JP4563862B2 - Semiconductor chip pickup device and pickup method - Google Patents

Description

  The present invention relates to a pickup device and a pickup method for picking up a semiconductor chip attached to an adhesive sheet by a suction nozzle.

  Semiconductor chips formed by cutting a semiconductor wafer into a dice are pasted on an adhesive sheet, and when bonding the semiconductor chip to a substrate, the semiconductor chips are picked up one by one from the adhesive sheet. .

When a semiconductor chip is picked up from an adhesive sheet by an adsorption nozzle, conventionally, as disclosed in Patent Document 1, a peripheral part of the semiconductor chip of the adhesive sheet to which the semiconductor chip picked up by the adsorption nozzle is attached is a backup body. In addition, the semiconductor chip is picked up by a suction nozzle while being separated from the pressure-sensitive adhesive sheet by pushing up and holding the semiconductor chip from the lower surface side by a push-up pin having a sharp tip.
Japanese Patent Application Laid-Open No. 2002-1000064

  By the way, recently, the thickness of the semiconductor chip may be as thin as 100 μm or less. When such a thin semiconductor chip is pushed up by a sharp tip of a push pin, stress is concentrated at a location where the tip hits. For this reason, the semiconductor chip may be damaged by the stress received from the push-up pin.

  In order to prevent damage to the semiconductor chip due to stress concentration, it may be possible to slow down the push-up speed of the semiconductor chip with the push-up pin. When the semiconductor chip is thin even if the push-up speed is slow, it is difficult to reliably prevent the damage.

  It is an object of the present invention to provide a pickup device and a pickup method that can be peeled from an adhesive sheet without damaging a semiconductor chip.

This invention is a semiconductor chip pick-up device for picking up a semiconductor chip affixed to an adhesive sheet by a suction nozzle,
A housing portion that is open on the upper surface is formed, and a suction portion is formed on a portion of the upper surface excluding the housing portion, and a semiconductor chip picked up by the suction nozzle of the pressure-sensitive adhesive sheet is attached to the suction portion. A backup body that sucks and holds the lower surface of the peripheral part of the peripheral part,
A plurality of movable members concentrically housed in an airtight state in the housing portion;
These movable members are positioned radially outward of the accommodating portions of the plurality of movable members in a state where the upper end surface is flush with the upper surface of the backup body and the adhesive sheet is adsorbed and held on the upper surface by the adsorption portion. Driving means for sequentially driving in a downward direction from the movable member to form an airtight negative pressure space between the upper end surface of the movable member and the lower surface of the adhesive sheet. A semiconductor chip pickup device.

  The suction portion includes a plurality of annular grooves concentrically formed on the upper surface of the backup body and a communication portion that communicates the annular grooves with each other, and a suction path to which a suction pump is connected communicates with the communication portion. It is preferable.

  The plurality of movable bodies may include at least one cylindrical movable body provided in a slidable state in the housing portion, and an axial movable body slidably accommodated in the cylindrical movable body. preferable.

This invention is a semiconductor chip pickup method for picking up a semiconductor chip attached to an adhesive sheet by a suction nozzle,
There is no space between the lower surface of the pressure-sensitive adhesive sheet and the accommodating portion on the upper surface of the backup body in which the accommodating portion is opened, the lower surface of the periphery of the semiconductor chip picked up by the suction nozzle of the pressure-sensitive adhesive sheet. A process of adsorbing and holding in an airtight state;
A step of sequentially forming a negative pressure space portion in an airtight state from the radially outer side toward the center portion in a portion corresponding to the housing portion on the lower surface of the pressure-sensitive adhesive sheet;
And a step of picking up the semiconductor chip from which the pressure-sensitive adhesive sheet has been sucked and peeled off by the negative pressure space in an airtight state by the suction nozzle.

  It is preferable that the pressure-sensitive adhesive sheet is peeled from the semiconductor chip while the semiconductor chip is sucked and held by the suction nozzle.

