JPS6136938A - Bonding device for semiconductor device - Google Patents

Abstract

PURPOSE:To eliminate the need for the exchange of collets on the pressure-welding of a plural kind of circuit parts by properly turning a turret, to which a plurality of the collets are mounted, and fittingly selecting the collet to the cir- cuit part to be sucked. CONSTITUTION:A bonding head is constituted by a main body frame 25, a holding mechanism 26 and a chucking driving mechanism 27. The holding mechanism 26 is installed vertically and rotatably, and has a turret chucking body 41 with a turret 45. A plurality of collet heads 52 are fitted to the turret 45. A plurality of the collet heads 52 are used selectively in response to circuit parts to be pressure-welded to a circuit substrate.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a semiconductor device in which a circuit component forming an electric circuit, such as a semiconductor element, a resistor element, or a capacitor element, is attached to a lead frame or a circuit board by pressure contact with a body. This invention relates to improvements in bonding equipment.

[Technical background of the invention and its problems]

Conventionally, in the manufacturing process of semiconductor devices, a so-called bonding process (where circuit components are pressure-bonded to a circuit board, etc.) is used.
(also called mounting process) is known. This is done by applying adhesive in advance to the position where the circuit component is to be pressure-bonded to the circuit board, and then vacuum-chucking and transporting the circuit component supplied by the collet of the bonding head, and then pressure-bonding it to the circuit board. At this time, multiple circuit components are arranged in multiple locations, but as described in JP-A-56-103430, the bonding head is mounted on an XY table and the collet is moved. The bonding head can quickly respond to multiple pressure welding positions, improving work efficiency and saving equipment.

However, the circuit components to be bonded are not just one type, but multiple types with different sizes and shapes, and the collets must be replaced accordingly, which significantly impedes work efficiency. . Furthermore, in order to increase work efficiency, a plurality of bonding devices are installed and different collets are attached to each bonding device, but this has the disadvantage of causing a significant waste of equipment.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a highly efficient bonding device that can press-bond a plurality of types of circuit components without replacing collets.

[Summary of the invention]

The present invention provides a turret chuck that is vertically movable and rotatable and is provided with a turret, a plurality of collets are attached to the turret, and the turret is rotated appropriately to properly attach the collets to the circuit components to be attracted. This is a bonding apparatus for semiconductor devices that can be selected.

[Embodiments of the invention]

The details of the present invention will be explained below with reference to an embodiment shown in FIGS. 1 to 4.

This embodiment is a bonding device (mounting device fjt) that uses an adhesive to bond a plurality of circuit components to a circuit board on which a wiring pattern is formed on a ceramic substrate having, for example, a width of 3 crR and a length of 5.

This embodiment consists of a pedestal section (A), a substrate supply/storage section (B), a transport section (C), a dispensing section (D), and a bending section (
E), a positioning section (F), a circuit component supply section (G), and a control section (H).

The pedestal part (A) is provided with a flat table surface (1) on the upper surface, and each part is mounted on this.

The substrate supply storage section (B) includes a supply magazine (2), a supply drive mechanism (3), a storage magazine (4), and a storage drive mechanism 5 (
5). The supply magazine (2) is composed of a box-shaped member with openings on the front, rear, and bottom surfaces, and carriers (7), etc. are stacked at a distance and supported by support grooves provided at a constant pitch inside. A large number of circuit boards (8), . . . are placed on these and stored. Although the inside of the supply drive mechanism (8) is not shown, it supports a feed screw body that is vertically rotatably installed, a motor that rotates the feed screw body in forward and reverse directions based on an external command, and a supply magazine 64. It also consists of an elevating support body screwed onto one feed screw body, a supply conveyor provided close to the lower surface of the supply magazine (2), and various sensors.

When the upper motor rotates according to a command from the control unit (H), the supply magazine (2) is rotated by the rotation of the feed screw body.
is lowered by a certain pitch and when the lowest carrier (7) is placed on the supply conveyor, the belt of this conveyor runs and the carrier (7) carrying the circuit board (8) is sent to the transport section (C). . Also storage magazine (4), storage drive mechanism (5)
has the same structure as the supply magazine (2) and the supply drive mechanism (3), and the bonded circuit board (8) sent from the conveyance section (C), which will be described later, is transferred to the storage conveyor together with the carrier (7). It is stored in the support groove at the lower end, and the storage magazine (3) rises one pitch.

