TWI396241B - A semiconductor wafer picking device - Google Patents

Description

Semiconductor wafer pick-up device Technical field

The present invention relates to a pick-up device and a pick-up method for picking up a semiconductor wafer attached to an adhesive sheet.

Background technique

The semiconductor wafer formed by cutting the semiconductor wafer into small squares is adhered to the adhesive sheet, and is picked up one by one from the adsorption sheet by a suction nozzle when the semiconductor wafer is bonded to the substrate.

As disclosed in the patent document 1 of the prior art, when the semiconductor wafer is picked up from the adhesive sheet, the peripheral portion of the semiconductor wafer to which the adhesive sheet of the semiconductor wafer picked up by the nozzle is attached is adsorbed and held by the support body, and the tip end is sharply pointed. The pin lifts the semiconductor wafer from below to perform a picking operation by the suction nozzle while separating the semiconductor wafer from the adhesive sheet.

[Patent Document] JP-A-2002-100644

Invention

However, extremely thin semiconductor wafers having a thickness of 50 μm or less have recently appeared. Once the thin semiconductor wafer is lifted by the sharpened top pin, the pressure will concentrate on where the front end of the pin is in contact. As a result, the semiconductor wafer may be damaged due to the pressure generated by the pin.

Although it is considered to reduce the ejector speed of the semiconductor wafer of the above-mentioned top pin to prevent the semiconductor wafer from being damaged due to pressure concentration, once the jacking speed of the pin is lowered, the picking speed is also slow, resulting in a decrease in productivity, and When the aforementioned semiconductor wafer is thin, it is difficult to surely prevent damage even if the jacking speed is lowered.

The present invention provides a pick-up device and a pick-up method which can reliably peel the aforementioned semiconductor wafer from the adhesive sheet without damage.

That is, the present invention is a semiconductor wafer pick-up device for picking up a semiconductor wafer attached to an adhesive sheet, comprising: a support body formed on the upper surface as an adsorption surface, and the adsorption surface can adsorb and hold the adhesive sheet corresponding to being picked up a portion of the area surrounding the semiconductor wafer; the push-up mechanism is configured to be driven in the up-and-down direction in the support body, and pushes the adhesive sheet to be picked up under the semiconductor wafer attaching portion to be above the support body And the pick-up mechanism is configured to adsorb and hold the upper surface of the semiconductor wafer and pick up the semiconductor wafer pushed up by the push-up mechanism from the adhesive sheet.

Simple illustration

Fig. 1 is a schematic structural view showing a pick-up device according to a first embodiment of the present invention.

Fig. 2A is a longitudinal sectional view of the support.

Fig. 2B is an exploded perspective view showing the upper portion of the push-up shaft and the lower nozzle body.

Figure 3 is a plan view showing the adsorption surface of the support.

Fig. 4A is an explanatory view when the nozzle body is lowered.

Fig. 4B is an explanatory view when the lower adsorption nozzle body is raised.

Fig. 4C is an explanatory view when the semiconductor wafer is pushed up by the lower adsorption nozzle body.

Fig. 4D is an explanatory view of a case where a semiconductor wafer pushed up by a lower adsorption nozzle body is picked up by a suction nozzle.

Fig. 5 is an enlarged cross-sectional view showing the semiconductor wafer picked up by the lower nozzle body.

Fig. 6A is a cross-sectional view showing the upper portion of the support of the second embodiment of the present invention.

Figure 6B is a perspective view of the upper part of the support

Fig. 6C is a plan view of a disk-shaped body provided at the upper end of the push-up shaft.

Fig. 7 is a longitudinal sectional view showing an upper portion of a support according to a third embodiment of the present invention.

Fig. 8 is a longitudinal sectional view showing an upper portion of a support according to a fourth embodiment of the present invention.

Fig. 9 is a perspective view showing the push shaft and the lower pusher on the fifth embodiment of the present invention.

Fig. 10 is a longitudinal sectional view showing the upper portion of the support of the sixth embodiment of the present invention.

Figure 11 is a plan view of the seat disposed at the upper end of the push-up shaft.

Figure 12 is a plan view showing the upper surface of the support.

Figure 13 is a plan view showing the upper surface of a support of a seventh embodiment of the present invention.

Preferred embodiment of the invention

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 to Fig. 5 show a first embodiment of the present invention. The pick-up device shown in FIG. 1 has a support unit 10, and the support unit 10 is disposed on the lower side of the adhesive sheet 2 which is extended and mounted on the unillustrated slice, and is driven in the Z direction by a Z drive (not shown). As described below, the position on the support 1 contacting the adhesive sheet 2 is driven between the position away from the adhesive sheet 2.

A plurality of semiconductor wafers 3 for dividing the semiconductor wafer into four squares are attached to the adhesive sheet 2. The slice is driven in the horizontal direction by X and Y drive sources not shown.

As a result, the semiconductor wafer 3 adhered to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the support unit 10. Alternatively, the slice may be driven in the Z direction instead of the support unit 10, and as long as the slice is driven in the X, Y, and Z directions with respect to the support unit 10.

On the upper surface side of the adhesive sheet 2, a suction nozzle mechanism 4 constituting an upper portion of the pickup mechanism is disposed above the support unit 10. The upper nozzle mechanism 4 has a pickup shaft 5 that is driven in the X, Y, and Z directions by X, Y, and Z driving sources (not shown), and a convex portion 6 is provided on the lower end surface of the pickup shaft 5.

A suction hole 7 whose front end opens toward the end surface of the convex portion 6 is formed in the pickup shaft 5 along the axial direction, and the suction hole 7 is connected to a suction pump (not shown). Further, the upper convex portion 6 is provided with an upper adsorption nozzle body 8 which is formed of an elastic material such as rubber or soft synthetic resin which can be attached and detached. One end of the upper adsorption nozzle body 8 communicates with the aforementioned suction hole 7, and a mouth hole 9 whose other end is open toward the front end surface is formed, and a flat surface 8a is formed on the lower surface.

Further, a voice coil motor or the like can be used as the Z drive source for driving the pickup shaft 5 in the Z direction, and it is preferable to control the generation of the upper nozzle mechanism 4. The pushing load is a fixed weight.

