JP2010161155A - Chip transfer method and chip transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip transfer apparatus excelling in chip transfer reliability and uninfluenced by the shape of a substrate on the object side of transfer, and a chip transfer method. <P>SOLUTION: An adhesive sheet 22 is sucked by a suction stage 30 from the opposite side to chips 21, and in this sucked state, an eject pin 31 is projected from a suction surface of the suction stage 30. The chips 21 located within a suction range of the adhesive sheet 22 sucked to the suction stage 30 are thereby pushed out to the substrate 23 side and brought into contact with the substrate 23. While the eject pin 31 is left stopped in this position, the suction stage 30 is separated from the substrate 23 to transfer the chips 21 located within the suction range of the adhesive sheet 22, to the substrate side 23. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a chip transfer method and a chip transfer apparatus.

  When manufacturing a semiconductor device, die bonding for mounting a semiconductor chip (die) on a lead frame as a mounted member is performed. For this die bonding, a die bonder having a collet for adsorbing chips is used.

  A typical die bonder has a bonding arm having a collet that adsorbs a semiconductor chip. The chip attached to the adhesive sheet is adsorbed to the collet, and in this state, the bonding arm is moved to the bonding position of the lead frame. The chip is transported, the collet is lowered at this bonding position, and the chip is bonded.

  However, in the bonding as described above, since the surface of the semiconductor chip is adsorbed by a collet, the chip may be chipped or the chip surface may be damaged during the bonding operation. Therefore, conventionally, methods have been proposed to prevent chips from being chipped or scratched (Patent Document 1 and Patent Document 2).

  In the semiconductor manufacturing apparatus of Patent Document 1, first, as shown in FIG. 5 (a), a wafer mounting process is performed in which the adhesive sheet 1 is attached to the surface 2a side of the semiconductor wafer 2, and then shown in FIG. 5 (b). Thus, the dicing process which cut | disconnects the semiconductor wafer 2 from the back surface 2b side is performed. Next, as shown in FIG. 5C, the semiconductor element 3 that is diced and divided into individual parts is placed with the adhesive sheet 1 facing upward, and as shown in FIG. Then, the surface 3 a of the semiconductor element 3 is pressed through the adhesive sheet 1. As a result, as shown in FIG. 5E, the semiconductor element 3 is peeled off from the adhesive sheet 1 and simultaneously transferred to the lead frame 6 and mounted thereon. That is, the back surface 3 b of the semiconductor element 3 is attached to the lead frame 6.

  In addition, as described in Patent Document 2, first, as shown in FIG. 6A, a dicing semiconductor wafer 2 divided into semiconductor elements 3 is subjected to dicing applied to the semiconductor wafer 2. One semiconductor element 3 is pressed by the collet 10 through the adhesive sheet 1. At this time, the suction collet 13 is inserted into the opening 12 of the die pad portion 11 of the lead frame 6 disposed below the semiconductor wafer 2, and the back surface 3 b of the semiconductor element 3 pressed by the collet 10 is sucked and held.

  Next, the surface 3 a of the semiconductor element 3 is pressed by the collet 10 toward the die pad portion 11 of the lead frame 6 on which an adhesive such as a silver paste for bonding the semiconductor element 3 is previously provided, and the semiconductor element 3 The semiconductor element 3 is lowered while the back surface 3b is held by the suction collet 13, and die-bonded as shown in FIG. 4B. Note that reference numeral 15 in FIGS. 6A and 6B denotes a wafer ring for holding the semiconductor wafer 2.

JP-A-6-204267 Japanese Patent No. 3289631

  In the device described in Patent Document 1, when the chip 3 is transferred (transferred) to the frame 6 side, the jig 5 is pressed through the adhesive sheet 1. For this reason, after the semiconductor element (chip) 3 is pressed to the frame 6 side, when the jig 5 is raised, the adhesive force on the adhesive sheet 1 side needs to be smaller than the adhesive force on the frame 6 side. However, the magnitude relationship of the adhesive force in this case is not stable, and the adhesive force on the adhesive sheet 1 side may be larger than the adhesive force on the frame 6 side. In such a case, when the jig 5 is raised, the state shown in FIG. 5 (e) is not achieved, and the chip 3 remains adhered to the adhesive sheet 1 side, so that the semiconductor element (chip) 3 Cannot be transferred. Moreover, since the transfer is performed only by pressing the jig 5, it is necessary to lower the jig 5 with a relatively large stroke, and there is a possibility that the chip may be displaced at the time of transfer. could not.

