KR100592338B1 - Electronic component pickup device, electronic component pickup method and electronic component pickup program - Google Patents

Abstract

In the pickup of an electronic component on an adhesive sheet, the electronic component can be easily peeled off from the adhesive sheet even when the adhesive force is large.

The sheet holding frame on which the adhesive sheet is mounted is set at a predetermined positional relationship (S10), and the setting is made so that the electronic component 16 to be peeled off is placed directly on the sheet stage (S12). Next, the sheet pressing mechanism is lowered, the adhesive sheet is sandwiched between the sheet stages (S14), and the push pin is pushed up in a state where the adhesive sheet is not adsorbed on the sheet stage (S16). The adhesive sheet is partially peeled off from the outer periphery of the. Thereafter, the pushing-up pin is pushed up in the state where the adhesive sheet is adsorbed on the sheet stage, the electronic component is adsorbed by the collet, and the entire electronic component is peeled off from the adhesive sheet (S18-S24).

A sheet holding frame, an adhesive sheet, a stage, a collet, a sheet stand, a pushing pin, a setting processing part, a peeling processing part, a conveyance processing part.

Description

ELECTRONIC COMPONENT PICKUP APPARATUS, ELECTRONIC COMPONENT PICKUP METHOD AND ELECTRONIC COMPONENT PICKUP PROGRAM

1 is a block diagram of an electronic component pickup apparatus in an embodiment according to the present invention.

It is a top view of the sheet stand in embodiment which concerns on this invention.

It is sectional drawing of the sheet stand in embodiment which concerns on this invention.

It is a figure which shows the situation of a sheet press in embodiment which concerns on this invention.

5 is a flowchart of a processing procedure of the electronic component pickup in the embodiment according to the present invention.

It is a figure which shows the state in which the set of the seat stand and the electronic component was performed in the electronic component pick-up process of embodiment which concerns on this invention.

It is a figure which shows the state of a sheet press in the electronic component pick-up process of embodiment which concerns on this invention.

FIG. 8 is a diagram illustrating a state in which part peeling is performed in the electronic component pickup process according to the embodiment of the present invention.

It is a figure which shows the state which adsorb | sucks an adhesive sheet after partial peeling in the electronic component pick-up process of embodiment which concerns on this invention.

It is a figure which shows the state which pushes up a pushing pin with the adhesive sheet adsorb | sucking in the electronic component pick-up process of embodiment which concerns on this invention.

It is a figure which shows the state in which an electronic component is adsorbed by a collet in the electronic component pick-up process of embodiment which concerns on this invention.

(Explanation of the sign)

10 Electronic component pickup device 12 Seat retainer

14 Adhesive Sheet 16 Electronic Components

18, 18a, 18b Remaining seat 20 Device

30 stage 40 seat pressing mechanism

42 click part 44 collet

50 seat stand 52 top view

54 recess 56 vacuum furnace

58 pin hole 60, 62, 64, 66 uncut

70 push pins 100 control

102 CPU 130 Retention Frame Setting Processing Unit

132 Seat stand setting processing unit 134 Part peeling processing unit

136 Whole Peel-Off Processing Unit 138 Transfer Processing Unit

Regarding the pick-up of the electronic parts, in particular, a plurality of electronic parts that are adhesively held on the adhesive face side of the adhesive sheet attached to the sheet holding frame and separated from each other are separated from the back face side of the adhesive face of the adhesive sheet through the adhesive sheet. An electronic part pick-up apparatus, an electronic part pick-up method, and an electronic part pick-up program which peel off and convey these electronic parts sequentially from an adhesive sheet by pushing up are related.

In order to take out a plurality of LSI chips or the like arranged on the wafer as individual chips, first, the wafer is separated into individual chips by a dicing apparatus or the like, and then picked up one by one. An adhesive sheet can be used for the separation of such a plurality of chips, the orderly holding of the separated plurality of chips, and the sequential pickup of the held chips. Therefore, the technique which peels an individual chip from an adhesive sheet and picks up sequentially is needed.

In Patent Literature 1, a wafer is diced onto a pressure-sensitive adhesive sheet side attached to a wafer ring, and a chip made of individual pieces is transferred and pasted, and a pin is used to move the pressure-sensitive adhesive sheet from the back side of the pressure-sensitive adhesive side in the pressure-sensitive adhesive sheet. The pushing mechanism which pushes and presses an individual chip | tip is peeled off from an adhesive sheet is described. Then, when the chip is removed by the pushing mechanism, the chip is adsorbed by the collet and the adsorption state is maintained until the chip is peeled off from the adhesive sheet, and the back side of the adhesive surface in the adhesive sheet is adsorbed and held. The method of adsorb | sucking a chip | tip by a collet from an adhesive surface side, and maintaining the adsorption state of a chip until a chip | tip is peeled off from an adhesive sheet is disclosed.

(Patent Document 1) Japanese Unexamined Patent Publication No. 2002-50670

However, as the chip becomes larger, the adhesive force between the adhesive sheet and the chip increases in proportion to the chip area, and it becomes increasingly difficult to peel off by the adsorption force of the collet or the force of adsorption of the collet plus the collet.

