JPH05152418A - Chip picking-up device - Google Patents

Abstract

PURPOSE:To reduce a chip picking-up error and tied chips and to reduce that a chip is damaged by silicon scraps. CONSTITUTION:An entitled device is constituted in the following manner: a collet 5 which can be moved up and down and whose inside diameter is a little larger than a chip is attached to a spindle 4 which can be moved up and down; and it is pressed downward by using a compression spring 8. In addition, the entitled device is constituted in the following manner: an outer collet 7 can be evacuated; nitrogen or dry air is discharged through the spindle 4; at the same time, the outer collet 7 is evacuated; and silicon scraps can be removed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip pickup device used for die bonding in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional pickup device of this type. In FIG. 4, 1 is an arm, 2 is a housing connected to the arm 1, 3 is a linear bearing built in the housing 2, Reference numeral 4 denotes a spindle which engages with the linear bearing 3 and moves up and down, 5 denotes a collet connected to the tip of the spindle 4, and 6 denotes a compression spring for pressing the spindle 4 downward.

Next, the operation will be described. The chip pickup device moved onto the chip is not shown,
By a vertical movement mechanism (for example, a ball screw + motor, an air cylinder, or the like) connected to the arm 1, the collet 5 comes down to come into contact with the tip and further press it for a minute distance. At this time, since the spindle 4 is pressed downward by the compression spring 6, the spindle 4 is in contact with the chip while applying a certain load. After that, vacuum suction A is performed through the center hole 4a of the spindle 4, the chip 1 is sucked, the arm 1 moves upward, and the chip is peeled from the adhesive sheet, and the chip pickup operation is completed.

[0004]

Since the conventional pickup device is constructed as described above, when the chip is peeled off from the adhesive sheet, the entire sheet is lifted,
There was a problem that the chips did not come off, a chip pickup error occurred, and adjacent chips were picked up in a row.

Further, when the chip is sucked by the collet,
There were problems such as scratches on the chip due to silicon scraps remaining on the chip.

The present invention has been made to solve the above problems, and an object thereof is to eliminate chip pick-up errors and continuous chips.

Also, the silicon scraps on the chip are removed,
The purpose is to eliminate the scratches caused by the implantation of silicon debris into the chips during chip adsorption.

[0008]

In the chip pickup device according to the present invention, the spindle part is provided with an outer collet for pressing an adjacent chip, and the outer collet is pressed downward by a spring, whereby the spindle On the other hand, it can be moved up and down.

Further, a mechanism capable of vacuuming is added to the outer collet.

[0010]

The chip pickup device according to the present invention is
By pressing the adjacent chip with the outer collet, the chip to be picked up can be easily peeled off from the adhesive sheet.

Further, the chip pickup device according to the present invention holds down adjacent chips and removes silicon scraps or the like on the chip to be picked up,
Facilitates the peeling of the chip from the adhesive sheet.

[0012]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numerals 1 to 5 are the same as or equivalent to those of the conventional example, 6 is a compression spring suspended between the upper step portion 4b of the spindle 4 and the housing 2, and 7 is the spindle. An outer collet that engages with the lower step portion 4c of 4 and a compression spring 8 that is hung between the outer collet 7 and the housing 4 and presses the outer collet downward.

2A to 2C are process diagrams for explaining the operation of the above embodiment. In FIG. 10A, the device is directly above the chip 11 to be picked up. Note that 9 is a push-up pin that normally operates to assist the pickup of the chip. Next, in FIG. 8B, the present apparatus descends, the outer collet 7 first presses the adjacent chip 12, the spindle 4 descends as it is, and at the same time, the chip 11 is pushed up by the push-up pin 9 and vacuum is performed. The target chip 11 is about to be peeled off from the adhesive sheet 13. Next, FIG. 7C shows a state in which the present apparatus is lifted to adsorb the chip 11, the outer collet 7 is returned to the original position, and the push-up pin 9 is also returned to the original position.

Example 2. FIG. 3 shows another embodiment of the present invention. In the drawing, 7a is a convex portion provided on the side surface of the outer collet 7 and having a hole 7b for vacuuming, 11 is a chip to be sucked, and 12 is its tip. Adjacent chips, 14 are silicon scraps on the chip 11. The others are the same as those in the first embodiment.

Next, the operation of the above embodiment will be described.
When the apparatus descends from the same state as in FIG. 2a and becomes the state in FIG. 3, first, nitrogen or dry air B is blown from the hole 4a for vacuuming through the spindle 4 as shown by an arrow,
At the same time, vacuum drawing A is performed from the convex portion 7a of the outer collet 7. As a result, after removing the silicon waste 14,
B) to step c).

[0016]

As described above, according to the present invention, since the adjacent chips can be pressed and picked up, the chip pick-up error and the number of continuous chips are reduced, and the continuous operation time is lengthened.

Further, according to the present invention, since silicon debris is removed from the chip, there is an effect that a high quality product can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional side view of a chip pickup device according to an embodiment of the present invention.

FIG. 2 is a sectional process drawing showing a process of the present invention.

FIG. 3 is a sectional side view of a chip pickup device according to another embodiment of the present invention.

FIG. 4 is a cross-sectional side view showing a conventional chip pickup device.

[Explanation of symbols]

 1 arm 2 housing 3 linear bearing 4 spindle 5 collet 6 compression spring 7 outer collet 8 compression spring 9 push-up pin 11 chip to be adsorbed 12 adjacent chip 13 adhesive sheet 14 silicon waste

Claims (2)

[Claims] 1. A collet for adsorbing a chip from a wafer, a spindle connected to this collet and vertically moved by being guided by a guide, and a spindle having a vacuum suction hole, and a vertically movable engagement with this spindle. A chip pickup device, comprising: an outer collet protruding from the collet; and a compression spring that presses down each of the spindle and the outer collet. 2. The chip pickup device according to claim 1, wherein a vacuuming mechanism is added to the outer collet.