JP4629624B2 - Semiconductor chip pickup device and pickup method - Google Patents

Description

  The present invention relates to a pickup apparatus and a pickup method for picking up a semiconductor chip attached to an adhesive sheet.

  The semiconductor chips formed by cutting the semiconductor wafer into dice are pasted on the adhesive sheet, and when the semiconductor chips are bonded to the substrate, they are picked up one by one from the adhesive sheet by the suction nozzle. .

When picking up a semiconductor chip from an adhesive sheet, conventionally, as shown in Patent Document 1, the periphery of the semiconductor chip of the adhesive sheet to which the semiconductor chip picked up by the suction nozzle is attached is covered by the upper surface of the backup body. The semiconductor chip is picked up by the suction nozzle while being separated from the adhesive sheet by holding and holding the semiconductor chip from the lower surface side with a push-up pin having a sharp tip.
Japanese Patent Application Laid-Open No. 2002-1000064

  By the way, recently, the thickness of the semiconductor chip may be as very thin as 20 to 30 μm. When such a thin semiconductor chip is pushed up and pushed up by the sharp tip of the pin, the tip breaks through the adhesive sheet and presses the semiconductor chip. For this reason, stress concentrates on the portion pressed by the sharp tip of the push-up pin of the semiconductor chip, and the semiconductor chip may be damaged by the stress received from the push-up pin.

  In order to prevent damage to the semiconductor chip due to stress concentration, it is conceivable to slow down the semiconductor chip push-up speed by the push-up pin. However, if the push-up speed of the push-up pin is slowed down, the pick-up speed is also slowed, which may lead to a decrease in productivity, and even if the push-up speed is slowed down, damage to the semiconductor chip is surely prevented. It was difficult.

  It is an object of the present invention to provide a pickup device and a pickup method that can be reliably peeled from an adhesive sheet without damaging a semiconductor chip.

This invention is a semiconductor chip pickup device for picking up a semiconductor chip attached to an adhesive sheet,
A backup body formed on the suction surface that holds the portion corresponding to the peripheral portion of the semiconductor chip from which the upper surface is picked up by the adhesive sheet;
A pin-shaped member and an elastic tube that covers the pin-shaped member and has an upper end projecting upward from the upper end of the pin-shaped member and whose elastic deformation is limited by the pin-shaped member are picked up Push-up means for elastically pushing up the semiconductor chip at the portion protruding from the upper end of the pin-shaped member of the elastic tube via the adhesive sheet;
There is provided a pickup device for a semiconductor chip, comprising: pickup means for picking up the upper surface of the semiconductor chip pushed up by the pushing-up means and picking up from the adhesive sheet.

  It is preferable that an opening having a shape smaller than the area of the semiconductor chip is formed on the upper surface of the backup body, and a portion corresponding to the opening of the adhesive sheet is sucked.

The push-up means is
A push-up shaft driven in the vertical direction;
A holding body having a holding surface and provided at the upper end of the push-up shaft;
It is preferable that the holding member is configured to include a pinching member that is detachably held on the holding surface and that holds the lower end portion of the pin-like member on which the elastic tube is mounted with the holding surface.

  The holding body has two holding surfaces facing in parallel and a pair of holding members detachably held on each holding surface, and each holding surface holds a plurality of the pin-shaped members between the holding members. It is preferably fixed.

This invention is a method for picking up a semiconductor chip for picking up a semiconductor chip attached to the upper surface of an adhesive sheet,
Sucking and holding the lower surface of the portion located around the semiconductor chip to be picked up of the adhesive sheet;
The semiconductor chip is elastically supported from the lower surface of the pressure-sensitive adhesive sheet by an elastic tube that covers the pin-shaped member and has an upper end protruding upward from the upper end of the pin-shaped member and elastic deformation of the protruding portion is restricted by the pin-shaped member. The process of pushing up,
And a step of picking up and picking up the upper surface of the pushed-up semiconductor chip.

  According to the present invention, since the semiconductor chip is pushed up by the pin-like member to which the elastic tube is attached, the stress is prevented from being concentrated on the semiconductor chip by the elastic tube at the time of pushing up, so that the pickup can be performed without damaging the semiconductor chip. It becomes possible to do.

An embodiment of the present invention will be described below with reference to the drawings.
The pickup apparatus shown in FIG. 1 includes a backup unit 10. The backup unit 10 is provided to face the lower surface side of the adhesive sheet 2 stretched on a wafer ring (not shown).