The conveying section (C) is composed of a trailing conveyor αυ, a trailing conveyor ■, a cross conveyor (not shown) connecting both conveyors, a stopper, and the like. The carrier ('r) sent out from the supply magazine (2) is sent to the dispensing section (D) and the bonding section (E) by the trailing conveyor αV, and then transferred to the trailing conveyor (2) by the cross conveyor, where it is stored. It is sent to the magazine (4).

The dispensing section (D) includes an XY table (g), a black and white television camera αQ attached to the table, and a dispensing head 07 for applying adhesive.

The bonding section (E) is composed of an XY table (C), a bonding head placed on the table (C), and a black and white television camera attached to the XY table (C). To explain in detail the four bonding heads which are the main parts of the present invention, in FIGS.
is composed of a main body frame), a holding mechanism (7), and a chuck drive mechanism. (on the main body frame)
It has a box-like structure with the front side ■ and rear side (A) open, side plate a, (33%) upper support plate (to), lower support plate (a), and upper and lower support plates (7). is the bearing part of the chuck drive mechanism@ which will be described later.

Next, referring to the holding mechanism (to) K, @ is a turret. In detail (6), the turret chuck body @◇ is rotatably supported by fitting into a bearing body 10 of a chuck drive mechanism (a) to be described later. The connection part is the arm part (b)
It is formed into a flange-like shape with a larger diameter, and four inner conical seats (T) are provided at equal intervals on the outer circumferential surface, and on the end surface on the turret member side, each catch and each Four connected joint pipes 6'? ) are evenly spaced. The turret member is formed into a disk shape and has four collet holes extending radially and perpendicular to the axis of the detail (b) and four adjustment holes (/19) communicating with these at right angles. There is.

63 is a collet head, which is constructed as follows. That is, the collet spindle (to) is fitted into the bushing Q inserted into the collet hole (to) via the linear bearing body (to) so as to be movable in the axial direction. This collet spind/L- (to) has a concentric depression opening on its upper end surface, and therein is a compression spring member (to) and a pressure welding pin (to) with a large diameter part. ) is inserted, and this pressure contact pin (to) is slidably inserted into the bush Q, and the receiver is pressed against the metal 6υ. A collet spindle 63 is attached to the lower end of the collet spindle ω, which has a suction hole 0 and communicates with a reduced pressure source via a conduit (b). Further, a tension spring member (to) is stretched between the collet 0 and the turret member. A support body (to) is attached to the above-mentioned adjustment hole), through which the adjuster (7Q) is inserted, and at the tip of this support body (7 eccentric cams) are formed. The deflection of the compression spring member (14) of the yoshi holder is adjusted through the gold plate 6.A conductive plate is attached near the collet spindle (14) with an insulating plate 0 interposed therebetween, and both members (14, 14,
(c) by inserting the conduit member into the long hole that penetrates)
Undesired rotation of the collet spindle (to) is prevented,
Also, due to the contact and separation at the lower end of the conduit member and the conductive plate σθ,
It is detected whether collet 0 is at the most protruding position.

Regarding detection, the collet head Q is configured as described in 1 or more below, and the compression spring member (to) and the tension spring member (to) constitute an elastic body qO that is involved in suppressing the collet (to). However, since the directions of force acting on both spring members are opposite to each other, the compression spring member field is in sufficient pressure contact with the pressure welding pin (to) and the collet spindle so that it acts stably. The tension spring member (to) is kept in the state
Due to the rotation of the adjuster (?1), the pressing force at the lowest end is #
I is equal to zero and is adjusted by several degrees of displacement to precisely reach the appropriate pressing force. Further, the above-mentioned conduit (to) is connected to a joint pipe (b) protruding from the connection part (to) of the turret chuck body (b).

Above this connection part (connection) is a connection valve (to the bearing body).
permanently attached to the The connecting valve (to) communicates with the air cylinder and is disconnected by rising. Furthermore, each of the conductive wires (B) connected to each of the above-mentioned conductive plates gO is respectively connected to four pressure contact terminals (To) attached to the connecting unit, and these pressure contact terminals (To) are connected to the bearings. A fixed feeder (to) having an annular rail fixed to the body 10 is in pressure contact with a spring, and even if the turret chuck body (6) rotates intermittently, voltage is always applied to each conduit 0. ing.