The increase in size of the object to be picked up is the increase in chip size due to the increase in size of the LSI chip. In addition, in recent years, as the technology for manufacturing packaged electronic components separated from each other in units wrapped by a package material has been advanced by so-called CSP (Chip Size Package) technology or the like, The size may increase in size.

For example, a plurality of small circuit boards are arranged in a connected manner, and large boards each including semiconductor chips and the like are formed on each small circuit board, and the entire large board is wrapped with a resin or the like. In this way, a large substrate wrapped entirely in a package material such as resin or the entire LSI wafer is entirely wrapped in a package material such as resin in the same manner as in an LSI wafer in which a plurality of LSI chips are arranged in alignment. In other words, it can be called a broad substrate.

The broad board | substrate wrapped in this package material is affixed on an adhesive sheet, and can be isolate | separated into individual small circuit boards or individual LSI chips wrapped in a package material by a dicing apparatus. These individually separated packaged electronic components may be considerably larger in size than conventional LSI chips. In such a case, it becomes difficult to peel off a large electronic component by resisting adhesive force. As one countermeasure, although the adhesive sheet with low adhesive force can be used, since several types of adhesive sheets are prepared and they are screened in some cases, it becomes a complicated process.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem of the prior art and to provide an electronic component pick-up apparatus, an electronic component pick-up method, and an electronic component pick-up program that can easily remove an electronic component from an adhesive sheet even if the adhesive strength is large.

In order to achieve the said objective, the electronic component pick-up apparatus which concerns on this invention adhere | attaches and hold | maintains the some electronic component isolate | separated from the adhesive surface side of the adhesive sheet attached to the sheet holding frame, and mutually separated, and the back surface of the adhesive surface of an adhesive sheet. An electronic component pickup device that sequentially peels off these electronic parts from the pressure sensitive adhesive sheet by pushing them up from the side to the pin through the pressure sensitive adhesive sheet, and is disposed on the back surface side of the pressure sensitive adhesive sheet to adsorb and hold the pressure sensitive adhesive sheet. A sheet holding mechanism having a hole and a sheet pressing mechanism arranged on the adhesive face side of the adhesive sheet, the adhesive sheet being held between the sheet stand at a pressing position close to the outer circumference of the electronic component to be peeled off. From the back side of the pressure-sensitive adhesive sheet of the pressure-sensitive adhesive sheet and the pressure-sensitive adhesive sheet, the electronic component is pinched through the pressure-sensitive adhesive sheet. The lifter includes a pushing mechanism, pushes up an electronic component to be peeled off by the pushing mechanism in a state in which the sheet stand does not adsorb, partially peels off the adhesive sheet from the outer periphery of the sheet pressing side of the electronic component, After that, the entire electronic part is peeled off from the adhesive sheet and picked up.

Moreover, in the electronic component pick-up apparatus which concerns on this invention, a some electronic component is the packaged electronic component isolate | separated from each other by the unit wrapped by the package material, and the sheet | seat pressing mechanism is adjacent to the electronic component to peel off. It is preferable that it is a mechanism which presses an adhesive sheet in the pressing position which is the outer periphery of an electronic component and is close to the electronic component of the object to peel off.

Moreover, in the electronic component pick-up apparatus which concerns on this invention, a some electronic component is a packaged electronic component isolate | separated from each other as a unit wrapped by the package material, and is a dummy seat which is wider than a separation site when separating neighboring electronic components. The remaining positions left between the neighboring electronic components after separation are also adhered to the adhesive sheet, and the sheet pressing mechanism is an outer periphery of the remaining positions adjacent to the electronic components to be peeled off. It is preferable that it is a mechanism which presses an adhesive sheet in the press position close to a component.

Moreover, the electronic component pick-up method which concerns on this invention adhere | attaches the adhesive sheet from the back surface side of the adhesive face of the adhesive sheet in the several adhesive parts hold | maintained by the adhesive face side of the adhesive sheet attached to the sheet | seat holding frame, and separated from each other. An electronic component pick-up method in which these electronic components are sequentially peeled off from an adhesive sheet by being pushed up by a pin through them, and are transported, comprising: a setting step of setting an adhesive sheet on which a plurality of electronic components are adhesively held, and adsorbing and holding the adhesive sheet. The sheet holding unit and the sheet holding unit for arranging the sheet stage having the adsorption holes on the back surface side of the pressure-sensitive adhesive sheet of the pressure-sensitive adhesive sheet, and at the pressing positions close to the outer periphery of the electronic component or outside of the electronic component to be peeled off, In the state of the sheet press which presses an adhesive sheet and presses between the sheet | seat stand of the state which stopped adsorption, and the adhesive sheet is pressed Then, the part to be peeled off is pushed up from the back side of the adhesive face to the pin through the adhesive sheet, and partly peeled off to partially peel off the adhesive sheet from the outer periphery of the sheet pressing side of the electronic part, and a part from the electronic part. It is characterized by including the peeling process of peeling off and conveying the whole electronic component from the adhesive sheet of the state which started to peel.

