JPH0623299U - Semiconductor component supply device - Google Patents

Abstract

(57) [Abstract] [Purpose] A plurality of IC chips, that is, semiconductor components, are pushed up from below by a push-up mechanism, and sucked and held by a suction mechanism from above, and are conveyed onto a lead frame by a conveying means together with the suction mechanism. A semiconductor component supply device for supplying, which does not require any adjustment work for setting the rising limit position of the thrust member when exchanging the thrust member included in the thrust mechanism or changing the type of IC chip. Providing equipment. The IC chip 2 is pushed up by a push-up operation of a push-up member 50 included in the push-up mechanism 4, and thereby the suction portion 7 abutting on the upper surface of the IC chip 2.
7 is pushed up together with the IC chip by this push-up amount, and a detection signal is issued from the detection means 92, and the push-up operation by the push-up mechanism 4 is stopped based on the detection signal to obtain the above-mentioned effect. It was

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is a semiconductor component incorporated as a part of a bonding device for mounting an IC chip, that is, a semiconductor component on a lead frame and bonding a pad (electrode) of the IC chip and a lead provided on the lead frame. Regarding supply equipment.

[0002]

[Prior art]

 Conventionally, as a bonding apparatus provided with such a semiconductor component supply device, there is a bonding device (not shown) in which a die bonding device, a curing device and a wire bonding device are installed in a line. Since each of these devices is well known, only the following description will be given.

First, the die bonding apparatus stores a large number of IC chips obtained by cutting a disk-shaped wafer, and uses a thermosetting adhesive or the like to place the IC chips at predetermined positions on a lead frame. The IC chips are mounted in sequence and sent out to the curing device in the subsequent stage.

On the other hand, the curing device receives the lead frame fed from the die bonding device, heats the adhesive so as to solidify the adhesive, and then feeds it toward the wire bonding device arranged in the subsequent stage. The wire bonding device receives the lead frame and bonds the lead formed on the lead frame and the pad of the IC chip mounted on the lead frame using a wire made of gold, aluminum, or the like. To do.

The semiconductor component supply device described above is provided in the die bonding device described above, and its configuration is schematically shown in FIG.

As shown in FIG. 12, the semiconductor component supply device has an annular turntable 101, and a sheet 104 is stretched on the turntable 101 by a flat ring 102. The turntable 101 is movable in the front-rear direction (the arrow Y direction and the opposite direction) and the left-right direction (the arrow X direction and the opposite direction), and is rotatable in a plane including the respective directions. The table drive means (not shown) moves and rotates in the respective directions.

The sheet 104 is made of, for example, a resin, and a large number of IC chips 106 are attached and stored in an array state on the surface thereof. These IC chips 106 are obtained by cutting a circular wafer (not shown) in another step.

An elevating shaft 108 is provided on the lower surface side of the seat 104 so as to be vertically movable, and a plurality of protruding needles 109 as protruding members are extended upward at the upper end portion of the elevating shaft 108. It is installed so that Further, a cam follower 108a is provided at the lower end of the elevating shaft 108, and the cam 110 slidingly contacting the cam follower 108a is driven to rotate by a driving means (not shown) so that the elevating shaft 108 operates. Has been done.

An optical sensor 112 for detecting that the elevating shaft 108 has reached a required ascending position and an optical sensor for detecting that the elevating shaft 108 has reached a descending position are provided on the side of the elevating shaft 108. And 113 are arranged. The required raised position is a raised position sufficient to push up the IC chip 106 on the sheet 104 with the push-up needle 109 to separate it. The optical sensors 112 and 113 are, for example, transmissive photocouplers, and the irradiation light emitted from the light emitting element provided to each of them to the light receiving element is blocked by the light shielding plate 114 fixed to the elevating shaft 108. Emits a detection signal.

On the other hand, a suction mechanism 117 is arranged on the upper surface side of the sheet 104. The suction mechanism 117 is provided on the tip transfer arm 118 as a base body and on the tip of the tip transfer arm 118 so as to be vertically movable (indicated by an arrow S) within a predetermined range to suction the IC chip 106. And an adsorbing section 119 for operating. Specifically, the suction portion 119 includes a mounting base 119a that is vertically movable with respect to the chip transfer arm 118, and a suction collet 119b that is mounted on the lower end of the mounting base 119a and performs a suction function. It should be noted that the fact that the mount 119a is vertically movable with respect to the chip transfer arm 118 is not directly related to the suction operation described later, and acts when the suction-held IC chip 106 is mounted on the lead frame. Is. Further, a negative pressure is applied to the suction collet 119b through a chave (not shown), so that the IC chip 106 is sucked.

