JP7458773B2 - Pick-up equipment and mounting equipment for electronic components - Google Patents

Description

The present invention relates to an electronic component pickup device and mounting device.

When mounting semiconductor chips on a substrate such as a lead frame, wiring board, or interposer substrate, the semiconductor chips are removed one by one from a wafer sheet in which a semiconductor wafer, which has been cut into individual semiconductor chips and attached to an adhesive sheet, and then transferred to the substrate for mounting.

In this way, a pickup device having a pickup mechanism and a push-up mechanism is used to peel and pick up electronic components such as semiconductor chips attached to an adhesive sheet such as a wafer sheet. The pickup mechanism has a suction nozzle that picks up the electronic components. The push-up mechanism pushes up the electronic components that have been sucked up to the suction nozzle from the underside with a push-up pin, assisting in peeling and removing the electronic components from the adhesive sheet.

Incidentally, recent semiconductor chips are becoming thinner, with a thickness of 50 μm or less. If such a thin semiconductor chip is simply pushed up with a push-up pin while stretching the adhesive sheet, there is a high risk that the semiconductor chip will be damaged. Therefore, as shown in Patent Document 1, the axes are aligned so that the adhesive sheet attached to the bottom surface of the semiconductor chip is peeled off gradually from the periphery toward the center of the semiconductor chip. A pickup device has been developed that has a plurality of push-up bodies provided in the vehicle. In such a pickup device, the upper surface shape of the plurality of push-up bodies is usually formed into the same shape as the semiconductor chip to be picked up, for example, a square.

In the above-mentioned pickup device, first, a plurality of push-up bodies are simultaneously raised to a predetermined height to press and push up the entire lower surface of the semiconductor chip to be picked up. Then, leaving the push-up body located at the outermost position, the other push-up bodies are further raised to a predetermined height. Next, the other push-up bodies are raised, leaving the second push-up body behind. The lower surface of the semiconductor chip is supported by the push-up body and is gradually released from the periphery toward the center, making it easier for the semiconductor chip to peel off from the adhesive tape. Furthermore, in order to promote peeling of the adhesive tape from the lower surface of the semiconductor chip, a recess is provided on the upper surface of the pusher located at least on the outermost periphery, that is, on the contact surface with the adhesive tape, where a suction force is applied between the pusher and the adhesive tape. It is proposed that a The concave portion provided on the upper surface of the push-up body serves as a place where the adhesive sheet starts to peel off from the semiconductor chip, so that it can promote the peeling of the release tape from the semiconductor chip.

JP 2010-056466 A

However, even when using a pickup device that has a plurality of push-up bodies as described above and has a recessed portion on the upper surface of at least the outermost push-up body, damage may occur to the semiconductor chip. Although the cause of damage to the semiconductor chip is not clear, damage to the semiconductor chip is likely to occur when a semiconductor chip whose thickness is reduced to, for example, 30 μm or less is peeled off from the adhesive sheet and picked up. Furthermore, circuits formed on semiconductor chips are also becoming more dense in order to increase the capacity and functionality of semiconductor chips, and such circuit shapes are also considered to be a cause of damage to semiconductor chips.

For example, the thickness of memory chips such as NAND flash memory is becoming thinner year by year, and as mentioned above, it is difficult to put into practical use semiconductor chips with thicknesses of 30 μm or less, further 25 μm or less, and 20 μm or less. It is progressing. Therefore, even when picking up such thinned semiconductor chips, there is a need for a pickup device that can more reliably peel the semiconductor chips from the adhesive sheet and pick them up without damaging the semiconductor chips. It has been demanded.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pickup device and a mounting device that can suppress damage to electronic components and also allow good peeling of electronic components from adhesive sheets.

An electronic component pickup device according to an embodiment includes: a pickup section that picks up an electronic component stuck on an adhesive sheet; a backup section provided opposite to a surface of the adhesive sheet opposite to the electronic component; The backup part has a suction surface that suction holds an area of the adhesive sheet corresponding to the electronic component to be picked up, and is movably provided within the suction surface along a common axis, and has an external shape. A plurality of pressing bodies of different sizes are coaxially nested on the common axis, and each pressing body has a pressing part having a pressing surface that presses the adhesive sheet, and all of the pressing bodies are connected to the adhesive sheet. By moving the sheet in the pressing direction, the pressing surface performs a first pressing operation of pressing the electronic component via the adhesive sheet, and after the first pressing operation, the adhesive sheet presses the electronic component. A separating operation in which each pressing body is sequentially moved from one of the pressing bodies to an adjacent pressing body in a separating direction to peel off from the component, and at least one pressing of the pressing bodies other than the pressing body that moved in the separating direction. a second pressing operation that moves the pressing body in the pressing direction so that the position of the pressing surface of the body exceeds the position of the pressing surface caused by the first pressing operation in the pressing direction; and the driving section includes a separating driving section that individually moves each pressing body in the separating direction, and a pressing driving section that moves all the pressing bodies in the pressing direction, and the separating driving section has a , a first driving member that moves along the common axis; and a conversion mechanism that converts the movement of the first driving member into movement of each of the pressing bodies in the separating direction .

The mounting device of the embodiment includes a supply device that holds an adhesive sheet on which a semiconductor chip is attached and held, a substrate stage on which a substrate is placed, and the pickup that picks up the semiconductor chip from the adhesive sheet held by the supply device. and a mounting mechanism for mounting the semiconductor chip taken out by the pickup device on the substrate.

According to the present invention, it is possible to provide a pickup device and a mounting device that can suppress damage to electronic components and also enable good peeling of electronic components from adhesive sheets.

1 is a partially transparent front view showing a schematic configuration of an electronic component pickup device according to a first embodiment; FIG. FIG. 2 is a plan view showing an adsorption surface of the first embodiment. FIG. 2 is a plan view showing a pressing body of the first embodiment. It is an exploded view showing the press body of a 1st embodiment, and the left side is a front view, and the right side is a side view. It is a front view of each press body of simplified embodiment. It is an explanatory view of operation of a press body of a simplified embodiment. FIG. 6 is an explanatory diagram showing the operation of the pressing body of Comparative Example 1. FIG. 6 is an explanatory diagram showing the operation of the pressing body of Comparative Example 2. It is an explanatory view showing operation of a press object of a simplified embodiment. It is an explanatory view showing a peeling angle. It is an explanatory view showing operation of a press object of a 1st embodiment. It is an explanatory view showing operation of a press object of a 1st embodiment. 6A to 6C are explanatory views showing an operation of a second cam mechanism according to the first embodiment; FIG. 3 is an operation explanatory diagram showing the first cam mechanism of the first embodiment. FIG. 2 is a configuration diagram showing a mounting apparatus according to a second embodiment. FIG. 7 is an explanatory diagram of the operation of the pressing body in another simplified embodiment.

Hereinafter, a pickup device according to an embodiment will be described with reference to the drawings. The drawings shown below are schematic, and the size and shape of each part, the mutual size ratio of each part, etc. may differ from the actual one.

[First embodiment]
[composition]
FIG. 1 is a partially transparent front view showing a schematic configuration of a pickup device 1 according to a first embodiment, FIG. 2 is a plan view showing a suction surface 220 of a backup section 200 of the pickup device 1 shown in FIG. 1, and FIG. FIG. 4 is a plan view showing the pressing part 230, and FIG. 4 is an exploded view of the pressing part 230. The left side of FIGS. 4(A) to (H) is a front view, and the right side is a side view. In the following description, a straight line parallel to the axis of the pressing part 230 will be referred to as the Z axis, and two axes that are orthogonal to each other in a plane orthogonal to this will be referred to as the X axis and the Y axis. When referring to a direction along an axis, it includes two opposite directions on a straight line parallel to the axis. However, the direction in which the pressing part 230 moves to press the adhesive sheet 2 is the Z direction indicated by the arrow in the figure, and the direction perpendicular to the Z direction is the direction in which the roller shaft 82 moves is the X direction indicated by the arrow in the figure. shall be. Further, in this embodiment, the X axis and the Y axis are horizontal axes, and the Z axis is a vertical axis. Furthermore, in this embodiment, the direction in which gravity is followed is defined as downward, and the direction in which gravity is resisted is defined as upward, but the installation direction is not limited to this. Further, the position in the Z direction is called the height.

Note that the axis of the pressing part 230 is an imaginary axis that passes through the center of a pressing surface 31 that comes into contact with and separates from the adhesive sheet 2, which will be described later, and is orthogonal to the radial cross section. The “radial cross section” of the pressing portion 230 is a cross section along a planar figure formed by the outline of the pressing surface 31 when the pressing portion 230 is viewed directly facing the pressing surface 31. The "center of the pressing surface" refers to the center or center of gravity of a planar figure formed by the outline of the pressing surface 31 when the pressing section 230 is viewed directly facing the pressing surface 31.

(Electronic Components)
Examples of the electronic component 3 include semiconductor elements, and resistors and capacitors other than semiconductor elements. Examples of the semiconductor elements include discrete semiconductors such as transistors, diodes, LEDs, capacitors, and thyristors, and integrated circuits such as ICs and LSIs. In this embodiment, as shown in Fig. 1, a rectangular parallelepiped semiconductor chip is used as the electronic component 3. Each semiconductor chip is obtained by dicing a semiconductor wafer into individual pieces.

(Adhesive sheet)
The electronic components 3 are attached to an adhesive sheet 2 called a dicing tape. The adhesive sheet 2 is held by a wafer ring (not shown). The semiconductor wafer attached to the adhesive surface of the adhesive sheet 2 is cut into individual pieces in a dice shape, resulting in a state in which a plurality of electronic components 3 are attached to the adhesive sheet 2.

