JP2003234396A - Chip pickup apparatus, manufacturing method of the same, and semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily separate a chip from a sheet without requiring the particular adjustment of the thrust-upward stroke of a needle and the vertically moving position of a stage. <P>SOLUTION: When the chip 102 is thrust-upward by the needle 17 via the sheet 101 by projecting the needle 17 from a needle hole 16, the sheet 101 is absorbed in the neighborhood of a suction air vent 15, but since the sheet 101 is not absorbed in the neighborhood of the needle hole 16, the sheet 101 is stretched only in the neighborhood of the needle hole 16 and separated from the sheet 101. Thus, the thrust-upward stroke of the needle 17 can be fixed, and the changing and adjusting of the position of the stage 14 are not required. Since air is not sucked into the needle hole 16, it does not become difficult to separate the chip 102 from the sheet 101. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip pickup device for supplying chips such as electronic parts, a manufacturing method thereof, and a semiconductor manufacturing device.

[0002]

2. Description of the Related Art As a conventional device of this type, there is, for example, one shown in FIGS. 6 (a) and 6 (b). In this apparatus, a chip 102 such as an electronic component attached on a sheet 101 is pushed up by a needle 103 through the sheet 101, whereby the chip 102 is peeled off from the sheet 101, and a chip is formed by a collet (not shown). 1
02 is picked up and picked up, and the chip 102 is supplied to a die bond head or the like of a die bond device.

Further, as shown in FIGS. 7 (a) and 7 (b), the sheet 101 is covered with the inner cylindrical ring 111, and the outer cylindrical ring 112 is fitted to the inner cylindrical ring 111 with the sheet 101 stretched. A plurality of chips 102 on the sheet 101 by sandwiching and supporting the periphery of the sheet 101.
Are arranged and pasted. While moving the sheet 101, the chips 102 are sequentially pushed up by a needle 103 to be peeled off.

Since only the peripheral edge of the sheet 101 is supported here, one tip 102 is attached to the needle 1.
When pushed up by 03, the entire sheet 101 is stretched. Therefore, in order to sufficiently separate the chip 102 from the sheet 101, it is necessary to increase the push-up stroke by the needle 103. In order to surely peel the tip 102 from the sheet 101, the needle 103
It is necessary to make the tip of the tape thin as appropriate. However, increasing the stroke of pushing up with the needle 103,
When the tip of the needle 103 is thinned, the seat 101 pierces the needle 103.

In the vicinity of the center and the periphery of the sheet 101, the manner in which the sheet 101 extends changes and the chip 10
Needle 103 for peeling 2 from the sheet 101
Although the optimum push-up stroke of No. 1 was different, it was difficult to adjust and control this stroke.

Further, when the needle 103 repeatedly pushes up the sheet 101, the sheet 101 gradually expands, and it becomes more difficult to peel off the chip 102, and this peeling operation cannot be performed stably.

Therefore, an apparatus as shown in FIG. 8 has been proposed. In this apparatus, a needle 122 is inserted and arranged inside a cylindrical stage 121. Then, by pushing up the sheet 101 by the spherical upper end of the stage 121, a constant tension is given to the sheet 101 near the upper end of the stage 121 at any position of the sheet 101, and then the upper end of the stage 121 The tip 102 is pushed up by a needle 122 and peeled off. In this case, since a constant tension is applied to the seat 101 near the upper end of the stage 121, the thrust stroke of the needle 122 can be constant. In addition, since the sheet 101 is stretched near the upper end of the stage 121, the chip 102 moves toward the sheet 101.
When the needle 122 is pushed up, the tip 102 can be easily peeled off.

However, in such a conventional apparatus, although the thrust stroke of the needle 122 can be made constant, a stage for applying a constant tension to the sheet 101 near the center and the periphery of the sheet 101. The vertical position of 121 is different and this stage 12
1 was difficult to adjust and control.