  It is preferable to form a negative pressure space portion in a stepwise manner in the portion corresponding to the housing portion on the lower surface of the pressure-sensitive adhesive sheet from the radially outer side toward the center portion.

  According to the present invention, when the semiconductor chip is picked up from the adhesive sheet by the suction nozzle, a negative pressure space is formed on the lower surface side of the semiconductor chip and the adhesive sheet is peeled off from the semiconductor chip. Pickup can be done without applying local stress to damage.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show an embodiment of the present invention. The pickup apparatus shown in FIG. 1 includes a backup unit 1. The backup unit 1 is provided opposite to the lower surface side of the adhesive sheet 2 stretched on a wafer ring (not shown), and the upper surface of the backup body 11 contacts the lower surface of the adhesive sheet 2 as will be described later by a Z drive source (not shown). It is driven in the Z direction between the position and a position away from the adhesive sheet 2 at a predetermined interval.

  A plurality of semiconductor chips 3 obtained by dividing a semiconductor wafer into dice-like shapes are attached to the upper surface of the adhesive sheet 2. The wafer ring is driven in the horizontal direction by an X and Y drive source (not shown). Thereby, the semiconductor chip 3 adhered to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup unit 1.

  Instead of the backup unit 1, the wafer ring may be driven in the Z direction. In short, the wafer ring and the backup unit 1 are relatively driven and positioned in the X, Y, and Z directions. Just do it.

  A suction nozzle 4 is provided above the backup unit 1 on the upper surface side of the adhesive sheet 2. The suction nozzle 4 is driven in the X, Y, and Z directions by an X, Y, and Z drive source (not shown). It is preferable to use a voice coil motor or the like as the Z drive source so that the pressing load of the semiconductor chip 3 by the suction nozzle 4 can be controlled to be constant.

  The backup unit 1 has the backup body 11. As shown in FIGS. 2 and 3, the backup body 11 is formed with a housing section 12 having a circular cross section in the axial direction. That is, the backup body 11 has a cylindrical shape. Note that the inner diameter dimension of the accommodating portion 12 is set slightly larger than the diagonal dimension of the semiconductor chip 3 to be picked up shown by a chain line in FIG.

  A plurality of annular grooves 13 are formed concentrically on the upper surface 11 a of the backup body 11. These annular grooves 13 are communicated with each other by a plurality of communicating recesses 14 formed on the upper surface of the backup body 11 along the radial direction. In this embodiment, an adsorption portion is formed by the annular groove 13 and the communication recess 14.

  As shown in FIG. 3, one end of the suction path 15 formed in the backup body 11 communicates with one of the plurality of communication recesses 14. The other end of the suction path 15 is open to the outer peripheral surface of the backup body 11, and a suction pump 16 is connected to the other end. Therefore, when the suction pump 16 is operated, suction force can be generated in the plurality of annular grooves 13 formed on the upper surface 11a of the backup body 11.

  A plurality of movable bodies are accommodated concentrically and movable in the vertical direction in the accommodating portion 12 formed in the backup body 11. The plurality of movable bodies includes a first cylindrical movable body 17 accommodated in such a manner that the outer peripheral surface is slidable in an airtight state with respect to the inner peripheral surface of the accommodating portion 12, and an inner portion of the cylindrical movable body 17. A second cylindrical movable body 18 accommodated in a peripheral surface so that the outer peripheral surface is slidable in an airtight state, and the outer peripheral surface is slid in an airtight state on the inner peripheral surface of the second cylindrical movable body 18. It consists of a shaft-shaped movable body 19 which is accommodated and movable.

  The outer diameter of the first cylindrical movable body 17 is set larger than the diagonal dimension of the semiconductor chip 3. Thereby, as shown in FIG. 2, the center of the upper surface 11a of the backup body 11 is aligned with the center of the semiconductor chip 3 picked up, and when this semiconductor chip 3 is adsorbed via the adhesive sheet 2, The corner 3 a is supported by the upper end surface of the first cylindrical movable body 17.

