JP5287276B2 - Electronic component pickup method and pickup device - Google Patents

Description

  The present invention relates to a method and apparatus for picking up a single electronic component in a mounting process of an electronic component such as a semiconductor chip. More specifically, the present invention relates to a method and an apparatus for picking up a chip used for peeling and holding a single chip from an adhesive sheet on which a large number of semiconductor chips cut out from a wafer are adhesively held and transported to a mounting process. .

  In the process of mounting a semiconductor chip on an object to be mounted such as a substrate, the semiconductor wafer is first attached to a so-called dicing tape, and the wafer is cut into portions to separate the individual chips. The dicing tape refers to a flexible sheet having an adhesive applied on one side, and may have a multilayer structure. In this state, after carrying the chip together with the dicing tape, the chip is peeled off and held from the individual dicing tape by a pickup device such as a mounting device, and mounted on the object to be mounted (see Patent Document 1). In the peeling-pickup operation, first, the dicing tape is tensioned and fixed in the chip supply area of the mounting apparatus. Next, the chip to be picked up from the back surface of the dicing tape is pushed up together with the tape by the push-up member, and the tape-chip is peeled off in a region other than the region sandwiched between the push-up member and the chip. Thereby, the holding force of the chip by the dicing tape is reduced, and then the chip is forcibly separated from the tape by a mounting collet or the like to hold it.

JP 2005-033079 A JP 2006-318972 A JP 2005-1117019 A Japanese Patent Laid-Open No. 11-186298

  Along with the recent miniaturization of electronic components, semiconductor chips have also been miniaturized and highly integrated, and the substrate itself has also been made thinner. Specifically, the back surface of the wafer is polished to reduce the wafer thickness to a few hundreds of microns or less than a few hundreds of microns, and a subsequent chip cutting process is performed. In such a chip, the ratio of the thickness to the length of one side of the chip is 1/100, and in the conventional pickup device, the chip itself may be broken due to a load when peeling it from the dicing tape. Will arise. In response to this problem, Patent Document 2 discloses a cylindrical first member, a cylindrical second member that can be fitted into a columnar space of the first member, and a circle of the second member. An example is shown in which a cylindrical third member that can be fitted into a columnar space is arranged concentrically and used as a unit for pushing up a chip. In this configuration, the chip and the dicing tape are sucked and held in such a manner that the unit and the collet are sandwiched between the unit and the collet, and from this state, the first member, the second member, and further the third member are removed from the dicing tape in this order. The dicing tape is peeled from the chip by sliding in a direction away from the chip and using the suction force of the decompression space generated by the sliding. In this embodiment, the dicing tape is gradually peeled off from the outer peripheral portion of the chip, and the chip is always held by suction by the collet, thereby maintaining the chip in a flat state, thereby preventing the chip from being damaged. Further, Patent Document 3 is similar to Patent Document 2, and in the manner in which the chip is pushed up by the unit, the pushing-up operation is sequentially stopped from the outer member at the time of pushing-up, and finally A configuration is disclosed in which only the member that pushes up the center of the chip performs the push-up operation. Also in this configuration, the chip is held in advance by a collet to keep the chip flat and to promote the peeling of the dicing tape from the chip.

  Here, the semiconductor chip is required to be thin and have high performance. As a specific required function, there is speeding up of signal transmission in a module product. In order to meet this requirement, a so-called Low-K material that has a low dielectric constant and lowers the capacitance between wirings to suppress signal delay is used for the interlayer insulating film and the like. However, many of the materials currently used as such Low-K materials are porous, and have a characteristic that they are low in strength and more brittle. For this reason, in the case of a configuration in which a chip or the like is sandwiched between a push-up unit and a collet as in the cited reference 2 described above, the individual operations are precisely synchronized while maintaining the chip thickness between them. Otherwise, there is a further concern that the chip may be damaged due to the clamping force exceeding the pressure resistance of the chip. Further, in the case of the configuration shown in the cited document 3, the tip is held by the collet in a state where the posture of the tip is finally controlled only by the push-up member at the center. In this case, there is no problem due to clamping, but if accurate posture control cannot be achieved when contacting the collet, it is difficult to accurately hold the chip, and there is a problem in chip breakage during the holding or a subsequent mounting process. There is a fear. In addition to avoiding load concentration at the time of pushing-up with two push-up units, and instead of controlling the posture when holding the tip by the collet, the style of loading the structure that follows the tip posture on the collet side is patent literature 4. However, in this method, there is a state in which the semiconductor chip is sandwiched between the collet and the push-up unit, and it is still necessary to reduce the load.

  The present invention has been made in view of the above circumstances, and provides a pickup method and a pickup method for an electronic component that can peel and hold a thin and easily breakable semiconductor chip of a relatively large area from a dicing tape stably and at high speed. It is intended to provide.

  In order to solve the above-described problems, an electronic component pick-up method according to the present invention is an electronic device in which a predetermined electronic component is peeled from a dicing tape and picked up from a plurality of electronic component groups arranged and arranged on the adhesive surface of the dicing tape. A method for picking up a component, wherein a suction collet that sucks and conveys an electronic component from a dicing tape and a non-adhesive surface side of the dicing tape are arranged at a position corresponding to the electronic component to be picked up, and the dicing tape extends A third support surface which is movable independently along an axis perpendicular to the surface to be moved and which is arranged substantially parallel to the surface on a central axis which is an axis passing through the center of the electronic component; A second support surface arranged outside the support surface, a first support surface arranged outside the second support surface according to the outer shape of the electronic component, and the central axis An adsorption holding surface arranged outside the first support surface and capable of adsorbing and holding a region on the non-adhesive surface side corresponding to a region for adhering and holding an electronic component group other than the electronic components in the dicing tape, Arrangement of the first support surface, the second support surface, and the third support surface, or support of at least one of the first, second, and third support surfaces from the state existing in the same surface By using a configuration that forms a suction space that opens toward the non-adhesive surface of the dicing tape and generates a suction force on the non-adhesive surface by moving the surface in the axial direction, the suction holding surface, the first support surface, A first step of bringing the second support surface and the third support surface into contact with the non-adhesive surface of the dicing tape in a state where the second support surface and the third support surface are disposed in the same plane; and the first support surface and the second support The contact portion of the surface and the third support surface with the dicing tape is simultaneously determined in the axial direction. By moving, the second step of moving the area other than the area adsorbed and held on the adsorption holding surface of the dicing tape to the adhesion holding surface side together with the electronic component, and the second support surface are separated from the non-adhesive surface of the dicing tape The third step, the fourth step of adsorbing the electronic component by the adsorption collet, and separating the adsorption collet from the dicing tape to separate the electronic component from the dicing tape, and the first to fourth steps And a fifth step of setting the suction space to a negative pressure at an arbitrary timing in the course of performing the step.

  In the electronic component pick-up method described above, the sum of the areas of the first support surface and the third support surface is the area of the suction recess of the suction collet and the force required for peeling the dicing tape. The first support surface and the third support surface in the third step are preferably defined based on a diagram for obtaining an area where the first support surface and the non-adhesive surface of the dicing tape are in contact with each other. Further, when the first support surface is composed of a plurality of regions, the outline of the region when the area defined by the circumscribed line of the first support surface is the maximum area is more than the outline of the electronic component. More preferably, the electronic component and the dicing tape obtained in the second step are arranged inward by a value obtained by adding the width of the peeling area where the electronic component is initially peeled and the thickness of the dicing tape. Alternatively, the outline of the first support surface is added with the width of the peeling region and the thickness of the dicing tape from which the electronic component and the dicing tape obtained from the second step are initially peeled, rather than the outline of the electronic component. More preferably, only the value is placed inward. Furthermore, when the suction collet stops at the suction position, the first support surface and the third support surface support the electronic component via the dicing tape, and the suction collet is spaced from the surface of the electronic component by a predetermined distance. It is more preferable to set the suction position.