Therefore, a device as shown in FIG. 9 has been proposed. In this apparatus, the needle 132 is arranged inside the cylindrical stage 131, and the flat plate portion 1 of the stage 131 is arranged.
Needle hole 1 in which the needle 132 projects in the center of 31a
31b is formed, and a plurality of suction holes 131c are formed around the needle hole 131b of the flat plate portion 131a. Then, by sucking and discharging the air inside the stage 131, each suction hole 131c of the flat plate portion 131a.
The sheet 101 is adsorbed to the flat plate portion 131a by the above, and the chip 102 is pushed up by the needle 132 and then peeled off. In this case, the sheet 101 is attached to the flat plate portion 131a.
Since the needle 132 is sucked in, the upward stroke of the needle 132 can be made constant, and the stage 131
There is no need to change or adjust the position of.

Among these conventional devices, the device shown in FIG. 9 is mainly used at present.

[0011]

However, in the device shown in FIG. 9, the needle holes 131b and the suction holes 131c are provided.
Are communicated with each other inside the stage 131, so that air is also sucked from the needle hole 131b, and in reality, the
As shown in 0, the sheet 101 adheres to the tip of the needle 132, the sheet 101 does not extend at the tip of the needle 132, and the chip 102 is difficult to peel off from the sheet 101.

Therefore, the present invention has been made in view of the above problems of the prior art, and the chip can be easily peeled from the sheet without requiring special adjustment of the stroke of raising the needle or the vertical position of the stage. An object is to provide a possible chip pickup device, a manufacturing method thereof, and a semiconductor manufacturing device.

[0013]

In order to solve the above-mentioned problems of the prior art, the present invention provides a chip in which a chip attached to a sheet is pushed up with a needle through the sheet, thereby separating the chip from the sheet. In the pickup device, a needle hole for projecting a needle and an air suction vent hole for adsorbing the sheet onto the stage are formed separately on a stage on which the sheet is placed.

According to the present invention having such a configuration, the needle hole for projecting the needle and the suction vent hole for adsorbing the sheet onto the stage are separately formed on the stage on which the sheet is placed. Therefore, the chip can be pushed up by the needle and peeled off from the sheet in a state where the sheet is adsorbed to the stage by the suction ventilation hole, and no special adjustment of the needle pushing stroke or the stage position is required. Moreover, since the needle hole and the suction vent hole are formed separately, air is not sucked through the needle hole, and the sheet does not stick to the tip of the needle due to the suction of air, so the tip is removed from the sheet. It can be easily peeled off.

Further, in the present invention, the stage is provided with an upright cylindrical body and a needle holder disposed in the cylindrical body, and a spacer is provided on the outer periphery of the needle holder. With this spacer, a gap is formed between the inner circumference of the tubular body and the outer circumference of the needle holder, the seat is placed on the upper end surfaces of the tubular body and the needle holder, and a needle hole for projecting the needle is formed in the needle holder. The gap between the inner circumference of the tubular body and the outer circumference of the needle holder is used as a suction vent for air.

With such a simple structure, a suction vent hole can be formed around the needle hole, and the tip is pushed up with the needle through the sheet at approximately the center of the region where the sheet is sucked, and the tip is pushed up. Can be reliably peeled off.

Further, in the present invention, a plurality of spacers are arranged separately in the vertical direction.

When the needle holder is press-fitted inside the tubular body, the spacers can be easily arranged by separating the spacers in the vertical direction. Also, the needle holder can be reliably positioned inside the tubular body.

Further, in the present invention, the shape of the suction vent hole on the stage is set so that the size of the suction area of the chip through the sheet by the suction vent hole becomes smaller than the size of the chip. There is.

By making the size of the suction area of the chip smaller than the size of the chip in this manner, the chip does not fit into the suction vent hole when the sheet is moved on the stage.

Further, in the present invention, the suction vent hole is
It has a symmetrical shape with respect to the needle hole.

In this case, the sheet is sucked at the respective points symmetrical with respect to the needle hole. Therefore, when the chip is pushed up by the needle through the sheet, the respective stresses generated between the tip of the needle and the respective points are dispersed and act on the sheet, and the stress acting on the chip is also dispersed.
As a result, it is possible to prevent the chip from being damaged or being flipped from the sheet. For example,
If the suction vent is concentric with the needle hole,
The symmetrical suction ventilation holes can be easily formed.
Furthermore, a suction vent having a shape capable of adsorbing almost the entire area of the chip is preferable. In this case, when the tip is pushed up with the needle through the sheet, the tip is reliably peeled from the sheet.