Moreover, the electronic component pick-up program which concerns on this invention adhere | attaches the adhesive sheet on the adhesive face side of the adhesive sheet attached to the sheet | seat holding frame, and isolates the adhesive sheet from the back surface side of the adhesive face of the adhesive sheet. An electronic component pick-up program executed in an electronic component pick-up apparatus that sequentially peels off these electronic components from the adhesive sheet by pushing them up through a pin through the pins, and the setting processing procedure for setting the adhesive sheet on which a plurality of electronic components are adhered and held; The sheet stage arrangement processing procedure which arrange | positions the sheet stand which has the adsorption hole which adsorb | sucks and hold | maintains an adhesive sheet in the back surface side of the adhesive face of an adhesive sheet, and the outer periphery of the electronic component from the outer side of the electronic component to peel off, At the pressing position, the sheet pressing portion is sandwiched between the sheet pressing portion and the sheet stage in the state of stopping adsorption and pressed. In the state of the rolling process and the adhesive sheet being pressed, the electronic component to be peeled off is pushed up from the back side of the adhesive face to the pin through the adhesive sheet, and the adhesive sheet is partially peeled off from the outer periphery of the sheet pressing side of the electronic component. The inside is characterized by executing a parting peeling process procedure and a parting peeling procedure for peeling off and conveying the entire electronic part from the adhesive sheet in a state where part peeling starts from the electronic part.

(The best form to carry out invention)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described in detail using drawing. In addition, below, the packaged electronic component separated from each other by the unit wrapped by the package material is demonstrated as an electronic component to pick-up, But besides, it adheres to the adhesive surface side of an adhesive sheet, and is mutually separated. It may be an electronic component. For example, the LSI chip may be separated from the LSI wafer by dicing. In addition, below, although it demonstrates as an exclusive installation which has a part peeling process, you may provide the means which can select a part peeling process, and can select between the conventional pick-up method which does not have a part peeling process. . In addition, although each sub dimension corresponding to this is demonstrated using the size of an electronic component as 35 mm angle, these are the illustrations to the last, and dimensions other than these may be sufficient.

1 is a block diagram of an electronic component pickup apparatus 10. In FIG. 1, although it is not a component of the electronic component pick-up apparatus 10, it also shows that it is set to the electronic component pick-up apparatus 10 and becomes a target of a pick-up operation. That is, the adhesive sheet 14 attached to the sheet | seat holding frame 12 and the some electronic component 16 adhesively hold | maintained on the adhesive surface side of the adhesive sheet 14, and mutually separated are shown. In addition, the adhesive sheet 14 is a single-sided adhesive sheet in which the adhesive agent was apply | coated only to the single side | surface side of a plastic film.

Here, the electronic component 16 is a board | substrate with which the extensive board | substrate wrapped with the package material was isolate | separated from each other by dicing, and is the packaged electronic component wrapped by the package material in the state separated from each other. The size is 35 mm square as an example. In addition, in FIG. 1, the remaining seat 18 is shown around the individual electronic components 16. In dicing, a dummy seat is provided between neighboring electronic components, and the width of the dummy seat is larger than the separation seat, which is the width of the grooves actually carved by dicing. The difference between the dummy seat and the separating seat is the remaining seat 18, and the remaining seat 18 is also adhered and held on the adhesive sheet 14. The width dimension of the remaining seat 18 can be about 1-3 mm as an example. The dummy seat may be made the same as the separate seat so that there are no remaining seats. In that case, the electronic components 16 are arranged to be separated from each other and adjacent to each other.

The electronic component pick-up apparatus 10 is connected with the apparatus main body 20 which has elements, such as a mechanism which picks up electronic components sequentially from an adhesive sheet, and the apparatus main-body part 20, and makes each component a whole. It is configured to include a control unit 100 for controlling.

The apparatus main body 20 holds the sheet retaining frame 12 and is movable in the X, Y, Z, and θ directions shown in FIG. 1 and upwards in the Z direction with respect to the stage 30. A sheet pressing mechanism 40 for pressing the adhesive sheet 14 hardly, a collet 44 for suction-supporting the electronic component 16, and fixed to the stage 30 in the lower direction in the Z direction. And a seat pin 50 to be used, a push pin 70 provided inside the seat table 50, and an actuator for operating these elements.

The stage 30 has a ring-shaped support portion for holding the sheet retaining frame 12, and is movable in the orthogonal triaxial directions of X, Y, and Z shown in FIG. 1, and furthermore, the center of the ring-shaped support portion. This stage is capable of rotating θ around the axis. When the sheet holding frame 12 is attached to the stage 30, shapes, such as a ring-shaped support part, are set so that the surface of the adhesive sheet 14 may become parallel to an XY plane. By the movement functions of the stage 30 in the X-axis and Y-axis directions, the stage 30 can be positioned with respect to the seat table 50. Moreover, the back surface side of the adhesive surface of the adhesive sheet 14 and the upper surface of the sheet stand 50 can be contacted or spaced apart by the movement function of a Z-axis direction. Moreover, by the (theta) rotation function, the arrangement direction of the electronic component on the sheet | seat holding frame 12 can be matched in the X-axis and Y-axis direction. The stage 30 is driven by the stage actuator 84 in accordance with the instruction of the control unit 100. The stage actuator 84 can be comprised with several stepping motors.

The sheet pressing mechanism 40 is a member which can be vertically moved in the Z direction, and has a function of sandwiching and pressing the adhesive sheet 14 between the sheet holder 50. Specifically, the thickness t in the X direction is about 1 mm, and the length L in the Y direction has an elongated pressing portion 42 of about 40 mm, and the (about 1 mm × about 40 mm) of the pressing portion 42 It is arrange | positioned so that a surface may become parallel to the upper surface 52 of the seat stand 50, and it can move up and down in a Z direction, maintaining this parallel relationship. As will be described later, since the seat stand 50 is a fixed position, the relative position at which the pressing portion 42 descends relative to the seat stand 50 is always the same. As shown in FIG. 1, the relative positional relationship is set so that the press part 42 may descend | fall to the position which is a position deviating from the center of the sheet | seat 50 in the -X direction. The more detailed meaning of this relative position is demonstrated in detail in the positional relationship with the electronic component 16 of the object to peel off. The sheet pressing mechanism 40 is driven by the sheet pressing actuator 80 under the instruction of the control unit 100.

The seat table 50 has a concave portion 54 for adsorbing the adhesive sheet 14 to a part of the upper surface 52, and the push pin 70 that can be vertically moved in the Z direction among the pin holes 58. It is a cylindrical part incorporating the structure, and the position is fixed to the apparatus main body 20 so as to be installed. When the size of the seat stand 50 corresponds to the above-mentioned 35 mm-angle electronic component 16, the diameter D can be about 60 mm, and the height H can be about 15 mm.

The top view of the seat stand 50 is shown in FIG. 2, and the A-A cross section is shown in FIG. Most of the area of the upper surface 52 of the seat table 50 is provided with a recess 54 having a depth of about 0.8 mm. The recessed part 54 is connected to the vacuum pump 86 via the vacuum path 56. The surface of the unclosed part of the upper surface 52 of the sheet stand 50 becomes a surface which contacts the back surface side of the adhesive sheet 14 when the stage 30 is lowered. When the vacuum pump 86 is driven here, the inside of the recess 54 is depressurized through the vacuum path 56, and the adhesive sheet 14 is subjected to the suction force in the recess 54. The adhesive sheet 14 can be adsorb | sucked and held on the upper surface 52 of ().

The part which is not recessed in the upper surface 52 of the seat stand 50 is the part 60 of about 2 mm width of the outer periphery of a 1st path. This part 60 has a function which interrupts | blocks with atmospheric pressure, when the recessed part 54 is depressurized.

The second non-dented portion is four elongated island-shaped portions 62 disposed radially with respect to the center of the seat table 50. The pinholes 58 are provided in the four island-like portions 62, respectively. That is, the top surface of each island shape has a function as a surface which contacts the adhesive sheet 14 in the vicinity of the pinhole 58.

The third non-dented portion is nine circular portions 64 arranged around the center of the seat table 50 and the island-like portion 62. These nine circular portions are arranged symmetrically with respect to the center of the seat table 50. When these centers are connected, they are arranged so as to be a rectangle of approximately 32 mm angle. That is, the upper surface of each circular portion 64 has a size of about 35 mm angle through the adhesive sheet 14 when the electronic component 16 to be peeled off is directly above the seat table 50. It has a function as a surface which supports the peripheral part of four sides of an electronic component. The appearance can be seen in FIG. Here, FIG. 4 is a figure which shows the positional relationship of each element at the time of sheet pressing, and stages 30 so that the center of the electronic component 16 to peel off may correspond with the center of the sheet stand 50 here. The arrangement on the adhesive sheet 14 of the electronic component 16 and the remaining seat 18 at the time of movement is shown.

The fourth non-dented portion is the twelve rectangular portions 66 arranged outside the circular portion 64. These twelve rectangular portions are arranged symmetrically with respect to the center of the seat table 50, and when these centers are connected, they are arranged so as to have a rectangular shape of about 37 mm. That is, the upper surface of each rectangular portion 66 has four sides of the electronic component 16 having a size of about 35 mm when the electronic component 16 to be peeled off is placed directly above the seat table 50. It has a function as a surface which supports the back surface side of the adhesive sheet 14 in the part near to the outer periphery of the electronic component 16 from the outer side. As shown in FIG. 4, since there are residual seats 18a and 18b in this part of the adhesive sheet 14, respectively, the upper surface of each rectangular-shaped part 66 is the remaining seats 18a and 18b and the like. It acts as a surface which supports the back surface side of the adhesive sheet 14 in the part of.