  In order to solve the above problems, an electronic component pickup apparatus according to the present invention peels a predetermined electronic component from a plurality of electronic component groups arranged in alignment with the adhesive surface of the dicing tape, An apparatus for picking up an electronic component to be picked up, a suction collet that sucks and transports the electronic component from a dicing tape, and a protrusion disposed on the non-adhesive surface side of the dicing tape at a position corresponding to the electronic component to be picked up. It has a lifting unit and a storage space for the lifting unit. The lifting unit is located at a position corresponding to the electronic component, and corresponds to the area where the electronic component group placed around the electronic component on the dicing tape is adhesively held. An adsorption block having an adsorption holding surface for adsorbing and holding an area on the non-adhesive surface side, and the adsorption block and the protrusion The suction space is composed of a bald unit and a dicing tape and has a suction opening that opens toward the non-adhesive surface, and the suction space that causes the suction force to act on the dicing tape from the non-adhesive surface side is exhausted from the suction space. Control that controls the suction exhaust system, the suction position of the suction collet when the suction collet peels and holds the electronic component from the dicing tape, and the state of the push-up unit when the electronic component is peeled by the suction collet And a push-up unit, each of which is independently movable along an axis perpendicular to a surface extending to the dicing tape, and which is an axis passing through the center of the electronic component. A third support surface disposed substantially parallel to the surface, a second support surface disposed outside the third support surface, and the electronic unit further outside the second support surface A first support surface, a first support surface, a second support surface, and a third support surface arranged according to the outer shape of the first block, the second block, and the third block, respectively. And a first support surface, a second support surface, and a third support surface, each having a block, and a drive unit that independently moves the first block, the second block, and the third block. Is characterized by changing the size of the suction opening according to each arrangement.

  In the electronic component pickup device described above, the first support surface is preferably formed by a plurality of support pins erected on the first block. Further, in this case, the region having the maximum area defined by the circumscribed line of the first support surface by the plurality of support pins is added with the width of the peeling region and the thickness of the dicing tape rather than the outline of the electronic component. It is more preferable to arrange inward by the value. Alternatively, the outer shape of the contact surface that contacts the dicing tape on the first support surface is arranged inward by a value obtained by adding the width of the predetermined peeling region and the thickness of the dicing tape, rather than the outer shape of the electronic component. The width of the predetermined peeling region is preferably in a range that does not cause bending deformation of the electronic component during the push-up operation. Further, when the suction collet stops at the suction position, the first support surface and the third support surface support the electronic component via the dicing tape, and the suction collet is at a position spaced from the surface of the electronic component by a predetermined distance. It is more preferable to set the suction position.

  According to the present invention, it is possible to reduce the load applied to the chip when the semiconductor chip is peeled off from the dicing tape, and to suppress damage to the chip and increase in internal stress. Further, due to the effect, even when the strength of the semiconductor chip is low in shape or material, it is possible to reduce the possibility of chip breakage and perform high-speed peeling and holding. In addition, it is possible to stabilize the posture of the semiconductor chip when sucked by the collet, and suppresses the positional displacement of the chip at the time of suction, the impact applied to the chip at the time of suction due to the positional shift, and stable mounting operation Can also be performed. In addition, according to the present invention, since the semiconductor chip can be peeled off from the dicing tape without holding the semiconductor chip in the thickness direction, the adverse effects that can be caused by holding the chip as described above are suppressed. It is also possible to do. Furthermore, since the load on the semiconductor chip is reduced, it is possible to relatively increase the peeling speed of the dicing tape. Even when the strength of the semiconductor chip is low in shape or material, the pick-up operation can be performed at high speed. Can be performed.

It is a figure showing the schematic structure of the principal part in the pick-up device for semiconductor chips concerning a first embodiment of the present invention including the partial axial section of these structures. It is a figure which shows schematic structure of the state which looked at the pushing-up unit from the upper surface in embodiment shown to FIG. 1A. 1B is a perspective view schematically showing a push-up unit shown in FIG. 1B and a semiconductor chip pushed up by the unit. FIG. It is a figure which shows the mode at the time of specific operation | movement at the time of peeling operation of a semiconductor chip in the structure which concerns on embodiment shown to FIG. 1A. It is a figure which shows the mode at the time of specific operation | movement at the time of peeling operation of a semiconductor chip in the structure which concerns on embodiment shown to FIG. 1A. It is a figure which shows the mode at the time of specific operation | movement at the time of peeling operation of a semiconductor chip in the structure which concerns on embodiment shown to FIG. 1A. It is a figure which shows the mode at the time of specific operation | movement at the time of peeling operation of a semiconductor chip in the structure which concerns on embodiment shown to FIG. 1A. It is a figure explaining the setting conditions of arrangement | positioning, such as a 1st support surface. It is a figure which shows the state which looked at the related structure from the side about FIG. 4A. It is a figure explaining setting conditions, such as a size of the 3rd support surface. It is a figure which shows the state which looked at the related structure from the side about FIG. 5A. It is a figure which shows the relationship of the attractive_force | adsorptive_power | peeling_force of the adsorption collet, and the adhesive force of an adhesion area | region. It is a figure explaining progress of the situation at the time of exfoliation when the 2nd block 15 does not exist. It is a figure explaining progress of the situation at the time of exfoliation when the 2nd block 15 does not exist. It is a figure explaining the load which acts on the semiconductor chip 101 when the 2nd block 15 does not exist. It is a figure explaining progress of the situation at the time of exfoliation when the 2nd block 15 exists. It is a figure explaining progress of the situation at the time of exfoliation when the 2nd block 15 exists. It is a figure explaining progress of the situation at the time of exfoliation when the 2nd block 15 exists. It is a figure explaining the load which acts on the semiconductor chip 101 when the 2nd block 15 exists. It is a figure which shows the other example of the shape of the 2nd support surface 15b. It is a figure which shows the other example of the shape of the 2nd support surface 15b. It is a figure which shows the other example of the shape of the 2nd support surface 15b. It is a figure which shows the relationship between the suction force of an adsorption | suction collet-peeling force-adhesion force of an adhesion area | region, Comprising: Furthermore, it is a figure which shows the relationship when the distance of the adsorption | suction surface of an adsorption collet and a semiconductor chip is also made into a variable. It is a figure which shows the schematic structure of the principal part in the pick-up apparatus for semiconductor chips concerning two embodiment of this invention including the partial axial direction cross section of these structures. It is a figure which shows schematic structure of the state which looked at the pushing-up unit from the upper surface in embodiment shown to FIG. 11A. FIG. 11B is a diagram illustrating a state during a specific operation during a semiconductor chip peeling operation in the configuration according to the embodiment illustrated in FIG. 11A. FIG. 11B is a diagram illustrating a state during a specific operation during a semiconductor chip peeling operation in the configuration according to the embodiment illustrated in FIG. 11A. FIG. 11B is a diagram illustrating a state during a specific operation during a semiconductor chip peeling operation in the configuration according to the embodiment illustrated in FIG. 11A. FIG. 11B is a diagram illustrating a state during a specific operation during a semiconductor chip peeling operation in the configuration according to the embodiment illustrated in FIG. 11A.

(First embodiment)
A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1A relates to the semiconductor chip pickup device according to the first embodiment of the present invention. FIG. 1A is a diagram partially showing an axial section of the configuration of the main part and showing a schematic configuration of elements related to the main part. . FIG. 1B is a diagram showing a configuration in which the semiconductor chip actually picked up is pushed up in the configuration shown in FIG. 1A as viewed from the pushing-up direction. FIG. 2 is a perspective view showing a positional relationship and the like at the time of push-up including a semiconductor chip to be pushed up in addition to the push-up unit shown in FIGS. 1A and 1B.

  The pickup device according to the present embodiment includes a main body portion 5 including a push-up unit 1 and a suction block 3, a Z portion orthogonal to the XY plane, and the main body portion 5 in the XY plane parallel to the extending surface of the dicing tape. And a main body drive system 7 that is moved along the axis. The suction block 3 has a cylindrical structure that extends in an axial direction perpendicular to the XY plane and has a hollow portion 3a that is a housing space for housing a push-up unit described later. The hollow portion 3a extends in the axial direction perpendicular to the XY plane described above. The upper end surface acting as the adsorption holding surface 3b is a plane parallel to the XY plane, and the adsorption opening 3c of the first suction line 3d connected to the suction exhaust system 9 is opened on the adsorption holding surface 3b. Yes. In this embodiment, the semiconductor chip to be picked up has an extremely thin flat plate shape with a relatively large area, and a plurality of semiconductor chips are adhesively held on the adhesive surface of the dicing tape (hereinafter referred to as the surface of the dicing tape). I will do it. The dicing tape is fixed to a fixing unit (not shown) in a state where a plurality of the semiconductor chips are held and so that the flat plate shape of the semiconductor chips extends in parallel to the XY plane described above. To do. The push-up unit 1 is disposed so as to fit into the hollow portion 3a of the suction block 3. In this configuration, the hollow portion 3a is arranged so as to correspond to a semiconductor chip 101a to be picked up, which will be described later, and the suction block 3 is a group of semiconductor chips arranged around the chip through the suction opening 3c via a dicing tape. Hold by adsorption. The push-up unit 1 includes a first block 11, a support pin 13, a second block 15, and a third block 17. The first block 11, the second block 15, and the third block 17 pass through the center of the flat plate shape of the semiconductor chip to be picked up and have an axis perpendicular to the flat plate surface (the same axis as described above). As the central axis, they are arranged concentrically from the outside in the order described here. That is, the first block 11 is disposed farthest from the central axis between these blocks, the second block 15 is disposed closer to the central axis than the first block 11, and the third block 17 is The second block 15 is disposed closer to the central axis. Further, the suction block 3 is disposed outside the first block 11 with respect to the central axis. In other words, the configuration includes a third support surface 17a (support surface disposed on the third block 17), which will be described later, disposed on the central axis and parallel to the flat plate surface of the semiconductor chip, and the third A second support surface 15b (a support surface disposed on the second block 15), which will be described later, disposed outside the support surface, and an outer side of the second support surface, depending on the outer shape of the semiconductor chip 101. It is defined that the first support surface 13a, which will be described later, is arranged.

