TWI234222B - Chip pickup device, its manufacturing method and semiconductor manufacturing device - Google Patents

Abstract

The present invention relates to a chip pickup device capable of easily peeling off chips from a passivation layer without having to particularly adjust the push-up stroke of a pushing pin and the ascending/descending position of a supporting stage, and also its manufacturing method and semiconductor manufacturing device. The pushing pin 17 is protruded out of a pin hole 16. The pushing pin 17 is used to push a chip 102 via a passivation layer 101. The passivation layer 101 is sucked and drawn near the venting hole 15, but is not sucked and drawn near the pin hole 16. The passivation layer 101 is propped up at the vicinity of the pin hole 16 to be separated from the supporting stage 14, thereby peeling off the chip 102 from the passivation layer 101. Therefore, it is able to keep the stroke of the pushing pin 17 constant without modifying or adjusting the position of the supporting stage 14. In addition, because there is no absorbing force of air in the pin hole 16, it is easy to peel off the chip 102 from the passivation layer 101.

Description

1234222 玖 发明, description of the invention (the description of the invention should state: the technical field, prior art, content, real money, and drawings of the genus of the genus) [Technical Field] This invention relates to the supply of wafers for electronic parts A wafer pick-up device, a manufacturing method thereof, and a semiconductor manufacturing device. [Prior art] As such a conventional device, for example, there are devices shown in Figs. 6 (a) and (b). In this device, the wafer 102 with electronic parts and the like attached to the protective layer \ 01 is pushed through the protective layer 101 through the protective layer 101, and the wafer 102 is peeled off by the protective layer 101, and then the suction tool ( (Not shown) The wafer 102 is sucked and picked up, and then the wafer 102 is supplied to a welding head or the like of a wafer bonding apparatus. As shown in Figs. 7 (a) and 7 (b), the inner cylindrical ring 111 'is covered with the protective layer 101 and the outer cylindrical ring 丨 2 is covered with the protective layer 101. It fits into the inner cylindrical ring 111 and sandwiches the peripheral edge of the support protective layer 101, so that a plurality of wafers 102 are arranged on the protective layer 101 in an array. When peeling, the protective layer 101 is moved, and each wafer 102 is pushed up by the push pin 103 in order to be peeled off. Here, only the periphery of the protective layer 101 is supported. Therefore, when one wafer 102 is pushed up with the push pin 103, the entire protective layer j 〇 丨 will be supported. 101 fully peels off the wafer 102, and it is necessary to increase the pushing stroke of the push pin 103. In addition, in order to reliably peel off the wafer 102 from the protective layer 101, it is necessary to appropriately narrow the leading end of the push pin 103. However, when the pushing stroke of the push pin i 〇3 is increased and the leading end of the push pin 103 is thinned, the protective layer 101 may be punctured by the push pin 103. In addition, the protective layer 101 is supported by 1234222 (2) I plane near the center and the periphery of the protective layer 101. Although the push pin is peeled off to remove the wafer 1 02 from the protective layer 1 01 1 03 The most suitable up-stroke for up-stroke is not the same, but it is quite difficult to adjust and control this stroke. In addition, when the push pin 103 is pushed up repeatedly, the protective layer 10 is slowly supported and the peeling of the wafer 102 gradually becomes difficult, so that the peeling operation cannot be performed stably. Therefore, it has been proposed to use the device shown in FIG. In this device, the push pin 122 is inserted inside the support table m arranged in the cylindrical body. In addition, by using the spherical upper end of the support table 121, the protective layer 丨 〇 丨 is pushed up. Even at any position of the protective layer 1 01, the protective layer 1 〇1 can be attached near the upper end of the support table 12 丨. With a certain tension, the wafer 102 on the upper end of the supporting table 121 by the push pin 22 is pushed and peeled off. At this time, since a certain tension is applied to the protective layer 101 near the upper end of the support table j 2 丨, the upward stroke of the push pin 122 can be kept constant. In addition, since the protection layer 101 will be supported near the upper end of the support table 121, the wafer 1 〇2 has been peeled off by the protective layer} 〇 丨, and it can be easily pushed on the push pin 122 The ground was peeled. However, in this kind of device, even if the push stroke of the push pin 122 can be kept constant, the lifting position of the support table 121 for applying a certain tension to the protective layer 101 near the center and the periphery of the protective layer 101 is also maintained. There will be differences, so it is difficult to adjust and control the position of the support table 121. Therefore, it has been proposed to use the device shown in FIG. In this device, the push pin 132 is arranged inside the support base 131 of the cylindrical body, and a pin hole nib for protruding the push pin 132 is formed in the center of the flat plate portion 131a of the support base 131, and the flat plate portion 13 la The pinhole 13 lb is formed around the majority of the suction holes 13 ". And 1234222

