present invention. In FIG. 5, solid arrows indicate vacuum suction, and two-dot chain arrows indicate the direction of mechanical operation.

(1) Movement Stage The adhesive sheet 2 is moved relative to the suction unit 4 by the transport table 5 so that the semiconductor chip 3 to be picked up is on the unit upper surface 4a of the suction unit 4 ( (See FIG. 5 (a)). At this time, as shown in FIG. 4, in plan view, the entire periphery of the semiconductor chip 3 to be picked up is located in the suction hole 11 and protrudes from the stage upper surface 12 a of the elevating stage 12. . In addition to this, the adjacent semiconductor chip 3 is set to a position that does not protrude into the suction hole 11 in plan view so that the adjacent semiconductor chip 3 is not separated from the adhesive sheet 2.

(2) Fixing stage The head surface 6a of the collet 6 is brought into contact with the upper surface of the semiconductor chip 3 to be picked up, and the semiconductor chip 3 is fixed in a vacuum-adsorbed state by the collet 6 (see FIG. 5B).

(3) Peeling Step The pressure-sensitive adhesive sheet 2 is peeled off from the semiconductor chip 3 to be picked up by vacuum-sucking the pressure-sensitive adhesive sheet 2 by the suction unit 4, and is specifically as follows.
(3-1) First, the pressure-sensitive adhesive sheet 2 is vacuum-sucked by the suction unit 4 in a state where the elevating stage 12 is at the raised position P1. Then, in the pressure-sensitive adhesive sheet 2 in the suction hole 11, a portion where the stage upper surface 12 a of the elevating stage 12 is not in contact (all the peripheral edge of the semiconductor chip 3) peels (see FIG. 5C).
(3-2) Next, the elevating stage 12 is moved to the lowered position P2 while being vacuum-sucked. Then, the adhesive sheet 2 completely peels from the entire lower surface of the semiconductor chip 3 (see FIG. 5D).

(4) Transporting stage The collet 6 transports the semiconductor chip 3 separated from the pressure-sensitive adhesive sheet 2 (see FIG. 5E). Thereafter, in order to separate the adhesive sheet 2 and the suction unit 4, the vacuum suction of the suction unit 4 is stopped and the lifting stage 12 is moved to the lifted position P1 (see FIG. 5 (f)).

  According to the pick-up method and apparatus 1 of the semiconductor chip 3 of the present example configured as described above, the adhesive sheet 2 is peeled from the semiconductor chip 3 after the semiconductor chip 3 is vacuum-adsorbed and fixed by the collet 6. Therefore, unlike the conventional example, it is possible to prevent the semiconductor chip 3 from being bent and deformed at the time of peeling, thereby preventing the semiconductor chip 3 from being damaged.

  Further, according to the pick-up method and apparatus 1 of the semiconductor chip 3 of this example, first, the pressure-sensitive adhesive sheet 2 is vacuum-sucked by the suction unit 4 in a state where the elevating stage 12 is at the raised position P1, so that the plan view Thus, the pressure-sensitive adhesive sheet 2 is peeled off from the entire periphery of the semiconductor chip 3 to be picked up that is in the suction hole 11 and protrudes from the stage upper surface 12a. Since the peripheral portion of the semiconductor chip 3 is the place where the adhesive sheet 2 is most easily peeled off, there is almost no damage to the semiconductor chip 3 when the adhesive sheet 2 is peeled off. Next, the adhesive sheet 2 is completely separated from the semiconductor chip 3 by moving the elevating stage 12 to the lowered position P2. As described above, since the entire peripheral portion of the semiconductor chip 3 is peeled off from the pressure-sensitive adhesive sheet 2 in advance, the pressure-sensitive adhesive sheet 2 is completely peeled off after the pressure-sensitive adhesive sheet 2 is easily peeled off. The pressure-sensitive adhesive sheet 2 can be peeled without applying an excessive load to the chip 3. For this reason, it is possible to prevent the semiconductor chip 3 from being damaged.

In addition, this invention is not limited to the said embodiment, For example, it can also be suitably changed and embodied as follows, for example in the range which does not deviate from the meaning of invention.
(1) As shown in FIG. 7, as shown in FIG. 7A, only one side which is a part of the peripheral edge of the semiconductor chip 3 is a top surface of the suction hole 11 and the lifting stage 12 in a plan view. 12a, first, as shown in FIG. 2B, the lifting stage 12 is set at the raised position P1, and the adhesive sheet 2 is peeled off only at one side, and then the lifting stage 12 is moved. The adhesive sheet 2 is completely peeled off at the lowered position P2.
(2) As shown in FIG. 8, as shown in FIG. 8A, only the four corners, which are part of the peripheral edge of the semiconductor chip 3, in plan view are the suction holes 11 and the stage upper surface 12 a of the lifting stage 12. First, as shown in FIG. 4B, the lifting stage 12 is set to the raised position P1, the adhesive sheet 2 is peeled only at the four corners, and then the lifting stage 12 is moved to the lowered position. Make P2 to completely peel off the adhesive sheet 2.

1 is a diagram showing an overall configuration of a semiconductor chip pickup device according to an embodiment of the present invention. It is a perspective view which shows the adsorption | suction unit of the pickup apparatus. It is a figure which shows the adsorption | suction unit, (a) is a top view, (b) is the bb sectional view taken on the line of (a). It is a figure which shows the principal part of the pick-up apparatus, (a) is a top view, (b) is the bb sectional view taken on the line of (a). It is a sectional side view which shows the pick-up method by the pick-up apparatus in steps. It is a figure which shows the principal part of the pick-up apparatus which concerns on the example of a change of the embodiment, (a) is a top view, (b) is the bb sectional view taken on the line of (a). It is a figure which shows the principal part of the pick-up apparatus which concerns on another modification of the embodiment, (a) is a top view, (b) is the bb sectional view taken on the line of (a). It is a top view which shows the adsorption | suction peeling tool in the pick-up method of the conventional semiconductor chip. It is side sectional drawing which shows the pick-up method of the conventional semiconductor chip in steps.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pickup apparatus 2 Adhesive sheet 3 Semiconductor chip 4 Adsorption unit 4a Unit upper surface 5 Transfer table 6 Collet 6a Head surface 6b Through-hole 7 Control part 11 Adsorption hole 12 Lifting stage 12a Stage upper surface P1 Raising position P2 Lowering position

Claims (4)

A pick-up method for picking up a semiconductor chip that has been affixed on a pressure-sensitive adhesive sheet and individually divided from a semiconductor wafer by a dicing step and picking it up from the pressure-sensitive adhesive sheet to the next step,
An adsorbing unit having a unit upper surface that is in contact with the lower surface of the pressure-sensitive adhesive sheet, and vacuum-adsorbing the pressure-sensitive adhesive sheet into an adsorption hole opened on the unit upper surface;
A transport table for moving the adhesive sheet relative to the suction unit;
Using a collet that has a head surface that comes into contact with the upper surface of the semiconductor chip, and vacuum-adsorbs the semiconductor chip to the head surface and conveys it to the next process,
Moving the adhesive sheet relative to the suction unit by the transport table so that a semiconductor chip to be picked up is on the upper surface of the suction unit; and
A fixing step in which the head surface of the collet is brought into contact with the upper surface of the semiconductor chip to be picked up and the semiconductor chip is fixed in a vacuum-adsorbed state by the collet;
A method for picking up a semiconductor chip, comprising: a peeling step of peeling the pressure-sensitive adhesive sheet from the semiconductor chip to be picked up by vacuum-sucking the pressure-sensitive adhesive sheet by the suction unit. The suction unit has an opening of the suction hole larger than the size of the semiconductor chip, and includes a lifting stage in the suction hole, the lifting stage having a stage upper surface formed in a size smaller than the suction hole, The upper surface of the stage is in contact with the lower surface of the pressure-sensitive adhesive sheet in the suction hole, and is supported so as to be movable up and down between a lowered position relatively below the raised position,
In the moving stage, in the plan view, all or part of the peripheral portion of the semiconductor chip to be picked up is in the suction hole and protrudes from the upper surface of the stage. And moving the adhesive sheet relative to the lifting stage,
In the peeling step, after the pressure-sensitive adhesive sheet is vacuum-sucked by the suction unit in a state where the lift stage is in the raised position, the lift stage is moved to the lowered position while being vacuum-sucked. The method for picking up a semiconductor chip according to claim 1. A pick-up device that picks up a semiconductor chip that has been affixed on a pressure-sensitive adhesive sheet and individually divided from a semiconductor wafer by a dicing process and transports it to the next process from the pressure-sensitive adhesive sheet,
An adsorbing unit having a unit upper surface that is in contact with the lower surface of the pressure-sensitive adhesive sheet, and vacuum-adsorbing the pressure-sensitive adhesive sheet into an adsorption hole opened on the unit upper surface;
A transport table for moving the adhesive sheet relative to the suction unit;
A collet that has a head surface in contact with the upper surface of the semiconductor chip, and vacuum-adsorbs the semiconductor chip to the head surface and transports it to the next process;
A control unit,
The control unit moves the adhesive sheet relative to the suction unit by the transport table so that the semiconductor chip to be picked up is on the upper surface of the suction unit. When,
A fixing step in which the head surface of the collet is brought into contact with the upper surface of the semiconductor chip to be picked up and the semiconductor chip is fixed in a vacuum-adsorbed state by the collet;
A semiconductor chip pick-up device configured to execute a control process including a peeling step of peeling the pressure-sensitive adhesive sheet from the semiconductor chip to be picked up by vacuum-sucking the pressure-sensitive adhesive sheet by the suction unit. The suction unit has an opening of the suction hole larger than the size of the semiconductor chip, and includes a lifting stage in the suction hole, the lifting stage having a stage upper surface formed in a size smaller than the suction hole, The upper surface of the stage is in contact with the lower surface of the pressure-sensitive adhesive sheet in the suction hole, and is supported so as to be movable up and down between a lowered position relatively below the raised position,
In the moving stage, in the plan view, all or part of the peripheral portion of the semiconductor chip to be picked up is in the suction hole and protrudes from the upper surface of the stage. And moving the adhesive sheet relative to the lifting stage,
In the peeling step, after the pressure-sensitive adhesive sheet is vacuum-sucked by the suction unit in a state where the lift stage is in the raised position, the lift stage is moved to the lowered position while being vacuum-sucked. 4. The semiconductor chip pick-up device according to claim 3.

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