Further, in the present invention, the plurality of suction vent holes are arranged so as to be symmetrical with respect to the needle hole.

In this case, it becomes easy to freely set the shape of the suction area of the chip through the sheet by the suction ventilation holes. Further, it becomes possible to appropriately disperse the suction force with respect to the chip.

Further, in the present invention, the size of the needle hole on the stage is not larger than the size of the chip.

When the size of the needle hole is set in this manner, the chip does not fit into the needle hole when the sheet is moved on the stage.

Further, in the present invention, the tip of the needle is made flat.

In this case, when the tip is pushed up by the needle, the tip of the needle does not break through the sheet, the stress acting on the tip is dispersed, and the tip can be peeled off without damage. Furthermore, in the state where the tip is pushed up through the sheet with the flat tip of the needle, if the tip is peeled from the sheet without breaking through the sheet, a small piece of the sheet or a small piece of the adhesive thereof does not adhere to the tip. In the manufacturing process after picking up the chip, it is possible to prevent the occurrence of a die bond defect or the like due to the adhesion of the small piece of the sheet, its adhesive or the like to the back surface of the chip.

Further, in the present invention, the size of the flat tip of the needle is set to the size of the tip or less. For example, the diameter of the flat tip of the needle is set to 1/2 to 1/5 of the length of the short side of the tip. Alternatively, the diameter of the flat tip of the needle is set to approximately ¼ of the length of the short side of the tip.

By setting the size of the flat tip of the needle as described above, the chip can be reliably peeled from the sheet without breaking through the sheet.

Next, according to the present invention, in a method for manufacturing a chip pickup device in which a chip attached to a sheet is pushed up with a needle through the sheet to separate the chip from the sheet, the outer periphery of the needle holder is provided. A spacer is provided, the needle holder is fitted inside the tubular body, the spacer is sandwiched between the inner periphery of the tubular body and the outer periphery of the needle holder, and a gap is formed between them to project the needle. Is formed in the needle holder, and the gap between the inner circumference of the tubular body and the outer circumference of the needle holder is used as a suction vent hole for vacuum suction of the sheet.

According to such a manufacturing method of the present invention, the pickup device of the present invention can be easily manufactured.

The semiconductor manufacturing apparatus of the present invention includes the pickup device of the present invention.

Since the semiconductor manufacturing apparatus of the present invention as described above is provided with the pickup apparatus of the present invention, the step of peeling the chip from the sheet and picking it up can be carried out reliably and promptly, and the delay of this step or Stoppages and the like do not occur, and the takt time of the die bonding process and wire bonding process following this process can be shortened.
Therefore, it is possible to realize a highly reliable semiconductor manufacturing apparatus such as a die bonding apparatus or a wire bonding apparatus.

[0035]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a sectional view partially showing an embodiment of the pickup device of the present invention. In the pickup device 11 of the present embodiment, the tubular body 12 is erected, and the tubular body 1
The needle holder 13 is arranged on the inner side of the stage 2, and the stage 1
Make up 4. Further, a gap is formed between the inner circumference of the cylindrical body 12 and the outer circumference of the needle holder 13, and this gap serves as a suction vent hole 15 for air. Further, the needle holder 1
A needle hole 16 is formed in the needle 3, and a needle 17 is inserted into the needle hole 16.

The suction ventilation hole 15 is connected to a vacuum pump (not shown), and the air in the suction ventilation hole 15 is sucked by this vacuum pump. In addition, the needle hole 16
Is completely separated from the suction vent hole 15, so the air in the needle hole 16 is not sucked.

2 (a), 2 (b) and 2 (d) are side views showing the cylindrical body 12, the needle holder 13 and the needle 17, respectively. Further, FIG. 2C is a plan view showing the needle holder 13.

The cylindrical body 12 is made of metal and has a hole 12a at its upper end and a flange 12b at its lower end. The flange 12b is attached to the apparatus main body, and the stage 14 is positioned and fixed.

The needle holder 13 has a cylindrical frame 13a at its upper end, and the needle 17 is projected from the inside of this cylindrical frame 13a. Two spacers 18 and 19 are provided on the outer periphery of the needle holder 13 and each spacer 1
Grooves 18a and 19a are formed in 8 and 19, respectively.

