CN1437234A - Chip pick-up device and producing method thereof and production apparatus of semiconductor - Google Patents
Chip pick-up device and producing method thereof and production apparatus of semiconductor Download PDFInfo
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- CN1437234A CN1437234A CN 03103138 CN03103138A CN1437234A CN 1437234 A CN1437234 A CN 1437234A CN 03103138 CN03103138 CN 03103138 CN 03103138 A CN03103138 A CN 03103138A CN 1437234 A CN1437234 A CN 1437234A
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Abstract
The present invention relates to a chip pickup device capable of easily peeling off chips from a passivation layer without having to particularly adjust the push-up stroke of a pushing pin and the ascending/descending position of a supporting stage. The pushing pin 17 is protruded out of a pin hole 16. The pushing pin 17 is used to push a chip 102 via a passivation layer 101. The passivation layer 101 is sucked and drawn near the venting hole 15, but is not sucked and drawn near the pin hole 16. The passivation layer 101 is propped up at the vicinity of the pin hole 16 to be separated from the supporting stage 14, thereby peeling off the chip 102 from the passivation layer 101. Therefore, it is able to keep the stroke of the pushing pin 17 constant without modifying or adjusting the position of the supporting stage 14. In addition, because there is no absorbing force of air in the pin hole 16, it is easy to peel off the chip 102 from the passivation layer 101.
Description
Invention field
The present invention relates to a kind of chip pickup apparatus and manufacture method thereof and semiconductor-fabricating device, be used for providing chip to electronic unit etc.
Background technology
Existing this device have Fig. 6 (a) for example and (b) shown in device.This device utilizes pin 103 will stick on chip 102 jack-up of electronic unit on the paper 101 etc. by paper 101, thereby chip 102 is peeled off from paper 101, with opening folder (not shown) absorption and pick-up chip 102, the load that chip 102 is offered die-bonding device is first-class then.
In addition, as Fig. 7 (a) and (b), paper 101 is covered on the inside cylindrical ring 111, under state with paper 101 drawouts, outside cylindrical ring 112 is fitted on the inside cylindrical ring 111, and the outer rim of clamping paper 101 is arranged on paper 101 and is pasted with a plurality of chips 102 to support it.Move this paper 101 continuously, utilize pin 103 order each chip 102 of jack-up and it is peeled off.
Here, only support the outer rim of paper 101, so during with 1 chip 102 of pin 103 jack-up, paper 101 can integrally stretchings.Therefore, fully peel off from paper 101, need to strengthen stroke with pin 103 jack-up for making chip 102.In addition, reliably peel off from paper 101, the front end of pin 103 is suitably attenuated for making chip 102.But,, can produce the problem of pin 103 bursting paper 101 if strengthen stroke, the front end of pin 103 is attenuated with pin 103 jack-up.
In addition, the extended state of paper 101 is near the central authorities of paper 101 and change near the outer rim, so that also difference of the best jack-up stroke of the pin 103 that chip 102 is peeled off from paper 101, but adjusting of the trip and control are difficult.
And if use pin 103 jack-up repeatedly, paper 101 slowly stretches, and makes peeling off gradually of chip 102 become difficulty, and this overburden operation can not be stablized carry out.
For this reason, device shown in Figure 8 has been proposed.This device inserts configuration pin 122 to the inboard of tubular objective table 121.By with the dome shape of objective table 121 upper end jack-up paper 101, no matter make in any position of paper 101, near the upper end of objective table 121, provide certain force of strain to paper 101, use the chip 102 of pin 122 jack-up objective tables 121 upper ends then, and it is peeled off.At this moment, near the upper end of objective table 121, provide certain force of strain, so can make the jack-up stroke of pin 122 certain to paper 101.In addition, near the upper end of objective table 121, paper 101 is stretched, and chip 102 is stripped from down half from paper 101, so when pin 122 jack-up, can peel off chip 102 easily.
But, existing this device, the jack-up stroke that promptly allows to pin 122 is certain, but near the central authorities of paper 101 and near the outer rim, be used for providing to paper 101 the lifting position difference of the objective table 121 of certain tension force, the position adjustments of this objective table 121 and control are difficult.
Therefore, device shown in Figure 9 has been proposed.This device is in the inboard configuration pin 132 of tubular objective table 131, forms the pin hole 131b that makes pin 132 outstanding in the central authorities of the flat part 131a of objective table 131, forms a plurality of attractions hole 131c simultaneously around the pin hole 131b of flat part 131a.By attracting and discharge the air of objective table 131 inboards, utilize the hole 131c that respectively attracts of flat part 131a that paper 101 is adsorbed onto flat part 131a, then with pin 132 jack-up and peel off chip 102.At this moment, paper 101 attracted to flat part 131a, thus can make the jack-up stroke of pin 132 certain, and needn't change or regulate the position of objective table 131.
In these existing apparatus, mainly be device shown in Figure 9 still now what use.
But, in the device shown in Figure 9, pin hole 131b and each attract hole 131c to be communicated with in objective table 131 inside, so air also is attracted by pin hole 131b, in fact as shown in figure 10, paper 101 connects airtight the front end at pin 132, exists paper 101 not stretch at the front end of pin 132, the chip 102 difficult problems of peeling off from paper 101.
Summary of the invention
Therefore, in view of the above problems, the objective of the invention is, a kind of chip pickup apparatus and manufacture method thereof and semiconductor-fabricating device are provided, the jack-up stroke of metering needle and the lifting position of objective table just can easily be peeled off chip from paper in addition.
For addressing the above problem, to sticking on chip jack-up on the paper by paper with pin, thereby with the pick device that chip is peeled off from paper, the present invention is placing on the objective table of paper, and independent formation makes pin hole that spicula goes out and the air that paper is adsorbed onto on the objective table attract air vent hole.
According to the present invention of such formation, to place on the objective table of paper, independent formation makes pin hole that spicula goes out and paper is adsorbed onto attraction air vent hole on the objective table.Therefore, utilize attracting air vent hole paper to be adsorbed onto under the state on the objective table, can peel off with chip jack-up and from paper with pin, in addition the jack-up stroke of metering needle and the position of objective table.And pin hole and to attract air vent hole be independent formation so can not be attracted at pin hole place air, can not attract to make paper to connect airtight front end at pin by air yet, therefore can easily chip be peeled off from paper.
In addition, objective table of the present invention comprises that the pin of erectting the cylindrical body that is provided with and being configured in this cylindrical body keeps body, keep the periphery of body to be provided with pad at pin, keep at interior week of cylindrical body and pin by this pad forming the gap between the periphery of body, keep the upper surface of body to place paper in cylindrical body and pin, keep forming on the body pin hole that spicula is gone out at pin, the gap between the periphery that the interior week and the pin of cylindrical body kept body is as the attraction air vent hole of air.
By so simple formation, can form around the pin hole and attract air vent hole, the about central part in the zone that paper is attracted, with pin by paper with chip jack-up, can peel off chip reliably.
In addition, the present invention in the above-below direction separate configurations a plurality of pads.
Keep body to be pressed into cylindrical body when inboard on pin, if with each pad separate configurations at above-below direction, can make that this push operation is easier to be carried out, pin can also be kept body be positioned at the inboard of cylindrical body reliably.
The shape of the attraction air vent hole on the objective table of the present invention is configured to make utilize and attracts air vent hole to attract the area size of chip less than this chip size by paper.
Like this, if the size in attraction zone that makes chip less than the size of this chip, during mobile paper, chip can not embed the attraction air vent hole on objective table.
In addition, attraction air vent hole of the present invention has symmetric shape with respect to pin hole.
At this moment, paper attracted to each position of relative pin hole symmetry.Therefore, when the paper jack-up chip, result from each stress peptizaiton between pin front end and this each position with pin to paper, the stress that acts on the chip is also disperseed.Like this, can prevent the chip damage, or chip is flown by bullet from paper.For example, be to be concentrically ringed shape if attract air vent hole with respect to pin hole, just can form the attraction air vent hole of symmetric shape at an easy rate.The attraction air vent hole of shape that preferably can adsorb the basic Zone Full of chip.At this moment, when passing through paper jack-up chip with pin, chip can be peeled off from paper reliably.