  The first block 11 is slidable in the Z-axis direction (perpendicular to the XY plane) in the hollow portion 3a, and has a rectangular shape that ensures a predetermined airtightness between the first block 11 and the hollow portion 3a in the XY plane. It has the external shape. In this embodiment, the rectangular shape corresponds to the outer shape (planar shape) of the semiconductor chip to be picked up, and has a size that is slightly larger than the outer shape. Moreover, it has the cylindrical-shaped 2nd block accommodation space 11a extended coaxially with this 1st block 11 centering | focusing on the axis | shaft in which the 1st block 11 extends. In this embodiment, the upper end surface 11b of the first block 11 is a plane parallel to the XY plane, and the support pins 13 are fixed at predetermined positions (details of the predetermined positions will be described later) at the four corners of the rectangular shape. . The support pin 13 extends in parallel with the axis of the first block 11 and has a first support surface 13a parallel to the XY plane as an upper end surface. The first block 11 is connected to the first block drive system 19 so that it can be driven in the Z-axis direction regardless of the drive by the main body drive system 7. In this embodiment, the first block 11 has an outer shape similar to the outer shape of the semiconductor chip to be picked up, its upper end surface 11b is parallel to the XY plane, and the support pins 13 are arranged at the four corners of the rectangular shape. I am going to do that. However, the outer shape may be changed according to the shape of the semiconductor chip, the upper end surface 11b may be inclined or uneven, and the number of support pins 13 may be increased or decreased, or the arrangement may be changed.

  The second block 15 extends in the axial direction coaxially with the central axis of the first block 11 and has a cylindrical shape having a columnar third block accommodation space 15a. The upper end surface of the second block 15 is parallel to the XY plane and acts as a second support surface 15b when pushing up the dicing tape. The second block 15 is inserted into the second block housing space 11 a of the first block 11 so as to be slidable in the axial direction with respect to the first block 11. Further, the cylindrical outer diameter of the second block 15 has a shape that ensures a predetermined airtightness with the first block 11 in the XY plane in a state of being accommodated in the second block accommodating space 11a. The second block 15 is connected to the second block drive system 21 so that the second block 15 can be driven in the Z-axis direction irrespective of the drive by the main body drive system 7 and the drive of the first block 11 in the Z-axis direction. It is connected. In this embodiment, the second block 15 has a columnar shape, and the third block accommodation space 15a has a cylindrical shape. However, these shapes are examples, and can be appropriately changed according to the shape of the semiconductor chip and the like as long as the relationship of the size of the support surface described later is satisfied. In this case, the shape and the size may be sufficient as long as the predetermined airtightness can be secured with the first block 11 as described above. Further, the arrangement of the second support surface 15b that is the upper end surface is not necessarily parallel to the XY plane.

  The third block 17 has a cylindrical shape extending coaxially with the above-described central axis in the axial direction. The upper end surface of the third block 17 is parallel to the XY plane and acts as a third support surface 17a when pushing up the dicing tape. The third block 17 is inserted into the third block accommodation space 15 a of the second block 15 so as to be slidable in the axial direction with respect to the second block 15. The cylindrical outer diameter of the third block 17 has a size that ensures a predetermined airtightness with the second block 15 in the XY plane in the state of being accommodated in the third block accommodating space 15a. The third block 17 is driven in the Z-axis direction regardless of the driving by the main body drive system 7, the driving of the first block 11 in the Z-axis direction, and the driving of the second block 15 in the Z-axis direction. It is connected to the third block drive system 23 so that it can be driven. In the present embodiment, the third block 17 has a cylindrical shape. However, the shape can be appropriately changed according to the shape of the semiconductor chip and the like as long as it satisfies the relationship of the size of the support surface described later. is there. In this case, the shape and the size may be sufficient as long as the predetermined airtightness can be secured with the second block 15 as described above. Further, the arrangement of the third support surface 17a that is the upper end surface is not necessarily parallel to the XY plane.

The first block 11, the support pin 13, the second block 15, and the third block 17 constitute the push-up unit 1 in a state where each is accommodated in the corresponding accommodating space. In the push-up unit 1, in the initial state, the first support surface 13a, the second support surface 15b, and the third support surface 17a are in the same plane as the suction holding surface 3b, in this embodiment, in the XY plane. To be arranged. Therefore, on the upper part of the upper end surface 11 b of the first block 11, there is a space that is defined inside and outside by the suction block 3 and the second block 15 and has a height corresponding to the height of the support pin 13. It is formed. The space acts as a suction space 11c, as will be described later, and opens on the surface of the suction block 3 defined by the first support surface 13a and the second support surface 15b or the third support surface 17a. The opening that acts as a suction opening 11d that opens above the suction space 11c in the XY plane described above. The suction space 11c is connected to an exhaust path 3e formed through the inside of the suction block 3 and connected to a second suction line 3f connected to the suction exhaust system 9 via an opening / closing valve 3g. . The main body drive system 7, the first block drive system 19, the second block drive system 21, the third block drive system 23, the suction exhaust system 9, the on-off valve 3g, and the like described above are controlled by a control (not shown). It is connected to the device and controlled systematically by the control device.
In this embodiment, the suction space 11c is exhausted by the suction exhaust system 9 to generate a suction force. Accordingly, it is possible to increase or decrease the suction force appropriately and at an appropriate elapsed time depending on the magnitude of the exhaust speed or the like. However, for simplification of the apparatus configuration, the suction exhaust type 9 can be deleted. For example, a space is formed in the upper part of the second block 15 by the lowering of the second block 15, but as described above, each block can ensure airtightness between the sliding surfaces. It has a simple structure. Accordingly, the lowering of the second block 15 causes the suction space to be enlarged by the space formed in the upper portion of the second block 15 to generate a suction force. By adjusting the size of the original suction space, the size of the suction space when it is enlarged, and the increasing speed of the suction space by controlling the lowering speed of the second block 15, there are time restrictions. On the other hand, it is also possible to obtain the same action as in the case of the suction exhaust system 9.

  Next, the operation of actually peeling and picking up the semiconductor chip from the dicing tape using these configurations will be described with reference to the drawings. 3A to 3D are diagrams showing each operation of the main configuration at the time of pickup according to time series. These drawings show only the main part in the same manner as in FIG. In practice, before reaching the pick-up operation shown in the figure, a tension is applied to the dicing tape 103 holding the plurality of semiconductor chips 101 after being cut and separated using a so-called wafer ring (not shown). In the operation of fixing this, the main body 5 is moved by the main body drive system 7 immediately below the semiconductor chip to be picked up (hereinafter, the semiconductor chip is described with reference numeral 101a for ease of explanation). The first support surface 13 a, the second support surface 15 b, the third support surface 17 a, and the suction holding surface 3 b in the initial state arranged in the same plane are operated as non-adhesive surfaces (hereinafter referred to as “adhesive surfaces”). , Referred to as the back surface of the dicing tape 103.) The main body drive system 7 moves the main body 5 to the position where it abuts (strictly, the position assumed to abut). Operation for driving the direction is performed.

  After reaching this state, the operations shown in FIG. 3A and thereafter are performed. To describe the state in more detail, the hollow portion 3a corresponds to the back surface of the area of the dicing tape 103 that serves as a gap between the area of the semiconductor chip 101a to be picked up and the surrounding semiconductor chip 101 group. It is arranged at the position to do. The first support surface 13a, the second support surface 15b, and the third support surface 17a are arranged such that the center of the semiconductor chip 101a and the center axis of the push-up unit 1 coincide with each other. It touches the back of the. At that time, the first support surface 13a, the second support surface 15b, and the third support surface 17a exist in the same plane parallel to the suction holding surface 3b and the XY plane. In this state, as shown in FIG. 3A, the suction exhaust system 9 is operated so that the back surface of the dicing tape 103 corresponding to the area where the semiconductor chip 101 disposed around the semiconductor chip 101a in the dicing tape 103 is adhesively held. The suction holding surface 3b holds the suction. In the figure, the suction openings 3c are arranged only at predetermined positions on the suction holding surface 3b. However, a plurality of suction openings 3c are arranged or concentric grooves are formed on the suction holding surface 3b. It is preferable that the dicing tape 103 can be securely held by arranging the suction opening 3c on the inner side.

