JP2022133601A - Chip peeling device - Google Patents

Abstract

To provide a chip peeling device capable of preventing a chip from being cracked when peeling the chip from a sheet.SOLUTION: The present invention relates to a chip peeling device for peeling from a sheet a chip C adhered on the sheet. The chip peeling device comprises: a base on which the sheet and the chip adhered on a top face of the sheet are mounted; a first push-up mechanism in which a plurality of first push-up parts 26a of projected lines in a first direction X in a planar view are provided on a lower side of the sheet at a predetermined interval D interposed therebetween in a second direction Y orthogonal with the first direction X, and the plurality of first push-up parts 26a are moved upward to push up a bottom face of the chip C over the sheet; and an adsorption part 25 which is provided between the first push-up parts 26a and adsorbs the sheet downward in a state where the first push-up parts 26a are abutted to the bottom face of the sheet. A thickness of the first push-up part 26a is smaller than the interval D between the adjacent first push-up parts 26a.SELECTED DRAWING: Figure 3

Description

The present invention relates to a chip peeling device for peeling a chip attached to a sheet from the sheet.

2. Description of the Related Art In the manufacture of semiconductor devices and the like, it is necessary to peel off chips after being divided by a dicing process from a sheet by a chip peeling device.

The chip peeling device comprises a stage for holding a sheet, a push-up base that advances and retreats with respect to the stage, and a needle that is pushed up by the push-up base. It is known to poke the chip away from the sheet.

In such a peeling device, the chip is held only at the points where the pins are in contact, and the stress concentrates at one point. As a result, an excessive load is concentrated on the abutting portion of the pin, and chip cracking may occur.

Therefore, in Patent Document 1, a chip peeling device is provided with first thrusting means having a projecting surface portion and second thrusting means having a plurality of pin members, and the projecting surface portion is lifted from below via a sheet. It has been proposed to push up the chip and perform initial peeling to peel off the periphery of the chip, and then position the tip of the pin member above the projecting surface to promote chip peeling (see, for example, the following patents: Reference 1).

JP 2010-192648 A

However, in Patent Document 1, the sheet is pressed against the chip and does not separate from the chip at the point where the projecting surface portion is in contact with the sheet at the time of initial separation. There is a risk that chip cracking may occur when peeling off.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip peeling apparatus capable of preventing chips from cracking when the chips are peeled from a sheet.

A peeling device according to the present invention is a chip peeling device for peeling a chip adhered to a sheet from the sheet, comprising: a base on which the sheet and the chip adhered to the upper surface of the sheet are placed; A plurality of first thrust-up portions, which are projections extending along a first direction in a plan view, are provided on the lower side of the sheet at predetermined intervals in a second direction perpendicular to the first direction. A first push-up mechanism, in which the first push-up portion moves upward to push up the lower surface of the chip over the sheet, is provided between the first push-up portion, and the first push-up portion is provided between the sheet and the sheet. a suction portion that sucks the sheet downward while in contact with the lower surface of the sheet, and the thickness of the first thrust-up portion is smaller than the interval between the adjacent first thrust-up portions.

According to the present invention, the chip attached to the sheet can be peeled off from the sheet while suppressing cracking.

FIG. 1 is a cross-sectional view schematically showing the configuration of a chip peeling device according to one embodiment of the present invention; Exploded perspective view of push-up mechanism Top view of push-up mechanism Sectional view of push-up mechanism (a) to (e) are diagrams showing the operation of the chip peeling device.

An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the chip peeling apparatus 1 of the present embodiment includes a base 10 for horizontally moving a sheet 2 having a rectangular chip C in plan view attached to the upper surface thereof, and a base 10 for moving the chip C over the sheet 2. A push-up device 20 pushing up from below, a collet 40 sucking the upper surface of the chip C, and a control unit 50 are provided. In the chip peeling device 1 , the control unit 50 controls the base 10 , the push-up device 20 and the collet 40 , so that the chip C pushed up from below by the push-up device 20 is sucked by the collet 40 and separated from the sheet 2 .