  A plurality of semiconductor chips 3 obtained by dividing a semiconductor wafer into dice-like shapes are attached to the upper surface of the adhesive sheet 2. The wafer ring is driven in the horizontal direction by an X and Y drive source (not shown).

  Thereby, the semiconductor chip 3 attached to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup unit 10. The backup unit 10 may be driven in the horizontal direction instead of the wafer ring. In short, it is only necessary that the wafer ring and the backup unit 10 are relatively driven in the X and Y directions.

  On the upper surface side of the pressure-sensitive adhesive sheet 2, a suction nozzle body 4 constituting pickup means is provided above the backup unit 10. The suction nozzle body 4 has a pickup shaft 5 that is driven in the X, Y, and Z directions by an X, Y, and Z drive source (not shown). A convex portion 6 is provided on the lower end surface of the pickup shaft 5.

  The pickup shaft 5 is formed with a suction hole 7 whose tip is opened at the end face of the convex portion 6 along the axial direction. The suction hole 7 is connected to a suction pump (not shown). An upper suction nozzle 8 made of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 6. The upper suction nozzle 8 is formed with a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opened to the tip surface, and further having a lower surface formed on a flat surface 8a.

  In addition, it is preferable to use a voice coil motor or the like as a Z drive source for driving the pickup shaft 5 in the Z direction so that the pressing load by the suction nozzle body 4 can be controlled to be constant.

  As shown in FIGS. 2 and 3, the backup body 1 has a cylindrical shape in which a lower end surface is opened and a rectangular opening 12 is formed on the upper surface. Here, the opening 12 is formed in a rectangular shape slightly smaller than the rectangular semiconductor chip 3 to be picked up, which is indicated by a chain line in FIG. That is, the opening 12 is formed in a similar shape to the semiconductor chip 3.

  As shown in FIG. 3, three annular grooves 14 a to 14 c surrounding the opening 12 are concentrically formed on the upper surface of the backup body 1. The three annular grooves 14 a to 14 c are communicated with each other by two communication grooves 15 formed along the radial direction of the backup body 1. The communication groove 15 is formed so as to be parallel to and opposite to the two opposite sides (end portions) of the semiconductor chip 3 to be picked up.

  Although not shown, a communication groove may be further formed on the upper surface of the backup body 1 so as to be parallel to the other two opposite sides of the semiconductor chip 3 and on the outer side.

  Four suction holes 16a are formed in the innermost annular groove 14a at intervals of 90 degrees in the circumferential direction so as to penetrate the upper wall of the backup body 1 in the thickness direction. Further, the diameter of the annular groove 14a is set larger than the diagonal length of the semiconductor chip 3 to be picked up.

  Two suction holes 16b are formed in the second annular groove 14b at intervals of 180 degrees in the circumferential direction. A suction force acts on each of the annular grooves 14a to 14c and the communication groove 15 through the suction holes 16a and 16b as described later. The annular grooves 14a to 14c and the suction holes 16a and 16b are shown only in FIG. 3, and are omitted in other drawings.

  As shown in FIG. 2, a cylindrical closing member 21 is provided at the lower end opening of the backup body 1 with one end thereof being airtightly fitted. An insertion hole 22 penetrating in the axial direction is formed in the central portion of the closing member 21. In the insertion hole 22, a push-up shaft 23 that constitutes a push-up means is slidable and is airtightly held by an O-ring 20 provided at the lower end of the insertion hole 22.

  As shown in FIGS. 4A and 4B, a rectangular holding body 24 having a planar shape smaller than the opening 12 is provided at the upper end of the push-up shaft 23 protruding from the upper end surface of the closing member 21. It has been. At the center of the upper surface of the holding body 24, a convex portion 26 formed on the holding surface 25 whose both side surfaces are flat protrudes along the width direction. Each holding surface 25 is formed with a pair of arc-shaped first holding grooves 25a spaced along the width direction at predetermined intervals along the vertical direction.

  To the pair of holding surfaces 25, a flat plate-shaped clamping member 27 having the same size as the holding surface 25 is attached and fixed by a pair of screws 28 that penetrates the convex portion 26. A pair of arc-shaped second holding grooves 27a are formed on the inner surface of the holding member 27 along the vertical direction at intervals corresponding to the first holding grooves 25a.

