JP2018190839A - Removal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a removal device for removing an outer periphery of a device from an adhesive tape before picking up the device.SOLUTION: A removal device 20 includes at least: frame supporting means 22 for supporting a frame 10; peripheral removal means 24 for sucking a space between adjacent devices 4 and 4 from an adhesive tape 12 side to remove the outer periphery of the devices 4 from the adhesive tape 12; and moving means 26 for relatively moving the peripheral removal means 24 and the frame supporting means 22.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a detachment device that separates the outer circumferences of a plurality of devices attached to an adhesive tape supported by a frame and divided along a street from the adhesive tape.

  A wafer in which a plurality of devices such as IC, LSI, etc., are defined by a street and formed on the surface is attached to an adhesive tape whose outer periphery is supported by a frame having an opening for accommodating the wafer, and a cutting blade is rotatably provided. It is divided into individual devices by cutting means. Then, individual devices are picked up from the divided wafer stuck on the adhesive tape by the pickup device, and used for electric devices such as mobile phones, personal computers, and communication devices (see, for example, Patent Document 1).

JP-A-9-1677779

  However, as the device becomes smaller, for example, 3 mm square or less, when the device is pushed up from the adhesive tape side by the lifting means and picked up by the collet, one side of the device is fixed to the adhesive tape and the device is inclined to pick up the device by the collet There is a problem that becomes difficult. Such a problem is that when the wafer is divided into individual devices, the wafer is cut and the adhesive tape is also cut slightly, so that the outer periphery of the device is surrounded by the adhesive and a relatively large amount of adhesive is present on any side of the device. It is thought that it occurs because it is difficult to be separated from the adhesive tape locally. Similar problems may occur when a wafer is irradiated with a laser beam to divide the wafer into individual devices.

  Therefore, a plurality of push-up pins constituting the push-up means are provided, and the above-mentioned problem is solved by a complicated movement of the plurality of push-up pins so that the device does not become inclined at the time of push-up. There is a problem that it takes time to push up and productivity is poor.

  An object of the present invention made in view of the above-mentioned fact is to provide a detaching device for detaching the outer periphery of a device from an adhesive tape before picking up the device.

  In order to solve the above problems, the present invention provides the following detachment device. That is, a detaching device for separating the outer periphery of a plurality of devices attached to an adhesive tape supported by a frame and divided along a street from the adhesive tape, and a frame supporting means for supporting the frame, and an adjacent device, It comprises at least an outer periphery detaching means for sucking between the device and the outer periphery of the device from the adhesive tape, and a moving means for relatively moving the outer periphery detaching means and the frame support means. This is a separation device.

  Preferably, the outer periphery detaching means includes a slit-like suction portion, and the moving means relatively rotates the outer periphery detachment means and the frame support means so that the slit-like suction portion and the street of the wafer coincide with each other. .

  The detachment apparatus provided by the present invention includes a frame support means for supporting a frame, an outer periphery detachment means for sucking a gap between adjacent devices from the adhesive tape side and releasing the outer periphery of the device from the adhesive tape, and the outer periphery detachment. Since the device and the moving means for relatively moving the frame support means, the outer periphery of the device can be detached from the adhesive tape before the device is picked up from the adhesive tape. Even if the device is pushed up by this pickup device, the device rises without tilting, and the device can be properly picked up by the collet.

The perspective view (a) of the wafer divided | segmented into each device, the enlarged view (b) of the wafer surface, and the expanded sectional view (c) of a wafer. 1 is a perspective view of a detachment device constructed in accordance with the present invention. FIG. 3 is an exploded perspective view of the detaching device shown in FIG. 2. Sectional drawing (a) which shows the state in which the outer periphery detachment | leave process is implemented, enlarged sectional view (b), and the expanded sectional view which shows the state from which the adhesive tape was removed from the outer periphery of a device. Sectional drawing (a) which shows the state in which the pick-up process is implemented, and the expanded sectional view (b) which shows the state by which the device was pushed up.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an embodiment of a detachment device configured according to the present invention will be described with reference to the drawings.

