CN104723028A - Dual-interface card production method and device - Google Patents
Dual-interface card production method and device Download PDFInfo
- Publication number
- CN104723028A CN104723028A CN201410293497.0A CN201410293497A CN104723028A CN 104723028 A CN104723028 A CN 104723028A CN 201410293497 A CN201410293497 A CN 201410293497A CN 104723028 A CN104723028 A CN 104723028A
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- Prior art keywords
- chip
- group
- card
- double
- interface card
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/06—Metal-working plant comprising a number of associated machines or apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention provides a dual-interface card production device and method. The dual-interface card production device comprises a chip turning device, wherein the chip turning device comprises a turning arm and 2N suction cups which are symmetrically arranged on the two sides of the turning arm, and the suction cups on one side of the turning arm are right opposite to chips to be sucked. Compared with the prior art, the chip welding efficiency is greatly improved by arranging a chip steering set and the chip turning device. The chip turning device is arranged into the structure that the chips are turned and sucked at the two ends, and compared with a traditional structure that the chips are sucked at one end, residual turning is reduced, the flow is simplified, a large amount of time is saved, and idle work applied by the chip turning device is reduced as well. The chip steering set is designed into two adsorption pieces, and through the cooperation with an X-axis servo motor, when one adsorption piece prepares for welding, the other adsorption piece can prepare for chip receiving, certain time is saved, and the production efficiency of the dual-interface card production device is greatly improved.
Description
Technical field
The present invention relates to moving communicating field, more particularly, relate to a kind of production method and equipment of double-interface card.
Background technology
Along with information technology and economic develop rapidly all over the world, economy between people and information interchange more and more frequent, simultaneously people are also finding various communication media easily always, from early stage magnetic card storage card finally, logic encryption card and a lot of contact type CPU card (smart card) of using of field now.Current smart card also plays irreplaceable effect in the life of people, and be that contact intelligent card or contact type intelligent card all have its respective merits and demerits, the wearing and tearing between contact intelligent card and card machine tool, substantially reduce its service life.And non-contact card is in the occasion of Radio frequency interference severity, its application is limited; Secondly due to by coupling transferring energy, so require that its power consumption is very low; Moreover, due to present a lot of industry, as the industries such as finance, communication have existed technology and the infrastructure of a large amount of contact card application, continuation is also used contact card by them, the double-interface card of contact card and non-contact card advantage arises at the historic moment between this situation set, increasing to the demand of double-interface card on market.Up to the present, two interface module and antenna technology reach its maturity, but the welding production of antenna and chip is all complete by hand (as Fig. 1), cause the problems such as yield rate is low, wastage of material, production efficiency are low.The Commercial cultivation machinery equipment of part double-interface card completes, but the production efficiency of machinery equipment is all on the low side.
Summary of the invention
One of the technical problem to be solved in the present invention is, for the defect that above-mentioned yield rate is low, wastage of material, production efficiency are low of prior art, provide a kind of yield rate high, economize in raw materials, double-interface card production method that production efficiency is high.
Two of the technical problem to be solved in the present invention is, for the defect that above-mentioned yield rate is low, wastage of material, production efficiency are low of prior art, provide a kind of yield rate high, economize in raw materials, double-interface card production equipment that production efficiency is high.
The present invention solves the technical scheme that one of its technical problem adopts: the production method providing a kind of double-interface card, comprises and carry out the following step with tin for glue machine:
S1: scolding tin that solder joint predetermined on chip is burn-on;
S2: scolding tin unnecessary on the solder joint after scolding tin of burn-oning is removed;
S3: PUR is welded on chip;
And complete the following step with packaging machine:
S4: carry out die-cut to the chip possessing scolding tin and PUR;
S5: chip turning device and chip stepping group absorption chip turn to group carrying chip to chip, and card transport belt turns to group carrying card to chip;
S6: described chip turns to group to carry out position correction to card and chip, and chip butt-weld group carries out butt-joint to card and chip;
It is characterized in that, 2N the sucker by being symmetricly set in the flip-arm both sides of chip turning device in described step S5 replaces absorption chip provides chip when flip-arm overturns to chip stepping group.
