JPH04340729A - Die bonder - Google Patents

Abstract

PURPOSE:To obtain a die bonder provided with a chip peeling mechanism capable of easily preventing the generation of cracks due to contact with an adjacent semiconductor chip when a chip is peeled from a tape, regarding the improvement of a semiconductor chip peeling mechanism of a die bonder. CONSTITUTION:In a die bonder which vacuum-sucks a plurality of semiconductor chips 9 stuck on a tape 8 surface whose peripheral parts are retained using a collet chuck, and conveys the chips 9, a spherical chuck 4 is provided, which is made to abut against the tape 8 rear, stretches the tape, and widens the interval between semiconductor chips 9.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a semiconductor chip peeling mechanism of a die bonder. In recent years, die bonders that mount semiconductor chips into semiconductor packages use a method in which a semiconductor substrate is attached to a tape and when the divided semiconductor chips are peeled off from the tape, the semiconductor chips are pushed up using push-up pins that pass through the tape. However, during this push-up, a problem arises in that chips occur due to contact with adjacent semiconductor chips.

Under the above circumstances, there is a need for a die bonder that can prevent chipping caused by contact with an adjacent semiconductor chip that occurs when a semiconductor chip is peeled off from the attached tape.

0003

2. Description of the Related Art A semiconductor chip peeling mechanism of a conventional die bonder will be explained with reference to FIG. FIG. 6 is a diagram showing a case where a semiconductor chip is attracted by a semiconductor chip peeling mechanism of a conventional die bonder. Semiconductor chip 9 as shown in the figure
The ring 7 to which the peripheral part of the tape 8 to which the
3, and while the position of the semiconductor chip 9 is monitored by the camera 32, the semiconductor chip 9 to be attracted to the collet chuck 31 and conveyed is moved to the position directly below the collet chuck 31 using the XY stage 36.

The tape 8 is brought into contact with a pick-up table 34 whose contact surface with the tape 8 is flat, and the tape 8 is adsorbed by vacuum to this contact surface. Push up the attached semiconductor chip 9 through the upper collet chuck 31.
are transported by vacuum suction.

[0005]

[Problems to be Solved by the Invention] In the conventional die bonder described above, as shown in FIG. 6, the tape 8 to which the semiconductor chip 9 is attached is vacuum-adsorbed onto the surface of the pickup table 34, which has a flat surface, and the push-up pins 35 and vacuum suction with collet chuck 31,
Since the spacing between the semiconductor chips 9 is very narrow, if the heights of the tips of the push-up pins 35 are not on the same plane, the semiconductor chips 9 will tilt and come into contact with adjacent semiconductor chips 9 during push-up, resulting in chipping. There was a problem in that this occurred.

In view of the above-mentioned circumstances, the present invention provides a chip peeling mechanism that can easily prevent chips from coming into contact with adjacent semiconductor chips when peeling a semiconductor chip from a tape. The purpose of this product is to provide a die bonder.

[0007]

[Means for Solving the Problems] The die bonder of the present invention is a die bonder that transports a plurality of semiconductor chips attached to the surface of a tape whose peripheral portions are supported by vacuum suction using a collet chuck, by pressing the chips from the back surface of the tape. The device is configured to include a spherical chuck for stretching the tape and increasing the distance between the semiconductor chips.

[0008]

[Operation] That is, in the present invention, when the semiconductor chip 9 attached to the surface of the tape 8 whose peripheral part is attached to the ring 7 is vacuum-chucking and conveyed by the collet chuck 1 as shown in FIG. By pressing the tape 8 from the back side, the tape 8 is stretched to increase the distance between the semiconductor chips 9, and at the same time, the peripheral part of the semiconductor chip 9 is peeled off from the tape 8, and in this state, the tape 8 is
is vacuum-adsorbed onto the surface of the spherical chuck 4, and the semiconductor chip 9 whose periphery has been peeled off from the tape 8 can be vacuum-adsorbed by the upper collet chuck 1.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described in detail below with reference to FIGS. 2 and 3, and a second embodiment of the present invention will be described with reference to FIGS. 4 and 5.

FIG. 2 is a diagram showing a semiconductor chip peeling mechanism of a first embodiment of the present invention in which a semiconductor chip at the center of the semiconductor chip peeling mechanism is sucked, and FIG. FIG. 6 is a diagram showing a case where a semiconductor chip at an end of a chip peeling mechanism is sucked.

In the first embodiment, as shown in FIG. 2, a groove of 10 mm x 10 mm is cut with a groove width of 0.2 μm.
The ring 7 to which the peripheral part of the tape 8 with the semiconductor chip 9 attached is fixed to the ring installation part 13 fixed to the XY stage 16 at the bottom, and while monitoring the position of the semiconductor chip 9 with the camera 12, This XY stage 16
The semiconductor chip 9 to be conveyed by vacuum suction to the collet chuck 11 is moved directly below the collet chuck 11.

By pressing a pickup table 14 whose surface has a radius of curvature of 130 mm against this tape 8, as shown in FIG. The peripheral portion is peeled off from the tape 8, and the tape 8 is vacuum-adsorbed.

In this state, a push-up pin 15 passing through a through hole 14a provided in the pickup table 14 pierces this tape 8 and pushes up the semiconductor chip 9, and the collet chuck 11 on the upper part vacuum-chucks the semiconductor chip 9 and transports it.