(3) By sucking the air inside the support table i 3 i and exhausting the air, the protective layer 101 is adsorbed on the flat plate portion 13u by using the suction holes 131c of the flat plate portion 13a. 132 pushes the wafer 102 up and peels it off. At this time, since the protective layer 101 is attracted to the flat plate portion 31a, the pushing stroke of the push pin 1 32 can be kept constant, and there is no need to change or adjust the position of the support table 131. Among these conventional devices, the users now mainly use the device shown in Fig. 9.

[Problems to be Solved by the Invention] However, in the device shown in FIG. 9, since the pinhole 13 lb and each suction hole 131c are communicated inside the support table 131, air is also sucked in through the pinhole nib. Actually, As shown in FIG. 10, the protective layer 101 will be in close contact with the front end of the push pin 132, so that the protective layer 101 cannot be supported at the front end of the push pin 132, and it is difficult to peel off the wafer 102 from the protective layer 101. problem. This book is designed to solve the above problems, and its purpose is to provide a pick-up device that can easily peel off the wafer from the protective layer without special adjustment of the push stroke of the push pin and the lifting position of the support table. ,its

Manufacturing method and semiconductor manufacturing device. [Summary of the invention] The problem of the accompanying solution is that the pick-up device of the wafer of the present invention is a pick-up device that uses a push pin to push the wafer attached to the protective layer on a protective layer to peel off the wafer: In the process, the pin hole protruding the f push pin on the carrying protective layer is formed separately from the suction vent hole that sucks the protective layer on the supporting table. The present inventor based on such a structure, because of the support stand on which the protective layer is placed -7-1234222

The pin hole that makes the push pin protrude and the chaos hole that is used to attract the protective layer to the support pin are formed separately. Therefore, in the state that the protective layer is absorbed on the support table by using the suction vent, the wafer is pushed up by the push pin and peeled off by the protective layer, so there is no need to adjust the push stroke of the push pin and the support table. Position ^, and because the pinhole is separated from the suction vent hole, air will not be sucked in by the pinhole, and the protective layer will not be in close contact with the front end of the push pin due to the suction of air, so it can be easily formed by the protective layer Peel off the wafer. In the present invention, the support table comprises a cylindrical body standing upright and a push pin holder arranged in the cylindrical body. A pad is provided on the outer periphery of the push pin holder, and the pepper pad is used in the cylindrical shape. A gap is formed between the inner periphery of the body and the outer periphery of the push pin holder. The protective layer is placed on the cylindrical body and the upper end surface of the push pin holder. A pin hole is formed in the push pin holder to make the push pin protrude. The gap between the inner periphery of the body and the outer periphery of the push pin holder serves as a suction ventilation hole for air. With such a simple structure, a suction air hole can be formed around the pinhole ', and the wafer can be reliably peeled off by pushing the wafer with a push pin across the protective layer at approximately the center of the area where the retaining layer is held. Wafer. In addition, in the present invention, a plurality of pads are separated and arranged in the vertical direction. When the push pin holder is pressed into the inside of the cylindrical body, when the pads are separated and arranged in the up-down direction, this push-in operation can be easily performed, and the push pin holder can be reliably positioned on the cylindrical body. Inside. In addition, in the present invention, the shape of the suction vent hole on the support table is set such that the size of the suction region of the wafer through the suction layer through the protective layer is smaller than the size of the wafer. In this way, set the size of the attraction area of the wafer to be smaller than the size of the wafer (5) 1234222