Preferably, described step S5 chips turning device and chip stepping group by following mode continuously for chip turns to group to provide chip:
S5.1: the side sucker absorption chip of described chip turning device;
S5.2: described chip turning device upset, the chip drawn by side sucker is towards described chip stepping group;
S5.3: described chip stepping group is drawn the chip on the side sucker of described chip turning device and is transported to chip and turns to group, then described chip stepping group reposition, waits for and transporting next time;
S5.4: the opposite side sucker absorption chip of described chip turning device;
S5.5: described chip turning device upset, the chip drawn by opposite side sucker is towards described chip stepping group;
S5.6: described chip stepping group is drawn the chip on the opposite side sucker of described chip turning device and is transported to chip and turns to group, then described chip stepping group reposition, waits for and transporting next time.
Preferably, described chip turns to group to comprise the X-axis servo motor turning to group position for adjusting chip, and comprise adsorption piece one and adsorption piece two further, be used for accepting chip stepping group and transport the chip of coming, described chip butt-weld group comprises soldering tip, and described step S6 chips turns to group and chip butt-weld group to carry out position correction and welding to card and chip continuously by following mode:
S6.1: the chip that adsorption piece one receiving chip stepping group transmits;
S6.2: moving chip turns to group adjustment X-axis position, makes adsorption piece one aim at the soldering tip of chip butt-weld group in the X-axis direction, carries out position correction simultaneously to card;
S6.3: adsorption piece one overturns, makes the chip on adsorption piece one vertical with soldering tip;
S6.4: chip butt-weld group carries out butt-joint to the chip on adsorption piece one and card;
S6.5: the chip that adsorption piece two receiving chip stepping group transmits;
S6.6: moving chip turns to group adjustment X-axis position, makes adsorption piece two aim at the soldering tip of chip butt-weld group in the X-axis direction, carries out position correction simultaneously to card;
S6.7: adsorption piece one and adsorption piece two overturn in the opposite direction, makes the chip on adsorption piece two vertical with soldering tip, and adsorption piece one resets simultaneously;
S6.8: chip butt-weld group carries out butt-joint to the chip on adsorption piece two and card.
Preferably, also step S2.1 is comprised before described step S3: PUR is punched out predetermined emptiness avoiding hole.
Preferably, also step S7 is comprised after described step S6: the double-interface card after hot weld is collected.
A kind of production equipment of double-interface card is provided, the upper tin comprising on carrying out on chip tin process and standby glue process for glue machine and for by the chip package after upper tin and standby glue process to the packaging machine on double-interface card card, described packaging machine comprises chip turning device, described chip turning device comprises flip-arm and 2N sucker, a described 2N sucker is symmetricly set on the both sides of described flip-arm, absorption chip is just treated in the direction of the described flip-arm wherein sucker of side, to replace absorption chip by the sucker of described flip-arm both sides when described flip-arm upset.
Preferably, packaging machine comprises the chip stepping group of the chip for carrying described chip turning device and absorption further, chip stepping group is positioned at the top of chip turning device, chip stepping group comprise for absorption chip carrying arm and adjustment chip stepping group position X-axis servo motor, Y-axis servo motor.
Preferably, packaging machine comprises chip butt-weld group further, at least one chip turns to group and card transport belt, chip butt-weld group and chip turn to component to occupy the both sides of card transport belt, and chip turns to group to comprise the X-axis servo motor turning to group position for adjusting chip.
Preferably, described packaging machine comprises the card transport belt for transporting double-interface card card and enters card carrying arm, enter card conveyer belt, for transporting the chip carrying arm of chip, for the chip die cutting die of die-cut chip, for carrying out the first chip correction group of first time correction to the position of chip on double-interface card base, for carrying out the second correction group that second time is revised to the position of chip on double-interface card base, the antenna welded for crashing and chip detection its whether weld good chip detection group, for carrying out heat weldable hot weld group to card and chip, chipset is put for what support chip ring material, for the receipts chip protective tapes group of collecting the protective tapes on chip, for the receipts chip scrap band group of collecting the chip scrap after use, for will the double-interface card sheet conveyance of butt-joint encapsulation be completed to the receipts card conveyance group receiving card card casket group, for collecting the receipts card card casket group of the double-interface card sheet machined.
Preferably, described upper tin back-gluing machine comprises puts chipset for what put down from chip winding by chip, for the chip guiding group led to chip, for to the scolding tin group of scolding tin on chip, for removing the unnecessary tin removing group of unnecessary tin on chip, for heat release melten gel on chip and on PUR the heat release melten gel of die-cut emptiness avoiding hole and die-cut group of PUR emptiness avoiding hole, for carrying out the standby PUR group of standby glue process to chip, for carrying out the chip stepping group of stepping conveyance to chip, for the chip collection group of collecting the chip after scolding tin and standby glue.