The base 10 has an expand ring 12 that holds a wafer ring 11 attached to the peripheral edge of the sheet 2 and a support ring 13 that horizontally positions the sheet 2 held by the wafer ring 11 . A wafer ring 11 is mounted on the base 10 so that the chip C is positioned on the upper surface of the sheet 2 .

As shown in FIGS. 2 to 4, the push-up device 20 includes a case 21 having a recess 19 that opens to the upper surface, and a stage 22 provided on the upper surface of the case 21 so as to cover the upper surface of the recess 19. Prepare. The push-up device 20 is provided inside the support ring 13 so as to face the lower surface of the seat 2 inside the support ring 13 .

The case 21 is connected to a decompression device 14 such as a vacuum pump so that the interior of the recess 19 is decompressed (see FIG. 1). The stage 22 is provided with a through hole 28 slightly larger than the planar shape of the chip C in the central portion, and a groove 29 communicating with the through hole 28 is provided around the through hole 28 .

When the upper surface of the stage 22 is brought into contact with the lower surface of the sheet 2, the groove 29 is decompressed together with the recess 19 of the case 21 by the decompression device 14, and the lower surface of the sheet 2 is attracted to the through hole 28 and the groove 29 provided in the stage 22. It adheres to the upper surface of the stage 22 .

The concave portion 19 of the case 21 is provided with a first push-up mechanism 23 and a second push-up mechanism 24 that push up the lower surface of the chip C over the sheet 2, and a suction portion 25 that sucks the sheet 2 downward.

The first push-up mechanism 23 includes a plurality of first push-up members 26 and a first driving section 27 that vertically moves the plurality of first push-up members 26 .

The plurality of first push-up members 26 are plate-shaped members as shown in FIG. is provided with a first push-up portion 26a that abuts on the lower surface of the chip C through the sheet 2, and connecting portions 26b are formed integrally with the first push-up portion 26a on both sides of the first push-up portion 26a in the first direction X. is provided.

The plurality of first push-up members 26 are arranged below the through hole 28 provided in the stage 22 with one end edge 26a1 of the first push-up portion 26a directed upward. As a result, one end edge 26a1 of the first thrust-up portion 26a vertically faces the lower surface of the chip C through the through hole 28 as a ridge along the first direction X in plan view.

The plurality of first push-up members 26 are arranged at intervals in a thickness direction Y of the first push-up members 26 orthogonal to the first direction X (hereinafter, this direction may be referred to as a second direction). . The interval D between the first thrust portions 26a adjacent to each other in the second direction Y is set larger than the thickness T of the first thrust portions 26a (see FIG. 3).

The first push-up portions 26a are preferably provided parallel to the periphery of the chip C in the first direction X in which the first push-up portions 26a extend, and are provided in the second direction Y at equal intervals. preferably. In addition, the distance E in plan view from the first raised portions 26a arranged at both ends in the second direction Y to the periphery of the chip C is smaller than the interval D between the first raised portions 26a adjacent to each other in the second direction Y. is preferably set. In addition, it is preferable that the length of the first push-up portion 26a in the first direction X is set shorter than that of the chip C so that it can be accommodated inside the chip C. As shown in FIG.

The plurality of first push-up members 26 arranged in this manner are connected to each other via spacers 31 at connecting portions 26b and connected to the first drive portion 27 as well. The first driving portion 27 is positioned such that one end edge 26 a 1 of the first push-up portion 26 a is flush with the upper surface of the stage 22 so as to contact the lower surface of the sheet 2 (see FIG. 4 ), or is positioned slightly below the sheet 2 . The plurality of first projections move between a position (hereinafter, this position may be referred to as a first retraction position) and a first projection position projecting upward from the upper surface of the stage 22 . The raising member 26 is moved up and down.

The second push-up mechanism 24 includes a plurality of second push-up members 30 and a second driving section 32 that vertically moves the plurality of second push-up members 30 .