Although not shown, a transport means for carrying the chip transport arm 118 and carrying it is provided, and by the operation of the transport means, the suction part 119 suctions the sheet 104. It is moved between the vicinity of the IC chip 106 to be mounted and a predetermined position on a lead frame (not shown) provided at another position for mounting the IC chip.

In the semiconductor component supply device having the above-described configuration, the suction operation of the IC chip 106 on the sheet 104 is performed as follows.

First, the above-mentioned conveying means is operated to bring the chip transfer arm 118 to the upper side of the sheet 104 so that the suction collet 119b is located directly above the IC chip 106 to be sucked. Then, the chip transfer arm 118 is lowered to bring the suction collet 119b closer to the IC chip 106. In this state, a negative pressure is applied to the suction collect 119b, and a suction force is generated.

Then, as shown in FIG. 13, the chip transfer arm 118 is moved upward so as to suck the IC chip 106 and separate it from the sheet 104. Then, in synchronization with this, the ascending / descending operation of the elevating shaft 108 is performed, and the IC chip 106 is pushed up by the push-up needle 109. In detail, the cam 110 is driven from the state shown in FIG. 12 to the state shown in FIG. 13 by the driving means (not shown), and the elevating shaft 108 ascends, and the light shielding plate 114 blocks the light of the upper optical sensor 112. At the time point, the driving means is deactivated based on the detection signal generated from the optical sensor 112. The push-up of the IC chip 106 by the push-up needle 109 is performed because the suction force of the suction collet 119b is not sufficient to peel the IC chip 106 from the sheet 104. Further, as described above, since the IC chip 106 is peeled from the sheet 104 in a state of being sandwiched by the push-up needle 109 and the suction collet 119b, the IC chip 106 may be laterally displaced during the peeling operation and fall off. There is no.

Thus, the IC chip 106 is peeled from the sheet 104, and is suction-held by the suction collet 119b.

After that, by the operation of the carrying means, the suction collet 119b is carried together with the held IC chip 106 onto a lead frame provided at another position, and the IC chip is mounted on the lead frame. It

[0017]

[Problems to be solved by the device]

 In the above-described semiconductor component supply device, when the push-up needle 109 that pushes up the IC chip 106 is worn or deformed, it is replaced. Further, even when the type of IC chip to be handled is changed, the amount of push-up required for peeling from the sheet changes depending on the area of the newly handled IC chip, etc. The protruding needle is replaced to match it.

In this way, when exchanging the protruding needle, depending on the change in the needle length due to the exchanging with the different type of the protruding needle, the needle length may be changed even when the needle is replaced with the same type of the protruding needle. And the attached state of the needle to the elevating shaft 108 also slightly shifts each time, so that the height of the needle also varies. In order to always reliably peel off the IC chip attached to the sheet and push it up, it is necessary to correct this variation, and therefore, the optical sensor 112 for setting the upper limit position of the upward movement of the thrust needle. The position is adjusted appropriately.

However, performing the position adjustment of the optical sensor every time the push-up needle is replaced or the IC chip type is changed as described above has a drawback that a great deal of labor and time is required.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and a semiconductor component supply device which does not need to perform adjustment work relating to the replacement of the thrust member and the semiconductor component type change. It is intended to be provided.

[0021]

[Means for Solving the Problems]

 The semiconductor component supply device according to the present invention comprises a suction mechanism having a substrate portion conveyed by a conveying means and a suction portion movably attached to the substrate portion for sucking a semiconductor component, and the suction mechanism for the substrate portion. And a protrusion mechanism that includes a protrusion member that is arranged to face the suction mechanism via a plurality of arranged semiconductor components and that pushes up the semiconductor components. The mechanism and the suction mechanism are each independently operable and are configured to control the thrusting operation by the thrusting mechanism in response to a detection signal emitted from the detection means.