  Next, as shown in FIG. 3B, the push-up unit 1 moves in the Z-axis direction by a predetermined amount. That is, the first block drive system 19, the second block drive system 21, and the third block drive system 23 each move the corresponding block by a predetermined amount in the Z-axis direction (upward in the figure). As a result, the dicing tape 103 with the semiconductor chip 101a adhered and held together with the semiconductor chip 101a by the first support surface 13a, the second support surface 15b, and the third support surface 17a of the push-up unit 1 A predetermined amount is moved to the adhesive holding surface side. By this operation, the dicing tape 103 on the back surface of the semiconductor chip 101a, more specifically, the portion other than the region supported by the first support surface 13a and the like on the tape is inclined by the suction block 3 that sucks and holds the periphery thereof. A tension is generated that is pulled downward to the outside of the chip. Here, as will be described later, the support pins 13 are formed by connecting the tangent lines of the first support surfaces 13a (see a rectangle surrounded by a chain line in FIG. 4A) and the outline of the rectangular semiconductor chip 101a. (Refer to a rectangle surrounded by a two-dot chain line in FIG. 4A).

  Here, each tangent of the first support surface 13a refers to an outer tangent obtained by connecting the adsorbing block 3 side that is disposed surrounding each of the adjacent first support surfaces 13a. Show. Due to the presence of the predetermined interval α, the outer peripheral portion of the adhesive region between the dicing tape 103 and the semiconductor chip 101a is peeled off due to the influence of the downward slanting force acting on the dicing tape 103 described above. However, in this state, each support surface, particularly the first support surface 13a, maintains a flat region having a certain size as an adhesive region. The predetermined interval α is set so that the stress does not exceed the bending strength of the semiconductor chip 101a even if the adhesive force of the dicing tape 103 applies a bending stress to the outer peripheral portion of the semiconductor chip 101a.

  In addition, the outer shape of the second support surface 15b (and the region including the third support surface 17a) is preferably set to a size in contact with the circumscribed line L of the first support surface 13a described above. As a result, the second support surface 15b suppresses deformation due to the downward stress applied to the semiconductor chip 101a via the dicing tape 103 by the second support surface 15b. Further, the first support surface 13a provides resistance to the stress against the end portion that cannot be supported by the second support surface 15b, for example, when the difference between the long side and the short side of the semiconductor chip 101 is large. In addition, it functions to suppress bending deformation at the end. As described above, in the operation shown in FIG. 3B, the central portion of the back surface of the chip is supported by the second support surface 15b having a sufficient width that does not cause bending deformation with respect to the main region of the semiconductor chip 101a at the time of pushing up. By supporting a chip end portion, which is largely subjected to bending stress and cannot be completely supported by the second support surface 15b, by the first support surface 13a, bending deformation may occur in the chip when the semiconductor chip 101a is pushed up. Is reduced. In addition, a predetermined interval α that promotes peeling of the outer peripheral portion of the chip is disposed between the outer tangent line of the first support surface 13a and the outer shape line of the semiconductor chip 101a so that peeling of the outer peripheral portion can be secured. With the above configuration, in this operation, it is possible to achieve both suppression of deformation such as bending in the semiconductor chip 101a and generation of a peeling trigger from the dicing tape at the end of the semiconductor chip 101a.

  After tape peeling at the end of the chip (initial peeling part that causes peeling) occurs, the opening / closing valve 3g is opened, and the suction space 11c is exhausted by the suction exhaust system 9. At this time, the suction space 11 c is closed by the inner peripheral wall of the suction block 3, the upper end surface 11 b of the first block 11, the outer peripheral surface of the second block 15, and the dicing tape 103. Accordingly, the inside of the suction space 11c is in a reduced pressure state, and a suction force is applied to the dicing tape 103 facing the space. Since the trigger of peeling has occurred in the previous operation, the peeling area expands the range of the adhesive area between the dicing tape 103 and the semiconductor chip 101a by this suction force. When the peeling range is expanded, a deformation load is also applied to the semiconductor chip 101a to which the dicing tape 103 adheres due to deformation. However, the presence of the first support surface 13a and the second support surface 15b (and further the third support surface 17a) prevents the semiconductor chip 101a from being deformed.

  Further, in the next stage, as shown in FIG. 3C, the second block drive system 21 is operated to lower the second block 15 in the Z-axis direction by a predetermined lowering amount. As a result, the semiconductor chip 101a is supported only by the first support surface 13a and the third support surface 17a via the dicing tape 103. Further, the dicing tape 103 held and supported between the semiconductor chip 101a and the second support surface 15b in the previous stage is peeled off from the back surface of the semiconductor chip 101a by the suction force exerted from the suction space 11c. The width of the third support surface 17a finally corresponds to the suction force of the suction collet 105, that is, the peeling force that can be exerted by the suction collet, as will be described later, and the deformation of the semiconductor chip 101a or the posture thereof. It is set to have a sufficient size that can prevent the change. The peeling force is set to be sufficiently small with respect to the strength in consideration of the strength of the semiconductor chip 101a. Therefore, the width of the adhesive region between the semiconductor chip 101a and the dicing tape 103 in the state shown in FIG. 3C is that the remaining portion is peeled off by the suction force of the suction collet 105 without applying an excessive load to the semiconductor chip 101a. It is possible to do it. Further, the back surface side is supported by the first support surface 13 a and the third support surface 17 a existing in the same plane, so that the semiconductor chip 101 a is pushed up in parallel with the suction surface 105 a of the suction collet 105. It is in the state.

  After the support state of the semiconductor chip 101a by only the first support surface 13a and the third support surface 17a is stabilized, the suction collet 105 is lowered as shown in FIG. 3D, and the semiconductor chip 101a is held by suction by the suction collet 105. Do it. Thereafter, by raising the suction collet 105, the final peeling of the semiconductor chip 101a from the dicing tape 103 and the pickup of the semiconductor chip 101a are performed. Note that a so-called suction collet 105 that actually picks up the semiconductor chip 101a by suction holding has a flat suction surface 105a that follows the upper surface of the semiconductor chip 101a (the surface opposite to the surface on which the adhesive is held). In addition, the suction collet 105 can be driven in the XY plane in synchronization with the main body 5 by a drive system (not shown). In the initial state, the suction collet 105 maintains a predetermined interval with respect to the semiconductor chip 101a. It stops above 101a. Further, the suction collet 105 can be moved in a direction perpendicular to the plane by a collet drive system (not shown).

In this embodiment, as shown in FIG. 3D, in the state where the semiconductor chip 101a is adhesively held on the dicing tape 103 and supported by the first support surface 13a and the third support surface 17a, the suction collet 105 is The semiconductor chip 101a is not directly in contact with the upper surface. That is, the suction force 105a is applied to the semiconductor chip 101a in a state where a minute gap is formed between the suction surface 105a and the upper surface of the semiconductor chip 101a, and complete separation from the dicing tape 103 is performed. As a result, it is possible to eliminate the generation of a load on the semiconductor chip 101a due to the clamping between the first support surface 13a and the third support surface 17a and the suction surface 105a.
Next, setting of the arrangement of the first support surface 13a will be described. FIG. 4A shows a state in which the portion of the push-up unit 1 that supports the dicing tape 103 from the back surface is viewed from the direction toward the support direction (upward). That is, FIG. 4A corresponds to a top view of the push-up unit 1 when the push-up unit 1 is in the state shown in FIG. 3B described above. FIG. 4B shows the positional relationship when the push-up unit 1, the dicing tape 103, and the semiconductor chip 101a are viewed from the side. In addition, the dashed-two dotted line in FIG. 4A has shown the external shape of the semiconductor chip 101a.