The present invention is configured to symmetric shape with a plurality of attraction air vent holes with respect to pin hole.
At this moment, the easy setting arbitrarily utilized the region shape of attraction air vent hole by paper attraction chip, and the attraction of decentralized photo for chip that can suit.
The present invention sets the pinhole size on the objective table less than chip size.
If set pinhole size like this, during mobile paper, chip can not embed in the pin hole on objective table.
Pin front end of the present invention is smooth.
At this moment, with pin jack-up chip the time, the pin front end can bursting paper, and can peptizaiton in the stress of chip, chip just can be peeled off injury-freely.Pass through under the state of paper jack-up chip at smooth front end with pin, can just can not peel off chip by bursting paper from paper, the small pieces of paper or the small pieces of its bonding agent can be attached on the chips, in the manufacturing process after picking up this chip, can prevent because of the chips welding that produces attached to the small pieces of the paper of chip back or its bonding agent etc. bad etc.
The present invention sets the size of the smooth front end of pin less than chip size.For example, make the diameter of the smooth front end of pin be chip bond length 1/2 to 1/5.Perhaps, make the diameter of the smooth front end of pin be chip bond length about 1/4.
According to this setting of the smooth front end size of pin, can not bursting paper, just can reliably chip be peeled off from paper.
Below, explanation will stick on chip jack-up on the paper with pin by paper, make the manufacture method of the pick device that chip peels off from paper, the present invention keeps the periphery of body to be provided with pad at pin, make pin keep body to embed the inboard of cylindrical body, the interior week and the pin that pad are clipped in cylindrical body keep forming the gap between the periphery of body between this, keep forming on the body pin hole that spicula is gone out at pin, the gap between the periphery that the interior week and the pin of cylindrical body kept body is as the attraction air vent hole of vacuum suction paper.
According to this manufacture method of the present invention, can easily make pick device of the present invention.
In addition, semiconductor-fabricating device of the present invention has pick device of the present invention.
This semiconductor-fabricating device of the present invention has pick device of the present invention, so can be reliably and promptly carry out operation that chip is peeled off and picked up from paper, can not produce the sluggishness of this operation and stop etc., can shorten the chips welding operation after this operation and the productive temp time of wire bonds operation.So, can realize the semiconductor-fabricating device of the die-bonding device of high reliability and lead bonding device etc.
Description of drawings
Fig. 1 is the partial section of a kind of execution mode of expression pick device of the present invention.
Fig. 2 (a) and (b) and (d) be the side view that the cylindrical body of representing the pick device of present embodiment respectively, pin keep body and pin (c) are the plane graphs that the expression pin keeps body.
Fig. 3 is the plane graph of the chip on the objective table of pick device of expression present embodiment.
Fig. 4 is the plane graph of distortion example of the pick device of expression present embodiment.
Fig. 5 be the expression present embodiment pick device other the distortion examples plane graph.
Fig. 6 (a) is the side view of existing apparatus, (b) is the side view of the operate condition of this device of expression.
Fig. 7 (a) and (b) be to be illustrated on the paper plane graph and the side view of arranging when pasting a plurality of chip.
Fig. 8 is the side view of other existing apparatus of expression.
Fig. 9 is the side view of other other existing apparatus of expression.
Figure 10 is the side view of the operate condition of presentation graphs 9 devices.
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.
Fig. 1 is the partial section of an execution mode of expression pick device of the present invention.The pick device 11 of present embodiment is erect cylindrical body 12 is set, and the inboard configuration pin maintenance body 13 in cylindrical body 12 constitutes objective table 14.Keep at interior week of cylindrical body 12 and pin forming the gap between the periphery of body 13, with the attraction air vent hole 15 of this gap as air.Keep forming on the body 13 pin hole 16 at pin, insert pin 17 to this pin hole 16.