  As shown in FIG. 4 (c), the first and second holding grooves 25a and 27a formed on the pair of holding surfaces 25 of the convex portion 26 and the holding member 27 are made of synthetic resin or rubber. A lower end portion of a metal pin-like member 32 inserted into an elastic tube 31 formed of an elastic material is clamped and fixed. That is, four pin-shaped members 32 covered with the elastic tube 31 are vertically attached to the holding body 24. The pin-shaped member 32 has a circular arc at the tip, but is relatively sharp because it has a small diameter of about 1 mm.

  The elastic tube 31 is formed longer than the pin-shaped member 32. The elastic tube 31 has an upper end protruding above the upper end of the pin-shaped member 32. The length of the elastic tube 31 does not have to be longer than that of the pin-shaped member 32. In short, the upper end portion of the elastic tube 31 only has to protrude above the upper end of the pin-shaped member 32.

  As shown in FIG. 2, a suction hole 35 is formed in the closing member 21 that closes the lower opening of the backup body 1. One end of the suction hole 35 is opened to the upper end surface of the closing member 21, that is, the internal space of the backup body 1, and the other end is opened to the outer peripheral surface of the closing member 21.

  As shown in FIGS. 1 and 2, a suction pump 36 is connected to the suction hole 35 formed in the closing member 21 through a pipe 37. When the suction pump 36 is operated, a suction force is generated in the annular grooves 14a to 14c through the opening 12, the suction holes 16a and 16b, and the communication groove 15 opened on the upper surface of the backup body 1.

  When the suction force of the suction pump 36 acts on the annular grooves 14a to 14c, the upper surface of the backup body 1 becomes a suction surface that sucks and holds the lower surface of the sticking sheet 2 to which the semiconductor chip 3 is stuck. That is, the upper surface of the backup body 1 is a portion located around the semiconductor chip 3 to be picked up by the adhesive sheet 2, and a portion located around the opening 12 of the adhesive sheet 2 is the portion of the backup body 1. Adsorb and hold on top.

  As shown in FIG. 1, a cam follower 41 is rotatably provided at a lower end portion of the push-up shaft 23 protruding from the lower end surface of the closing member 21. The cam follower 41 is in contact with the outer peripheral surface of a cam 42 that is rotationally driven in the direction of the arrow by a drive source (not shown). Therefore, when the cam 42 is driven to rotate, the push-up shaft 23 is driven in the vertical direction, so that the holding body 24 holding the pin-shaped member 32 is interlocked with the movement in the vertical direction.

  When the cam follower 41 hits the bottom dead center of the cam 42 and the push-up shaft 23 is in the lowered position, the upper end of the elastic tube 31 mounted on the pin-shaped member 32 is slightly smaller than the suction surface on the upper surface of the backup body 1. Located below.

When the cam 42 rotates and the cam follower 41 hits the top dead center and the push-up shaft 23 is in the raised position, the upper end of the elastic tube 31 is upwardly spaced from the suction surface of the backup body 1 by a predetermined dimension, for example, 0.5 mm. It is set to protrude to a certain extent.
The drive control of the suction nozzle body 4 and the backup unit 10 is controlled by a control device (not shown) as described later.

Next, the operation of the pickup device having the above configuration will be described with reference to FIGS.
First, the adhesive sheet 2 is driven in the X and Y directions by a wafer ring (not shown), and the semiconductor chip 3 to be picked up is positioned above the opening 12 of the backup body 1 as shown in FIGS. That is, positioning is performed so that the center of the semiconductor chip 3 coincides with the center of the opening 12.

  When the semiconductor chip 3 to be picked up is positioned, the suction nozzle body 4 is lowered as shown in FIG. 5A and picked up by the flat surface 8a at the lower end of the upper suction nozzle 8 provided at the lower end thereof. 3 is adsorbed. At this time, the suction nozzle body 4 presses the semiconductor chip 3 with a predetermined load. The elastic tube 31 attached to the pin-like member 32 is positioned so that the upper end is slightly below the lower surface of the adhesive sheet 2.

  If the upper suction nozzle 8 is lowered to hold the upper surface of the semiconductor chip 3 by suction, the suction pump 36 is operated at the same time. As a result, the internal space of the backup body 1 is depressurized, and suction force is generated in the annular grooves 14a to 14c and the communication groove 15 on the upper surface thereof, so that the suction sheet is positioned around the semiconductor chip 3 picked up by the adhesive sheet 2 The part to be sucked is held by suction on the suction surface (upper surface) of the backup body 1.