  The present inventor has secured the width p of the original peripheral part peeling area (initial peeling area) larger than 0.05 mm from the examination of the semiconductor chip 101 and the dicing tape 103 described in this embodiment for holding the semiconductor chip 101. By doing so, it has been found that peeling of the dicing tape using the suction force of the decompression space easily proceeds. It has also been confirmed that when the width p is 0.1 mm or more, the semiconductor chip 101 may be deformed such as bending. When the width p is set to 0.05 mm or less, it becomes difficult to form a separation region substantially due to the viscosity of the dicing tape 103 or the adhesive material attached to the dicing tape 103. Further, when the width p is 0.1 mm or more, the moment of the cantilever beam generated at the end of the chip is increased, and there is a possibility that a load exceeding the strength or rigidity of the semiconductor chip 101 is generated. Accordingly, sufficient initial peeling for preventing the occurrence of deformation and the like for the semiconductor chip 101 and promoting the subsequent peeling progress, that is, a condition for obtaining a peeling trigger is a range in which the assumed initial peeling amount is larger than 0.05 mm and smaller than 0.1 mm. It is preferable to set to. Further, the peeling area may change depending on the push-up amount of the push-up unit 1, and the numerical value is determined in consideration of this change. It is preferable that the peeling area is larger in consideration of the subsequent tape peeling process. However, since the deformation load on the semiconductor chip becomes too large at the start of peeling as the peeling range becomes larger, it is actually preferable to determine in consideration of the strength of the semiconductor chip and the adhesive strength of the large dicing tape.

  Further, the actual predetermined interval α described above can be obtained by adding the thickness t of the dicing tape to the width p of the peeling region. As in the present embodiment, when there are a plurality of first support surfaces 13a, the region defined by the tangent line of each adjacent first support surface is the maximum area, and the region is a semiconductor. Each of the support pins 13 is arranged so as to be arranged inward from the outline of the semiconductor chip by a value obtained by adding the width p of the predetermined peeling region and the tape thickness t described above to the outline of the chip 101a. It is preferable. A region defined by the circumscribing line in this case is indicated by an alternate long and short dash line L. The number of the support pins 13 can be increased according to the shape, strength, rigidity, etc. of the semiconductor chip, but in this case as well, the arrangement of the individual support pins is set based on the above-described conditions. It is preferable. In the above-described embodiment, each support surface is a flat surface. This is because the flat surface distributes the support load most evenly and does not create a load concentration area during support.

  The first support surface 13a of the support pin 13 and the second support surface 15b of the second block 15 are circular. In this way, by not providing corners in the plane, concentration of partial load is prevented when a diagonal downward tension is applied to the dicing tape 103. However, for example, depending on the shape of the semiconductor chip, a non-uniform support can be achieved in the semiconductor chip by adopting a shape of the support surface that follows the shape or a shape that allows partial contact instead of the surface. May be prevented. Moreover, the peripheral part of each support surface becomes a fulcrum, and there is a possibility that load concentration on the fulcrum occurs. Therefore, the corners may be eliminated by providing, for example, a taper or so-called R processing at the peripheral edge of each support surface.

Next, setting of the size of the third support surface 17a will be described. FIG. 5A shows a state in which the portion of the push-up unit 1 that supports the dicing tape 103 from the back surface is viewed from the direction toward the support direction (upward). That is, FIG. 5A corresponds to a top view of the push-up unit 1 when the push-up unit 1 is in the state shown in FIG. 3C described above. FIG. 5B shows the positional relationship when the push-up unit 1, the dicing tape 103, and the semiconductor chip 101a are viewed from the side. Here, the relationship between the area of the suction recess that generates the suction force in the suction collet 105 and the suction force obtained from the suction recess (synonymous with the peeling force obtained from the suction recess) is obtained. Moreover, the relationship between the contact area which hits the adhesion area | region of a semiconductor chip and a dicing tape and the peeling force required when peeling these from the said adhesion state is calculated | required. The results obtained in the actual experiment, that is, the area of the suction recess of the suction collet 105, the force required for peeling the dicing tape 103, and the first support surface 13a and the third support surface 17a FIG. 6 shows an example of a diagram for obtaining the area in contact with the adhesive surface. According to the figure, for example, when the area of the suction recess is 8 mm ² , the suction force generated from the suction collet at that time is about 80 g. Here, it can be seen that if the peel force is 80 g, the maximum adhesive area that can be peeled is about 18 mm ² . From the above, by setting the total area of the first support surface 13a and the third support surface 17a to 18 mm ² or less, the semiconductor chip is removed from the dicing tape at the final stage using the suction collet of the suction recess 8 mm ^2. It can be seen that peeling is possible.

  In the above-described embodiment, when forming the initial peeling portion that causes the peeling, the four corners are supported by the first support surface 13a so as to be inscribed in the initial peeling portion, and the central portion is supported by the second support surface 15b and It is supported by the third support surface 17a, and in this state, the pushing-up operation of the dicing tape by the pushing-up unit 1 is performed. Further, by adopting a mode in which tension is applied to the dicing tape 103 and peeling is adopted, it is possible to concentrate the peeling load on the edge of the adhesive region and to efficiently generate the peeling start. Therefore, unlike the configuration in which the adhesive region edge is sucked as a surface by the space on the back surface as in the configuration disclosed in Patent Document 2, it is possible to generate an effective and quick peeling trigger, unlike a mode in which the action of the peeling load is low. Become. Further, at this time, the position of the support surface is defined so that the diagonally downward tension actually applied to the dicing tape 103 and the like is minimized. Therefore, in the process in which the largest load may be applied to the semiconductor chip, the load is minimized. Further, in this embodiment, after the formation of the initial peeling portion that causes the peeling, the space existing on the back surface of the dicing tape 103 is decompressed so that a suction force is applied to the dicing tape 103 from the space. In peeling of a tape or the like, when there is no trigger for peeling, the largest suction force or the like is usually required to cause the original peeling. In this embodiment, since the separation trigger already exists, it is possible to expand the separation even if the suction force obtained from the suction space 11c is not so large. Accordingly, it is possible to reduce the load applied to the semiconductor chip 101a via the dicing tape 103 during suction and peeling.

  Further, for example, when a push-up unit having a push-up area that decreases stepwise from the outer periphery when performing a push-up operation as in the configuration disclosed in Patent Document 3, the edge portion of the push-up surface is always used. Load concentration occurs. The load concentration is considered to have a high probability of adverse effects such as breakage on an extremely thin semiconductor chip. Further, when the dicing tape is peeled off, the peeling load provided for the tape peeling works most in the direction of the tension acting on the tape, so that the load concentration described above is considered to be relatively easy to occur. However, in the case of the present embodiment, a load load at the time of pushing up is basically generated only in a small region of the outer peripheral portion. Also, when expanding the peeling range, while supporting the four corners and the center of the semiconductor chip, which is most likely to be deformed, and sucking with the back surface of the tape as the surface, Concentration of peeling load is prevented. Therefore, by adjusting the degree of decompression of the suction space 11c by the suction exhaust system 9, it is possible to almost eliminate the possibility that the semiconductor chip will be damaged even when the peeling portion is enlarged.

  Further, in this embodiment, the semiconductor chip 101a is held by suction collet 105 after the semiconductor chip 101a is supported by the minimum support area by the first support surface 13a and the third support surface 17a. It is said. Thereby, it is possible to suppress the region and the holding time between the suction collet 105 and the push-up unit 1, and to suppress the load such as stress on the semiconductor chip 101a due to the sandwiching of these members. In addition, when the normal support area is reduced, particularly when a downward slanting tension acts on the periphery of the dicing tape 103 as in the present embodiment, the semiconductor chip 101a is in a so-called tilted state due to the tension unbalance or the like. For example, the holding state of the semiconductor chip 101a may be deteriorated. In this embodiment, the first support surface 13a is arranged corresponding to the four corners of the semiconductor chip 101a, and the first support surface 13a and the third support surface 17a are in the same plane. This prevents the posture from deteriorating. Therefore, even if the suction holding by the suction collet 105 is performed after the peeling of the dicing tape in a region different from the support portion is performed, the semiconductor chip 101a can be sucked and held in a state in which a suitable posture is maintained. . Further, as described above, since the posture of the semiconductor chip 101a is stabilized in the present invention, the semiconductor chip 101a is peeled from the dicing tape 103 without the semiconductor chip 101a being held between the suction collet 105 and the push-up unit 1. In addition, the semiconductor chip 101a can be sucked and held by the suction collet 105.

  In the above-described embodiment, the push-up unit 1 pushes up the semiconductor chip 101a and performs an operation of exhausting the inside of the suction space 11c after the second block 15 is lowered. In the case of the operation method, it is possible to move to an enlargement operation of the next peeled portion after it is confirmed that the peeled portion has been completely obtained. For this reason, it becomes possible to perform stable peeling operation. However, depending on the adhesive strength of the dicing tape or the like, there may be a case where a good peeling trigger cannot be obtained only by the initial pushing operation by the pushing unit 1. In the case of such conditions, for example, it is preferable to perform the decompression operation of the suction space 11c at a stage before the push-up operation by the push-up unit 1. According to this method, not only the diagonally downward peeling force due to the tension applied to the dicing tape at the time of pushing up, but also the peeling force on the back surface of the dicing tape that is the direction facing the main direction of action of the adhesive force. Can also be made to act. Therefore, when obtaining a trigger for peeling, a larger peeling force can be applied to the peripheral edge of the adhesive region.

