WO2010052759A1 - Chip peeling method, chip peeling apparatus and semiconductor device manufacturing method - Google Patents

Chip peeling method, chip peeling apparatus and semiconductor device manufacturing method Download PDF

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Publication number
WO2010052759A1
WO2010052759A1 PCT/JP2008/070057 JP2008070057W WO2010052759A1 WO 2010052759 A1 WO2010052759 A1 WO 2010052759A1 JP 2008070057 W JP2008070057 W JP 2008070057W WO 2010052759 A1 WO2010052759 A1 WO 2010052759A1
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WO
WIPO (PCT)
Prior art keywords
chip
movable stage
peeling
protruding
adhesive sheet
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Application number
PCT/JP2008/070057
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French (fr)
Japanese (ja)
Inventor
顕 中津
Original Assignee
キヤノンマシナリー株式会社
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Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Priority to KR1020117003603A priority Critical patent/KR101062708B1/en
Priority to PCT/JP2008/070057 priority patent/WO2010052759A1/en
Priority to JP2010536597A priority patent/JP4668361B2/en
Priority to TW098137459A priority patent/TWI452614B/en
Publication of WO2010052759A1 publication Critical patent/WO2010052759A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to a chip peeling method, a chip peeling apparatus, and a semiconductor device manufacturing method.
  • a diced semiconductor chip hereinafter simply referred to as a chip
  • a conventional chip peeling apparatus there is one provided with a stage for holding an adhesive sheet, a push-up stand that advances and retreats with respect to this stage, and a needle that is pushed up by this push-up stand. That is, it is configured such that the needle is pushed up by the push-up stand and the adhesive sheet of the stage is pushed from the back side so that the chip is detached from the adhesive sheet.
  • the pressure sensitive adhesive tape may be broken.
  • the back surface of the chip may be damaged.
  • the length of each needle is different due to abrasion or breakage, and the tip is tilted and pushed up, and adjacent tips may collide and be damaged.
  • the chip is adsorbed by a collet and taken out.
  • a tip suction error due to the collet occurs. If a collet chip suction error occurs, it will hinder subsequent operations. Further, the tip may be damaged by the needle being pushed up.
  • the chip peeling apparatus includes a stage 3 that holds an adhesive sheet 2 to which a chip 1 is attached. Further, the stage 3 is provided with a movable stage portion 4 whose upper surface 4a protrudes from the stage upper surface 3a. That is, a recess 5 is provided in the stage 3, and the movable stage portion 4 is fitted in the recess 5. In this case, there is a step of S0 between the upper surface 4a of the movable stage portion 4 and the upper surface 3a of the stage 3.
  • the upper surface 4a of the movable stage unit 4 is positioned higher than the upper surface 3a of the stage 3 by S0 in the vertical direction. Further, the first side 1 a of the chip 1 protrudes beyond the end face 9 of the movable stage portion 4. Therefore, a gap 6 is formed between the movable stage portion 4 and the adhesive sheet 2 on the outer peripheral side. Further, as shown in FIG. 6, the stage 3 is provided with a suction hole 8 communicating with the gap 6.
  • the pressure-sensitive adhesive sheet 2 is sucked downward through the suction holes 8 in a state where the chip 1 is sucked (held) by a collet (adsorption collet) (not shown) from above.
  • a collet adsorption collet
  • the air in the gap 6 is sucked, the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is sucked, and the pressure-sensitive adhesive sheet 2 is peeled off at the protruding portion of the chip 1 as indicated by a virtual line as shown in FIG. 6A.
  • the chip peeling device When the chip peeling device is used, in the initial stage of peeling, it is necessary to peel off the adhesive sheet 2 at a part of the peripheral edge of the chip 1 (in the case shown in FIG. 5, the protruding portion of the chip 1). Since the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is strongly stuck due to stress during dicing, a larger stress than other portions is required for peeling. For this reason, the upper surface 4a of the movable stage portion 4 is projected from the stage upper surface 3a by S0. Thereby, the stress which peels the adhesive sheet 2 becomes large, and the adhesive sheet 2 of the protrusion part of the chip
  • the chip When the pressure-sensitive adhesive sheet 2 is peeled off, the chip is bent greatly due to a large stress that can peel off a part of the peripheral portion (protruding portion), that is, a high step, and a sliding operation is performed in a state in which the step is maintained.
  • a large peeling force is required in the case of peeling a part of the peripheral edge (the protruding portion) at the initial peeling stage.
  • a large peeling force in the initial peeling stage is not required. That is, the peeling strength is not uniform on the back surface of the chip at the peeling stage.
  • the present invention can peel a part of the peripheral edge of the chip (extrusion part) with a large peeling force in the initial stage of peeling, and can reduce cracks in the sliding stress during sliding.
  • the present invention provides a chip peeling method, a chip peeling apparatus, and a semiconductor device manufacturing method capable of easily peeling and taking out a chip to be peeled.
  • the chip peeling method of the present invention is a chip peeling method in which the chip is peeled off from an adhesive sheet having a chip attached to the upper surface.
  • the chip to be peeled is placed on a stage having a fixed stage portion and a movable stage portion.
  • the protruding portion of the tip is pushed up by the convex portion through the adhesive sheet in the protruding state after being installed so that at least a part of the peripheral edge portion of the tip protrudes from the movable stage portion.
  • a space is formed below the protruding portion, and then the movable stage portion is driven after a negative pressure is applied to the space below the protruding portion.
  • the protruding part of the chip can be pushed up by the convex part through the adhesive sheet. And a big peeling force can be provided by making a negative pressure act on the space
  • the upper surface of the movable stage portion can be raised from the upper surface of the fixed stage portion.
  • the movable stage part can be slid horizontally in the direction opposite to the protruding side.
  • the raised surface of the convex portion is the same as the upper surface of the movable stage portion or lower than the upper surface of the movable stage portion. can do.
  • the semiconductor device manufacturing method of the present invention manufactures a semiconductor device using a chip peeling method.
  • the chip peeling apparatus of the present invention is a chip peeling apparatus for peeling the chip from an adhesive sheet having a chip attached on the upper surface, a stage having a fixed stage part and a movable stage part, and a chip to be peeled off. And at least a part of the peripheral edge of the tip protrudes from the movable stage portion, the protruding portion of the tip is pushed up through the adhesive sheet, and a gap is formed below the protruding portion. And a negative pressure supply means for applying a negative pressure to the gap via a negative pressure passage, and a slide means for sliding the movable stage portion in the horizontal direction on the side opposite to the protruding side. It is.
  • the convex part can be constituted by a pin member or a plate member. That is, even if it is a pin member or a plate-like member, the chip can be pushed up.
  • the movable stage can be slidable, and can be raised and lowered and slidable.
  • a void for negative pressure action can be secured, and the protruding part of the chip can be stably peeled off. Further, at the time of sliding, it is possible to prevent the other adjacent chips from being bent and further prevent the adjacent adjacent chips from cracking.
  • the convex portion may be a pin member or a plate-like member, can be formed with a simple configuration, can reduce costs, and has a stable push-up function. Further, if the movable stage unit can be moved up and down, an optimum low step (step between the upper surface of the fixed stage unit and the upper surface of the movable stage unit) can be obtained when the movable stage unit is slid. As a result, the bending applied to other adjacent chips can be reduced, and it is possible to reliably prevent a large force from being applied to the other adjacent chips. For this reason, the crack of the other chip
  • the protruding surface of the convex part is the same as the upper surface of the movable stage part or lower than the upper surface of the movable stage part, so that the convex part is affected.
  • the movable stage portion can be driven by sliding or the like, and a smooth peeling operation can be performed.
  • FIG. 2 is a simplified cross-sectional view showing a chip peeling method using the chip peeling apparatus of the present invention and before a protruding portion is pushed up. It is a simplified sectional view showing a chip peeling method using the chip peeling apparatus of the present invention, and showing a protruding state of a protruding portion.
  • FIG. 2 is a simplified cross-sectional view showing a chip peeling method using the chip peeling apparatus of the present invention, in a sliding state of a movable stage portion. It is a simplified top view of the said chip peeling apparatus. It is a simplified top view which shows the chip
  • Chip 12 Adhesive sheet 16 Stage 16a Movable stage portion 16b Fixed stage portion 19 Gap 30 Negative pressure passage 31 Overhang portion 50 Convex portions 51, 53 Plate member 52 Push-up surface 55 Pin member
  • the chip peeling device is a device that sequentially peels and takes out a plurality of rectangular thin-walled chips (semiconductor chips) 11 attached on the pressure-sensitive adhesive sheet 12 from the pressure-sensitive adhesive sheet 12. That is, it is used for a semiconductor device manufacturing apparatus for manufacturing a semiconductor chip 11 as a semiconductor device.
  • the chip 11 is a final product by using the wafer 10 (see FIG. 3) as a material and cutting the material into a rectangular shape. For this reason, the chip 11 includes a square or a strip. That is, as shown in FIG. 3, the wafer 10 is circular as a whole, and is divided into individual chips 11 by dicing, and the chips 11 are attached to the adhesive sheet 12. A frame 13 made of a ring body is attached to the outer peripheral side of the adhesive sheet 12. That is, the frame 13 and the adhesive sheet 12 are integrated. And the chip
  • the chip peeling apparatus includes a holding means 15 that holds the chip 11 to be peeled from above, and a stage 16 on which the adhesive sheet 12 is placed.
  • the stage 16 includes a fixed stage portion 16b and a slidable movable stage portion 16a. That is, the recess 22 is provided in the upper surface 37 of the fixed stage portion 16b, and the movable stage portion 16a, which is a rectangular flat plate body, is disposed in the recess 22.