  A first driving means 21 such as a cylinder is connected to the lower end of the first cylindrical movable body 17. The first cylindrical movable body 17 is driven in the up-down direction by the first driving means 21 in the housing portion 12.

A second driving means 22 for driving the second cylindrical movable body 18 in the vertical direction is connected to the lower end of the second cylindrical movable body 18. The 3rd drive means 23 which drives the axial movable body 19 to an up-down direction is connected.

  In this embodiment, the first and second cylindrical movable bodies 17 and 18 and the shaft-shaped movable body 19 are arranged such that the upper end surfaces of the backup body 11 are the upper surfaces 11a of the backup bodies 11 as shown in FIG. It is supported in a state of being flush with each other, and is driven in a descending direction from that state. In this embodiment, the movable bodies 17 to 19 are set to have the same stroke in the descending direction.

  Next, the operation of picking up the semiconductor chip 3 from the adhesive sheet 2 by the pickup device having the above configuration will be described.

  As shown in FIGS. 1 and 3, the adhesive sheet 2 is driven in the X and Y directions by a wafer ring (not shown), and the semiconductor chip 3 to be picked up is positioned above the accommodating portion 12 of the backup body 11. That is, the center of the upper surface 11 a of the backup body 11 is made to coincide with the center of the semiconductor chip 3. And the backup body 11 is raised to the position where the upper surface 11a of the backup body 11 contacts the lower surface of the adhesive sheet 2.

  At this time, the first and second cylindrical movable bodies 17 and 18 and the shaft-shaped movable body 19 accommodated in the accommodating portion 12 of the backup body 11 have an upper end surface that is flush with the upper surface 11a of the backup body 11. Positioning is held.

  Before raising the backup body 11, the suction pump 16 is operated. Accordingly, when the upper surface 11a of the backup body 11 comes into contact with the lower surface of the adhesive sheet 2, the periphery of the semiconductor chip 3 picked up by the suction nozzle 4 of the adhesive sheet 2 by the annular groove 13 formed in the upper surface 11a. Part is adsorbed and held. At this time, the four corners 3a of the semiconductor chip 3 are supported by the upper end surface of the first cylindrical movable body 17 via the adhesive sheet 2 as shown by a chain line in FIG.

  If the lower surface of the adhesive sheet 2 is sucked and held on the upper surface 11a of the backup body 11 in this way, the suction nozzle 4 is lowered and the semiconductor chip 3 is sucked and held at its tip as shown in FIG. . At this time, the suction nozzle 4 presses the semiconductor chip 3 with a predetermined load.

  If the suction nozzle 4 holds the semiconductor chip 3 by suction, the first driving means 21 is operated to lower the first cylindrical movable body 17. The outer peripheral surface of the first cylindrical movable body 17 slides in an airtight manner on the inner peripheral surface of the housing portion 12, and the inner peripheral surface slides in an airtight manner on the outer peripheral surface of the second cylindrical movable body 18. To do.

  Therefore, when the first cylindrical movable body 17 is lowered, the first space S1 formed between the upper end surface and the lower surface of the adhesive sheet 2 has a negative pressure. A portion of the adhesive sheet 2 corresponding to the upper end surface of the first cylindrical movable body 17 is sucked downward and peeled off from the semiconductor chip 3. That is, the adhesive sheet 2 is peeled off at portions corresponding to the four corners 3 a of the semiconductor chip 3.

If the part corresponding to the four corners 3a of the semiconductor chip 3 of the adhesive sheet 2 is peeled off, the second driving means 22 is operated to change the second cylindrical movable body 18 into the first cylindrical movable body 17. Lower with the same stroke. Thereby, as shown in FIG. 4B, the lower surface side of the pressure-sensitive adhesive sheet 2 and the portions corresponding to the upper end surfaces of the first and second cylindrical movable bodies 17 and 18 than the first space portion S1. A second space S2 having a large negative pressure is formed. The second space portion S2 is also at a negative pressure, like the first space portion S1.