Attract air vent hole 15 to be connected, attract the air in the air vent hole 15 to be attracted by this vacuum pump with vacuum pump (not shown).Pin hole 16 is located away from attraction air vent hole 15 fully and forms, so the air in this pin hole 16 can not be attracted.
Fig. 2 (a) and (b) and (d) be to represent that respectively cylindrical body 12, pin keep the side view of body 13 and pin 17, Fig. 2 (c) is the plane graph that the expression pin keeps body 13.
Pin keeps body 13 cylinder frame 13a to be arranged the end thereon, makes pin 17 interior side-prominent from this cylinder frame 13a.Keep the periphery of body 13 to be provided with 2 pads 18,19 at pin, on each pad 18,19, form groove 18a, 19a respectively.
Inboard with pin keeps body 13 to insert cylindrical body 12 keeps each pad 18,19 of body 13 to be pressed into cylindrical body 12 on pin, makes the upper inside walls 12c of pad 18 contact cylindrical body 12, makes cylindrical body 12 and pin keep body 13 to become one.By each pad 18,19, keep at interior week of cylindrical body 12 and pin forming the gap between the periphery of body 13, this gap becomes and attracts air vent hole 15. Form groove 18a, 19a respectively at each pad 18,19, so attract air vent hole 15 can not block because of each pad 18,19.In addition, the external diameter of the cylinder frame 13a of pin maintenance body 13 is littler than the internal diameter of the hole 12a of cylindrical body 12, on objective table 14, attracts air vent hole 15 to form concentric circless with respect to pin hole 16.On objective table 14, attract air vent hole 15 with respect to pin hole 16 balanced configurations if make, the attraction air vent hole 15 of this concentric circles will be very easy to make.
In addition, each pad 18,19 is separated to be arranged on two places, so it is little to be pressed into the required power of each pad 18,19, so the assembling of objective table 14 is easy to.When supposing that basic covering pin is set keeps all pad of the periphery of body 13, it will be very big being pressed into the required power of this pad, so the assembling difficulty of objective table 14.Be pressed into each pad 18,19 o'clock, when keeping body 13 to be fixed on the cylindrical body 12 on pin, need do not use bonding agent, so as hereinafter described, during the chip of use electronic unit etc., chip can not polluted by bonding agent.In addition, the upper surface of cylindrical body 12 and pin keep the upper surface of the cylinder frame 13a of body 13, and promptly the upper surface of objective table 14 is processed very smoothly easily, so in use, cylindrical body 12 and 13 of bodies of pin maintenance can not produce and rock, and the upper surface of objective table 14 can not be out of shape yet.
The leading section 17a of pin 17 is processed smooth, and the diameter of establishing this leading section 17a is D, makes this diameter D less than chip size.
This pick device 11 as shown in Figure 7, is placed with on objective table 14 and arranges the paper 101 of having pasted a plurality of chips 102.At this moment, as shown in Figure 1, attract air vent hole 15 to be blocked by paper 101, so attract to form negative pressure in the air vent hole 15, paper 101 is attracted on the objective table 14.But pin hole 16 is separated fully from attracting air vent hole 15, so near pin hole 16, paper 101 can not be adsorbed.
Here, by shown in Figure 3, move paper 101 to the arrow A direction, by shown in Figure 1, a chip 102 is positioned at pin 17 leading section 17a directly over.Make pin 17 outstanding from pin hole 16, by this chip 102 of paper 101 jack-up, paper 101 is adsorbed near attraction air vent hole 15, and is not adsorbed near pin hole 16 with pin 17, so 101 on paper stretches near pin hole 16 and leaves objective table 14, this chip 102 is peeled off from paper 101.Then, with opening folder (not shown) absorption and pick-up chip 102, the load that chip 102 is offered die-bonding device is first-class.
In the present embodiment, under paper 101 is adsorbed on state on the objective table 14, peel off with pin 17 jack-up chips 102 and with it, thus can make the jack-up stroke of pin 17 certain, and need not change or regulate the position of objective table 14.And air can not be adsorbed to pin hole 16, so paper 101 can not connect airtight the front end at pin as before, chip 102 is peeled off from paper 101 easily.