  On the surface 2 a of the wafer 2 shown in FIG. 1, a plurality of rectangular devices 4 such as ICs and LSIs are formed by being partitioned by lattice-like streets 6. As shown in FIG. 1 (a), an orientation flat 8 showing crystal orientation is formed on the periphery of the disc-shaped wafer 2, and the lattice-like street 6 is formed in the orientation flat 8 as shown in FIG. 1 (b). And a plurality of second streets 6 b orthogonal to the orientation flat 8. In the illustrated embodiment, as shown in FIG. 1 (a), the back surface of the wafer 2 is attached to an adhesive tape 12 whose outer periphery is supported by an annular frame 10 having a circular opening 10 a that accommodates the wafer 2. The surface 2a of the wafer 2 may be attached to the adhesive tape 12. Further, the wafer 2 shown in FIG. 1 is divided into individual devices 4 by being cut into a lattice shape along the street 6 by a cutting means (not shown) having a cutting blade rotatably. Yes. A portion (processing line) that is cut in a lattice shape along the street 6 of the wafer 2 by the cutting means is indicated by reference numeral 14 in FIG. 1, and a portion that is cut along the first street 6a. A (first processing line) is indicated by reference numeral 14a in FIG. 1 (b), and a portion (second processing line) cut along the second street 6b is indicated by reference numeral 14b in FIG. 1 (b). It shows with. An example of the adhesive of the adhesive tape 12 clinging to the outer periphery of the device 4 is indicated by reference numeral 16 in FIG.

  2 removes the outer periphery of the device 4 from the adhesive tape 12 by sucking between the frame support means 22 for supporting the annular frame 10 and the adjacent device 4 and the device 4 from the adhesive tape 12 side. It comprises at least an outer periphery detaching means 24 and a moving means 26 for relatively moving the outer periphery detaching means 24 and the frame support means 22. In the illustrated embodiment, as shown in FIG. 2, the detaching device 20 further includes an alignment unit 28 that images the wafer 2 in order to align the outer periphery detaching unit 24 with the street 6 of the wafer 2.

  2 and 3, the frame support means 22 includes a rectangular substrate 30, a Y-axis direction movable frame 32 that is mounted on the substrate 30 so as to be movable in the Y-axis direction, and in the X-axis direction. And a rectangular X-axis direction movable plate 34 mounted on the Y-axis direction movable frame 32 in a movable manner. A pair of guide rails 36 extending in the Y-axis direction with an interval in the X-axis direction are attached to the upper surface of the substrate 30. A guide groove 36a extending in the Y-axis direction is formed on the upper surface of one guide rail 36, and a guided protrusion (not shown) slidably fitted in the guide groove 36a is a Y-axis direction movable frame. 32 is formed on the lower surface. When the Y-axis movable frame 32 is moved in a state where the guided ridge of the Y-axis movable frame 32 is fitted in the guide groove 36a of the guide rail 36, the guide groove moves so as to move along the Y-axis direction. The Y-axis direction movable frame 32 is guided by 36a. A pair of guide rails 38 extending in the X-axis direction with an interval in the Y-axis direction are attached to the upper surface of the Y-axis direction movable frame 32. A guide groove 38 a extending in the X-axis direction is formed on the upper surface of one guide rail 38, and a guided protrusion (not shown) that fits in the guide groove 38 a is formed on the lower surface of the X-axis direction movable plate 34. Is formed. When the X-axis direction movable plate 34 is moved in a state where the guided ridge of the X-axis direction movable plate 34 is fitted in the guide groove 38a of the guide rail 38, the guide groove moves so as to move along the X-axis direction. The X-axis direction movable plate 34 is guided by 38a. The X-axis direction movable plate 34 is formed with an opening (not shown) for allowing the outer periphery separating means 24 to pass therethrough, and a cylindrical support base 40 covers the opening so as to cover the opening. It is rotatably mounted on the top surface of the. A plurality of clamps 42 are arranged on the outer peripheral edge on the upper end side of the support base 40 at intervals in the circumferential direction. The X-axis direction is a direction indicated by an arrow X in FIGS. 2 and 3, and the Y-axis direction is a direction indicated by an arrow Y in FIGS. 2 and 3 and is a direction orthogonal to the X-axis direction. The plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

  As shown in FIGS. 2 and 3, the outer periphery detaching means 24 is a pair of support legs extending upward from the upper surface of the substrate 30 through the rectangular opening 32 a of the Y-axis direction movable frame 32 and the opening of the X-axis direction movable plate 34. 44 and a suction piece 46 supported on the upper ends of the pair of support legs 44. In the illustrated embodiment, a slit-like suction part 46a extending in the X-axis direction is formed at the upper end of the suction piece 46, and a suction source (not shown) for generating suction force on the suction part 46a is a flow path. 48 is connected to the suction piece 46. The upper end side portion of the suction portion 46a is formed in a triangular shape whose width gradually decreases from the upper surface of the suction piece 46 downward. The upper surface of the suction piece 46 and the upper surface of the support base 40 are aligned in the vertical direction, and the lower surface of the adhesive tape 12 contacts the upper surface of the suction piece 46 when the annular frame 10 is placed on the support base 40. It is like that.