Therefore, the adhesive sheet 2 peeled from the four corners 3a of the semiconductor chip 3 is further peeled from the corner 3a toward the center of the semiconductor chip 3 by forming the second space S2. become. As a result, the adhesive sheet 2 is peeled from the semiconductor chip 3 except for the upper end surface of the shaft-shaped movable body 19 that supports the lower surface of the semiconductor chip 3.

  That is, by lowering the first cylindrical movable body 17 and the second cylindrical movable body 18, most of the adhesive sheet 2 is peeled from the semiconductor chip 3, but the lower surface of the semiconductor chip 3 is axial. Since it is supported by the movable body 19 and the upper surface is sucked and held by the suction nozzle 4, it does not enter into the accommodating portion 12 and the peripheral portion is damaged at a predetermined height without bending downward. It is certainly supported without.

  Next, the third driving means 23 is operated to lower the shaft-like movable body 19 with the same stroke as the second cylindrical movable body 18 as shown in FIG. Accordingly, a third space larger than the second space S2 is formed between the lower surface of the pressure-sensitive adhesive sheet 2 and the upper end surfaces of the first and second cylindrical movable bodies 17, 18 and the shaft-shaped movable body 19. A space S3 is formed.

  As a result, the remaining portion of the adhesive sheet 2 attached to the semiconductor chip 3, which corresponds to the upper end surface of the shaft-shaped movable body 19, is peeled from the semiconductor chip 3. That is, the adhesive sheet 2 is peeled from the semiconductor chip 3 to be picked up.

  When the shaft-shaped movable body 19 is lowered and the semiconductor chip 3 is peeled from the adhesive sheet 2, the suction nozzle 4 holding the semiconductor chip 3 is lifted. Thereafter, the suction nozzle 4 is moved in the horizontal direction, and the semiconductor chip 3 is transferred to a mounting suction nozzle (not shown).

  When the predetermined semiconductor chip 3 is picked up from the adhesive sheet 2 in this way, the upper and lower ends of the first and second cylindrical movable bodies 17 and 18 and the shaft-shaped movable body 19 are the upper surfaces of the backup body 11. Raise until level with 11a. Accordingly, the volume of the space portions S1 to S3 formed on the lower surface side of the pressure-sensitive adhesive sheet 2 becomes 0, so that the suction force generated in the portion facing the upper surface opening of the housing portion 12 of the pressure-sensitive adhesive sheet 2 disappears. .

  Next, the suction pump 16 is stopped to remove the suction force acting on the adhesive sheet 2. Thereby, the adhesive sheet 2 can freely move in the X, Y and Z directions with respect to the backup body 11. Then, after the semiconductor chip 3 to be picked up next is positioned with respect to the backup body 11, the above-described pick-up operation is repeated.

  In this way, the negative pressure space portions S1 to S3 are formed on the lower surface of the adhesive sheet 2 stepwise from the radially outer side to the inner side of the housing portion 12, and the semiconductor chip 3 picked up by the negative pressure. The pressure-sensitive adhesive sheet 2 was peeled off.

  Therefore, it is possible to pick up the semiconductor chip 3 without intensively generating stress in the semiconductor chip 3 as in the conventional case where the semiconductor chip 3 is pushed up by the push-up pin. That is, it is possible to pick up from the adhesive sheet 2 without damaging the semiconductor chip 3.

  Spaces S1 to S3 for peeling the adhesive sheet 2 from the semiconductor chip 3 are formed in a stepwise manner from the peripheral part of the semiconductor chip 3 toward the center part. It peeled off from one corner | angular part 3a.

  The adhesive sheet 2 can be peeled off from the four corners 3a of the semiconductor chip 3 with a relatively small suction force compared to places other than the corner 3a, for example, side portions and center portions. If the adhesive sheet 2 can be peeled off from the four corners 3 a of the semiconductor chip 3, the adhesive sheet 2 can be easily peeled from the corner 3 a toward the center of the semiconductor chip 3. It becomes.