As mentioned above, although the relative positional relationship in the XY plane of the sheet stand 50 and the sheet | seat pressing mechanism 40 is always the same, the positional relationship is sheet | seat pressing with respect to each rectangular part 66 of this rectangular shape. The position of the pressing part 42 at the tip of the mechanism 40 is set to correspond. In other words, when the sheet pressing mechanism 40 is lowered when the electronic component 16 to be peeled off is directly above the seat table 50, the pressing portions 42 at the tip end thereof are the remaining seats 18a and 18b. In detail, the upper surface of the remaining seat 18a located in the -X direction of the electronic component 16 to be peeled off is contacted, and the remaining seat 18a is pressed firmly toward the seat table 50. Figure 4 shows its aspect. That is, an elongate surface having a thickness t of about 1 mm and a length L of about 40 mm of the pressing portion 42 opposes the rectangular portion 66 via the remaining seat 18a. When looking at the structure of this part of the Z direction, the rectangular part 66 in the press part 42-residual part 18a-adhesion sheet 14-the seat stand 50 of the sheet | seat pressing mechanism 40 is shown. The upper surface of the "), and the adhesive sheet 14 is interposed between the pressing portion 42 of the sheet pressing mechanism 40 and the upper surface of the rectangular portion 66 on the sheet stage 50. It is embedded and pressed.

The pin holes 58 respectively provided in the four island-shaped portions 62 which are not recessed have a function of accommodating the pushing pins 70 which can be moved up and down in the Z direction, and serve as a vertical movement guide. The pin hole 58 is not connected to the vacuum pump 86. The pushing pin 70 may be made of a ceramic or metal pin having a flat tip or a hemispherical shape. Driving of the up-and-down movement of the pushing pin 70 is performed by the pushing pin actuator 88. As shown in FIG. The range of the vertical movement of the pushing pin 70 with respect to the upper surface 52 of the sheet stand 50 is normally pulled about 0.5-2 mm from the upper surface 52 of the seat stand 50, and protrudes. In this case, the upper surface 52 may protrude about 0.2-1 mm. In addition, the pushing speed may be variable.

Returning to FIG. 1 again, the collet 44 is a component which is attached to the tip of a conveyance arm (not shown) and adsorbs and holds the electronic component 16. The conveyance arm moves the predetermined conveyance path, thereby It has the function to adsorb | suck and hold | maintain 16 from the adhesive sheet 14, and to convey to a predetermined position. The collet 44 has a concave portion for adsorbing the electronic component 16, has a vacuum passage connected to the concave portion therein, and is connected to a pickup vacuum pump, in which a vacuum passage is not shown. The position where the collet 44 adsorbs the electronic component 16 is set to the position corresponding to the center of the sheet | seat 50. As shown in FIG. The drive of the collet 44 and the conveyance arm which is not shown is performed by the conveyance actuator 82. FIG.

The control part 100 is connected with the apparatus main-body part 20, controls each component, picks up the electronic component 16 sequentially from the adhesive sheet 14, and performs the process which conveys to a predetermined position. It has a function and can be configured with a general computer. The control unit 100 includes a CPU 102, an input unit 104 such as a keyboard or an operation panel, an output unit 106 such as a display, and an external storage device 108. Moreover, the control part 100 is an interface corresponding to each actuator, such as the sheet | seat press actuator 80 of the apparatus main body 20, and the vacuum pump 86, and push-up pin I from the sheet | seat press (I / F110). / F118). Each component in the control part 100 is connected to each other by the internal bus.

The CPU 102 instructs each actuator or vacuum pump 86 such as the sheet pressing actuator 80 or the like to sequentially pick up the electronic component 16 from the adhesive sheet 14 in accordance with a predetermined sequence. Has the ability to run. To perform these processes, software can be used, and predetermined processes can be performed by executing a corresponding electronic component pickup program. It is also possible to execute some of the processing in hardware.

The function of the conveyance processing part 138 from the holding frame setting processing part 130 in CPU102 is demonstrated below using FIG. 5 which is a flowchart of the processing procedure of an electronic component pickup. 6-11, the state of the sheet | seat 50, the sheet | seat pressing mechanism 40, etc. corresponding to each processing procedure are also demonstrated together as needed. 6 to 11, the seat table 50 and the like are schematically illustrated.

When the electronic component pick-up apparatus 10 is pushed up, each component of the CPU 102 and the apparatus main body 20 is set to an initial state by the not shown initial setting function of the control part 100. For example, as the initial state, the stage 30 is in the retracted position in the raised state, the seat pressing mechanism 40 is in the raised position, and the pushing pin 70 is in the position pulled into the pin hole 58, The vacuum pump 86 can be turned off.

In this state, the arbitrary sheet holding frame 12 is taken out from the holding frame magazine which is not shown in figure, and is attached to the ring-shaped support part of the stage 30. As shown in FIG. This process may use the conveyance mechanism which is not shown in figure, and an operator may perform it manually. Next, an instruction is given to the stage actuator 84 by the function of the holding frame setting processing part 130, and the holding frame setting process, such as adjustment of the attachment angle of the sheet holding frame 12, is performed (S10). For example, the stage 30 is moved in the X-axis direction and the Y-axis direction, the movement trajectory of the electronic component 16 is detected at that time, and the arrangement direction of each electronic component 16 is the X-axis and the Y-axis. The seat holder 12 is rotated so as to be parallel, and clamped in that state.