As shown in FIG. 2 and FIG. 3, the support body 1 has a cylindrical shape in which the lower end surface is open and a rectangular opening portion 12 is formed in the upper surface, and the opening portion 12 is formed to be slightly smaller than the chain line in FIG. The object to be picked up, that is, the rectangle of the rectangular semiconductor wafer 3. That is, the opening portion 12 is formed in a shape similar to that of the semiconductor wafer 3.

As shown in Fig. 3, three annular grooves 14a to 14c surrounding the opening portion 12 are concentrically formed on the support body 1, and three annular grooves 14a to 14c are formed to penetrate along the radial direction of the support body 1. The two communication grooves 15 communicate with each other. The communication groove 15 is formed in parallel with the opposite sides (ends) of the semiconductor wafer 3 to be picked up, and is located outside the aforementioned side.

Further, although not shown in the drawing, the communication groove 15 may be formed on the support body 1 so as to be parallel to the other two sides of the semiconductor wafer 3, and to be located outside the side.

The innermost annular groove 14 is penetrated through the upper wall of the support body 1 in the thickness direction at intervals of 90 degrees in the circumferential direction to form four suction holes 16a. Next, the diameter of the annular groove 14a is set to be larger than the length of the diagonal line of the semiconductor wafer 3 to be picked up.

In the second annular groove 14b, two suction holes 16b are formed at intervals of 180 degrees in the circumferential direction. As described below, the suction force acts on the annular grooves 14a to 14c and the communication groove 15 through the suction holes 16a and 16b. Further, the annular grooves 14a to 14c and the suction holes 16a and 16b are only shown in Fig. 3, and are omitted in the other drawings.

As shown in FIG. 2A, a cylindrical blocking member 21 that hermetically fits a part of the opening is provided at a lower end of the support body 1, and the blocking member is provided. The center portion of the 21 is provided with an insertion hole 22 penetrating in the axial direction. In the insertion hole 22, the push shaft 23 is slidably formed on the push-up mechanism and is hermetically held by the O-ring 24 provided at the lower end portion of the insertion hole 22.

As shown in FIG. 2B, a rectangular disk-shaped body 25 is provided at an upper end of the upper push shaft 23 projecting from the upper end surface of the blocking member 21, and a cylindrical convex portion is provided at a central portion of the upper surface of the disk-shaped body 25. In the portion 26, the lower nozzle body 27 is formed by attaching an elastic material such as rubber or soft synthetic resin to the convex portion 26 so as to be detachably attached thereto.

A suction hole 28 is formed in the axial direction of the push-up shaft 23, and an upper end opening of the suction hole 28 faces the convex portion 26 provided on the disk-shaped body 25, and a lower end opening faces the side surface of the push-up shaft 23. A nozzle hole 29 is formed in the lower nozzle body 27 so as to penetrate in the vertical direction, and the lower nozzle body 27 is attached to the convex portion 26, and the lower end of the nozzle hole 29 communicates with the suction hole 28 of the convex portion 26. .

The upper surface of the lower nozzle body 27 is a flat surface 27a, and the planar shape is formed into a circular shape having a diameter slightly smaller than the short side of the semiconductor wafer 3 indicated by the chain line in FIG. That is, as shown in FIG. 2B, the lower nozzle body 27 is formed in a substantially truncated cone shape.

As shown in FIG. 2A, a suction hole 31 is formed in the blocking member 21 that blocks the lower opening of the support body 1, and one end of the suction hole 31 is opened toward the upper end surface of the blocking member 21, that is, the internal space of the support body 1. And the other end opening is opened toward the peripheral surface of the aforementioned blocking member 21.

As shown in FIG. 1, the suction hole 31 formed in the blocking member 21 and the suction hole 28 formed in the upper push shaft 23 are connected to the suction hole via the line 33. Pump 32. After the suction pump 32 starts to operate, suction is applied to the annular grooves 14a to 14c through the suction holes 16a and 16b and the communication groove 15 on the upper surface of the support body 1, and the suction holes 28 formed in the push-up shaft 23 are simultaneously transmitted. Suction is generated to the nozzle hole 29 of the lower adsorption nozzle body 27.

After the suction of the suction pump 32 in the annular grooves 14a to 14c is started, the upper surface of the support 1 is adsorbed and held by the suction surface on the lower surface of the adhesive sheet 2 to which the semiconductor wafer 3 is attached. That is, the portion of the support sheet 1 around which the semiconductor wafer 3 to be picked up is held, that is, the portion around the opening portion 12 of the adhesive sheet 2 is adsorbed and held.

Further, after the suction force in the nozzle hole 29 of the lower nozzle body 27 starts to act, the flat surface 27a of the nozzle body 27 opened below the nozzle hole 29 adsorbs and holds the opening of the adhesive sheet 2 with respect to the opening of the support body 1. Below the 12 part. That is, the portion of the adhesive sheet 2 corresponding to the lower surface of the semiconductor wafer 3 and the portion around the opening portion 12 can be adsorbed and held.

As shown in FIG. 1 , a cam follower 35 is rotatably provided at an end portion of the push-up shaft 23 projecting from a lower end surface of the blocking member 21, and the cam follower 35 is not shown by the figure. The drive source 36 is driven to rotate in the direction of the arrow. Therefore, since the push-up shaft 23 is driven in the vertical direction as long as the cam 36 is rotationally driven, the lower nozzle body 27 is interlocked with the vertical movement.

When the cam follower 35 contacts the bottom dead center of the cam 36 and the push-up shaft 23 is at the lowered position, the flat surface 27a of the lower nozzle body 27 is positioned slightly lower than the suction surface of the upper surface of the support body 1.

When the cam 36 rotates, the cam follower 35 contacts the aforementioned cam 36 and is dead. When the push-up shaft 23 is at the raised position, the flat surface 27a of the lower nozzle body 27 is set to be higher than the predetermined size of the adsorption surface of the support 1, for example, 1.0 mm.

Further, the control device (not shown) controls the drive control of the nozzle mechanism 4, the support unit 10, and the like in accordance with the following operation.

Next, the operation of the above-described pickup device will be described with reference to FIGS. 4A to 4D.

After the upper surface of the support 1 of FIG. 1 is raised to a position where it is in contact with the lower surface of the adhesive sheet 2, the adhesive sheet 2 is driven in the X and Y directions by a slice not shown, and the pickup semiconductor wafer 3 is positioned on the support. 1 is above the opening portion 12. That is, the center of the semiconductor wafer 3 is made to coincide with the center of the opening 12.