The plurality of second push-up members 30 are cylindrical members extending upward as shown in FIGS. A two-push-up portion 30a is provided. The tip of the second raised portion 30a is preferably rounded in a tapered shape, and has a convex surface shape having a radius of curvature R larger than 1/2 of the thickness T of the first raised portion 26a. That is, it is more preferable that the diameter of the tip portion of the second raised portion 30a is larger than the thickness T of the first raised portion 26a. Further, when the tip of the second thrust-up portion 30a is flat, it is preferable that the diameter of the tip of the second thrust-up portion 30a is larger than the thickness T of the first thrust-up portion 26a.

The plurality of second push-up members 30 are arranged inside in the second direction Y from the first push-up portions 26a arranged at both ends in the second direction Y, and adjacent to the first push-up members 26 in the second direction Y. It is provided to be sandwiched between It is preferable that the second push-up portion 30a is arranged close to one of the two first push-up members 26 adjacent in the second direction Y and spaced apart in the first direction X. It is preferable that the distance d between the raised portion 26a and the second raised portion 30a is smaller than the diameter of the tip of the second raised portion 30a (twice the curvature radius R of the tip of the second raised portion 30a).

As shown in FIG. 4 , the lower ends of the plurality of second push-up members 30 are supported by a block-shaped support 33 , and the support 33 is connected to the second drive section 32 . The second driving portion 32 is positioned such that the tip of the second push-up portion 30a is positioned below the seat 2 as shown in FIG. The plurality of second push-up members 30 are vertically moved so as to move between the first push-up position and a second push-up position positioned above. In addition, it is preferable to set the second shunting position below one end edge 26a1 of the first push-up portion 26a arranged at the first shunting position.

The suction portion 25 is a space defined between the first thrust portions 26a adjacent to each other in the second direction Y. As shown in FIG. When one end edge 26a1 of the first push-up member 26 contacts the lower surface of the sheet 2, the suction unit 25 is depressurized together with the recess 19 of the case 21 by the decompression device 14, and the sheet 2 is pushed between the first push-up portions 26a. Adsorb.

Various dimensions of the push-up device 20 can be appropriately set according to the size, thickness, material, etc. of the chip C. As an example, the thickness T of the first push-up portion 26a is 0.1 mm to 1.5 mm. It can be 0 mm. It is preferably 0.1 mm to 0.5 mm, more preferably 0.1 mm to 0.2 mm. The curvature radius R of the second raised portion 30a can be 0.1 mm to 0.35 mm. The maximum value 0.35 mm of the radius of curvature R of the second push-up portion 30a is the radius of curvature when the diameter of the second push-up member is, for example, 0.7 mm. Not as long. The interval D between the first raised portions 26a adjacent to each other in the second direction Y can be set to 1 mm to 5 mm.

The control unit 50 includes a memory and a central processing unit (CPU), and the central processing unit executes a program stored in the memory to control the base 10, the thrusting device 20, and the collet 40 to move the chip C. It is separated from the sheet 2 by vacuum suction with the collet 40 .

Next, the operation of the chip peeling device 1 of this embodiment will be described with reference to FIG.

First, when the sheet 2 to which the chips C are adhered is placed on the base 10, the control unit 50 causes the through holes 28 of the stage 22 to be positioned below the chips C to be peeled off, as shown in FIG. 5(a). The base 10 is moved so that the base 10 is positioned, and the recess 19 and the groove 29 of the case 21 are decompressed by the decompression device 14 to suck the bottom surface of the sheet 2 onto the top surface of the stage 22 . In addition, the control unit 50 arranges the collet 40 above the chip C to be peeled from now, and moves the first thrusting part 26a and the second thrusting part 30a of the thrusting device 20 to the first and second retracted positions, respectively. place in position. At this time, it is preferable to dispose the first thrust-up portion 26a so that one end edge 26a1 of the first thrust-up portion 26a is in contact with the lower surface of the sheet 2. As shown in FIG. By arranging the one end edge 26 a 1 of the first push-up portion 26 a in this way, it is possible to prevent the sheet 2 and the chips C from being sucked into the through hole 28 due to the reduced pressure inside the recess 19 .

