JP2010040657A - Chip peeling device and chip peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip transfer device and a chip transfer method, wherein reliability of transfer of a chip is satisfactory and there is not an influence of the shape of a substrate on the other side to which the chip is transferred. <P>SOLUTION: The chip 21 such as a semiconductor element stuck on an adhesive sheet 22 is transferred to the side of the substrate 23. Only a pressing member 24 is moved in a direction separated from the chip 21 so as to change a state where the chip 21 is pressed against the transfer surface 23a of the substrate 23 with the pressing surface 24a of the pressing member 14 into a state where an eject pin 26 protrudes from the pressing surface 24a. Consequently, while the chip 21 is left on the substrate side, the adhesive sheet 22 sucked to the pressing surface 24a is peeled from the chip 21. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a chip peeling apparatus and a chip peeling method.

  When manufacturing a semiconductor device, die bonding for mounting a semiconductor chip (die) on a lead frame as a mounted member is performed. For this die bonding, a die bonder having a collet for adsorbing chips is used.

  A typical die bonder has a bonding arm having a collet that adsorbs a semiconductor chip. The chip attached to the adhesive sheet is adsorbed to the collet, and in this state, the bonding arm is moved to the bonding position of the lead frame. The chip is transported, the collet is lowered at this bonding position, and the chip is bonded.

  However, in the bonding as described above, since the surface of the semiconductor chip is adsorbed by a collet, the chip may be chipped or the chip surface may be damaged during the bonding operation. Therefore, conventionally, methods have been proposed to prevent chips from being chipped or scratched (Patent Document 1 and Patent Document 2).

  In the semiconductor manufacturing apparatus of Patent Document 1, first, as shown in FIG. 5 (a), a wafer mounting process is performed in which the adhesive sheet 1 is attached to the surface 2a side of the semiconductor wafer 2, and then shown in FIG. 5 (b). Thus, the dicing process which cut | disconnects the semiconductor wafer 2 from the back surface 2b side is performed. Next, as shown in FIG. 5C, the semiconductor element 3 that is diced and divided into individual parts is placed with the adhesive sheet 1 facing upward, and as shown in FIG. Then, the surface 3 a of the semiconductor element 3 is pressed through the adhesive sheet 1. As a result, as shown in FIG. 5E, the semiconductor element 3 is peeled off from the adhesive sheet 1 and simultaneously transferred to the lead frame 6 and mounted thereon. That is, the back surface 3 b of the semiconductor element 3 is attached to the lead frame 6.

  In addition, as described in Patent Document 2, first, as shown in FIG. 6A, a dicing semiconductor wafer 2 divided into semiconductor elements 3 is subjected to dicing applied to the semiconductor wafer 2. One semiconductor element 3 is pressed by the collet 10 through the adhesive sheet 1. At this time, the suction collet 13 is inserted into the opening 12 of the die pad portion 11 of the lead frame 6 disposed below the semiconductor wafer 2, and the back surface 3 b of the semiconductor element 3 pressed by the collet 10 is sucked and held.

Next, the surface 3a of the semiconductor element 3 is pressed with the collet 10 toward the die pad portion 11 of the lead frame 6 on which an adhesive such as a silver paste for bonding the semiconductor element 3 is previously provided, and the semiconductor element 3 The semiconductor element 3 is lowered while the back surface 3b is held by the suction collet 13, and die-bonded as shown in FIG. 4B. Note that reference numeral 15 in FIGS. 6A and 6B denotes a wafer ring for holding the semiconductor wafer 2.
JP-A-6-204267 Japanese Patent No. 3289631

  In the device described in Patent Document 1, when the chip 3 is transferred (transferred) to the frame 6 side, the jig 5 is pressed through the adhesive sheet 1. For this reason, after the semiconductor element (chip) 3 is pressed to the frame 6 side, when the jig 5 is raised, the adhesive force on the adhesive sheet 1 side needs to be smaller than the adhesive force on the frame 6 side. However, the magnitude relationship of the adhesive force in this case is not stable, and the adhesive force on the adhesive sheet 1 side may be larger than the adhesive force on the frame 6 side. In such a case, when the jig 5 is raised, the state shown in FIG. 5 (e) is not achieved, and the chip 3 remains adhered to the adhesive sheet 1 side, so that the semiconductor element (chip) 3 Cannot be transferred.

  Moreover, in the thing of patent document 2, since the semiconductor element (chip) 3 is adsorbed-held by the adsorption collet 13, it is excellent in the reliability of transfer (peeling) of the semiconductor element (chip) 3. However, since the suction collet 13 is taken in and out through the opening 12 provided in the lead frame 6, there is a restriction on the target lead frame.

  In view of the above problems, the present invention provides a chip transfer apparatus and a chip transfer method that are excellent in chip transfer reliability and that are not affected by the shape of the counterpart substrate to be transferred.

  The chip peeling apparatus of the present invention is a chip peeling apparatus for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side, and contacts or presses the chip against a transfer surface of the substrate via the adhesive sheet. The pressing member, the adsorbing means for adsorbing the pressure-sensitive adhesive sheet to the pressing surface of the pressing member, the drive mechanism for moving the pressing member relatively to and away from the substrate, and the driving synchronized with the pressing member and the pressing member are independent. The ejector pin can be slid in the axial direction, and the tip of the eject pin is aligned with the pressing surface of the pressing member, and the chip is pressed against the transfer surface of the substrate with this pressing surface. The ejector pin is moved to a direction away from the holding surface so that the eject pin protrudes from the holding surface, and the chip remains on the substrate side and is attracted to the holding surface. The pressure-sensitive adhesive sheet are those for separating from the chip.

  According to the chip peeling apparatus of the present invention, the tip of the eject pin is aligned with the pressing surface of the pressing member, and the chip can be pressed against the transfer surface of the substrate by the pressing surface. From this state, it is possible to move only the pressing member in a direction away from the chip while the eject pin is stopped at that position. That is, only the pressing member is separated from the chip while the pressure-sensitive adhesive sheet is pressed against the chip with the eject pin. In this case, the pressure-sensitive adhesive sheet is adsorbed to the pressing surface of the pressing member by the suction means, and by the separation of the pressing member, the part other than the eject pin corresponding portion in the range where the chip is stuck is removed from the chip together with the pressing member. As a result, the eject pin-corresponding portion of the adhesive sheet is also separated from the chip. That is, if the pressing member is moved away from the tip, the dimension between the pressing surface of the pressing member and the tip of the eject pin gradually increases, and the eject pin corresponding portion of the adhesive sheet is broken. The pin corresponding part is also separated from the chip.

  The pressing member does not directly press the chip. Furthermore, even when the eject pin breaks the adhesive sheet, there is a gap corresponding to the thickness of the adhesive sheet between the tip of the eject pin and the chip. The eject pin is not in direct contact with the chip.

  Further, this apparatus does not require a suction collet or the like for sucking chips from the substrate side. For this reason, there is no restriction | limiting as a board | substrate and this apparatus can be used for manufacture of a various semiconductor device.

  When the pressing member is moved away from the chip, the tip of the eject pin is preferably a tapered point in order to break the adhesive sheet.

  The holding member has a hole portion in which the eject pin slides along the axial direction, and even if this hole portion is disposed along the axis of the holding member, the hole portion extends in the circumferential direction. A plurality of them may be arranged at a predetermined pitch along the line.

  It is preferable that the suction means has a suction hole whose suction port opens on the pressing surface of the pressing member. In the case where the suction port opens on the pressing surface, the suction of the adhesive sheet to the pressing surface of the pressing member is stabilized.

  Even if the suction port of the suction means opens in a ring shape on the pressing surface of the pressing member, a plurality of suction ports may be provided.

  The chip peeling method of the present invention is a chip peeling method for transferring a chip such as a semiconductor element affixed to an adhesive sheet to the substrate side, and transferring the chip through the adhesive sheet on the pressing surface of the pressing member. Move the pressing member only in the direction away from the chip so that the eject pin protrudes from the pressing surface from the pressed state on the surface, leaving the chip on the substrate side and being attracted to the pressing surface. The pressure-sensitive adhesive sheet is separated from the chip.

  According to the chip peeling method of the present invention, first, the chip is pressed against the transfer surface of the substrate by the pressing surface of the pressing member. Next, from this state, only the pressing member is moved away from the chip. In this state, the eject pin is maintained as it is, and the eject pin protrudes from the pressing surface of the pressing member by separating the pressing member from the tip. That is, the pressure-sensitive adhesive sheet is separated from the chip in a state where the portion corresponding to the eject pin is pressed against the chip. For this reason, the adhesive sheet adsorbed on the pressing surface is separated from the chip, leaving the chip on the substrate side. Furthermore, if the pressing member is moved away from the tip, the dimension between the pressing surface of the pressing member and the tip of the eject pin gradually increases, and the eject pin corresponding portion of the adhesive sheet is broken, and this eject The pin corresponding part is also separated from the chip.

  It is preferable to positively break the adhesive sheet at the tapered point at the tip of the eject pin while moving only the pressing member away from the tip.

  In the present invention, the pressure-sensitive adhesive sheet is peeled stably from the chip, and the reliability of peeling (transfer) is excellent. Further, since the pressing member and the eject pin do not directly contact the chip, chip chipping or damage can be stably prevented, and a highly accurate transfer process can be performed.

  There is no need for an adsorption collet or the like for adsorbing chips from the substrate side, and there is no restriction as a substrate. This apparatus can be used for manufacturing various semiconductor devices, and the application range can be expanded.

  By making the tip of the eject pin a tapered point, the reliability of peeling of the chip from the adhesive sheet is improved.

  When the eject pin slides into the hole disposed along the axis of the pressing member, the chip can be pressed at the center of the pressing surface of the pressing member. The pressing function at the initial stage of peeling can be sufficiently exhibited. If a plurality of holes are arranged at a predetermined pitch along the circumferential direction, the pressing function at the initial stage of peeling of the pressure-sensitive adhesive sheet can be stably exhibited by the plurality of eject pins. .

  In the case where the suction port opens on the pressing surface of the pressing member, the adsorption of the adhesive sheet to the pressing surface of the pressing member is stabilized, and the reliability of the peeling action is improved. In addition, when the suction port is opened in a ring shape, it can be adsorbed over a wide area and can exhibit stable adsorbability. In the case of having a plurality of suction ports, each suction port can be strongly suctioned and can exhibit stable adsorptivity as a whole.

  Embodiments of the present invention will be described below with reference to FIGS.

  FIG. 1 shows a chip peeling method using a chip peeling apparatus according to the present invention. The chip peeling device includes a pressing member 24 that contacts or presses the chip 21 against a transfer surface 23a of a substrate (lead frame) 23 via an adhesive sheet 22, and an adsorbing unit that adsorbs the adhesive sheet 22 to a pressing surface 24a of the pressing member 24. 25 (see FIG. 3), a drive mechanism (not shown) that moves the pressing member 24 relatively close to and away from the substrate 23, a drive synchronized with the pressing member 24, and the pressing member 24 in an independent axial direction. And an eject pin 26 capable of sliding.

  The holding member 24 is formed of a cylindrical body having a hole portion (axial hole) 27 through which the eject pin 26 slides along the axial direction thereof. The tip of the eject pin 26 is formed at a tapered point 26a, and reciprocates in the vertical direction in synchronization with the pressing member 24 by the drive of the drive mechanism.

  The drive mechanism can be constituted by a reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear motor, or a linear actuator. The eject pin 26 can be driven in the axial direction of the eject pin 26 alone in addition to the drive synchronized with the pressing member 24. The drive of the eject pin 26 alone can also be constituted by a reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear motor, or a linear actuator. At this time, the drive mechanism for the eject pin 26 may be a drive mechanism for the pressing member 24 or a separate drive mechanism for the eject pin 26.

  The holding member 24 is provided with a suction hole 30 constituting a part of the suction means 25. That is, the suction hole 30 is connected to the cylindrical main body 30a provided in the pressing member 24, the suction port 33 (33a) communicating with the main body 30a and opening to the pressing surface 24a, and the main body 30a. And a suction port 34 opened in the peripheral wall of the pressing member 24. The suction port 33 (33a) of the suction hole 30 has an annular shape as shown in FIG. A plurality of suction ports 34 are provided at a predetermined pitch along the circumferential direction. A vacuum generator 32 is connected to the suction port 34 via a suction path 31. Therefore, the adhesive sheet 22 can be adsorbed by sucking the air in the adsorption holes 30 by driving the vacuum generator 32. That is, the suction means 25 can be configured by the vacuum generator 32, the suction hole 30, the suction path 31, and the like.

  Next, a chip peeling method using the chip peeling apparatus configured as described above will be described. In this case, first, similarly to the wafer mounting process shown in FIG. 5A, a wafer mounting process for attaching the adhesive sheet 22 to the surface side of the semiconductor wafer is performed, and then the dicing process shown in FIG. 5B. The dicing process is performed to cut the semiconductor wafer from the back side so that the individually divided semiconductor elements (chips) 21 are in a state where the adhesive sheet 22 is on the upper side. That is, the state is the same as in FIG.

  As shown in FIG. 1A, in the state where the chip 21 with the adhesive sheet 22 attached to the surface 21a side is on the lower side and the adhesive sheet 22 is on the upper side, as shown in FIG. The chip 21 to be transferred is adsorbed to the pressing surface 24 a of the pressing member 24 through the adhesive sheet 22. That is, the vacuum generator 32 is driven to suck the air in the suction holes 30 and suck the adhesive sheet 22 to the pressing surface 24a. At this time, the pressing surface 24a of the pressing member 24 and the tip of the eject pin 26 (the tip of the tapered portion 26a) are set to the same height position. That is, the pressing surface 24a of the pressing member 24 and the tip of the eject pin 26 are arranged on the same plane.

  Thereafter, as shown in FIG. 1B, the ejector pin 26 of the pressing member 24 is synchronized and lowered as indicated by an arrow B, and the chip 21 is placed at the bonding position of the substrate 23. Next, with the eject pin 26 stopped from this state, only the pressing member 24 is raised as indicated by the arrow C in FIG. At this time, since the eject pin 26 is stopped at this position, the corresponding portion 28 of the eject pin 26 in the adhesive sheet 22 remains pressed by the eject pin 26. However, since the adhesive sheet 22 is adsorbed to the pressing surface 24a of the pressing member 24 via the suction port 33a, the adhesive sheet 22 remains pressed with the pressing surface 24a except for the corresponding portion 28 of the eject pin 26. And rise together.

  For this reason, the adhesive sheet 22 is peeled off from the chip 21 except for the corresponding portion 28 of the eject pin 26. Thereafter, only the pressing member 24 is further raised, and the pressing member 24 is separated from the chip 21. If the pressing member 24 moves away from the chip 21, the dimension between the pressing surface 24a of the pressing member 24 and the tip of the eject pin 26 gradually increases, and as shown in FIG. This eject pin corresponding portion is torn, and the eject pin corresponding portion is also separated from the chip 21.

  Thereafter, as shown by an arrow e in FIG. 1 (e), the eject pin 26 is raised so that the pressing surface 24a of the pressing member 24 and the tip of the eject pin 26 (tip of the tapered point 26a) have the same height. Position. As a result, the chip 21 is transferred to the substrate 23, and the chip peeling operation is completed.

  In the present invention, the pressing member 24 can be pressed against the substrate side, and the chip 21 can be adhered to the substrate side. Thereafter, the pressure-sensitive adhesive sheet 22 can be peeled off from the chip 21 while adsorbing the pressure-sensitive adhesive sheet 22 to the pressing surface 24 a of the pressing member 24 while pressing the chip 21 toward the substrate side with the eject pin 26. Further, as the pressing member 24 moves away from the chip 21, the eject pin corresponding portion of the adhesive sheet 22 is broken, whereby the peeling of the adhesive sheet 22 from the chip 21 is stably performed. Excellent (transfer) reliability.

  Further, as shown in FIGS. 1A and 1B and the like, the pressing member 24 does not directly press the chip 21. Further, even when the eject pin 26 breaks the adhesive sheet, a gap S corresponding to the thickness t of the adhesive sheet 22 is provided between the tip of the eject pin 26 and the chip 21 as shown in FIG. Thus, the eject pin 26 is not in direct contact with the chip 21. For this reason, chipping and scratching of the chip 21 can be stably prevented, and a highly accurate transfer process can be performed.

  In addition, unlike the prior art (the one described in Patent Document 2, etc.), there is no need for a suction collet or the like for sucking chips from the substrate side, and there is no restriction as a substrate. It can be used for a wide range of applications.

  By making the tip of the eject pin 26 the tapered point portion 26a, the adhesive sheet 22 can be positively broken, and the reliability of peeling of the chip 21 from the adhesive sheet 22 is improved.

  In the case where the eject pin 26 slides in the hole portion 27 disposed along the axis of the pressing member 24, the chip 21 can be pressed at the center portion of the pressing surface 24a of the pressing member 24, and one ejection is performed. The pin 26 can sufficiently exert the pressing function at the initial stage of peeling of the pressure-sensitive adhesive sheet.

  By the way, as the adsorption | suction hole 30 of the adsorption | suction means 25, as shown to Fig.4 (a), you may provide with two or more along the circumferential direction. In this case, a plurality of suction ports 33 (33b) are arranged on the pressing surface 24a along the circumferential direction. When the suction port 33 (33a) is opened in a ring shape, it can be adsorbed over a wide area and can exhibit stable adsorptivity. In the case where a plurality of the suction ports 33 (33b) are provided, the suction ports 33b can be strongly sucked and can exhibit stable adsorptivity as a whole.

  Further, the number of eject pins 26 is not limited to one, and a plurality of eject pins 26 may be provided in FIG. That is, a plurality of hole portions 27 arranged at a predetermined pitch along the circumferential direction may be provided in the pressing member 24, and the eject pin 26 may be slidably inserted into each hole portion 27. Even in such a case, each eject pin 26 can be driven in synchronization with the pressing member 24 and can slide in the axial direction independent of the pressing member 24.

  In FIG. 4B, the suction hole 30 of the suction means 25 has an annular suction port 33 a disposed along the outer peripheral surface of the pressing surface 24 a of the pressing member 24, and the pressing member 24. And a suction port 33c disposed at the center of the pressing surface 24a.

  For this reason, even if such a pressing member 24 is used, the pressure-sensitive adhesive sheet 22 is peeled off from the chip 21 while adsorbing the pressure-sensitive adhesive sheet 22 to the pressing surface 24 a of the pressing member 24 while pressing the chip 21 toward the substrate with the eject pin 26. Can do. A plurality of eject pins can stably exhibit the pressing function at the initial stage of peeling of the pressure-sensitive adhesive sheet.

  As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, when a plurality of eject pins 26 are provided, the number can be increased or decreased arbitrarily. The arrangement pitch and the arrangement position can be arbitrarily set. Whether there is one eject pin or a plurality of eject pins, the outer diameter can be arbitrarily set. Moreover, the inner diameter dimension and the outer diameter dimension when the suction port is in an annular shape can be arbitrarily set, and the diameter and number of each hole when a plurality of suction ports are arranged can also be arbitrarily set. That is, depending on the size, shape, etc. of the chip 21, it can be pressed to the substrate side by the pressing member 24, the chip 21 can be adhered to the substrate side, and the chip 21 is moved to the substrate side by the eject pin 26. What is necessary is just to be able to peel from the chip 21 while adsorbing the adhesive sheet 22 to the pressing surface 24a of the pressing member 24 while pressing.