  At this time, a suction force is also generated in the opening 12 of the backup body 1, and the semiconductor chip 3 positioned opposite to the opening 12 is sucked into the backup body 1 through the adhesive sheet 2.

  However, the semiconductor chip 3 has a rectangular shape slightly larger than the opening 12. Therefore, even if the suction force generated in the opening 12 of the backup body 1 is before the lower surface of the semiconductor chip 3 is supported by the tip of the elastic tube 31 attached to the pin-like member 32, the semiconductor chip 3 has a peripheral portion. Is held in engagement with the peripheral portion of the opening 12 on the upper surface of the backup body 1, so that it is prevented from being deformed by being sucked into the opening 12 together with the adhesive sheet 2.

  Next, the push-up shaft 23 is raised as shown in FIG. Accordingly, the lower surface of the semiconductor chip 3 on which the tip of the elastic tube 31 attached to the pin-like member 32 held by the holding body 24 at the upper end of the push-up shaft 23 is picked up is elastically contacted via the adhesive sheet 2. . That is, the picked-up semiconductor chip 3 is sucked and held by the upper suction nozzle 8 whose upper surface is made of an elastic material, and the lower surface is elastically pushed up by the elastic tube 31.

  If the upper surface of the semiconductor chip 3 to be picked up is adsorbed by the upper adsorbing nozzle 8 and the tip of the elastic tube 31 is pressed against the lower surface via the adhesive sheet 2, the push-up shaft 23 is moved as shown in FIG. Raise.

  When the push-up shaft 23 is raised, the semiconductor chip 3 is pushed through the adhesive sheet 2 by the tips of the elastic tubes 31 attached to the four pin-shaped members 32 provided on the holding body 24 at the upper end. Thereby, the portion of the adhesive sheet 2 to which the semiconductor chip 3 is attached is stretched upward. At this time, the suction nozzle body 4 rises in conjunction with the rise of the push-up shaft 23.

  When the semiconductor chip 3 is pushed up and the pressure-sensitive adhesive sheet 2 is stretched upward and elastically deformed, the pressure-sensitive adhesive sheet 2 is peeled off from the lower surface periphery of the semiconductor chip 3 by the reaction force. At the same time, the pressure-sensitive adhesive sheet 2 is peeled off from the lower surface of the semiconductor chip 3 by the suction force acting on the portion corresponding to the opening 12 of the pressure-sensitive adhesive sheet 2 except for the pressure-sensitive adhesive sheet 2 pressed by the elastic tube 31.

  At this time, since the semiconductor chip 3 is pushed up by the elastic tube 31, local stress is prevented from being applied to the semiconductor chip 3 by the elasticity of the elastic tube 31. Therefore, the semiconductor chip 3 is not damaged.

  Moreover, the elastic tube 31 is attached to a metal pin-shaped member 32 having rigidity. Therefore, even if the elastic tube 31 is elastically deformed, the deformation amount is limited by the pin-shaped member 32, so that the semiconductor chip 3 is reliably pushed up by the elastic tube 31 via the pin-shaped member 32.

  If the semiconductor chip 3 is pushed upward from the upper surface of the backup body 1 by the pin-like member 32 to which the elastic tube 31 is attached, the upper suction nozzle 8 is raised as shown in FIG. At this time, the portion of the adhesive sheet 2 that faces the opening 12 is sucked downward by the suction force acting on the opening 12.

  Therefore, the suction force of the rising upper suction nozzle 8 and the suction force generated in the opening 12 act as forces for separating the picked-up semiconductor chip 3 and the adhesive sheet 2, respectively. It becomes possible to pick up easily and reliably from the pressure-sensitive adhesive sheet 2.

  The pin-shaped member 32 and the elastic tube 31 attached to the pin-shaped member 32 are sufficiently reduced in diameter so that the area where the elastic tube 31 presses the adhesive sheet 2 when pushing up the semiconductor chip 3 can be reduced.

  Thereby, when the semiconductor chip 3 is pushed up, the area where the adhesive sheet 2 is not peeled off from the semiconductor chip 3 can be reduced, so that the semiconductor chip 3 can be easily and reliably picked up from the adhesive sheet 2. It becomes possible to do.