Then, the control unit 50 lowers the collet 40 to vacuum-suck the upper surface of the chip C, as shown in FIG. 5(b).

Then, as shown in FIG. 5(c), the control unit 50 operates the first drive unit 27 to move the first push-up portion 26a upward from the first retracted position to the first push-up position, The chip C is pushed upward together with the sheet 2. - 特許庁Further, the control unit 50 moves the collet 40 upward in synchronization with the upward movement of the first push-up portion 26a. At this time, since the sheet 2 is vacuum-adsorbed to the stage 22, the periphery of the chip C may be peeled off from the sheet 2, or the adhesion between the sheet 2 and the chip C may be reduced. Further, the sheet 2 is vacuum-sucked in the suction section 25 defined between the first thrust-up sections 26a, so that the sheet 2 may be peeled off from the chip C or the adhesive strength with the chip C may be reduced.

Then, as shown in FIG. 5(d), the control unit 50 operates the second drive unit 32 to move the second thrust-up part 30a while the first thrust-up part 26a is arranged at the first thrust-up position. The chip C is pushed upward together with the sheet 2 by moving upward from the second shunting position to the second thrust-up position. Further, the control unit 50 moves the collet 40 upward in synchronization with the upward movement of the second push-up portion 30a. As a result, the sheet 2 is vacuum-sucked at a portion where the second thrust-up portion 30a is not in contact with the chip C, and the sheet 2 is separated from the chip C, or the adhesion between the sheet 2 and the chip C is reduced.

Then, as shown in FIG. 5(e), the control unit 50 further moves the collet 40 upward to separate the chip C from the sheet 2 while keeping the second thrust-up part 30a at the second thrust-up position. and the chip C is carried out.

After peeling the chip C from the sheet 2, the control unit 50 moves the base 10 so that the through hole 28 of the stage 22 is positioned below the next chip C to be peeled. Further, after carrying out the chip C separated from the sheet 2, the control unit 50 moves the collet 40 above the chip C to be separated next. After that, the chips C are sequentially peeled off from the sheet 2 by repeating the above-described procedure.

In the chip peeling apparatus 1 of the present embodiment as described above, before the chips C are completely peeled off from the sheet 2, the chips C are separated from the sheet by the first raised portion 26a, which is a ridge extending along the first direction X. 2, the load applied to the chip C can be dispersed, and cracking of the chip C can be suppressed.

Moreover, in the present embodiment, since the thickness T of the first thrust-up portions 26a is smaller than the interval D between the adjacent first thrust-up portions 26a, the suction portion 25 partitioned between the plurality of first thrust-up portions 26a can be provided in a wide range on the lower surface of the chip C. As a result, when the chip C is pushed upward together with the sheet 2 by the first push-up portion 26a, the sheet 2 is peeled off from the chip C at the portion vacuum-sucked by the suction portion 25, or the adhesive strength with the chip C is reduced. can be made As a result, when the chip C is separated from the sheet 2 by the collet 40, it is possible to prevent an excessive load from being applied to the chip C at once, and the chip C can be separated from the sheet 2 while suppressing cracking. .

Further, the distance E between the first thrust-up portions 26a arranged at both ends in the second direction Y and the periphery of the chip C in plan view is greater than the distance D between the first thrust-up portions 26a adjacent to each other in the second direction Y. If it is small, the peripheral edge of the chip C can be peeled off while suppressing damage to the peripheral edge of the chip C. FIG.

If the length in the first direction X is set shorter than the chip C so that the first push-up portion 26a fits inside the chip C, the chip C is pushed upward by the first push-up portion 26a. When pushed up, both ends of the chip C in the first direction X are not pushed up together with the sheet 2 by the first push-up portions 26a. Therefore, both ends of the chip C in the first direction X can be separated from the sheet 2 when the chip C is pushed upward by the first push-up portion 26a.