The adhesive sheet 2 to which a plurality of electronic components 3 are attached is provided so that the wafer ring can be moved in directions along the X-axis, Y-axis, and Z-axis by a drive mechanism (not shown). Thereby, the adhesive sheet 2 is provided so as to be positionable in the directions along the X and Y axes with respect to the backup section 200, which will be described later, and is also provided so as to be able to approach and separate from the suction surface 220 of the backup section 200. There is. Note that the wafer ring and the backup unit 200 may be configured to be relatively driven along the X-axis, Y-axis, and Z-axis. That is, the backup part 200 may be moved in the direction along the Z-axis to come into contact with and leave the fixed adhesive sheet 2 in the direction along the Z-axis.

(Pickup device)
The pickup device 1 of this embodiment is a device that individually peels and takes out a plurality of electronic components 3 attached to an adhesive sheet 2 from the adhesive sheet 2. The pickup device 1 includes a pickup mechanism 100, a backup section 200, and a control device 300.

The pick-up mechanism 100 picks up the electronic component 3 stuck to the adhesive sheet 2. The pickup mechanism 100 includes a pickup section 4 that individually attracts and holds the electronic components 3. The pickup section 4 has a main body section 5 and a suction nozzle 8. The main body 5 is a cylindrical member, and is driven in directions along the X, Y, and Z axes by X, Y, and Z drive sources (not shown). A convex portion 6 protruding toward the adhesive sheet 2 is provided on one end surface of the main body portion 5 . In the main body part 5, a suction hole 7 whose tip is open is formed in the end surface of the convex part 6 in the direction along the Z-axis. This suction hole 7 is connected to a pneumatic circuit including a suction pump (not shown).

The suction nozzle 8 is detachably connected to the convex portion 6 and is a truncated cone-shaped member whose diameter decreases toward the tip. The suction nozzle 8 is made of an elastic material such as rubber or soft synthetic resin. The suction nozzle 8 is formed with a nozzle hole 9 whose one end communicates with the suction hole 7 and whose other end opens to a flat surface 8a at the tip. Note that it is preferable to use a voice coil motor or the like as the Z drive source that drives the main body section 5 in the direction along the Z axis, and to control the pressing load by the pickup section 4 to be constant.

The backup part 200 is provided facing the surface of the adhesive sheet 2 opposite to the adhesive surface. The backup section 200 includes a container 210 , a suction surface 220 , a pressing section 230 , and a driving section 20 .

The container 210 is a cylindrical container whose axis is a straight line parallel to the Z-axis. A suction pump 211 that sucks the inside is connected to the container 210 via piping or the like. The suction surface 220 is a surface that suctions and holds a region of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up. The area corresponding to the electronic components 3 is an area surrounding the area of the adhesive sheet 2 to which the plurality of electronic components 3 to be picked up are pasted, and is larger than this area.

The suction surface 220 is formed on a cap attached to an opening facing the adhesive sheet 2 of the container 210. As shown in FIG. 2, the suction surface 220 is provided with a plurality of suction holes 221. The suction hole 221 is connected to the suction pump 211 through the inside of the backup section 200 or through piping (not shown). By operating the suction pump 211, suction force is generated on the suction surface 220 through the plurality of suction holes 221. Therefore, when the suction pump 211 is operated to bring the suction surface 220 into contact with the surface of the adhesive sheet 2 opposite to the adhesive surface, the adhesive sheet 2 is suction-held. That is, in this embodiment, the entire region of the suction surface 220 in which the suction holes 221 are provided corresponds to the electronic component 3 . Note that since the suction holes 221 are provided over substantially the entire area of the suction surface 220, the entire area within the suction surface 220 including the top of the pressing portion 230 may be used as a region corresponding to the electronic component 3.

The pressing unit 230 is provided within the adsorption surface 220 so as to be movable along a common axis, and is a member in which a plurality of pressing bodies 30 with different outer sizes are coaxially nested on the common axis, and each pressing body has a pressing surface 31, 32 that presses the adhesive sheet 2. Here, the common axis is parallel to the Z axis, and is also the axis of the pressing unit 230 described above. The pressing unit 230 is provided within a rectangular opening 222 provided in the adsorption surface 220 so as to be able to advance and retreat.

As shown in FIGS. 2 and 3, the pressing body 30 is a rectangular cylindrical body or columnar body whose cross section perpendicular to a common axis has a similar shape to the electronic component 3. The innermost pressing body 30A is a columnar body whose end face facing the adhesive sheet 2 is a rectangular pressing surface 31. The pressing bodies 30B to 30H on the outer periphery of the innermost periphery are cylindrical bodies whose end faces facing the adhesive sheet 2 form a rectangular frame-shaped pressing surface 32. In this embodiment, the eight pressing bodies 30A to 30H are coaxially nested and slidably arranged by sequentially inserting the pressing bodies 30 having a smaller external size into the pressing body 30. There is. The external size of the outermost pressing body 30H is the same as or slightly smaller than the external size of the surface of the electronic component 3 to be picked up that is attached to the adhesive sheet 2. Slightly smaller may be, for example, smaller than the outer shape of the surface of the electronic component 3 to be attached to the adhesive sheet 2, to the extent of the width of the pressing surface 32 determined by the thickness of the side wall of the pressing body 30H. Thereby, the adhesive sheet 2 can be peeled off from the outermost periphery while suppressing the load on the electronic component 3. In the following description, when the pressing bodies 30A to 30H are not distinguished, they may be referred to as the pressing body 30.

In addition, from the viewpoint of preventing damage to the electronic component 3, the adhesive sheet that remains without being peeled off by the pressing surface 31 of the innermost pressing body 30A is Although it is preferable that the area of 2 is 30% or less, the present embodiment is not limited to this. Further, the width of the pressing surface 32 determined by the thickness of the side wall of each of the pressing bodies 30B to 30H is preferably about 0.6 mm or less, but the present embodiment is not limited to this. Moreover, although the electronic component 3 of this embodiment is square, it is not limited to this and may be rectangular. When the electronic component 3 has a rectangular shape, the pressing surfaces 31 and 32 may have a rectangular shape similar to the electronic component 3.

As shown in Figs. 3 and 4, the pressing surface 32 of the pressing body 30B-30H is formed with projections and recesses. That is, a plurality of first projections 33 are provided along the four rectangular side edges of the pressing surface 32, and second projections 34 are provided at the four corners of the rectangle. Recesses 35 are provided between the first projections 33 and the second projections 34 and between the first projections 33. The top surfaces of the first projections 33 and the second projections 34 press the adhesive sheet 2. When the adhesive sheet 2 is pressed up in this way, the first projections 33 partially support the direction parallel to the four side edges of the electronic component 3, and the second projections 34 partially support the direction from the center of the electronic component 3 toward the four corners.

The suction force of the suction pump 211 is transmitted to the recess 35 through pipes (not shown) provided in the container 210, gaps between the pressing bodies 30A to 30H, and a notch 36. The notch 36 is a suction path formed in a partially circular shape in a part of the pressing surface 32 of the pressing bodies 30B to 30H. Furthermore, in adjacent pressing bodies 30, the recesses 35 are provided alternately. With such an alternating configuration, suction lines are formed from the outer periphery and corners toward the center, so suction to the center is ensured to the end, and the suction performance of the adhesive sheet 2 is improved.

The drive unit 20 moves all the pressing bodies 30 in the pressing direction to press the adhesive sheet 2, thereby performing a first pressing operation in which the pressing surfaces 31 and 32 press the electronic component 3 via the adhesive sheet 2. . Further, after performing the first pressing operation, the drive unit 20 moves each pressing body 30 from one of the pressing bodies 30 to an adjacent pressing body 30 in the separation direction in which the adhesive sheet 2 is peeled from the electronic component 3. Perform a separating operation to move the parts in sequence. Furthermore, the drive unit 20 further moves the position of the pressing surfaces 31 and 32 of at least one of the pressing bodies 30 other than the pressing body 30 that has moved in the separating direction to the position of the pressing surfaces 31 and 32 due to the first pressing operation. A second pressing operation is performed in which the pressing body 30 is moved in the pressing direction so as to exceed the positions of the surfaces 31 and 32 in the pressing direction. Here, in this embodiment, the separating direction is the opposite direction to the pressing direction. The drive unit 20 includes a separation drive unit 20A that individually moves each press body 30 in the separation direction, and a press drive unit 20B that moves all the press bodies 30 in the pressing direction. In this embodiment, the separating operation is performed sequentially from the outermost pressing body 30 to the adjacent inner pressing body 30. The second pressing operation is performed each time one of the pressing bodies 30 moves in the separating direction due to the separating operation, and at least one of the pressing bodies 30 located inside the pressing body 30 that has performed the separating operation is The pressing body 30 adjacent to the pressed body 30 that has performed the operation, in this embodiment, the adjacent pressing body 30 and all the pressing bodies 30 inside this, are moved by a preset distance in the pressing direction. Finally, in the stage just before the electronic component 3 is picked up, the position of the pressing surface 31 of the pressing body 30 located at the innermost periphery changes from the position of the pressing surfaces 31 and 32 caused by the first pressing operation in the pressing direction. shall exceed.

The separation drive unit 20A includes a first drive member 241 and a conversion mechanism 250. The first drive member 241 is a cylindrical member, and is driven in a direction along a common axis by a drive mechanism 21A such as a ball screw mechanism or a cam roller mechanism driven by a servo motor, for example. Note that the drive mechanism 21A is housed in a common housing with a drive mechanism 21B, which will be described later, and drives the first drive member 241 independently of a second drive member 242, which will be described later.

The conversion mechanism 250 converts the motion of the single first drive member 241, which moves along a common axis, into the separation motion of the multiple pressing bodies 30A-30H. The conversion mechanism 250 has a frame 50, an extension 60, a biasing member 70, a first cam mechanism 80, and a second cam mechanism 90. The frame 50 is housed within the housing 210, and is a member that supports the pressing body 230, the first cam mechanism 80, and the second cam mechanism 90.