When the protection layer is moved on the support table, the wafer can be prevented from being embedded in the suction vent. In the present invention, the suction vent hole has a shape symmetrical to the pinhole. At this time, the protective layer is sucked in places commensurate with the pinholes. Therefore, when the wafer is pushed up with the push pin across the protective layer, the stress generated between the front end of the push pin and the place will be dispersed. Stress on the protective layer and the wafer

It also disperses, which prevents the wafer from being damaged or the wafer being ejected from the protective layer. For example, if the suction vents are in the shape of a concentric circle with the pinholes, the symmetrical suction vents can be easily formed. In addition, it is preferable that the suction vent hole has a shape capable of easily holding a substantially entire area of the wafer. In this case, when the wafer is pushed up with a push pin through a protective layer, the wafer can be reliably peeled off. In the present invention, a plurality of suction vent holes are arranged in a shape symmetrical to the pin holes. In this case, it is easier to freely set the suction vent through the protective layer.

The shape of the attraction area of the attraction wafer and the attraction of the wafer can be appropriately dispersed. In the present invention, the size of the pinhole is set to be smaller than the size of the wafer on the support table. When the pinhole size is set in this way, the chip can be prevented from being embedded in the pinhole when the protective layer is moved on the support table. X 'In the present invention, the front end of the pinhole is formed into a flat shape. On this day, when the spear J pushes the wafer up with a push pin, the protective layer + will be broken by the 9-9-1234222 before the push pin, and the calculation will be broken by j, and the stress acting on the wafer will be dispersed without harming The wafer is peeled off. In addition, in a state where the wafer is pushed up with the flat tip of the push pin across the protective layer, when the wafer is peeled off by the protective layer without piercing the protective layer, fragments of the protective layer or its adhesive will not adhere to In the manufacturing process on the wafer after picking up the wafer, it is possible to prevent the occurrence of soldering of the wafer caused by the fragments of the protective layer or the adhesive on the back of the wafer. In the present invention, the size of the flat tip of the push pin is set to the size of the wafer or less. For example, set the diameter of the flat tip of the push pin to 1/2 to 1/5 of the short side of the wafer, or set the diameter of the flat tip of the push pin to approximately 1/4 of the length of the short side of the wafer. . With the setting of the flat end size of such a push pin, the wafer can be peeled off from the protective layer without puncturing the protective layer. Secondly, the manufacturing method of the wafer picking device of the sun and the moon is through a protective layer, and the push pin pushes the wafer attached to the protective layer, so that the protective layer can be used to push the wafer and push it. A pad is provided on the outer periphery of the needle holder to fit the pusher holder to the inside of the cylindrical body, and the pad is sandwiched between the inner periphery of the cylindrical body and the outer periphery of the pusher holder to form a gap therebetween. The pin hole protruding the push pin is formed in the push pin holder, and the gap between the inner periphery of the cylindrical body and the outer periphery of the push pin holder is used as the suction ventilation hole of the vacuum suction protection layer. According to the manufacturing method of the present invention, the pickup device of the present invention can be easily manufactured. The semiconductor manufacturing apparatus of this month includes the pickup apparatus of the present invention. In such a semiconductor manufacturing apparatus of the present invention, since -10-Ϊ 222222 of the present invention is included