Further, as in the present embodiment, when the second thrust-up portion 30a thrusts up the lower surface of the chip C at a position different from the first thrust-up portion 26a after the first thrust-up portion 26a pushes up the chip C, the chip C It can be peeled off in stages while distributing the load applied to it. Moreover, if the radius of curvature R of the tip of the second thrust-up portion 30a is larger than half the thickness T of the first thrust-up portion 26a, the tip of the second thrust-up portion 30a pushes up the chip C. Therefore, it becomes difficult for the load to be concentrated on the chip C, and cracking of the chip C can be prevented.

Further, as in the present embodiment, by arranging the second thrusting member 30 in close proximity to one of the first thrusting members 26 adjacent in the second direction Y, the tip by the first thrusting portion 26a can be reduced. The second push-up portion 30a does not push up the vicinity of the central portion in the second direction Y of the adsorption portion 25 where the sheet 2 is likely to be peeled off during the push-up of C. Therefore, when the chip C is pushed up by the second push-up portion 30a, the chip C can be smoothly peeled off from the sheet 2 starting from the point peeled from the chip C by the push-up of the first push-up portion 26a.

Further, as in the present embodiment, in a state in which the first push-up portion 26a pushes up the lower surface of the chip C over the sheet 2, the second push-up portion 30a moves to the second push-up position and pushes over the sheet 2. In the case of pushing up the lower surface of the chip C, the chip C can be pushed up by the second pushing-up part 30a from a state where a part of the sheet 2 is peeled off from the chip C, and the chip C can be peeled off smoothly.

Further, as in the present embodiment, the collet 40 sucks the upper surface of the chip C, and the first thrust-up portion 26a pushes up the lower surface of the chip C over the sheet 2, thereby pushing up the chip. It is possible to disperse the load applied to the chip C at that time, and to suppress cracking of the chip C.

Although embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, as well as the scope of the invention described in the claims and equivalents thereof. Examples of modifications are listed below.

(Modification 1)
Next, Modification 1 of the above-described embodiment will be described. In the above-described embodiment, a case has been described in which the first push-up portion 26a and the second push-up portion 30a push up the chip C in order, and then the collet 40 sucks the chip C and separates it from the sheet 2. After the push-up portion 26 a pushes up the chip C, the chip C may be adsorbed by the collet 40 and peeled off from the sheet 2 without the second push-up portion 30 a pushing up the chip C.

(Modification 2)
Next, Modification 2 of the above-described embodiment will be described. In the above-described embodiment, the case where the first thrusting mechanism 23 and the second thrusting mechanism 24 are provided in one case 21 has been described. can be stored in the recess of

Specifically, the first push-up mechanism 23 is arranged below the chip C, and the first push-up part 26a of the first push-up mechanism 23 is moved from the first retracted position to the first push-up position to lift the chip C. is pushed up, the first push-up portion 26a is returned to the first retracted position. Then, after moving the first push-up mechanism 23 from below the chip C to below another chip C, the second push-up mechanism 24 is arranged below the chip C to raise the second push-up portion 30a. In a state where the chip C is pushed up by moving from the second retraction position to the second thrust-up position, the chip C is sucked by the collet 40 and separated from the sheet 2, and the chip C is taken out.

(Modification 3)
Next, Modification 3 of the above-described embodiment will be described. In the above-described embodiment, the case where the first thrust-up portion 26a is provided as a continuous ridge along the first direction X in plan view has been described, but the first thrust-up portion 26a is divided in the middle. ridges along the first direction X may be used.

Further, in the present embodiment, the case where the first push-up portion 26a is a plate-shaped member having a substantially constant thickness has been described, but the first push-up portion 26a is a blade whose thickness becomes thinner as the upper end portion thereof goes upward. It may be a member having a shape. When the first push-up portion 26a has a blade shape, the tip of the first push-up portion 26a has a convex surface shape with a radius of curvature smaller than the radius of curvature of the tip of the second push-up portion 30a. is more preferred.