The device main body 20 is provided with a chip position identification device (not shown), and the positions of the respective electronic components are identified. Thus, the position of the electronic component 16 to be peeled off is identified, and the position of the electronic component 16 is set to the position of the sheet stage 50 by the function of the sheet stage setting processing unit 132 (S12). . This set instruction is performed in two stages. Initially, the stage actuator 84 is given a driving instruction in the XY plane, and the stage 30 is moved so that the electronic component 16 to be peeled off is placed directly on the seat table 50. In more detail, a movement instruction is performed so that the center of the target electronic component 16 and the center of the sheet | seat 50 may be aligned. Next, the stage actuator 84 is given a driving instruction for descending in the Z direction, and the stage 30 is lowered at that position, so that the back surface of the adhesive surface of the adhesive sheet 14 is replaced by the upper surface 52 of the seat table 50. Access to Preferably, the degree that the upper surface 52 is exactly in contact with the rear surface of the adhesive surface is good. This state is shown in FIG.

The part peeling processing part 134 processes the part of peeling the adhesive sheet 14 from the outer peripheral part of the electronic component 16 to be peeled off by giving a driving instruction to the sheet pressing actuator 80 and the pushing pin actuator 88. Has the function of doing This function is performed by sheet pressing process S14 and pin pushing process S16. During the processing of S14 and S16, the vacuum pump 86 is not given a drive instruction. That is, the adhesive sheet 14 is only a state loaded on the upper surface 52 of the sheet stand 50, and is not maintained by adsorption.

First, in the state where the upper surface 52 of the seat stand 50 is in contact with the back surface side of the adhesive sheet 14, the sheet pressing actuator 80 is instructed to lower the sheet pressing mechanism 40, and then presses. The portion 42 is pressed firmly to the remaining seat 18a, and the adhesive sheet 14 is sandwiched between the sheet holder 50 and pressed (S14). This state is shown in FIG.

Next, the push pin actuator 88 is instructed, and the push pin 70 is pushed up from the seat table 50 (S16). The pushing pins 70 may push up all four equally, or may push up two close by the pressing position which the press part 42 presses the remainder 18a. The latter state is shown in FIG. Since the adhesive sheet 14 is not adsorb | sucked by the sheet | seat stand 50, it is only being fixed at the pressing position of the remaining seat 18a, and the adhesive sheet 14 is pushed up by the pushing-up pin 70. ) Is in a state of floating above the upper surface 52 of the seat table 50. Since the adhesive sheet 14 is fixed at one pushing position and the other part is floated by the pushing pin 70, the shape is suddenly bent between the pushing position and the pushing position of the pushing pin 70. do. On the other hand, although the electronic component 16 moves upwards in the Z direction under the influence of the adhesive sheet 14, the shape change does not occur in the degree of pushing up of the pin. Due to the difference in shape change followability between the pressure sensitive adhesive sheet 14 and the electronic component 16, as illustrated in FIG. 8, the pressure sensitive adhesive sheet 14 is formed on the outer periphery of the electronic component 16 on the pressing part 42 side. Is stripped off some. By this partial peeling, air flows into the interface with the adhesive sheet 14 at the outer circumference of the electronic component 16. At this air-flowed interface, the adhesive force is significantly lowered.

The whole peeling-out processing part 136 uses this part peeled-off state, and also gives the push pin actuator 88, the vacuum pump 86, etc. to instruct the whole electronic component 16 from the adhesive sheet 14, and the like. It has a function of performing a peeling process. Specifically, the process of releasing the sheet press (S18), the process of adsorbing the adhesive sheet to the sheet stage (S20), and the process of pushing up the pushing pin (S22) are performed.

First, the push pin actuator 88 is instructed, and the push pin 70 is pulled into the pin hole 58. Next, an instruction is given to the sheet press actuator 80, the sheet press mechanism 40 is raised, and the sheet press is released (S18). Then, a driving instruction is given to the vacuum pump 86, and the inside of the recess 54 is depressurized by the path of the "vacuum pump 86-the vacuum path 56-the recess 54", and the pressure-sensitive adhesive sheet ( 14) is adsorbed on the upper surface of the seat table 50 (S20). This state is shown in FIG. In FIG. 8, the pressure-sensitive adhesive sheet 14 that has been floated from the sheet rest 50 returns to the upper surface 52 side of the seat rest 50 again. At this time, since the electronic component 16 is not actively pressed against the adhesive sheet 14, air is introduced into the interface at the outer periphery of the electronic component 16, and the state in which the adhesive force is significantly reduced is almost maintained. .