  Therefore, the adhesive sheet 2 can be easily and reliably peeled from the semiconductor chip 3. That is, since it can be peeled off without increasing the suction force for sucking the pressure-sensitive adhesive sheet 2 more than necessary, the semiconductor chip 3 is not excessively bent by causing a large suction force to act on it. .

  A suction pump 16 generates a suction force for adsorbing and holding the adhesive sheet 2 on the upper surface 11 a of the backup body 11. The suction force for peeling the adhesive sheet 2 from the semiconductor chip 3 does not depend on the suction pump 16, and the first and second cylindrical movable bodies 17 and 18 housed in the housing portion 12 of the backup body 11 and the shaft shape. The movable body 19 is lowered to form and generate the spaces S1 to S3.

  That is, the suction force for adsorbing and holding the adhesive sheet 2 on the upper surface 11 a of the backup body 11 and the suction force for peeling the adhesive sheet 2 from the semiconductor chip 3 are independent of each other. Therefore, even if the operation of adsorbing and holding the pressure sensitive adhesive sheet 2 and the operation of peeling the pressure sensitive adhesive sheet 2 are performed at the same time, the negative pressure for performing each operation does not fluctuate. Can do.

In other words, the negative pressure for adsorbing and holding the pressure-sensitive adhesive sheet 2 and the negative pressure for peeling the pressure-sensitive adhesive sheet 2 can be individually set and maintained at a pressure for optimally performing each operation.
In addition, if the negative pressure for peeling the adhesive sheet 2 from the semiconductor chip 3 exists in advance between the adhesive sheet 2 and the upper end surfaces of the movable bodies 17 to 19, the movable bodies 17 to 19 are provided. It can be set by changing the stroke. That is, when peeling off the adhesive sheet 2 from the semiconductor chip 3, the greatest force is required when peeling off the first part (four corners 3a in the above embodiment), and peeling is performed sequentially starting from the peeled part. As it goes on, it can be peeled off with a small force.

  Therefore, first, the stroke in the descending direction of the first cylindrical movable body 17 that forms the space for separating the adhesive sheet 2 from the semiconductor chip 2 is maximized, and then the second cylindrical movable body 18, the shaft The stroke is reduced in the order of the movable body 19. Thereby, the negative pressure acting on the pressure-sensitive adhesive sheet 2 according to the size of the space formed by the lowering of each movable body can be sequentially reduced according to the suction force required to peel off the pressure-sensitive adhesive sheet 2. .

  In other words, the suction force when first peeling the adhesive sheet 2 from the semiconductor chip 3 can be set to a size that can be reliably peeled by the stroke of the first cylindrical movable body 17. .

  Moreover, the time for lowering each movable body 17-19 and obtaining the predetermined negative pressure for peeling the adhesive sheet 2 from the semiconductor chip 3 is set by changing the lowering speed of each movable body 17-19. It is possible. For example, if the descending speed of each movable body 17 to 19 is initially increased and gradually decreased, the rising time until the predetermined negative pressure required for peeling the adhesive sheet 2 from the semiconductor chip 3 is shortened. Is possible. Further, when the semiconductor chip 3 is thin and easily cracked, the force applied to the semiconductor chip 3 through the adhesive sheet can be gradually increased by increasing the rise time until the predetermined negative pressure is reached. The semiconductor chip 3 can be peeled off without damaging it.

  In the above embodiment, three movable bodies are accommodated in the backup body accommodating portion. However, the number of movable bodies is not limited, and for example, one cylindrical movable body and two axial movable bodies may be used. Or three or more cylindrical movable bodies and one axial body may be sufficient.

  In addition, although an example has been given in which a cylinder is used as a driving means for driving each movable body, a link mechanism, a screw drive, or the like may be used instead of the cylinder. As long as each movable body can be driven up and down with a predetermined stroke.