In addition, attract air vent hole 15 to be configured to concentric circles with respect to pin hole 16, thus paper 101 be attracted to pin hole 16 around on the whole.Therefore, with pin 17 during by paper 101 jack-up chips 102, result from the leading section 17a of pin 17 and pin hole 16 around stress peptizaiton between all in paper 101, the stress that acts on chip 102 is also disperseed.Like this, can prevent chip 102 damaged, or chip 102 is flown by bullet from paper 101.
The leading section 17a of pin 17 is processed smooth, thus can bursting paper 101, can peel off chip 102 at an easy rate.And, also can peptizaiton in the stress of chip 102, prevent chip 102 damaged, or chip 102 is flown by bullet from paper 101.In addition, the small pieces of paper 101 and the small pieces of bonding agent thereof can not be attached to the back side of chip 102, can prevent that chips welding that die-bonding device etc. produces because of the small pieces of the paper that is attached to chip 102 back sides and the bonding agent of paper etc. is bad etc.
Usually, the diameter D of the leading section 17a of pin 17 is set at bond length 1/2 to 1/5 better of chip 102, best is with diameter D be set at chip 102 bond length 1/4.For example, when the bond length of chip 102 was 180 μ m～220 μ m, if the diameter D of the leading section 17a of pin 17 is set at about 30 μ m, 50 μ m and 100 μ m, chip 102 can be peeled off from paper 101 at an easy rate.If diameter D is set at the about 1/4 of the bond length that is equivalent to chip 102, promptly during 50 μ m, chip 102 can be peeled off from paper 101 with the best form.
In addition, the internal diameter of the pin hole 16 above the objective table 14 is set less than the bond length of chip 102.Like this, in paper 101 moving process, chip 102 can not embed pin hole 16.
On the other hand, the internal diameter of the attraction air vent hole 15 above the objective table 14 is preferably as much as possible little.This is because attract air vent hole 15 more near pin hole 16, just can shorten the jack-up stroke of chip 102 required pin 17 when paper 101 is peeled off more.
For being embedded, chip 102 attracts air vent holes 15, the width h (as shown in Figure 3) of the attraction air vent hole 15 above the objective table 14, and it is narrow in well to try one's best in the scope that can obtain abundant attraction.Particularly, at the moving direction of the arrow A of paper 101, attract the width h of air vent hole 15 to be less than the width of chip 102.Perhaps, because of chip 102 is rectangles, need make the minor face of the width h of attraction air vent hole 15 less than chip 102.Suppose width or the minor face of the width h of attraction air vent hole 15 greater than chip 102, chip 102 embeds sometimes and attracts air vent hole 15.
Fig. 4 is the plane graph of the distortion example of expression pick device 11.Here, supposing that the difference in length of the long limit of chip 102A and minor face is very big, is oval with the shape set of the hole 12a of cylindrical body 12.Therefore attract air vent hole 15 on objective table 14, to present ellipse, though, be not concentric circles with respect to pin hole 16 symmetries.Along the long limit of chip 102A, attract air vent hole 15 to be lengthened out, so by attracting air vent hole 15 can attract the basic Zone Full of chip 102A.Although at the long side direction of chip 102A, chip 102A is adsorbed on the paper 101 more strongly, can reliably paper 101 be attracted on the objective table 14 by oval-shaped attraction air vent hole 15, so chip 102A can peel off from paper 101 at an easy rate.At the moving direction of the arrow A of paper 101, attract air vent hole 15 to be held narrow width h, chip 102A can not embed and attract air vent hole 15.
Fig. 5 is the plane graph of other distortion examples of expression pick device 11.Here, dwindle the diameter of hole 12a of the upper end of cylindrical body 12, pin is kept the cylinder frame 13a of the upper end of body 13 be entrenched on the 12a of this hole, make in the upper end of cylindrical body 12 and form a plurality of hole 12d that are symmetric shape with respect to pin hole 16.That is, on objective table 14, will lead to attract air vent hole 15 each hole 12d with respect to pin hole 16 balanced configurations.At this moment, can utilize each hole 12d to set the region shape that attracts chip 102 by paper 101 arbitrarily, even the size of each hole 12d less than the size of chip 102, also can obtain big absorption affinity.In addition, the decentralized photo that can suit can prevent chip 102 damaged for the attraction of chip 102, or chip 102 is flown by bullet from paper 101.