Next, a driving instruction is given to the pushing pin actuator 88, and the pushing pin 70 is pushed up from the seat table 50 (S22). It is preferable to perform pushing up with respect to all four pushing pins. The state is shown in FIG. At this time, since the vacuum pump 86 continues its operation, the adhesive sheet 14 is pushed up from the upper surface 52 of the seat table 50 by the pushing pin 70, and the recessed portion at the position around it. By the pressure reduction in 54, it adsorb | sucks to the upper surface 52 of the sheet stand 50. As shown in FIG. Thus, the adhesive sheet 14 suddenly bends in the vicinity of the pushing pin 70. On the other hand, although the electronic component 16 moves upwards in the Z direction under the influence of the adhesive sheet 14, the shape change does not occur to the extent of pushing up the pins. Due to the difference in shape change followability between the pressure sensitive adhesive sheet 14 and the electronic component 16, a peeling force is generated between the pressure sensitive adhesive sheet 14 and the electronic component 16. Also in this case, when the electronic component 16 is large, the adhesive force is also very large, and there is a competition with the peeling force. However, since air has already flowed into the interface with the pressure sensitive adhesive sheet 14 at the outer periphery of the electronic component 16 and is beginning to peel off partly, further inflow of air easily occurs from this portion. Therefore, the peeling of the adhesive sheet 14 progresses over the whole of the electronic component 16 from this part which is beginning to peel, and the adhesive force of the whole between the electronic component 16 and the adhesive sheet 14 rapidly increases. Degrades. The state is shown in FIG.

In the state of FIG. 10, the electronic component 16 is almost starting to peel off from the adhesive sheet 14, but is still loaded on the adhesive sheet 14. Therefore, the conveyance actuator 82 is instructed, the electronic component 16 is removed from the adhesive sheet 14, and is conveyed to a predetermined position. Specifically, a process of adsorbing the electronic component to the collet (S24) and a process of holding the electronic component to the collet and conveying it to a predetermined position (S26) are performed.

First, the conveying actuator 82 is instructed to lower the collet 44 and to contact the electronic component 16 to adsorb it. The lowering of the collet 44 is performed by operation of a conveyance arm (not shown), and adsorption is performed by operating a pickup vacuum pump (not shown). As a result, the collet 44 adsorbs (S24) and holds the electronic component 16 on the pressure sensitive adhesive sheet 14. Next, the collet 44 is instructed to be raised, and the entire electronic component 16 is peeled off from the adhesive sheet 14. The state is shown in FIG. Thereafter, an instruction is given to the operation of the conveyance arm (not shown), and the electronic component 16 held by the collet 44 at the tip of the conveyance arm is conveyed to a predetermined position (S26). The conveyance can be performed by, for example, turning the conveyance arm.

In this way, the electronic component 16 to be peeled off is peeled off from the adhesive sheet and conveyed to a predetermined position. The chip position identification device (not shown here) determines whether or not all the electronic components are picked up from the sheet holding frame (S28). If it is determined that pickup has not yet been completed for all the electronic components, the process returns to S12 again, and the above steps are repeated for the next electronic component to be peeled off. If it is determined that the pick-up has ended for all the electronic components, the pick-up procedure for this sheet holding frame is completed.

In this way, by partially peeling off, air is introduced between the electronic component and the adhesive sheet, and further peeling is carried out from this portion to peel off the entire electronic component, so that the electronic component is easily removed from the adhesive sheet even when the adhesive force is high. Can be peeled off.

In the above, the whole peeling process was demonstrated by the procedure of sheet press release (S18)-adhesive sheet adsorption (S20)-pin up (S22)-collet adsorption (S24). In addition, depending on the degree of peeling off, these procedures may be omitted or the procedures may be replaced. For example, when peeling to some extent is advanced by partial peeling off, it can perform collet adsorption as it is and peels off whole. Moreover, when adhesive force is considerable strong, you may perform the procedure after S20, without performing sheet press release, but performing sheet press. Alternatively, the collet adsorption may be set before or immediately after the sheet adsorption, and pin pushing may be performed while adsorbing the electronic component.

With the above configuration, the sheet pressing mechanism sandwiches and presses the adhesive sheet between the sheet stand and the pressing position close to the outer circumference of the electronic component to be peeled off. And the electronic component to be peeled off is pushed up by the pushing mechanism in a state in which the sheet stand does not adsorb | suck, and a part of adhesive sheet is peeled off from the outer periphery of the sheet | seat pressing side of the electronic component. That is, the adhesive sheet is partially peeled off around the electronic component corresponding to the pressing position, and air enters between the bottom surface of the electronic component and the adhesive sheet, whereby the adhesive sheet is likely to peel off. Therefore, in subsequent work, it becomes easy to peel off the whole electronic component from an adhesive sheet. Thus, since the electronic component is peeled off from the adhesive sheet in two steps, the electronic component can be easily peeled off from the adhesive sheet even when the adhesive force is large.

For the packaged electronic component, the outer circumference of the electronic component adjacent to the electronic component to be peeled off or the outer circumference of the remaining position adjacent to the electronic component to be peeled off is set as a pressing position. In other words, the sheet pressing mechanism does not directly press the adhesive sheet between the sheet stand, but rather presses through the remaining positions made of the packaged electronic component or the package material. Therefore, it is not necessary to worry about adhesion between the pressing portion of the sheet pressing mechanism and the adhesive sheet, and the operation becomes easier.

As explained above, according to the electronic component pick-up apparatus, the electronic component pick-up method, and the electronic component pick-up program which concern on this invention, even if adhesive force is large, an electronic component can be peeled off easily from an adhesive sheet and can be picked up.