  • the upper surface 34 of the movable stage portion 16a is higher than the upper surface 37 of the fixed stage portion 16b. That is, a step S is provided between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b.
  • the width dimension W of the movable stage portion 16a is set smaller than the length (width dimension) W1 of one side of the chip 11 which is a square.
  • one tip surface 17a of the movable stage portion 16a corresponds to the first side 23a of the chip 11 to be peeled off, and the first side 23a of the chip 11 protrudes beyond the tip surface 17a of the movable stage portion 16a.
  • a negative pressure passage 30 for introducing a negative pressure to the interface with the adhesive sheet 12 is provided in the stage 16.
  • the negative pressure passage 30 is provided with suction ports 30 a and 30 b that open on the first side 23 a side of the chip 11.
  • each suction port 30a, 30b corresponds to the protruding portion 31 of the chip 11, as can be seen in plan view.
  • a vacuum pump (not shown) is connected to the negative pressure passage 30. That is, by driving the vacuum pump, air can be sucked from the suction ports 30 a and 30 b of the negative pressure passage 30.
  • the negative pressure passage 30 and the vacuum pump can constitute negative pressure supply means (air suction means).
  • the holding means 15 is constituted by a suction member (collet) 21 having a head 20 for sucking the chip 11.
  • the head 20 is provided with a suction hole in its lower end surface 20 a, and the chip 11 is vacuumed through the suction hole, and the chip 11 is sucked into the lower end surface 20 a of the head 20. For this reason, if this vacuum suction (evacuation) is released, the chip 11 is detached from the head 20.
  • the movable stage portion 16a moves along the horizontal direction while the tip end surface 17a of the movable stage portion 16a is parallel to the first side 23a of the chip 11 via a drive mechanism (not shown).
  • a drive mechanism (not shown).
  • various mechanisms such as a reciprocating mechanism and a cylinder mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member can be used.
  • a convex portion 50 made of a plate-like member 51 is provided in the recess 22 of the fixed stage portion 16b corresponding to the protruding portion 31 of the chip 11. That is, as shown in FIG. 2, the convex portion 50 has a long side 51a of its upper end surface (push-up surface) set to be substantially the same as the length dimension of the distal end surface 17a of the movable stage portion 16a, and its short side. 51 b is set to be smaller than the width dimension of the protruding portion 31. And this convex-shaped part 50 is arrange
  • a vertical movement mechanism (not shown) is connected to the convex portion 50, and the convex portion 50 moves up and down independently of the movable stage portion 16a.
  • various mechanisms such as a reciprocation mechanism and a cylinder mechanism which consist of a bolt shaft member and a nut member screwed together, can be used.
  • the gap 19 is formed in the lower portion of the protruding portion 31 of the chip 11, but the protruding portion 31 of the chip 11 is shown in FIG. 1B through the adhesive sheet 12 by raising the convex portion 50. Can be pushed up. By this push-up, the step between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b becomes large.
  • the height position of the protruding surface (tip surface) 52 of the convex portion 50 is matched with the height position of the upper surface 34 of the movable stage portion 16a.
  • the protruding portion 50 can be raised and the protruding portion 31 of the chip 11 can be pushed up through the adhesive sheet 12. That is, the level difference between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b is increased.
  • the gap 19 communicates with the suction ports 30a and 30b as described above. Therefore, by driving the suction means (negative pressure supply means), the air in the gap 19 is sucked through the suction ports 30a and 30b to apply negative pressure. As a result, the protruding portion 31 of the chip 11 is sucked, and the adhesive sheet 12 is peeled from the protruding portion 31 of the chip 11 as indicated by the phantom line shown in FIG. 1B.
  • the convex portion 50 is lowered.
  • the height position of the raised surface 52 of the convex portion 50 is set lower than the height position of the upper surface 34 of the movable stage portion 16a.
  • the movable stage portion 16a is slid through the drive mechanism in the direction of arrow B which is the direction opposite to the protruding side.
  • the receiving area of the chip 1 by the movable stage portion 16a is sequentially reduced, and the area of adsorption (suction) downward of the adhesive sheet 12 is increased.
  • the adhesive sheet 12 is sequentially peeled from the chip 11. For this reason, when the front end surface 17a of the movable stage portion 16a is detached from the first side 23a of the chip 11, the adhesive sheet 12 can be completely peeled from the chip 1 to be peeled.
  • a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices.
  • it may be in a wafer state on which a circuit is formed, an individual semiconductor chip cut out from the wafer, a wafer divided into a plurality of pieces, or a package in the wafer state. Even if it is, what was packaged in the wafer state may be divided into a plurality of parts, or what was packaged in the wafer state may be cut out to form individual semiconductor elements.
  • the protruding portion 31 of the chip 11 can be pushed up by the convex portion 50 via the adhesive sheet 12. And a big peeling force can be provided by making a negative pressure act on the space
  • the protruding surface 52 of the convex portion 50 can be made lower than the upper surface 34 of the movable stage portion 16a, and therefore the convex portion 50 is affected.
  • the movable stage portion 16a can be driven by sliding or the like, and a smooth peeling operation can be performed.
  • FIG. 4 shows a modified example of the convex portion 50.
  • the convex portion 50 includes a substantially U-shaped plate member 53 in a plan view. That is, the plate-like member 53 includes a flat plate-like main body portion 53a arranged in parallel with the distal end surface 17a of the movable stage portion 16a, and end piece portions 54b, 54b bent at right angles from the end portions of the flat plate-like main body portion 53a. It consists of. End piece portions 54b and 54b are disposed along the side surface of the distal end surface 17a of the movable stage portion 16a.
  • the push-up surface 52 has a U shape in plan view.
  • the chip 11 can be pushed up stably, a large peeling force can be exerted in the initial peeling stage, and the peeling work can be stabilized. it can.
  • the convex portion 50 is composed of a pin member 55.
  • three are arranged at a predetermined pitch along the distal end surface 17a of the movable stage portion 16a.
  • Each pin member 55 is movable up and down. For this reason, the protrusion part 31 of the chip
  • the movable stage unit 16a only slides. However, the movable stage unit 16a may slide up and down (elevate).
  • the driving means in this case includes an elevating mechanism part (elevating means) for elevating and lowering the movable stage part 16a, and a slide mechanism part (sliding means) for sliding the movable stage part 16a.
  • the elevating mechanism unit has, for example, a push-up pin, and moves the push-up pin up and down via a reciprocating mechanism.
  • the slide mechanism section includes a reciprocating mechanism that slides the elevating mechanism section in a substantially horizontal direction.
  • various known and publicly available mechanisms such as a reciprocating mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member, a cylinder mechanism, and a linear actuator can be used. .
  • the movable stage portion 16a can be moved up and down, the amount of step difference between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b can be variously changed. That is, the movable stage portion can be raised once and lowered to the original position, or the movable stage portion 16a can be raised once and lowered to an intermediate height position higher than the original position.
  • the movable stage portion 16a and the fixed stage portion 16b can have a high step or a low step. For this reason, at the initial stage of peeling, if the step between the movable stage portion 16a and the fixed stage portion 16b is increased, a large peeling force is applied to the adhesive sheet 12 even if the rising amount of the convex portion 50 is reduced. be able to. For this reason, generation
  • the step between the movable stage portion 16a and the fixed stage portion 16b is reduced, it is effective to apply dynamic twisting stress to other adjacent chips 11 when the movable stage portion 16a slides. Therefore, it is possible to reduce the bending applied to other adjacent chips 11.
  • the suction port 30a provided in the stage 16 has a size and a number of The shape and the like can be arbitrarily set within the air suckable range of the gap 19. For this reason, the suction port 30a may be one.
  • the chip 11 to be peeled is not limited to a square, but may be a rectangle having a short side and a long side, or may be a strip having a very long long side compared to the short side. .
  • the thickness of the pressure-sensitive adhesive sheet 12 is different depending on the suction force or the like, it can be curved and deformed so that it can be peeled off from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). I just need it.
  • the thickness of the movable stage portion 16a can be arbitrarily set according to the range that can be peeled from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). Further, the angle of the corner of the movable stage portion 16a is not limited to 90 degrees, and may be somewhat acute or obtuse.
  • the number of chips 11 stuck on the pressure-sensitive adhesive sheet 12 is also arbitrary, and in the present invention, all the chips 11 on the pressure-sensitive adhesive sheet 12 can be sequentially peeled without being affected by the number. .
  • the area of the protruding portion 31 of the chip 11 can be variously set within a range in which a peeling force acts on the adhesive sheet 12 when a negative pressure is applied.
  • the long side 51a is set to be substantially the same as the length of the movable stage portion 16a as shown in FIG. May be longer or shorter than the length of the movable stage portion 16a.
  • the thickness dimension of the plate-like member 51 may be anything as long as it can be disposed below the protruding portion 31.
  • a plurality of plate-like members 51 may be provided.
  • the pin member 55 may be a cylindrical body having a circular cross section, an elliptical or elliptical cross section, a triangular, quadrangular, pentagonal, or more rectangular prism having a cross section. Also good. Moreover, a cylinder may be sufficient.
  • the area of the push-up surface 52 of the pin member 55 can be variously changed within a range in which the protruding portion 31 can be pushed up.
  • the height position of the push-up surface 52 of the convex portion 50 may be matched with the height position of the upper surface 34 of the movable stage portion 16a. Even in such a case, the slide of the movable stage portion 16a is not adversely affected.
  • the amount of protrusion of the protruding portion 31 of the chip 11 can be arbitrarily set within a range in which the adhesive sheet 12 can be peeled by the action of negative pressure at the initial stage of peeling depending on the size, thickness, material, etc. of the chip 11. .
  • ⁇ A plurality of rectangular thin-walled chips (semiconductor chips) attached on the adhesive sheet can be used in a pickup device that sequentially separates and picks up from the adhesive sheet.