⑺ Picking device, so that the process of peeling off the protective layer and picking up the crystal 1 can be carried out reliably and quickly, without delaying or stopping the process, etc., and shortening the wafer soldering process and wire bonding process following this process. The running time. Therefore, a semiconductor manufacturing apparatus such as a wafer bonding apparatus and a wire bonding apparatus with high reliability can be realized. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a partial cross-sectional view showing an embodiment of a pickup device according to the present invention. In the pickup device 11+ of the present embodiment, a cylindrical body 12 is erected, and a push pin holding body 13 is arranged inside the cylindrical cymbal 12 to constitute a support table 14. A space is formed between the inner periphery of the cylindrical body and the outer periphery of the push pin holder 13, and the gap is used as an air suction vent 15 for air. Further, a pin hole 16 is formed in the pin holding body 13 and a pin 17 is inserted into the pin hole 16. The suction vent 15 is connected to a vacuum pump (not shown), and the air in the suction vent 15 is attracted by the vacuum pump. In addition, the pinholes 16 are formed so as to be completely separated by the suction vent holes 15, so that the air in the pinholes 16 is not attracted. 2 (a), (b), and (d) are side views showing the cylindrical body 12, the push pin holding body 13, and the push pin 17, respectively. X, Fig. 2 is a plan view showing the push pin holding body 13. The cylindrical body 2 is a metal cylindrical product having a hole na at its upper end and a flange 12b at its lower end. The flange 12b is mounted on the apparatus body, thereby positioning and fixing the support table 14. The push pin holding body 13 has a cylindrical frame na at its upper end portion, so that the push pin port can protrude from the inside of this cylindrical frame 13a. There are two 1234222 on the outer periphery of the push pin holder 13.

In summary, 18 and 19, grooves 18a and 19a are formed in the gaskets 18 and 19, respectively. Insert the push pin holder 13 into the inside of the cylindrical body 12 and press the pads 18 and 19 of the push pin holder j 3 into the cylindrical body 12 so that the pad 18 is blocked against the inner wall of the upper side of the cylindrical body 12 12c to integrate the cylindrical body 12 and the push pin holder ^. A gap is formed between the inner periphery of the cylindrical body 12 and the outer periphery of the push pin holder Η with each of the pads 18 and 19, and the gap is used as the suction vent hole 15. Since the grooves 18a and 19a are formed in the gaskets 18 and 19, respectively, the suction ventilation holes 15 are not blocked by the gaskets 18 and 19. In addition, the outer diameter of the cylindrical frame 13a of the push pin holder 13 is smaller than the inner diameter of the hole 12a of the cylindrical body 12, and the suction vent hole 15 # pinhole 16 is concentrically circled on the support table 14. If the suction ventilation holes 15 and the pinholes 16 are arranged symmetrically, the concentric circular suction ventilation holes 5 are the easiest to manufacture. Further, since the pads 18 and 19 are provided at two locations, the pressure for pressing the pads 18 and 19 can be reduced, and the assembling of the support table 14 can be made easier. If a pad covering the entire periphery of the push pin holding body 13 is provided, the pressure of pressing into the pad will be 'k extremely large', making it difficult to assemble the support table 14. In addition, when the pads 8 and 19 are pressed in, it is not necessary to use a bonding agent to fix the push pin holder 13 to the cylindrical body 12. Therefore, it is possible to prevent the wafer from being subjected to the bonding agent when processing wafers such as electronic parts described later. Pollution. In addition, it is easier to machine the upper end surface of the cylindrical body 12 and the upper end surface of the cylindrical frame 13a of the push pin holder 13, that is, the upper surface of the support table 14, into a smooth surface. In use, the cylindrical body 12 and the push pin are held The upper surface of the support table 14 will not be deformed due to looseness between the bodies 丨 3. The end surface 17a before the push pin 17 is flat. Assuming that the position of the previous end surface i7a is D ', this diameter D is made smaller than the size of the wafer. In this pick-up device 11 ', an arrangement is placed on the support table 14 as shown in FIG. 7 -12- 1234222