The present invention is not limited to above-mentioned execution mode, can carry out various deformation.For example, can change the shape, number, configuration etc. of the attraction air vent hole above the objective table.In addition, the present invention is not only a pick device, also comprises the semiconductor-fabricating device of die-bonding device with this pick device and lead bonding device etc.
According to the present invention of above explanation, under the state that by the attraction air vent hole paper is adsorbed onto on the objective table, can and it be peeled off from paper with pin jack-up chip, in addition the jack-up stroke of metering needle and the position of objective table.And pin hole separates formation with the attraction air vent hole, so can not be attracted at pin hole place air, paper can not attract be fitted into the front end of pin because of air, so chip can be peeled off from paper at an easy rate.
According to the present invention, keep the periphery of body to be provided with pad at pin, keep at interior week of cylindrical body and pin by this pad forming the gap between the periphery of body, keep the upper surface of body to place paper in cylindrical body and pin, keep forming on the body pin hole that spicula is gone out at pin, the gap between the periphery that the interior week and the pin of cylindrical body kept body is as the attraction air vent hole of air.According to so simple formation, can form around the pin hole and attract air vent hole, the basic central part in the attraction zone of paper by paper jack-up chip, can make chip reliably peel off with pin.
In addition, according to the present invention,, can at an easy rate pin be kept body to be pressed into the cylindrical body inboard, and keep body reliably to be positioned at the cylindrical body inboard on pin at each pad of above-below direction configured separate.
According to the present invention, the size in the attraction zone of chip is less than the size of this chip, so on objective table during mobile paper, chip can not embed the attraction air vent hole.
According to the present invention, attract air vent hole to have symmetric shape, so paper attracted to each position of relative pin hole symmetry with respect to pin hole.Therefore, when the paper jack-up chip, result from each stress peptizaiton between pin front end and this each position with pin to paper, the stress that acts on chip is also disperseed.Like this, can prevent chip hurt, or chip is flown by bullet from paper.
According to the present invention, the relative pin hole of a plurality of attraction air vent holes is the symmetric shape configuration, so easy setting utilization arbitrarily attracts the region shape of air vent hole by paper attraction chip, and the attraction of decentralized photo for chip that can suit.For example, if relative pin hole becomes the attraction air vent hole of concentric circles, can form the attraction air vent hole of symmetric shape easily.The attraction air vent hole of shape that preferably can adsorb in addition, the basic Zone Full of chip.At this moment, when passing through paper jack-up chip with pin, chip can reliably be peeled off from paper.
In addition, according to the present invention, the pinhole size on the objective table is less than chip size, so on objective table during mobile paper, chip can not embed in the pin hole.
According to the present invention, the front end of pin is smooth, so during with pin jack-up chip, the front end of pin can bursting paper, and can peptizaiton in the stress of chip, chip just can be peeled off injury-freely.Pass through under the state of paper jack-up chip at smooth front end with pin, when paper is peeled off chip, the small pieces of paper or the small pieces of its bonding agent etc. can be attached to the back sides of chip, in the manufacturing process after picking up this chip, can prevent because of the chips welding that produces attached to the small pieces of the paper of chip back or its bonding agent etc. bad etc.
According to the present invention, the size of the smooth front end of pin is less than chip size.For example, make the diameter of the smooth front end of pin be chip bond length 1/2 to 1/5.Perhaps, make the diameter of the smooth front end of pin be chip bond length about 1/4.Like this, can not bursting paper, just can reliably chip be peeled off from paper.
Manufacturing method according to the invention, keep the periphery of body to be provided with pad at pin, make pin keep body to be fitted to the inboard of cylindrical body, the interior week and the pin that pad are clipped in cylindrical body keep between the periphery of body, between this, form the gap, keep forming on the body pin hole that spicula is gone out at pin, the gap between the periphery that the interior week and the pin of cylindrical body kept body is as the attraction air vent hole of vacuum suction paper.Like this, can easily make pick device of the present invention.