  Moreover, in the thing of patent document 2, since the semiconductor element (chip) 3 is adsorbed-held by the adsorption collet 13, it is excellent in the reliability of transfer (peeling) of the semiconductor element (chip) 3. However, since the suction collet 13 is taken in and out through the opening 12 provided in the lead frame 6, there is a restriction on the target lead frame.

  In view of the above problems, the present invention provides a chip transfer apparatus and a chip transfer method that are excellent in chip transfer reliability and that are not affected by the shape of the counterpart substrate to be transferred.

  A first chip transfer method of the present invention is a chip transfer method for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side, and the adhesive sheet is placed on the suction stage from the side opposite to the chip. In this suction state, the eject pin is protruded from the suction surface of the suction stage, and the chip located within the suction range of the adhesive sheet sucked on the suction stage is pushed out to the substrate side. After contacting the substrate, the suction pin is stopped at this position, and the suction stage is separated from the substrate to transfer the chip located within the suction range of the adhesive sheet to the substrate side.

  According to the first chip transfer method of the present invention, when the suction stage is separated from the substrate, the adhesive sheet is sucked while the chip to be peeled is kept in contact with the substrate side by the eject pin. The suction stage moves away from the substrate. As a result, only the chip to be peeled is transferred to the substrate. Further, the chip is not peeled only by pushing up the eject pin, but with the eject pin, the suction stage is separated from the substrate while the chip is in contact with the substrate, and the adhesive sheet is separated from the substrate. Therefore, the push-up amount of the eject pin push-up is small.

  A second chip transfer method of the present invention is a chip transfer method for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side, and the adhesive sheet is placed on the suction stage from the side opposite to the chip. In this suction state, the eject pin is protruded from the suction surface of the suction stage, and the chip located within the suction range of the adhesive sheet sucked on the suction stage is pushed out to the substrate side. After contacting the substrate, the suction surface is deformed so as to be separated from the substrate by adjusting the negative pressure to the suction stage, and the chip located within the suction range of the adhesive sheet is transferred to the substrate side. .

  According to the second chip transfer method of the present invention, the suction surface of the suction stage can be deformed so as to be separated from the substrate by adjusting the negative pressure to the suction stage. The suction stage on which the adhesive sheet is sucked away from the substrate while maintaining the state of being in contact with the side. As a result, only the chip to be peeled is transferred to the substrate. Further, the chip is not peeled only by pushing up the eject pin, but the adhesive sheet is separated from the substrate by deforming the suction surface while the chip is in contact with the substrate by the eject pin. Therefore, the push-up amount of the eject pin is small.

  A first chip transfer device of the present invention is a chip transfer device for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side, and adsorbs the adhesive sheet from the side opposite to the chip. A stage, an eject pin for pushing the chip toward the substrate side, a stage driving means for displacing the suction stage in a direction approaching / separating the substrate, and an eject pin moving in a direction approaching / separating the substrate By controlling the pin driving means and the pin driving means, the eject pin is protruded from the suction surface of the suction stage, and a chip located within the suction range of the adhesive sheet sucked by the suction stage is mounted on the substrate. The pin control means that pushes out to the side and the stage drive means are controlled, and the chip is brought into contact with the board with the eject pin. In it are state, in which a stage control means for separating the suction stage from the substrate.

  According to the first chip transfer device of the present invention, the adhesive sheet can be sucked from the side opposite to the chip by the suction stage. And in this adsorption | suction state, a chip | tip can be extruded to a board | substrate side with an eject pin. The suction stage can be separated from the substrate while the chip is in contact with the substrate by the eject pin. That is, the suction stage on which the adhesive sheet is sucked away from the substrate while the chip to be peeled is kept in contact with the substrate by the eject pin. As a result, only the chip to be peeled is transferred to the substrate.