The frame 50 includes a support block 51, a first support plate 52, a linear guide 53, and a second support plate 54, as shown in FIG. The support block 51 has a rectangular parallelepiped shape provided on the side of the adhesive sheet 2 in the container 210, and has a rectangular parallelepiped guide hole 51a into which the pressing part 230 is slidably inserted in the direction along the Z axis. It is formed. Further, on the side of the adhesive sheet 2 of the support block 51, a protrusion 51b is provided that protrudes outward from the opposing side surfaces. Here, the contradictory sides refer to positions that are opposite to each other with respect to a common axis. For example, when the support block 51 has a rectangular parallelepiped shape as in this embodiment, two of the four side surfaces that are located (opposed) across a common axis are opposite sides.

The first support plate 52 is a disk-shaped member to which the support block 51 is attached. The linear guide 53 is a member that supports the moving body 83 (described later) so that it can slide in the X direction by means of a guide rail. The second support plate 54 is a disk-shaped member provided on the drive unit 20 side of the frame 50. The second support plate 54 has a hole through which the first drive member 241 is inserted. The tip of the second drive member 242 is fixed to the second support plate 54. The first support plate 52, the linear guide 53, and the second support plate 54 are connected and fixed to each other by a support column in the Z axis direction (not shown).

As shown in FIGS. 3 and 4, the extending portions 60 are provided in pairs on the opposite sides of the pressing body 30, respectively. Here, the opposing side surfaces of the pressing body 30 refer to two side surfaces located (opposed) with a common axis in between, when the pressing body 30 has a rectangular cylindrical shape as in this embodiment. . Although there are two sets of opposing side surfaces in one pressing body 30, in this embodiment, the sets facing each other in the X-axis direction are defined as opposing side surfaces. Further, the outside of the side surface is the portion that becomes both ends when the side surface is viewed from the front. That is, a total of four extending portions 60 are provided from two opposite sides of each pressing body 30. The extending portion 60 is provided at the lower end of the side surface. The pair of extensions 60 of the outermost pressing body 30H are provided on the outermost side, and the extensions 60 are sequentially provided on the inner side as the pressing bodies 30G to 30A are located on the inner side. One extending portion 60 of the innermost pressing body 30A is provided on each opposing side surface. In other words, it is not necessary for all the pressing bodies 30A to 30H to be provided with a pair of extension portions 60 on opposing sides. Note that the extending portion 60 extends the lower ends of the two side walls facing each other in the Y-axis direction by a predetermined amount below the lower ends of the two side walls facing each other in the X-axis direction, and both ends of this extended portion are aligned with the X-axis. It can also be considered as a part extending in the direction.

As shown in FIGS. 1 and 3, the biasing member 70 is a member that individually biases the extending portions 60 of each pressing body 30 in the direction of separation. The biasing member 70 can be configured using an elastic member such as a leaf spring or a coil spring. In this embodiment, as the biasing member 70, a member is used in which a pin that moves forward and backward in response to the expansion and contraction of the compression coil spring is provided at the tip of a cylinder containing a compression coil spring. The biasing member 70 is provided in a direction parallel to the Z-axis, one end is attached to the protrusion 51b of the support block 51, and the tip of the pin that is the other end is in contact with the extension 60. Therefore, each pressing body 30 is energized.

The first cam mechanism 80 is a mechanism that is driven by the first drive member 241 and allows the pressing bodies 30 to move in the separating direction sequentially from the outside to the inside. The first cam mechanism 80 has a cam surface 81, a roller shaft 82, and a moving body 83.

The cam surface 81 is provided on the surface of each pressing body 30 opposite to the adhesive sheet 2, and is shaped for each pressing body 30 in a direction intersecting a common axis, specifically, along the X-axis direction. is a different aspect. In the present embodiment, the cam surface 81 is a surface having portions whose distances from the pressing surface 31 or 32 are sequentially different for each pressing body 30. The cam surfaces 81 are formed on the end surfaces of two opposing side surfaces of the pressing body 30 in the direction along the Y-axis, specifically, on the lower end surface that is the opposite side to the pressing surface 31 or 32.

As shown in Figures 4(A) to (H), the cam surface 81 of this embodiment includes a matching surface 84, a step surface 85, and a stopper surface 86. The matching surfaces 84 are surfaces that match each other when the distance d from the pressing surface 31 or 32 of all pressing bodies 30 is constant and the positions of the pressing surfaces 31 or 32 of all pressing bodies 30 are aligned.

The step surface 85 is a surface that continues from the matching surface 84 and the distance from the pressing surfaces 31, 32 decreases stepwise (see Figs. 5 and 6). The starting point of the step surface 85 is indicated by p. The distance of each step of the step surface 85 from the pressing surfaces 31, 32 determines the distance that the pressing surfaces 31, 32 of each pressing body 30 move in the separation direction in the separation operation. The difference in the distance of each step of the step surface 85 from the pressing surfaces 31, 32 is determined by the difference in height between each step of the step surface 85 and the adjacent steps, that is, the step difference. Just before the electronic component 3 is picked up, the pressing surface 32 of the innermost pressing body 30 exceeds the position of the pressing surfaces 31, 32 by the first pressing operation in the pressing direction, and the other pressing bodies 30 are set so that they are located in the separation direction from the position of the pressing surfaces 31, 32 by the first pressing operation, more preferably in the separation direction from the suction surface 220. This step difference can be constant. However, in this embodiment, as exemplified in the operation principle described later, the distance from the pressing surfaces 31, 32 to each step is set so that the first moving distance in the separating direction is greater than the second and subsequent moving distances in the separating direction. In other words, the first step closest to the starting point p has a large step difference, and the subsequent steps have a constant step difference smaller than the first step. The number of steps of the step surface 85 is N-1, where N is the number of pressing bodies 30H at the outermost periphery, and decreases by one step toward the inner periphery. In this embodiment, the pressing body 30H at the outermost periphery has seven steps, and the steps are 6, 5, 4, 3, 2, and 1 step toward the inner periphery. In this way, each step of the step surface 85 is a portion having a step from the matching surface 84, and includes the case of a single step. For the innermost pressing body 30A, a step surface 85 is provided for the final separation operation, and is connected to a stopper surface 86, which will be described later. However, if the separation operation is not performed, the step surface 85 does not have to be provided.

The length w of the matching surface 84 in the X-axis direction becomes longer toward the inner pressing body 30, and the starting end p of the step surface 85 is shifted along the X-axis accordingly. This means that the timing at which the roller shaft 82, which will be described later, reaches the step surface 85 becomes later as the pressing body 30 is located on the inner side. As a result, the phase of movement of each pressing body 30 is shifted, that is, the timing at which each pressing body 30 starts moving in the peeling direction is shifted. The stopper surface 86 is a surface that constitutes the terminal end q of the staircase surface 85. The distance of the stopper surface 86 from the matching surface 84 in the X-axis direction is the same between the pressing bodies 30 .

The roller shaft 82 contacts the cam surface 81 of each pressing body 30 and urges each pressing body 30 in a direction against the urging member 70, and also in a direction intersecting the separation direction, specifically, the X-axis. move in the direction along The roller shaft 82 has a length spanning two sides on which the cam surface 81 is formed. When this roller shaft 82 does not reach the step surface 85, that is, when it is in contact with the matching surface 84, all the pressing bodies 30 are pushed up in the direction against the urging member 70. At this time, the pressing surfaces 31 and 32 of all the pressing bodies 30 are aligned. When the roller shaft 82 reaches the step surface 85 of each pressing body 30, each pressing body 30 is sequentially moved in the separating direction by the urging force of the urging member 70. In this embodiment, the timing at which the roller shaft 82 reaches the step surface 85 is delayed as the pushing bodies 30 are located on the inner side, so that the roller shafts 82 move in the separating direction from the pushing bodies 30 on the outside to the pushing bodies 30 on the inside. Furthermore, as the roller shaft 82 moves to each step on the stairway surface 85, the moving distance of each pressing body 30 in the separating direction increases by a constant amount from the outer pressing body 30 to the inner pressing body 30. . The stopper surface 86 defines a moving end of the roller shaft 82.

Note that the movement range of the roller shaft 82 is within the range of the outer edge of the suction surface 220. In this embodiment, the roller shaft 82 moves within the inner diameter of the container 210. Therefore, the cam surface 81 is also formed within this range.

The moving body 83 has a moving block 83a and a bearing 83b. The moving block 83a is a substantially rectangular parallelepiped-shaped member, and is provided so as to be slidable in the X-axis direction by the linear guide 53. The bearing 83b is a member that is provided on the pressing body 30 side of the movable body 83 and rotatably supports the shaft of the roller shaft 82 in the direction along the Y axis.

The second cam mechanism 90 controls the movement of the first drive member 241 along the pressing direction and the separating direction (movement in the Z-axis direction) in a direction intersecting the pressing direction and the separating direction of the roller shaft 82 (the X-axis direction). ). The second cam mechanism 90 has a roller 92 and an inclined surface 91 in contact with the roller 92. A main driving cam moves either the roller 92 or the inclined surface 91 along a common axis, that is, the Z axis, and the other moves along the Z axis. This is a direct-acting cam that is a driven cam that moves in the direction that intersects the axis (X-axis direction).

The second cam mechanism 90 of this embodiment has an inclined surface 91, a roller 92, and a bearing 93. The inclined surface 91 is provided on the surface of the moving block 83a opposite to the pressing body 30, and is a surface inclined with respect to the Z-axis direction. The roller 92 moves in a direction toward the adhesive sheet 2 in contact with the inclined surface 91, thereby moving the moving block 83a to the left in the drawing along the X-axis direction (see FIG. 1).

The bearing 93 rotatably supports the shaft of the roller 92 in the direction along the Y axis. The bearing 93 is fixed to the end of the first driving member 241. Therefore, as the first driving member 241 moves, the bearing 93 moves together with the roller 92 toward the adhesive sheet 2.

The press drive section 20B has a second drive member 242. The second drive member 242 is a cylindrical member disposed coaxially with the first drive member 241, and is driven by a drive mechanism 21B such as a ball screw mechanism or a cam roller mechanism driven by a servo motor, so that the second drive member 242 and the first drive member 241 share a common axis. It is driven independently of the first drive member 241 in the direction along the direction. The second drive member 242 drives the frame 50. The pressing drive unit 20B performs the above-described first pressing operation and second pressing operation when the second driving member 242 drives the frame 50.