  In order to break the adhesive sheet 22, it is preferable that the tip of the eject pin 26 has a tapered point 26 a, but it is not always necessary to have the tapered point 26 a. That is, in the state of FIG. 1 (c), only the eject pin-corresponding portion 28 adheres to the chip 21, and if the eject pin 26 is lifted together with the pressing member 24 from this state, the taper portion 26a adheres. The adhesive sheet 22 can be peeled from the chip 21 without breaking the sheet 22. In addition, when forming the tapered point part 26a, in the said embodiment, although sharply sharpened, it may be rounded shape without sharpening too much sharply.

  Further, the pressing member 24 may be a rod-like body that is arranged around the eject pin 26 at a predetermined pitch along the circumferential direction. In this case, the suction port of the suction means 25 may be provided on the pressing surface of the rod-shaped body. In the above-described embodiment, the suction port of the suction unit 25 is opened on the pressing surface 24a of the pressing member 24. However, the suction unit 25 is configured such that the suction port is opened on a separate member from the pressing member 24. There may be.

It is a simplified diagram showing a chip peeling process using a chip peeling apparatus showing an embodiment of the present invention. It is sectional drawing of the pressing member of the said chip | tip peeling apparatus. It is a simplified view of the chip peeling device. The modification of the pressing member of the said chip | tip peeling apparatus is shown, (a) is sectional drawing which shows a 1st modification, (b) is sectional drawing which shows a 2nd modification. It is a simplified diagram showing a chip peeling process using a conventional chip peeling apparatus. It is a simplified diagram showing a chip peeling process using another conventional chip peeling apparatus.

Explanation of symbols

21 Chip 22 Adhesive Sheet 23 Substrate 23a Transfer Surface 24 Pressing Member 24a Pressing Surface 25 Suction Unit 26 Eject Pin 26a Pointed Point 27 27 Hole 30 Suction Hole 33 Suction Port

Claims (9)

A chip peeling device for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side,
A pressing member that contacts or presses the chip against the transfer surface of the substrate via the adhesive sheet, an adsorbing means that adsorbs the adhesive sheet to the pressing surface of the pressing member, and a drive mechanism that moves the pressing member closer to and away from the substrate And a drive synchronized with the pressing member and an eject pin capable of sliding in the axial direction independent of the pressing member. The tip of the eject pin is aligned with the pressing surface of the pressing member, and the chip is substrated on the pressing surface. From the state of pressing onto the transfer surface, only the pressing member is moved away from the chip so that the eject pin protrudes from the pressing surface, leaving the chip on the substrate side and being attracted to the pressing surface. A chip peeling apparatus, wherein the pressure-sensitive adhesive sheet is separated from the chip.   2. The chip peeling apparatus according to claim 1, wherein when the pressing member is moved in a direction away from the chip, the tip of the eject pin is a tapered point in order to break the adhesive sheet.   3. The pressing member according to claim 1, wherein the pressing member has a hole portion through which the eject pin slides along the axial direction, and the hole portion is disposed along the axial center of the pressing member. The chip peeling apparatus as described.   2. The pressing member according to claim 1, wherein the pressing member has a hole portion through which the eject pin slides along the axial direction, and a plurality of the hole portions are arranged at a predetermined pitch along the circumferential direction. 2. The chip peeling apparatus according to 2.   5. The chip peeling apparatus according to claim 1, wherein the suction means has a suction hole whose suction port opens on a pressing surface of the pressing member.   6. The chip peeling apparatus according to claim 5, wherein the suction port of the suction means is opened in a ring shape on the pressing surface of the pressing member.   6. The chip peeling apparatus according to claim 5, wherein the suction means has a plurality of suction ports. A chip peeling method for transferring a chip such as a semiconductor element attached to an adhesive sheet to a substrate side,
From the state where the chip is pressed against the transfer surface of the substrate via the adhesive sheet by the pressing surface of the pressing member, only the pressing member is moved away from the chip so that the eject pin protrudes from the pressing surface. Then, the chip peeling method is characterized in that the adhesive sheet adsorbed on the pressing surface is separated from the chip while leaving the chip on the substrate side.   The chip peeling method according to claim 8, wherein the pressure-sensitive adhesive sheet is broken at the pointed tip of the eject pin while moving only the pressing member in a direction away from the chip.

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