(9) The protective layer 101 of most wafers 102 is shown. At this time, as shown in FIG. 1, the suction vent hole 15 will be blocked by the protective layer 101, so that the suction vent hole 15 becomes a negative pressure, and the protective layer 101 is sucked on the support table 14. However, since the pinhole 16 is completely separated from the suction ventilation hole 15, the protective layer 101 is not attracted near the pinhole 16. Here, as shown in FIG. 3, the protective layer 101 is moved in the direction of the arrow A, and as shown in FIG. 1, one wafer 102 is positioned directly above the front end 17a of the push pin 17. When the push pin 17 is protruded from the pin hole 16 and the push pin 17 is pushed up by the push pin 17 with the protective layer 101 interposed therebetween, the protective layer 1 〇1 will be near the suction vent hole 15. If it is sucked, the protective layer 10 will not be sucked near the pinhole 16, so the protective layer 101 will be supported only near the pinhole 16 and detach from the support table 14, so that the wafer 102 is protected by the protective layer. 1 〇1 is peeled. The wafer 102 is picked up by a suction tool (not shown), and then the wafer 102 is supplied to a soldering head of a wafer soldering apparatus or the like. As described above, in this embodiment, the wafer 100 can be pushed up by the push pin 17 to be peeled off while the protective layer 101 is sucked on the support table 14. Therefore, the upward stroke of the push pin 17 can be kept constant, and there is no need to change or adjust the position of the support table 14. In addition, since the pinhole 16 has no air suction force, the protective layer 101 is not closely adhered to the front end of the push pin as in the past, and it is difficult to peel off the wafer 102 by the protective layer 100. Moreover, since the 15 pairs of suction holes 16 are arranged in a concentric circle, the protective layer 101 is sucked by the entire periphery of the pin hole 16, and therefore, the wafer is pushed by the push pin 17 through the protective layer ι〇1. When the 102 is pushed up, the stress generated between the front end 17a of the push pin 17 and the entire periphery of the pinhole 16 will be dispersed in the protective layer, and the stress applied to the wafer 102 will also be dispersed, so the wafer 1 can be prevented. 2 is damaged, or the wafer 102 is ejected from the protective layer 101. (10) 1234222

In addition, since the front end portion 17a of the pinhole 17 is flat, it is easier to peel off the wafer 102 from the protective layer 101 without piercing the protective layer 101, and the stress acting on the wafer 102 can be dispersed by this. It can prevent the wafer 102 from being damaged or the wafer ι02 being ejected from the protective layer 101. In addition, the fragments of the protective layer 101 or the adhesive will not adhere to the back surface of the wafer 102. In the wafer soldering device and the like, the fragments of the protective layer on the back surface of the wafer 102 and the adhesive of the protective layer can be prevented. Defective wafer welding caused by adhesion. Tong Wei ideally sets the diameter D of the front end 17a of the push pin 17 to 1/2 to 1/5 of the length of the short side of the wafer 102, and sets the diameter D to the short side of the wafer 102 A degree of about 1/4 is better. For example, when the length of the short side of the wafer 102 is 180 μm to 220 μm, if the diameter 0 of the front end 17a of the push pin 17 is set to 30 μm, 50 μm, and 100 μm, then The wafer 102 is easily peeled from the protective layer 101. When the diameter d is set to 50 μm which is approximately 1/4 of the length of the short side of the wafer 102, it is easiest to peel off the wafer 102 from the protective layer 101 and the pinhole 16 on the support table 14 The inner diameter is set below the length of the short side of the wafer 102. During the movement of the protective layer 101, the wafer 10 can be prevented from being embedded in the pinhole 16. On the other hand, the inside diameter of the suction vent hole 15 on the support table 14 is preferably as small as possible. This is because the closer the suction vent hole 15 is to the pin hole 16 ′, the shorter the pushing stroke above the push pin 17 required to peel off the wafer 102 from the protective layer 101 can be shortened. Also, the width h of the suction ventilation hole 15 on the support table 14 (as shown in FIG. 3) should be as narrow as possible within the range where sufficient attraction can be obtained to prevent the wafer 1 〇 2 (ii) 1234222

