JPS63255937A - Chip mounting equipment - Google Patents

Abstract

PURPOSE:To prevent the cracking of a chip at the time of pick-up, by performing a control wherein a second toss member is pushed up after a first toss member is pushed up, and then the first toss member descends. CONSTITUTION:A first toss member 14 pushes up a chip 13 in the state where a shock is released, and a second toss member 15 acts to retain the chip 13 in the manner in which an expand tape 16 exfoliates from the peripheral part of the chip 13. Therefore, the expand tape 16 is easily exfoliated, and the large attractive force of a collet 11 is not necessary to be large, so that the semiconductor chip 13 is not sucked by an excessive attractive force. Thereby, the generation of crack at the time of attraction to the collet can be prevented.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applied to chip packaging used for packaging small electronic components such as semiconductor chips, chip capacitors, and chip resistors into packages or storing them separately in cases. Regarding equipment.

[Conventional technology]

In the manufacture of semiconductor devices, semiconductor chips are picked up in order to die-bond the semiconductor chips formed from a semiconductor wafer one by one into a package. In this case, the semiconductor wafer is diced onto an expanded tape and separated into individual semiconductor chips, and a chip mounting device is used to separate the semiconductor chips from the expanded tape and transport them to a package.

FIGS. 3 and 4 are diagrams showing a conventional example of a semiconductor chip mounting apparatus as an example of such a chip mounting apparatus. This device consists of a collet 1 connected to a vacuum suction means (not shown), and a push-up pin 2 that moves up and down below the collet 1.
It is equipped with

Semiconductor chips 3, which are individually separated by dicing the semiconductor wafer, are transported between the collet 1 and the push-up pins 2 while being supported by the expandable tape 4 adhered to the bottom surface of the semiconductor wafer during dicing. .

By this conveyance, the semiconductor chip 3 is transferred to the suction port 5 of the collet 1.
When reaching the lower part, the push-up pins 2 push up the bottom surface of the expandable tape 4 and push up the semiconductor chip 3 in the direction of the suction port 5. As a result, the expanding chip 14 curves upward, and the semiconductor chip 3 is sucked toward the suction port of the collet 1 by the suction force of the collet 1. Therefore, the expanding chip 14 is gradually peeled off from the periphery of the lower surface of the semiconductor chip 3, and the expanding tape 4 and the semiconductor chip 3 are separated, and the semiconductor chip 3 is attracted to the suction port 5 of the collet 1, and in this state. Daihonding will be held.

By the way, semiconductor chips made of compound semiconductors such as gallium arsenide (GaAs > gallium phosphide (GaP)) have recently become larger, with each side measuring approximately 5M or more. The device shown in FIG. 4 is used because it is necessary to prevent the semiconductor chip 3 from cracking due to impact and to reliably push the semiconductor chip 3 up in the direction of the collet 1. Four push-up pins 2 are provided that abut on each of the four push-up pins 2, and the four push-up pins 2 simultaneously push up the four corners of the semiconductor chip 3 from the bottom surface of the expandable tape 4. The stress applied locally to the semiconductor chip 3 during lifting is alleviated, and the stress when the pins are pushed up and picked up by the collet 1 is alleviated.

[Problems to be Solved by the Invention] However, in a conventional device equipped with a plurality of push-up pins 2, all push-up pins 2 simultaneously touch the semiconductor chip 3.
Since the expandable tape 4 is in contact with the lower surface of the semiconductor chip 3, it is attracted to the collet 1 while completely adhering to the lower surface of the semiconductor chip 3. Therefore, the semiconductor chip 3 is expanded into the expanded chip 7.
In order to peel and pick up from 4, use collet 1.
It is necessary to increase the suction force of the collet 1, and this suction force causes the semiconductor chip 3 to break at the suction port 5 of the collet 1 more frequently.

Note that the above-mentioned situation occurs not only in the mounting of semiconductor chips but also in small electronic components such as chip capacitors and chip resistors. That is, when a small electronic component in the form of a chip increases in size or becomes an elongated plate, cracks occur due to the adhesive force of the expandable tape and the suction force of the collet.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip mounting apparatus that can peel off even a large chip from an expandable tape without increasing the suction force.

[Means for Solving the Problems] The chip mounting apparatus according to the present invention includes a first
A push-up member and a second push-up member supporting the center portion of the lower surface of the chip are used together, and after the first push-up member pushes up, the second push-up member is pushed up, and then the first push-up member is pushed up.
The thrusting member is controlled to descend.

[Effect]

Since the chip mounting apparatus according to the present invention is configured as described above, the first push-up member acts to push up the chip while reducing the impact, and the second push-up member acts to push up the chip with the expanded tape. It acts to support the chip so that it can be peeled off from the periphery of the chip.

〔Example〕

Hereinafter, some embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in the description of the drawings, the same elements are given the same reference numerals, and redundant description will be omitted.

FIG. 1 is a diagram showing the configuration and operation of a semiconductor element mounting apparatus as an example of a chip mounting apparatus according to an embodiment. As shown in the figure, a collet 11 having a suction port 12 at the bottom is disposed above, and the collet 11 is connected to suction means (not shown). A plurality of push-up pins are provided below the collet 11 so as to be movable up and down. The push-up pin is the first
As shown in the figure, with respect to the semiconductor chip 13, there are four outer push-up pins (first push-up members) 14 that come into contact with the four corners of the bottom surface of the semiconductor chip 13, and four inner push-up pins that come into contact with the center of the bottom surface. (second push-up member 15).

Each of the push-up pins 14 and 15 has a sharp upper end, and the outer push-up pins 14 all move up and down at the same time, and the inner push-up pins 15 all move up and down at the same time. These rises act to push up the semiconductor chip 13 from the lower surface of the expanded chip 116 toward the collet 11. Here, as described above, the control is such that the outer push-up pin 14 first rises, then the inner push-up pin 15 rises, and then the outer push-up pin 14 descends.

Next, the operation of the mounting apparatus according to this embodiment will be explained.

Semiconductor chips 13 are formed by dicing a semiconductor wafer.
are divided into individual parts, and are conveyed between the collet 11 and the push-up pins 14, 15 while being glued onto the expanding band chi 116. When the semiconductor chip 13 reaches below the suction port 12 of the collet 11 during this conveyance, the outer push-up pins 14 rise as shown in FIG. The semiconductor chip 13 is pushed up in the direction of the collet 11.
4 simultaneously abut against the lower surface of the semiconductor chip 13, the impact is alleviated and cracking of the semiconductor chip 13 due to pushing up is prevented. Outer push-up pin 1
4, the semiconductor chip 13 is attracted to the suction port 13 of the collet 11 with the expanded tape 16 adhered thereto.

Next, as shown in Fig. 1(b), the inner push-up pin 1
5 rises and contacts the center portion of the bottom surface of the semiconductor chip 13 from the bottom surface of the expandable tape 16. Until this contact, the semiconductor chip 13 is supported by the outer push-up pin 14, and when the inner push-up pin 15 comes into contact with the expandable tape 16, the outer push-up pin 14 descends and separates from the expanded tape 16. As a result, the semiconductor chip 13 is in a state where only the central portion is supported by the inner push-up pins 15.
The extrusion band 116 gradually peels off from the periphery of the semiconductor chip 13 toward the center. When the inner push-up pin 15 descends, the adhesive surface has already decreased, so the adhesive force as a whole is weak, and eventually the semiconductor chip 1
3 Peel off from the entire bottom surface. Therefore, extract band 1
Since the chip 16 is easily peeled off, there is no need to increase the suction force of the collet 11, and the semiconductor chip 13 is not attracted by excessive suction force, thereby preventing cracking when adsorbed to the collet 11. Can be done.

This type of pickup of semiconductor chips is particularly effective for large semiconductor devices with a ratio of the length of one side g to the main thickness N/l of 10 or more for compound semiconductors made of gallium arsenide, and for compound semiconductors made of gallium arsenide. If it is a crystal, it is particularly effective for large semiconductor chips with the above ratio of 15 or more.