Claims (5)

These electronic components are adhered to the pressure-sensitive adhesive sheet side of the pressure-sensitive adhesive sheet attached to the sheet holding frame by pushing a plurality of electronic components separated from each other by a pin through the pressure-sensitive adhesive sheet from the back surface side of the pressure-sensitive adhesive sheet of the pressure-sensitive adhesive sheet. In the electronic component pick-up apparatus which peels off and conveys sequentially from the back, WHEREIN: The sheet stand which is arrange | positioned at the back surface side of the adhesive face of an adhesive sheet, has a suction hole which adsorbs-holds an adhesive sheet, and presses the sheet arrange | positioned at the adhesive face side of an adhesive sheet. As a mechanism, from the back side of the sheet | seat pressing mechanism which pinches and presses an adhesive sheet between sheet stand | seats at the press position which is the outer side of the electronic component to peel off, and is close to the outer periphery of the electronic component, and the adhesive face of the adhesive sheet. And a pushing mechanism for pushing the electronic parts through the pressure-sensitive adhesive sheet with a pin, and the sheet stand does not perform suction. The electronic component to be peeled off is pushed up by the push-up mechanism to partially peel off the adhesive sheet from the outer periphery of the sheet pressing side of the electronic component, and then the entire electronic component is peeled off from the adhesive sheet and picked up. Electronic component pickup device. The electronic component according to claim 1, wherein the plurality of electronic components are packaged electronic components separated from each other in units wrapped by a package material, and the sheet pressing mechanism is peeled off as an outer circumference of an electronic component adjacent to the electronic component to be peeled off. An electronic component pick-up apparatus, wherein the adhesive sheet is a mechanism for pressing an adhesive sheet at a pressing position proximate to an electronic component to be put out. The electronic component of claim 1, wherein the plurality of electronic components are packaged electronic components that are separated from each other in units wrapped by a package material, and when a neighboring electronic component is separated, a dummy site wider than the separation portion is provided, and the neighboring portion is separated after the separation. The remaining seats left between the electronic parts to be held are also adhered to the adhesive sheet, and the sheet pressing mechanism is an outer periphery of the remaining seats adjacent to the electronic parts to be peeled off, and at a pressing position close to the electronic parts to be peeled off, An electronic component pick-up device, which is a mechanism for pressing an adhesive sheet. These electronic components are adhered to the pressure-sensitive adhesive sheet side of the pressure-sensitive adhesive sheet attached to the sheet holding frame by pushing a plurality of electronic components separated from each other by a pin through the pressure-sensitive adhesive sheet from the back surface side of the pressure-sensitive adhesive sheet of the pressure-sensitive adhesive sheet. An electronic component pick-up method of sequentially peeling off and conveying from a sheet, comprising: a setting step of setting an adhesive sheet on which a plurality of electronic components are adhered and held, and a sheet stand having adsorption holes for adsorbing and holding the adhesive sheet. Adhesion between the sheet pressing portion and the sheet stage in the state where adsorption is stopped at a pressing position that is disposed on the back side of the sheet and at a pressing position that is outside the electronic component to be peeled off and close to the outer circumference of the electronic component. The sheet pressing step of inserting the sheet and pressing the sheet, and the electronic component to be peeled off while the adhesive sheet is pressed to the back side of the adhesive surface. Part of the peeling process of peeling off the adhesive sheet from the outer periphery of the sheet pressing side of the electronic component, and peeling off the entire electronic component from the adhesive sheet in a state where the peeling part of the electronic component starts to peel off. An electronic component pick-up method, comprising a peeling step of carrying out and conveying. These electronic components are adhered to the pressure-sensitive adhesive sheet side of the pressure-sensitive adhesive sheet attached to the sheet holding frame by pushing a plurality of electronic components separated from each other by a pin through the pressure-sensitive adhesive sheet from the back surface side of the pressure-sensitive adhesive sheet of the pressure-sensitive adhesive sheet. An electronic component pick-up program executed by an electronic component pick-up apparatus that is sequentially removed and conveyed from a sheet, comprising: a sheet having a setting processing procedure for setting an adhesive sheet on which a plurality of electronic components are adhered and held, and a suction hole for adsorbing and holding the adhesive sheet; The sheet pressing portion and the suction at the pressing position close to the outer periphery of the electronic component to be peeled off and close to the outer periphery of the electronic component were removed from the sheet stage arrangement processing procedure for placing the stage on the back side of the adhesive face of the adhesive sheet. The state of the sheet pressing process which presses an adhesive sheet and presses between a sheet stand of the state, and the adhesive sheet is pressed Then, the electronic component to be peeled off is pushed up from the back side of the adhesive face to the pin through the adhesive sheet and partially peeled off from the outer periphery of the sheet pressing side of the electronic component from the peeling processing procedure and the electronic component. An electronic component pick-up program, characterized in that a peeling processing procedure of peeling and conveying the entire electronic component from a part of the adhesive sheet that has begun to peel off is performed.

Images