Embedded in the suction ventilation hole 15. Especially in the moving direction of the protective layer 101 to the arrow A, it is necessary to set the width h of the suction vent hole 15 to be smaller than the width of the wafer 102, or because the wafer 102 is rectangular, it is also set to be smaller than the wafer j. 2 of the short side. If the width h of the suction ventilation hole 15 is wider than the width or short side of the wafer 102, the wafer 102 may be embedded in the suction ventilation hole 15. FIG. 4 is a plan view showing a modified example of the pickup device 11. Here, as the wafer 102A, the lengths of the long side and the short side of the wafer 102 are largely different, and the shape of the hole 12a of the cylindrical body 12 is set to an oval shape. Therefore, the suction vent hole 15 has an oval shape on the support table 14 and is symmetrical to the pin hole 16, but is not concentric. The suction ventilation hole ι5 is extended along the long side of the wafer 102A by the gray system. Therefore, the suction ventilation hole 15 can be used to suck almost the entire area of the wafer ι〇2A. In the direction of the long side of the wafer 102A, although the wafer i02a is more strongly attached to the protective layer 101, the protective layer 101 can be surely sucked on the support table 14 by the oval-shaped suction ventilation hole 15, which is easy. The wafer OM2A is peeled off by the protective layer 101. Further, in the moving direction of the protective layer 101 toward the arrow A, the width h of the suction vent hole 15 is kept to a narrow value of the rider's, so the wafer 102A will not be embedded in the suction vent hole 15. FIG. 5 is a plan view showing another modification of the pickup device 11. Here, the hole diameter of the hole 12a at the upper end portion of the cylindrical body 12 is reduced, and the cylindrical frame 13a at the upper end portion of the push pin holder 13 is fitted into this hole 12a. 12d is formed symmetrically with the pinhole 16. That is, on the support table 4 ', the holes 12 (1 that lead to the suction vent hole 15 are arranged in a symmetrical state with the pin holes 16. At this time, it is easier to set freely through the protective layer 10i By using the shape of the suction area of the wafer 1 02 by each hole 12d, even if the size of each hole 12d is set below the size of the wafer 102, a large additional 1234222 can be obtained.

(12) The force can be appropriately distributed, and the attractive force to the wafer 102 can be appropriately dispersed, so that the wafer 102 can be prevented from receiving the shells' or the wafer 102 can be ejected from the protective layer 101. The present invention is not limited to the above-mentioned embodiments, and various modifications can be made. For example, the shape, number, and configuration of the suction vents on the support table can be variously deformed. In addition, the present invention is not limited to the pick-up apparatus' but also includes a semiconductor manufacturing apparatus including a wafer bonding apparatus, a wire bonding apparatus, and the like having the pick-up apparatus. [Effect of the invention] As described above, according to the present invention, in a state where the protective layer is attracted to the service support table by using the suction vent hole, the wafer is pushed up by using a push pin and the layer is peeled off, so no need Specially adjust the upward stroke of the push pin and the lifting position of the support table, and because the pin hole is separated from the suction vent hole, air will not be sucked in by the pin hole, and the protective layer will not be in close contact with the air due to the suction force of the air. Push the front end of the pin, so the wafer can be easily peeled off by the protective layer. Also according to the present invention, a pad is provided on the outer periphery of the push pin holder, and a gap is formed between the inner periphery of the cylindrical body and the outer periphery of the push pin holder by using the spacer, and a protective layer is placed on the cylindrical body. And the upper end surface of the push pin holder, a pin hole is formed in the push pin holder to make the push pin protrude, and a gap between the inner periphery of the cylindrical body and the outer periphery of the push pin j holder is used as an air suction vent. With this early structure, suction vent holes can be formed around the pinholes, and the wafers can be peeled greenishly through the protective layer by pushing the wafer up through the protective layer at approximately the center of the suction / k layer area. Under the wafer. In addition, according to the present invention, since the pads are arranged separately in the up-down direction, the push pin holder can be easily pressed into the inside of the cylindrical body, and the push can be pushed -16-1234222.