FIG. 2 shows a perspective view of another embodiment of the invention.

In the device shown in the figure (a), the push-up member is constituted by an outer cylinder 17 and an inner circular shaft 18. In addition, in the figure (b), an outer cylinder 19 and an inner circular shaft 18 constitute a thrusting member. The body 20 is formed into a rectangular shape, and in the figure (C), the inner shaft body 22 is formed into a circular shape with respect to the rectangular outer cylinder body 21.

In these embodiments, the outer cylinder]7°19.2
1 is the semiconductor chip 13 from the bottom surface of the expanded tape 16
collet 11, and the semiconductor chip 13 is brought into contact with the peripheral part of the collet 11.
It pushes up in the direction, and corresponds to the outer push-up pin (first push-up member)]4 provided in the above-mentioned embodiment. Further, the inner shaft bodies 18, 20.22 are in contact with the center portion of the semiconductor chip 13 to support the semiconductor chip 13 when the expansion chip 716 is peeled off, and are similar to the inner push-up pins in the above-described embodiment. (Second push-up member) 15
corresponds to Therefore, such cylinders 17, 19, 21
And also by the combination of shaft bodies 18, 20.22,
It becomes possible to pick up semiconductor chips without causing cracks.

The present invention is not limited to the above embodiments, and various modifications are possible.

For example, the number of outer push-up pins that push up the peripheral portion of the semiconductor chip may be five or more, since the outer push-up pins push up the semiconductor chip toward the collet while reducing the impact. In addition, since the semiconductor chip is attracted to the collet, the number of inner push-up pins that support the central part of the semiconductor chip may be small;
It may be three books. Alternatively, the inner push-up pin and the cylindrical body or the outer push-up pin and the shaft body may be combined.

The present invention is applicable not only to picking up semiconductor chips from expanded tape, but also to various small chip-shaped parts (
For example, it can also be applied to pickup of chip capacitors, chip resistors, etc.).

〔Effect of the invention〕

As described above in detail, the chip mounting apparatus according to the present invention includes a first push-up member that pushes up the peripheral portion of the chip, and a second push-up member that supports the central portion of the chip after the push-up. Since it is composed of a lifting member, the impact at the time of lifting is alleviated, and the expandable tape is easily peeled off. Therefore, there is no need to increase the suction force of the collet even when the chip is large, and cracking of the chip during pickup can be prevented, which has the effect of improving the pick-up rate.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway side view showing the operation of a semiconductor element mounting apparatus according to the present invention, FIG. 2 is a perspective view of another embodiment, and FIGS. 3 and 4 are perspective views of a conventional apparatus. 11...] Collet 13... Semiconductor element, 14...
・Outer push-up pin (first push-up member), 15...
Inner push-up pin (second push-up member), 16... Expand tape, 17, 19, 21... Cylindrical body (first
push-up member>, 18, 20. 22... shaft body (second push-up member). Patent applicant: Sumitomo Electric Industries, Ltd. Representative Patent Attorney Yoshi Hase
Example 4 Figure 1 Example 1

Claims (1)

[Scope of Claims] 1. In a chip mounting apparatus that pushes up a chip bonded on an expanding tape from the lower surface of the expanding tape toward the collector, a first pushing-up member that pushes up a peripheral portion of the lower surface of the chip; a second push-up member that supports a central portion of the lower surface of the chip, the second push-up member is pushed up after the first push-up member is pushed up, and then the first push-up member is pushed up; A chip mounting device characterized in that it is controlled to descend. 2. Claim 1, wherein the first pushing-up member is at least four pins pushing up the four corners of the chip.
Chip mounting equipment as described in section. 3. The chip mounting apparatus according to claim 1, wherein the second pushing-up member is at least two pins that support the center portion of the chip. 4. The chip mounting apparatus according to claim 1, wherein the first pushing-up member is a cylindrical body that comes into contact with the entire periphery of the chip. 5. The chip mounting apparatus according to claim 1, wherein the second pushing-up member is a shaft body that comes into contact with the center portion of the chip.