The control device 300 is a device that controls each part of the pickup device 1. This control device 300 can be configured by, for example, a dedicated electronic circuit including a processor, a memory, etc., or a computer that operates with a predetermined program. Regarding the control related to exhaust by the suction pump 211, the drive control by the drive unit 20, the pickup control by the pickup mechanism 100, etc., the control contents are programmed and various settings are stored in a storage unit such as a memory. The control device 300 uses a processing device such as a PLC or a CPU to execute a program according to such settings. For example, in order to move the pressing body 30 in the first pressing operation and the second pressing operation, the amount of operation of the second drive member 240 is stored in advance in the storage section, and the amount of operation of the second driving member 240 is stored in advance in the storage section, and the control device 300 controls the drive mechanism 21B.

[Operating principle]
[Principle of movement of pressing body]
The principle of movement of the pressing body 30 will be described with reference to Figs. 5 and 6. Fig. 5 shows an example in which there are four pressing bodies 30 in order to make it easier to understand the principle of movement of the pressing body 30. First, as shown in Figs. 5(A) to (D), the four pressing bodies 30 have a step surface 85 formed between the matching surface 84 and the stopper surface 86. The pressing body 30 on the outermost periphery has three steps (Fig. 5(A)), the pressing body 30 on the inner side has two steps (Fig. 5(B)), the pressing body 30 on the inner side has one step (Fig. 5(C)), and the pressing body 30 on the innermost periphery has one step (Fig. 5(D)). The step of the step surface 85 is set as shown in Fig. 6(a). That is, the step of the step surface 85 of each pressing body 30 between the first step closest to the starting point p and the adjacent second step is 2h, and the step between the other steps is h. In other words, the height of the step that the roller shaft 82 first comes into contact with is twice the height of the other steps.

The four pressing bodies 30 are arranged coaxially and nested as described above to form the pressing section 230. Each pressing body 30 is biased in the direction away from the other by the biasing member 70. The pressing section 230 is driven in the pressing direction by the pressing drive section 20B.

The operation of the pressing body 30 as described above will be explained with reference to FIG. 6. FIGS. 6(A) to 6(D) schematically show cross sections taken in the axial direction of the pressing portions 230 arranged in a nested manner. 6(A') is the initial state, FIG. 6(A) is the state where the first pressing operation has been performed, FIG. 6(B') is the state where the outermost pressing body 30 has performed the separating action, and (B) (C') is a state in which the second pressing operation is performed in parallel with (B'), (C') is a state in which the outermost periphery and the pressing body 30 adjacent thereto have performed a separating action, (C) is (C') (D') is a state in which the pressing body 30 other than the innermost periphery performs a separating action; (D) is a state in which the second pressing operation is performed in parallel with (D'); Indicates a state in which a pressing operation has been performed.

In this way, the operation (B) is not performed subsequent to the operation shown in FIG. 6(B'), but the operation (B) is performed in parallel with the operation shown in FIG. 6(B'). The operations in FIGS. 6C' and 6C and the operations in FIGS. 6D' and 6D are also similar. Therefore, the actual position of the pressing body 30 changes as shown in (A'), (A), (B), (C), and (D). 6(a) to 6(d) are diagrams showing the positions of the step surfaces 85 of each pressing body 30 corresponding to FIGS. 6(A) to 6(D). Further, in the figure, white arrows indicate the moving direction of all the pressing bodies 30, and black arrows indicate the moving direction of the roller shaft 82.

First, in an initial state in which the roller shaft 82 is in contact with the matching surfaces 84 of all the pressing bodies 30, the pressing surfaces 31 and 32 of each pressing body 30 are at the same height position. The positions of the pressing surfaces 31 and 32 at this time are indicated by the height position [α] of the dashed line. From this state, as shown in FIGS. 6A' and 6A, a first pressing operation is performed in which all the pressing bodies 30 are moved in the pressing direction. The moving distance at this time is h, and the positions of the pressing surfaces 31 and 32 are indicated by the height position [β] of the dashed line.

Next, as shown in FIGS. 6(B') and (b), the roller shaft 82 moves from the matching surface 84 of the outermost pressing body 30, beyond the starting end p, to the first step of the stepped surface 85. do. Then, due to the urging force of the urging member 70, the outermost pressing body 30 moves in the separating direction. The moving distance at this time is 2 hours due to the difference in level of the stair surface 85. In parallel with this, all the pressing bodies 30 move in the pressing direction, as shown in FIGS. 6(B) and (b). The moving distance at this time is h/3.

Then, as shown in FIGS. 6(C') and (c), the roller shaft 82 passes from the matching surface 84 of the pressing body 30 adjacent to the outermost pressing body 30, beyond the starting end p, to the step surface 85. Move to the first stage. Further, the roller shaft 82 is located at the second stage of the pressing body 30 at the outermost periphery. Then, due to the urging force of the urging member 70, the outermost pressing member 30 and the adjacent pressing member 30 move in the separating direction. The moving distance at this time is h for the outermost pressing body 30 and 2h for the pressing body 30 adjacent thereto. In parallel with this, all the pressing bodies 30 move in the pressing direction, as shown in FIGS. 6(C) and 6(c). The moving distance at this time is h/3.

Furthermore, as shown in FIG. 6(D') and (d), the roller shaft 82 moves from the coincident surface 84 of the second innermost pressing body 30 from the outermost pressing body 30, over the starting point p, to the first step of the step surface 85. The roller shaft 82 also comes to the third step of the step surface 85 of the outermost pressing body 30 and the second step of the step surface 85 of the pressing body 30 adjacent thereto. Then, due to the biasing force of the biasing member 70, the outermost pressing body 30 and the pressing body 30 adjacent thereto move in the separation direction. The movement distance at this time is h for the outermost pressing body 30, h for the pressing body 30 adjacent thereto, and 2h for the pressing body adjacent further inward. In parallel with this, as shown in FIG. 6(D) and (d), all pressing bodies 30 move in the pressing direction. The movement distance at this time is h/3.

Through the above operations, the position of the pressing surface 31 of the innermost pressing body 30 moves to a position higher than the height position [β], and the pressing surfaces 32 of the other pressing bodies 30 move to the height position Move to a position lower than [β]. In other words, only the pressing surface 31 of the innermost pressing body 30 is at the height position [γ] shown by the dashed line in the figure, and the pressing surfaces 32 of the other pressing bodies 30 are in the first pressing operation. The distance is further away from the height position [β], and in this embodiment, the distance is further away from the height position [α]. The height position [γ] is the target position that the pressing surface 31 should reach immediately before the electronic component 3 is picked up.

The distance between [α] and [β], the distance between [β] and [ γ] has a common interval h. The distance from the initial position [α] to the target position [γ] is twice the distance from the initial position [α] to the first pressed position [β]. Further, the steps of the stair surface 85 are set so that each pressing body 30 descends by 2 h only during the first separation operation, and descends by h from the second time onwards. Further, the movement distance of the second pressing operation is a value obtained by equally dividing h by (N-1). Thereby, while ensuring the distance between the position of the pressing surface 31 of the innermost pressing body 30 and the position of the pressing surface 32 of the other pressing bodies 30, the distance from [β] to the pressing surface 31, [β] ] to the pressing surface 32 can be suppressed from increasing.

[Peeling operation]
As the pressing body 30 sequentially moves in the separating direction in this manner, the adhesive sheet 2 adsorbed to the pressing surfaces 31 and 32 peels off from the outer circumferential side of the electronic component 3 toward the inner circumferential side. The principle of the peeling operation accompanying the movement of the pressing body 30 will be explained with reference to FIGS. 7 to 9 in comparison with a comparative example different from the present embodiment. In FIGS. 7 to 9, gaps are provided between the pressing bodies 30, but in reality, the nested pressing bodies 30 are in contact with each other.

First, a comparative example 1 in which the pressing body 30 moves from the outer periphery to the inner periphery in the pressing direction to perform peeling will be described with reference to FIG. 7. As shown in FIG. 7(A), the suction surface 220 contacts the adhesive sheet 2 to which the electronic component 3 to be picked up is attached, and sucks the adhesive sheet 2. From this state, as shown in FIG. 7(B), all the pressing bodies 30 move in the pressing direction to push up the electronic component 3 through the adhesive sheet 2. The position of the pressing surfaces 31 and 32 of the pressing body 30 at this time is the reference position H, which is indicated by a dashed line in the figure. Furthermore, as shown in FIG. 7(C), (D), and (E), the pressing body 30 on the inner periphery moves in the pressing direction so that the pressing body 30 on the inner periphery is at a higher position than the pressing body 30 on the outer periphery. As a result, the adhesive sheet 2 is gradually peeled off from the outer periphery to the inner periphery of the electronic component 3.

Next, Comparative Example 2 in which peeling is performed by sequentially moving the pressing body 30 in the separating direction from the outer circumference to the inner circumference will be described with reference to FIG. 8. The operations in FIGS. 8(A) and 8(B) are the same as those in FIGS. 7(A) and 7(B). As shown in FIGS. 8(C), (D), and (E), as the pressing body 30 sequentially moves in the separating direction toward the inner periphery, each pressing surface 31, 32 is moved to the reference position H. The film is sequentially moved in the peeling direction so as to pass downward. As a result, the adhesive sheet 2 gradually peels off from the outer circumference toward the inner circumference of the electronic component 3 until only the innermost pressing body 30 remains at the reference position H.