After the semiconductor wafer 3 is picked up, the upper nozzle mechanism 4 is lowered as shown in Fig. 4A to adsorb the upper surface of the semiconductor wafer 3 picked up by the flat surface 8a provided at the lower end of the nozzle body 8 at the lower end of the nozzle mechanism 4. At this time, the upper nozzle body 8 pushes the semiconductor wafer 3 with a predetermined load. Further, the upper surface of the lower adsorption nozzle body 27 is slightly lower than the lower surface of the adhesive sheet 2.

After the upper adsorption nozzle body 8 is lowered and the upper surface of the semiconductor wafer 3 is adsorbed and held, as shown in FIG. 4B, the push-up shaft 23 is raised and the suction pump 32 is operated to move the flat surface 27a of the lower adsorption nozzle body 27 and the support body. The adsorption surface of 1 (top) is as high.

As a result, the flat surface 27a of the lower nozzle body 27 is moved by the suction force of the suction pump 32, and the lower surface of the semiconductor wafer 3 to be picked up can be adsorbed and held via the adhesive sheet 2. That is, the upper pick-up nozzle body 8 and the lower nozzle body 27 may be sandwiched by an elastic material to hold the picked-up semiconductor wafer 3 Up and down.

When the suction pump 32 is started to operate, the internal space of the support 1 is decompressed, and suction is generated on the annular grooves 14a to 14c and the communication groove 15 on the support body 1, so that the adhesive sheet 2 can be picked up by the suction force. A portion around the semiconductor wafer 3 is adsorbed and held on the adsorption surface of the support 1.

At this time, suction force is also generated in the opening portion 12 of the support body 1, and the semiconductor wafer 3 facing the opening portion 12 can be attracted to the inside of the support body 1 via the adhesive sheet 2.

However, the semiconductor wafer 3 is a rectangle slightly larger than the opening portion 12. Therefore, even before the lower surface of the semiconductor wafer 3 is adsorbed by the lower adsorption nozzle body 27, even if the suction force is generated to the opening portion 12 of the support body 1, the peripheral portion of the semiconductor wafer 3 with respect to the opening portion 12 and the opening portion of the support body 1 are opened. 12 The surrounding card is merged and held. As a result, it is possible to prevent the semiconductor wafer 3 and the adhesive sheet 2 from being attracted to the opening 12 by the suction force generated in the support 1 at the same time, thereby causing damage.

When the upper nozzle body 8 and the lower nozzle body 27 are held by the upper and lower surfaces of the pickup semiconductor wafer 3, as shown in FIG. 4C, the push-up shaft 23 is raised to the upper end surface of the lower nozzle body 27. The suction surface of the support 1 of the contour is raised by, for example, 0.5 mm, and the above-mentioned raising operation is regarded as the first rising step.

Further, the time during which the pump 32 is operated may be the time when the first ascending step ends.

When the push-up shaft 23 is raised, the adhesive sheet 2 is peeled off from the four corners of the lower surface of the semiconductor wafer 3 due to the suction of the portion of the adhesive sheet 2 opposite to the opening portion 12.

When the adhesive sheet 2 starts to be peeled off from the four corners of the lower surface of the semiconductor wafer 3, the lower nozzle body 27 is further raised by 0.5 mm, and the raising operation is referred to as a second rising step. In other words, by controlling the rotation of the cam 36, the lower nozzle body 27 is divided into two stages at a time of 0.5 mm, and as a result, the flat surface 27a of the lower nozzle body 27 is raised by 1 mm from the suction surface of the support 1.

After the lower suction nozzle body 27 is thus raised, the peeling state of the adhesive sheet 2 with respect to the semiconductor wafer 3 proceeds from the lower four corners toward the center portion. That is, by raising the lower nozzle body 27, as shown enlarged in Fig. 5, the portion of the adhesive sheet 2 that is separated from the flat surface 27a of the lower nozzle body 27 is expanded into a mountain shape.

In other words, the lower nozzle body 27 pushes the semiconductor wafer 3 from the adsorption surface of the support 1 while deforming the adhesive sheet 2 into a trapezoidal shape. At this time, the upper nozzle mechanism 4 rises in conjunction with the raising operation of the push-up shaft 23.

After the semiconductor wafer 3 is pushed up, the adhesive sheet 2 is deformed into a mountain shape and enlarged. Since the area of the adhesive sheet 2 is enlarged, the adhesion per unit area increases as the area increases. Therefore, the semiconductor wafer 3 becomes easily peeled off from the adhesive sheet 2.

Further, since the adhesive sheet 2 is pushed up by the lower suction nozzle body 27 and deformed into a mountain shape, the adhesive sheet 2 is from the portion farthest from the center of the flat surface 27a of the lower suction nozzle body 27, that is, four of the semiconductor wafers 3. The corners began to peel off. In Fig. 5, the portion where the adhesive sheet 2 is peeled off from the four corners of the semiconductor wafer 3 is indicated by R.

The flat surface 27a of the lower nozzle body 27 is formed of an elastic material The semiconductor wafer 3 is pushed up. As a result, since the partial pressure is not applied to the semiconductor wafer 3 at the time of the push-up, the push-up operation can be performed without damaging the semiconductor wafer 3.

Further, the planar shape of the flat surface 27a of the lower adsorption nozzle body 27 is circular. In this way, since the flat surface 27a does not have a square angle (edge), the push-up operation can be performed without applying partial pressure to the semiconductor wafer 3.

Since the flat surface 27a of the lower adsorption nozzle body 27 is circular, the distance from the four corners of the semiconductor wafer 3 to the aforementioned flat surface 27a can be increased. As a result, when the semiconductor wafer 3 is pushed up by the lower nozzle body 27, the curvature radius of the bending of the semiconductor wafer 3 can be increased even if the semiconductor wafer 3 is deformed, so that partial pressure can be prevented from being applied to the semiconductor wafer 3.

Further, when the semiconductor wafer 3 is pushed up by the flat surface 27a of the lower nozzle body 27, the upper surface of the wafer is held by the flat surface 8a of the upper surface of the nozzle body 8 formed of an elastic material. In this way, even if the adhesive sheet 2 is deformed into a mountain shape during the push-up, the pair of nozzle bodies 8, 27 can be used to elastically suppress the semiconductor wafer 3 and the adhesive sheet 2 from being simultaneously deformed into a mountain shape, so that the action can also be prevented. The pushed up semiconductor wafer 3 is damaged.