In addition, semiconductor-fabricating device of the present invention has pick device of the present invention, so can be reliably and promptly carry out operation that chip is peeled off and picked up from paper, can shorten the chips welding operation after this operation and the productive temp time of wire bonds operation.So, can realize the semiconductor-fabricating device of the die-bonding device of high reliability and lead bonding device etc.
Claims (11)
1. chip pickup apparatus will stick on chip jack-up on the paper with pin by paper, thereby chip will be peeled off from paper, it is characterized in that,
On the objective table of placing paper, separate to form making spicula pin hole that goes out and the air that is used for paper is adsorbed onto on the objective table attract air vent hole.
2. chip pickup apparatus according to claim 1 is characterized in that,
Objective table comprises that the pin of erectting the cylindrical body that is provided with and being configured in this cylindrical body keeps body;
Keep the periphery of body to be provided with pad at pin, keep at interior week of cylindrical body and pin by this pad forming the gap between the periphery of body, keep the upper surface of body to place paper in cylindrical body and pin, keep forming on the body pin hole that spicula is gone out at pin, the gap between the periphery that the interior week and the pin of cylindrical body kept body is as the attraction air vent hole of air.
3. chip pickup apparatus according to claim 2 is characterized in that, in the above-below direction configured separate a plurality of pads.
4. according to each described chip pickup apparatus of claim 1～3, it is characterized in that the shape of the attraction air vent hole on the objective table is configured to make utilize and attracts air vent hole to attract the area size of chip less than this chip size by paper.
5. according to each described chip pickup apparatus of claim 1～4, it is characterized in that, attract air vent hole to have symmetric shape with respect to pin hole.
6. according to each described chip pickup apparatus of claim 1～4, it is characterized in that a plurality of attraction air vent holes are configured to symmetric shape with respect to pin hole.
7. according to each described chip pickup apparatus of claim 1～6, it is characterized in that the pinhole size on the objective table is less than chip size.
8. according to each described chip pickup apparatus of claim 1～7, it is characterized in that the front end of pin is smooth.
9. chip pickup apparatus according to claim 8 is characterized in that the size of the smooth front end of pin is less than chip size.
10. the manufacture method of a chip pickup apparatus wherein in this chip pickup apparatus, will stick on chip jack-up on the paper with pin by paper, and chip is peeled off from paper, and this manufacture method is characterised in that,
Keep the periphery of body to be provided with pad at pin, make pin keep body to be fitted to the inboard of cylindrical body, the interior week and the pin that pad are clipped in cylindrical body keep between the periphery of body, between this, form the gap, keep forming on the body pin hole that spicula is gone out at pin, the gap between the periphery that the interior week and the pin of cylindrical body kept body is as the attraction air vent hole of vacuum suction paper.