  2 and FIG. 3, the moving unit 26 moves the support base 40 in the Y-axis direction with respect to the outer circumferential detaching unit 24 and the outer circumferential detaching unit 24. X-axis direction moving means 52 for moving the support base 40 in the X-axis direction, and rotation means 54 for rotating the support base 40 about the axis extending in the vertical direction. As shown in FIG. 3, the Y-axis direction moving means 50 has a ball screw 56 extending in the Y-axis direction on the substrate 30 and a motor 58 connected to one end of the ball screw 56. A nut portion (not shown) of the ball screw 56 is fixed to the lower surface of the Y-axis direction movable frame 32. The Y-axis direction moving means 50 converts the rotational motion of the motor 58 into a linear motion by the ball screw 56 and transmits it to the Y-axis direction movable frame 32, and along the guide rail 36 on the substrate 30, the Y-axis direction movable frame. 32 is advanced and retracted in the Y-axis direction, and thereby the support base 40 is advanced and retracted in the Y-axis direction with respect to the outer periphery detaching means 24. The X-axis direction moving means 52 includes a ball screw 60 extending in the X-axis direction on the Y-axis direction movable frame 32, and a motor 62 connected to one end of the ball screw 60. A nut portion (not shown) of the ball screw 60 is fixed to the lower surface of the X-axis direction movable plate 34. The X-axis direction moving means 52 converts the rotational motion of the motor 62 into a linear motion by the ball screw 60 and transmits it to the X-axis direction movable plate 34, along the guide rail 38 on the Y-axis direction movable frame 32. The axially movable plate 34 is moved back and forth in the X-axis direction, thereby moving the support base 40 forward and backward in the X-axis direction with respect to the outer periphery detaching means 24. The rotating means 54 includes a pulley 64 disposed on the upper surface of the X-axis direction movable plate 34, an endless belt 66 wound around the lower end side outer peripheral surface of the support base 40 and the pulley 64, and a motor that rotates the pulley 64 ( (Not shown). The rotating means 54 transmits the rotational motion of the motor to the support base 40 via the pulley 64 and the endless belt 66, and rotates the support base 40 about the axis extending in the vertical direction.

  As shown in FIG. 2, the alignment means 28 has a support body 68 that extends upward from the upper surface of the substrate 30 and then extends substantially horizontally, and a camera 70 attached to the lower surface of the front end of the support body 68.