Furthermore, the operating principle of this embodiment will be explained with reference to FIG. The operations in FIGS. 9(A) and 9(B) are the same as those in FIGS. 7(A) and 7(B). Note that this operation corresponds to the first pressing operation described above. In this embodiment, as shown in FIGS. 9(C), (D), and (E), the pressing bodies 30 are sequentially moved in the separating direction from the outer periphery to the inner periphery, and all the pressing bodies 30 are Move in the pressing direction. However, even if all the pressing bodies 30 are moved in the pressing direction, the pressing surfaces 32 of the pressing bodies 30 that have been moved in the separating direction do not exceed the suction surface 220 in the pressing direction. At this time, the pressing surfaces 31 and 32 of at least one of the pressing bodies 30 other than the pressing body 30 that has moved in the separating direction exceeds the reference position H above. More specifically, all the pressing bodies 30 on the inner peripheral side of the pressing bodies 30 that have moved in the separating direction move so that their pressing surfaces 31 and 32 exceed the reference position H upward (in the pressing direction). As a result, the adhesive sheet 2 gradually peels off from the outer circumference of the electronic component 3 toward the inner circumference.

[Peeling angle]
Here, in Comparative Example 1, each pressing body 30 is sequentially moved a certain distance in the pressing direction, and in Comparative Example 2, each pressing body 30 is sequentially moved a certain distance in the separating direction. The distance that each pressing body 30 moves in the pressing direction determines the angle (hereinafter referred to as the peeling angle) between the horizontal plane that is perpendicular to the pressing direction and the surface of the adhesive sheet 2 that is stretched during peeling. In FIG. 10(A), such a peeling angle is indicated by α. Here, the angle of the adhesive sheet 2 inclined by pressing with respect to the adsorption surface 220 of the container 210, that is, the surface of the adhesive sheet 2 at the initial position, is indicated by the peeling angle α. In order to achieve good peeling, it is preferable that the moving distance of the pressing body 30 is long and the peeling angle α is large.

However, as shown in FIG. 10(B), if the moving distance of the pressing body 30 in the initial pressing operation is increased, the peeling angle α of the adhesive sheet 2 becomes larger, but the inclined adhesive sheet 2 is removed from the adjacent electronic component 3. The electronic component 3 may be lifted up to the edge of the electronic component 3, and the adjacent electronic component 3 may be damaged.

Moreover, even if it is attempted to increase the moving distance of each pressing body 30, as shown in FIG. 7(E) of Comparative Example 1, if the pressing body 30 is moved only in the pressing direction, The distance to the adhesive sheet 2 to which the pressing body 30 is attracted becomes too large. Then, the adhesive sheet 2 is stretched excessively, and the tension extends to the part attached to the adjacent electronic component 3, causing the electronic component 3 to shift. As shown in FIG. 8(E) of Comparative Example 2, when the pressing body 30 is sequentially moved only in the peeling direction from the reference position H, the adhesive sheet 2 is not stretched excessively, but the peeling angle α is small. It will remain at an angle. Therefore, there are problems in achieving better peeling. Furthermore, when the pressing body 30 is moved only in the pressing direction as in Comparative Example 1, force continues to be applied to the electronic component 3 in only one direction, so that the electronic component 3 to be picked up is likely to warp.

After extensive research, the inventors of the present invention have developed a device that can increase the travel distance of each pressing body 30 to perform good peeling while preventing any effects on the electronic components 3. In other words, the travel distance in the initial pressing operation of the pressing body 30, i.e., the first pressing operation, is kept the same as in Comparative Examples 1 and 2, i.e., to a level that does not lift the edge of the adjacent electronic component 3, and by suppressing the peel angle α of the adhesive sheet 2, it is possible to prevent any effects on the adjacent electronic component 3.

In addition, by sequentially moving each pressing body 30 from the outermost circumference in the peeling direction, which is the position of the suction surface 220, and at the same time moving the suction surface 220 of the entire pressing body 30 in the pressing direction, Comparative Example 1 Compared to this, the difference in height between the innermost pressing body 30 and the outermost pressing body 30 is suppressed from increasing more than necessary. Therefore, it is possible to suppress the application of a large force to the adhesive sheet 2 to which the electronic component 3 adjacent to the electronic component 3 to be picked up is attached, and it is possible to prevent the electronic component 3 from shifting. Furthermore, each time the pressing body 30 is moved in the peeling direction, the pressing body 30 inside the pressing body 30 is moved in the pressing direction, and is located at the outermost periphery among the pressing bodies 30 that have not moved in the separating direction. The difference in height between the pressing surface 32 of the pressing body 30 and the pressing surface 32 of the pressing body 30 located outside adjacent to the pressing body 30 and moved in the separating direction is greater than the moving distance in the first pressing operation. We also plan to expand it gradually. Therefore, each time the pressing body 30 is moved in the separating direction, that is, each time the distance between the adjacent electronic component 3 and the pressing body 30 that is not moving in the separating direction increases, the peeling angle α of the adhesive sheet 2 is increased. be able to. This means that the peeling angle α is increased while preventing the neighboring electronic components 3 from being affected. That is, even if the peeling angle α is increased, as long as the distance to the electronic component 3 is long, its influence can be prevented. Therefore, it is possible to increase the moving distance of each pressing body 30 and perform good peeling while preventing the influence on the electronic component 3.

[motion]
The operation of the pickup device 1 of this embodiment as described above will be explained with reference to FIGS. 11 to 13 in addition to the above drawings. First, a drive mechanism that drives the wafer ring moves the adhesive sheet 2 so that the electronic component 3 to be picked up is aligned with the pressing surface 32 of the pressing section 230 and the adhesive sheet 2 is in contact with the suction surface 220. This movement is performed based on map information including the position coordinates of the electronic component 3 in advance.

Then, as shown in FIG. 11A, the suction pump 211 applies suction force to the suction holes 221 to cause the adhesive sheet 2 to be attracted to the suction surface 220. As a result, the portion of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up is suctioned and held by the suction surface 220, and the area of the electronic component 3 is also suctioned and held by the pressing surfaces 31 and 32 of the pressing body 30.

In this way, after the adhesive sheet 2 is adsorbed and held by the suction surface 220, the pick-up unit 4 moves toward the electronic component 3, and the suction nozzle 8 adsorbs the top surface of the electronic component 3 to be picked up.

Next, the first pressing operation is performed by the pressing driving section 20B of the driving section 20. That is, the drive mechanism 21B drives the second drive member 242 by a predetermined amount of movement toward the adhesive sheet 2 side, so that the pressing portion 230 supported by the frame 50 is moved as shown in FIG. 11(B). That is, the pressing bodies 30A to 30H are pushed up toward the adhesive sheet 2 side all at once. Then, the pressing surfaces 31 and 32 of the pressing body 30 press the entire electronic component 3 evenly, so that the portion of the adhesive sheet 2 to which the electronic component 3 is attached exceeds the suction surface 220 of the container 210. being pushed out.

Then, the separation operation and the second pressing operation are performed by the separation driving unit 20A and the pressing driving unit 20B of the driving unit 20. That is, the driving mechanism 21A drives the first driving member 241 toward the adhesive sheet 2, thereby moving the roller 92 toward the adhesive sheet 2, as shown in Figs. 13(A) to (C). That is, the roller 92 is raised along the Z-axis direction. This movement direction is shown by the white arrow in the figure. Then, the roller 92 presses against the inclined surface 91, so that the moving block 83a and the bearing 83b of the moving body 83 move in the X direction. This movement direction is shown by the black arrow in the figure. As a result, the roller shaft 82 moves to the left in the figure along the X direction.

As the roller shaft 82 moves in this way, the roller shaft 82 moves along each step of the stepped surface 85 from the matching surface 84 of the pressing body 30, as shown in FIG. 14 when the cam surface 81 is viewed from below. . Then, as shown in FIGS. 11(C), (D), (E), and 12(A), (B), (C), and (D), the outer pressing force is applied by the urging force of the urging member 70. From the body 30H, the pressing bodies 30G, 30F, 30E, 30D, 30C, and 30B sequentially move in the separating direction, that is, perform a separating operation of descending. Finally, only the pressing surface 31 of the innermost pressing body 30A protrudes beyond the reference position H, and the electronic component 3 is picked up. Thereafter, as shown in FIG. 12(E), when the roller shaft 82 moves to the step surface 85 of the pressing body 30A, the pressing body 30A descends.

In this way, each time the pressing bodies 30H, 30G, 30F, 30E, 30D, 30C, and 30B sequentially move in the separating direction, the second driving member 242 moves all the pressing bodies 30 in the pressing direction. In other words, the second pressing operation to raise is performed. In this embodiment, it is assumed that the separating operation and the second pressing operation are performed simultaneously and in parallel. Each time each pressing body 30 moves in the separating direction, the distance that all the pressing bodies 30 move in the pressing direction is smaller than the distance that each pressing body 30 moves in the separating direction. However, among the pressing bodies 30 other than the pressing body 30 moved in the separating direction, the pressing surfaces 31 and 32 of at least one pressing body 30 are located at a position beyond the reference position H in the pressing direction, that is, above.

As the pressing bodies 30 move in sequence, the suction force of the suction pump 211 acts, and the peeling of the adhesive sheet 2 progresses from the outer periphery of the electronic component 3 to the inner periphery. Eventually, as shown in FIG. 12(E), only the innermost pressing body 30A presses the adhesive sheet 2, and the pressing surfaces 32 of the pressing bodies 30B to 30H on the outer periphery of the pressing body 30A are located at or below the suction surface 220 of the container 210, and the area of the pressing surface 31 of the innermost pressing body 30A becomes the part of the adhesive sheet 2 that is attached to the electronic component 3. At this time, each time the peeling operation is performed in sequence from the outer pressing body 30, the pressing surfaces 31 and 32 of the pressing bodies 30 on the inner periphery of the pressing body 30 are sequentially pressed and moved to a position higher than the reference position H. Therefore, the relative height (height difference) between the pressing surface 32 of the pressing body 30 that has been peeled and the pressing surfaces 31, 32 (the pressing surfaces 31, 32 supporting the electronic component 3) of the pressing body 30 located one periphery inside the pressing surface 32 can be gradually increased. In other words, the peel angle α can be gradually increased from the time when the first pressing operation is completed. Therefore, the adhesive sheet 2 can be favorably peeled off from the electronic component 3. In addition, since the pressing body 30 is moved (lowered) from the outermost periphery in sequence by the separating operation, even if the peel angle α is increased by the second pressing movement, the position of the inclined portion of the adhesive sheet 2 formed by the height difference of the pressing body 30 gradually moves away from the adjacent electronic component 3. In addition, the adhesive sheet 2 located on the side of the adjacent electronic component 3 is adsorbed by the pressing body 30 that has been separated. Therefore, each time the pressing body 30 is moved (raised) in the pressing direction, the tension applied to the adhesive sheet 2 of the adjacent electronic component 3 is suppressed, and the influence on the adjacent electronic component 3 can be suppressed.

The pressing surface 31 of the pressing body 30A on the innermost periphery is set to have a very small area. Therefore, by raising the suction nozzle 8 that has suctioned the electronic component 3, the electronic component 3 can be easily peeled off from the adhesive sheet 2. In other words, the pressing surface 31 of the pressing body 30A is set to a size that can suppress the stress applied to the electronic component 3 and allow it to be peeled off. Thereafter, by raising the suction nozzle 8, the electronic component 3 can be picked up from the adhesive sheet 2.

[Action and Effect]
(1) The pickup device 1 of this embodiment has a pickup unit 4 that picks up an electronic component 3 affixed to an adhesive sheet 2, and a backup unit 200 provided facing the surface of the adhesive sheet 2 opposite the electronic component 3. The backup unit 200 has an adsorption surface 220 that adsorbs and holds an area of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up, and a pressing unit 230 that is provided movably along a common axis within the adsorption surface 220, and has a plurality of pressing bodies 30 with different outer sizes arranged in a coaxial nested manner around the common axis, and each pressing body 30 has pressing surfaces 31, 32 that press the adhesive sheet 2.

Then, the pickup device 1 performs a first pressing operation in which the pressing surfaces 31 and 32 press the electronic component 3 via the adhesive sheet 2 by moving all the pressing bodies 30 in the pressing direction to press the adhesive sheet 2. After the first pressing operation, a separating operation is performed in which each pressing body 30 is sequentially moved from one of the pressing bodies 30 to an adjacent pressing body 30 in a separating direction in which the adhesive sheet 2 is peeled from the electronic component 3. , the position of the pressing surfaces 31 and 32 of at least one of the pressing bodies 30 other than the pressing body 30 that has moved in the separating direction is the same as the position of the pressing surfaces 31 and 32 caused by the first pressing operation in the pressing direction. It has a drive unit 20 that performs a second pressing operation of moving the pressing body 30 in the pressing direction so as to cross the pressing body 30.

In this way, each time the suction surface 220 of each pressing body 30 moves in the separating direction, the pressing body 30 performs the second pressing operation in which it moves in the pressing direction, so that the electronic component 3 to be picked up While the influence on the adjacent electronic component 3 can be suppressed, the pressing surface 32 of the pressing body 30 that has moved away and the pressing surfaces 31 and 32 of the pressing body 30 that supports the electronic component 3 to be picked up can be suppressed. The distance (height difference) can be increased. Therefore, it is possible to suppress the influence on the adjacent electronic components 3 and to perform good peeling.

More specifically, each time a peeling operation is performed in order from the outer pressing member 30, the pressing surfaces 31 and 32 of the inner pressing member 30 are located at a higher position than the reference position H than the pressing member 30 that performed the peeling operation. Since the pressing surface 32 of the pressing body 30 that has been peeled off and moved is one of the pressing surfaces 31 and 32 of the pressing body 30 located on the inner periphery, that is, the pressing body 30 that supports the electronic component 3. Since the difference can be sequentially increased and the peeling angle α can be sequentially expanded from the point at which the first pressing operation is completed, the adhesive sheet 2 can be peeled off from the electronic component 3 in a good manner. In addition, since the pressing body 30 is moved apart (lowered) sequentially from the outermost periphery by the separating operation, even if the inclination angle α is increased by the second pressing movement, the adhesive sheet formed by the height difference of the pressing body 30 is The position of the inclined portion 2 gradually moves away from the adjacent electronic component 3. Further, the adhesive sheet 2 located on the side of the adjacent electronic component 3 is attracted by the pressing body 30 that has moved away. Therefore, each time the pressing body 30 is moved (raised) in the pressing direction, the amount of extension of the adhesive sheet 2 from the adjacent electronic component 3 is suppressed, and the influence on the adjacent electronic component 3 can be suppressed. Furthermore, since a force in the pushing direction is applied to the electronic component 3 to be picked up, as well as a force in the separating direction, there is a case where a force is applied only in the separating direction unilaterally or a force is continuously applied only in the pressing direction. Compared to this, the occurrence of warping of the electronic component 3 can be suppressed.

(2) The drive section 20 includes a separation drive section 20A that individually moves each press body 30 in the separation direction, and a press drive section 20B that moves all the press bodies 30 in the press direction. Therefore, while the separating operation is performed by the separating drive section 20A, the first pressing operation and the second pressing operation can be performed by the common pressing driving section 20B.

(3) The separation drive unit 20A has a first drive member 241 that moves along a common axis, and a conversion mechanism that converts the operation of the first drive member 241 into an operation in the separation direction of the pressing body 30. . Therefore, by the operation of the single first driving member 241, the plurality of pressing bodies 30 can be sequentially moved from the outside in the separating direction and peeled off from the adhesive sheet 2. Therefore, it is possible to prevent the electronic component 3 from being damaged during pickup while preventing the device from becoming more complicated and larger.

(4) The conversion mechanism 250 individually urges the at least one pair of extension parts 60 extending outward from opposite side surfaces of each pressing body 30 and the extension parts 60 of each pressing body 30 in the direction of separation. It has a biasing member 70 and a first cam mechanism 80 that is driven by the first drive member 241 and allows the pressing bodies 30 to move in the separating direction sequentially from the outside to the inside.

For this reason, since the extending portion 60 extending outward from the side surface of the pressing body 30 is pressed by the urging member 70, the interval between the pressing positions becomes wider compared to when pressing inside the pressing body 30. , it is possible to prevent the pressing body 30 from wobbling, etc., and to stabilize the movement.

(5) The first cam mechanism 80 is provided on the surface of each pressing body 30 opposite the pressing surfaces 31, 32 that are pressed against the adhesive sheet 2, and has a cam surface 81 that has a different shape for each pressing body 30 along a direction intersecting a common axis, and a roller shaft 82 that contacts the cam surface 81 of each pressing body 30 to urge each pressing body 30 in a direction against the urging member 70 and moves in a direction intersecting the separation direction.

Therefore, as the roller shaft 82 moves, the plurality of pressing bodies 30 can be sequentially moved in the separating direction, so compared to the case where each pressing body 30 is driven independently, the pressing body 30 can be pressed with a simpler and smaller device. The number of bodies 30 can be increased to provide multiple stages. Therefore, when peeling electronic components 3 of the same area from the adhesive sheet 2, it is possible to reduce the area each time when peeling from the outside, and it is also possible to reduce the area of the central pressing surface 31 that remains at the end. . Thereby, damage to the electronic component 3 can be prevented by appropriately balancing the load applied to the electronic component 3 during peeling and the speed of peeling. For example, if the number of pressing bodies 30 is five or more, it is possible to prevent the electronic component 3 from being damaged while suppressing the complexity and size of the device. In addition, even when compared with the case where a flat plate-shaped blade is used as a pressing body, the area of the central pressing surface 31 remaining at the end can be similarly reduced. For example, in this embodiment, the area of the adhesive sheet 2 that remains without being peeled off by the pressing surface 31 of the innermost pressing body 30A is set to 0. It can be reduced to 5% or less.

(6) The conversion mechanism 250 includes a second cam mechanism 90 that converts movement of the first drive member 241 in a direction along the common axis into movement in a direction crossing the separation direction of the roller shaft 82. . For this reason, it is possible to move the first drive member 241 of the drive unit 20 in the Z-axis direction, which is a common axial direction, and to prevent the space from expanding in the X-axis direction, which is a direction perpendicular to the Z-axis direction.

(7) The second cam mechanism 90 has a roller 92 and an inclined surface 91 in contact with the roller 92, and a main drive cam that moves either the roller 92 or the inclined surface 91 along a common axis, and a driving cam that moves one of the roller 92 and the inclined surface 91 along a common axis. This is a direct-acting cam that uses a driven cam to move in a direction that intersects the axis of the cam. Therefore, the axial movement can be converted into the movement of the roller shaft 82 with a simple configuration. Incidentally, the inclined surface 91 may be used as a main driving cam, and the roller 92 may be used as a driven cam.

(8) The pressing section 230 has five or more pressing bodies 30A-30H, and the outermost pressing body 30H is formed so that the size of the pressing surface 32 is the same as or slightly smaller than the size of the surface of the electronic component 3 that is attached to the adhesive sheet 2, i.e., the outer shape of the electronic component 3, and the innermost pressing body 30A is formed so that the area of the pressing surface 31 is 30% or less of the area of the surface of the electronic component 3 that is attached to the adhesive sheet 2.

With this configuration, the adhesive sheet 2 can be peeled off little by little from the electronic component 3, and the area of the adhesive sheet 2 that ultimately remains without being peeled off from the electronic component 3 can be reduced. Even if the electronic component 3 is thin, it is possible to peel it off while suppressing stress. Such a configuration is particularly effective for picking up thin electronic components 3 that are relatively large in size, such as having a side length of more than 5 mm, and having a thickness of 50 μm or less. The area of the pressing surface 31 of the innermost pressing body 30A is set to 5% or less of the area of the electronic component 3, and the thickness of the side wall of the cylindrical pressing body 30 is set to 0.6 mm or less. By setting the number, reliability against stress can be further improved. In other words, the effect of suppressing damage to the electronic component 3 can be further improved.

[Second embodiment]
Referring to FIG. 15, a mounting apparatus 400 including the pickup device 1 of the first embodiment will be described as a second embodiment. In the following description, the direction along a vertical straight line will be referred to as the Z-axis direction, and the directions along two straight lines perpendicular to each other in a horizontal plane perpendicular to the Z-axis direction will be referred to as the X-axis direction and the Y-axis direction.