  A second chip transfer device of the present invention is a chip transfer device for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side, and adsorbs the adhesive sheet from the side opposite to the chip. A suction stage having a suction surface that deforms according to the negative pressure supplied, a negative pressure supply means for supplying a negative pressure to the suction stage, an eject pin for pushing the chip toward the substrate, and the eject pin to the substrate By controlling the pin driving means that displaces in the direction of approaching and separating and the pin driving means, the eject pin protrudes from the suction surface of the suction stage, and the suction of the pressure-sensitive adhesive sheet adsorbed on the suction stage A chip control means for extruding a chip located within the range to the substrate side and contacting the substrate, and a negative pressure supply means to control the chip with an eject pin In a state where in contact with the substrate, the suction surface is obtained and a negative pressure control means for deforming so as to be separated from the substrate.

  According to the second chip transfer device of the present invention, the adhesive sheet can be sucked from the side opposite to the chip by the suction stage. And in this adsorption | suction state, a chip | tip can be extruded to a board | substrate side with an eject pin. While the chip is in contact with the substrate with the eject pin, the negative pressure in the suction stage is adjusted by the negative pressure control means so that the shape of the suction surface of the suction stage is separated from the substrate. Can be deformed. That is, the suction stage on which the adhesive sheet is attracted moves away from the substrate while the chip to be peeled is kept in contact with the substrate side by the eject pin. As a result, only the chip to be peeled is transferred to the substrate.

  It is preferable to dispose an adhesive sheet having a chip attached to the upper surface below the substrate. Moreover, the pressure sensitive adhesive sheet-corresponding wall of the suction stage can be made elastically deformable and the outer surface of the pressure sensitive adhesive sheet-corresponding wall can be the suction surface.

  In the present invention, only the chip to be peeled is transferred to the substrate, and the push-up amount of the eject pin is small. For this reason, when the chip contacts the substrate, it is possible to effectively prevent the positional deviation of the chip and to transfer the chip to the substrate with high accuracy. Moreover, in the present invention, it is possible to remove the adhesive sheet without contacting the eject pin and the chip. For this reason, the transfer reliability is improved, and there is an effect that the chip is not damaged. Further, there is no need for a suction collet or the like for sucking chips from the substrate side, and there is no restriction as a substrate, and this device can be used for manufacturing various semiconductor devices, and the application range can be expanded. it can.

  If the adhesive sheet with the chip attached to the upper surface is disposed below the substrate, the adhesive sheet is pulled downward, and the peelability of the chip from the adhesive sheet can be improved. .

  In the case where the wall corresponding to the adhesive sheet of the suction stage is made thin and elastically deformable, the adhesive sheet can be pulled away from the substrate while adjusting the negative pressure while keeping the chip to be peeled in contact with the substrate with the eject pin. For this reason, it is not necessary to lower the suction stage when the chip is peeled off, and the control of the apparatus can be simplified.

1 is a simplified diagram of a chip transfer apparatus showing an embodiment of the present invention. The chip transfer method using the said chip transfer apparatus is shown, (a) is sectional drawing of the state which pushed up the chip | tip with the eject pin, (b) is sectional drawing of the state which lowered | hung the adsorption | suction stage. It is sectional drawing of the upper wall of the said adsorption | suction stage. FIG. 4 shows another embodiment of the present invention, in which (a) is a cross-sectional view showing a state in which a tip is pushed up by an eject pin, and (b) is a cross-sectional view showing a state in which an adsorption stage is lowered. It is a simplified diagram showing a chip peeling process using a conventional chip transfer device. It is a simplified diagram showing a chip peeling process using another conventional chip transfer device.

  Embodiments of the present invention will be described below with reference to FIGS.

  FIG. 1 shows a chip transfer apparatus according to the present invention. This chip transfer device is for transferring a chip 21 such as a semiconductor element attached to an adhesive sheet 22 to a substrate (lead frame) 23 side.

  The chip transfer device approaches and separates the suction stage 30 that sucks the adhesive sheet 22 from the side opposite to the chip 21, the eject pin 31 that pushes the chip 21 toward the substrate 23, and the substrate 23. Stage drive means 32 for displacing in the direction and pin drive means 33 for displacing the eject pin in the direction of approaching and separating from the substrate 23 are provided.