  The pin-shaped member 32 to which the elastic tube 31 is attached is held by the holding member 27 on the holding surface 25 of the holding body 24. The holding member 27 can be attached to and detached from the holding body 24 with a screw 28. Therefore, when the elastic tube 31 and the pin-shaped member 32 are damaged by long-term use, the elastic tube 31 and the pin-shaped member 32 can be easily replaced.

  In the above-described embodiment, the push-up shaft is moved up and down using the cam, but other drive sources such as a cylinder may be used.

  Further, although the opening of the backup body has a rectangular shape slightly smaller than the semiconductor chip, it may be formed larger than the semiconductor chip, and the point is not limited. In that case, before the adhesive sheet is sucked into the backup body, the lower surface of the part to which the semiconductor chip of the adhesive sheet is attached may be supported by the elastic tube.

  Further, the elastic tube has been described as a tube shape with the upper and lower ends opened, but it may be a tube shape with the upper end closed. With such a configuration, the tip of the pin-shaped member is exposed from the upper end of the elastic tube. Can be prevented.

  The number of pin-like members held by the holding body is not limited to four, and the number may be set according to the size of the semiconductor chip, for example, one, six, eight or more. There may be.

1 is a schematic configuration diagram of a pickup device showing an embodiment of the present invention. The longitudinal cross-sectional view of a backup body. The top view which expands and shows the adsorption surface of a backup body. (A) is a perspective view showing a holding body provided at the upper end of the push-up shaft, (b) is a plan view of the holding body, and (c) is a view showing a push-up pin equipped with an elastic tube held by the holding body. . (A)-(d) is explanatory drawing which showed sequentially the operation | movement when picking up a semiconductor chip.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Backup body, 2 ... Adhesive sheet, 3 ... Semiconductor chip, 4 ... Adsorption nozzle body (pickup means), 8 ... Upper adsorption nozzle, 12 ... Opening part, 16a, 16b ... Suction hole, 23 ... Push-up shaft (push-up means) ), 24... Holding body (pushing means), 31. Elastic tube (pushing means), 32... Pin-shaped member (pushing means).

Claims (5)

A semiconductor chip pickup device for picking up a semiconductor chip attached to an adhesive sheet,
A backup body formed on the suction surface that holds the portion corresponding to the peripheral portion of the semiconductor chip from which the upper surface is picked up by the adhesive sheet;
A pin-shaped member and an elastic tube that covers the pin-shaped member and has an upper end projecting upward from the upper end of the pin-shaped member and whose elastic deformation is limited by the pin-shaped member are picked up Push-up means for elastically pushing up the semiconductor chip at the portion protruding from the upper end of the pin-shaped member of the elastic tube via the adhesive sheet;
A pick-up device for a semiconductor chip, comprising: pick-up means for picking up the upper surface of the semiconductor chip pushed up by the pushing-up means and picking it up from the adhesive sheet.   2. The semiconductor chip according to claim 1, wherein an opening having a shape smaller than an area of the semiconductor chip is formed on an upper surface of the backup body, and a portion corresponding to the opening of the adhesive sheet is sucked. Pickup device. The push-up means is
A push-up shaft driven in the vertical direction;
A holding body having a holding surface and provided at the upper end of the push-up shaft;
2. The semiconductor according to claim 1, further comprising: a holding member that is detachably held on the holding surface and that holds the lower end portion of the pin-like member on which the elastic tube is mounted with the holding surface. Chip pickup device.   The holding body has two holding surfaces facing in parallel and a pair of holding members detachably held on each holding surface, and each holding surface holds a plurality of the pin-like members between the holding members. 4. The semiconductor chip pickup device according to claim 3, wherein the semiconductor chip pickup device is fixed. A method for picking up a semiconductor chip for picking up a semiconductor chip attached to the upper surface of an adhesive sheet,
Sucking and holding the lower surface of the portion located around the semiconductor chip to be picked up of the adhesive sheet;
The semiconductor chip is elastically supported from the lower surface of the pressure-sensitive adhesive sheet by an elastic tube that covers the pin-shaped member and has an upper end protruding upward from the upper end of the pin-shaped member and elastic deformation of the protruding portion is restricted by the pin-shaped member. The process of pushing up,
A method of picking up a semiconductor chip, comprising: sucking and picking up an upper surface of the semiconductor chip pushed up.

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