The mounting device 400 includes a supply device 500, an intermediate stage 600, a substrate stage 700, and a mounting mechanism 800 in addition to the pickup device 1 and the control device 300. The supply device 500 is a device that holds an adhesive sheet 2 to which an electronic component 3 such as a semiconductor chip is attached. The supply device 500 includes a wafer ring 510, a wafer table 520, and a drive mechanism (not shown). The wafer ring 510 is a member that holds the adhesive sheet 2 to which the electronic components 3 separated into pieces are adhered. The wafer table 520 is a device that movably supports the wafer ring 510. The drive mechanism supports the wafer table 520 so as to be movable in the X-axis, Y-axis, and Z-axis directions, and moves the wafer ring 510 along the X-axis, Y-axis, and Z-axis.

The intermediate stage 600 is a stage on which the electronic component 3 is temporarily placed when the electronic component 3 sucked and held by the suction nozzle 8 of the pickup device 1 is delivered to the mounting mechanism 800. The substrate stage 700 is a member on which a substrate 710 is placed. In other words, it is a member that supports the board 710 on which the electronic component 3 is mounted. The substrate stage 700 is supported by an XYθ direction moving mechanism (not shown) and is provided so as to be movable in the X axis direction, the Y axis direction, and the θ (horizontal rotation) direction.

The mounting mechanism 800 is a mechanism that mounts the electronic component 3 taken out by the pickup device 1 onto the board 710. The mounting mechanism 800 suction-holds the electronic component 3 from above the intermediate stage 600, and mounts the suction-held electronic component 3 onto a predetermined position on the substrate 710 supported by the substrate stage 700. The mounting mechanism 800 has a mounting tool 810 and an XYZ drive mechanism (not shown). The mounting tool 810 is a suction nozzle that suctions and holds the electronic component 3. The XYZ drive mechanism is a mechanism that moves the mounting tool 810 in the X, Y, and Z axis directions.

The pickup device 1 has the same configuration as the first embodiment described above. Further, the control device 300 is the same as the control device 300 of the first embodiment, with the function of controlling the supply device 500, the substrate stage 700, and the mounting mechanism 800 added.

In such a mounting apparatus 400, the pickup apparatus 1 picks up the electronic component 3 from above the wafer ring 510 supported by the wafer table 520 of the supply apparatus 500 as described above. The pickup device 1 delivers the picked-up electronic component 3 to the mounting tool 810 of the mounting mechanism 800 via the intermediate stage 600. The mounting tool 810 mounts the electronic component 3 onto the substrate 710 on the substrate stage 700. The mounting apparatus 400 sequentially and repeatedly performs such operations of picking up the electronic component 3, delivering it, and mounting it on the board 710.

Such a mounting apparatus 400 can provide the same effects as those of the first embodiment described above. Furthermore, with this effect, it is possible to improve the mounting quality and the reliability of the mounting of the electronic component 3 by the mounting apparatus 400, and as a result, the electronic component 3 is mounted on the substrate 710 and a semiconductor package, etc. It is possible to improve the quality of electronic component products.

[Modified example]
The following modifications are also applicable to this embodiment. In the above embodiment, the distance (distance in the height direction) from the reference position H of the pressing surface 31 of the pressing body 30 that has moved in the separating direction increases as it goes toward the outer circumference, and decreases as it goes toward the inner circumference. However, the pressing surface 31 of the pressing body 30 that has moved in the separating direction is at the same position, for example, the pressing surface 32 of the pressing body 30 that has finally moved away is at the same height below the position of the first pressing operation. It may be arranged so that they are aligned. This height may be, for example, the position of the suction surface 220 of the container 210. In this case as well, effects similar to those of the above embodiment can be obtained. An example of such an aspect will be described with reference to FIG. 16. 16(A) to (D) are schematic cross-sectional views of the pressing part 230, similar to FIG. 6, and (B') and (B), (C') and (C), and (D') and (D) are performed simultaneously and in parallel. As shown in FIG. 16(a), the height difference between each step of the stair surface 85 and the adjacent step is h+. (h/3), and the height difference between the other stages is h/3.

First, in an initial state in which the roller shaft 82 is in contact with the matching surface 84 of all the pressing bodies 30, the pressing surfaces 31 and 32 of each pressing body 30 are at the same height position [α]. From this state, as shown in FIGS. 16A and 16A, a first pressing operation is performed for a moving distance h so that the pressing surfaces 31 and 32 reach the height position [β].

Next, as shown in FIGS. 16(B') and 16(b), the roller shaft 82 moves from the matching surface 84 of the outermost pressing body 30, beyond the starting end p, to the first step of the stepped surface 85. do. Then, due to the urging force of the urging member 70, the outermost pressing body 30 moves in the separating direction. The moving distance at this time is h+(h/3) due to the step difference in the stair surface 85. In parallel with this, all the pressing bodies 30 move in the pressing direction, as shown in FIGS. 6(B) and (b). The moving distance at this time is h/3. As a result, the pressing surface 31 of the pressing body 30 at the innermost periphery moves by h/3 from the height position [β], and the pressing surface 32 of the pressing body 30 at the outermost periphery comes to the height position [α].

Then, as shown in FIGS. 16(C') and (c), the roller shaft 82 moves from the matching surface 84 of the pressing body 30 adjacent to the outermost pressing body 30, beyond the starting end p, to the step surface 85. Move to the first stage. Further, the roller shaft 82 is located at the second stage of the pressing body 30 at the outermost periphery. Then, due to the urging force of the urging member 70, the outermost pressing member 30 and the adjacent pressing member 30 move in the separating direction. The moving distance at this time is h/3 for the outermost pressing body 30 and h+(h/3) for the pressing body 30 adjacent thereto. In parallel with this, all the pressing bodies 30 move in the pressing direction, as shown in FIGS. 6(C) and 6(c). The moving distance at this time is h/3. As a result, the pressing surface 31 of the pressing body 30 at the innermost circumference moves by (h/3)×2 from the height position [β], and the pressing surface 31 of the pressing body 30 at the outermost circumference and the pressing body 30 adjacent thereto moves from the height position [β] by (h/3)×2. 32 comes to the height position [α].

Furthermore, as shown in FIGS. 16(D') and (d), the roller shaft 82 is moved inward from the outermost pressing member 30 from the matching surface 84 of the second pressing member 30 to the first stage of the step surface 85. move to. Further, the roller shaft 82 is located at the third stage of the stepped surface 85 of the outermost pressing body 30 and at the second stage of the stepped surface 85 of the pressing body 30 adjacent thereto. Then, due to the urging force of the urging member 70, the outermost pressing member 30 and the adjacent pressing member 30 move in the separating direction. The moving distance at this time is h/3 for the outermost pressing body 30, h/3 for the pressing body 30 adjacent thereto, and h+(h/3) for the pressing body adjacent to the inner side. In parallel with this, all the pressing bodies 30 move in the pressing direction, as shown in FIGS. 16(D) and (d). The moving distance at this time is h/3. As a result, the pressing surface 32 of the innermost pressing member 30 moves from the height position [β] by (h/3)×3=h, and the outermost pressing member 30 and the two inner pressing members 30 The pressing surface 32 of comes to the height position [α].

Through the above operations, the position of the pressing surface 31 of the innermost pressing body 30 moves to the position [γ] higher than the position [β], and the pressing surface 32 of the other pressing bodies 30 moves to the position [γ]. α]. In this way, while ensuring the distance between the position of the pressing surface 31 of the innermost pressing body 30 and the position of the pressing surface 32 of the other pressing bodies 30, the distance from [β] to the pressing surface 31, [ [beta]] to the pressing surface 32 can be suppressed from increasing.

The form of the pressing body 30 in this embodiment is not limited to the form shown above. For example, if the height difference between the pressing surface 31 of the innermost pressing body 30 and the pressing surface 32 of the adjacent pressing body 30 is greater than the height to the height position [β] by the first pressing operation, the pressing bodies 30 around the innermost pressing body 30 may protrude above the suction surface 220 of the container 210.

Further, the supporting direction of the adhesive sheet 2, the pickup direction of the pickup mechanism 100, the driving direction of the first driving member 241 and the second driving member 242 of the backup part 200, and the moving direction of the pressing body 30 are vertical directions. may be in the horizontal direction or in a direction inclined with respect to these.

In the above aspect, the first driving member 241 and the conversion mechanism 250 move the pressing body 30 from the outer pressing body 30H to the adjacent inner pressing bodies 30G, 30F, etc. in the separating direction in order during the separating operation. Although all the pressing bodies 30 are sequentially moved in the pressing direction, that is, raised, during the second pressing operation, the present invention is not limited to this. For example, during the second pressing operation, only the pressing bodies 30 on the inner periphery of the pressing bodies 30 that have moved in the separating direction are raised, or the pressing bodies 30 on the inner periphery of one of the pressing bodies 30 that have moved in the separating direction, that is, Alternatively, only the pressing body 30 may be raised. Further, the timing at which each pressing body 30 is lowered (separating operation) is not limited to lowering at equal time intervals, and the time intervals at which each pressing body 30 is lowered may be different. For example, the smaller the area of the electronic component 3 in contact with the adhesive sheet 2, the shorter the time interval for lowering the pressing body 30. More specifically, the time interval at which the pressing body 30 is lowered may be shortened as the position approaches the inside from the outside.

In the above embodiment, the separation operation and the second pressing operation are performed simultaneously in parallel, but this is not limited to the above. For example, the second pressing operation may be performed after the separation operation. Specifically, the outermost pressing body 30 may be subjected to a separation operation, followed by a second pressing operation of a pressing body 30 on the inner side of the outermost pressing body 30, and then, at the next timing, the second pressing body 30 from the outermost pressing body 30 may be subjected to a separation operation, followed by a second pressing operation of a pressing body 30 on the inner side of the outermost pressing body 30.