Next, the chuck drive mechanism (c) will be described. An elevating screw body 0) is rotatably supported at both ends by the upper support plate [with] and the lower support plate (to). An elevating nut body θ is screwed into this, and this elevating nut body trowel is
A bearing is attached to the guide body (A), which is supported so as to be movable up and down. The upper support plate (b) is attached with a pick-up device (to) consisting of a guide groove body (to), a sliding body (g) slidably fitted into the guiding groove body, and an adjusting screw body (a). , to which a KDC servo motor e9 and an encoder (100) are attached. The forward and reverse rotation of this DC servo motor (to) is transmitted to the lifting screw body 01) by a belt transmission mechanism (102) K using a timing bell (101). In addition, the above-mentioned bearing body) is equipped with a DC servo motor (
105) is attached, and the belt transmission mechanism (106) K attached to the turret chuck body @◇) The turret chuck body @◇ is rotated appropriately, and its indexing is controlled by the four collet heads 6. ... An index disk (107) having slits corresponding to K and a photoelectric switch (108) operated by these slits.
It is now carried out by Note (110)
is a camera bracket that holds a TV camera.

Although the bonding head is constructed as described above, its basic operation will be explained below.

First, four collet heads 0 are provided, and collets υ of different types may be attached to these, although they may be the same.

And the two-dimensional movement of collect (to) is the XY table @
However, the vertical movement is done by a DC servo motor).
The six collets move up and down through the bearing body), and the DC servo motor (to) is operated by a command from the control section (H), but the rotation speed is detected by the encoder (B). In addition, the selection among the four collets 62 is made by the DC servo motor (105) rotating υ according to a command from the control unit (l(), and the turret chuck body II) rotating via the belt machine! (106). The indexing is performed by an indexing disk (107) and a photoelectric switch (108). The conduit 64 of the selected collet head (toward) (facing downward) has its seat uO directly facing the connection valve (2), and is appropriately switched to a vacuum source by the operation of eight air cylinder devices (not shown). It is communicated via . Furthermore, the pressing force of the collet Q is kept constant as follows. That is, when the suctioned circuit component comes into contact with the circuit board (8) due to the lowering of the turret chuck body θ°C, it is detected that the conduit 0 separates from the conductive plate σe.

From this point on, the turret chuck body (6) is further lowered by a predetermined distance to maintain the predetermined value. This concludes the explanation of the bodding head @.

Next, the positioning section (F) includes a rotary table (121),
Two positioning chucks (122) whose upper surfaces are formed into vacuum chucks and which are rotatably and equidistantly provided on the rotary table (121) and the rotary table (121) are inserted 180 degrees apart. An index unit (not shown) that rotates back and forth, a stepping motor (not shown) that is attached to the rotary table (121) and rotates the positioning chucks (122), (122) separately, and a television camera (12).
3) It consists of the following. When the positioning chuck (122) is located on the side of the circuit component supply section (G), it is the positioning position, and when it is located on the opposite side of the bonding section (E), it is the supply position.

The circuit component supply section (G) supplies circuit components such as Perez (
A large number of trays (132)%... containing a large number of trays (131), ... are stored in a matrix in a stocker (133), and an
The pickup (135) is driven to suck and hold the pellets (131) one by one and supply them to the positioning chuck (122) at the positioning position. Therefore, the stocker (133) can accommodate not only pellets of the same kind but also pellets of different kinds.

The control section () () sequentially operates the above-mentioned devices along with a power supply device, a microcomputer device, and various built-in μ sensors according to a program.

Next, the operation of the above bonding device will be described. In response to a command from the control unit (I), the supply drive mechanism (8) is activated, the supply magazine (2) is lowered, and the lowest carrier (7) is placed on the follower conveyor aI). Travels and carries the circuit board together with the carrier (7), for example horizontal 3
First, a thick film circuit board (8) having a wiring pattern formed on a ceramic substrate having a length of 5 mm is transferred, and is positioned and stopped by a stopper at a position of the dispensing head α. At this position, the circuit board (8) on the carrier ('r) is lifted to a certain height by a nest (not shown) provided below this position, and the circuit board (8) is fixedly provided above. It is elastically pressed from above by a presser plate (not shown) and fixed. Here, an image is taken by the television camera αO, and the portion to which the circuit component (131) is to be attached is automatically detected. That is, the standard pattern of the mounting positions of the circuit components (131) on the circuit board (8) is manually stored in advance in a memory (not shown). Therefore, the circuit components (1'31) of the circuit board (8) that arrive each time
The mounting position of the 4Z image is captured by the TV camera aQ, and the amount of positional deviation is calculated by comparing each binarized image output of this image with the standard pattern described above. From this amount of positional deviation, the actual circuit component ( 131) is recognized, and a material for fixing the circuit component (131), such as adhesive silver paste, is applied to this part using the α force of the dispensing head. When the coating is finished, the circuit board (8) is placed on the carrier (7) again by the descent of the nest (not shown), and is sent to the next bonding head (to the next bonding head) by the running of the follower conveyor αυ. Position and stop. At this mounting position, the TV camera Q, which is lifted and fixed in the same manner as the above-mentioned dispensing position and mounted on the bonding head, takes a picture of the above-mentioned circuit components (
131) Automatically detects the installation position of. The detection means automatically detects the dispensing work position using pattern recognition technology, similar to the above-mentioned detection of the dispensing work position.

During this time, a desired collet head 63 is selected from among the four collet heads (to) by a command from the control unit (H), and the collet head is rotated downward and then selected by the operation of the connection valve (to). The collet υ starts adsorption. When the position detection is automatically completed, the collet Q of the bonding head 4 is lowered and the XY table (C) is moved to attract the circuit component (131) on the positioning chuck (122) with the collet (to). At the same time as the device is placed in contact with the mounting position detected above, contact is detected, and further DC
The turret chuck body 0p is lowered by a certain amount using a servo motor (servo motor) and pressed with a predetermined pressing force to attach the circuit component (131) to the circuit board (8). This process is repeated several times to attach a plurality of circuit components (131) and complete the bonding process (mounting process). The completed circuit board (8) is lowered and placed on the carrier (7) again,
It is transferred onto a trailing conveyor υ by a cross conveyor (not shown) and is stored in a storage magazine (4)K. Subsequently, the storage magazine (4) is raised by one pitch by the storage drive mechanism (5) and then stopped.

On the other hand, the circuit component (1) on the positioning chuck (122)
31) is transported as follows. In other words, the XY drive device (134) operates according to a command from the control unit (H) to move the pickup (135) to the pickup tray (32).
) is attracted and conveyed to the positioning chuck (122) on the positioning side. Note that the stocker (133) is marked with a mark, and by manually detecting this mark in advance and storing it in the memory, the amount of positional deviation of the stocker (133) is memorized, and based on this,
The Y drive (134) is activated. Positioning chuck (
The position of the circuit component (131) adsorbed by the circuit component (122) is detected by the TV camera (123), the error in angle θ is corrected by rotating the positioning chuck (122), and the position error in the XY direction is detected by the bonding head. ) is used as location information. After the angle correction is completed, turn the rotary table (12
1) rotates 180 degrees, the circuit component (131) moves to the supply side position, is carried away by the bonding head, and then reversely rotates 180 degrees and returns to the positioning side.

IT television monitors (141) and (142) are installed, the monitor (141) displays the imaging output of the television camera α0, and the monitor (142) displays the imaging output of the television camera (c).

〔Effect of the invention〕

As described in detail above, the bonding apparatus of the present invention is configured such that a turret chuck body is provided, a plurality of collet heads are attached to the turret chuck body, and a desired collet is selected by rotating the turret chuck body. Since the turret chuck body can simply be rotated without having to replace the collet each time for different types of circuit parts, this is extremely beneficial in improving efficiency.

[Brief explanation of the drawing]

1 to 4 show an embodiment of the present invention,
Fig. 1 is a perspective view showing the overall configuration, Fig. 2 is a cross-sectional front view of the main part of the bonding part, Fig. 3 is an enlarged view of section A in Fig. 2, and Fig. 4 is a plan view of the main part of Fig. 2. It is. A: pedestal section, B: substrate supply and storage section, C: transport section. D = Nibuispetz, E: Bonde Ink Department. F: Positioning section, G: Circuit component supply section. H: Control unit. (8): Attached to body (circuit board), (2): Bonding head, (A): Holding mechanism, @: Chuck drive mechanism. θ◇: Turret chuck body, @e: Turret part. (To): Colette Henodo. 6a: Colette. (131): Circuit components (Berrett) Agent Patent attorney Noriyuki Chika (and 1 other person)

Claims (2)

[Claims] (1) In a semiconductor device bonding apparatus that has a bonding head that suctions and transports circuit components and presses and fixes them to an object to be attached, the bonding head has a turret section at one end and is rotatable. and a turret chuck body supported so as to be movable up and down, a plurality of collets arranged equidistantly and radially on the turret portion to attract the circuit components, and a chuck that rotates the turret chuck body intermittently and moves it up and down. 1. A bonding apparatus for semiconductor devices, comprising: a drive mechanism. (2) The semiconductor device bonding apparatus according to claim 1, wherein the plurality of collets include collets of different shapes or sizes.