The needle holding body is surely positioned inside the cylindrical body. In addition, according to the present invention, since the size of the suction area of the wafer is smaller than the size of the wafer, the protective layer is moved on the support table to prevent the wafer from being embedded in the suction ventilation hole.守 ’可

In addition, according to the present invention, since the suction vent hole has a shape similar to that of the pinhole, the protective layer is attracted at places commensurate with the pinhole. Therefore, when the wafer is pushed up with the push pin through the protective layer, the The stresses generated between the front end of the needle and the four points will be dispersed and act on the protective layer, and the stress will be dispersed on the wafer. &Amp; It can prevent the wafer from being damaged or the wafer from being bounced by the protective layer; and according to the present invention Since most of the suction vent holes are arranged so that the holes are relatively symmetrical, it is relatively easy to freely set the shape of the suction area of the wafer through the protective layer through the suction vent holes, and the attraction of the wafer can be appropriately dispersed. . For example, it is easier to form a symmetrical suction vent if the suction vent is in a concentric circle shape with the pinhole. In addition, Ke Guyi can suck the ventilation hole of the shape of the entire area of the Japanese film to attract the vent hole. The reason is that when the wafer is pushed up with a push pin across the protective layer, you can be sure. Peel off the wafer. In addition, according to the present invention, since the pinhole is placed on the support table and the size of the pinhole is smaller than the size of the wafer, it is possible to prevent the chip from being embedded in the pinhole when the protective layer is moved on the support table. According to the date and month of this issue, because the front end of the push pin is formed into a flat shape, using the push pin to push the θθ sheet on the sun $, the protective layer will not be punctured by the front end of the push pin, and the stress acting on the wafer is dispersed. Without damaging the chip, -17- (14) 1234222

/. In addition, 'in a state where the wafer JI | | > is peeled from the protective layer with the flat tip of the push pin across the protective layer, the protective layer fragments or the agent fragments will not adhere to the back of the wafer, In the plate making process after picking up this wafer, it can prevent the occurrence of chip soldering defects caused by the fragments of the protective layer or their adhesives being attached to the surface of the wafer.

In addition, according to the present invention, the size of the flat tip of the push pin is set below the size of the wafer. For example, the diameter of the flat front end of the push pin is set to 1/2 to 1/5 of the length of the side of the wafer, or the diameter of the flat front end of the push pin is set to about 1/4 of the length of the edge of the wafer. . Therefore, the wafer can be reliably peeled off from the protective layer without piercing the protective layer. Next, according to the manufacturing method of the present invention, since two pads are provided on the outer periphery of the push pin holder, the push pin holder is fitted into the inside of the cylindrical body, and the inner periphery of the same shape body and the push pin are held. Between the outer periphery of the body, forming a gap there will form a pin hole protruding from the push pin in the push pin holder. Use the gap between the inner periphery of the cylindrical body and the outer periphery of the push pin holder as a suction suction protection layer. Stomata. Therefore, the wafer pickup of the present invention can be easily manufactured.

= In the semiconductor manufacturing system of the present invention, since the film picking device of the present invention is included, the process of peeling the X film from the protective layer can be performed quickly and reliably. Following this process, the wafer soldering technicians and the wire bonding process flow time. Because of &, it is possible to realize a highly reliable wafer soldering device and wire soldering vibration device. [Brief description of the drawings] FIG. 1 is a partial cross-section showing an embodiment of a pickup device of the present invention -18- 1234222 〇5)

Face view. Figs. 2 (a), (b), and (d) are side views showing the μ-shaped body, the push pin holding body, and the push pin of the pickup device of this embodiment, respectively. Also, the tube you show the plan view of the holding body. 4 FIG. 3 is a plan view showing a sheet on a supporting table of the pickup device of this embodiment. Fig. 4 is a plan view showing a modification of the pickup device according to this embodiment. Fig. 5 is a plan view showing another modification of the pickup device according to this embodiment. Fig. 6 (a) is a side view showing a conventional device, and (b) is a side view showing an operation state of the device. Figs. 7 (a) and 7 (b) are a plan view and a side view showing a state in which a plurality of wafers are arranged and pasted on a protective layer. Fig. 8 is a side view showing another conventional device. Fig. 9 is a side view showing another conventional device. FIG. 10 is a side view showing the operating state of the device of FIG. 9. [Illustration of Symbols in the Drawings] State of the Face 11 Pickup Device 12 Cylindrical Body 13 Pushing Pin Holder 14 Support Stand 15 Suction Ventilation Hole 16 Pinhole 17 Pushing Pin-19- 1234222 (16) 明 _ 明 _ 页 18 , 19 gasket 101 protective layer 102 wafer

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Claims (1)

Patent No. 1234222 ^ 〇H01589 Replacement of the benefit range (July 1993) Month > Japanese pick-up, patent application range L A pick-up device for a wafer, which is pushed on the wafer attached to the protective layer t through a protective layer with a push pin, Those who are separated from the wafer by α through the protective layer are characterized in that: on the support table carrying the protective layer, the pin holes that make the push pins protrude from the suction vents that attract the protective layer to the air used on the support table are separated And formed. 2. The wafer picking device according to item 1 of the patent application scope, wherein the support table includes a standing cylindrical body and a push pin ^ holding body arranged in the cylindrical body, and μ is held in the push pin. A pad is provided on the outer periphery of the body. With this pad, a gap is formed between the inner periphery of the cylindrical body and the outer periphery of the push pin holder. A protective layer is placed on the upper end surface of the cylindrical body and the push pin holder. The push pin holding body forms a pin hole through which the push pin protrudes, and uses a gap between the inner periphery of the cymbal body and the outer periphery of the push pin holding body as an air suction vent. 3. The wafer picking device according to item 2 of the patent application, wherein most of the pads are separated and arranged in the up-down direction. 4. The device for picking up a wafer according to any one of items 1 to 3 of the patent application, wherein the size of the suction region of the wafer through the protective layer through the suction vent is smaller than the size of the wafer, The shape of the suction vents set on the support table. 5. The wafer pick-up device as claimed in any one of claims 1 to 3, wherein the suction vent hole has a shape symmetrical to the pinhole. 6. Pick-up device for wafers according to any one of patent application scopes 1-3: 83281-930702 1234222 Among them, most suction vent holes are arranged in a symmetrical shape with respect to the pin holes. For example, the device for picking up a wafer according to any one of claims 1 to 3 is claimed. ′ In the support table, the size of the pinhole is set below the size of the wafer. 8 * The pickup device for a wafer according to any one of claims 1 to 3, wherein the front end of the pinhole is formed into a flat shape. 9. The wafer picking device according to item 8 of the patent application, wherein the size of the flat front end of the push pin is set below the size of the wafer. 10. A manufacturing method of a wafer picking device, which uses a push pin to push a wafer attached to the protective layer through a protective layer, thereby peeling off the wafer by the protective layer; characterized in that ... A pad is provided on the outer periphery of the needle holder to fit the pusher holder into the inner body of the cylindrical body J, and the liner is sandwiched between the inner periphery of the cylindrical body and the outer circumference of the pusher body to form a gap therebetween. The pin hole that makes the push pin protrude is formed in the push pin holder, and the gap between the inner periphery of the cylinder and the outer body of the push pin holder is used as the suction ventilation hole of the vacuum suction protective layer. 11. A semiconductor manufacturing apparatus, characterized in that it includes a pickup device as claimed in any one of claims 1 to 9. Yes 83281-930702 -2-