For example, in the above embodiment, an inclined surface is formed on the cam surface 81 to raise each pressing body 30 by a predetermined amount at the same timing, and after each pressing body 30 is raised by a predetermined amount at once, the outer The pressing body 30H may be lowered in order. With this configuration, the second driving member 242 can be omitted.

Further, in the above embodiment, the separating operation is performed by the separating driving section 20A using a cam, and the second pressing operation is performed by the pressing driving section 20B, but the second pressing operation is also performed by the separating driving section 20A. You may also make it happen.

To change the way the pressing body 30 operates, the shape of the cam surface 81, that is, the cam curve, may be changed appropriately for each pressing body 30. For example, in the above embodiment, if it is desired to shorten the time interval for lowering each pressing body 30, the relative interval of the start p of the step surface 85 on the cam surface 81 between each pressing body 30 may be shortened. Also, if it is desired to increase the amount of descent of the pressing body 30, the height difference between the step surface 85 and the matching surface 84, or the height difference between each step of the step surface 85 may be increased. Also, if it is desired to cause the cam surface 81 to perform a second pressing operation, an inclined surface may be formed on the cam surface 81 of the pressing body 30 to perform the second pressing operation, so that the cam surface 81 rises at the timing when the pressing body 30 on the periphery performs the separation operation.

Furthermore, the shape of the cam surface 81 for moving the pressing body 30 in the separation direction is not limited to a stepped shape. Even if it is a continuous inclined surface, the pressing body 30 can be moved sequentially in the separation direction. In this way, by adopting a configuration for control by the cam surface 81, the amount of pushing up or separating of each pressing body 30, and the timing of pushing up or separating can be freely set depending on the shape of the cam surface 81 of each pressing body 30. However, in the present invention, it is also possible to configure the driving unit that drives each pressing body 30 as a multi-axis configuration having a driving member that drives each pressing body 30 in the Z-axis direction.

Further, in the above embodiment, the pressing body 30 is formed into a rectangular cylinder shape or a rectangular column shape, but it is not limited to this. It may be formed into a shape or a prismatic shape. For example, when the pressing bodies 30 are cylindrical and cylindrical, the opposing sides of each pressing body 30 are two lines located on a straight line that intersects perpendicularly to a plane containing the common axis of each pressing body 30. It becomes the side. Therefore, in the cylindrical pressing body 30, when the extending portion 60 is provided on the outside of the side surface of the pressing body 30 as in the above embodiment, the extending portion 60 is provided so as to be in contact with the side surface of the cylinder. Become. The number of pressing bodies 30 constituting the pressing section 230 may also be five or more or less than five. If the number is less than five, it is possible to provide a drive unit with the above-mentioned multi-axis configuration while suppressing the increase in size.

Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention, as well as within the scope of the invention described in the claims and its equivalents.

1 Pickup device 2 Adhesive sheet 3 Electronic component 4 Pickup section 5 Main body section 6 Convex section 7 Suction hole 8 Suction nozzle 8a Flat surface 9 Nozzle hole 20 Drive section 20A Separation drive section 20B Pressure drive section 21A, 21B Drive mechanism 30, 30A ~30H Pressing bodies 31, 32 Pressing surface 33 First protrusion 34 Second protrusion 35 Recess 36 Notch 50 Frame 51 Support block 51a Guide hole 51b Projection 52 First support plate 53 Linear guide 54 Second support Plate 60 Extension portion 70 Biasing member 80 First cam mechanism 81 Cam surface 82 Roller shaft 83 Moving body 83a Moving block 83b Bearing 84 Matching surface 85 Stair surface 86 Stopper surface 90 Second cam mechanism 91 Inclined surface 92 Roller 93 Bearing 100 Pickup mechanism 200 Backup part 210 Container 211 Suction pump 220 Suction surface 221 Suction hole 222 Opening 230 Pressing part 241 First drive member 242 Second drive member 250 Conversion mechanism 300 Control device 400 Mounting device 500 Supply device 510 Wafer ring 520 Wafer table 600 Intermediate stage 700 Substrate stage 710 Substrate 800 Mounting mechanism 810 Mounting tool

Claims (10)

a pickup section that picks up electronic components stuck on the adhesive sheet;
a backup portion provided opposite to a surface of the adhesive sheet opposite to the electronic component;
has
The backup section is
an adsorption surface that adsorbs and holds an area of the adhesive sheet corresponding to the electronic component to be picked up;
A plurality of pressing bodies that are movably provided within the suction surface along a common axis and have different external sizes are coaxially nested on the common axis, and each pressing body is attached to the adhesive sheet. a pressing part having a pressing surface that presses the
By moving all of the pressing bodies in a pressing direction that presses the adhesive sheet, the pressing surface performs a first pressing operation that presses the electronic component via the adhesive sheet, and the first pressing operation is performed. Then, a separating operation in which each pressing body is sequentially moved from one of the pressing bodies to an adjacent pressing body in a separating direction in which the adhesive sheet is peeled from the electronic component, and a pressing body other than the pressing body that has moved in the separating direction. A second step of moving the pressing body in the pressing direction so that the position of the pressing surface of at least one pressing body among the bodies exceeds the position of the pressing surface caused by the first pressing operation in the pressing direction. a driving unit that performs a pressing operation;
has
The drive unit includes:
a separation drive unit that individually moves each pressing body in the separation direction;
a pressing drive unit that moves all the pressing bodies in the pressing direction;
has
The separation drive section is
a first drive member moving along the common axis;
a conversion mechanism that converts the operation of the first driving member into the movement of each of the pressing bodies in the separating direction;
A pick-up device for electronic components, characterized by having the following. 2. The electronic component pickup device according to claim 1, wherein the separation operation is performed sequentially from the outermost pressing member to the innermost pressing member. The second pressing operation is performed each time one pressing body moves in the separating direction due to the separating operation, and among the pressing bodies located inside the pressing body that performed the separating operation, at least the pressing body moves in the separating direction. A pressing body adjacent to the pressing body that has performed the operation is moved in the pressing direction by a preset distance, and finally the position of the pressing surface of the pressing body located at the innermost circumference is determined by the first pressing operation. 3. The electronic component pickup device according to claim 1, wherein the position of the pressing surface exceeds the position of the pressing surface in the pressing direction. The conversion mechanism is
at least a pair of extending portions extending outward from opposing sides of each pressing body;
a biasing member that individually biases the extending portion of each pressing body in the separating direction;
a first cam mechanism that is driven by the first driving member and allows each pressing body to sequentially move in the separating direction from one of the pressing bodies to an adjacent pressing body;
2. The electronic component pickup device according to claim 1 , further comprising: The first cam mechanism is
a cam surface provided on the opposite side of the adsorption surface of each pressing body and having a different shape for each pressing body along a direction intersecting the common axis;
a roller shaft that is in contact with a cam surface of each pressing body, biases each pressing body in a direction against the urging member, and moves in a direction intersecting the separation direction;
5. The electronic component pickup device according to claim 4 , further comprising: The conversion mechanism is
Claim characterized by comprising a second cam mechanism that converts movement of the first drive member in a direction along the common axis into movement of the roller shaft in a direction intersecting the separation direction. 5. The electronic component pickup device according to 5 . The second cam mechanism is
It has a roller and an inclined surface in contact with the roller,
The cam is characterized in that it is a direct-acting cam in which one of the roller and the inclined surface is a main-acting cam that moves one of the rollers and the inclined surface along the common axis, and the other is a driven cam that moves the other in a direction intersecting the common axis. The electronic component pickup device according to claim 6 . The pressing unit includes five or more pressing bodies,
the outermost pressing body is formed so that the size of the pressing surface is the same as or slightly smaller than the size of the surface of the electronic component to be picked up that is to be attached to the adhesive sheet;
The electronic component pickup device according to any one of claims 1 to 7, characterized in that the area of the pressing surface of the innermost pressing body is formed to be 30% or less of the area of the surface of the electronic component to be picked up that is attached to the adhesive sheet . A pickup mechanism that picks up electronic components stuck on an adhesive sheet,
a backup portion provided opposite to a surface of the adhesive sheet opposite to the electronic component;
has
The backup section is
an adsorption surface that adsorbs and holds an area of the adhesive sheet corresponding to the electronic component to be picked up;
A plurality of pressing bodies that are movably provided within the suction surface along a common axis and have different external sizes are coaxially nested on the common axis, and each pressing body holds the adhesive sheet. a pressing part having a pressing surface to press;
By moving all of the pressing bodies in a pressing direction that presses the adhesive sheet, the pressing surface performs a first pressing operation that presses the electronic component via the adhesive sheet, and the first pressing operation is performed. Then, a separating operation in which each pressing body is sequentially moved from one of the pressing bodies to an adjacent pressing body in a separating direction in which the adhesive sheet is peeled from the electronic component, and a pressing body other than the pressing body that has moved in the separating direction. A second step of moving the pressing body in the pressing direction so that the position of the pressing surface of at least one pressing body among the bodies exceeds the position of the pressing surface caused by the first pressing operation in the pressing direction. a driving unit that performs a pressing operation;
a conversion mechanism that is provided in the drive unit and converts the operation of a single drive member that moves along the common axis into a separation operation of the plurality of pressing bodies;
has
The conversion mechanism is
a biasing member that individually biases each pressing body in the separating direction;
a cam surface provided on the opposite side of the pressing surface of each pressing body to the pressing surface that is pressed against the adhesive sheet, and having a different shape for each pressing body along the direction intersecting the common axis;
a roller shaft that comes into contact with a cam surface of each pressing body, urges each pressing body in a direction against the urging member, and moves in a direction intersecting the separation direction;
A pick-up device for electronic components, characterized by having the following. a supply device that holds an adhesive sheet with a semiconductor chip attached thereto;
a substrate stage on which the substrate is placed;
a pickup device that picks up the semiconductor chip from the adhesive sheet held by the supply device;
A mounting device comprising: a mounting mechanism for mounting the semiconductor chip taken out by the pickup device on the substrate,
A mounting apparatus, wherein the pickup device is the pickup device according to any one of claims 1 to 9 .

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