JPH05243375A - Die picking-up method and collet - Google Patents

Abstract

PURPOSE:To achieve that a die which is slender like a one-dimensional CCD line sensor and whose surface cannot be brought into direct contact can be picked up stably form a wafer sheet. CONSTITUTION:Surface contact areas are formed on both ends in the lengthwise direction of a die 1; the areas are brought into contact with, and held by, a collet 2; the die 1 is picked up from a wafer sheet 3. Since the die 1 is slender and its strength is weak, it is deformed largely when it is picked up. Since a relief 2c is formed in the collet 2, the photodetection face on the surface of the die does not come into contact with the collet and since the surface is brought into contact and supported, the die is not turned and can be picked up stably.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling method for assembling an elongated die such as a one-dimensional CCD line sensor, and more particularly to a die pickup method and a collet for picking up a die from a wafer sheet.

[0002]

2. Description of the Related Art In general, a die pick-up is performed by dividing a wafer stuck on a wafer sheet into individual dies, positioning the dies individually, adsorbing and holding them with a collet, and pushing up from the lower side of the wafer sheet. Push up with a needle,
Remove the die from the sheet and transfer.

The collets used here are roughly classified into two types. One is a surface collet that comes into contact with the surface of the die and adsorbs and holds the die, and the other is a taper portion that is provided corresponding to two or four opposite sides of the die and comes into contact with the edge portion of the die. It is a two-sided or four-sided (pyramidal) collet (hereinafter referred to as a taper collet) that sucks and holds a die.

Conventionally, a one-dimensional CCD line sensor has a light receiving portion arranged on the surface of a die, and unlike other semiconductor elements such as a memory, a passivation film is not formed on the surface, so that the wiring is exposed. However, there was a problem that the surface could not be adsorbed by the collet, and the taper collet was used for the pickup.

Further, in order to hold the die with the taper portion of the collet at the time of pickup, it is necessary for the taper portion of the collet to enter the gap between the dies. Of 25
The work of expanding from about 70 μm to about 200 to 400 μm was also performed.

[0006]

Recently, the one-dimensional CCD line sensor has become longer and thinner in order to improve the manufacturing technique and the yield per wafer. For example, for mass-produced products, width 0.65 mm x length 35 mm x
Thickness 0.4 mm, width 0.8 in the case of currently considering commercialization
mm × length 80 mm × thickness 0.4 mm.

Therefore, when a die is picked up from a wafer sheet, since the taper collet is used, the die, which is one of the conventional purposes of using the taper collet, slips at the taper portion, the position of the die can be corrected, and stable pickup is performed. On the contrary, the advantage of being able to do is that the width of the die is narrow, so the die rotates smoothly and cannot pick up stably.

Further, even if the area for contacting the surface collet is simply provided and the surface collet is used, if the area is provided on the short side, the width of the die becomes wider (for example, 400 on one side.
If an area of μm is provided, the width is 0.65 mm → 1.45 m
m, width 0.8 mm → 1.6 mm) The yield per wafer of dies is drastically reduced. Therefore, if the area is provided on the long side, the yield is almost the same, but since the die is thin and the strength is weak, the die is greatly deformed at the time of pickup,
There is a problem that the collet is contacted by the light-receiving part of the die and scratches.

An object of the present invention is to provide a die pick-up method and collet for stably picking up a die such as a one-dimensional CCD line sensor which is long and narrow and cannot directly contact the surface of the die.

[0010]

In order to achieve the above-mentioned object, a die pick-up method according to the present invention is a die pick-up method for picking up long and narrow dies individually from a wafer sheet. A suction area in which a region is formed is provided, and a collet is brought into contact with only the area to hold the die for pickup.

In the suction area, wirings such as alignment patterns and inspection wirings which are unnecessary after the semiconductor device is assembled are provided.

Further, the collet according to the present invention is a collet used in a die pickup method for individually picking up elongated dies from a wafer sheet. The collet is a portion for contact-holding suction areas at both ends of the die and a collet at the time of pickup. When the center of the die rises due to the deformation of the die, the taper portion receives the edge of the center with the tapered surface.

[0013]

Function: Adsorption areas of 400 μm or more are provided on both ends in the longitudinal direction of the die surface, and only the areas are held in contact with the surface collet, and the die edge is received by the collet taper portion when the die is deformed.

[0014]

The present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing a die pickup state in Embodiment 1 of the present invention.

In FIG. 1, the die 1 has four ends on both sides in the long side direction.
It has a contact area of 00 μm, is attached to the wafer sheet 3, is divided into individual pieces, and is positioned at the pickup position by a wafer sheet holding ring and a die positioning mechanism (not shown).