Further, since the holding semiconductor wafer 3 is elastically sandwiched by the pair of upper and lower adsorption nozzle bodies 27, 8 formed of an elastic material, the pressure applied to the pushed up semiconductor wafer 3 can be alleviated, and the semiconductor wafer 3 can be prevented. Suffered from damage.

When the semiconductor wafer 3 is pushed upward from the upper surface of the support 1 by the lower adsorption nozzle body 27, the upper adsorption nozzle body 8 is raised as shown in Fig. 4D. At this time, the lower adsorption nozzle body 27 can be adsorbed and held by the suction force acting on the nozzle hole 29. The portion of the sheet 2 is picked up below the portion of the semiconductor wafer 3.

In this way, the suction force of the upper suction nozzle body 8 and the suction force of the lower adsorption nozzle body 27 can be respectively applied to peel off the force of the picked-up semiconductor wafer 3 and the adhesive sheet 2 attached to the lower surface of the semiconductor wafer 3.

Therefore, compared with the conventional method of adsorbing and picking up the semiconductor wafer 3 only by the upper adsorption nozzle body 8, since the upper and lower suction force, that is, about twice the force can be peeled off from the adhesive sheet 2, the semiconductor wafer 3 can be easily removed. The aforementioned semiconductor wafer 3 is surely picked up.

In summary, the upper nozzle body 8 lifts the semiconductor wafer 3 upward, and the lower nozzle body 27 pulls the adhesive sheet downward. In this way, since the peeling of the adhesive sheet 2 is performed from the peeling portion of the corner portion of the semiconductor wafer 3 at the time of pushing up toward the center, the upper nozzle body 8 can be quickly and surely picked up from the adhesive sheet 2 The aforementioned semiconductor wafer 3.

Further, the upper nozzle body 8 of the upper nozzle mechanism 4 and the suction nozzle body 27 at the lower portion of the upper push shaft 23 can be separately attached and detached. In this way, since the respective nozzle bodies 8, 27 can be replaced with different diameters, even when the size of the semiconductor wafer 3 is changed, the processing can be performed by using the nozzle bodies 8, 27 in accordance with their sizes.

Fig. 6A to Fig. 6C show a second embodiment of the present invention. In this embodiment, a plurality of corners are provided at the four corners of the disk-shaped body 25 disposed at the upper end of the push-up shaft 23. The present embodiment is four convex portions 26, and is respectively mounted on the four convex portions 26. The lower suction nozzle body 27 made of an elastic material is attached and detached.

The suction hole 28 formed in the push-up shaft 23 communicates with the recess 41 which is open-formed on the upper end surface of the push-up shaft 23. In the aforementioned disk body 25 and the aforementioned convex portion 26 The nozzle hole 29 formed in the lower nozzle body 27 is formed with a communication hole 42 that communicates through the recess 41. Therefore, when the suction pump 32 of Fig. 1 starts to operate and the suction hole 28 of the push-up shaft 23 starts to act, a suction force is generated to the nozzle hole 29 of the lower nozzle body 27.

In this manner, when the four lower nozzle bodies 27 are provided in the disk-shaped body 25, when the semiconductor wafer 3 is pushed up and raised by the push-up shaft 23, the four corners of the disk-shaped body 25 can be used. The lower adsorption nozzle body 27 performs a push-up operation while adsorbing and holding the lower surface of the semiconductor wafer 3.

Therefore, when the semiconductor wafer 3 is pushed up by the lower nozzle body 27, the size from the periphery of the lower nozzle body 27 to the corner of the disk body 25 represented by Z in FIG. 6C can be reduced, that is, The size of the semiconductor wafer 3 is at the corner to the lower nozzle body 27, so that when the semiconductor wafer 3 is pushed up in response to the dimension Z, the amount of deflection generated at the corner of the semiconductor wafer 3 can be reduced to prevent the corner damaged.

Since the positions of the four lower nozzle bodies 27 can be enlarged or reduced with respect to the diagonal direction, it is possible to arrange, for example, the amount of deflection of the semiconductor wafer 3 which is pushed up and down. In this way, it is possible to prevent local pressure from being generated at the corners of the semiconductor wafer 3 during the push-up.

Fig. 7 shows a third embodiment of the present invention. The present embodiment is detachably mountable with respect to the convex portion 26 of the disk-shaped body 25 provided on the push-up shaft 23 by a resilient support member 44 formed of a resilient material which is softer than the lower suction nozzle body 27. The lower suction nozzle body 27 is formed by an elastic material.

According to this configuration, when the semiconductor wafer 3 is pushed up by the lower nozzle body 27, the lower nozzle body 27 is softly elasticized by the elastic supporting member 44. When the semiconductor wafer 3 is pushed up via the adhesive sheet 2 by elastic displacement, and the elastic support member 44 is compressed and deformed, the lower nozzle body 27 is also elastically deformed.

That is, the elasticity when the semiconductor wafer 3 is pushed up by the lower nozzle body 27 is the softest when the lower nozzle body 27 contacts the semiconductor wafer 3, and is gradually strengthened as the push-up operation is gradually performed. That is, the impact when the lower nozzle body 27 contacts the semiconductor wafer 3 is minimized to prevent damage, and when the lower nozzle body 27 pushes the semiconductor wafer 3 via the adhesive sheet 2 when pushed up, the semiconductor wafer 3 can be prevented. Damage caused by impact.

In the third embodiment described above, the elastic supporting member 44 can be formed by using an elastic material which is harder than the lower nozzle body 27.

Fig. 8 shows a fourth embodiment of the present invention. In the present embodiment, the disk-shaped body 25 having the convex portion 26 to which the lower adsorption nozzle body 27 is attached is separable from the push-up shaft 23. That is, a support shaft 45 is provided under the disk-shaped body 25, and a support hole 46 for supporting the slidable support shaft 45 is formed in the push-up shaft 23.

A coil spring 47 as an elastic supporting member is provided between the disk-shaped body 45 and the push-up shaft 23, and the coil spring 47 has elasticity which is softer than that of the elastic material forming the lower nozzle body 27.

A fall prevention pin 48 is provided at an intermediate portion of the aforementioned support shaft 45. Since the fulcrum 45 is biased in the upward direction by the biasing force of the coil spring 47, the detachment preventing pin 48 is engaged with the upper end of the elongated hole 49 formed at the intermediate portion of the upper urging shaft 23.