[0022]

【Example】

 Next, a semiconductor component supply apparatus as an embodiment of the present invention will be described with reference to the accompanying drawings. This semiconductor component supply device stores a large number of IC chips (described later), sucks and holds each of them one by one, and conveys them to a predetermined position on a lead frame (not shown) provided at another position and mounts them. Is.

As shown in FIG. 1, the semiconductor component supplying apparatus includes a stocker (not shown as a whole) including a turntable 1 and a large number of IC chips 2 and a lower part of the turntable 1. The push-up mechanism 4 that pushes up the IC chips 2 stored in the stocker one by one, and the suction mechanism 6 that is located above the turntable 1 and suction-holds the pushed IC chips 2. And a carrying means 8 carrying the suction mechanism 6 and carrying it to the vicinity of the lead frame.

As shown in FIG. 1, a seat 14 is stretched by a flat ring 12 on a turntable 1 which is a constituent member of the stocker. The turntable 1 is movable in the front-back direction (arrow Y direction and its opposite direction) and left-right direction (arrow X direction and its opposite direction), and is rotatable in a plane including the respective directions. The table drive means (not shown) moves and rotates in each direction.

The sheet 14 is made of, for example, a resin, and a large number of IC chips 2 are attached and stored in an array state on the surface thereof. These IC chips 2 are obtained by cutting a circular wafer (not shown) in another step.

Further, the push-up mechanism 4 is arranged so as to face the upper suction mechanism 6 via the IC chips 2 and is configured as follows.

As shown in FIGS. 2 to 4, the push-up mechanism 4 has a bracket 21 fixed to the apparatus frame by bolts (reference numerals are not attached). As shown in FIG. 2, a guide rail 22 is attached to the bracket 21 so as to extend in the vertical direction, and a slider 23 guided by the guide rail 22 is provided. The movable base 25 is fastened to the slider 23 with a bolt (not shown).

On the other hand, as shown in FIG. 3, an air cylinder 26 is fixedly installed on the bracket 21 so that the rod 26 a projects upward. The tip of the rod 26a and the movable base 25 are connected by connecting members 28a, 28b and bolts (reference numerals are not attached), and the movable base 25 is operated by the operation of the air cylinder 26. Is designed to move up and down. As is apparent from FIG. 3, the connecting member 28a is movably inserted into the opening 21a formed in the web portion of the bracket 21. Further, as shown in the figure, an adjusting screw 30 is screwed onto the upper end portion of the web portion, and the tip of the screw portion can come into contact with the upper surface of the connecting member 28a. That is, by appropriately turning the adjusting screw 30, the upper limit movement position of the movable base 25 is set.

As shown in FIGS. 2 and 4, on the side of the bracket 25, two optical sensors 32 and 33 for detecting that the movable base 25 has reached its upper and lower movement limit positions are provided. It is installed. Specifically, these optical sensors 32 and 33 are fixed to two mounting plates 36 fastened to the bracket 25 by two bolts 35 by means of machine screws (reference numerals are not attached). The insertion holes 36a formed in the mounting plate 36 for inserting the bolts 35 are elongated holes extending in the vertical direction, and the lengths of the elongated holes can be reduced by loosening the bolts 35. The position of each optical sensor 32, 33 can be adjusted within the range.

Each of the above-described optical sensors 32 and 33 is, for example, a photocoupler including a light emitting element and a light receiving element, and a light shielding plate 38 as a detected object attached to the movable base 25 changes from the light emitting element to the light receiving element. A detection signal is emitted by blocking the irradiation light emitted toward the target.

A shaft 40 having a substantially cylindrical shape is attached to the upper portion of the movable base 25 described above by means of bolts (reference numeral is not attached). A rod 41 is inserted in the shaft 40 with a gap 42, and is held so as to slide smoothly by sleeve bearings 45 provided at both upper and lower ends of the shaft 40. The sleeve bearing 45 also has an airtight function.