11. a semiconductor-fabricating device is characterized in that, has each described chip pickup apparatus of claim 1～9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP029799/2002 | 2002-02-06 | ||
| JP2002029799A JP3945632B2 (en) | 2002-02-06 | 2002-02-06 | Chip pickup device, manufacturing method thereof, and semiconductor manufacturing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1437234A true CN1437234A (en) | 2003-08-20 |
| CN1329969C CN1329969C (en) | 2007-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031031382A Expired - Fee Related CN1329969C (en) | 2002-02-06 | 2003-01-30 | Chip pick-up device and producing method thereof and production apparatus of semiconductor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3945632B2 (en) |
| CN (1) | CN1329969C (en) |
| TW (1) | TWI234222B (en) |
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| CN100373536C (en) * | 2004-05-11 | 2008-03-05 | 先进自动器材有限公司 | Apparatus and method for semiconductor chip detachment |
| CN100547720C (en) * | 2004-10-29 | 2009-10-07 | 先进自动器材有限公司 | Driving mechanism for chip separation device |
| CN102254787A (en) * | 2010-05-21 | 2011-11-23 | 台湾积体电路制造股份有限公司 | Semiconductor chip separation device and method |
| CN103659813A (en) * | 2013-12-25 | 2014-03-26 | 大连佳峰电子有限公司 | Method for controlling movement of mechanism for semiconductor chip absorbing |
| CN104871659A (en) * | 2012-12-20 | 2015-08-26 | 富士机械制造株式会社 | Die supply device |
| CN109148352A (en) * | 2018-08-02 | 2019-01-04 | 上海天马微电子有限公司 | Transfer head array, transfer head and method for transferring inorganic light emitting diode |
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| JP5201990B2 (en) * | 2005-08-31 | 2013-06-05 | 芝浦メカトロニクス株式会社 | Semiconductor chip pickup device |
| JP4629624B2 (en) * | 2006-07-06 | 2011-02-09 | 芝浦メカトロニクス株式会社 | Semiconductor chip pickup device and pickup method |
| JP2011187665A (en) * | 2010-03-08 | 2011-09-22 | Denso Corp | Pickup device of semiconductor chip |
| TWI453851B (en) * | 2010-05-21 | 2014-09-21 | Taiwan Semiconductor Mfg | Semiconductor chip pickup apparatus and pickup method |
| CN115226411A (en) * | 2021-02-17 | 2022-10-21 | 株式会社新川 | Semiconductor die pick-up device and pick-up method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60211949A (en) * | 1984-04-06 | 1985-10-24 | Tokyo Sokuhan Kk | Pickupping method of chip in die-bonder |
| JPH09283540A (en) * | 1996-04-15 | 1997-10-31 | Sony Corp | Chip pickup structure and chip pickup method for die bonding apparatus |
| JPH1092907A (en) * | 1996-09-13 | 1998-04-10 | Nec Corp | Semiconductor chip pickup unit and method therefor |
| JP3440803B2 (en) * | 1998-02-06 | 2003-08-25 | 松下電器産業株式会社 | How to push up the chip |
| JP3611962B2 (en) * | 1998-03-26 | 2005-01-19 | 松下電器産業株式会社 | Chip push-up device |
-
2002
- 2002-02-06 JP JP2002029799A patent/JP3945632B2/en not_active Expired - Lifetime
-
2003
- 2003-01-24 TW TW92101589A patent/TWI234222B/en not_active IP Right Cessation
- 2003-01-30 CN CNB031031382A patent/CN1329969C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100373536C (en) * | 2004-05-11 | 2008-03-05 | 先进自动器材有限公司 | Apparatus and method for semiconductor chip detachment |
| CN100547720C (en) * | 2004-10-29 | 2009-10-07 | 先进自动器材有限公司 | Driving mechanism for chip separation device |
| CN102254787A (en) * | 2010-05-21 | 2011-11-23 | 台湾积体电路制造股份有限公司 | Semiconductor chip separation device and method |
| CN102254787B (en) * | 2010-05-21 | 2013-04-24 | 台湾积体电路制造股份有限公司 | Semiconductor chip separation device and method |
| CN104871659A (en) * | 2012-12-20 | 2015-08-26 | 富士机械制造株式会社 | Die supply device |
| CN104871659B (en) * | 2012-12-20 | 2017-10-03 | 富士机械制造株式会社 | Nude film feedway |
| CN103659813A (en) * | 2013-12-25 | 2014-03-26 | 大连佳峰电子有限公司 | Method for controlling movement of mechanism for semiconductor chip absorbing |
| CN109148352A (en) * | 2018-08-02 | 2019-01-04 | 上海天马微电子有限公司 | Transfer head array, transfer head and method for transferring inorganic light emitting diode |
| CN109148352B (en) * | 2018-08-02 | 2020-11-27 | 上海天马微电子有限公司 | Transfer head array, transfer head and method for transferring inorganic light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3945632B2 (en) | 2007-07-18 |
| TWI234222B (en) | 2005-06-11 |
| CN1329969C (en) | 2007-08-01 |
| TW200303067A (en) | 2003-08-16 |
| JP2003234396A (en) | 2003-08-22 |
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