  The suction stage 30 is a box-shaped body having an upper wall 30a, and is connected to a negative pressure supply means 35 for supplying a negative pressure therein. The negative pressure supply means 35 includes a vacuum generator 36, and a negative pressure is supplied into the suction stage 30 by the operation of the vacuum generator 36. The vacuum generator 36 may be an ejector type that controls the opening and closing of high-pressure air and discharges it from the nozzle to the diffuser to generate a negative pressure in the diffusion chamber. The vacuum generator 36 is connected to a negative pressure control means 37 for adjusting the negative pressure of the suction stage 30.

  As shown in FIG. 3, the upper wall 30 a of the suction stage 30 is provided with a pin hole portion 40 into which the tip end portion of the eject pin 31 is fitted in the axial center portion, and on the outer peripheral side of the pin hole portion 40. A plurality of suction holes 41 are provided at a predetermined pitch along the circumferential direction. That is, when the inside of the suction stage 30 is in a negative pressure state, the adhesive sheet 22 is sucked through the suction holes 41.

  The stage drive means 32 can be constituted by a reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear motor, or a linear actuator. In this case, the adhesive sheet 22 having the chip 21 attached on the upper surface is disposed below the substrate 23, and the suction stage 30 is disposed below the adhesive sheet 22. For this reason, the suction stage 30 moves up and down.

  The stage drive means 32 is connected to a stage control means 45 for controlling the stage drive means 32. This stage control means 45 controls the vertical movement timing and vertical movement amount of the suction stage 30.

  The eject pin 31 is composed of a rod-shaped body having a small diameter toward the tip (upper end), and moves up and down by a pin drive means 33. The pin driving means 33 can also be constituted by a reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear motor, or a linear actuator. That is, as shown in FIG. 1, as shown in FIG. 2, the eject pin 31 is housed in the suction stage 30 and the tip thereof does not protrude upward from the upper surface (suction surface) 46 of the upper wall 30a. The tip protrudes above the upper surface (suction surface) 46 of the upper wall 30a.

  A pin control means 47 for controlling the pin drive means 33 is connected to the pin drive means 33. This pin control means 47 controls the timing of vertical movement of the eject pin 31 and the amount of vertical movement.

  By the way, the control means 37, 45, 47 can be constituted by a microcomputer or the like, and these may be constituted independently or by one computer.

  Next, a chip transfer method using the chip transfer apparatus configured as described above will be described. First, similarly to the wafer mounting process shown in FIG. 5A, a wafer mounting process for attaching the adhesive sheet 22 to the surface side of the semiconductor wafer is performed, and then the dicing process similar to the dicing process shown in FIG. 5B. Then, the semiconductor wafer is cut from the back surface side so that the individually divided semiconductor elements (chips) 21 are in a state where the adhesive sheet 22 is on the upper side. That is, the state is the same as in FIG.

  In this way, the chip 21 with the adhesive sheet 22 attached to the surface 21a side is set as the upper side, and the substrate 23 is disposed above the chip 21. In this case, as shown in FIG. 2A, only the chip 21 to be peeled off is attached to the substrate 23 as the gap dimension t between the upper surface (substrate bonding surface) 21b of the chip 21 and the transfer surface 23a of the substrate 23. It may be a minute dimension (minimum dimension) that can be brought into contact.

  Thereafter, with the suction stage 30 stopped, only the eject pin 31 is raised as shown in FIG. 2A to push up the chip 21 to be peeled through the adhesive sheet 22. As a result, the substrate bonding surface 21 b of the chip 21 is brought into contact with the transfer surface 23 a of the substrate 23. At this time, the tip portion of the eject pin 31 protrudes from the upper surface (the suction surface 46) of the suction stage 30 through the pin hole 40.

  As shown in FIG. 2B, only the suction stage 30 is lowered while the state in which the substrate bonding surface 21b of the chip 21 is pushed up by the eject pin 31 and is in contact with the transfer surface 23a of the substrate 23 is maintained. Let In this case, since the adhesive sheet 22 is adsorbed by the adsorption surface 46 of the adsorption stage 30, the adhesive sheet 22 also descends as the adsorption stage 30 is lowered. However, the tip 21 pushed up by the eject pin 31 remains in that position. For this reason, the adhesive sheet 22 is peeled from the chip 21, and only this chip 21 is transferred to the transfer surface 23 a of the substrate 23.