Therefore, in the ascending position, the support shaft 45 can be prevented from falling off from the support hole 46 through the aforementioned anti-separation pin 48, and the snail can be compressed and deformed. The coil spring 47 is displaced from the raised position in the descending direction.

Further, a communication hole 50 that communicates with the suction hole 28 formed in the push-up shaft 23 is formed in the support shaft 45 along the axial direction. Therefore, the suction hole 28 can communicate with the nozzle 29 formed in the lower nozzle body 27 via the communication hole 50.

According to the foregoing configuration, when the lower nozzle body 27 contacts the semiconductor wafer 3, since only the weight of the lower nozzle body 27 and the disk-shaped body 25 is applied to the wafer 3, and the push-up is not directly applied due to the elastic deformation of the coil spring 47 Since the pulling force of the shaft 23 is reduced, the impact applied to the semiconductor wafer 3 can be reduced, and the wafer 3 can be prevented from being damaged.

Further, since the coil spring 47 which is softer than the lower nozzle body 27 is compressed and deformed when the lower nozzle body 27 contacts the semiconductor wafer 3 and is pushed up, the lower nozzle portion 27 is also elastically deformed.

Therefore, the third embodiment is the same as the third embodiment shown in Fig. 7, because the elasticity when the semiconductor wafer 3 is pushed up by the lower nozzle 27 is the softest when the lower nozzle body 27 contacts the semiconductor wafer 3, and as the semiconductor is pushed up. The wafer 3 is gradually reinforced, so that the semiconductor wafer 3 can be prevented from being struck and damaged when pushed up.

Further, in the fourth embodiment, the coil spring 47 may have a lower elasticity than the lower nozzle body 27.

In the third and fourth embodiments, the lower nozzle body 27 is described as an example. However, a plurality of lower nozzle bodies 27 may be provided as in the second embodiment.

When a plurality of lower adsorption nozzle bodies 27 are provided, elastically supporting each lower adsorption The spring constant of the elastic support member 44 or the coil spring 47 of the nozzle body 27, that is, the amount of compression deflection to the load may be the same or different.

When the plurality of elastic support members 44 or the coil springs 47 having different spring numbers are used, the lower suction nozzle body 27 supported by the elastic elastic support member 44 or the coil spring 47 is elastically supported by the elastic support. The frictional force of the lower suction nozzle body 27 supported by the member 44 or the coil spring 47 and the adhesive sheet 2 becomes small. In this manner, since the upper surface of the lower nozzle body 27 is lifted while sliding with respect to the adhesive sheet 2, the adhesive sheet 2 is easily peeled off from the semiconductor wafer 3 by the sliding contact.

Fig. 9 is a view showing a fifth embodiment of the present invention. This embodiment is a modification of the push-up mechanism, and is formed by a lower push-up body 51 formed of an elastic material instead of the lower-side adsorption nozzle body 27 of each of the above-described embodiments.

The planar shape of the lower push-up body 51 is smaller than the rectangular shape of the semiconductor wafer 3, and the ridges 52 and the grooves 53 on the upper surface thereof are alternately formed in a wave shape with respect to the long direction crossing the width direction.

The lower push-up body 51 is provided to be attachable and detachable to the convex portion 26, and the convex portion 26 is attached to the upper end disk portion 25 of the push-up shaft 23. Further, the opening portion 12 formed in the support 1 is larger than the lower pusher 51 and smaller than the rectangular shape of the semiconductor wafer 3.

Further, in this embodiment, although the nozzle hole 29 is formed in the lower push-up body 51 as in the lower nozzle body 27 of the above-described respective embodiments, the push-up body 51 can be sucked at the lower portion. An opening of the opening is formed in the strip 52.

When the lower pusher 51 is used in the lower configuration, the lower pusher is used Since 51 is smaller than the rectangular shape of the semiconductor wafer 3, when the semiconductor wafer 3 is pushed up, it is possible to suppress the semiconductor wafer 3 from being largely bent and deformed downward by the suction force of the opening portion 12. In this way, even the extremely thin semiconductor wafer 3 having a thickness of 20 to 30 μm can be prevented from being greatly bent and broken by suction.

Further, since the upper push-up body 51 is formed with a plurality of recesses 53, the portion of the adhesive sheet 2 pushed up by the lower push-up body 51, the portion corresponding to the recess 53 is subjected to the suction force generated by the opening portion 12. effect. As a result, since the semiconductor wafer 3 becomes easily peeled off from the adhesive sheet 2, the semiconductor wafer 3 can be surely picked up by the upper adsorption nozzle body 8.

Fig. 10 through Fig. 12 show a sixth embodiment of the present invention. This embodiment shows a modification of the push-up mechanism. As shown in Fig. 10, a seat 25A equivalent to the disk-shaped body 25 of each of the above-described embodiments is provided at the upper end of the push-up shaft 23, and a plurality of lower portions are provided at the seat 25. The upper pusher body is formed, and the lower pusher body is formed of an elastic material into a flat truncated cone shape. As shown in Fig. 11, in the present embodiment, the fifth lower pushers 55a to 55e of the first to fifth are provided.

Further, the shape of each of the lower pushers 55a to 55e is not limited to a truncated cone shape, and may be a columnar shape or a square columnar shape.

Among the five lower upper pushers 55a to 55e, for example, the first lower pusher 55a located at one end corner of the predetermined direction of the seat 25A is detachably attached to the disk 57 provided at the upper end of the movable shaft 56. The second to fourth lower pushers 55b to 55e are detachably mounted on the seat 25A.

A concave step portion 54 is formed at one end corner of the predetermined direction of the seat 25A, and a support hole 58 is formed in the step portion 54, and the support hole 58 has a large-diameter portion 58a having an opening upward. In the support hole 58, the aforementioned movable shaft 56 The coil spring 59 provided in the large-diameter portion 58a is supported to be elastically displaceable.

Therefore, when the coil spring 59 is in an uncompressed state, the height is set such that the upper surface of the first lower pusher 55a protrudes from the upper surface of the other upper pushers 55b to 55e by the length represented by h in Fig. 10. In addition, the length h is about 1 mm.