  • a chip is made into a material, and this material is cut into a rectangular shape to become a final product. For this reason, there are square and strip-shaped chips.

Abstract

Provided is a chip peeling method wherein a part of the periphery of a chip can be peeled by a large peeling force in an initial peeling stage, and a chip to be peeled can be easily peeled and taken out when the chip is slid. A chip peeling apparatus and a semiconductor device manufacturing method are also provided. A stage (16) is arranged directly below an adhesive sheet (12) having a chip (11) adhered on the upper surface. The stage (16) is provided with a fixed stage section (16b) and a movable stage section (16a). In a state where the chip (11) is supported by the movable stage section (16a), a part of the periphery of the chip (11) is protruded from the movable stage section (16a). In such protruded state, the protruding section of the chip (11) is thrust up by a protruding section (50) through the adhesive sheet (12), then, negative pressure is permitted to operate to a gap (19) below a protruding section (31) to drive the movable stage section (16a).

Description

チップ剥離方法、チップ剥離装置、及び半導体装置製造方法Chip peeling method, chip peeling apparatus, and semiconductor device manufacturing method
　本発明は、チップ剥離方法、チップ剥離装置、及び半導体装置製造方法に関するものである。 The present invention relates to a chip peeling method, a chip peeling apparatus, and a semiconductor device manufacturing method.
　半導体装置の製造工程において、ダイシングされた半導体チップ（以下、単にチップという。）を粘着シートからピックアップする必要がある。従来のチップ剥離装置として、粘着シートを保持するステージと、このステージに対して進退する突き上げ台と、この突き上げ台によって突き上げられるニードルとを備えたものがある。すなわち、突き上げ台によって突き上げられたニードルによりステージの粘着シートを裏面側から突いて、チップを粘着シートから離脱させるように構成されている。 In the manufacturing process of a semiconductor device, it is necessary to pick up a diced semiconductor chip (hereinafter simply referred to as a chip) from an adhesive sheet. As a conventional chip peeling apparatus, there is one provided with a stage for holding an adhesive sheet, a push-up stand that advances and retreats with respect to this stage, and a needle that is pushed up by this push-up stand. That is, it is configured such that the needle is pushed up by the push-up stand and the adhesive sheet of the stage is pushed from the back side so that the chip is detached from the adhesive sheet.
　しかしながら、ニードルを使用するチップ剥離装置では、ニードルがチップを突き上げて粘着シートから剥離する際に、粘着テープを突き破る場合があり、このような場合にはチップ裏面を傷付けるおそれがある。また、磨滅や破損によって各ニードルの長さが相違することになって、チップが傾いて突き上げられる状態になり、隣合うチップ同士が衝突して傷付け合うおそれがある。 However, in a chip peeling apparatus using a needle, when the needle pushes up the chip and peels from the pressure sensitive adhesive sheet, the pressure sensitive adhesive tape may be broken. In such a case, the back surface of the chip may be damaged. Further, the length of each needle is different due to abrasion or breakage, and the tip is tilted and pushed up, and adjacent tips may collide and be damaged.
　さらに、チップはコレットにて吸着されて取り出される。しかしながら、チップが傾いて突き上げられれば、コレットによるチップの吸着ミスが発生する。コレットのチップ吸着ミスが発生すると、その後の作業に支障を来たすことになる。また、ニードルの突き上げによって、チップが損傷する場合もあった。 Furthermore, the chip is adsorbed by a collet and taken out. However, if the tip is tilted and pushed up, a tip suction error due to the collet occurs. If a collet chip suction error occurs, it will hinder subsequent operations. Further, the tip may be damaged by the needle being pushed up.
　そこで、近年このようなニードルを使用しないチップ剥離装置（特許文献１）が提案されている。このチップ剥離装置は、図５と図６に示すように、チップ１が貼り付けられている粘着シート２を保持するステージ３を備える。また、ステージ３には、その上面４ａがステージ上面３ａより突出する可動ステージ部４が付設される。すなわち、ステージ３に凹所５を設け、この凹所５に可動ステージ部４を嵌合させている。この場合、可動ステージ部４の上面４ａと、ステージ３の上面３ａとでＳ０の段差ができる。すなわち、可動ステージ部４の上面４ａは、ステージ３の上面３ａよりも鉛直方向にＳ０だけ上位に位置する。また、可動ステージ部４の端面９よりもチップ１の第１辺１ａをはみ出させている。このため、可動ステージ部４の外周側には、粘着シート２との間に空隙６が形成される。さらに、図６に示すように、ステージ３には、前記空隙６に連通される吸引孔８が設けられている。 Therefore, in recent years, a chip peeling device (Patent Document 1) that does not use such a needle has been proposed. As shown in FIGS. 5 and 6, the chip peeling apparatus includes a stage 3 that holds an adhesive sheet 2 to which a chip 1 is attached. Further, the stage 3 is provided with a movable stage portion 4 whose upper surface 4a protrudes from the stage upper surface 3a. That is, a recess 5 is provided in the stage 3, and the movable stage portion 4 is fitted in the recess 5. In this case, there is a step of S0 between the upper surface 4a of the movable stage portion 4 and the upper surface 3a of the stage 3. That is, the upper surface 4a of the movable stage unit 4 is positioned higher than the upper surface 3a of the stage 3 by S0 in the vertical direction. Further, the first side 1 a of the chip 1 protrudes beyond the end face 9 of the movable stage portion 4. Therefore, a gap 6 is formed between the movable stage portion 4 and the adhesive sheet 2 on the outer peripheral side. Further, as shown in FIG. 6, the stage 3 is provided with a suction hole 8 communicating with the gap 6.
　次に、前記チップ剥離装置を使用したチップ剥離方法を説明する。まず、上方から図示省略のコレット（吸着コレット）にてチップ１を吸着（保持）した状態で、吸引孔８を介して粘着シート２を下方に吸引する。これによって、空隙６のエアが吸引され、チップ１のはみ出し部の粘着シート２が吸引され、図６Ａに示すような仮想線で示すように、チップ１のはみ出し部において粘着シート２が剥離する。 Next, a chip peeling method using the chip peeling apparatus will be described. First, the pressure-sensitive adhesive sheet 2 is sucked downward through the suction holes 8 in a state where the chip 1 is sucked (held) by a collet (adsorption collet) (not shown) from above. As a result, the air in the gap 6 is sucked, the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is sucked, and the pressure-sensitive adhesive sheet 2 is peeled off at the protruding portion of the chip 1 as indicated by a virtual line as shown in FIG. 6A.
　前記チップ剥離装置を使用した場合、剥離の初期段階においては、チップ１の周縁部の一部（図５に示す場合、チップ１のはみ出し部）の粘着シート２を剥がす必要がある。このチップ１のはみ出し部の粘着シート２は、ダイシング時の応力により貼り付きが強いため、剥離するためには他の箇所よりも大きな応力が必要となる。このため、可動ステージ部４の上面４ａを、ステージ上面３ａからＳ０だけ突出させている。これによって、粘着シート２を剥離する応力が大きくなって、チップ１のはみ出し部の粘着シート２を剥離することができる。 When the chip peeling device is used, in the initial stage of peeling, it is necessary to peel off the adhesive sheet 2 at a part of the peripheral edge of the chip 1 (in the case shown in FIG. 5, the protruding portion of the chip 1). Since the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is strongly stuck due to stress during dicing, a larger stress than other portions is required for peeling. For this reason, the upper surface 4a of the movable stage portion 4 is projected from the stage upper surface 3a by S0. Thereby, the stress which peels the adhesive sheet 2 becomes large, and the adhesive sheet 2 of the protrusion part of the chip | tip 1 can be peeled.
　その後、図５Ｂに示すように、可動ステージ部４を矢印の方向へ移動させる。これによって、可動ステージ部４にて受けられているチップ１の受け面積が減少していって、粘着シート２の吸着（吸引）面積が増加して、最終的にこのチップ１から粘着シート２を完全に剥離させることができる。
特許第３２０９７３６号明細書 Thereafter, as shown in FIG. 5B, the movable stage unit 4 is moved in the direction of the arrow. As a result, the receiving area of the chip 1 received by the movable stage portion 4 is reduced, the adsorption (suction) area of the adhesive sheet 2 is increased, and finally the adhesive sheet 2 is removed from the chip 1. Can be completely peeled off.
Japanese Patent No. 3209736
　粘着シート２を剥離する際には、周縁部の一部（はみ出し部）が剥離できる大きな応力、すなわち高い段差によりチップに大きな曲げが与えられ、この段差を維持した状態でスライド動作が行われる。このように、剥離初期段階において周縁部一部（はみ出し部）を剥離する場合には、大きな剥離力が必要となる。しかしながら、周縁部の一部が剥離された後、可動ステージ部４をスライドさせて他の部位を剥離させて際には、剥離初期段階における大きな剥離力を必要としない。すなわち、剥離強度は剥離段階でチップの裏面で一様ではない。 When the pressure-sensitive adhesive sheet 2 is peeled off, the chip is bent greatly due to a large stress that can peel off a part of the peripheral portion (protruding portion), that is, a high step, and a sliding operation is performed in a state in which the step is maintained. As described above, in the case of peeling a part of the peripheral edge (the protruding portion) at the initial peeling stage, a large peeling force is required. However, when a part of the peripheral edge is peeled off and then the movable stage part 4 is slid to peel off other parts, a large peeling force in the initial peeling stage is not required. That is, the peeling strength is not uniform on the back surface of the chip at the peeling stage.
　したがって、初期段階の剥離を重点おいて、可動ステージ部４の上面４ａと、ステージ上面３ａとの段差を大きくすれば、可動ステージ部４をスライドさせて他の部位を剥離させる際には、高い段差のままスライド動作を加えることになる。このため、隣設する他のチップ１に動的に捻るような応力を与えてしまう。このような応力が付与されると、隣設する他のチップ１は大きく曲げられて割れるおそれがある。 Therefore, if the step between the upper surface 4a of the movable stage portion 4 and the stage upper surface 3a is increased with emphasis on the separation at the initial stage, it is high when the movable stage portion 4 is slid to separate other portions. The slide operation will be added with the step. For this reason, stress which dynamically twists is given to other chips 1 provided adjacently. When such a stress is applied, another adjacent chip 1 may be greatly bent and cracked.
　また、逆に、スライド動作時に重点をおいて、可動ステージ部４の上面４ａと、ステージ上面３ａとの段差を小さく設定すれば、初期段階の剥離において必要な大きな剥離力を発生させることができない。 Conversely, if the step between the upper surface 4a of the movable stage portion 4 and the stage upper surface 3a is set small with an emphasis at the time of the sliding operation, it is not possible to generate a large peeling force necessary for the peeling at the initial stage. .
　本発明は、上記課題に鑑みて、剥離の初期段階においては、大きな剥離力でチップの周縁部の一部（はみ出し部）を剥離することができ、スライド時には、スライド応力における割れを軽減できて、剥離すべきチップを容易に剥離して取り出すことが可能なチップ剥離方法、チップ剥離装置、および半導体装置製造方法を提供する。 In view of the above problems, the present invention can peel a part of the peripheral edge of the chip (extrusion part) with a large peeling force in the initial stage of peeling, and can reduce cracks in the sliding stress during sliding. The present invention provides a chip peeling method, a chip peeling apparatus, and a semiconductor device manufacturing method capable of easily peeling and taking out a chip to be peeled.
　本発明のチップ剥離方法は、上面にチップを貼り付けた粘着シートから前記チップを剥離させるチップ剥離方法において、固定ステージ部と可動ステージ部とを備えたステージ上に、剥離すべきチップを可動ステージ部に対応させかつこのチップの周縁部の少なくとも一部が可動ステージ部からはみ出すように設置した後、前記はみ出し状態で前記チップのはみ出し部分を前記粘着シートを介して前記凸状部で突き上げて、はみ出し部の下方に空隙を形成し、次に、はみ出し部の下部の空隙に負圧を作用させてから前記可動ステージ部を駆動するようにしたものである。 The chip peeling method of the present invention is a chip peeling method in which the chip is peeled off from an adhesive sheet having a chip attached to the upper surface. The chip to be peeled is placed on a stage having a fixed stage portion and a movable stage portion. And the protruding portion of the tip is pushed up by the convex portion through the adhesive sheet in the protruding state after being installed so that at least a part of the peripheral edge portion of the tip protrudes from the movable stage portion. A space is formed below the protruding portion, and then the movable stage portion is driven after a negative pressure is applied to the space below the protruding portion.
　本発明のチップ剥離方法によれば、チップのはみ出し部分を前記粘着シートを介して凸状部で突き上げることができる。そして、この突き上げ状態で、はみ出し部の下方の空隙に負圧を作用させることによって、大きな剥離力を付与することができる。このため、チップのはみ出し部において、粘着シートが吸引されて粘着シートがチップから剥離する。その後、可動ステージ部を、駆動することによって、可動ステージ部によるチップの受け面積が減少し、粘着シートの吸着（吸引）面積が増加して剥離範囲が広がって、最終的には、この剥離すべきチップから粘着シートを完全に剥離させることができる。すなわち、剥離初期段階では、粘着シートに対して大きな剥離力を作用させることができ、また、可動ステージ部のスライド時には、隣設する他のチップに動的な捻るような応力が付与されるのを防止して、隣設する他のチップに与えられる曲げを小さくすることができる。 According to the chip peeling method of the present invention, the protruding part of the chip can be pushed up by the convex part through the adhesive sheet. And a big peeling force can be provided by making a negative pressure act on the space | gap under a protrusion part in this pushing-up state. For this reason, in the protrusion part of a chip | tip, an adhesive sheet is attracted | sucked and an adhesive sheet peels from a chip | tip. After that, by driving the movable stage unit, the receiving area of the chip by the movable stage unit is reduced, the adsorption (suction) area of the adhesive sheet is increased, and the peeling range is expanded. The pressure-sensitive adhesive sheet can be completely peeled off from the chip to be cut. That is, in the initial peeling stage, a large peeling force can be applied to the adhesive sheet, and when the movable stage portion slides, a stress that dynamically twists is applied to other adjacent chips. Therefore, it is possible to reduce the bending applied to other adjacent chips.
　前記前記凸状部の突き上げ面を固定ステージ部の上面よりも高位としてはみ出し部の下方に空隙を設けることができる。 It is possible to provide a gap below the protruding portion by setting the protruding surface of the convex portion higher than the upper surface of the fixed stage portion.
　チップのはみ出し状態において、可動ステージ部の上面を固定ステージ部の上面から隆起させることができる。 In the protruding state of the chip, the upper surface of the movable stage portion can be raised from the upper surface of the fixed stage portion.
　前記可動ステージ部を、はみ出し側とは反対方向に水平方向にスライドさせることができる。 The movable stage part can be slid horizontally in the direction opposite to the protruding side.
　前記凸状部の突き上げ面を可動ステージ部の上面よりも高く突き上げた後、可動ステージ部の駆動時には前記凸状部の突き上げ面を可動ステージ部の上面と同一乃至可動ステージ部の上面よりも低くすることができる。 After raising the raised surface of the convex portion higher than the upper surface of the movable stage portion, when the movable stage portion is driven, the raised surface of the convex portion is the same as the upper surface of the movable stage portion or lower than the upper surface of the movable stage portion. can do.
　本発明の半導体装置製造方法は、チップ剥離方法を用いて半導体装置を製造するものである。 The semiconductor device manufacturing method of the present invention manufactures a semiconductor device using a chip peeling method.
　本発明のチップ剥離装置は、上面にチップを貼り付けた粘着シートから前記チップを剥離させるチップ剥離装置において、固定ステージ部と可動ステージ部とを備えたステージと、剥離すべきチップを可動ステージ部に対応させかつこのチップの周縁部の少なくとも一部が可動ステージ部からはみ出すようにした状態で、このチップのはみ出し部分を前記粘着シートを介して突き上げて、このはみ出し部の下方に空隙を形成する凸状部と、前記空隙に負圧通路を介して負圧を作用させる負圧供給手段と、前記はみ出し側とは反対側に前記可動ステージ部を水平方向にスライドさせるスライド手段とを備えたものである。 The chip peeling apparatus of the present invention is a chip peeling apparatus for peeling the chip from an adhesive sheet having a chip attached on the upper surface, a stage having a fixed stage part and a movable stage part, and a chip to be peeled off. And at least a part of the peripheral edge of the tip protrudes from the movable stage portion, the protruding portion of the tip is pushed up through the adhesive sheet, and a gap is formed below the protruding portion. And a negative pressure supply means for applying a negative pressure to the gap via a negative pressure passage, and a slide means for sliding the movable stage portion in the horizontal direction on the side opposite to the protruding side. It is.
　前記凸状部をピン部材又は板状部材で構成することができる。すなわち、ピン部材であっても、板状部材であってもチップを突き上げることができる。可動ステージ部をスライド自在としたり、昇降自在かつスライド自在としたりできる。 The convex part can be constituted by a pin member or a plate member. That is, even if it is a pin member or a plate-like member, the chip can be pushed up. The movable stage can be slidable, and can be raised and lowered and slidable.
　本発明では、吸着前（負圧作用前）において、負圧作用用の空隙を確保することができ、チップのはみ出し部の剥離を安定して行うことができる。また、スライド時においては、隣設する他のチップに曲げが付与されるのを防止して、隣設する他のチップの割れを一層防止することができる。 In the present invention, before adsorption (before negative pressure action), a void for negative pressure action can be secured, and the protruding part of the chip can be stably peeled off. Further, at the time of sliding, it is possible to prevent the other adjacent chips from being bent and further prevent the adjacent adjacent chips from cracking.
　凸状部は、ピン部材であっても、板状部材であってもよく、簡素な構成で形成でき、低コスト化を図ることができ、しかも、突き上げ機能も安定する。また、可動ステージ部が昇降可能であれば、可動ステージ部をスライドさせる際には最適な低い段差（固定ステージ部の上面と可動ステージ部の上面との段差）とすることができる。これによって、隣設する他のチップに与えられる曲げを小さくすることができ、隣設する他のチップに大きな力がかかるのを確実に防止することができる。このため、スライド時の応力における隣設する他のチップの割れを軽減できて、剥離すべきチップを容易に剥離して取り出すことができる。 The convex portion may be a pin member or a plate-like member, can be formed with a simple configuration, can reduce costs, and has a stable push-up function. Further, if the movable stage unit can be moved up and down, an optimum low step (step between the upper surface of the fixed stage unit and the upper surface of the movable stage unit) can be obtained when the movable stage unit is slid. As a result, the bending applied to other adjacent chips can be reduced, and it is possible to reliably prevent a large force from being applied to the other adjacent chips. For this reason, the crack of the other chip | tip adjacently installed in the stress at the time of a slide can be reduced, and the chip | tip which should be peeled can be peeled easily and taken out.
　前記凸状部の突き上げ面を可動ステージ部の上面よりも高く突き上げることによって、はみ出し部の下部の空隙を大きくとることができ、剥離初期段階において大きな剥離力を発揮させることができ、剥離作業の安定化を図ることができる。また、可動ステージ部を駆動（スライド）させる際には、凸状部の突き上げ面を可動ステージ部の上面と同一乃至可動ステージ部の上面よりも低くすることによって、凸状部に影響を受けることなく、可動ステージ部をスライド等の駆動が可能となり、なめらかな剥離作業が可能となる。 By pushing up the raised surface of the convex part higher than the upper surface of the movable stage part, it is possible to make a large gap below the protruding part, and to exert a large peeling force at the initial stage of peeling. Stabilization can be achieved. In addition, when driving (sliding) the movable stage unit, the protruding surface of the convex part is the same as the upper surface of the movable stage part or lower than the upper surface of the movable stage part, so that the convex part is affected. In addition, the movable stage portion can be driven by sliding or the like, and a smooth peeling operation can be performed.
本発明のチップ剥離装置を用いたチップ剥離方法を示し、凸状部の突き上げ前の簡略断面図である。FIG. 2 is a simplified cross-sectional view showing a chip peeling method using the chip peeling apparatus of the present invention and before a protruding portion is pushed up. 本発明のチップ剥離装置を用いたチップ剥離方法を示し、凸状部の突き上げ状態の簡略断面図である。It is a simplified sectional view showing a chip peeling method using the chip peeling apparatus of the present invention, and showing a protruding state of a protruding portion. 本発明のチップ剥離装置を用いたチップ剥離方法を示し、可動ステージ部のスライド状態の簡略断面図である。FIG. 2 is a simplified cross-sectional view showing a chip peeling method using the chip peeling apparatus of the present invention, in a sliding state of a movable stage portion. 前記チップ剥離装置の簡略平面図である。It is a simplified top view of the said chip peeling apparatus. 粘着シートに貼り付けたチップを示す簡略平面図である。It is a simplified top view which shows the chip | tip stuck on the adhesive sheet. 凸状部の第１変形例を示す簡略平面図である。It is a simplified top view which shows the 1st modification of a convex-shaped part. 凸状部の第２変形例を示す簡略平面図である。It is a simplified top view which shows the 2nd modification of a convex part. 従来のチップ剥離装置を用いたチップ剥離方法を示し、可動ステージ部のスライド前の簡略断面図である。It is the simplified cross-sectional view before the slide of a movable stage part which shows the chip | tip peeling method using the conventional chip | tip peeling apparatus. 従来のチップ剥離装置を用いたチップ剥離方法を示し、可動ステージ部のスライド状態の簡略断面図である。It is a simplified cross-sectional view showing a chip peeling method using a conventional chip peeling apparatus and showing a sliding state of a movable stage part. 従来のチップ剥離装置の簡略平面図である。It is a simplified top view of the conventional chip peeling apparatus.
符号の説明Explanation of symbols
１１   チップ
１２   粘着シート
１６   ステージ
１６ａ 可動ステージ部
１６ｂ 固定ステージ部
１９   空隙
３０   負圧通路
３１   はみ出し部
５０   凸状部
５１、５３    板状部材
５２   突き上げ面
５５   ピン部材 11 Chip 12 Adhesive sheet 16 Stage 16a Movable stage portion 16b Fixed stage portion 19 Gap 30 Negative pressure passage 31 Overhang portion 50 Convex portions 51, 53 Plate member 52 Push-up surface 55 Pin member
　以下、本発明の実施の形態を図１～図４に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to FIGS.
　図１と図２に本発明のチップ剥離装置を示す。このチップ剥離装置は、粘着シート１２上に貼り付けられた複数の矩形薄肉のチップ（半導体チップ）１１を、前記粘着シート１２から順次剥離して取り出す装置である。すなわち、半導体装置としての半導体チップ１１を製造する半導体装置製造装置に用いるものである。 1 and 2 show a chip peeling apparatus of the present invention. The chip peeling device is a device that sequentially peels and takes out a plurality of rectangular thin-walled chips (semiconductor chips) 11 attached on the pressure-sensitive adhesive sheet 12 from the pressure-sensitive adhesive sheet 12. That is, it is used for a semiconductor device manufacturing apparatus for manufacturing a semiconductor chip 11 as a semiconductor device.
　チップ１１は、ウェーハ１０(図３参照)を素材とし、この素材を矩形状に切断することによって最終製品となる。このため、チップ１１には正方形や短冊状のもの等がある。すなわち、図３に示すように、ウェーハ１０は全体として円形であり、ダイシングにより個々のチップ１１に分割され、このチップ１１が粘着シート１２に貼り付けられている。また、粘着シート１２の外周側にはリング体からなるフレーム１３が貼着されている。すなわち、このフレーム１３と粘着シート１２とが一体化されている。そして、フレーム１３と粘着シート１２とが一体化されている状態で、このチップ剥離装置にてチップ１１が取り出される。 The chip 11 is a final product by using the wafer 10 (see FIG. 3) as a material and cutting the material into a rectangular shape. For this reason, the chip 11 includes a square or a strip. That is, as shown in FIG. 3, the wafer 10 is circular as a whole, and is divided into individual chips 11 by dicing, and the chips 11 are attached to the adhesive sheet 12. A frame 13 made of a ring body is attached to the outer peripheral side of the adhesive sheet 12. That is, the frame 13 and the adhesive sheet 12 are integrated. And the chip | tip 11 is taken out with this chip | tip peeling apparatus in the state in which the flame | frame 13 and the adhesive sheet 12 are integrated.
　チップ剥離装置は、図１に示すように、剥離すべきチップ１１を上方から保持する保持手段１５と、粘着シート１２が載置されるステージ１６とを備える。ステージ１６は、固定ステージ部１６ｂと、スライド自在な可動ステージ部１６ａとを備える。すなわち、固定ステージ部１６ｂの上面３７には凹所２２が設けられ、この凹所２２に矩形平板体である可動ステージ部１６ａが配置されている。可動ステージ部１６ａの上面３４が固定ステージ部１６ｂの上面３７よりも高位とされている。すなわち、可動ステージ部１６ａの上面３４と固定ステージ部１６ｂの上面３７とに段差Ｓが設けられる。 As shown in FIG. 1, the chip peeling apparatus includes a holding means 15 that holds the chip 11 to be peeled from above, and a stage 16 on which the adhesive sheet 12 is placed. The stage 16 includes a fixed stage portion 16b and a slidable movable stage portion 16a. That is, the recess 22 is provided in the upper surface 37 of the fixed stage portion 16b, and the movable stage portion 16a, which is a rectangular flat plate body, is disposed in the recess 22. The upper surface 34 of the movable stage portion 16a is higher than the upper surface 37 of the fixed stage portion 16b. That is, a step S is provided between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b.
　図２に示すように、可動ステージ部１６ａの幅寸法Ｗは、正方形であるチップ１１の一辺の長さ（幅寸法）Ｗ１よりも小さく設定されている。この場合、可動ステージ部１６ａの一方の先端面１７ａが剥離すべきチップ１１の第１辺２３ａに対応し、チップ１１の第１辺２３ａが可動ステージ部１６ａの先端面１７ａよりもはみ出している。 As shown in FIG. 2, the width dimension W of the movable stage portion 16a is set smaller than the length (width dimension) W1 of one side of the chip 11 which is a square. In this case, one tip surface 17a of the movable stage portion 16a corresponds to the first side 23a of the chip 11 to be peeled off, and the first side 23a of the chip 11 protrudes beyond the tip surface 17a of the movable stage portion 16a.
　ステージ１６に粘着シート１２との境界面に負圧を導入する負圧通路３０を設けている。負圧通路３０は、チップ１１の第１辺２３ａ側に開口する吸引口３０ａ、３０ｂが設けられている。この場合、各吸引口３０ａ、３０ｂは、平面視で分かるように、チップ１１のはみ出し部３１に対応している。 A negative pressure passage 30 for introducing a negative pressure to the interface with the adhesive sheet 12 is provided in the stage 16. The negative pressure passage 30 is provided with suction ports 30 a and 30 b that open on the first side 23 a side of the chip 11. In this case, each suction port 30a, 30b corresponds to the protruding portion 31 of the chip 11, as can be seen in plan view.
　負圧通路３０には、図示省略の真空ポンプが接続されてなる。すなわち、真空ポンプが駆動することによって、負圧通路３０の吸引口３０ａ、３０ｂからエアを吸引することができる。このように、負圧通路３０と真空ポンプ等で負圧供給手段（エア吸引手段）を構成することができる。 A vacuum pump (not shown) is connected to the negative pressure passage 30. That is, by driving the vacuum pump, air can be sucked from the suction ports 30 a and 30 b of the negative pressure passage 30. Thus, the negative pressure passage 30 and the vacuum pump can constitute negative pressure supply means (air suction means).
　保持手段１５は、チップ１１を吸着するヘッド２０を有する吸着部材（コレット）２１にて構成している。ヘッド２０は、その下端面２０ａに吸着孔が設けられ、この吸着孔を介してチップ１１が真空吸引され、このヘッド２０の下端面２０ａにチップ１１が吸着する。このため、この真空吸引（真空引き）が解除されれば、ヘッド２０からチップ１１が外れる。 The holding means 15 is constituted by a suction member (collet) 21 having a head 20 for sucking the chip 11. The head 20 is provided with a suction hole in its lower end surface 20 a, and the chip 11 is vacuumed through the suction hole, and the chip 11 is sucked into the lower end surface 20 a of the head 20. For this reason, if this vacuum suction (evacuation) is released, the chip 11 is detached from the head 20.
　可動ステージ部１６ａは図示省略の駆動機構を介して、可動ステージ部１６ａの先端面１７ａがチップ１１の第１辺２３ａと平行を保持しつつ水平方向に沿って移動する。駆動機としては、ボルト軸部材とこれに螺合するナット部材からなる往復動機構やシリンダ機構等の種々の機構を用いることができる。 The movable stage portion 16a moves along the horizontal direction while the tip end surface 17a of the movable stage portion 16a is parallel to the first side 23a of the chip 11 via a drive mechanism (not shown). As the driving machine, various mechanisms such as a reciprocating mechanism and a cylinder mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member can be used.
　また、固定ステージ部１６ｂの凹所２２には、チップ１１のはみ出し部３１に対応して、板状部材５１からなる凸状部５０が設けられている。すなわち、この凸状部５０は、図２に示すように、その上端面（突き上げ面）の長辺５１ａが可動ステージ部１６ａの先端面１７ａの長さ寸法と略同一に設定され、その短辺５１ｂがはみ出し部３１の幅寸法よりも小さく設定している。そして、可動ステージ部１６ａの先端面１７ａにこの凸状部５０が接触乃至近接するように配置される。 Further, a convex portion 50 made of a plate-like member 51 is provided in the recess 22 of the fixed stage portion 16b corresponding to the protruding portion 31 of the chip 11. That is, as shown in FIG. 2, the convex portion 50 has a long side 51a of its upper end surface (push-up surface) set to be substantially the same as the length dimension of the distal end surface 17a of the movable stage portion 16a, and its short side. 51 b is set to be smaller than the width dimension of the protruding portion 31. And this convex-shaped part 50 is arrange | positioned so that it may contact or adjoin to the front end surface 17a of the movable stage part 16a.
　凸状部５０に図示省略の上下動機構が連設され、この凸状部５０は可動ステージ部１６ａとは独立して上下動する。なお、上下動機構としては、ボルト軸部材とこれに螺合するナット部材からなる往復動機構やシリンダ機構等の種々の機構を用いることができる。 A vertical movement mechanism (not shown) is connected to the convex portion 50, and the convex portion 50 moves up and down independently of the movable stage portion 16a. In addition, as a vertical movement mechanism, various mechanisms, such as a reciprocation mechanism and a cylinder mechanism which consist of a bolt shaft member and a nut member screwed together, can be used.
　本発明では、チップ１１のはみ出し部３１の下部には空隙１９が形成されるが、凸状部５０を上昇させることによって、チップ１１のはみ出し部３１を粘着シート１２を介して、図１Ｂに示すように、突き上げることができる。この突き上げによって、チップ１１のはみ出し部３１と固定ステージ部１６ｂの上面との段差が大きくなる。 In the present invention, the gap 19 is formed in the lower portion of the protruding portion 31 of the chip 11, but the protruding portion 31 of the chip 11 is shown in FIG. 1B through the adhesive sheet 12 by raising the convex portion 50. Can be pushed up. By this push-up, the step between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b becomes large.
　次に、前記図１に示すチップ剥離装置を使用したチップ剥離方法を説明する。可動ステージ部１６ａでチップ１１を支持した状態で、チップ１１の周縁部の少なくとも一部（つまり第１辺２３ａ側）を可動ステージ部１６ａからはみ出させる。これによって、このはみ出し部３１の下方に図１Ａに示すように空隙１９を設ける。この空隙１９は吸引口３０ａ、３０ｂに連通されている。この際、保持手段１５のコレット２１を、ヘッド２０をチップ１の上面に当接するとともに、吸着孔を介してチップ１１を真空吸引して、このヘッド２０の下端面２０ａにチップ１１を吸着させる。 Next, a chip peeling method using the chip peeling apparatus shown in FIG. 1 will be described. In a state where the chip 11 is supported by the movable stage portion 16a, at least a part of the peripheral edge portion of the chip 11 (that is, the first side 23a side) protrudes from the movable stage portion 16a. Thus, a gap 19 is provided below the protrusion 31 as shown in FIG. 1A. The gap 19 communicates with the suction ports 30a and 30b. At this time, the collet 21 of the holding unit 15 abuts the head 20 on the upper surface of the chip 1 and vacuum-sucks the chip 11 through the suction hole, thereby adsorbing the chip 11 to the lower end surface 20 a of the head 20.
　この状態では、凸状部５０の突き上げ面（先端面）５２の高さ位置を、可動ステージ部１６ａの上面３４の高さ位置に合わせている。次に、図１Ｂに示すように、凸状部５０を上昇させて、チップ１１のはみ出し部３１を粘着シート１２を介して、突き上げることができる。すなわち、チップ１１のはみ出し部３１と固定ステージ部１６ｂの上面との段差を大きくする。 In this state, the height position of the protruding surface (tip surface) 52 of the convex portion 50 is matched with the height position of the upper surface 34 of the movable stage portion 16a. Next, as shown in FIG. 1B, the protruding portion 50 can be raised and the protruding portion 31 of the chip 11 can be pushed up through the adhesive sheet 12. That is, the level difference between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b is increased.
　前記空隙１９は、前記したように、吸引口３０ａ、３０ｂに連通されている。そこで、吸引手段（負圧供給手段）を駆動することによって、吸引口３０ａ、３０ｂを介して空隙１９のエアを吸引して負圧を作用させる。これによって、チップ１１のはみ出し部３１が吸引され、図１Ｂに示す仮想線で示すように、チップ１１のはみ出し部３１から粘着シート１２を剥離する。 The gap 19 communicates with the suction ports 30a and 30b as described above. Therefore, by driving the suction means (negative pressure supply means), the air in the gap 19 is sucked through the suction ports 30a and 30b to apply negative pressure. As a result, the protruding portion 31 of the chip 11 is sucked, and the adhesive sheet 12 is peeled from the protruding portion 31 of the chip 11 as indicated by the phantom line shown in FIG. 1B.
　その後は、図１Ｃに示すように、凸状部５０を下降させる。この場合、凸状部５０の突き上げ面５２の高さ位置が可動ステージ部１６ａの上面３４の高さ位置よりも低くしている。次に、可動ステージ部１６ａを、はみ出し側と反対方向である矢印Ｂ方向に前記駆動機構を介してスライドさせる。このスライドによって、可動ステージ部１６ａによるチップ１の受け面積が順次減少していって、粘着シート１２の下方への吸着（吸引）面積が増加していく。この際、チップ１１はコレット２１に保持（吸着）されているので、粘着シート１２が順次チップ１１から剥離していく。このため、可動ステージ部１６ａの先端面１７ａが、チップ１１の第１辺２３ａから外れたときに、この剥離すべきチップ１から粘着シート１２を完全に剥離させることができる。 Thereafter, as shown in FIG. 1C, the convex portion 50 is lowered. In this case, the height position of the raised surface 52 of the convex portion 50 is set lower than the height position of the upper surface 34 of the movable stage portion 16a. Next, the movable stage portion 16a is slid through the drive mechanism in the direction of arrow B which is the direction opposite to the protruding side. By this slide, the receiving area of the chip 1 by the movable stage portion 16a is sequentially reduced, and the area of adsorption (suction) downward of the adhesive sheet 12 is increased. At this time, since the chip 11 is held (adsorbed) on the collet 21, the adhesive sheet 12 is sequentially peeled from the chip 11. For this reason, when the front end surface 17a of the movable stage portion 16a is detached from the first side 23a of the chip 11, the adhesive sheet 12 can be completely peeled from the chip 1 to be peeled.
　そして、剥離後は、コレット２１を上昇させてステージ１６から離すことによって、チップ１１を粘着シート１２から取り出すことができる。その後は、前記負圧状態を解除して、可動ステージ部１６ａを前記矢印Ｂと反対方向にスライドさせて、図１Ａに示す状態に戻す。 And after peeling, the chip | tip 11 can be taken out from the adhesive sheet 12 by raising the collet 21 and releasing | separating from the stage 16. FIG. Thereafter, the negative pressure state is released, and the movable stage portion 16a is slid in the direction opposite to the arrow B to return to the state shown in FIG. 1A.
　その後、順次チップ１１にこのチップ剥離装置を対応させて行けば、粘着シート１２上のすべてのチップ１１を粘着シート１２から剥離して取り出すことができる。このように、このチップ剥離装置を半導体装置を製造する際に用いることができる。ここで、半導体装置とは、半導体特性を利用することで機能しうる装置全般を指し、電気光学装置、半導体回路および電子機器は全て半導体装置である。また、回路が形成されたウエハ状態のものであっても、ウエハから切り出された個別の半導体チップであっても、ウエハを複数に分割したものであっても、ウエハ状態でパッケージされたものであっても、ウエハ状態でパッケージされたものを複数に分割したものであっても、ウエハ状態でパッケージされたものを切り出して個別の半導体素子にしたものであっても構わない。 Thereafter, if the chip peeling device is sequentially associated with the chips 11, all the chips 11 on the pressure-sensitive adhesive sheet 12 can be peeled off from the pressure-sensitive adhesive sheet 12 and taken out. Thus, this chip peeling apparatus can be used when manufacturing a semiconductor device. Here, a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices. In addition, it may be in a wafer state on which a circuit is formed, an individual semiconductor chip cut out from the wafer, a wafer divided into a plurality of pieces, or a package in the wafer state. Even if it is, what was packaged in the wafer state may be divided into a plurality of parts, or what was packaged in the wafer state may be cut out to form individual semiconductor elements.
　本発明では、チップ１１のはみ出し部３１を粘着シート１２を介して凸状部５０で突き上げることができる。そして、この突き上げ状態で、はみ出し部３１の下方の空隙１９に負圧を作用させることによって、大きな剥離力を付与することができる。その後、可動ステージ部を、駆動することによって、最終的には、この剥離すべきチップ１１から粘着シートを完全に剥離させることができる。すなわち、剥離初期段階では、粘着シート１２に対して大きな剥離力を作用させることができ、また、可動ステージ部１６ａのスライド時には、隣設する他のチップ１１に動的な捻るような応力が付与されるのを防止して、隣設する他のチップ１１に与えられる曲げを小さくすることができ、隣設する他のチップ１１の割れを一層防止することができる。 In the present invention, the protruding portion 31 of the chip 11 can be pushed up by the convex portion 50 via the adhesive sheet 12. And a big peeling force can be provided by making a negative pressure act on the space | gap 19 below the protrusion part 31 in this pushing-up state. Thereafter, the pressure-sensitive adhesive sheet can be completely peeled from the chip 11 to be peeled finally by driving the movable stage portion. That is, at the initial peeling stage, a large peeling force can be applied to the pressure-sensitive adhesive sheet 12, and when the movable stage portion 16a is slid, a stress that dynamically twists is applied to the other adjacent chips 11. Therefore, the bending applied to the adjacent chip 11 can be reduced, and the crack of the adjacent chip 11 can be further prevented.
　また、可動ステージ部１６ａを駆動（スライド）させる際には、凸状部５０の突き上げ面５２を可動ステージ部１６ａの上面３４よりも低くすることができるので、凸状部５０に影響を受けることなく、可動ステージ部１６ａをスライド等の駆動が可能となり、なめらかな剥離作業が可能となる。 Further, when driving (sliding) the movable stage portion 16a, the protruding surface 52 of the convex portion 50 can be made lower than the upper surface 34 of the movable stage portion 16a, and therefore the convex portion 50 is affected. In addition, the movable stage portion 16a can be driven by sliding or the like, and a smooth peeling operation can be performed.
　図４は凸状部５０の変形例を示し、図４Ａでは、平面視で略コの字状の板状部材５３からなる。すなわち、この板状部材５３は、可動ステージ部１６ａの先端面１７ａと平行に配置される平板状本体部５３ａと、この平板状本体部５３ａの端部から直角に屈曲する端片部５４ｂ、５４ｂとからなる。端片部５４ｂ、５４ｂが可動ステージ部１６ａの先端面１７ａの側面に沿って配設される。この凸状部５０にてチップ１１を突き上げる際の突き上げ面５２が平面視においてコの字状となる。このため、図４Ａの凸状部５０を用いれば、チップ１１の突き上げを安定して行うことができ、剥離初期段階において大きな剥離力を発揮させることができ、剥離作業の安定化を図ることができる。 FIG. 4 shows a modified example of the convex portion 50. In FIG. 4A, the convex portion 50 includes a substantially U-shaped plate member 53 in a plan view. That is, the plate-like member 53 includes a flat plate-like main body portion 53a arranged in parallel with the distal end surface 17a of the movable stage portion 16a, and end piece portions 54b, 54b bent at right angles from the end portions of the flat plate-like main body portion 53a. It consists of. End piece portions 54b and 54b are disposed along the side surface of the distal end surface 17a of the movable stage portion 16a. When the chip 11 is pushed up by the convex portion 50, the push-up surface 52 has a U shape in plan view. For this reason, if the convex-shaped part 50 of FIG. 4A is used, the chip 11 can be pushed up stably, a large peeling force can be exerted in the initial peeling stage, and the peeling work can be stabilized. it can.
　図４Ｂでは、凸状部５０はピン部材５５から構成される。この場合、可動ステージ部１６ａの先端面１７ａに沿って所定ピッチで３本配設されている。各ピン部材５５は、上下動可能とされる。このため、各ピン部材５５の上昇によって、チップ１１のはみ出し部３１を粘着シート１２を介して突き上げることができる。このため、このピン部材５５からなる凸状部５０を用いても、剥離初期段階において大きな剥離力を発揮させることができ、剥離作業を行うことができる。 In FIG. 4B, the convex portion 50 is composed of a pin member 55. In this case, three are arranged at a predetermined pitch along the distal end surface 17a of the movable stage portion 16a. Each pin member 55 is movable up and down. For this reason, the protrusion part 31 of the chip | tip 11 can be pushed up through the adhesive sheet 12 by the raise of each pin member 55. FIG. For this reason, even if it uses the convex-shaped part 50 which consists of this pin member 55, a big peeling force can be exhibited in the peeling initial stage, and peeling work can be performed.
　ところで、前記図１に示すチップ剥離装置では、可動ステージ部１６ａがスライドのみするものであったが、可動ステージ部１６ａとして、上下動（昇降）とスライドするものであってもよい。 Incidentally, in the chip peeling apparatus shown in FIG. 1, the movable stage unit 16a only slides. However, the movable stage unit 16a may slide up and down (elevate).
　すなわち、この場合の駆動手段は、可動ステージ部１６ａを昇降させる昇降機構部（昇降手段）と、可動ステージ部１６ａをスライドさせるスライド機構部（スライド手段）とを備える。昇降機構部は、例えば、押し上げピンを有し、この押し上げピンを往復動機構を介して上下動させるものである。また、スライド機構部（スライド手段）は、この昇降機構部を略水平方向にスライドさせる往復動機構を備える。なお、昇降機構部及びスライド機構部の往復動機構は、ボルト軸部材とこれに螺合するナット部材からなる往復動機構やシリンダ機構、リニアアクチュエータ等の種々の公知公用の機構を用いることができる。 That is, the driving means in this case includes an elevating mechanism part (elevating means) for elevating and lowering the movable stage part 16a, and a slide mechanism part (sliding means) for sliding the movable stage part 16a. The elevating mechanism unit has, for example, a push-up pin, and moves the push-up pin up and down via a reciprocating mechanism. The slide mechanism section (slide means) includes a reciprocating mechanism that slides the elevating mechanism section in a substantially horizontal direction. As the reciprocating mechanism of the lifting mechanism section and the slide mechanism section, various known and publicly available mechanisms such as a reciprocating mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member, a cylinder mechanism, and a linear actuator can be used. .
　可動ステージ部１６ａを昇降自在とすれば、可動ステージ部１６ａの上面３４と固定ステージ部１６ｂの上面３７との段差量を種々変更することができる。すなわち、可動ステージ部をいったん上昇させてから元の位置まで下降させたり、可動ステージ部１６ａをいったん上昇させてから元の位置よりは高い中間高さ位置まで下降させたりできる。 If the movable stage portion 16a can be moved up and down, the amount of step difference between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b can be variously changed. That is, the movable stage portion can be raised once and lowered to the original position, or the movable stage portion 16a can be raised once and lowered to an intermediate height position higher than the original position.
　このように変更することによって、可動ステージ部１６ａと固定ステージ部１６ｂとを高い段差としたり、低い段差としたりできる。このため、剥離初期段階では、可動ステージ部１６ａと固定ステージ部１６ｂとの段差を大きくすれば、凸状部５０の上昇量を小さくしても、粘着シート１２に対して大きな剥離力を作用させることができる。このため、凸状部５０の突き上げによるチップ１１の折り曲げ力発生を防止できる。また、可動ステージ部１６ａと固定ステージ部１６ｂとの段差を小さくすれば、可動ステージ部１６ａのスライド時において、隣設する他のチップ１１に動的な捻るような応力が付与されるのを有効に防止して、隣設する他のチップ１１に与えられる曲げを小さくすることができる。 By changing in this way, the movable stage portion 16a and the fixed stage portion 16b can have a high step or a low step. For this reason, at the initial stage of peeling, if the step between the movable stage portion 16a and the fixed stage portion 16b is increased, a large peeling force is applied to the adhesive sheet 12 even if the rising amount of the convex portion 50 is reduced. be able to. For this reason, generation | occurrence | production of the bending force of the chip | tip 11 by pushing up of the convex-shaped part 50 can be prevented. In addition, if the step between the movable stage portion 16a and the fixed stage portion 16b is reduced, it is effective to apply dynamic twisting stress to other adjacent chips 11 when the movable stage portion 16a slides. Therefore, it is possible to reduce the bending applied to other adjacent chips 11.
　以上、本発明の実施形態につき説明したが、本発明は前記実施形態に限定されることなく種々の変形が可能であって、例えば、ステージ１６に設けられる吸引口３０ａとしては、大きさ、数、形状等を、空隙１９のエアの吸引可能範囲で任意に設定できる。このため、吸引口３０aは１個であってもよい。また、剥離すべきチップ１１として、正方形に限るものではなく、短辺と長辺とを有する長方形であっても、さらには、短辺に比べて長辺が極めて長い短冊状であってもよい。粘着シート１２の厚さとしても、吸引力等によって相違するが、吸引手段（負圧供給手段）にて空隙１９のエアを吸引した際に、チップ１１から剥離できるように、湾曲変形できるものであればよい。 As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the suction port 30a provided in the stage 16 has a size and a number of The shape and the like can be arbitrarily set within the air suckable range of the gap 19. For this reason, the suction port 30a may be one. Further, the chip 11 to be peeled is not limited to a square, but may be a rectangle having a short side and a long side, or may be a strip having a very long long side compared to the short side. . Although the thickness of the pressure-sensitive adhesive sheet 12 is different depending on the suction force or the like, it can be curved and deformed so that it can be peeled off from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). I just need it.
　可動ステージ部１６ａの肉厚としても、吸引手段（負圧供給手段）にて空隙１９のエアを吸引した際に、チップ１１から剥離できる範囲によって、任意に設定できる。また、可動ステージ部１６ａの角部の角度として９０度に限るものではなく、多少鋭角であっても鈍角であってもよい。 The thickness of the movable stage portion 16a can be arbitrarily set according to the range that can be peeled from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). Further, the angle of the corner of the movable stage portion 16a is not limited to 90 degrees, and may be somewhat acute or obtuse.
　粘着シート１２上に貼り付けられているチップ１１の数としても任意であり、本発明では、数に影響されることなく、粘着シート１２上の全てのチップ１１を順次剥離して行くことができる。チップ１１のはみ出し部３１の面積としては、負圧を作用させた際に、粘着シート１２に剥離力が作用する範囲で種々設定できる。 The number of chips 11 stuck on the pressure-sensitive adhesive sheet 12 is also arbitrary, and in the present invention, all the chips 11 on the pressure-sensitive adhesive sheet 12 can be sequentially peeled without being affected by the number. . The area of the protruding portion 31 of the chip 11 can be variously set within a range in which a peeling force acts on the adhesive sheet 12 when a negative pressure is applied.
　凸状部５０として板状部材５１を用いる場合、前記実施形態では、図２に示すように、その長辺５１ａが可動ステージ部１６ａの長さと略同一に設定されているが、その長辺５１ａが可動ステージ部１６ａの長さよりも長くても短くてもよい。また、板状部材５１の厚さ寸法としても、はみ出し部３１の下方に配置可能なものであればよい。板状部材５１としては複数有するものであってもよい。 In the case where the plate-like member 51 is used as the convex portion 50, the long side 51a is set to be substantially the same as the length of the movable stage portion 16a as shown in FIG. May be longer or shorter than the length of the movable stage portion 16a. Further, the thickness dimension of the plate-like member 51 may be anything as long as it can be disposed below the protruding portion 31. A plurality of plate-like members 51 may be provided.
　凸状部５０としてピン部材５５を用いる場合、前記実施形態では、図４Ｂに示すように、その数が３本であったが、その数の増減は任意である。また、ピン部材５５としては、断面が円形の円柱体であっても、断面が長円乃至楕円形の柱体、断面が三角形、四角形、五角形、またはこれら以上の角形の角柱体等であってもよい。また、筒体であってもよい。ピン部材５５の突き上げ面５２の面積もはみ出し部３１を押し上げることが可能な範囲で種々変更可能である。 When using the pin member 55 as the convex part 50, in the said embodiment, as shown to FIG. 4B, although the number was three, the increase / decrease in the number is arbitrary. The pin member 55 may be a cylindrical body having a circular cross section, an elliptical or elliptical cross section, a triangular, quadrangular, pentagonal, or more rectangular prism having a cross section. Also good. Moreover, a cylinder may be sufficient. The area of the push-up surface 52 of the pin member 55 can be variously changed within a range in which the protruding portion 31 can be pushed up.
　図１Ｃに示す状態において、凸状部５０の突き上げ面５２の高さ位置を可動ステージ部１６ａの上面３４の高さ位置に合わせてよい。このように合わせた場合でも、可動ステージ部１６ａのスライドに悪影響を及ぼさない。 In the state shown in FIG. 1C, the height position of the push-up surface 52 of the convex portion 50 may be matched with the height position of the upper surface 34 of the movable stage portion 16a. Even in such a case, the slide of the movable stage portion 16a is not adversely affected.
　チップ１１のはみ出し部３１のはみ出し量としては、チップ１１の大きさ、厚さ、材質等に応じて、剥離初期段階で、負圧の作用で粘着シート１２が剥離可能な範囲で任意に設定できる。 The amount of protrusion of the protruding portion 31 of the chip 11 can be arbitrarily set within a range in which the adhesive sheet 12 can be peeled by the action of negative pressure at the initial stage of peeling depending on the size, thickness, material, etc. of the chip 11. .
　粘着シート上に貼り付けられた複数の矩形薄肉のチップ（半導体チップ）を、粘着シートから順次剥離してピックアップするピックアップ装置に用いることができる。チップは、を素材とし、この素材を矩形状に切断することによって最終製品となる。このため、チップには正方形や短冊状のもの等がある。 ¡A plurality of rectangular thin-walled chips (semiconductor chips) attached on the adhesive sheet can be used in a pickup device that sequentially separates and picks up from the adhesive sheet. A chip is made into a material, and this material is cut into a rectangular shape to become a final product. For this reason, there are square and strip-shaped chips.

Claims (10)

  1. 　上面にチップを貼り付けた粘着シートから前記チップを剥離させるチップ剥離方法において、
    　固定ステージ部と可動ステージ部とを備えたステージ上に、剥離すべきチップを可動ステージ部に対応させかつこのチップの周縁部の少なくとも一部が可動ステージ部からはみ出すように設置した後、
    　前記はみ出し状態で前記チップのはみ出し部分を前記粘着シートを介して前記凸状部で突き上げて、はみ出し部の下方に空隙を形成し、
    　次に、はみ出し部の下部の空隙に負圧を作用させてから前記可動ステージ部を駆動するようにしたことを特徴とするチップ剥離方法。     In the chip peeling method for peeling the chip from the adhesive sheet with the chip attached to the upper surface,
    After setting the chip to be peeled on the stage including the fixed stage part and the movable stage part so as to correspond to the movable stage part and so that at least a part of the peripheral part of the chip protrudes from the movable stage part,
    In the protruding state, the protruding portion of the chip is pushed up by the convex portion via the adhesive sheet, and a gap is formed below the protruding portion,
    Next, the movable stage portion is driven after a negative pressure is applied to the gap below the protruding portion.
  2. 　前記前記凸状部の突き上げ面を固定ステージ部の上面よりも高位としてはみ出し部の下方に空隙を設けることを特徴とする請求項１に記載のチップ剥離方法。 2. The chip peeling method according to claim 1, wherein the protruding surface of the convex portion is higher than the upper surface of the fixed stage portion, and a gap is provided below the protruding portion.
  3. 　チップのはみ出し状態において、可動ステージ部の上面を固定ステージ部の上面から隆起させることを特徴とする請求項１又は請求項２に記載のチップ剥離方法。 3. The chip peeling method according to claim 1, wherein the upper surface of the movable stage portion is raised from the upper surface of the fixed stage portion in a protruding state of the chip.
  4. 　前記可動ステージ部を、はみ出し側とは反対方向に水平方向にスライドさせることを特徴とする請求項１～請求項３のいずれか１項に記載のチップ剥離方法。 The chip peeling method according to any one of claims 1 to 3, wherein the movable stage portion is slid horizontally in a direction opposite to the protruding side.
  5. 　前記凸状部の突き上げ面を可動ステージ部の上面よりも高く突き上げた後、可動ステージ部の駆動時には前記凸状部の突き上げ面を可動ステージ部の上面と同一乃至可動ステージ部の上面よりも低くすることを特徴とする請求項１～請求項４のいずれか１項に記載のチップ剥離方法。 After raising the raised surface of the convex portion higher than the upper surface of the movable stage portion, when the movable stage portion is driven, the raised surface of the convex portion is the same as the upper surface of the movable stage portion or lower than the upper surface of the movable stage portion. The chip peeling method according to any one of claims 1 to 4, wherein:
  6. 　請求項１～請求項５のいずれか１項に記載のチップ剥離方法を用いて半導体装置を製造する半導体装置製造方法。 A semiconductor device manufacturing method for manufacturing a semiconductor device using the chip peeling method according to any one of claims 1 to 5.
  7. 　上面にチップを貼り付けた粘着シートから前記チップを剥離させるチップ剥離装置において、
    　固定ステージ部と可動ステージ部とを備えたステージと、
    　剥離すべきチップを可動ステージ部に対応させかつこのチップの周縁部の少なくとも一部が可動ステージ部からはみ出すようにした状態で、このチップのはみ出し部分を前記粘着シートを介して突き上げて、このはみ出し部の下方に空隙を形成する凸状部と、
    　前記空隙に負圧通路を介して負圧を作用させる負圧供給手段と、
    　前記はみ出し側とは反対側に前記可動ステージ部を水平方向にスライドさせるスライド手段とを備えたことを特徴とするチップ剥離装置。     In the chip peeling device for peeling the chip from the adhesive sheet with the chip attached to the upper surface,
    A stage having a fixed stage part and a movable stage part;
    With the chip to be peeled corresponding to the movable stage part and at least a part of the peripheral edge of this chip protruding from the movable stage part, the protruding part of this chip is pushed up through the adhesive sheet, and this protrusion A convex portion that forms a gap below the portion;
    Negative pressure supply means for applying a negative pressure to the gap via a negative pressure passage;
    A chip peeling apparatus comprising: a sliding means for sliding the movable stage portion in a horizontal direction on the side opposite to the protruding side.
  8. 　前記凸状部をピン部材又は板状部材で構成したことを特徴とする請求項７に記載のチップ剥離装置。 The chip peeling apparatus according to claim 7, wherein the convex portion is configured by a pin member or a plate-like member.
  9. 　可動ステージ部をスライド自在としたことを特徴とする請求項７又は請求項８に記載のチップ剥離装置。 9. The chip peeling apparatus according to claim 7, wherein the movable stage portion is slidable.
  10. 　可動ステージ部を昇降自在かつスライド自在としたことを特徴とする請求項７又は請求項８に記載のチップ剥離装置。 9. The chip peeling apparatus according to claim 7 or 8, wherein the movable stage portion is movable up and down and slidable.
PCT/JP2008/070057 2008-11-04 2008-11-04 Chip peeling method, chip peeling apparatus and semiconductor device manufacturing method WO2010052759A1 (en)

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KR1020117003603A KR101062708B1 (en) 2008-11-04 2008-11-04 Chip Peeling Method, Chip Peeling Device, and Semiconductor Device Manufacturing Method
PCT/JP2008/070057 WO2010052759A1 (en) 2008-11-04 2008-11-04 Chip peeling method, chip peeling apparatus and semiconductor device manufacturing method
JP2010536597A JP4668361B2 (en) 2008-11-04 2008-11-04 Chip peeling method, chip peeling apparatus, and semiconductor device manufacturing method
TW098137459A TWI452614B (en) 2008-11-04 2009-11-04 Chip-stripping method, chip-stripping device and fabricating method of semiconductor device

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