  Next, the eject pin 31 and the suction stage 30 are returned to the initial state as shown in FIG. 1, and the eject pin 31 corresponds to the lower side of the chip 21 to be peeled next, and / or The suction stage 30 is moved. Thereafter, transfer to the transfer surface 23a of the substrate 23 of the chip 21 is performed in the process as described above. Thereafter, the transfer of all the chips 21 on the wafer is completed by sequentially performing such steps.

  In the present invention, only the chip 21 to be peeled is transferred to the substrate, and the push-up amount of the eject pin 31 is small. For this reason, when the chip 21 is in contact with the substrate 23, it is possible to effectively prevent the positional deviation of the chip 21, and to transfer the chip 21 to the substrate 23 with high accuracy. Moreover, in the present invention, it is possible to remove the adhesive sheet 22 without the eject pin 31 and the chip 21 coming into contact with each other. Therefore, the transfer reliability is improved and the chip 21 is not damaged. Further, there is no need for a suction collet or the like for sucking the chip 21 from the substrate 23 side, and there is no restriction as the substrate 23, and this device can be used for manufacturing various semiconductor devices, thereby expanding the application range. Can be planned.

  In the embodiment, if the adhesive sheet 22 having the chip 21 attached to the upper surface is disposed below the substrate 23, the adhesive sheet 22 is pulled downward, and the adhesive sheet of the chip 21. The peelability from 22 can be improved.

  Next, FIG. 4 shows another embodiment. In this case, after the tip 21 is pushed up by the eject pin 31, the suction stage 30 is not lowered. In this case, the pressure-sensitive adhesive sheet corresponding wall (upper wall) 30a of the suction stage 30 is deformed by adjusting the negative pressure in the suction stage 30 by making it thin and elastically deformable. That is, as shown in FIG. 4A, in the state where the tip 21 is pushed up by the eject pin 31, the adhesive sheet 22 is adsorbed without the upper wall 30a of the adsorption stage 30 being deformed. By adjusting the negative pressure from this state, as shown in FIG. 4B, the upper wall 30a can be deformed so as to be recessed.

  Next, a chip transfer method using the chip transfer apparatus shown in FIG. 4 will be described. The chip 21 with the adhesive sheet 22 attached to the surface 21a side is the upper side, and the substrate 23 is placed on the upper side. In this case, as shown in FIG. 4A, as the gap dimension t between the upper surface (substrate bonding surface) 21b of the chip 21 and the transfer surface 23a of the substrate 23, only the chip 21 to be peeled is attached to the substrate 23. It may be a minute dimension that can be brought into contact.

  Thereafter, while the suction stage 30 is stopped, only the eject pin 31 is raised as shown in FIG. 4A to push up the chip 21 to be peeled through the adhesive sheet 22. As a result, the substrate bonding surface 21 b of the chip 21 is brought into contact with the transfer surface 23 a of the substrate 23.

  Next, the negative pressure in the suction stage 30 is adjusted to deform the upper wall 30a as shown in FIG. That is, it is set as the displacement which the adsorption surface 46 which is the upper surface of the upper wall 30a falls. At this time, since the chip 21 pushed up by the eject pin 31 remains in that position, the adhesive sheet 22 is peeled off from the chip 21, and only this chip 21 is transferred to the transfer surface 23 a of the substrate 23.

  Even when the chip transfer apparatus shown in FIG. 4 is used, only the chip 21 to be peeled is transferred to the substrate, and the push-up amount of the eject pin 31 is small. For this reason, there exists an effect similar to the chip transcription | transfer apparatus shown in the said FIG. In this way, when the pressure sensitive adhesive sheet-corresponding wall (upper wall) 30a of the suction stage 30 is thin and elastically deformable, it is not necessary to lower the suction stage 30 when the chip is peeled off, and the control of the apparatus is simplified. be able to.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the eject pin 31 has a pointed tip as in the embodiment. Although it is preferable to break the pressure-sensitive adhesive sheet 22, it is not always necessary to use a tapered point. In the case of forming the tapered point portion, in the above-described embodiment, it is sharply pointed, but it may be rounded without being sharply sharpened. Further, in the embodiment, the diameter dimension is sequentially reduced from the proximal end (lower end) to the distal end (upper end), but only the distal end portion (upper end portion) may be tapered. The cross-sectional shape of the eject pin 31 may also be a circle, an ellipse, a square, a pentagon or more polygon.

  Moreover, the hole diameter, number, shape, and the like of the suction holes 41 can be arbitrarily set. As shown in FIG. 1B, when the suction stage 30 is lowered, the adhesive sheet 22 can be sucked to the suction surface 46. As shown in FIG. 4B, when the suction stage 30 is not lowered, the adhesive sheet 22 can be sucked to the suction surface 46 and the upper wall 30a of the suction stage 30 can be deformed by controlling the negative pressure. Good.

  In the above-described embodiment, the adhesive sheet 22 with the chip 21 attached is disposed below the substrate 23. Conversely, the adhesive sheet with the chip 21 attached above the substrate 23. 22 may be provided. In this case, the chip 21 is disposed below the adhesive sheet 22, and the suction stage 30 and the eject pin 31 are disposed above the adhesive sheet 22.

  As the material for the suction stage 30 and the eject pin 31, various metals and resins can be used as long as they have rigidity corresponding to the environment in which they are used and their respective operations.

21 Chip 22 Adhesive Sheet 23 Substrate 30 Adsorption Stage 30a Upper Wall (Adhesive Sheet Corresponding Wall)
31 Eject pin 32 Stage drive means 33 Pin drive means 35 Negative pressure supply means 37 Negative pressure control means 45 Stage control means 46 Suction surface 47 Pin control means

Claims (6)

A chip transfer method for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side,
The pressure-sensitive adhesive sheet is sucked by the suction stage from the opposite side of the chip. In the suction state, the eject pin is protruded from the suction surface of the suction stage, and is within the suction range of the pressure-sensitive adhesive sheet sucked by the suction stage. After the chip located on the substrate is pushed out and brought into contact with the substrate side, the suction stage is moved away from the substrate while the eject pin is stopped at this position, and is located within the suction range of the adhesive sheet. A chip transfer method, wherein the chip is transferred to a substrate side. A chip transfer method for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side,
The pressure-sensitive adhesive sheet is sucked by the suction stage from the opposite side of the chip. In the suction state, the eject pin is protruded from the suction surface of the suction stage, and is within the suction range of the pressure-sensitive adhesive sheet sucked by the suction stage. After the chip located on the substrate is pushed out and brought into contact with the substrate, the suction surface is deformed so as to be separated from the substrate by adjusting the negative pressure to the suction stage, and is within the suction range of the adhesive sheet. A chip transfer method, wherein the chip located is transferred to a substrate side. A chip transfer device for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side,
An adsorption stage for adsorbing the adhesive sheet from the side opposite to the chip;
An eject pin for pushing the chip to the substrate side;
Stage drive means for displacing the suction stage in the direction of approaching and separating from the substrate;
A pin driving means for displacing the eject pin in a direction approaching or separating from the substrate;
The drive means for the pins is controlled so that the eject pin protrudes from the suction surface of the suction stage, and the chip located within the suction range of the adhesive sheet sucked by the suction stage is pushed out to the substrate side to this substrate. Control means for pins to be brought into contact with,
A chip transfer apparatus comprising: stage control means for controlling the stage drive means and separating the suction stage from the substrate in a state where the chip is in contact with the substrate by an eject pin. A chip transfer device for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side,
While adsorbing the pressure-sensitive adhesive sheet from the opposite side of the chip, the adsorption stage of the adsorption surface that deforms according to the negative pressure supplied,
Negative pressure supply means for supplying a negative pressure to the suction stage;
An eject pin for pushing the chip to the substrate side;
A pin driving means for displacing the eject pin in a direction approaching or separating from the substrate;
The drive means for the pins is controlled so that the eject pin protrudes from the suction surface of the suction stage, and the chip located within the suction range of the adhesive sheet sucked by the suction stage is pushed out to the substrate side to this substrate. Control means for pins to be brought into contact with,
In a state where the negative pressure supply means is controlled and the chip is in contact with the substrate with the eject pin,
A chip transfer apparatus comprising: negative pressure control means for deforming the suction surface so as to be separated from the substrate.   The chip transfer device according to claim 3 or 4, wherein an adhesive sheet having a chip attached to the upper surface is disposed below the substrate.   5. The chip transfer apparatus according to claim 4, wherein the adhesive sheet-corresponding wall of the suction stage is thin and elastically deformable, and an outer surface of the adhesive sheet-corresponding wall is the suction surface.

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