JP5980875B2 - Chip peeling apparatus and chip peeling method - Google Patents

Description

  The present invention relates to a chip peeling apparatus and a chip peeling method.

  In the manufacturing process of a semiconductor device, it is necessary to pick up a diced semiconductor chip (hereinafter simply referred to as a chip) from an adhesive sheet. Some chip peeling devices include a stage that holds an adhesive sheet, a push-up table that advances and retreats with respect to the stage, and a needle that is pushed up by the push-up table. That is, it is configured such that the needle is pushed up by the push-up stand and the adhesive sheet of the stage is pushed from the back side so that the chip is detached from the adhesive sheet.

  In a chip peeling apparatus using a needle, when the needle pushes up the chip and peels it from the adhesive sheet, the adhesive tape may be pierced. In such a case, the back surface of the chip may be damaged. Further, the length of each needle is different due to abrasion or breakage, and the tip is tilted and pushed up, and adjacent tips may collide and be damaged.

  Further, the chip is adsorbed by a collet and taken out. However, if the tip is tilted and pushed up, a tip suction error due to the collet occurs. If a collet chip suction error occurs, it will hinder subsequent operations. Further, the tip may be damaged by the needle being pushed up.

  Therefore, a chip peeling device (Patent Document 1) that does not use a needle has been proposed. As shown in FIGS. 7 and 8, the chip peeling apparatus includes a stage 3 that holds an adhesive sheet 2 to which a chip 1 is attached. Further, the stage 3 is provided with a movable stage portion 4 whose upper surface 4a protrudes from the stage upper surface 3a. That is, a recess 5 is provided in the stage 3, and the movable stage portion 4 is fitted in the recess 5. In this case, there is a step of S0 between the upper surface 4a of the movable stage portion 4 and the upper surface 3a of the stage 3. That is, the upper surface 4a of the movable stage unit 4 is positioned higher than the upper surface 3a of the stage 3 by S0 in the vertical direction. Further, the first side 1 a of the chip 1 protrudes beyond the end face 9 of the movable stage portion 4. Therefore, a gap 6 is formed between the movable stage portion 4 and the adhesive sheet 2 on the outer peripheral side. Further, as shown in FIG. 8, the stage 3 is provided with a suction hole 8 communicating with the gap 6.

  Next, a chip peeling method using the chip peeling apparatus will be described. First, the pressure-sensitive adhesive sheet 2 is sucked downward through the suction holes 8 in a state where the chip 1 is sucked (held) by a collet (adsorption collet) (not shown) from above. As a result, air in the gap 6 is sucked, the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is sucked, and the pressure-sensitive adhesive sheet 2 is peeled off at the protruding portion of the chip 1.

  When the chip peeling apparatus is used, it is necessary to peel off a part of the peripheral edge of the chip 1 (in the case shown in FIG. 7, the protruding portion of the chip 1) at the initial stage of peeling. Since the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is strongly stuck due to stress during dicing, a larger stress than other portions is required for peeling. For this reason, the upper surface 4a of the movable stage portion 4 is projected from the stage upper surface 3a by S0. Thereby, the stress which peels the adhesive sheet 2 becomes large, and the adhesive sheet 2 of the protrusion part of the chip | tip 1 can be peeled.

  Thereafter, the movable stage unit 4 is moved in the direction of arrow B as shown in FIG. As a result, the receiving area of the chip 1 received by the movable stage portion 4 is reduced, the adsorption (suction) area of the adhesive sheet 2 is increased, and finally the adhesive sheet 2 is removed from the chip 1. Can be completely peeled off.

  When the pressure-sensitive adhesive sheet 2 is peeled off, the chip is bent greatly due to a large stress at which a part of the peripheral edge (protruding portion) can be peeled off, that is, a high step, and a sliding operation is performed in a state where the step is maintained. As described above, in the case of peeling a part of the peripheral edge (the protruding portion) at the initial peeling stage, a large peeling force is required. However, when the movable stage part 4 is slid to peel off other parts after part of the peripheral part is peeled off, a large peeling force as in the initial stage of peeling is not required. That is, the peeling force to be applied differs depending on the stage of peeling and is not uniform.

  The chip peeling apparatus of Patent Document 2 is provided with a convex portion that pushes out the protruding portion of the chip. That is, when the protruding portion of the tip is pushed up by the convex portion, or simultaneously with the protruding portion, a negative pressure is applied to the gap below the protruding portion to drive the movable stage portion. Thereby, only in the initial stage of peeling, a part of the peripheral edge of the chip is peeled off with a large peeling force.

Japanese Patent No. 3209736 Japanese Patent No. 4668361

  In the case where the convex portion is provided as in Patent Document 2, if the pushing force of the convex portion is too small or the pushing distance is too short, a large peeling force cannot be applied, and the adhesive sheet peels off at the peripheral portion of the chip. It may not be possible. In this case, since it is necessary to change the pushing force and pushing distance of the convex portion depending on the thickness, shape and property of the chip, it is necessary to control the pushing force and pushing distance of the convex portion with high accuracy. Further, if the chip does not protrude from the convex part, no gap is formed between the chip and the fixed stage part, and the adhesive sheet on the peripheral part of the chip cannot be sucked. Therefore, it is necessary to position the chip with high accuracy.

  Therefore, in view of such circumstances, the present invention can stably peel off a part of the peripheral edge of the chip (the protruding portion) without performing chip positioning with high accuracy in the initial stage of peeling. Provided is a chip peeling apparatus and a chip peeling method.

  The chip peeling apparatus of the present invention is a chip peeling apparatus that peels off the chip from the adhesive sheet with the chip attached to the upper surface, and has a fixed stage part, a movable stage part that slides in the horizontal direction, and a negative pressure passage. A convex part that moves up and down between the movable stage part and the fixed stage part, a negative pressure supply means that applies a negative pressure through the negative pressure passage, and a chip to be peeled off correspond to the movable stage part, And a slide means for sliding the movable stage portion in the horizontal direction on the side opposite to the protruding side after applying negative pressure with at least a part of the peripheral edge portion of the chip protruding from the movable stage portion. It is equipped with.

  According to the chip peeling apparatus of the present invention, since the negative pressure passage is provided in the convex portion provided between the movable stage portion and the fixed stage portion, the adhesive sheet on the peripheral portion of the chip can be sucked. In this case, since the negative pressure passage is provided in the convex portion that can move up and down, the suction port can be moved up and down. That is, according to the position of the chip, the gap between the chip and the chip can be adjusted while moving the position of the suction port up and down by moving the convex part up and down. Moreover, the peeling force can be increased by raising the convex portion and pushing up the peripheral edge of the chip.

  The said structure WHEREIN: The said convex-shaped part shall descend | fall while acting a negative pressure. Thereby, the adhesive sheet of the peripheral part of a chip | tip can be peeled by suction force and the downward movement of a convex part, and can make the peeling force of the adhesive sheet in the peripheral part of a chip | tip larger.

  The said structure WHEREIN: The negative pressure path which makes a negative pressure act on the space | gap formed in the said fixed stage part with the protrusion part of a chip | tip can be provided. In other words, the outer peripheral side of the peripheral edge of the chip can be sucked through the negative pressure passage provided in the convex portion, and can be further sucked through the negative pressure passage provided in the fixed stage.

  The said structure WHEREIN: The said convex-shaped part can be comprised with a pin member or a plate-shaped member.

  The chip peeling method of the present invention is a chip peeling method in which the chip is peeled off from an adhesive sheet having a chip attached to the upper surface. The chip to be peeled is placed on a stage having a fixed stage portion and a movable stage portion. And a step of installing the chip so that at least a part of the peripheral edge of the chip protrudes from the movable stage portion, and a convex portion provided between the movable stage portion and the fixed stage portion is moved up and down. A step, a step of applying a negative pressure through a negative pressure passage provided in the convex portion, and a step of sliding the movable stage portion in a direction opposite to the protruding side.

  The said structure WHEREIN: The said convex-shaped part shall descend | fall while acting a negative pressure.

  In the present invention, the position of the suction port can be moved up and down in accordance with the position of the chip. Therefore, in the initial stage of peeling, the chip positioning can be performed stably without performing high-precision positioning. The pressure-sensitive adhesive sheet of the portion (excess portion) can be peeled off.

The chip | tip peeling method using the chip | tip peeling apparatus of 1st Embodiment of this invention is shown, (a) is simple sectional drawing in the state which does not raise a convex-shaped part, (b) is a raise of a convex-shaped part. It is a later simplified sectional view, and (c) is a simplified sectional view of the movable stage portion in a sliding state. It is a simplified top view of the chip | tip peeling apparatus of 1st Embodiment of this invention. The chip | tip peeling method using the chip | tip peeling apparatus of 1st Embodiment of this invention is shown, (a) is simple sectional drawing before the convex part descend | falls, (b) is the simple cross section after the convex part descend | falls FIG. The chip | tip peeling method using the chip | tip peeling apparatus of 2nd Embodiment of this invention is shown, (a) is simplified sectional drawing in the state which has not raised the convex-shaped part. It is a simplified top view of the chip peeling apparatus of 2nd Embodiment. The modification of a convex-shaped part is shown, (a) is a simplified plan view which shows a 1st modification, (b) is a simplified plan view which shows a 2nd modification. The chip | tip peeling method using the conventional chip | tip peeling apparatus is shown, (a) is a simplified sectional view before a slide of a movable stage part, (b) is a simplified sectional view of the sliding state of a movable stage part. It is a simplified top view of the conventional chip peeling apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  1 to 3 show a chip peeling apparatus according to a first embodiment of the present invention. The chip peeling device is a device that sequentially peels and takes out a plurality of rectangular thin-walled chips (semiconductor chips) 11 attached on the pressure-sensitive adhesive sheet 12 from the pressure-sensitive adhesive sheet 12. That is, it is used for a semiconductor device manufacturing apparatus for manufacturing a semiconductor chip 11 as a semiconductor device. The chip 11 becomes a final product by using a wafer as a material and cutting the material into a rectangular shape.

  As shown in FIG. 1, the chip peeling apparatus includes a holding unit 15 that holds the chip 11 to be peeled from above, and a stage 16 on which the adhesive sheet 12 is placed. The stage 16 includes a fixed stage portion 16b and a slidable movable stage portion 16a. That is, the recess 22 is provided in the upper surface 37 of the fixed stage portion 16b, and the movable stage portion 16a, which is a rectangular flat plate body, is disposed in the recess 22. The upper surface 34 of the movable stage portion 16a is higher than the upper surface 37 of the fixed stage portion 16b. That is, a step S is provided between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b.

  As shown in FIG. 2, the width dimension W of the movable stage portion 16a is set smaller than the length (width dimension) W1 of one side of the chip 11 which is a square. In this case, the first side 23a of the chip 11 protrudes beyond the tip surface 17a of the movable stage portion 16a.

  As shown in FIG. 1, the holding means 15 is constituted by a suction member (collet) 21 having a head 20 that sucks the chip 11. The head 20 is provided with a suction hole in its lower end surface 20 a, and the chip 11 is vacuumed through the suction hole, and the chip 11 is sucked into the lower end surface 20 a of the head 20. For this reason, if this vacuum suction (evacuation) is released, the chip 11 is detached from the head 20.

  The movable stage portion 16a moves along the horizontal direction through a driving mechanism (not shown) while the distal end surface 17a of the movable stage portion 16a is kept parallel to the first side 23a of the chip 11. As the driving machine, various mechanisms such as a reciprocating mechanism and a cylinder mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member can be used.

  A convex portion 50 made of a plate-like member 51 is provided in the recess 22 of the fixed stage portion 16b. That is, as shown in FIG. 2, the convex portion 50 has a long side 51a at the upper end surface set to be substantially the same as the length dimension of the distal end surface 17a of the movable stage portion 16a, and a short side 51b at the protruding portion. The width is set to be smaller than 31. And the convex part 50 is provided between the movable stage part 16a and the fixed stage part 16b, and is arrange | positioned so that the convex part 50 may contact or adjoin to the front end surface 17a of the movable stage part 16a.

  A vertical movement mechanism (not shown) is connected to the convex portion 50, and the convex portion 50 moves up and down independently of the movable stage portion 16a. In addition, as a vertical movement mechanism, various mechanisms, such as a reciprocation mechanism and a cylinder mechanism which consist of a bolt shaft member and a nut member screwed together, can be used.

  The convex part 50 is provided with a negative pressure passage 30 for introducing a negative pressure. The negative pressure passage 30 includes two through holes extending in the vertical direction, and end portions of the through holes serve as suction ports 30 a and 30 b that open to the front end surface 52 side of the convex portion 50. In this case, each suction port 30a, 30b corresponds to the peripheral edge of the chip 11 as can be seen in plan view. A vacuum pump (not shown) is connected to the negative pressure passage 30. That is, by driving the vacuum pump, air can be sucked from the suction ports 30 a and 30 b of the negative pressure passage 30. Thus, the negative pressure passage 30 and the vacuum pump can constitute negative pressure supply means (air suction means).

  Next, a chip peeling method using the chip peeling apparatus shown in FIG. 1 will be described. As shown in FIG. 1A, in a state where the chip 11 is supported by the movable stage portion 16a, at least a part of the peripheral edge portion of the chip 11 (that is, the first side 23a side) is separated from the movable stage portion 16a and the convex portion 50. Make it stick out. Thus, the gap 19 is provided below the protruding portion 31. At this time, the head 20 of the collet 21 is brought into contact with the upper surface of the chip 1, and the chip 11 is vacuum-sucked through the suction hole so that the chip 11 is sucked to the lower end surface 20 a of the head 20.

  In the state of FIG. 1A, the height position of the tip surface 52 of the convex portion 50 is matched with the height position of the upper surface 37 of the fixed stage portion 16b. In this case, the height position of the tip surface 52 of the convex portion 50 is set to a height position of the upper surface 34 of the movable stage portion 16a, a position between the upper surface 34 and the upper surface 37, or various positions. Can do. At this time, the convex portion 50 is raised to bring the suction ports 30a and 30b closer to the chip 11, or the convex portion 50 is lowered to move the suction ports 30a and 30b away from the chip 11 to Adjust the width.

  In the present embodiment, the gap 19 is formed in the lower part of the protruding part 31 of the chip 11, but by raising the convex part 50, the protruding part 31 of the chip 11 is made to move as shown in FIG. Alternatively, the adhesive sheet 12 may be pushed up. By this push-up, the step between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b becomes large.

  By driving the suction means (negative pressure supply means), the air in the gap 19 is sucked through the suction ports 30a and 30b to apply negative pressure. As a result, the peripheral edge of the chip 11 is sucked and the adhesive sheet 12 is peeled off from the peripheral edge of the chip 11.

  Thereafter, as shown in FIG. 1C, the convex portion 50 is lowered while acting a negative pressure. Thereby, the adhesive sheet 12 at the peripheral portion of the chip 11 can be peeled off by the suction force and the lowering of the convex portion 50, and the peeling force of the adhesive sheet 12 at the peripheral portion of the chip 11 is further increased. be able to. In this case, the height position of the front end surface 52 of the convex portion 50 is set lower than the height position of the upper surface 34 of the movable stage portion 16a.

  Next, the movable stage portion 16a is slid through the drive mechanism in the direction of arrow B which is the direction opposite to the protruding side. By this slide, the receiving area of the chip 1 by the movable stage portion 16a is sequentially reduced, and the area of adsorption (suction) downward of the adhesive sheet 12 is increased. At this time, since the chip 11 is held (adsorbed) on the collet 21, the adhesive sheet 12 is sequentially peeled from the chip 11. For this reason, when the front end surface 17a of the movable stage portion 16a is detached from the first side 23a of the chip 11, the adhesive sheet 12 can be completely peeled from the chip 1 to be peeled.

  And after peeling, the chip | tip 11 can be taken out from the adhesive sheet 12 by raising the collet 21 and releasing from the stage 16. FIG. Thereafter, the negative pressure state is released, and the movable stage portion 16a is slid in the direction opposite to the arrow B to return to the state shown in FIG.

  Thereafter, by sequentially associating the chip 11 with the chip peeling device, all the chips 11 on the pressure-sensitive adhesive sheet 12 can be peeled off from the pressure-sensitive adhesive sheet 12 and taken out. Thus, this chip peeling apparatus can be used when manufacturing a semiconductor device. Here, a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices. In addition, it may be in a wafer state on which a circuit is formed, an individual semiconductor chip cut out from the wafer, a wafer divided into a plurality of pieces, or a package in the wafer state. Even if it is, what was packaged in the wafer state may be divided into a plurality of parts, or what was packaged in the wafer state may be cut out to form individual semiconductor elements.

  Further, as shown in FIG. 3A, at least a part of the peripheral edge of the chip 11 (that is, the first side 23a side) protrudes from the movable stage 16a as a position where the chip 11 is placed on the stage 16. And even if it is a case where it does not protrude from the convex-shaped part 50, the chip | tip 11 can be peeled from the adhesive sheet 12, and can be taken out.

  In this case, as shown in FIG. 3B, the convex portion 50 is lowered to form the gap 19 between the peripheral edge portion of the chip 11 and the tip surface 52 of the convex portion 50. In this state, by driving the suction means (negative pressure supply means), the air in the gap 19 is sucked through the suction ports 30a and 30b to apply negative pressure. As a result, the peripheral edge of the chip 11 is sucked and the adhesive sheet 12 is peeled off from the peripheral edge of the chip 11.

  Thereafter, similarly to the above-described method, the movable stage portion 16a can be slid in the direction opposite to the protruding side, and the adhesive sheet 12 can be completely peeled from the chip 1 to be peeled.

  In the present invention, since the negative pressure passage 30 is provided in the convex portion 50 provided between the movable stage portion 16a and the fixed stage portion 16b, the adhesive sheet 12 at the peripheral portion of the chip 11 can be sucked. . In this case, since the negative pressure passage 30 is provided in the convex portion 50 that can move up and down, the suction ports 30a and 30b can be moved up and down. That is, according to the position of the chip 11, the width of the gap 19 between the chip 11 can be adjusted while moving the position of the suction ports 30 a and 30 b up and down by moving the convex part 50 up and down. In the initial stage of peeling, it is possible to peel the adhesive sheet 12 at a part of the peripheral edge of the chip 11 (the protruding portion) without positioning the chip 11 with high accuracy. In addition, the protruding portion 50 can be raised to push up the peripheral edge of the chip 11 to increase the peeling force.

  4 and 5 show a chip peeling apparatus according to a second embodiment of the present invention. In the chip peeling apparatus of the second embodiment, the negative pressure passage 60 is also provided in the fixed stage portion 16b. As shown in FIG. 5, the negative pressure passage 60 is provided with suction ports 60 a and 60 b that open on the first side 23 a side of the tip 11. In this case, each suction port 60a, 60b corresponds to the protruding portion 31 of the chip 11, as can be seen in plan view.

  A vacuum pump (not shown) is connected to the negative pressure passage 60. That is, by driving the vacuum pump, air can be sucked from the suction ports 60 a and 60 b of the negative pressure passage 60. This vacuum pump may be provided separately from the vacuum pump for sucking air from the suction ports 30a and 30b provided in the convex portion 50, or may be provided with a single vacuum pump and the suction ports 30a and 30b. The air may be sucked from both the suction ports 60a and 60b.

  With such a configuration, in addition to the negative pressure passage 30 provided in the convex portion 50, suction can be performed from the negative pressure passage 60 provided in the fixed stage portion 16 b, and the periphery of the chip 11 can be obtained. A large peeling force can be applied to the part.

  FIG. 6 shows a modification of the convex portion 50. In FIG. 6A, the convex portion 50 is composed of a substantially U-shaped plate-like member 53 in plan view. That is, the plate-like member 53 includes a flat plate-like main body portion 53a arranged in parallel with the distal end surface 17a of the movable stage portion 16a, and end piece portions 53b and 53b bent at right angles from the end portions of the flat plate-like main body portion 53a. It consists of. End piece portions 53b and 53b are disposed along the side surface of the distal end surface 17a of the movable stage portion 16a. The front end surface 52 of the convex portion 50 has a U shape in plan view. In FIG. 6A, the negative pressure passage 30 is composed of one through hole, and the suction port 30a has a long hole shape in plan view.

  In FIG. 6B, the convex portion 50 is composed of a pin member 55. In this case, three are arranged at a predetermined pitch along the distal end surface 17a of the movable stage portion 16a. Each pin member 55 is movable up and down. In FIG. 6B, the negative pressure passage 30 is composed of three through holes provided in each pin member 55, and a suction port 30 a is provided in each pin member 55.

  By the way, in the chip peeling apparatus shown in FIG. 1, the movable stage portion 16a only slides. However, the movable stage portion 16a may slide vertically.

  That is, the driving means in this case includes an elevating mechanism part (elevating means) for elevating and lowering the movable stage part 16a, and a slide mechanism part (sliding means) for sliding the movable stage part 16a. The elevating mechanism unit has, for example, a push-up pin, and moves the push-up pin up and down via a reciprocating mechanism. The slide mechanism section (slide means) includes a reciprocating mechanism that slides the elevating mechanism section in a substantially horizontal direction. As the reciprocating mechanism of the lifting mechanism section and the slide mechanism section, various known and publicly available mechanisms such as a reciprocating mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member, a cylinder mechanism, and a linear actuator can be used. .

  If the movable stage portion 16a can be moved up and down, the amount of steps between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b can be changed variously. That is, the movable stage portion can be raised once and lowered to the original position, or the movable stage portion 16a can be raised once and lowered to an intermediate height position higher than the original position.

  By changing in this way, the movable stage portion 16a and the fixed stage portion 16b have a high step, a low step, or the movable stage portion 16a and the fixed stage portion 16b have the same height (that is, a step is provided). Not). In the initial peeling stage, the gap 19 can be increased by increasing the level difference between the movable stage portion 16a and the fixed stage portion 16b. In addition, if the step between the movable stage portion 16a and the fixed stage portion 16b is reduced, it is effective to apply dynamic twisting stress to other adjacent chips 11 when the movable stage portion 16a slides. Therefore, it is possible to reduce the bending applied to other adjacent chips 11.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the suction port 30a provided in the convex portion 50 or the stage 16 can be modified. As the suction port 60 a provided, the size, number, shape, and the like can be arbitrarily set within the air suckable range of the gap 19. One suction port 30a may be provided. Further, the chip 11 to be peeled is not limited to a square, but may be a rectangle having a short side and a long side, or may be a strip having a very long side compared to the short side. . Although the thickness of the pressure-sensitive adhesive sheet 12 differs depending on the suction force or the like, it can be deformed so that it can be peeled off from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). I just need it.

  The thickness of the movable stage portion 16a can be arbitrarily set depending on the range in which the air can be separated from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). Further, the angle of the corner of the movable stage portion 16a is not limited to 90 degrees, and may be somewhat acute or obtuse.

  The number of chips 11 stuck on the pressure-sensitive adhesive sheet 12 is also arbitrary, and in the present invention, all the chips 11 on the pressure-sensitive adhesive sheet 12 can be sequentially peeled without being affected by the number. . The area of the protruding portion 31 of the chip 11 can be variously set within a range in which a peeling force acts on the adhesive sheet 12 when a negative pressure is applied.

  When the plate-like member 51 is used as the convex portion 50, the long side 51a is set to be substantially the same as the length of the movable stage portion 16a as shown in FIG. May be longer or shorter than the length of the movable stage portion 16a. Also, the thickness dimension of the plate-like member 51 may be anything as long as it can be arranged below the protruding portion 31. A plurality of plate-like members 51 may be provided.

  When using the pin member 55 as the convex part 50, in the said embodiment, as shown in FIG.6 (b), the number was three, However, The increase / decrease in the number is arbitrary. The pin member 55 may be a cylindrical body having a circular cross section, a column having an oval or elliptical cross section, a triangular, quadrangular, pentagonal, or more rectangular prism having a cross section. Also good. Moreover, a cylinder may be sufficient. The area of the tip end surface 52 of the pin member 55 can be variously changed within a range in which the protruding portion 31 can be pushed up.

  In the state shown in FIG. 1C, the height position of the tip surface 52 of the convex portion 50 may be matched with the height position of the upper surface 34 of the movable stage portion 16a. Even in such a case, the slide of the movable stage portion 16a is not adversely affected. Moreover, in FIG.1 (b) to FIG.1 (c), the convex-shaped part 50 may fall in the state which does not act a negative pressure.

  The amount of protrusion of the protruding portion 31 of the chip 11 can be arbitrarily set within a range in which the adhesive sheet 12 can be peeled by the action of negative pressure at the initial stage of peeling depending on the size, thickness, material, etc. of the chip 11. .

11 Chip 12 Adhesive sheet 16 Stage 16a Movable stage portion 16b Fixed stage portion 19 Gap 30 Negative pressure passage 31 Overhang portion 50 Protruding portions 51, 53 Plate member 52 Push-up surface 55 Pin member 60 Negative pressure passage

Claims (6)

In the chip peeling device for peeling the chip from the adhesive sheet with the chip attached to the upper surface,
A fixed stage part;
A movable stage portion that has a top surface that is higher than the top surface of the fixed stage portion and slides in a horizontal direction;
The chip to be peeled is made to correspond to the movable stage part, and at least a part of the peripheral part of the chip is made to protrude from the movable stage part, and then negative pressure is applied to the side opposite to the protruding side. Slide means for sliding the movable stage portion in a horizontal direction;
It has a negative pressure passage having a suction port that opens to the front end surface side, is provided between the movable stage portion and the fixed stage portion, and moves up and down in a gap provided below the protruding portion of the chip, A convex portion that adjusts the width of the gap and moves the suction port close to and away from the protrusion in the gap ;
It said chip peeling apparatus characterized by comprising a negative pressure supply means for applying a negative pressure through the negative pressure passage.   The chip peeling apparatus according to claim 1, wherein the convex portion is lowered while applying a negative pressure.   3. The chip peeling apparatus according to claim 1, wherein a negative pressure passage that applies a negative pressure to a gap formed by a protruding portion of the chip is provided in the fixed stage portion.   The chip peeling apparatus according to any one of claims 1 to 3, wherein the convex portion is configured by a pin member or a plate-like member. In the chip peeling method for peeling the chip from the adhesive sheet with the chip attached to the upper surface,
A chip having a fixed stage part and an upper surface higher than the upper surface of the fixed stage part, and a movable stage part that slides in a horizontal direction, the chip to be peeled off corresponding to the movable stage part; and A step of installing so that at least a part of the peripheral edge of the chip protrudes from the movable stage part;
A convex part provided between the movable stage part and the fixed stage part and provided with a negative pressure passage provided with a suction port opening on the front end surface side is moved up and down to be provided below the protruding part of the chip. Adjusting the width of the gap and making the suction port approach and separate from the protruding portion in the gap ;
A step of applying a negative pressure through a negative pressure passage provided in the convex portion;
And a step of sliding the movable stage portion in a direction opposite to the protruding side.   6. The chip peeling method according to claim 5, wherein the convex part is lowered while acting a negative pressure.

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