  When the outer periphery of the plurality of devices 4 attached to the adhesive tape 12 supported by the annular frame 10 and divided along the street 6 is separated from the adhesive tape 12 by the removing device 20 as described above, FIG. As shown in a), first, the annular frame 10 is placed on the upper surface of the support base 40 with the device 4 facing upward, and the adhesive tape 12 is brought into contact with the upper surface of the suction piece 46 of the outer periphery detaching means 24. Next, the outer peripheral edge of the annular frame 10 is fixed with a plurality of clamps 42. Next, the outer periphery detaching means 24 and the frame supporting means 22 are relatively moved and rotated by the moving means 26, and the slit-like suction part 46 a and the street 6 of the wafer 2 are matched. In the illustrated embodiment, the wafer 2 is imaged from above by the camera 70 of the alignment unit 28, and the support base 40 of the frame support unit 22 is attached to the outer periphery detaching unit 24 based on the image of the wafer 2 captured by the camera 70. By moving and rotating the moving means 26, the direction of the wafer 2 is adjusted to a predetermined direction, and the positions of the first street 6a of the wafer 2 and the suction portion 46a of the suction piece 46 in the XY plane are adjusted. . When the orientation of the wafer 2 is adjusted to a predetermined direction, first, the first flat 6a is roughly aligned in the X-axis direction by aligning the orientation flat 8 in the X-axis direction, and then imaged by the camera 70. By aligning a line segment connecting two key patterns (not shown) along the first street 6a in the X-axis direction, the first street 6a is accurately aligned in the X-axis direction. Further, when adjusting the positions of the first street 6a of the wafer 2 and the suction portion 46a of the suction piece 46 in the XY plane, as shown in FIGS. 4 (a) and 4 (b), a plurality of first streets The slit-like suction part 46a is made to coincide with the first processing line 14a located at one end in the Y-axis direction among the plurality of first processing lines 14a formed along the streets 6a. Next, the operation of the suction source connected to the flow path 48 of the outer periphery detaching means 24 is started, and a suction force is generated in the suction portion 46 a of the suction piece 46. As a result, as shown in FIG. 4C, the outer periphery of the device 4 can be detached from the adhesive tape 12 by sucking the space between the adjacent devices 4 from the adhesive tape 12 side. Next, the operation of the suction source is stopped and the suction force of the suction part 46a is released. Next, the wafer 2 and the suction portion 46a are index-fed in the Y-axis direction relative to the interval of the first processing line 14a. In the illustrated embodiment, the support base 40 of the frame support means 22 that supports the annular frame 10 is moved in the Y-axis direction with respect to the suction portion 46a of the outer periphery detachment means 24 by the interval of the first processing line 14a. The moving means 50 feeds the index in the Y-axis direction. Then, suction by the suction part 46a, release of suction, and index feeding for the interval of the first processing line 14a are repeated in order, and the outer periphery of the device 4 is adhered to the adhesive tape 12 in all of the plurality of first processing lines 14a. To leave. Next, the second street 6b is roughly aligned in the X-axis direction by rotating the support base 40 by 90 degrees with the rotating means 54, and then two keys along the second street 6b imaged by the camera 70 are used. By aligning line segments connecting patterns (not shown) in the X-axis direction, the second street 6b is accurately aligned in the X-axis direction. Further, by moving the support base 40 in the Y-axis direction by the Y-axis direction moving means 50, the Y-axis direction among the plurality of second processing lines 14b formed along each of the plurality of second streets 6b. The slit-like suction part 46a is aligned with the second processing line 14b located at one end. Then, suction by the suction part 46a, release of suction, and index feeding for the interval of the second processing line 14b are sequentially repeated, and the outer periphery of the device 4 is adhered to the adhesive tape 12 in all of the plurality of second processing lines 14b. To leave. Thereby, the outer periphery of all the devices 4 can be detached from the adhesive tape 12. Note that the friction coefficient of the upper surface of the suction piece 46 contacting the adhesive tape 12 is such that the upper surface of the suction piece 46 of the outer periphery detaching means 24 is coated with fluororesin or the upper surface of the suction piece 46 is made of fluororesin. If it is smaller, the index feed may be performed while suctioning by the suction part 46a for separating the outer periphery of the device 4 from the adhesive tape 12 without releasing the suction.

  As described above, in the illustrated embodiment, when the wafer 2 is divided into the individual devices 4, the wafer 2 is cut and the adhesive tape 12 is slightly cut, and the outer periphery of the device 4 is surrounded by the adhesive of the adhesive tape 12. Even if a relatively large amount of adhesive is attached to any side of the device 4, the outer periphery of the device 4 can be detached from the adhesive tape 12 before the device 4 is picked up from the adhesive tape 12. Therefore, the device 4 does not become difficult to separate from the adhesive tape 12 locally. Therefore, for example, as shown in FIG. 5A, a conventional pickup device 76 having a push-up pin 72 that pushes up the device 4 from the adhesive tape 12 side and a collet 74 that sucks the device 4 pushed up by the push-up pin 72. The device 4 can be picked up properly. That is, as shown in FIG. 5B, since the outer periphery of the device 4 is detached from the adhesive tape 12, the device 4 rises without tilting even when the device 4 is pushed up by the push-up pin 72, and the device 4 is moved by the collet 74. Can be picked up properly.

2: Wafer 4: Device 6: Street 6a: First street 6b: Second street 10: Annular frame 12: Adhesive tape 20: Detachment device 22: Frame support means 24: Outer periphery removal means 26: Moving means 46: Suction Piece 46a: suction part

Claims (2)

A detaching device for separating the outer periphery of a plurality of devices attached to an adhesive tape supported by a frame and divided along a street from the adhesive tape,
Frame support means for supporting the frame;
An outer periphery detaching means for sucking between the adjacent device and the device from the adhesive tape side and detaching the outer periphery of the device from the adhesive tape,
Moving means for relatively moving the outer periphery separating means and the frame supporting means;
A detachment device comprised at least from. The outer periphery detaching means includes a slit-like suction part,
2. The detaching apparatus according to claim 1, wherein the moving means relatively rotates the outer periphery detaching means and the frame supporting means to align the slit-like suction portion with the street of the wafer.