As shown in FIG. 5, a needle guide 47 formed in a cylindrical shape with one end substantially closed is fitted to the upper end portion of the shaft 40. As shown in FIG. 3, an O-ring 47 a is provided between the lower end portion of the needle guide 47 and the shaft 40 to obtain an airtight state in the internal space of the needle guide 47. The upper end portion of the rod 41 reaches the internal space of the needle guide 47, and a plurality of protruding needles 50 as protruding members are planted in the upper end portion via a mounting block 48. These push-up needles 50 can be projected and retracted through guide holes (not shown) formed in the upper end portion of the needle guide 47, that is, the closed end portion.

As is particularly clear from FIG. 3, a hole 41a extending in the longitudinal direction of the rod 41 is formed in the upper end portion of the rod 41, and the side wall portion of the hole 41a passes through the hole 41a. Communication holes 41b and 41c for communicating the internal space of the shaft 40 and the internal space of the needle guide 47 are formed. As also shown in FIG. 3, a nipple 52 is attached to the lower end of the shaft 40 so as to communicate with the internal space of the shaft 40. Air is sucked through the nipple 52 by a negative pressure applying means (not shown), and a negative pressure is applied to the inner space of the needle guide 47 communicating with the inner space of the shaft 40 as described above, and thus the needle guide 47. Negative pressure is generated on the upper end surface of.

On the other hand, as shown in FIG. 3 and FIG. 4, a ball bearing 54 as a cam follower is attached to the lower end of the rod 41 having the push-up needle 50 attached to the upper end. As is clear from the drawings, another ball bearing 57 is attached near the lower end portion of the rod 41 by a mounting member 56 and a bolt (reference numeral is not attached), and the movable base 25 The ball bearing 57 is adapted to roll along a guide member 59 fastened to the side end of the member by a bolt (not shown). That is, the rod 41 is vertically movably guided by the guide member 59 and the sleeve bearings 45 provided at the upper and lower portions of the shaft 40.

As shown in FIGS. 3 and 4, below the rod 41, a cam 61 is arranged so as to come into contact with the ball bearing 54 as the cam follower described above. The cam 61 is fitted in the central portion of a shaft 64 that is rotatably attached to the movable base 25 by a pair of ball bearings 63, and the rod 41 is driven up and down by the rotation of the cam 61. . As shown in FIGS. 3 and 4, a coil spring 41d that applies a downward biasing force to the rod 41 is provided, and the coil spring 41d is planted in the movable base 25. It is installed between the pin 25a and the attachment member 56 fixed to the rod 41.

As shown in FIGS. 2 and 4, a belt wheel 65 is fitted to one end of the shaft 64 described above. As shown in FIG. 2, a motor 68 is attached near the lower part of the movable base 25 via an attachment plate 67, and the belt wheel 69 fitted to the output shaft 68a of the motor 68 and the above belt. A belt 70 is wound around the car 65.

On the other hand, as shown in FIG. 4, a disc-shaped sensing plate 72 is fitted to the other end of the shaft 64. An optical sensor 73 is arranged corresponding to this sensing plate 72, and is attached to the movable base 25 via a small bracket 73a. The sensing plate 72 and the optical sensor 73 constitute a means for confirming the rotation angle of the cam 61.

That is, the optical sensor 73 is composed of, for example, a photocoupler, and irradiation light emitted from the light emitting element included in the photosensor 73 passes through a light transmitting hole (not shown) formed in the sensing plate 72 to a light receiving element of the opposite example. A detection signal is emitted upon incidence.

Next, the suction mechanism 6 shown in FIG. 1 will be described.

As shown in FIGS. 1 and 5 to 10, the suction mechanism 6 includes a chip transfer arm 76 as a base portion carried and carried by the carrying means 8 shown in FIG. 1, and the chip carrying arm. A suction portion 77 for suctioning the IC chip 2 is provided at the front end of 76 so as to be movable in the vertical direction within a predetermined range (indicated by an arrow S in FIGS. 8 and 9). . Specifically, the suction part 77 includes a mounting base 77a that is vertically movable with respect to the chip transfer arm 76, and a suction collet 77b that is fitted to the lower end of the mounting base 77a and performs a suction function. Consists of.

As is particularly clear from FIG. 9, the mounting base 77a is formed in a cylindrical shape except for the lower end portion to which the suction collet 77b is fitted, and the support block 79 is fitted to the upper end portion. . The support block 79 is brought into contact with the upper surface of the tip end portion of the chip transfer arm 76, so that the mounting base 77a is supported in a supported state. Then, as shown in FIGS. 5 and 6 and FIGS. 8 and 10, the mount 77a is smoothly moved up and down by a plurality of ball bearings 82 attached to the tip of the chip transfer arm 76 by screw pins 81. Be guided. It should be noted that these ball bearings 82 are not shown in FIG.

Further, as shown in FIGS. 5 to 7, 9 and 10, a slide pin 83 is provided at one end of the support block 79 so as to extend downward, The slide pin 83 is slidably fitted in a guide hole 76a (shown in FIG. 9) formed in the transfer arm 76. Further, a plurality of ball bearings 86 are attached to the chip transfer arm 76 by screw pins 85, and the ball bearings 86 are in contact with the slide pins 83.

As shown in FIGS. 7 and 8, between the tip portion of the chip transfer arm 76 and the support block 79, the movable portion including the support block 79 and the suction portion 77 is moved downward. A coil spring 88 that applies a biasing force is installed.

As is clear from FIG. 9, a nipple 90 (also shown in FIG. 5) is attached to the support block 79, and the nipple 90 and the internal space of the mounting base 77 a are attached to the support block 79. Is formed with a hole 79a communicating with each other. A tube 91 is connected to the nipple 90, and air is sucked through the tube 91 by negative pressure applying means (not shown). This negative pressure passes through the hole 79a and the mounting base 77a and reaches the suction collet 77b, so that a negative pressure is generated on the lower surface, that is, the suction surface of the suction collet 77b.

As is especially clear from FIG. 9, a magnetic proximity sensor 92 is provided near the tip of the detection head near the tip of the chip transfer arm 76 that movably holds the suction part 77 including the mount 77a and the suction collet 77b. It is installed with facing up. The supporting block 79 on the movable side is provided with a metal piece 93 having a high magnetic permeability as a detected body corresponding to the tip of the detection head. The distance that the magnetic proximity sensor 92 can detect is in the range of 0 to 1.0 mm, for example. The magnetic proximity sensor 92 and the metal piece 93 constitute detection means for detecting the movement of the suction portion 77 with respect to the chip transfer arm 76, which is the base portion.

Next, the transport means 8 (shown in FIG. 1) that transports the above-mentioned suction unit 77 together with the chip transfer arm 76 holding the suction unit 77 will be described.

As shown in FIG. 1, the transfer means 8 includes a base 95 fixedly mounted on the apparatus base 2 (not shown), and a front-back direction (the arrow Y direction and the opposite direction) on the base 95. And a second table 97 mounted on the first table 96 so as to reciprocate in the left-right direction (arrow X direction and the opposite direction). is doing. A male screw 96a is provided on the base 95 so as to extend in the direction in which the first table 96 should move, and the male screw 96a is screwed onto a nut (not shown) fixedly mounted on the first table 92. I am fit. A motor 98 that applies torque to the male screw 96a is provided. That is, the first table 96 reciprocates as the motor 96 rotates forward and backward.

A male screw 97 a is provided on the first table 96 so as to extend in the direction in which the second table 97 should move, and a nut fixed to the second table 97 (see FIG. (Not shown). A motor 99 for rotating and driving the male screw 97a is provided, and the forward and backward rotation of the motor 99 causes the second table 97 to reciprocate.

The above-mentioned chip transfer arm 76 is provided on the above-mentioned second table 97 so as to be capable of reciprocating in the up-down direction (the arrow Z direction and the opposite direction). A male screw 76b is provided on the second table 97 so as to extend in the direction in which the tip transfer arm 76 should move, and a nut (not shown) fixed to the tip transfer arm 76 is provided. Screw). A motor 100 for applying torque to the male screw 76b is provided.

Next, the operation of the semiconductor component supply device having the above configuration will be described with reference to FIG. The following operation is controlled by the control unit including a microcomputer.

First, the turntable 1 shown in FIG. 1 is actuated by a table driving means (not shown) for driving the turntable 1 in the front-back direction (arrow Y direction and the opposite direction) and left-right direction (the arrow X direction and the opposite direction). Direction) and is rotationally driven so that a desired one of the large number of IC chips 2 attached to the sheet 14 on the turntable 1 has a predetermined orientation. Is positioned immediately above the push-up needle 50 included in.

Subsequent to or simultaneously with this, the respective motors 98, 99 and 100 of the conveying means 8 are appropriately rotated, whereby the suction portion 77 is moved in the three-dimensional direction, and as shown in FIG. The IC chip 2 is positioned directly above the selected IC chip 2 and is brought into contact with the IC chip 2. When the suction portion 77 is brought into contact with the IC chip 2 in this way, the suction portion 77 slightly moves up with respect to the chip transfer arm 76 due to its reaction. This slight upward movement is detected by the magnetic proximity sensor 92 shown in FIG. 9 and the like, and a detection signal is issued by the magnetic proximity sensor. The control unit stops the operation of the transporting unit 8 in response to the detection signal, and the positioning of the suction unit 77 is completed. Following this, in order to reduce the load applied to the IC chip 2 by the suction unit 77, the conveying means 8 is further operated, and the suction unit 77 separates the IC chip 2 from the IC chip 2 by a very small distance. Increase until the state becomes. If the load on the IC chip 2 is set to zero in this manner, a large reaction force will not be generated when the IC chip 2 is pushed up by the push-up needle 50 as will be described later, and the IC chip 2 is damaged by the push-up. Is prevented.

After this, the air cylinder 26 (shown in FIG. 3) of the push-up mechanism 4 (details shown in FIGS. 2 to 5) located below the seat 4 is caused to project, and the push-up mechanism 4 is provided. The movable base 25 rises. As a result, as shown in FIG. 11, the needle guide 47 provided on the movable base 25 via the shaft 40 comes close to a state where the needle guide 47 is substantially in contact with the seat 14. However, at this point in time, the protruding needle 50 is buried in the needle guide 47. In this state, the motor 68 of the push-up mechanism 4 is operated to operate the cam 61, the push-up needle 50 projects as shown in FIG. 5, penetrates through the sheet 14, and pushes up the IC chip 2 described above. It is peeled off from 14 and pushed up toward the suction collet 77b included in the suction portion 77. At this time, the sheet 14 is adsorbed by the negative pressure applied through the needle guide 47, and does not lift when the thrusting needle 50 is pushed up.

On the other hand, a negative pressure is applied to the suction collet 77b to suck the IC chip 2 which is pushed up. However, as described above, the suction collet 77b is positioned with a very small gap from the IC chip 2 before the start of the thrusting operation, and the suction force of the thrusting needle 50 causes the suction collet 77b to absorb the suction. The IC chip 2 thus held is pushed up.

The push-up and suction operations will be described in more detail.

First, the push-up needle 50 is slightly pushed up based on the rotation of the motor 68. As a result, the suction portion 77 including the suction collet 77b is pushed up together with the IC chip 2 by an extremely fine distance. Then, this is detected by the magnetic proximity sensor 92 shown in FIG. 9 and the like, and a detection signal is emitted. In response to this detection signal, the control unit first stops the motor 68 to temporarily stop the thrusting operation of the thrusting needle 50, and then operates the above-mentioned transfer means 8 to cause the chip transfer arm 76 to operate. Is lifted by a slight amount of protrusion by the thrust needle 50 so as to be separated from the group of IC chips 2 on the sheet 14. Below, a series of operations of the fine push-up of the push-up needle 50 and the upward movement of the chip transfer arm 76 in response to this, the selected IC chip 2 is completely separated from the sheet 14 and the suction is completed. Can be repeated until.

Due to the above-described configuration, the push-up needle 50 and the suction portion 77 operate completely in synchronization regardless of the presence of distortion or vibration of the mechanism, and the IC chip 2 has the push-up needle 50 and the suction collet. It is peeled from the sheet 14 while being stably sandwiched by the 77b.

Thus, the IC chip 2 is suction-held by the suction unit 77.

After that, the conveying means 8 is operated, and the IC chip 2 is conveyed to a position directly above the lead frame (not shown) arranged at another position together with the suction portion 77 holding the IC chip 2 and the negative pressure is released. Then, the lead frame is mounted at a predetermined position.

In the present embodiment, a magnetic proximity sensor is used as a detection means for detecting the movement of the suction portion 77 with respect to the chip transfer arm 76, but other transmission type or reflection type optical sensor or the like is also used. It is possible to use various sensors such as the use of.