As shown in Fig. 10, a suction distribution portion 61 that communicates with the suction hole 28 formed in the push-up shaft 23 is formed in the seat 25A. The suction distribution unit 61 is connected to one of the five suction branch pipes 62 (only three are shown in FIG. 10), and the other ends of the branch pipes 62 and the support holes 58 are formed in the second to fifth lower portions. The suction holes 29 of the upper pushers 55b to 55e communicate with each other.

A communication path 63 is formed in the movable shaft 56 supported by the support hole 58, and the communication path 63 and the suction branch pipe 62 that communicates with the support hole 58 are formed on the first lower portion provided on the movable shaft 56. The suction holes 29 in the pusher 55a communicate with each other.

In this manner, the suction force generated by the suction pump 32 in Fig. 1 can be applied to the flat upper surfaces of the first to fifth lower pushers 55a to 55e via the suction holes 28 of the push-up shaft 23.

As shown in FIG. 12, when the push-up shaft 23 is driven upward, the suction surface on the upper surface of the support body 1 has a shape that can be protruded corresponding to the first to fifth lower push-up shafts 55a to 55e, that is, The planar shape (circular) opening portion 12A of the five lower push-up bodies 55a to 55e is combined.

Further, the shape of the opening portion 12A may be slightly smaller than the rectangular shape of the semiconductor wafer 3.

On the upper surface of the support body 1, a rectangular shape is formed around the opening portion 12A. The groove 64 is formed such that the inner groove is slightly smaller than the outer shape of the semiconductor wafer 3 represented by the chain line in Fig. 12, and the outer periphery is slightly larger than the outer edge of the semiconductor wafer 3. As a result, the outer edge of the semiconductor wafer 3 positioned and adsorbed on the support body 1 via the adhesive sheet 2 is located above the intermediate portion in the width direction of the rectangular groove 64.

As shown in Fig. 12, a plurality of annular grooves 65 and four radiation grooves 66 communicating with the annular grooves 65 and the rectangular grooves 64 are formed on the support body 1, and the radiation grooves 66 are open to each other. The through hole 67 is formed inside the support body 1 and above. In this way, the suction force of the suction pump 32 can be applied to the rectangular groove 64 and the annular groove 65 from the inner space of the support body 1 and the through hole 67 via the radiation groove 66.

The number of the annular groove 65 and the radiation groove 66 is not limited. For example, the radiation groove 66 is not limited to four, and may be six or more than six.

Further, in the rectangular groove 64, the annular groove 65, and the radiation groove 66 formed on the adsorption surface of the support 1, the tenth figure shows only the rectangular groove 64.

According to this configuration, after the position at which the semiconductor wafer 3 is picked up is positioned with respect to the support 1 and the upper nozzle mechanism 4 is lowered to adsorb and hold the upper surface of the semiconductor wafer 3, the suction pump 32 is turned on to generate suction to the adsorption surface of the support 1. . In this way, the semiconductor wafer 3 that has been positioned on the adsorption surface of the support 1 can be adsorbed and held via the adhesive sheet 2.

The adsorption surface of the support 1 is formed with a rectangular groove 64, and the semiconductor wafer 3 is positioned such that the outer edge of the semiconductor wafer 3 is placed in the middle portion of the rectangular groove 64 in the width direction. Therefore, the portion of the adhesive sheet 2 corresponding to the outer edge of the semiconductor wafer 3 can be strongly attracted by the suction force generated by the rectangular groove 64.

Next, the push-up shaft 23 is driven in the ascending direction. In this way, among the five lower upper pushers 55a to 55e, the first push-up portion 55a whose upper surface is higher than the second to fifth lower pushers 55b to 55e is adsorbed by the adhesive sheet 2 and elastically pressed correspondingly. Below the portion of one of the corners of the four corners of the semiconductor wafer 3.

If only the portion corresponding to one corner of the semiconductor wafer 3 is pushed up, the adhesive sheet 2 at the corner is greatly enlarged compared to the other portions. Therefore, the adhesive sheet 2 is peeled off from the portion where the corresponding semiconductor wafer 3 is pushed up by the first lower push-up body 55a.

At this time, since the portion of the adhesive sheet 2 corresponding to the outer edge of the semiconductor wafer 3 can be strongly attracted by the rectangular groove 64, the outer edge portion of the corner portion corresponding to the semiconductor wafer 3 pushed up by the first lower pusher 55a can be smoothly performed. Stripping work.

Further, since the semiconductor wafer 3 is inclined by being pushed up only by the first upper pusher 55a, the adhesive sheet 2 can be easily peeled off from the corner of the upper end in the oblique direction.

After the semiconductor wafer 3 is pushed up by the first lower upper pusher 55a, the coil spring 59 is compressed and deformed by increasing the push-up shaft 23 to increase the pressing force applied to the first lower pusher 55a. The push-up shaft 23 moves the first lower push-up body 55a downward.

Therefore, when the first lower pusher 55a and the other four lower pushers 55b to 55e are equal in height, the lower surface of the semiconductor wafer 3 is pulled from the four corners by the first to fourth lower pushers 55a to 55d. Push up and push up from the middle portion by the fifth lower pusher 55e.

The adhesive sheet 2 will first be pushed from the corresponding semiconductor crystal pushed up by the first lower pusher. The portion of the sheet 3 at one corner began to peel off. Further, the suction force generated by the rectangular groove 64 strongly attracts the portion corresponding to the outer edge of the semiconductor wafer 3.

In this manner, when the adhesive sheet 2 is pushed up by using the flat upper surfaces of the first to fourth lower push-up bodies 55a to 55d to push up the four corners of the semiconductor wafer 3, the first lower push-up body 55a is peeled off. One corner is used as a starting point, and other parts can be peeled off smoothly.

In other words, when only a part of the semiconductor wafer 3 is pushed up by the first lower pusher 55a, the adhesive sheet 2 of the portion is easily peeled off. When the other corners of the semiconductor wafer 3 are pushed up by the second to fourth lower pushers 55b to 55d, the portion which is peeled off by the first lower pusher 55a is used as a starting point, and the other portions can be smoothly peeled off. .

Further, since the suction force generated by the rectangular groove 64 can strongly attract the portion of the adhesive sheet 2 corresponding to the outer edge of the semiconductor wafer 3, the adhesive sheet 2 can be smoothly peeled off in a complementary manner.

The lower center of the semiconductor wafer 3 is supported by the fifth lower upper pressing body 55e. In this manner, it is possible to prevent the semiconductor wafer 3 from being bent and deformed by the suction generated in the opening portion 12A of the adsorption surface of the support 1 to be bent and damaged.