The needle holder 13 is inserted into the cylindrical body 12 to form the spacers 18 and 19 of the needle holder 13.
Is press-fitted into the tubular body 12, and the spacer 18 is brought into contact with the upper inner wall 12c of the tubular body 12 to integrate the tubular body 12 and the needle holding body 13. By each spacer 18, 19,
A gap is formed between the inner periphery of the tubular body 12 and the outer periphery of the needle holder 13, and this gap serves as the suction vent hole 15. Since the grooves 18a and 19a are formed in the spacers 18 and 19, the suction vent hole 15 is not blocked by the spacers 18 and 19. Further, the outer diameter of the cylindrical frame 13a of the needle holder 13 is smaller than the inner diameter of the hole 12a of the tubular body 12, and the suction vent hole 15 is concentric with the needle hole 16 on the upper surface of the stage 14. If the suction vent holes 15 are arranged symmetrically with respect to the needle holes 16 on the upper surface of the stage 14, the suction vent holes 15 of the concentric circle shape will be used.
Is the easiest to manufacture.

Further, since the spacers 18 and 19 are separately provided at two places, the force for press-fitting the spacers 18 and 19 is small, and the assembly of the stage 14 is easy. If a spacer that substantially covers the entire outer circumference of the needle holder 13 is provided, the force for press-fitting the spacer becomes very large, and the stage 14
Assembly becomes difficult. In addition, each spacer 18, 19
When press-fitting, since it is not necessary to use an adhesive to fix the needle holder 13 to the tubular body 12, the chip is contaminated by the adhesive when handling a chip such as an electronic component described later. You don't have to. Furthermore, the upper end surface of the tubular body 12 and the upper end surface of the cylindrical frame 13a of the needle holder 13,
That is, the upper surface of the stage 14 can be easily processed to be smooth, and the upper surface of the stage 14 is not deformed due to backlash between the cylindrical body 12 and the needle holder 13 during use.

The tip 17a of the needle 17 is flattened, and if the diameter of the tip 17a is D, this diameter D is made smaller than the size of the tip.

In the pick-up device 11, a sheet 101 having a large number of chips 102 arranged and attached as shown in FIG. 7 is placed on the stage 14. At this time, as shown in FIG.
Is blocked, the inside of the suction ventilation hole 15 becomes negative pressure, and the sheet 101 is adsorbed on the stage 14. However, since the needle hole 16 is completely separated from the suction vent hole 15, the sheet 101 is not adsorbed in the vicinity of the needle hole 16.

Here, as shown in FIG. 3, the sheet 101 is moved in the direction of arrow A to position one tip 102 just above the tip 17a of the needle 17 as shown in FIG. Then, when the needle 17 is projected from the needle hole 16 and the tip 102 is pushed up by the needle 17 through the seat 101, the seat 101 is adsorbed in the vicinity of the suction vent hole 15 and the seat 101 is located in the vicinity of the needle hole 16. Is not adsorbed, the sheet 101 extends only near the needle hole 16 and is separated from the stage 14, and the chip 102 is peeled from the sheet 101. Further, the chip 102 is adsorbed and picked up by a collet (not shown), and the chip 102 is supplied to a die bond head or the like of a die bond device.

As described above, in this embodiment, since the chip 102 is pushed up by the needle 17 and peeled off while the sheet 101 is adsorbed on the stage 14, the pushing stroke of the needle 17 can be made constant and the stage 14 There is no need to change or adjust the position of. Moreover,
Since air is not sucked into the needle hole 16, the sheet 101 does not adhere to the tip of the needle as in the conventional case, and the chip 102 does not easily peel off from the sheet 101.

Since the suction vent holes 15 are concentrically arranged with respect to the needle holes 16, the sheet 101 is sucked around the entire needle holes 16. Therefore, when the tip 102 is pushed up by the needle 17 through the seat 101, the stress generated between the tip portion 17 a of the needle 17 and the entire periphery of the needle hole 16 is applied to the seat 101.
The stress acting on the chip 102 is also dispersed. As a result, the chip 102 can be prevented from being damaged and the chip 102 can be prevented from being flipped off from the sheet 101.