Compared with prior art, its production process does not need manpower intervention substantially, and production efficiency is high, and yield rate is high, is conducive to economizing in raw materials, also reduces production cost.Group and chip turning device is turned to drastically increase the efficiency of welding chip by arranging chip.Chip turning device is arranged to the structure of two ends upset absorption chip compared with the structure of traditional one end absorption chip, decreases unnecessary upset, simplifies flow process and save a large amount of time, decreasing the idle work that chip turning device does.Chip turns to group to be designed to two adsorption pieces, coordinate the servo motor with X-axis again, when making an adsorption piece prepare welding, another one adsorption piece can carry out the preparation of receiving chip, save the regular hour, the production efficiency of double-interface card production equipment of the present invention is improved greatly.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of double-interface card manual production process in prior art;
Fig. 2 is the structural representation of the packaging machine of double-interface card production equipment of the present invention;
Fig. 3 is the perspective view of the packaging machine of double-interface card production equipment of the present invention;
Fig. 4 is chip turning device and the chip stepping group perspective view of the packaging machine of double-interface card production equipment of the present invention;
Fig. 5 is chip turning device and the chip carrying arm perspective view of the packaging machine of double-interface card production equipment of the present invention;
Fig. 6 is that the chip of the packaging machine of double-interface card production equipment of the present invention turns to group and chip butt-weld group perspective view;
Fig. 7 is chip steering apparatus and the chip butt-weld device perspective view of the packaging machine of double-interface card production equipment of the present invention;
Fig. 8 is the structural representation of upper tin for glue machine of double-interface card production equipment of the present invention;
Fig. 9 is the structural representation of the card required for double-interface card production equipment of the present invention.
Detailed description of the invention
In order to solve, prior art double-interface card welding efficiency is lower, defect under production capacity, the invention provides production method and the equipment of the double-interface card that a kind of welding efficiency is high, production capacity is high.
In order to there be understanding clearly to technical characteristic of the present invention, object and effect, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
Fig. 1 is the schematic diagram of double-interface card manual production process in prior art; Chip 301 on double-interface card comprises front 100 and the back side 200, and there is predetermined solder joint 2001 at its back side 200.By manual mode chip 301 is welded on the card base 302 of band antenna in prior art, the double-interface card 300 being with sky line card base can be obtained, the double-interface card 300 of band sky line card base is carried out packaged after namely obtain double-interface card 303.
Refer to Fig. 2-Fig. 3, packaging machine comprises card transport belt 21, enters card carrying arm 22, enters card conveyer belt 23, chip stepping group 24; chip turning device 25, chip turns to group 26, chip butt-weld group 27; first chip correction group 28, second chip correction group 210, test set 211; hot weld group 212; put chipset 214, receive chip protective tapes group 212, receive chip scrap band group 29; receive card conveyance group 215, receive card card casket group 216.
The course of work of packaging machine: first enter card conveyer belt 23 and treat that the card of butt-joint and encapsulation is transported to into card carrying arm 22 place above being placed on; Enter card carrying arm 22 by by entering treating that card conveyer belt 23 puts in place the card transport that butt-joint encapsulates to card transport belt 21; The position holding fix that card is transported to chip butt-weld group 27 by card transport belt 21 corrects and butt-joint; Chip die cutting die (not shown) is then carried out die-cut to the chip put in place, pick up chip by chip turning device 25 again and overturn 180 °, chip stepping group 24 is positioned at the top of chip turning device 25, and chip stepping group 24 will be got off and be transported to chip by the chip after chip turning device 25 overturns to turn to group 26 by chip die cutting die is die-cut; Chip butt-weld group 27 antenna on the card put in place is carried out position correction and butt-joint is convenient in clamping, and then the antenna put in place and chip are carried out butt-joint by chip butt-weld group 27; Chip and antenna are carried out rough location correction by the first chip correction group 28; Second chip correction group 210 carries out spot welding by after chip and antenna again position correction; Chip detection group 211 crash the antenna that welds and chip carry out detecting whether weld good; Hot weld group 213 pairs of cards and chip carry out hot weld; Putting chipset 214 is passive bracing or strutting arrangements to chip ring material; Protective tapes on chip is collected by chip protective tapes group 212, carries out blowing as required to chip simultaneously; Receive chip scrap band group 29 chip scrap after use is neatly collected; Receive card conveyance group 215 and will complete the double-interface card sheet conveyance of butt-joint encapsulation to receiving card card casket group 216; Receive card card casket group 216 and collect the double-interface card sheet machined.
Refer to Fig. 4-Fig. 5, chip stepping group 24 comprises chip carrying arm 241, carrying arm X-axis motor 242, carrying arm Y-axis motor 243.Carrying arm X-axis motor 242 and carrying arm Y-axis motor 243 are preferably servo motor.Carrying arm X-axis motor 242 and carrying arm Y-axis motor 243 can move by control chip carrying arm 241 in diagram X-direction and Y direction.The lower end of chip carrying arm 241 is provided with carrying arm sucker 2411, for the chip on absorption chip turning device 25.Chip turning device 25 comprises flip-arm 251 and flip-arm sucker 2511, and flip-arm sucker 2511 can have 2N, is preferably 4.Flip-arm sucker 2511 is symmetricly set on the both sides of flip-arm 251, and absorption chip is just treated in the direction of the flip-arm 251 wherein flip-arm sucker 2511 of side.Chip stepping group 24 and chip turning device 25 cooperatively interact, for chip turns to group 26 to provide chip.After chip transport puts in place, chip turning device 25 moves downward, flip-arm sucker 2511 moves upward after picking up chip and overturns 180 °, make script flip-arm sucker 2511 upward downward, convenient absorption chip next time, originally the flip-arm sucker 2511 downward having drawn chip then chip stepping group 24 upward, facilitates chip carrying arm 241 to draw chip on flip-arm sucker 2511.Now chip carrying arm 241 moves downward, and picks up the chip on flip-arm sucker 2511 by carrying arm sucker 2411, and the chip of this side is all transported to chip turns to group 26.Chip turning device 25 again moves downward and gets final product absorption chip again, and then chip turning device 25 can overturn again, and the chip of this side is transported to chip and turns to group 26 by chip carrying arm 241, thus continuously for chip turns to group 26 to provide chip.
Refer to Fig. 6-Fig. 7, chip turns to group 26 to comprise chip steering apparatus 261 and transfer X-axis motor 262.Transfer X-axis motor 262 is preferably servo motor, for the X-axis position of control chip transfer 261.Chip butt-weld group 27 comprises position correction apparatus 271 and chip butt-weld device 272, and chip butt-weld device 272 comprises soldering tip 2721.Position correction apparatus 271 is for controlling the welding direction of soldering tip 2721 when welding.Chip steering apparatus 261 comprises adsorption piece 1 and adsorption piece 2 2612, and adsorption piece 1 and adsorption piece 2 2612 are used for accepting and transport by chip carrying arm 241 chip come.Chip butt-weld group 27 and chip turn to group 26 to live apart the both sides of card transport belt 21, when chip carrying arm 241 transports chip, are alternately placed on by carrying chip on adsorption piece 1 and adsorption piece 2 2612.After the chip that adsorption piece 1 receiving chip stepping group 24 transmits, moving chip turns to group 26 to adjust X-axis position, adsorption piece 1 is made to aim at the soldering tip 2721 of chip butt-weld group 27 in the X-axis direction, position correction is carried out to the card of the position holding fix correction and butt-joint that are transported to chip butt-weld group 27 by card transport belt 21 simultaneously, then adsorption piece 1 overturns 90 °, make the chip on adsorption piece 1 vertical with soldering tip 2721, facilitate soldering tip 2721 pairs of chips to weld.Chip butt-weld group 27 carries out butt-joint to the chip on adsorption piece 1 and card subsequently, and so far, the chips welding on adsorption piece 1 completes.Receive card conveyance group 215 and by completing the double-interface card conveyance of butt-joint encapsulation to receiving card card casket group 216, can collect by receipts card card casket group 216 double-interface card machined.After chips welding on adsorption piece 1 completes, the chip that adsorption piece 2 2612 receiving chip stepping group 24 transmits, moving chip turns to group 26 to adjust X-axis position, adsorption piece 2 2612 is made to aim at the soldering tip 2721 of chip butt-weld group 27 in the X-axis direction, position correction is carried out to card simultaneously, adsorption piece 1 and adsorption piece 2 2612 overturn in the opposite direction, make the chip on adsorption piece 2 2612 vertical with soldering tip 2721, and adsorption piece 1 carries out the preparation receiving next chip, chip butt-weld group 27 carries out butt-joint to the chip on adsorption piece 2 2612 and card subsequently, receive card conveyance group 215 and will complete the double-interface card conveyance of butt-joint encapsulation to receiving card card casket group 216, receive card card casket group 216 and collect the double-interface card machined.So, then the chip transported by chip stepping group 24 can be welded continuously.
Fig. 8 is the structural representation of the upper tin back-gluing machine of double-interface card production equipment of the present invention; Upper tin back-gluing machine comprises puts chipset 31, chip guiding group 32, scolding tin group 33, unnecessary scolding tin removing group 34, heat release melten gel and PUR emptiness avoiding hole die-cut group 35, standby PUR group 36, chip stepping group 37, chip collection group 38.
The course of work of upper tin back-gluing machine: consult Fig. 8, the band putting chipset 31 pairs of chips carries out blowing as required; Chip guiding group 32 leads in stepping process to whole chip, guarantees that follow-up scolding tin, detin position are accurate; Scolding tin group 33 to the upper scolding tin of the solder joint 2001 (see Fig. 1) of the chip put in place, amount number, time and position analysis; Unnecessary tin removing group 34 by scolding tin unnecessary for removing, and retains suitable scolding tin at solder joint 2001 (see Fig. 1) place; Heat release melten gel and PUR emptiness avoiding hole die-cut group 35, to PUR on demand blowing to emptiness avoiding hole mould place, then by mould, emptiness avoiding hole carries out to its PUR put in place die-cut; Standby PUR group 36 is welded the PUR put in place and chip, and welding manner is bonding to complete by temperature; Chip stepping group 37 is stepping chips one by one, to complete scolding tin to chip and gum work; Chip collection group 38 is collected welding tin with the chip getting glue ready, uses in the packaging machine shown in preparing in fig. 2.
Fig. 9 is the structural representation of the card required for double-interface card production equipment of the present invention.The base material 400 (such as, the base material that PVC material is made) of first-class coil is placed between other which floor base materials, by specific layer machine, finally makes the card base 302 of band antenna from card base, slotter etc.
Compared with prior art, its production process does not need manpower intervention substantially, and production efficiency is high, and yield rate is high, is conducive to economizing in raw materials, also reduces production cost.Group 26 and chip turning device 25 is turned to drastically increase the efficiency of welding chip by arranging chip.Chip turning device 25 is arranged to the structure of two ends upset absorption chip compared with the structure of traditional one end absorption chip, decreases unnecessary upset, simplifies flow process and save a large amount of time, decreasing the idle work that chip turning device 25 does.Chip turns to group 26 to be designed to two adsorption pieces, coordinate the servo motor with X-axis again, when making an adsorption piece prepare welding, another one adsorption piece can carry out the preparation of receiving chip, save the regular hour, the production efficiency of double-interface card production equipment of the present invention is improved greatly.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned detailed description of the invention; above-mentioned detailed description of the invention is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (10)
1. a production method for double-interface card, comprises and carries out the following step with tin for glue machine:
S1: scolding tin that solder joint predetermined on chip is burn-on;
S2: scolding tin unnecessary on the solder joint after scolding tin of burn-oning is removed;
S3: PUR is welded on chip;
And complete the following step with packaging machine:
S4: carry out die-cut to the chip possessing scolding tin and PUR;
S5: chip turning device and chip stepping group absorption chip turn to group carrying chip to chip, and card transport belt turns to group carrying card to chip;
S6: described chip turns to group to carry out position correction to card and chip, and chip butt-weld group carries out butt-joint to card and chip;
It is characterized in that, 2N the sucker by being symmetricly set in the flip-arm both sides of chip turning device in described step S5 replaces absorption chip provides chip when flip-arm overturns to chip stepping group.
2. the production method of double-interface card according to claim 1, is characterized in that, described step S5 chips turning device and chip stepping group by following mode continuously for chip turns to group to provide chip:
S5.1: the side sucker absorption chip of described chip turning device;
S5.2: described chip turning device upset, the chip drawn by side sucker is towards described chip stepping group;
S5.3: described chip stepping group is drawn the chip on the side sucker of described chip turning device and is transported to chip and turns to group, then described chip stepping group reposition, waits for and transporting next time;
S5.4: the opposite side sucker absorption chip of described chip turning device;
S5.5: described chip turning device upset, the chip drawn by opposite side sucker is towards described chip stepping group;
S5.6: described chip stepping group is drawn the chip on the opposite side sucker of described chip turning device and is transported to chip and turns to group, then described chip stepping group reposition, waits for and transporting next time.
3. the production method of double-interface card according to claim 2, it is characterized in that, described chip turns to group to comprise the X-axis servo motor turning to group position for adjusting chip, and comprise adsorption piece one and adsorption piece two further, be used for accepting chip stepping group and transport the chip of coming, described chip butt-weld group comprises soldering tip, and described step S6 chips turns to group and chip butt-weld group to carry out position correction and welding to card and chip continuously by following mode:
S6.1: the chip that adsorption piece one receiving chip stepping group transmits;
S6.2: moving chip turns to group adjustment X-axis position, makes adsorption piece one aim at the soldering tip of chip butt-weld group in the X-axis direction, carries out position correction simultaneously to card;
S6.3: adsorption piece one overturns, makes the chip on adsorption piece one vertical with soldering tip;
S6.4: chip butt-weld group carries out butt-joint to the chip on adsorption piece one and card;
S6.5: the chip that adsorption piece two receiving chip stepping group transmits;
S6.6: moving chip turns to group adjustment X-axis position, makes adsorption piece two aim at the soldering tip of chip butt-weld group in the X-axis direction, carries out position correction simultaneously to card;
S6.7: adsorption piece one and adsorption piece two overturn in the opposite direction, makes the chip on adsorption piece two vertical with soldering tip, and adsorption piece one resets simultaneously;
S6.8: chip butt-weld group carries out butt-joint to the chip on adsorption piece two and card.
4. the production method of double-interface card according to claim 1, is characterized in that, also comprises step S2.1 before described step S3: PUR is punched out predetermined emptiness avoiding hole.
5. double-interface card production method according to claim 1, is characterized in that, also comprises step S7 after described step S6: collect the double-interface card after hot weld.
6. the production equipment of a double-interface card, the upper tin comprising on carrying out on chip tin process and standby glue process for glue machine and for by the chip package after upper tin and standby glue process to the packaging machine on double-interface card, it is characterized in that, described packaging machine comprises chip turning device, described chip turning device comprises flip-arm and 2N sucker, a described 2N sucker is symmetricly set on the both sides of described flip-arm, absorption chip is just treated in the direction of the described flip-arm wherein sucker of side, to replace absorption chip when described flip-arm overturns by the sucker of described flip-arm both sides.
7. the production equipment of double-interface card according to claim 6, it is characterized in that, packaging machine comprises the chip stepping group of the chip for carrying described chip turning device and absorption further, chip stepping group is positioned at the top of chip turning device, chip stepping group comprise for absorption chip carrying arm and adjustment chip stepping group position X-axis servo motor, Y-axis servo motor.
8. the production equipment of double-interface card according to claim 6, it is characterized in that, packaging machine comprises chip butt-weld group further, at least one chip turns to group and card transport belt, chip butt-weld group and chip turn to component to occupy the both sides of card transport belt, and chip turns to group to comprise the X-axis servo motor turning to group position for adjusting chip.
9. the production equipment of double-interface card according to claim 8, is characterized in that, described packaging machine comprises the card transport belt for transporting double-interface card card and enters card carrying arm, enter card conveyer belt, for transporting the chip carrying arm of chip, for the chip die cutting die of die-cut chip, for carrying out the first chip correction group of first time correction to the position of chip on double-interface card, for carrying out the second correction group that second time is revised to the position of chip on double-interface card, the antenna welded for crashing and chip detection its whether weld good chip detection group, for carrying out heat weldable hot weld group to card and chip, chipset is put for what support chip ring material, for the receipts chip protective tapes group of collecting the protective tapes on chip, for the receipts chip scrap band group of collecting the chip scrap after use, for will the double-interface card sheet conveyance of butt-joint encapsulation be completed to the receipts card conveyance group receiving card card casket group, for collecting the receipts card card casket group of the double-interface card sheet machined.