As a result, when the adhesive sheet 2 is peeled off from the lower surface of the semiconductor wafer 3, the semiconductor wafer 3 can be surely picked up by the upper nozzle mechanism 4. At the time of pickup, the adhesive sheet 2 can be attracted from below by the suction force generated on the upper portions of the first to fifth lower pushers 55a to 55e. Therefore, since the suction force can be used as the force for peeling off the adhesive sheet 2 from the lower surface of the semiconductor wafer 3, the pickup operation of the semiconductor wafer 3 can be smoothly performed.

In the sixth embodiment, the number of pushers provided on the lower portion of the seat 25A is not limited to five, but may be two to four or six or more, for example, six, which may be set to each. In this case, in order to position the two lower elastic bodies located at one end of the one end in the predetermined direction at a position higher than the other four lower elastic bodies, the coil springs can be held to be elastically displaced downward.

According to the foregoing configuration, at the time of picking up, since the push-up axis is raised, the one end of the predetermined direction of the semiconductor wafer 3 is pushed up via the adhesive sheet, so that it can be from the one end of the predetermined direction of the semiconductor wafer toward the other direction. The aforementioned adhesive sheet was peeled off in order.

Further, in the sixth embodiment, the nozzle holes are formed in the first to fifth lower portions, and the suction force is generated on the upper surfaces, but the nozzle holes may not be formed in the lower portions.

Fig. 13 is a seventh embodiment of the present invention, and this embodiment is a modification of the sixth embodiment shown in Figs. 10 to 12. That is, in the sixth embodiment, although the rectangular groove 64 is formed on the adsorption surface of the support 1, the suction hole 68 may be formed at a position corresponding to the four corners of the semiconductor wafer 3 instead of the rectangular groove 64, and The suction hole 68 is sized to communicate with the innermost annular groove 65.

According to the foregoing configuration, since the suction force generated by the suction hole 68 can exert a strong suction force on the portion of the corresponding corner portion 4 of the corresponding semiconductor wafer 3 of the adhesive sheet 2, the semiconductor wafer is pushed up by the lower push-up bodies 55a to 55e. At 3 o'clock, the portion of the adhesive sheet 2 corresponding to the four corners of the semiconductor wafer 3 can be smoothly peeled off.

Because the adhesive sheet 2 is peeled off from the four corners of the semiconductor wafer 3 At this time, the peeling situation easily extends from the four corners to other portions, so that no burrs are generated under the four corners, and the pickup operation of the semiconductor wafer 3 can be performed smoothly and surely.

In each of the above embodiments, the push-up shaft is operated up and down using the cam, but another drive source such as an air cylinder may be used. Further, the planar shape of the upper nozzle body and the lower nozzle body is not limited to a circular shape, and may be a rectangular shape or the like, and is not particularly limited.

Further, although the suction nozzle composed of an elastic material is attached to the lower end of the pick-up shaft of the pick-up mechanism and the upper end of the push-up mechanism, the lower end of the pick-up mechanism may not be at the lower end of the pick-up shaft of the pick-up mechanism. The suction nozzle formed of an elastic material is attached to the upper end of the push-up shaft of the push-up mechanism. That is, as long as the pick-up mechanism can adsorb and hold the upper surface of the semiconductor wafer, the push-up mechanism can adsorb and hold the portion of the adhesive sheet adhered to the lower surface of the semiconductor wafer.

Further, although the support opening portion is formed to be slightly smaller than the rectangular shape of the semiconductor wafer, it may be larger than the semiconductor wafer, and this point is not particularly limited.

In the sixth embodiment, the rectangular groove is formed on the support adsorption surface, but the rectangular groove may be formed on the adsorption surface of the support used in the first to fifth embodiments. Similarly, the configuration in which the suction holes are formed in the portions corresponding to the four corners of the semiconductor wafer is also applicable to the first to fifth embodiments.

Industrial use possibilities

According to the present invention, the aforementioned semiconductor wafer can be picked up from the aforementioned adhesive sheet At the time, the portion around the semiconductor wafer of the aforementioned adhesive sheet is adsorbed and pushed up and the semiconductor wafer is pushed up.

In this way, not only the partial pressure applied to the semiconductor wafer can be prevented from being damaged, but also the adhesive sheet corresponding to the push-up portion of the semiconductor wafer can be greatly enlarged, so that the adhesive sheet can be easily removed from the expandable characteristic. The aforementioned semiconductor wafer is stripped.

1‧‧‧Support

2‧‧‧Adhesive tablets

3‧‧‧Semiconductor wafer

4‧‧‧Upper adsorption nozzle mechanism

5‧‧‧ picking shaft

6, 26‧‧ ‧ convex

7, 16a, 16b, 28, 31, 68‧‧‧ attracting holes

8‧‧‧Upper adsorption nozzle

8a, 27a‧‧‧ flat surface

9, 29‧‧‧ mouth hole

10‧‧‧Support unit

12, 12A‧‧‧ openings

14a~14c, 65‧‧ ‧ annular groove

15‧‧‧Connected trench

21‧‧‧Blocking members

22‧‧‧ inserted through hole

23‧‧‧Upper shaft

24‧‧‧O-ring

25‧‧‧ discoid

25A‧‧‧

27‧‧‧Lower adsorption nozzle

32‧‧‧Attraction pump

33‧‧‧ pipeline

35‧‧‧Cam followers

36‧‧‧ cam

41‧‧‧ recess

42, 50‧‧‧Connected holes

44‧‧‧elastic support members

45‧‧‧ fulcrum

46, 58‧‧‧ support holes

47, 59‧‧‧ spiral spring

48‧‧‧ Preventing the loss of the pin

49‧‧‧Long hole

51, 55a~55e‧‧‧ lower pusher

52‧‧‧

53‧‧‧ Groove

54‧‧‧

56‧‧‧ movable shaft

57‧‧‧ disc

58a‧‧‧ Large Diameter Department

61‧‧‧Attracting the Distribution Department

62‧‧‧Attracting branch pipe

63‧‧‧Connected path

64‧‧‧ Rectangular ditch

66‧‧‧radiation ditch

67‧‧‧through holes

Fig. 1 is a schematic structural view showing a pick-up device according to a first embodiment of the present invention.

Fig. 2A is a longitudinal sectional view of the support.