FIG. 2 shows a case where the semiconductor chip 9 is located at the center of the tape 8, but the semiconductor chip 9 is located at the center of the tape 8.
If the semiconductor chip 9 is attached to the end of the collet chuck 1, move the ring installation part 13 using the XY stage 16 as shown in FIG.
1 and transported by vacuum suction.

FIG. 4 is a diagram showing a semiconductor chip peeling mechanism of a second embodiment of the present invention in which a semiconductor chip at the center of the semiconductor chip peeling mechanism is sucked, and FIG. FIG. 6 is a diagram showing a case where a semiconductor chip at an end of a chip peeling mechanism is sucked.

In the second embodiment, as shown in FIG. 4, a ring 7 to which a peripheral portion of a tape 8 to which a semiconductor chip 9 is pasted is attached to a groove 24 provided around a spherical chuck 24.
The protrusion 23a that engages with the ring a is fixed to the ring installation part 23 provided inside.

The radius of curvature of the surface of this spherical chuck 24 is 100 mm, and it is mounted on an XY stage 26.
It is provided on a spherical stage 25 that can swing in two directions, X and Y, along the same radius of curvature as the radius of curvature of the surface of this spherical chuck 24 .

While monitoring the position of the semiconductor chip 9 with the camera 22, the central semiconductor chip 9 stuck to the tape 8 is moved by the XY stage 26 to just below the collet chuck 21.

By raising the spherical chuck 24 and pressing it against the tape 8, the tape 8 is stretched as shown in FIG. 8 and adsorbs the tape 8.

In this state, the semiconductor chip 9 is brought close to the upper collet chuck 21, and the semiconductor chip 9 is vacuum-adsorbed by the collet chuck 21 and transported. Although FIG. 4 shows the case where the semiconductor chip 9 is located at the center of the tape 8,
When the semiconductor chip 9 is attached to the end of the tape 8, the spherical chuck 24 is moved using the spherical stage 25 as shown in FIG. The chip 9 is brought close to the upper collet chuck 21, and the semiconductor chip 9 is attracted and conveyed by the collet chuck 21.

In this way, since the tape 8 is stretched by pressing the pick-up table 14 or the spherical chuck 24 against the tape 8, the distance between the semiconductor chips 9 attached to the tape 8 is increased, and at the same time, the periphery of the semiconductor chips 9 is The semiconductor chip 9 can be peeled off from the semiconductor chip 9.
It is possible to prevent chipping from occurring due to contact with the adjacent semiconductor chip 9 when the semiconductor chip 9 is attracted to the collet chuck.

[0022]

As is clear from the above description, according to the present invention, by simply changing the structure, the distance between the semiconductor chips attached to the tape can be increased, and at the same time, the peripheral part of the semiconductor chip 9 can be separated from the tape 8. Since it can be peeled off,
It is possible to provide a die bonder which has the advantage of being able to prevent chipping from occurring when a semiconductor chip is picked up by a collet chuck, and which can be expected to have significant economic and reliability effects.

[Brief explanation of drawings]

[Figure 1] Diagram explaining the principle of the present invention,

[Figure 2]
A diagram showing a case where a semiconductor chip at the center of the semiconductor chip peeling mechanism of the die bonder according to the first embodiment of the present invention is sucked;

FIG. 3 is a diagram showing a case where a semiconductor chip at the end of the semiconductor chip peeling mechanism of the die bonder of the first embodiment of the present invention is sucked;

FIG. 4 is a diagram showing a case where a semiconductor chip at the center of the semiconductor chip peeling mechanism of the die bonder according to the second embodiment of the present invention is attracted;

FIG. 5 is a diagram showing a case where a semiconductor chip at an end of a semiconductor chip peeling mechanism of a die bonder according to a second embodiment of the present invention is sucked;

[Fig. 6] A diagram showing a case where a semiconductor chip is adsorbed by a semiconductor chip peeling mechanism of a conventional die bonder.

[Explanation of symbols]

1, 11, 21 are collet chucks, 3, 13, 23 are ring installation parts 23a is a protrusion; 4, 24 are spherical chucks, 24a is a groove; 7 is a ring, 8 is tape, 9 is a semiconductor chip, 12 and 22 are cameras, 14 is a pickup table, 14a is a through hole; 15 is a push-up pin, 16 and 26 are XY stages 25 is a spherical stage,

Claims (3)

[Claims] [Claim 1] In a die bonder that transports a plurality of semiconductor chips (9) attached to the surface of a tape (8) whose peripheral portion is supported by vacuum suction using a collet chuck (1), the tape (8) is pressed from the back side. By stretching the tape (8), the semiconductor chip (
9) A die bonder characterized in that it is equipped with a spherical chuck (4) for increasing the distance between the dice. 2. The die bonder according to claim 1, wherein the spherical chuck (4) includes a spherical pickup table (14) that stretches the tape (8) by pressing it from the back side of the tape (8); A through hole (14a) provided in the pickup table (14)
A die bonder comprising a push-up pin (15) that passes through the tape (8) and pushes up the semiconductor chip (9), and is movable by an XY stage (16). 3. The die bonder according to claim 1, wherein the spherical stage (24) is mounted with the spherical chuck (24).
25) and an XY stage (26) on which the spherical stage (25) is mounted, and the spherical chuck (24) is movable on the spherical stage (25) by the XY stage (26). A dice bonder characterized by: