JP3484936B2 - Method and apparatus for handling chip-shaped parts - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for handling chip-shaped parts, and in particular, it is held by an adhesive property while being arranged on a holding sheet having expandability and having an adhesive surface formed on the surface thereof. The present invention relates to a method and an apparatus for peeling a plurality of chip-shaped components that are present from a holding sheet.

[0002]

2. Description of the Related Art For example, in the technical field of manufacturing chip-shaped electronic components, it is known to take out a plurality of chip-shaped electronic components such as semiconductor chips by cutting a mother body such as a semiconductor wafer with a dicer or the like. Has been. Further, when carrying out such a step, a mother body is placed on a holding sheet having expandability and having an adhesive surface formed on the surface thereof, and the mother body is held by the adhesiveness of the adhesive surface, and the dicer is used. It is also known to apply the above to cut so as to obtain a plurality of chip-shaped electronic components.

The plurality of chip-shaped electronic components thus obtained are then picked up from the holding sheet,
It is supplied to the next step, but at least at the time of this pick-up, each chip-shaped electronic component must be peeled from the holding sheet in the main part while being adhered and positioned in the holding sheet in a part thereof. I won't. This is because the pickup is usually performed by using a movable vacuum suction chuck or the like, but if each chip-shaped electronic component is not appropriately peeled from the holding sheet, the pickup will be hindered.

An apparatus for handling chip-shaped electronic components, which can perform the above-mentioned holding sheet peeling at high speed and efficiently, is described in, for example, Japanese Patent Application Laid-Open No. 5-335405. The publication describes a mounting table for a semiconductor wafer, which has a structure as shown in FIG. With reference to FIG. 5, the mounting table 1 has a plurality of semiconductors having expandability and held by the adhesiveness provided by the adhesive surface 2 while being arranged on the holding sheet 3 having the adhesive surface 2 formed on the surface thereof. It is used for peeling the chip 4 from the holding sheet 3. In this way, a plurality of semiconductor chips 4
The holding sheet 3 holding the is placed on the placing table 1.

The mounting table 1 has a plurality of suction grooves 5 distributed so as to cover a region facing each semiconductor chip 4, and at least 2 for each semiconductor chip 4 between the plurality of suction grooves 5. The protrusions 6 are formed so as to be partially opposed to each other at some points. On the mounting table 1,
Further, a suction hole 7 communicating with each suction groove 5 is provided.

In such a structure, each suction groove 5 is passed through a suction hole 7 from a vacuum source such as a vacuum pump (not shown).
When a negative pressure 8 is applied to the holding sheet 3, the holding sheet 3 is deformed along the protrusions 6, whereby each semiconductor chip 4 is
The main part is peeled off from the holding sheet 3. The semiconductor chips 4 peeled off from the holding sheet 3 as described above are picked up from the holding sheet 3 by a vacuum suction chuck or the like (not shown) and supplied to the next step.

[0007]

However, the handling of the semiconductor chip 4 using the mounting table 1 described above has the following problems. Since each semiconductor chip 4 has a size that straddles a plurality of suction grooves 5 defined by the protrusions 6, the peeling of the holding sheet 3 for one semiconductor chip 4 is performed by the plurality of suction grooves 5. Occurs independently in each part facing each other. Therefore, although the negative pressure 8 is applied to the plurality of suction grooves 5 at the same time, the time when the holding sheet 3 is peeled off from the semiconductor chip 4 is often different for each portion facing each of the suction grooves 5. In some cases, the order of peeling that occurs in each portion facing each of the suction grooves 5 is usually various.

As a result, when the peeling of the holding sheet 3 for a certain semiconductor chip 4 is delayed most, for example, at a part of the peripheral edge of this semiconductor chip 4, as shown by the phantom line in FIG. The semiconductor chip 4 may be in a posture of relatively rising with the delayed peripheral edge as a fulcrum. In addition, when the semiconductor chip 4 stands up, its orientation and inclination angle are usually not constant.

It should be noted that such rising is unlikely to occur when the semiconductor chip 4 is relatively large, but is likely to occur when the dimensions are extremely small, for example, 6.7 mm × 0.5 mm × 0.3 mm. . If the semiconductor chip 4 takes such a rising posture, it may fail to pick up the semiconductor chip 4 in the pickup process using the vacuum suction chuck or the like described above, or the posture at the time of pickup may be unsuitable even if the pickup is performed. It causes a problem that it causes trouble in the next process.

Therefore, an object of the present invention is to provide a method and an apparatus for handling chip-shaped parts, which can solve the above-mentioned problems.

[0011]

SUMMARY OF THE INVENTION According to the present invention, first, a plurality of chip-shaped chips having expandability and held by the adhesiveness provided by the adhesive surface while being arranged on a holding sheet having an adhesive surface formed thereon. Parts are handled so as to be peeled off from the holding sheet, and are directed to a method for handling chip-shaped parts, in order to solve the above-mentioned technical problem,
It is characterized by including the following steps.

That is, the chip-shaped component handling method according to the present invention has a plurality of suction grooves distributed so as to cover at least the respective regions facing each chip-shaped component, and between the plurality of suction grooves. A first step of preparing a mounting table on which projections are formed so as to partially oppose each chip-shaped component at least, and a holding sheet holding a plurality of chip-shaped components The method includes a second step of mounting on a mounting table, and a third step of applying a negative pressure to the suction groove to thereby deform the holding sheet along the protrusions and peel it from the chip-shaped component. .

[0013] Then, as the third step described above, the holding sheet may peel off from the periphery of the chip-like components, each chip
Provided in the first suction groove facing the peripheral edge of the cup-shaped component
The negative pressure is stronger than the negative pressure applied to the other second suction groove.
It is characterized by including a negative pressure control step .

More preferably, the above-mentioned third step further includes a step of applying substantially the same negative pressure to both the first and second suction grooves after the negative pressure control step. To be Further, the method for handling a chip-shaped component according to the present invention is preferably applied to a handling method further including a step of picking up the chip-shaped component from the holding sheet after the third step.

Further, in the method of handling a chip-shaped component according to the present invention, preferably, the projection has top portions extending in a straight line, and the top portions are arranged in parallel with each other, and the second step is performed. In, each chip-shaped component is oriented such that its longitudinal direction is orthogonal to the direction in which the top extends. In the chip-shaped component handling method according to the present invention, preferably, the plurality of chip-shaped components are obtained by cutting the mother body held on the holding sheet.

In the method of handling a chip-shaped component according to the present invention, preferably, the chip-shaped component is a chip-shaped electronic component. The present invention also has a plurality of chip-shaped components which are held by the adhesiveness provided by the adhesive surface while being arranged on the holding sheet having an expandability and an adhesive surface formed on the surface, so that the chip-like components are peeled off from the holding sheet. The present invention is also directed to a handling device for handling chip-shaped parts, and is characterized by having the following configuration in order to solve the above-mentioned technical problem.

That is, the chip-shaped component handling apparatus according to the present invention is for mounting a holding sheet holding a plurality of chip-shaped components, and is configured so that each region facing each chip-shaped component is A mounting table having a plurality of suction grooves distributed so as to cover at least, and formed with projections positioned between the plurality of suction grooves so as to partially face each chip-shaped component at least at two positions. In addition, the holding sheet is deformed along the protrusions and peeled off from the chip-shaped component, so that the holding sheet is peeled off from the vacuum source for applying a negative pressure to the suction groove and the peripheral portion of each chip-shaped component. , On the periphery of each chip-shaped component
The negative pressure applied to the opposing first suction groove is set to the other negative pressure.
2 than the negative pressure applied to the suction groove, and then this
Substantially the same for both the first and second suction grooves
Negative pressure control means for controlling the negative pressure applied from the vacuum source to each of the plurality of suction grooves so as to apply the negative pressure.

[0018] Also, the handling device of the chip-components according to the present invention, according to another aspect, together and a mounting table and a vacuum source as described above, from the vacuum source, the periphery of each chip shaped parts A first vacuum path leading to the opposing first suction groove, a second vacuum path leading from the same vacuum source to a second suction groove other than the first suction groove, and these first vacuum path and first vacuum path. Two
And a negative pressure control means for individually controlling the first and second negative pressures applied to the vacuum passage and the vacuum passage, respectively.

In the chip-shaped component handling apparatus according to the present invention, preferably, the projection has top portions extending in a straight line, and the top portions are arranged in parallel with each other. Further, the top portion of the above-mentioned protrusion preferably has a knife edge shape.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 4 are for explaining one embodiment of the present invention. Here, FIG.
FIG. 2 is a schematic perspective view showing an overall outline of the chip-shaped component handling device 10, and FIGS. 2 to 4 are cross-sectional views of a mounting table 11 provided in the handling device 10 and a chip-shaped component handling method. The steps included in are sequentially shown.

In this embodiment, the chip-shaped electronic component 12 such as the semiconductor chip described above is disclosed as the chip-shaped component to be handled. The plurality of chip-shaped electronic components 12 have expandability and are held by the adhesiveness provided by the adhesive surface 13 while being arranged on the holding sheet 14 having the adhesive surface 13 formed on the surface. These chip-shaped electronic components 12 are obtained by cutting the mother body held on the holding sheet 14 with, for example, a dicer. In addition, each chip-shaped electronic component 12
Has a very small dimension, for example, the dimension in the longitudinal direction is 6.7 mm, the dimension in the width direction is 0.5 mm, and the dimension in the thickness direction is 0.3 mm.

The mounting table 11 provided in the handling apparatus 10 has a plurality of suction grooves 15 and 16 distributed so as to cover at least the respective regions facing the respective chip-shaped electronic components 12. These suction grooves 15 and 16 are located so as to face the peripheral portion of the chip-shaped electronic component 12
The suction groove 15 and the other second suction groove 19 are classified.

Further, the mounting table 10 is located between the plurality of suction grooves 15 and 16 so as to partially oppose each chip-shaped electronic component 12 at least at two positions, in this embodiment at three positions. The protrusion 17 is formed.
The protrusion 17 has a top portion that extends linearly, and the top portions are arranged in parallel with each other. Also, the protrusion 17
Has a knife-edge shape.

The mounting table 10 is provided with first and second suction holes 18 and 19 which communicate with the first and second suction grooves 15 and 16, respectively. On the other hand, suction hole 1
A vacuum source 20, such as the vacuum pump shown in block form in FIG. 1, is provided to generate a negative pressure applied to the suction grooves 15 and 16 through 8 and 19, respectively. Vacuum source 2
The negative pressure generated at 0 is supplied to the mounting table 11 via the negative pressure control means 21. From the vacuum source 20 to the mounting table 1
The vacuum path leading to No. 1 is divided into a first vacuum path 22 and a second vacuum path 23 by the negative pressure control means 21, and the first vacuum path 22 is connected to the first vacuum path 22 via the first suction hole 18. 1 suction groove 1
5, the second vacuum passage 23 communicates with the second suction groove 16 via the second suction hole 19.

The negative pressure control means 21 executes the steps described in detail below with reference to FIGS.
By individually controlling the negative pressures applied from the vacuum source 20 to the first vacuum path 22 and the second vacuum path 23, the negative pressure is applied to each of the first and second suction grooves 15 and 16. It is for controlling negative pressure, and includes, for example, a pressure control valve driven by a personal computer, a sequencer, or the like.

As shown in FIG. 2, the holding sheet 14 holding the plurality of chip-shaped electronic components 12 is in a state in which the adhesive surface 13 adhering the chip-shaped electronic components 12 is directed upward. It is placed on the mounting table 11 while maintaining the above. When the holding sheet 14 is placed on the mounting table 11 in this way, the first suction groove 15 and the second suction groove 16 define a sealed space that is independent of each other. Preferably,
In this mounted state, the longitudinal direction of each chip-shaped electronic component 12 is oriented so as to be orthogonal to the extending direction of the top of the protrusion 17.

By applying a negative pressure from the vacuum source 20 to the suction grooves 15 and 16 in the above-mentioned state, the holding sheet 14 is finally deformed along the protrusion 17 as shown in FIG. By doing so, the holding sheet 14 is peeled off from each chip-shaped electronic component 12, but in this embodiment, the process shown in FIG. 3 is first performed based on the negative pressure control means 21 described above. To be done.

Referring to FIG. 3, each chip-shaped electronic component 12
The first suction groove 15 facing the peripheral edge portion of each chip-shaped electronic component 12 so that the holding sheet 14 is peeled from the peripheral edge portion.
The first negative pressure 24 applied to the second suction groove 16 is made stronger than the second negative pressure 25 applied to the other second suction grooves 16. By applying the negative pressures 24 and 25 in this manner, the first
The peeling of the holding sheet 14 occurs only in the peripheral portion of each chip-shaped electronic component 12 facing the suction groove 15 of
At the central portion of each chip-shaped electronic component 12 facing the suction groove 16 of FIG. As described above, when the longitudinal direction of each chip-shaped electronic component 12 is oriented so as to be orthogonal to the extending direction of the tops of the protrusions 17, each chip facing the first suction groove 15 is processed by the process shown in FIG. It is easy to cause peeling of the holding sheet 14 at the peripheral portion of the chip-shaped electronic component 12.

In the process shown in FIG. 3, in the above description, the second suction groove 16 is given the second negative pressure 25 which is weaker than the first negative pressure 24. Negative pressure may not be applied to the suction groove 16 at all, and negative pressure 24 may be applied only to the first suction groove 15. Then, as shown in FIG. 4, the first and second suction grooves 15 and 1
Substantially the same negative pressure 26 is applied to both 6.
As a result, the peeling of the holding sheet 14 in the portion facing the first suction groove 15 is maintained as it is,
The peeling of the holding sheet 14 also occurs in the portion facing the second suction groove 16, that is, in the central portion of each chip-shaped electronic component 12.

In this way, the holding sheet 14 is peeled from the peripheral edge of each chip-shaped electronic component 12, and at the time of peeling from the peripheral edge, the central portion of each chip-shaped electronic component 12 is still adhered. The chip-shaped electronic component 12 does not have a posture of rising relatively with the peripheral portion as a fulcrum. When the process shown in FIG. 4 is completed, each chip-shaped electronic component 12 adheres to the holding sheet 14 only in a very limited portion facing the top of the protrusion 17, and therefore, these chip-shaped electronic components 12 are adhered. Since the electronic component 12 is supplied to the next step, it can be easily picked up from the holding sheet 14 by a vacuum suction chuck or the like (not shown).
In particular, as in this embodiment, when the top of the protrusion 17 has a knife edge shape, the area where the holding sheet 14 is in contact with each chip-shaped electronic component 12 is still determined when the peeling process of the holding sheet 14 is completed. It can be extremely small.

Although the present invention has been described above with reference to the illustrated embodiments, within the scope of the present invention, other
Various modifications are possible. For example, in the illustrated embodiment, in order to allow the holding sheet 14 to be peeled off from the peripheral edge portion of each chip-shaped electronic component 12, the first suction groove facing the peripheral edge portion of each chip-shaped electronic component 12 in the first step. 15
The first negative pressure 24 applied to the second suction groove 16 is made stronger than the second negative pressure 25 applied to the other second suction grooves 16, and then,
In the second stage, substantially the same negative pressure 26 is applied to both of these first and second suction grooves 15 and 16.
However, for example, the first negative pressure 24 applied to the first suction groove 15 is stronger than the second negative pressure 25 applied to the second suction groove 16. The holding sheet 14 is peeled from the peripheral edge portion of each chip-shaped electronic component 12 only by performing the negative pressure applying step in which the holding sheet 1 is held even in the central portion.
5 can be peeled off.