Fig. 2B is an exploded perspective view showing the upper portion of the push-up shaft and the lower nozzle body.

Figure 3 is a plan view showing the adsorption surface of the support.

Fig. 4A is an explanatory view when the nozzle body is lowered.

Fig. 4B is an explanatory view when the lower adsorption nozzle body is raised.

Fig. 4C is an explanatory view when the semiconductor wafer is pushed up by the lower adsorption nozzle body.

Fig. 4D is an explanatory view of a case where a semiconductor wafer pushed up by a lower adsorption nozzle body is picked up by a suction nozzle.

Fig. 5 is an enlarged cross-sectional view showing the semiconductor wafer picked up by the lower nozzle body.

Fig. 6A is a cross-sectional view showing the upper portion of the support of the second embodiment of the present invention.

Figure 6B is a perspective view of the upper part of the support

Fig. 6C is a plan view of a disk-shaped body provided at the upper end of the push-up shaft.

Fig. 7 is a longitudinal sectional view showing an upper portion of a support according to a third embodiment of the present invention.

Fig. 8 is a longitudinal sectional view showing an upper portion of a support according to a fourth embodiment of the present invention.

Fig. 9 is a perspective view showing the push shaft and the lower pusher on the fifth embodiment of the present invention.

Fig. 10 is a longitudinal sectional view showing the upper portion of the support of the sixth embodiment of the present invention.

Figure 11 is a plan view of the seat disposed at the upper end of the push-up shaft.

Figure 12 is a plan view showing the upper surface of the support.

Figure 13 is a plan view showing the upper surface of a support of a seventh embodiment of the present invention.

1‧‧‧Support

12‧‧‧ openings

21‧‧‧Blocking members

22‧‧‧ inserted through hole

23‧‧‧Upper shaft

24‧‧‧O-ring

25‧‧‧ discoid

26‧‧‧ convex

27‧‧‧Lower adsorption nozzle

27a‧‧‧flat surface

28, 31‧‧‧ attracting holes

29‧‧‧ mouth hole

35‧‧‧Cam followers

Claims (14)

A semiconductor wafer pick-up device for picking up a semiconductor wafer attached to an adhesive sheet, comprising: a support body formed on an adsorption surface, wherein the adsorption surface can adsorb and hold the semiconductor chip corresponding to the adhesive film a portion surrounding the wafer; the push-up mechanism is configured to be driven in the up-and-down direction in the support body, and is formed by attaching and detaching the upper end portion by an elastic material, the upper end portion pressing the attachment of the adhesive sheet And a pick-up mechanism for adsorbing and holding the upper surface of the semiconductor wafer to be picked up and picking up from the adhesive sheet by the aforementioned push-up The aforementioned semiconductor wafers were pushed by the organization. The pick-up device for a semiconductor wafer according to claim 1, wherein the push-up mechanism includes: a push-up shaft that drives in an up-and-down direction; and a lower suction nozzle body that is made of an elastic material and can be mounted and disassembled. The ground electrode is disposed at an upper end of the upper push shaft, and adsorbs the lower surface of the adhesive sheet to which the semiconductor wafer portion is attached. The pick-up device for a semiconductor wafer according to claim 1, wherein the push-up mechanism is capable of adsorbing the underside of the adhesive sheet to which the semiconductor wafer portion to be picked up is attached. A pick-up device for a semiconductor wafer according to claim 1 of the patent scope, wherein The above-mentioned push-up mechanism is constituted by a plurality of detachable nozzle bodies that can be attached and detached. A pick-up device for a semiconductor wafer according to the first or second aspect of the invention, wherein the push-up mechanism pushes up a surface of the adhesive sheet to which the semiconductor wafer portion to be picked up is a flat surface. The pick-up device for a semiconductor wafer according to claim 5, wherein the flat surface area is smaller than a planar shape of the semiconductor wafer. The pick-up device for a semiconductor wafer according to claim 1, wherein at least a lower end portion of the pick-up mechanism is composed of an elastic material, and the lower end portion is for adsorbing the picked semiconductor wafer. The pick-up device for a semiconductor wafer according to claim 1, wherein an opening portion having a shape smaller than the semiconductor wafer and capable of raising the push-up mechanism is formed in the opening of the support adsorption surface, and is pushed up by the adhesive sheet. The aforementioned semiconductor wafer. The pick-up device for a semiconductor wafer according to claim 1, wherein the push-up mechanism has an upper push shaft driven in an up-and-down direction, and a lower portion of the push-up shaft is disposed at an upper end of the push-up shaft by an elastic material. The mouth body, and the elastic supporting member elastically supports the lower nozzle body and has elasticity different from the lower nozzle body. The pick-up device for a semiconductor wafer according to the first aspect of the invention, wherein the push-up mechanism has an upper push-up shaft that can be driven in an up-and-down direction, and a suction nozzle body disposed below the upper end of the upper push-up shaft, and the lower suction nozzle body Supported by the aforementioned push-up shaft, elastically displaceable in the up-and-down direction to drive the aforementioned push-up shaft in the upward direction to contact the semiconductor wafer At this time, the weight of the lower nozzle body is applied only to the semiconductor wafer. The pick-up device for a semiconductor wafer according to claim 1, wherein the push-up mechanism has a push-up shaft that can be driven in an up-and-down direction, and a wave-shaped lower push-up body is provided on an upper end of the push-up shaft, and the lower portion is The push-up system is formed by the elastic material on which the protrusions and grooves are alternately formed. The pick-up device for a semiconductor wafer according to claim 1, wherein the push-up mechanism has an upper push-up shaft that can be driven in an up-and-down direction, and a plurality of lower push-up bodies are disposed on an upper end of the push-up shaft, and the plurality of push-ups are pushed up At least one of the bodies is held in a manner that is elastically lowered to make it higher above the other aforementioned pushers. The pick-up device for a semiconductor wafer according to claim 1, wherein a rectangular groove for generating suction is formed on the support body, and the rectangular groove is sized to be adsorbed and held on the support via the adhesive sheet. The outer edge of the semiconductor wafer on the upper surface of the body is located at an intermediate portion in the width direction of the rectangular groove. The pick-up device for a semiconductor wafer according to claim 1, wherein the support body is provided with a suction hole, and the suction hole is located at four corners of the semiconductor wafer which are adsorbed and held on the support body via the adhesive sheet. Awkward.