  The effect of the second block 15, that is, the second support surface 15b in the present invention will be described here. FIGS. 7A and 7B are the same as FIGS. 3A to 3D, and schematically show the main configuration by removing the suction block 3, the suction collet 105, and the surrounding semiconductor chip 101 for ease of explanation. In particular, the case where the second block 15 does not exist is shown. FIG. 7C schematically shows bending stress acting on the semiconductor chip 101a in the configuration. When the second block 15 does not exist, that is, when the second support surface 15b does not exist, the protrusion of the dicing tape 103 is caused by the first support surface 13a and the third support surface 17a when initially forming the peeling portion. The raising operation is performed (see FIG. 7A). In this state, when the suction space 11c is evacuated and a suction force is generated in the suction space 11c, an area existing between the third support surface 17a and the first support surface 13a (at a distance S1 in FIG. 7C). The suction force acts on the entire area. When peeling of the dicing tape 103 between the third support surface 17a and the first support surface 13a does not occur or when peeling has not progressed so far, the suction force acting on this region is adhered to the dicing tape 103. It acts as a bending stress on the semiconductor chip 101a. The bending stress is integrated as a bending stress F1 that finally deforms the semiconductor chip 101a to the dicing tape 103 side in a substantially intermediate region between the third support surface 17a and the first support surface 13a. When this deformation stress F1 (see FIG. 7C) is large, the semiconductor chip 101a may break as shown in FIG. 7B, while a large separation area of the dicing tape 103 from the semiconductor chip 101a can be obtained.

  In contrast, as in the first embodiment described above, the second block 15, that is, the second support surface 15 b is schematically shown in the same manner as in FIG. 7A when the second support surface 15 b is present. This will be described with reference to FIGS. 8A to 8C. FIG. 8D schematically shows the bending stress acting on the semiconductor chip in the same manner as FIG. 7C. In this embodiment, as described above, the dicing tape 103 is pushed up by the first support surface 13a, the second support surface 15b, and the third support surface 17a (see FIG. 8A). In this state, when the suction space 11c is evacuated and a suction force is generated in the suction space 11c, an area existing between the second support surface 15b and the first support surface 13a (at a distance S2 in FIG. 8D). The suction force acts on the entire area. When peeling of the dicing tape 103 between the second support surface 15b and the first support surface 13a does not occur or when the peeling has not progressed so far, the suction force acting on this region is adhered to the dicing tape 103. It acts as a bending stress on the semiconductor chip 101a. The bending stress is finally integrated as a deformation stress F2 (see FIG. 8D) that deforms the semiconductor chip 101a to the dicing tape 103 side in a substantially intermediate region between the second support surface 15b and the first support surface 13a. The

  Here, the bending stress with respect to the semiconductor chip 101a corresponding to the integrated value of the attractive force acting per unit area is proportional to the distance between the regions (S1 and S2) supported by the first support surface 13a and the like. To do. Therefore, as shown in FIG. 8D, the magnitude of the bending stress F2 acting on the semiconductor chip 101a according to the value of S2 set to be sufficiently smaller than S1 is sufficiently larger than the strength of the semiconductor chip 101a. It becomes easy to make it a small value. At this stage, as shown in FIG. 8B, the state is maintained until the separation sufficiently progresses to the region defined by the distance S2. Thereafter, the amount of peeling is further increased by lowering the second block 15 (see FIG. 8C). In this manner, the dicing tape 103 is peeled off by the suction force from the suction space 11c in a state where the size of the opening 11d of the suction space 11c is narrowed by the second support surface 15b, and then the opening 11d is enlarged. By enlarging the amount of peeling of the dicing tape 103 in the manner of doing, it becomes possible to suppress the bending stress locally applied to the semiconductor chip 101a.

  For example, even in the form shown in FIG. 7A and the like, for example, the degree of decompression of the suction space 11c is gradually increased so that the suction force acting from the suction space 11c gradually increases as the amount of separation increases. Thus, the semiconductor chip 101a can be prevented from being broken. However, in this method, it is considered that it takes too much time for the dicing tape 101 to be peeled off in the region defined by the distance S1, and the productivity is lowered. Further, since the progress of peeling of the dicing tape 103 is not constant, there is also a problem of how to recognize an appropriate peeling state. By interposing the state where the dicing tape 103 is supported by the second support surface 15b as in the present invention, an effect of shortening the time required for peeling the dicing tape 103 as a whole can be obtained. Further, when the second support surface 15b exists, it is possible to apply a large suction force locally as compared with the case shown in FIG. 7A and the like. In this case, even if the suction force is increased, it is only necessary to keep the bending stress F2 finally applied to the semiconductor chip 101a smaller than F1 by setting the value of S2 to an appropriate value, for example.

  In the first embodiment described above, the size of the second support surface 15b in the second block 15 and the positional relationship between the second support surface 15b and the first support surface 13a are shown in FIG. 4A. The style shown in However, the aspect of the second support surface 15b in this embodiment is not limited to the illustration. An example of the second support surface 15b that can be specifically implemented will be described below. 9A, 9B, and 9C show examples when the support surface is viewed from above in the same manner as in FIG. 4A. In the example shown in FIG. 4A, a mode in which the circular second support surface 15b is accommodated in the region indicated by the alternate long and short dash line L obtained by connecting the outlines of the first support surface 13a is shown. In the case of the said style, there exists an advantage that the width | variety of an initial peeling part can be prescribed to some extent not only by the 1st support surface 13a but the 2nd support surface 15b. However, as shown in FIG. 9A, the second support surface 15b may be made larger and protrude from the region indicated by the alternate long and short dash line L. By setting it as the said style, the area | region where a suction | attraction force acts initially from the suction space 11c is narrowed, and the effect that progress of an initial peeling part can be aimed at more safely is acquired.

  Further, as shown in FIG. 9B or 9C, the shape of the second support surface 15b may be rectangular. Further, in this case, as shown in FIG. 9B, the both ends in the longitudinal direction of the second support surface 15b are made to coincide with the both ends in the longitudinal direction of the semiconductor chip 101a, respectively, and the initial peeling portion is made to be the longitudinal direction of the semiconductor chip 101a. It is good also as making it generate | occur | produce so that it may extend only to. In this case, it is more preferable that both sides extending in the longitudinal direction of the second support surface 15b are made to coincide with the one-dot chain line L. Thereby, it becomes possible to obtain an initial peeling part more reliably and correctly. Alternatively, as shown in FIG. 9C, the both ends in the short direction of the second support surface 15b are made to coincide with the both ends in the short direction of the semiconductor chip 101a, respectively, and the initial peeling portion is formed in the short direction of the semiconductor chip 101a. It is good also as making it generate | occur | produce so that it may extend only to. Further, in this case, it is more preferable that both sides extending in the short direction of the second support surface 15b coincide with the alternate long and short dash line L. In the example shown in FIG. 9B or 9C, the first support surface 13a is disposed inside the second support surface 15b so as to be in contact with the outline of the second support surface 15b. In this invention, even if it is such a form, the 1st support surface 13a shall be included in the state arrange | positioned on the outer side of the 2nd support surface 15b. That is, even if another support surface is included in the region of the one support surface, the other support surface is in contact with the outer region of the one support surface, in particular, the outline of the one support surface. If it is disposed, the other support surface is defined to be disposed outside the one support surface, or the one support surface is defined to be disposed more centrally with respect to the other support surface.