  In addition, each movable body is driven by a separate driving unit, but three movable bodies may be sequentially driven by one driving unit. For example, if the first cylindrical movable body is lowered to a predetermined position, the second cylindrical movable body is interlocked with the lowering of the first cylindrical movable body so that the second cylindrical movable body If it is lowered to a predetermined position, the shaft-like movable body may be interlocked.

  The means for linking each movable body is realized by forming a key groove along the axial direction on one side surface on which each movable body slides, and providing a key that engages with the key groove on the other side surface. Is possible.

  As described above, according to the configuration in which the movable bodies are sequentially interlocked, it is only necessary to use one driving means. Therefore, not only can the configuration be simplified, but a plurality of movable bodies can be driven continuously. Therefore, the pressure-sensitive adhesive sheet can be smoothly peeled off.

The schematic block diagram which shows the backup unit of one embodiment of this invention. The top view of a backup body. The longitudinal cross-sectional view of the backup body along the III-III line of FIG. (A)-(c) is explanatory drawing which shows a pick-up operation | movement sequentially.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Adhesive sheet, 3 ... Semiconductor chip, 4 ... Adsorption nozzle, 11 ... Backup body, 12 ... Storage part, 13 ... Ring groove, 15 ... Suction path, 16 ... Suction pump, 17 ... 1st cylindrical movable body, 18 ... second cylindrical movable body, 19 ... axial movable body, 21-22 ... driving means.

Claims (6)

A semiconductor chip pick-up device for picking up a semiconductor chip affixed to an adhesive sheet by a suction nozzle,
A housing portion that is open on the upper surface is formed, and a suction portion is formed on a portion of the upper surface excluding the housing portion, and a semiconductor chip picked up by the suction nozzle of the pressure-sensitive adhesive sheet is attached to the suction portion. A backup body that sucks and holds the lower surface of the peripheral part of the peripheral part,
A plurality of movable members concentrically housed in an airtight state in the housing portion;
These movable members are positioned radially outward of the accommodating portions of the plurality of movable members in a state where the upper end surface is flush with the upper surface of the backup body and the adhesive sheet is adsorbed and held on the upper surface by the adsorption portion. Driving means for sequentially driving in a downward direction from the movable member to form an airtight negative pressure space between the upper end surface of the movable member and the lower surface of the adhesive sheet. Semiconductor chip pickup device.   The suction portion includes a plurality of annular grooves concentrically formed on the upper surface of the backup body and a communication portion that communicates the annular grooves with each other, and a suction path to which a suction pump is connected communicates with the communication portion. 2. The semiconductor chip pick-up device according to claim 1, wherein:   The plurality of movable bodies includes at least one cylindrical movable body provided in a slidable state in the housing portion, and an axial movable body slidably accommodated in the cylindrical movable body. 2. The pick-up device for a semiconductor chip according to claim 1, wherein: A semiconductor chip pick-up method for picking up a semiconductor chip affixed to an adhesive sheet by a suction nozzle,
There is no space between the lower surface of the pressure-sensitive adhesive sheet and the accommodating portion on the upper surface of the backup body in which the accommodating portion is opened, the lower surface of the periphery of the semiconductor chip picked up by the suction nozzle of the pressure-sensitive adhesive sheet. A process of adsorbing and holding in an airtight state;
A step of sequentially forming a negative pressure space portion in an airtight state from the radially outer side toward the center portion in a portion corresponding to the housing portion on the lower surface of the pressure-sensitive adhesive sheet;
A method of picking up a semiconductor chip, comprising: picking up the semiconductor chip from which the pressure-sensitive adhesive sheet has been sucked and peeled by the negative pressure space in an airtight state using the suction nozzle.   5. The method of picking up a semiconductor chip according to claim 4, wherein the adhesive sheet is peeled from the semiconductor chip in a state where the semiconductor chip is sucked and held by the suction nozzle.   5. The semiconductor chip according to claim 4, wherein a negative pressure space portion is sequentially formed in a step corresponding to the housing portion on the lower surface of the pressure-sensitive adhesive sheet from the radially outer side toward the center portion. Pickup method.

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