Further, in the present embodiment, as described above, when the IC chip 2 is peeled off from the sheet 14, the push-up needle 50 is raised while being paused by a fine distance, and the magnetic proximity sensor 92 is based on this. Although the suction portion 77 is raised by the distance in accordance with the detection signal issued from the device, it may be operated as follows.

That is, without repeating such fine distance movements, the protrusion needle 50 is raised once at a predetermined distance sufficient for the IC chip 2 to be peeled from the sheet 14, for example, 1 mm. Then, the push-up mechanism 4 is stopped in response to the detection signal generated from the magnetic proximity sensor 92 due to the movement of the suction portion 77 accompanying this, and then the transfer means 8 is operated to raise the chip transfer arm 76.

[0063]

[Effect of device]

 As described above, in the semiconductor component supplying apparatus according to the present invention, the desired semiconductor component in the semiconductor component group is pushed up by the push-up operation of the push-up member included in the push-up mechanism. The attracting portion located on the semiconductor component is pushed up by the thrust amount together with the semiconductor component, and a detection signal is emitted from the detection means, and the thrust operation by the thrust mechanism is controlled based on the detection signal. For example, it is designed to be stopped. With this configuration, the semiconductor component can always be reliably pushed up regardless of the height of the thrust member, and the upper movement limit position of the thrust member can be set when exchanging the thrust member or changing the type of semiconductor component. There is no need to perform adjustment work for setting, and the effect is that it can be dealt with quickly and easily.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor component supply apparatus as an embodiment of the present invention.

FIG. 2 is a front view of a thrust mechanism included in the semiconductor component supply device shown in FIG.

FIG. 3 is a vertical cross-sectional view of the thrust mechanism shown in FIG.

FIG. 4 is a cross-sectional view taken along the line AA of FIG.

FIG. 5 is a front view showing a part of the thrust mechanism shown in FIGS. 2 to 4 and a peripheral mechanism thereof.

FIG. 6 is a front view of a suction mechanism included in the semiconductor component supply apparatus shown in FIG.

FIG. 7 is a sectional view taken along line BB of FIG.
FIG.

FIG. 8 is a sectional view taken along line CC of FIG.
FIG.

9 is a cross-sectional view taken along line DD of FIG. 7.

10 is a sectional view taken along line EE in FIG.

FIG. 11 is an operation explanatory diagram of the semiconductor component supply device shown in FIGS. 1 to 10;

FIG. 12 is a front view of a main part of a conventional semiconductor component supply device including a partial cross section.

13 is an operation explanatory diagram of the configuration shown in FIG. 12;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 turntable 2 IC chip (semiconductor component) 4 thrust mechanism 6 adsorption mechanism 8 transport means 26 air cylinders 32, 33, 73 optical sensor 47 needle guide 50 thrust needle (bulb member) 68, 98, 99, 100 motor 76 Chip transfer arm (base part) 77 Adsorption part 77a Mounting base 77b Adsorption collet 92 Magnetic proximity sensor 93 Metal piece

Claims (3)

[Scope of utility model registration request] 1. A suction mechanism having a base portion conveyed by a conveying means and a suction portion movably attached to the base portion for sucking a semiconductor component, and movement of the suction portion with respect to the base portion is detected. The present invention further includes a detection unit and a push-up mechanism including a push-up member that is arranged to face the suction mechanism via a plurality of arranged semiconductor components and pushes up the semiconductor component. The push-up mechanism and the suction mechanism are independent of each other. The semiconductor component supply apparatus is characterized in that the thrusting operation by the thrusting mechanism is controlled in accordance with a detection signal emitted from the detection means. 2. After the push-up operation is performed by the push-up mechanism, the conveying means is operated to separate the base portion from the semiconductor component group according to a detection signal emitted from the detecting means. The semiconductor component supply device according to claim 1, wherein the semiconductor component supply device is provided. 3. A thrust operation is performed by the thrust mechanism,
2. The operation of the push-up mechanism is stopped in response to a detection signal generated by the detection means based on a movement of the suction portion with respect to the base portion by a predetermined distance. Semiconductor component supply equipment.