Further, since the tip portion 17a of the needle 17 is flattened, the chip 102 can be easily peeled off without breaking through the sheet 101. Moreover, this also makes it possible to disperse the stress acting on the chip 102, and prevent the chip 102 from being damaged or the chip 102 being flipped off. Further, the small pieces of the sheet 101 and the small pieces of the adhesive agent are used for the chips 102.
In the die-bonding device or the like, it is possible to prevent the occurrence of a die-bonding defect or the like due to the adhesion of a small piece of the sheet on the rear surface of the chip 102, an adhesive agent of the sheet or the like.

Normally, it is desirable to set the diameter D of the tip portion 17a of the needle 17 to 1/2 to 1/5 of the length of the short side of the tip 102, and further, to set the diameter D to the tip 102.
Most preferably, the length is set to about 1/4 of the length of the short side. For example, the length of the short side of the chip 102 is 180 μm
When it is 220 μm, the tip portion 17a of the needle 17
If the diameter D is set to about 30 μm, 50 μm, and 100 μm, the chip 102 can be easily peeled from the sheet 101. Then, when the diameter D is set to 50 μm, which corresponds to approximately ¼ of the length of the short side of the chip 102, the chip 102 can be peeled most favorably from the sheet 101.

The inner diameter of the needle hole 16 on the upper surface of the stage 14 is set to be equal to or less than the length of the short side of the tip 102. As a result, the tip 102 does not fit into the needle hole 16 during the movement of the seat 101.

On the other hand, it is desirable to make the inner diameter of the suction vent hole 15 on the upper surface of the stage 14 as small as possible. This is because the closer the suction vent hole 15 is to the needle hole 16, the shorter the push-up stroke of the needle 17 required to peel the tip 102 from the sheet 101 can be shortened.

Further, the width h (shown in FIG. 3) of the suction ventilation hole 15 on the upper surface of the stage 14 is narrow within a range where a sufficient suction force can be obtained so that the chip 102 does not fit into the suction ventilation hole 15. It is better to do it. In particular, in the moving direction of the arrow A of the sheet 101, the width h of the suction ventilation hole 15 is set to the chip 1
The width is narrower than 02. Alternatively, since the tip 102 has a rectangular shape, the width h of the suction vent hole 15 is made narrower than the short side of the tip 102. If the width h of the suction vent hole 15 is made wider than the width or the short side of the tip 102, the tip 102 may fit into the suction vent hole 15.

FIG. 4 is a plan view showing a modified example of the pickup device 11. Here, as the chip 102A,
The shape of the hole 12a of the cylindrical body 12 is set to an oval shape, assuming that the long side and the short side have greatly different lengths. Therefore, the suction vent hole 15 has an oval shape on the upper surface of the stage 14 and is symmetrical with respect to the needle hole 16,
Not concentric. Since the suction vent hole 15 is elongated along the long side of the tip 102A, almost the entire area of the tip 102A can be sucked by the suction vent hole 15.
Regarding the long side direction of the chip 102A, the chip 102A
Although it adheres more strongly to the sheet 101, the oval suction holes 15 can surely suck the sheet 101 onto the stage 14 and easily peel the chip 102A from the sheet 101. Further, in the moving direction of the arrow A of the sheet 101, the width h of the suction ventilation hole 15 is kept small, and the chip 102A does not fit into the suction ventilation hole 15.

FIG. 5 is a plan view showing another modification of the pickup device 11. Here, the diameter of the hole 12a at the upper end of the tubular body 12 is reduced, the cylindrical frame 13a at the upper end of the needle holder 13 is fitted into the hole 12a, and a plurality of holes are formed at the upper end of the tubular body 12. 12d are formed so as to be symmetrical with respect to the needle hole 16. That is, on the upper surface of the stage 14, the holes 12d communicating with the suction ventilation holes 15 are arranged symmetrically with respect to the needle holes 16. In this case, the shape of the suction area of the chip 102 through the sheet 101 by each hole 12d can be freely set, and the size of each hole 12d can be set to the chip 10.
Even if the size is set to 2 or less, a large suction force can be obtained. Further, the suction force with respect to the tip 102 can be dispersed appropriately, and the tip 102 is damaged or
It is possible to prevent the chip 102 from being flipped off from the sheet 101.