Further, the negative pressure applied to each of the first and second suction grooves 15 and 16 is adjusted by the negative pressure control means 2.
For example, regardless of the pressure regulating valve included in 1, the suction hole 1
Alternatively, the size and number of 8 and 19 may be changed. Also, the suction grooves 15 and 16 and the protrusion 17
The arrangement state of the chip-shaped electronic components 1 on the holding sheet 14 is
2 shape, arrangement mode, or which part of the peripheral portion of the chip-shaped electronic component 12 from which the holding sheet 14 is to be peeled off,
It is appropriately changed according to factors such as.

The present invention is not limited to the above-mentioned chip-shaped electronic component 12, but can be applied to the handling of chip-shaped components other than electronic components.

[0034]

As described above, according to the chip-shaped component handling method of the present invention, the holding sheet holding a plurality of chip-shaped components is placed on the mounting table while being mounted on the mounting table. Applying a negative pressure to the suction groove provided, thereby, when performing the step of deforming the holding sheet along the protrusions and peeling it from the chip-shaped component, so that the holding sheet is peeled from the peripheral portion of each chip-shaped component, Since the negative pressure applied to each of the plurality of suction grooves is controlled, when the holding sheet is peeled off from the peripheral portion of each chip-shaped component,
Since the holding sheet still adheres to the central portion of each chip-shaped component, the chip-shaped component does not have a posture in which it rises relative to the peripheral portion as a fulcrum. Therefore, regardless of the shape of the chip-shaped component, the holding sheet can always be efficiently and efficiently peeled off from the chip-shaped component. This is particularly advantageous when handling small chip-shaped components, for example small chip-shaped electronic components.

Further, according to the handling of chip-like component according to the present invention, when controlling the negative pressure applied to each of the plurality of suction grooves as described above, faces the peripheral portion of each chip-shaped component the first negative pressure otherwise the suction is applied to the groove second <br/> that stronger than the negative pressure applied to the suction groove line of Unode, possible to easily realize such control You can In After the negative pressure control steps as above mentioned, first
By applying substantially the same negative pressure to both the second suction groove and the second suction groove, it is possible to surely avoid the inconvenience that the holding sheet again adheres to the peripheral portion of the chip-shaped component.

In the chip-shaped component handling method according to the present invention, in order to pick up the chip-shaped component from the holding sheet, as described above, when the holding sheet is peeled from the chip-shaped component, It is possible to prevent a problem that a failure is caused in picking up a shaped component, or the posture at the time of picking up becomes improper even if picking up is performed, which causes a problem in the next step.

Further, in the method of handling a chip-shaped component according to the present invention, the protrusions have linearly extending tops, and the respective tops are arranged in parallel with each other. When the longitudinal direction is oriented so as to be orthogonal to the extending direction of the apex, it is possible not only to arrange a plurality of chip-shaped components on the holding sheet in an aligned state, but also to provide each of the plurality of suction grooves. By controlling the negative pressure, it becomes easy to separate the holding sheet from the peripheral portion of each chip-shaped component.

In the chip-shaped component handling method according to the present invention, a plurality of chip-shaped electronic components can be obtained by cutting the mother body held on the holding sheet to obtain a plurality of chip-shaped electronic components. The parts are held in an aligned state on the holding sheet. Therefore, without recognizing the position of each chip-shaped component with a CCD camera or the like and aligning each chip-shaped component with the projection and the suction groove, it is only necessary to mount the holding sheet on the mounting table. As desired, each chip-shaped component can be efficiently aligned with the protrusion and the suction groove.