10. the production equipment of double-interface card according to claim 6, it is characterized in that, described upper tin back-gluing machine comprises puts chipset for what put down from chip winding by chip, for the chip guiding group led to chip, for to the scolding tin group of scolding tin on chip, for removing the unnecessary tin removing group of unnecessary tin on chip, for heat release melten gel on chip and on PUR the heat release melten gel of die-cut emptiness avoiding hole and die-cut group of PUR emptiness avoiding hole, for carrying out the standby PUR group of standby glue process to chip, for carrying out the chip stepping group of stepping conveyance to chip, for the chip collection group of collecting the chip after scolding tin and standby glue.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105692147A (en) * | 2016-03-23 | 2016-06-22 | 广州华大生物科技有限公司 | Electron accelerator under-beam turnover and conveying mechanism |
| CN106449485A (en) * | 2016-10-26 | 2017-02-22 | 东莞市锐祥智能卡科技有限公司 | Double interface chip package device |
| CN111503105A (en) * | 2020-04-27 | 2020-08-07 | 格润智能装备(深圳)有限公司 | Multi-interface chip soldering tin gum device and method |
| CN112719848A (en) * | 2019-10-29 | 2021-04-30 | 江苏凯尔生物识别科技有限公司 | Chip positioning device for smart phone |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6136938A (en) * | 1984-07-30 | 1986-02-21 | Toshiba Corp | Bonding device for semiconductor device |
| CN101499428A (en) * | 2009-02-19 | 2009-08-05 | 东莞锐发智能卡科技有限公司 | Double-interface card production method and equipment |
| CN103192188A (en) * | 2013-03-21 | 2013-07-10 | 向泽亮 | Packaging machine and packaging method for dual-interface card |
| CN203471785U (en) * | 2013-09-23 | 2014-03-12 | 天津伍嘉联创科技发展有限公司 | Upper-lower-face turnover mechanism for double-ended devices |
| CN203573961U (en) * | 2013-09-30 | 2014-04-30 | 刘义清 | Intelligent card packaging machine |
| CN203936583U (en) * | 2014-06-25 | 2014-11-12 | 广东曙光自动化设备股份有限公司 | A kind of production equipment of double-interface card |
-
2014
- 2014-06-25 CN CN201410293497.0A patent/CN104723028B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6136938A (en) * | 1984-07-30 | 1986-02-21 | Toshiba Corp | Bonding device for semiconductor device |
| CN101499428A (en) * | 2009-02-19 | 2009-08-05 | 东莞锐发智能卡科技有限公司 | Double-interface card production method and equipment |
| CN103192188A (en) * | 2013-03-21 | 2013-07-10 | 向泽亮 | Packaging machine and packaging method for dual-interface card |
| CN203471785U (en) * | 2013-09-23 | 2014-03-12 | 天津伍嘉联创科技发展有限公司 | Upper-lower-face turnover mechanism for double-ended devices |
| CN203573961U (en) * | 2013-09-30 | 2014-04-30 | 刘义清 | Intelligent card packaging machine |
| CN203936583U (en) * | 2014-06-25 | 2014-11-12 | 广东曙光自动化设备股份有限公司 | A kind of production equipment of double-interface card |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105692147A (en) * | 2016-03-23 | 2016-06-22 | 广州华大生物科技有限公司 | Electron accelerator under-beam turnover and conveying mechanism |
| CN106449485A (en) * | 2016-10-26 | 2017-02-22 | 东莞市锐祥智能卡科技有限公司 | Double interface chip package device |
| CN106449485B (en) * | 2016-10-26 | 2024-02-02 | 东莞市锐祥智能卡科技有限公司 | Packaging device for double-interface chip |
| CN112719848A (en) * | 2019-10-29 | 2021-04-30 | 江苏凯尔生物识别科技有限公司 | Chip positioning device for smart phone |
| CN112719848B (en) * | 2019-10-29 | 2022-05-10 | 江苏凯尔生物识别科技有限公司 | Chip positioning device for smart phone |
| CN111503105A (en) * | 2020-04-27 | 2020-08-07 | 格润智能装备(深圳)有限公司 | Multi-interface chip soldering tin gum device and method |
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|---|---|
| CN104723028B (en) | 2018-02-06 |
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Address after: 523000 E Jin Lei Industrial Park, 3 Keyuan Road, Tangxia Town, Dongguan, Guangdong. Patentee after: Guangdong Jingyi Polytron Technologies Inc Address before: 523000 E Jin Lei Industrial Park, 3 Keyuan Road, Tangxia Town, Dongguan, Guangdong. Patentee before: Guangdong dawn automation equipment limited company |
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