The present invention is not limited to the above embodiment and can be modified in various ways. For example,
The shape, number, arrangement, etc. of the suction vent holes on the upper surface of the stage may be variously changed. Further, the present invention includes not only the pickup device but also a semiconductor manufacturing device such as a die bonding device or a wire bonding device provided with this pickup device.

[0056]

As described above, according to the present invention, the chip can be pushed up by the needle and peeled off from the sheet in the state where the sheet is adsorbed to the stage by the suction air vent, and the needle pushing stroke and the stage position. Does not require any special adjustments. Moreover, since the needle hole and the suction vent hole are formed separately, air is not sucked through the needle hole, and the sheet does not stick to the tip of the needle due to the suction of air, so the tip is removed from the sheet. It can be easily peeled off.

Further, according to the present invention, a spacer is provided on the outer periphery of the needle holder, and the spacer forms a gap between the inner periphery of the cylindrical body and the outer periphery of the needle holder to retain the cylindrical body and the needle holder. A seat is placed on the upper end surface of the body, and a needle hole for projecting the needle is formed in the needle holder, and a gap between the inner circumference of the tubular body and the outer circumference of the needle holder is used as a suction hole for air. With such a simple structure, a suction vent hole can be formed around the needle hole, and the tip is pushed up with the needle through the seat in the approximate center of the area where the seat is sucked, and the tip is securely held. Can be peeled off.

Furthermore, according to the present invention, since the spacers are arranged separately in the vertical direction, the needle holder can be easily pressed into the inside of the cylindrical body. Also, the needle holder can be reliably positioned inside the tubular body.

Further, according to the present invention, since the size of the suction area of the chip is smaller than the size of the chip, the chip fits into the suction ventilation hole when the sheet is moved on the stage. You don't have to include it.

Further, according to the present invention, since the suction vent hole has a symmetrical shape with respect to the needle hole, the sheet is sucked at each position symmetrical with respect to the needle hole.
Therefore, when the chip is pushed up by the needle through the sheet, the respective stresses generated between the tip of the needle and the respective points are dispersed and act on the sheet, and the stress acting on the chip is also dispersed. As a result, it is possible to prevent the chip from being damaged or being flipped from the sheet.

Further, according to the present invention, since the plurality of suction vent holes are arranged symmetrically with respect to the needle hole, the shape of the suction area of the chip through the sheet by the suction vent holes is changed. Easy to set freely. Further, it becomes possible to appropriately disperse the suction force with respect to the chip.
For example, if the suction vent hole is concentric with the needle hole, a symmetrical suction vent hole can be easily formed. Furthermore, a suction vent having a shape capable of adsorbing almost the entire area of the chip is preferable. In this case, when the tip is pushed up with the needle through the sheet, the tip is reliably peeled from the sheet.

Further, according to the present invention, on the stage,
Since the size of the needle hole is equal to or smaller than the size of the chip, it is not necessary for the chip to fit into the needle hole when the sheet is moved on the stage.

Further, according to the present invention, since the tip of the needle is made flat, the tip of the needle does not break through the sheet when the tip is pushed up by the needle,
The stress acting on the chip can be dispersed and the chip can be peeled off without damage. Furthermore, when the chip is peeled off from the sheet with the flat tip of the needle pushed up through the sheet, the small piece of the sheet, the small piece of the adhesive, etc. will not adhere to the back surface of the chip In the manufacturing process after picking up, it is possible to prevent the occurrence of a die bond failure or the like due to the adhesion of a small piece of the sheet, its adhesive or the like on the back surface of the chip.

Further, according to the present invention, the size of the flat tip of the needle is set to be equal to or smaller than the size of the tip. For example, the diameter of the flat tip of the needle is set to 1/2 to 1/5 of the length of the short side of the tip. Alternatively, the diameter of the flat tip of the needle is set to approximately ¼ of the length of the short side of the tip.
As a result, the chip can be reliably peeled from the sheet without breaking through the sheet.

Next, according to the manufacturing method of the present invention, a spacer is provided on the outer periphery of the needle holder, the needle holder is fitted inside the cylindrical body, and the spacer is held on the inner periphery of the cylindrical body and the needle holder. It is sandwiched between the outer circumference of the body, a gap is formed between them, a needle hole for protruding the needle is formed in the needle holder, and the sheet is vacuum-sucked in the gap between the inner circumference of the tubular body and the outer circumference of the needle holder. It is used as a suction vent. Thereby, the pickup device of the present invention can be easily manufactured.

