TW200504917A - Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component - Google Patents

Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component

Info

Publication number
TW200504917A
TW200504917A TW093115627A TW93115627A TW200504917A TW 200504917 A TW200504917 A TW 200504917A TW 093115627 A TW093115627 A TW 093115627A TW 93115627 A TW93115627 A TW 93115627A TW 200504917 A TW200504917 A TW 200504917A
Authority
TW
Taiwan
Prior art keywords
electronic component
bonding sheet
pickup
bonding
stage
Prior art date
Application number
TW093115627A
Other languages
Chinese (zh)
Other versions
TWI321823B (en
Inventor
Tsuneharu Arai
Michio Yonemoto
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200504917A publication Critical patent/TW200504917A/en
Application granted granted Critical
Publication of TWI321823B publication Critical patent/TWI321823B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Abstract

The present invention is to easily peel off the electronic component from the bonding sheet even with large bonding force when picking up the electronic component on the bonding sheet. The solution is: configuring the holding frame of the bonding sheet accommodating the bonding sheet in a specific positional relation (S10); configuring the electronic component 16 to be peeled off to reach just above the bonding sheet stage (S12); next, lowering the bonding sheet pressurizing mechanism to hold the bonding sheet between the bonding sheet stage (S16), and pushing up the top pin without attaching the bonding sheet on the bonding sheet stage (S16), so as to peel off the partial bonding sheet around the electronic component; then, pushing up the top pin when attaching the bonding sheet with the bonding sheet stage, and attach the electronic component with the chuck to peel off the whole electronic component from the bonding sheep (S18-S24).
TW093115627A 2003-07-08 2004-06-01 Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component TW200504917A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003272072A JP2005033065A (en) 2003-07-08 2003-07-08 Electronic part pickup equipment and method and electronic part pickup program

Publications (2)

Publication Number Publication Date
TW200504917A true TW200504917A (en) 2005-02-01
TWI321823B TWI321823B (en) 2010-03-11

Family

ID=34209742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115627A TW200504917A (en) 2003-07-08 2004-06-01 Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component

Country Status (3)

Country Link
JP (1) JP2005033065A (en)
KR (1) KR100592338B1 (en)
TW (1) TW200504917A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101527184B1 (en) * 2013-10-14 2015-06-09 도레이첨단소재 주식회사 Double-sided bag tape for manufacturing electronic components and method for separating electronic components using the same
JP6324860B2 (en) * 2014-09-26 2018-05-16 ファスフォードテクノロジ株式会社 Semiconductor or electronic component mounting apparatus and semiconductor or electronic component mounting method
JP6843725B2 (en) * 2017-10-11 2021-03-17 三菱電機株式会社 Semiconductor pickup device
KR102130475B1 (en) * 2019-11-21 2020-07-06 제너셈(주) Picker structure and package separator including the same

Also Published As

Publication number Publication date
TWI321823B (en) 2010-03-11
KR100592338B1 (en) 2006-06-22
KR20050006064A (en) 2005-01-15
JP2005033065A (en) 2005-02-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees