JPH0661279A - Device for picking up semiconductor pellet - Google Patents

Abstract

PURPOSE:To surely peel a semiconductor pellet off a wafer tape. CONSTITUTION:This is a semiconductor pellet 10 picking up device, which picks up a semiconductor pellet 10 by vacuum suction from a semiconductor wafer 6 by means of a collet 3, interlocking with the press of a pushup piece 8 from below a wafer tape 17 where a semiconductor wafer 6 is stuck, and the vicinity of the semiconductor pellet 10 to become the object of pickup is pressed, and also a presser 4 made of elastic material is arranged next to the collet 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for picking up semiconductor pellets after dicing from a wafer tape, and more particularly to a technique effective for picking up semiconductor pellets after dicing from a wafer tape by vacuum suction of a collet. It is a thing.

[0002]

2. Description of the Related Art Conventionally, in a dicing process in which a semiconductor wafer that has completed a preceding process of an LSI process is finely cut and divided into individual semiconductor pellets, a wafer tape is attached to the back surface of the semiconductor wafer and the cut semiconductor is cut. We are trying to prevent the pellets from moving and scattering. When the dicing is completed, each semiconductor pellet is pushed up from the wafer tape side by the needle of the push-up piece to separate each pellet.

[0003]

According to the study by the present inventor, in the conventional technique of pushing up each semiconductor pellet from the wafer tape side with a needle, the elasticity of the wafer tape increases as the number of push-ups increases. However, there is a problem that the semiconductor pellet remains on the wafer tape without being picked up even if the push-up is normally performed. In order to solve this problem, it is conceivable to lengthen the needle of the push-up piece, but if it is too long, the needle will break and normal pick-up cannot be performed, and this is not a solution.

Therefore, an object of the present invention is to provide a technique for reliably peeling a semiconductor pellet from a wafer tape.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0006]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, a semiconductor pellet pickup device for picking up semiconductor pellets from the semiconductor wafer by vacuum suction by a collet in conjunction with pressing of a push-up piece from the bottom of a wafer tape to which a semiconductor wafer is adhered. The semiconductor wafer in the vicinity of the semiconductor pellet is pressed and a pressing tool made of a material having elasticity is arranged adjacent to the collet.

[0008]

According to the above-mentioned means, the press tool provided along with the collet presses the vicinity of the semiconductor pellet to be picked up in association with the push-up operation by the push-up piece and the pickup operation of the semiconductor pellet by the collet.
Facilitates peeling of semiconductor pellets from the wafer tape. Therefore, the elasticity of the wafer tape can be reduced and the pickup of the semiconductor pellet can be ensured.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a front view showing an embodiment of a semiconductor pellet pickup device of the present invention.

Two spacers 2 are attached to the tip of a swing arm 1 for lifting the semiconductor pellets 10, a rubber collet 3 is attached to one tip of the spacer 2, and a rubber collet 3 is attached to the other tip. The pressing tool 4 is attached. Here, the lower surface of the collet 3 is set so as to be located below the lower surface of the retainer 4.
The center of the collet 3 is hollow and communicates with the vacuum hose 5 through the spacer 2. A semiconductor wafer 6 is disposed so as to be able to come into contact with the collet 3, and this semiconductor wafer 6
A wafer tape 7 is attached to the lower surface (back surface) of the.
Further, a push-up piece 8 is disposed on the lower surface of the wafer tape 7 so as to be able to come into contact therewith. This push-up piece 8 has a plurality of needles 8
In addition to the a being erected, a vacuum suction function is provided, and a vacuum hose 9 is connected to realize this.
A vacuum pump (not shown) is connected to the vacuum hose 5 and the vacuum hose 9.

In the above structure, the semiconductor pellet 10
When pushing up, the swing arm 1 is first set right above the semiconductor pellet 10 to be picked up on the semiconductor wafer 6. Then, the push-up piece 8 is set from the lower portion of the wafer tape 7 to a position facing the semiconductor pellet 10 to be picked up, and the push-up piece 8 is pushed up. Along with this operation, the attached needle 8a pushes up the wafer tape 7, and the inside of the push-up piece 8 is evacuated via the vacuum hose 9, so that the wafer tape 7 around the semiconductor pellet 10 to be picked up is vacuumed.
At the same time, the collet 3 comes into contact with the corresponding semiconductor pellet 10, and the periphery of the semiconductor pellet 10 is vacuumed. At the same time as pushing up, the pressing tool 4 presses the surface of the semiconductor wafer 6. When the swing arm 1 is raised in this state, only the semiconductor pellets 10 to be picked up are peeled off from the wafer tape 7 and transported.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, although the retainer is made of rubber, it can be replaced with another material having elasticity.

[0014]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, a semiconductor pellet pickup device for picking up semiconductor pellets by vacuum suction from the semiconductor wafer by a collet in conjunction with pressing of a push-up piece from below the wafer tape to which the semiconductor wafer is adhered. Since the pressing tool made of a material having elasticity is arranged adjacent to the collet while pressing the semiconductor wafer in the vicinity of the semiconductor pellet, the elasticity of the wafer tape is reduced, and the semiconductor Pellet pickup can be ensured.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a semiconductor pellet pickup device according to the present invention.

[Explanation of symbols]

 1 Swing Arm 2 Spacer 3 Collet 4 Holding Tool 5 Vacuum Hose 6 Semiconductor Wafer 7 Wafer Tape 8 Push-up Piece 8a Needle 9 Vacuum Hose 10 Pellet

Claims (2)

[Claims] 1. A semiconductor pellet pick-up device for picking up semiconductor pellets by vacuum suction from the semiconductor wafer by a collet in conjunction with pressing of a push-up piece from the lower part of a wafer tape to which a semiconductor wafer is adhered. A semiconductor pellet pick-up device, characterized in that a semiconductor wafer in the vicinity of the semiconductor pellet is pressed and a pressing tool made of a material having elasticity is disposed adjacent to the collet. 2. The pickup device for semiconductor pellets according to claim 1, wherein a vacuum suction function is added to the push-up piece.