On the other hand, according to the chip-shaped component handling apparatus of the present invention, the suction sheet is provided from the vacuum source to each of the plurality of suction grooves so that the holding sheet is peeled off from the peripheral portion of each chip-shaped component. Since it is provided with a negative pressure control means for controlling the negative pressure, the holding sheet, as in the case of the above-described method of handling the chip-shaped component, is at the time of peeling from the peripheral portion of each chip-shaped component. Since the central portion of the chip-shaped component is still adhered, each chip-shaped component is not relatively raised with its peripheral edge as a fulcrum. Therefore, regardless of the shape of the chip-shaped component, the holding sheet can always be efficiently and efficiently peeled off from the chip-shaped component.

Further, according to the chip-shaped component handling apparatus of the present invention , the negative pressure control means applies the negative pressure applied to the first suction groove facing the peripheral edge of each chip-shaped component to other than that. Make it stronger than the negative pressure applied to the second suction groove, and then
Since the control is performed so as to apply substantially the same negative pressure to both the first and second suction grooves, such a control method can be realized with a simple configuration, and
It is possible to reliably avoid the inconvenience that the holding sheet that has once peeled off adheres again to the peripheral portion of the chip-shaped component.

In addition, in the chip-shaped component handling apparatus according to the present invention, the above-described mounting table and vacuum source are provided, and from this vacuum source to the first suction groove facing the peripheral portion of each chip-shaped component. A first vacuum passage communicating with the first vacuum passage and a second vacuum passage communicating with the second suction groove other than the first suction groove from the vacuum source.
And a negative pressure control means for individually controlling the first and second negative pressures applied to the first vacuum path and the second vacuum path, respectively. It is possible to simplify the structure of the pipe or the like for supplying the negative pressure to be applied to the first and second suction grooves, respectively.

Further, in the chip-shaped component handling apparatus according to the present invention, the projection provided on the mounting table has a linearly extending top portion, and when the top portions are arranged in parallel with each other, the projection is provided. By using it, it is easy to make the first and second suction grooves independent of each other, and thus it is easy to individually control the negative pressure of each of the first and second suction grooves. Become.

Further, if the tops of the above-mentioned projections have a knife-edge shape, the area where the holding sheet contacts each chip-shaped component can be made extremely small even after the peeling step of the holding sheet is completed. For example, it becomes possible to pick up the chip-shaped component from the holding sheet with a light force.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing a chip-shaped component handling device 10 according to an embodiment of the present invention.

2 is a sectional view showing the mounting table 11 shown in FIG. 1 together with a holding sheet 14. FIG.

FIG. 3 is a view corresponding to FIG. 2 and shows a first suction groove 15;
The first negative pressure 24 applied to the first suction groove 15 is made stronger than the second negative pressure 25 applied to the second suction groove 16.
The step of peeling off the holding sheet 14 is shown only in the portion facing to.

FIG. 4 is a view corresponding to FIG. 2, and after the step shown in FIG. 3, first and second suction grooves 15 and 16 are provided.
The process of applying substantially the same negative pressure 26 to both of the above is shown.

FIG. 5 is a sectional view showing a conventional mounting table 1 which is of interest to the present invention.

[Explanation of symbols] 10 Handling device 11 table 12 Chip-shaped electronic components 13 Adhesive surface 14 holding sheet 15 First suction groove 16 Second suction groove 17 Protrusion 18 First suction hole 19 Second suction hole 20 vacuum source 21 Negative pressure control means 22 First vacuum path 23 Second vacuum path 24 First negative pressure 25 Second negative pressure 26 Negative pressure

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Claims (10)