A plurality of push-up needles 5 for pushing up the center of the short side of the die 1 are arranged in the direction of the long side of the die, held by a needle holder 6 and controlled to operate in synchronization with the collet 2. ing.

The sheet suction holders 4a and 4b are connected to a suction device so as to hold the push-up needle 5 and the needle holder 6 in a vertically movable state and suck and hold the wafer sheet 3 by vacuum suction.

The collet 2 is 400 μm on each end of the die 1.
Has a contact portion 2b corresponding to the contact area of
The die 1 is suction-held by the vacuum suction hole 2a provided in the b.

The collet 2 is provided with a relief 2c so that the collet 2 and the die 1 do not come into contact with each other even when the die 1 is deformed into an arc shape during pickup. It has been found that this clearance may be about 0.4 mm to 0.5 mm at the center depending on the strength and deformation of the die.

Next, the pickup method will be described step by step. The die 1 is positioned at the pickup position, and the wafer suction holder 4a, 4b sucks and holds the wafer sheet 3.

After that, the collet 2 is moved, brought into contact with the die 1, and held by suction.

The collet 2 and the push-up needle 5, that is, the needle holder 6 are synchronously moved upward to separate the die 1 from the wafer sheet 3. At this time, since the wafer sheet 3 is suction-held by the sheet suction holder, the push-up needle 5
There is an effect that only the place where the push-up is performed is deformed, and the die 1 is supported at the points, so that the die 1 can be easily peeled off from the wafer sheet 3.

Here, in the contact areas at both ends of the die 1,
Circuits and wiring that are unnecessary after assembly as a semiconductor device, such as circuits for alignment and circuits for measuring electrical characteristics,
Providing what was conventionally placed in the die has the advantage that the contact area can be provided with almost no change in die size.

Further, since the surface collet is used, the die does not rotate, and stable pickup can be performed. In addition, when picking up, the gap between the dies is 200 to 400 μm.
There is an advantage that it is not necessary to provide an interval such as m, and the work of enlarging the sheet can be omitted.

(Embodiment 2) FIG. 2 is a sectional view of a collet used in Embodiment 2 of the present invention.

The collet 2'has a contact portion 2'b and a vacuum suction hole 2'a, and also has a taper portion 2'c at the center in the longitudinal direction, so that even if the die is deformed during pickup, the taper portion 2'is formed. The edge of the die can be received at'c.

In this case, since there is no need for a clearance on the lower surface of the collet and the collet can be made flat, a plurality of vacuum suction holes for die suction can be provided in the longitudinal direction of the die, and the die holding force of the collet is higher than that of the first embodiment. It has the advantage of being strong.

Further, the taper portion 2'c does not have to be in contact with the die at the time of pickup and may be provided above the die surface (preferably 0.2 mm above), so that it can be used similarly to the surface collet. The sheet enlargement is not required as in the first embodiment.

[0030]

As described above, according to the present invention, since the contact areas of 400 μm or more are provided at both ends in the longitudinal direction of the die, even if the die is long and narrow like the one-dimensional CCD line sensor and the surface cannot directly contact, the surface collet can be formed. There is an effect that it can be used and can be picked up stably.

[Brief description of drawings]

FIG. 1 is a sectional view showing a die pickup state according to a first embodiment of the present invention.

2A is a sectional view showing a collet used in Embodiment 2 of the present invention, and FIG. 2B is a sectional view taken along line BB ′ of FIG.

[Explanation of symbols]

 1 die 2, 2'collet 2a, 2'a vacuum suction hole 2b, 2'b contact part 2c escape 2'c taper part 3 wafer sheet 4a, 4b sheet suction holder 5 push-up needle 6 needle holder

Claims (3)

[Claims] 1. A die pickup method for individually picking up elongated dies from a wafer sheet, wherein adsorption areas having active areas are provided at both longitudinal ends of a die surface, and a collet is brought into contact with only the areas. A die pick-up method comprising holding and picking up. 2. The die pick-up method according to claim 1, wherein wirings which are unnecessary after the semiconductor device is assembled, such as alignment patterns and inspection wirings, are provided in the suction area. 3. A collet for use in a die pickup method for individually picking up an elongated die from a wafer sheet, wherein the collet has a portion that holds the suction areas at both ends of the die in contact with each other and a die central portion due to deformation of the die during pickup. A collet characterized by having a taper portion in which the edge of the central portion is received by the taper surface when it rises.