As described above, in this embodiment, the suction collet 105 and the third support surface 17a and the like do not sandwich the semiconductor chip 101a, that is, the peeling of the dicing tape 103 from the semiconductor chip 101a by the push-up unit 1 is completed. After that, the suction collet 195 stops at a position away from the semiconductor chip 101a by a predetermined distance, and complete peeling of the semiconductor chip 101a from the dicing tape 103 and holding of the semiconductor chip 101a are performed from the position. . FIG. 5 is a relationship diagram for obtaining a stop position of the suction collet 105 for realizing the style, and the size of the contact area between the dicing tape 103 and the semiconductor chip 101a, the peeling force required in that case, and the suction collet 105 FIG. 10 shows the relationship between the area of the suction recess (the area of the region that actually exhibits the suction force) and the peeling force (suction force) obtained from the suction recess. In addition, regarding the relationship between the area of the suction recess and the peeling force in the figure, from the top in the figure, the distance between the suction surface 105a and the surface of the semiconductor chip 101a is 0 mm, 0.01 mm, 0.02 mm, In the case of, the relationship diagrams obtained for 0.04 mm and 0.05 mm are respectively shown. According to the figure, for example, when an adsorption collet 105 having an adsorption recess area of 8 mm ² is used and the distance between the adsorption surface 105a and the surface of the semiconductor chip 101a is 0.02 mm, the peel force obtained is about 50 g. When the contact area between the semiconductor chip 101a and the dicing tape 103 when the peeling force is 50 g is further obtained from the drawing, it can be seen that the contact area is about 11 mm ² . From the above relationship, even when the distance between the suction surface 105a and the semiconductor chip 101a is 0.02 mm, the total area in which the first support surface 13a and the third support surface 17a support the dicing tape 103 is calculated. It can be seen that the semiconductor chip 101a can be easily and reliably peeled from the dicing tape 103 by setting the thickness to 11 mm or less.

  In the present invention, by inputting these data to the control device, the dicing of the semiconductor chip 101a can be performed without holding the semiconductor chip 101a between the push-up unit 1 and the suction collet 105 in the actual semiconductor chip peeling process. Peeling from the tape 103 is possible. That is, in the present invention, the control device is a suction system that exhausts the suction space constituted by the suction block, the push-up unit, and the dicing tape and applies a suction force to the dicing tape from the non-adhesive surface side. The exhaust system 9 and the suction position of the suction collet when the suction collet peels and holds the electronic component from the dicing tape, and the state of the push-up unit when the electronic component is peeled off by the suction collet Yes.

(Second embodiment)
Next, a second embodiment of the present invention will be described with reference to the drawings. In addition, about the said form, it shall show in a figure using the same referential mark about the structure same as 1st embodiment, and suppose that the description about the detail is abbreviate | omitted here. FIG. 11A is a view corresponding to FIG. 1A in the first embodiment and schematically showing only the upper part of the main body 5. FIG. 11B is a diagram corresponding to FIG. 1B in the first embodiment. In this embodiment, unlike the first embodiment, the support pin 13 is not present, and the end face (upper end face) on the side where the axial suction collet 105 is arranged in the first block 11 is the fourth support face 11e. Acts as In this case, the upper end surface of the fourth support surface 11e exists in a plane parallel to the second support surface 15b and the like, and is defined by the outline L obtained from the circumscribed line of the support pin 13 in the first embodiment. The surface shape is the same. Thereby, the initial peeling region between the dicing tape 103 and the semiconductor chip 101a obtained by pushing up the dicing tape 103 by the fourth support surface 11e, the second support surface 15b, and the third support surface 17a is: First, it coincides with the initial peeling region assumed in the embodiment. Further, since the outer shape of the first block 11 is smaller than the outer shape of the first block 11 in the first embodiment, all the hollow portions 3a in the first embodiment are closed by the first block 11. The hollow portion 3a remains around the first block 11 without being removed.

  Further, in the case of this embodiment, for example, when the second block 15 is lowered by a predetermined lowering amount in the Z-axis direction, a suction space corresponding to the lowering amount of the second block 15 is formed. When the suction force generated from the suction space is generated promptly and stably, or when the suction space is exhausted to increase the suction force, it is necessary to secure an exhaust path communicating with the suction space. . In this embodiment, the upper support surface concave groove 11 f is arranged on the fourth support surface 11 e on the first block 11. The concave groove 11f on the support surface communicates from the hollow portion 3a to the second block accommodating space 11a and constitutes a ventilation path between these spaces. By providing the concave groove 11f on the support surface, a suction space formed by the lowering of the second block 15 (hereinafter referred to as a second block suction space 15c to be distinguished from the suction space 11c, see FIG. 12C). On the other hand, it is possible to perform an exhaust operation using the suction system exhaust system 9 and the exhaust path 3e. In the present embodiment, the concave groove 11f on the support surface provided on the fourth support surface 11e is illustrated as the ventilation path. However, the ventilation path is not the surface of the fourth support surface 11e but the first block. It is good also as providing in 11 inside.

  Next, the procedure of the peeling operation of the semiconductor chip 101a using the push-up unit 1 according to the present embodiment will be described. In this description, a diagram schematically showing a state during a specific operation during the peeling operation (pickup operation) of the semiconductor chip 101a in the second embodiment in the same manner as in FIGS. 3A to 3D in the first embodiment. 12A to 12D are used. Before the actual pick-up operation, the dicing tape 103 is sucked and held by the sucking block 3, and the second surface is attached to the back surface which is the non-stick surface of the area where the dicing tape 103 sticks and holds the semiconductor chip 101a to be picked up. The step of bringing the support surface 15b and the third support surface 17a into contact with each other is performed, and the state shown in FIG. 12A is obtained. Since the process until the state is obtained is basically the same as that in the first embodiment, detailed description thereof is omitted. Here, as shown in FIG. 12B, the push-up unit 1 moves in the Z-axis direction by a predetermined amount. The operation of the drive system associated with each block is basically the same as in the first embodiment. However, in the case of the present embodiment, the first block 11 exists at a position where it is first lowered from the other blocks, so that only the first block drive system 19 (see FIG. 1) for the first block 11 is the other drive system. Do different actions. That is, after the fourth support surface 11e is in the same plane as the second support surface 15b and the third support surface 17a, a predetermined amount of pushing operation of the dicing tape 103 is maintained while maintaining the state. I do. By this operation, the dicing tape 103 on the back surface of the semiconductor chip 101a, more specifically, a portion other than the region supported by the fourth support surface 11e and the like on the tape is inclined by the suction block 3 that sucks and holds the periphery thereof. A tension is generated that is pulled downward to the outside of the chip. As a result, an initial peeling region is obtained at the outer peripheral portion of the back surface region of the dicing tape 103 with which the fourth support surface 11e abuts (see FIG. 12B).

  After an initial peeling portion is generated at the end of the chip, the opening / closing valve 3g is opened, and exhaust in the remaining space in the hollow portion 3a is performed by the suction exhaust system 9 (see FIG. 1). At this point, the second block 15 is lowered as shown in FIG. 12C. As a result, a suction space 15c on the second block is formed that can apply a suction force to the area of the back surface of the dicing tape 103 supported by the second support surface 15b. The suction space 11c on the second block is composed of a surface facing the second block 15 in the first block 11 (an inner peripheral surface of the first block 11), a second support surface 15b, The third block 17 is a closed space from the surface facing the second block (the outer peripheral surface of the third block 17) and the dicing tape 103. In addition, the substantially closed space is decompressed by an increase in volume or by exhausting air through a ventilation path exemplified by the concave groove 11f on the support surface, and suction force is applied to the dicing tape 103 in contact with the space. Act. When the inside and the outside of the fourth support surface 11e having an annular shape are completely divided, there is almost no influence on the peeling of the dicing tape 103 generated by the suction force described above by the initially peeled area. However, the ventilation path is formed as a concave groove on the fourth support surface 11e as in the present embodiment, or the outline of the second support surface 15b and the outline of the first support surface coincide with each other. In the case where they are arranged so as to have an interval smaller than the distance α described in the embodiment, the initial peeling region is expanded to the region where the second support surface 15b is in contact with the surface due to the influence of the suction force (see FIG. 12C). .

  After the support state of the semiconductor chip 101a only by the fourth support surface 11e and the third support surface 17a is stabilized, the suction collet 105 is lowered as shown in FIG. 12D, and the suction holding of the semiconductor chip 101a by the suction collet 105 is performed. Do it. Thereafter, by raising the suction collet 105, the final peeling of the semiconductor chip 101a from the dicing tape 103 and the pickup of the semiconductor chip 101a are performed. Also in this embodiment, as shown in FIG. 12D, in the state where the semiconductor chip 101a is adhesively held by the dicing tape 103 and supported by the fourth support surface 11e and the third support surface 17a, the suction collet 105 is used. Does not directly contact the upper surface of the semiconductor chip 101a. In this case, the stop position of the suction collet 105, the suction force exhibited by the suction collet 105, and the total area value when the fourth support surface 11e and the third support surface 17a are added are the various relationships described above. It follows the conditions determined by the diagram. Further, the size of the second support surface 15b is also in accordance with the conditions obtained from the various relationship diagrams described above.

Even when the upper end surface of the first block 11 is used as the support surface of the dicing tape 103 instead of the support pins 13 as in the present embodiment, the initial separation region is formed and the central portion and the outer periphery of the semiconductor chip 101 are formed. The effect of the present invention can be obtained by satisfying the condition that a predetermined peeling amount is obtained by causing the dicing tape 103 that adheres to these intermediate areas to leave the support of the part and advance the peeling area from the initial peeling area. It is done. In this case, it goes without saying that the initial peeling amount and the area of the intermediate region described here are defined by the above-described diagram. For this embodiment, unlike unlike in the case of the first embodiment, operation of correctly match those of the upper end surface of the plurality of support pins is not present not required, in building tossing unit It is easier than in the case of the first embodiment. However, the first support surface 13a or the fourth support surface 11e basically supports a plurality of points on the outer peripheral portion of the chip or a position close thereto with a small area as much as possible, from the viewpoint of suppressing deformation of the entire semiconductor chip. Is preferable. Moreover, it is preferable that the first support surface 13a or the fourth support surface 11e is divided from the viewpoint of facilitating the formation of the suction space and extending and expanding the separation region from the initial separation region. From the above viewpoint, in the present invention, the form using the support pin 13 is the most preferred embodiment. By using the push-up unit described above, it becomes possible to peel and hold a relatively large-sized semiconductor chip that is easily broken and thin from the dicing tape at high speed.
As described above, in the first and second embodiments described above, basically, the first support surface 13a (or the fourth support surface 11e), the second support surface 15b, and the third support surface 13a. The push-up operation of the semiconductor chip 101a is started in a state where the support surface 17a exists in the same plane, and after the initial peeling portion is obtained, the second support surface 15b is lowered to open the back surface of the dicing tape 103. The suction space having the suction opening to be expanded is formed (formed), and the corresponding area of the dicing tape 103 is subjected to suction peeling. However, as long as the operation of each of the support surfaces satisfies the pushing-up of the dicing tape 103 in a specific range by the pushing-up unit 1 and the suction peeling of the dicing tape 103 by the lowering of the second supporting surface 15b, the suction space is previously set. It is also possible to change the arrangement of the respective support surfaces so as to constitute.

1: Push-up unit, 3: Adsorption block, 5: Main unit, 7: Main unit drive system, 9: Exhaust system for suction, 11: First block, 13: Support pin, 15: Second block, 17 : Third block, 19: first block drive system, 21: second block drive system, 23: third block drive system, 100: pickup device, 101: semiconductor chip, 103: dicing tape, 105: suction collet

Claims (13)

A plurality of electronic component groups arranged and arranged on an adhesive surface of a dicing tape, a predetermined electronic component is peeled from the dicing tape and picked up by an electronic component to be picked up,
A suction collet that sucks and conveys the electronic component from a dicing tape;
The dicing tape is disposed at a position corresponding to the electronic component to be picked up on the non-adhesive surface side of the dicing tape, and is movable independently along an axis perpendicular to the surface on which the dicing tape extends. A third support surface disposed substantially parallel to the surface on a central axis that is the axis passing through the center of the electronic component, a second support surface disposed outside the third support surface, and A first support surface disposed on the outside of the second support surface according to the outer shape of the electronic component; and
A non-adhesive surface side region corresponding to a region where the electronic component group other than the electronic component in the dicing tape is adhesively held, which is disposed outside the first support surface with respect to the central axis, can be sucked and held. An adsorption holding surface,
Arrangement of the first support surface, the second support surface, and the third support surface, or at least one of the first, second, and third support surfaces from a state existing in the same surface Using a configuration that forms a suction space that opens toward the non-adhesive surface of the dicing tape and generates a suction force on the non-adhesive surface by movement of any of the support surfaces in the axial direction,
The suction holding surface, the first support surface, the second support surface, and the third support surface are brought into contact with the non-adhesive surface of the dicing tape in a state where they are arranged in the same plane. One process,
The first holding surface, the second supporting surface, and the contact portion of the third supporting surface with the dicing tape are simultaneously moved by a predetermined amount in the axial direction, thereby attracting and holding the dicing tape. A second step of moving the area other than the area held by suction to the adhesive holding surface side together with the electronic component,
A third step of separating the second support surface from the non-adhesive surface of the dicing tape;
A fourth step of adsorbing the electronic component by the adsorption collet and separating the electronic component from the dicing tape by separating the adsorption collet from the dicing tape;
And a fifth step of setting the suction space to a negative pressure at an arbitrary timing in the course of performing the first step to the fourth step.   The total area of the first support surface and the third support surface is the area of the suction recess of the suction collet, the force required for peeling the dicing tape, and the first step in the third step. 2. The method of picking up an electronic component according to claim 1, wherein the support surface and the third support surface are defined based on a diagram for obtaining an area where the support surface is in contact with the non-adhesive surface of the dicing tape.   When the first support surface is composed of a plurality of regions, the outline of the region when the area defined by the circumscribed line of the first support surface is the maximum area is more than the outline of the electronic component The electronic component obtained from the second step and the dicing tape are arranged inward by a value obtained by adding a width of a peeling area where the dicing tape is initially peeled and a thickness of the dicing tape. The electronic component pickup method according to claim 1 or 2.   The external line of the first support surface is wider than the external line of the electronic component, and the width of the peeling region where the electronic component and the dicing tape are initially peeled and the thickness of the dicing tape are obtained. The electronic component pickup method according to claim 1, wherein the electronic component is arranged inward by a value obtained by adding to   When the suction collet stops at the suction position, the first support surface and the third support surface support the electronic component via the dicing tape, and the suction collet is separated from the surface of the electronic component. 5. The electronic component pickup method according to claim 1, wherein the suction position is set at a position separated by a predetermined interval. 6. An electronic component pick-up device that peels off the predetermined electronic component from a plurality of electronic component groups arranged in alignment with the adhesive surface of the dicing tape, and picks up from the dicing tape,
A suction collet that sucks and conveys the electronic component from a dicing tape;
On the non-adhesive surface side of the dicing tape, a push-up unit disposed at a position corresponding to the electronic component to be picked up,
In a region having an accommodating space for the push-up unit, the push-up unit is disposed at a position corresponding to the electronic component, and the electronic component group disposed around the electronic component in the dicing tape is adhesively held. A suction block having a suction holding surface for sucking and holding the corresponding non-adhesive surface side region;
A suction space that includes the suction block, the push-up unit, and the dicing tape and has a suction opening that opens toward the non-adhesive surface;
A suction exhaust system for exhausting the suction space, wherein a suction force is applied to the dicing tape from the non-adhesive surface side from the suction space;
Control for controlling the suction position of the suction collet when the suction collet peels and holds the electronic component from the dicing tape, and the state of the push-up unit when the electronic component is peeled by the suction collet An apparatus,
The push-up unit is independently movable along an axis perpendicular to a surface extending to the dicing tape, and the surface is on a central axis that is the axis passing through the center of the electronic component. A third support surface disposed substantially parallel to the second support surface, a second support surface disposed outside the third support surface, and further on the outside of the second support surface according to the outer shape of the electronic component A first support surface disposed;
A first block, a second block, and a third block having each of the first support surface, the second support surface, and the third support surface;
A plurality of drive systems arranged to correspond to each of the first block, the second block, and the third block, and independently moving each of the blocks ;
The electronic component pickup apparatus according to claim 1, wherein the first support surface, the second support surface, and the third support surface change the size of the suction opening portion according to the arrangement of the first support surface, the second support surface, and the third support surface.   The pickup device according to claim 6, wherein the first support surface is formed by a plurality of support pins erected on the first block.   A value obtained by adding the width of the peeling region and the thickness of the dicing tape to the maximum area defined by the circumscribing line of the first support surface by the plurality of support pins, rather than the outline of the electronic component The pickup device according to claim 7, wherein the pickup device is disposed only inward. The outer shape of the contact surface that contacts the dicing tape on the first support surface is arranged inward by a value obtained by adding the width of the predetermined peeling region and the thickness of the dicing tape, rather than the outer shape of the electronic component. And
7. The pickup device according to claim 6, wherein the width of the predetermined peeling area is a size that does not cause bending deformation to the electronic component during the push-up operation.   When the suction collet stops at the suction position, the first support surface and the third support surface support the electronic component via the dicing tape, and the suction collet is separated from the surface of the electronic component. The pickup apparatus according to claim 6, wherein the suction position is set at a position that is separated by a predetermined interval. The said 1st block, said 2nd block, and said 3rd block have airtightness between mutual sliding surfaces, The Claim 6 thru | or 10 characterized by the above-mentioned. Pickup device. The control device stops the suction collet at a position away from the electronic component by a predetermined distance when controlling the state of the push-up unit for peeling the electronic component. The pickup device according to any one of the above. 13. The pickup device according to claim 6, wherein an outer shape of the second support surface has a region that matches or protrudes with respect to a circumscribed line of the first support surface.

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