Further, since the semiconductor manufacturing apparatus of the present invention is provided with the pickup device of the present invention, the step of peeling the chip from the sheet and picking it up can be performed reliably and promptly, and the die bonding step following this step. The tact time in the wire bonding process can be shortened. Therefore, it is possible to realize a highly reliable semiconductor manufacturing apparatus such as a die bonding apparatus or a wire bonding apparatus.

[Brief description of drawings]

FIG. 1 is a sectional view partially showing an embodiment of a pickup device of the present invention.

2A, 2B, and 2D are side views showing a cylindrical body, a needle holder, and a needle in the pickup device of the present embodiment, and FIG. 2C is a needle holder. FIG.

FIG. 3 is a plan view showing a chip on a stage in the pickup device of the present embodiment.

FIG. 4 is a plan view showing a modified example of the pickup device of the present embodiment.

FIG. 5 is a plan view showing another modification of the pickup device of the present embodiment.

FIG. 6 (a) is a side view showing a conventional device,
(B) is a side view showing an operating state of the apparatus.

7A and 7B are a plan view and a side view showing a state in which a plurality of chips are arranged and attached on a sheet.

FIG. 8 is a side view showing another conventional device.

FIG. 9 is a side view showing another conventional device.

FIG. 10 is a side view showing an operating state of the apparatus shown in FIG.

[Explanation of symbols]

11 Pickup device 12 tubular 13 Needle holder 14 stages 15 Suction vent 16 Needle hole 17 needles 18,19 Spacer 101 sheets 102 chips

Claims (11)

[Claims] 1. A pickup device for a chip in which a chip attached to a sheet is pushed up by a needle through the sheet, thereby separating the chip from the sheet, and a needle hole for projecting the needle and a sheet on a stage for mounting the sheet. A pickup device for a chip, characterized in that it is formed separately from an air suction vent for adsorbing the air on the stage. 2. The stage is provided with an upright cylindrical body and a needle holder arranged in the cylindrical body, and a spacer is provided on the outer periphery of the needle holder, and the spacer forms a cylindrical shape. A gap is formed between the inner circumference of the body and the outer circumference of the needle holder, the seat is placed on the upper end surfaces of the tubular body and the needle holder, and a needle hole for projecting the needle is formed in the needle holder, The chip pickup device according to claim 1, wherein a gap between the inner circumference and the outer circumference of the needle holder is used as a suction air vent. 3. The chip pickup device according to claim 2, wherein a plurality of spacers are arranged separately in the vertical direction. 4. The shape of the suction vent hole on the stage is set so that the size of the suction area of the chip through the sheet by the suction vent hole is smaller than the size of the chip. Item 4. A chip pickup device according to any one of items 1 to 3. 5. The chip pickup device according to claim 1, wherein the suction vent has a symmetrical shape with respect to the needle hole. 6. The plurality of suction vent holes are arranged so as to be symmetrical with respect to the needle hole.
5. The chip pickup device according to any one of 1 to 4. 7. The chip pick-up device according to claim 1, wherein the size of the needle hole on the stage is equal to or smaller than the size of the chip. 8. The chip pickup device according to claim 1, wherein the tip of the needle is flat. 9. The chip pickup device according to claim 8, wherein the size of the flat tip of the needle is equal to or smaller than the size of the chip. 10. A method of manufacturing a chip pickup device in which a chip attached to a sheet is pushed up with a needle through the sheet to separate the chip from the sheet, wherein a spacer is provided on the outer periphery of a needle holder, The holder is fitted inside the tubular body, the spacer is sandwiched between the inner circumference of the tubular body and the outer circumference of the needle holder, and a gap is formed between them to form a needle hole into the needle holder to project the needle. A method for manufacturing a chip pickup device, characterized in that a gap between the inner circumference of the tubular body and the outer circumference of the needle holder is used as a suction vent hole for vacuum suction of the sheet. 11. A semiconductor manufacturing apparatus comprising the chip pickup device according to claim 1.