Further, in the above-described embodiment, the case where the second thrust-up portion 30a is provided in a tapered columnar shape has been described, but the second thrust-up portion 30a may be a ridge extending in the first direction X or a ridge extending in the second direction. Any shape such as a ridge extending in Y may be set.

(Modification 4)
Next, Modification 3 of the above-described embodiment will be described. In the above-described embodiment, the case where the upper surface of the chip C is vacuum-sucked by the collet 40 and then the chip C is pushed up by the first pushing-up portion 26a and the second pushing-up portion 30a has been described. After the chip C is pushed up, the upper surface of the chip C is vacuum-sucked by the collet 40, or after the chip C is pushed up by the first thrusting part 26a and the second thrusting part 30a, the upper surface of the chip C is vacuum-sucked by the collet 40. You can

REFERENCE SIGNS LIST 1 peeling device 2 sheet 10 base 11 wafer ring 12 expand ring 13 support ring 14 decompression device 19 concave portion 20 push-up device 21 case 22 stage , 23... First push-up mechanism, 24... Second push-up mechanism, 25... Adsorption part, 26... First push-up member, 26a... First push-up part, 26a1... One end edge, 26b... Connecting part, 27... First drive part 28 Through hole 29 Groove 30 Second push-up member 30a Second push-up part 31 Spacer 32 Second drive part 33 Support 40 Collet 50... control section, C... chip, X... first direction, Y... second direction

Claims (10)

A chip peeling device for peeling a chip attached to a sheet from the sheet,
a base on which the sheet and the chip attached to the upper surface of the sheet are placed;
A plurality of first push-up portions, which are protrusions along the first direction in plan view, are provided on the lower side of the sheet at predetermined intervals in a second direction orthogonal to the first direction, and the plurality of a first push-up mechanism in which the first push-up portion moves upward to push up the lower surface of the chip over the sheet;
a suction unit that is provided between the first push-up portions and sucks the sheet downward while the first push-up portions are in contact with the lower surface of the sheet;
A chip peeling device in which the thickness of the first thrust-up portion is smaller than the interval between the adjacent first thrust-up portions. The chip has a rectangular shape in plan view,
the first direction is provided parallel to the periphery of the chip;
2. The first thrust portions arranged at both ends in the second direction have a distance from a peripheral edge of the chip in a plan view smaller than an interval between the first thrust portions adjacent to each other in the second direction. The chip peeling device according to 1. 3. The chip peeling device according to claim 1, wherein the first push-up portion is accommodated inside the chip in plan view. 2. A vacuum device for decompressing the interior of said recess, wherein said first push-up mechanism and said adsorption portion are provided inside said recess. 4. The chip peeling device according to any one of 1 to 3. A second push-up portion provided between the adjacent first push-up portions,
The tip according to any one of claims 1 to 4, wherein after the first thrusting part pushes up the tip, the second thrusting part moves upward to push up the lower surface of the chip over the sheet. peeling device. 6. The chip peeling device according to claim 5, wherein said second thrust-up portion has a tapered columnar shape. 7. The tip peeling device according to claim 6, wherein the tip of the second thrust portion is rounded, and the radius of curvature of the tip of the second thrust portion is larger than 1/2 of the thickness of the first thrust portion. . After the plurality of first push-up portions move upward and push up the lower surface of the chip over the sheet, the second push-up portions are moved while holding the positions of the plurality of first push-up portions. The chip peeling device according to any one of claims 5 to 7, which moves upward and pushes the lower surface of the chip over the sheet. A collet for sucking the upper surface of the chip is provided,
The chip peeling device according to any one of claims 1 to 8, wherein the collet attracts the upper surface of the chip while the plurality of first thrusting portions pushes the lower surface of the chip over the sheet. The chip peeling device according to any one of claims 1 to 9, wherein the thickness of the first thrust portion is 0.1 mm or more and 1.0 mm or less.

Images