(57) [Claims] 1. A plurality of chip-shaped components, which are held on the holding sheet having expandability and having an adhesive surface formed on the surface thereof and held by the adhesiveness provided by the adhesive surface, are peeled off from the holding sheet. Is a method of handling a chip-shaped component, which has a plurality of suction grooves distributed so as to cover at least each region facing each of the chip-shaped components,
A first step of preparing a mounting table having protrusions positioned between the plurality of suction grooves so as to partially face each of the chip-shaped components at least at two positions; The second step of placing the holding sheet holding the chip-shaped component on the placing table, and applying a negative pressure to the suction groove, thereby causing the holding sheet to follow the protrusion. And a third step of deforming and peeling from the chip-shaped component, wherein the third step is performed so that the holding sheet is peeled from the peripheral portion of each chip-shaped component.
The first suction groove provided in the first suction groove facing the peripheral portion.
A second negative pressure is applied to the second suction groove other than the second pressure.
A method of handling a chip-shaped component, comprising a negative pressure control step of making the pressure stronger than the negative pressure . 2. The third step further includes a step of applying substantially the same negative pressure to both the first and second suction grooves after the negative pressure control step. Item 1. A method for handling a chip-shaped component according to Item 1 . After wherein the third step further comprises the step of picking up the chip-shaped component from said holding sheet, chip-like component handling method according to claim 1 or 2. 4. The protrusion has linearly extending tops, and the tops are arranged so as to be parallel to each other. In the second step, each of the chip-shaped components is
The method for handling a chip-shaped component according to any one of claims 1 to 3 , wherein the longitudinal direction is oriented so as to be orthogonal to the extending direction of the apex. Wherein a plurality of said chip-like component, which is obtained by cutting the mother body held on the holding sheet, the chip-like component according to any of claims 1 to 4 How to handle. Wherein said chip-like component is a chip-like electronic parts, handling of the chip-component according to any of claims 1 to 5. 7. A plurality of chip-shaped parts, which are held on the holding sheet having expandability and having an adhesive surface formed on the surface thereof and held by the adhesiveness provided by the adhesive surface, are peeled off from the holding sheet. Is a device for handling chip-shaped components, which is for mounting the holding sheet holding a plurality of the chip-shaped components, and at least each region facing each of the chip-shaped components is A plurality of suction grooves that are distributed so as to cover the plurality of suction grooves are formed, and protrusions that are positioned between the plurality of suction grooves and are partially opposed to each of the chip-shaped components are formed. A mounting table, a vacuum source for applying a negative pressure to the suction groove for deforming the holding sheet along the protrusions and peeling the holding sheet from the chip-shaped component, and each of the chucks. So that the holding sheet is peeled off from the peripheral portion of the cup-shaped component,
The negative pressure applied to the suction groove of 1
It should be stronger than the negative pressure applied to the suction groove.
Substantially the same negative pressure for both the first and second suction grooves
And a negative pressure control means for controlling a negative pressure applied to each of the plurality of suction grooves from the vacuum source so as to apply the chip-shaped component handling device . 8. A plurality of chip-shaped parts, which are held on the holding sheet having expandability and having an adhesive surface formed on the surface thereof and held by the adhesiveness provided by the adhesive surface, are peeled off from the holding sheet. Is a device for handling chip-shaped components, which is for mounting the holding sheet holding a plurality of the chip-shaped components, and at least each region facing each of the chip-shaped components is A plurality of suction grooves that are distributed so as to cover the plurality of suction grooves are formed, and protrusions that are positioned between the plurality of suction grooves and are partially opposed to each of the chip-shaped components are formed. A mounting table, a vacuum source for applying a negative pressure to the suction groove for deforming the holding sheet along the protrusions and peeling the holding sheet from the chip-shaped component, and the vacuum. A first vacuum path from the source to the first suction groove facing the peripheral edge of each chip-shaped component, and from the vacuum source to the second suction groove other than the first suction groove. A second vacuum passage, and negative pressure control means for individually controlling the first and second negative pressures applied to the first vacuum passage and the second vacuum passage, respectively. Characteristic device for handling chip-shaped parts. 9. The chip-shaped component handling device according to claim 7 , wherein the protrusion has a top portion that extends linearly, and the top portions are arranged in parallel with each other. 10. The chip-shaped component handling device according to claim 9 , wherein the top of the protrusion has a knife-edge shape.